AL
S
R INDUSTRY
LECTR
Second Edition
Ernest W. Flick
r-l "P
NOYES PUBLICATIONS Park Ridge, New Jersey, U.S.A.
Copyright 0 1992 by Ernest W. Flick No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Catalog Card Number: 91-44715 ISBN: O-8155-1295-3 Printed in the United States Published in the United States of America Noyes Publications Mill Road, Park Ridge, New Jersey 07656
by
10987654321
Library
of Congress
Cataloging-in-Publication
Data
Flick, Ernest W. Adhesives, sealants, and coatings for the electronics industry by Ernest W. Flick. -- 2nd ed. p. cm. Includes index. ISBN O-8155-1295-3 1. Electronics--Materials--Catalogs. 2. Coatings-Catalogs. 3. Sealing compounds--Catalogs. I. Title. TK7871.FSS 1992 914471s 621.381--dc20 CIP
/
Preface
The second edition of this industrial guide is a collection of more than 2,500 adhesives, sealants, coatings and related products, which are available to the electronics and related industries. It is the result of information received from 80 manufacturers and distributors of these products. The data, including product specifications, represent selections from the manufacturers’ descriptions made at no cost to, nor influence from, the makers or distributors of these materials. Only the most recent information has been included. It is believed that all of the products listed here are currently available, which will be of interest to readers concerned with product discontinuances. The market for electronics adhesives, sealants and coatings continues to be an expanding one, with sales showing consistently strong growth. 1990 sales were $200 million, and 1995 sales are projected, at a 9% growth rate, to be $305 million (in constant 1990 dollars). A large segment of the demand is for surface mount technology and other miniaturization efforts. Diverse products such as printed circuit boards, camcorders, VCRs, and desktop computers are constantly being upgraded with new and better adhesive agents, often made of high-performance specialty materials. As”enviromnentally friendly”products have become more desirabie, the industry is working toward using less solvents, removing them completely where possible, and replacing them with waterborne, hot-melt, or totally solid products. In addition, the industry is always seeking stronger and/or faster products. Automotive electronics have also created a niche for silicone-based adhesives which can withstand broad temperature fluctuations and corrosive environments. The book is divided into the following I. II. III. IV. V. VI.
eleven sections
Adhesives-General Adhesives-Cyanoacrylate Adhesives-Epoxy Caulks and Sealants Coatings Conductive Compounds V
based on end use:
vi
Preface
VII. VIII. IX. X. XI.
Encapsulating, Potting, Casting, Impregnating Compounds Films and Tapes Insulating Products Silicones Miscellaneous
In addition to the sections listed above, the book contains a valuable list of Suppliers’ Addresses and a Trade Name Index. In each section, companies are presented alphabetically and each company’s products, which fit into that particular section, are listed thereafter. The reader seeking a particular product should check any section which might be applicable. The table of contents is organized in such a way as to be a subject index for the book. Each product in the book lists the following information, as available, in the manufacturer’s own words: Company name and product category. Tradename and product number. A description of the product’s (3) Product description/characterization. main features, as described by the supplier. Typical end uses may also be included. ii;
My fullest appreciation is expressed to the companies and organizations who supplied the information for this book. Newburyport, Massachusetts January, 1992
Ernest W. Flick
NOTICE To the best of our knowledge the information in this publication is accurate; however, the Publisher does not assume any responsibility for the accuracy or completeness of, or consequences arising from, such information. This industrial guide does not purport to contain detailed user instructions, and by its range and scope could not possibly do so. Mention of trade names or commercial products does not constitute endorsement or recommendation for use by the Publisher. In some cases adhesive, sealant and coating products could be toxic, and therefore due caution should be exercised. Final determination of the suitability of any information or product for use contemplated by any user, and the manner of that use, is the sole responsibility of the user. We strongly recommend that users seek and adhere to a manufacturer’s or supplier’s current instructions for handling each material they use. The Author and Publisher have used their best efforts to include only the most recent data available. The reader is cautioned to consult the supplier in case of questions regarding current availability.
Contents and Subject Index
........................ SECTION I: ADHESIVES-GENERAL Ashland Chemical, Inc. ................................. ....................... PLIOBOND Industrial Adhesives Bostik .............................................. .................................. Contact Adhesives ........................... General Purpose Adhesives Hot Melt Adhesives: Bulk Hot Melts .................... ............. Hot Melt Adhesives: Rope Form Hot Melts .................... Hot Melt Adhesives and Applicators Glue Guns, Hot Melt Glue Camidges--1” diameter, Hot Melt Glue Sticks--%” diameter Castall, Inc. ......................................... Adhesives Specially Designed for Electronic or General .................................... Applications CASTALL, CASTALL QUICK CURE CASTALL LClOOO Light Cure Series ................... CASTALL LC2000-T Light Cure Series ................. CASTALL LC3000 Light Cure Series ................... CASTALL LC-3080 Light Cure Series .................. Dymax Corp. ........................................ DYMAX Engineering Adhesives: Product 488 Gel: LIGHTWELD UV Curing Adhesives for Use with Clear Plastic .... DYMAX Engineering Adhesives: Product 911 and 912: ........... MULTI-CURE Adhesives and LIGHT-WELD DYMAX MULTI-CURE Surface Mount Adhesive 995 ...... Flexhar Machine Corp. ................................ .............. AUTOCRETE Hi-Temp Ceramic Adhesive vii
1 2 2 3 3 5 7 11 12
15 15 23 24 25 27 28 28 29 30 31 31
. ..
vu1
Contents and Subject Index
Furane Products ..................................... Electronic Grade Adhesives .......................... Surface Mounting ..............................
32 32 32
EPIBOND Thermal Transfer/Component
Protection
.............
35
URALANE General Purpose ............................... Electronic Grade Surface Mount Adhesives ...............
35 41
Syringe Dispense, Screen Printing and Dispense for High Stand-Off Components, Software Pin Transfer, Hardware Pin Transfer EPIBOND Die Attach Adhesives: Polyimide Surface Mount Adhesives ............................ GC Electronics ...................................... Adhesives ....................................... Epoxy Cements ................................
.............
45 46 49 49 49
QUICK STIK, SUPER GLUE .................. Silicone Rubber Adhesive/Sealant Epoxy Glue ................................... Cyanoacrylate Adhesives .........................
49 50 50
GR-R-RIP, GELWELD, PERh4ABOND Solvent Release Adhesives
........................
51
General Purpose Plastic Cement, GC BOND, Service Cement, Rubber-to-Metal Cement, Acrylic Cement, vinylite Cement, PEM-LOK IPS Corp. .......................................... WELD-ON 1007 High Strength Cement for Rigid Vinyl (PVC) and Kydex ................................ WELD-ON 1591 Acrylonitrile-Butadiene-Styrene (ABS) ..... WELD-ON 1707 Acrylonitrile-Butadiene-Styrene (ABS) ..... WELD-ON 1993 High Strength Cement for Rigid Vinyl .’ .. (PVC), Kydex or Acrylivin ....................... WELD-ON 3050 Noryl Cement ....................... ITWDevcon ......................................... DEVCON MVP Methacrylate Adhesives for Bonding All Materials ....................................... Loctite Corp. ........................................ Bonding .........................................
SPEEDBONDER, Threadlocker
55 55 55 56 56 57 5& 58 59 59
DEPEND
Adhesives
.............................
63
LOCTITE DRI-LOC, LOCQUIC Mereco Division ...................................... MERECO CLN-738 Surface Mount Adhesive ............. METRE-SET 321 One-Part Adhesive Epoxy ..............
68 68 68
Contents and Subject Index Norland Products Inc. ................................. ...................... NORLAND Electronic Adhesive NEA ..................................... Pacer Technology ..................... ANA-LOK Anaerobic Compounds ANL ............................... Permabond International QUICKBOND High Speed Toughened Acrylic Adhesive ..................... System: QUICKBOND 650,612 Permagile Industries Inc. ............................... .......... INSULBOND Industrial and Electrical Adhesives ................ INSULBOND Special Purpose Adhesives Sauereisen Cements ................................... Electric Heater Cement No. 6 ........................ INSA-LUTE Adhesive Cement No. 1 ................... ALUSEAL Adhesive Cement No. 2 .................... INSA-LUTE Hi-Temp Cement No. 7 ................... SAUEREISEN Cement No. 31. ....................... SAUEREISEN Electric Insulating Cement No. 12 .......... .............. SAUEREISEN Electric Refractory Cement SAUEREISEN Electric Resistor Cement No. 78 ........... ............ SAUEREISEN Electrical Cement No. DW-30 SAUEREISEN Electrical Refractory Cement No. 75 ........ SAUEREISEN ELECTROTEMP Cement No. 8 .......... SAUEREISEN INSULTEMP Cement No. 10 ............. SAUEREISEN Low Expansion Cement No. 29 ............ Sheldahl ........................................... SHELDAHL Bonding Materials: Unsupported Acrylic Adhesive T1615 (MUC) ............................ SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400 ................ 3MCo. ............................................ High Performance Adhesives for the Electrical and Electronics Industry ............................... Two-Part Epoxies .............................. SCOTCH-WELD ........................... Two-Part Urethanes ............................. One-Part Epoxies Hot Melts ................................... JET-MELT ................................ Cyanoacrylates PRONTO ................................ Bonding Film Thermoset Plastics, Inc. ...............................
ix 69 69 71 71 76 76 77 77 79 81 81 82 82 83 84 85 86 87 88 89 90 91 92 93 93 94 97 97 97 100 100 101 102 103 104
x
Contents and Subject Index Electronic Grade Adhesives One Component/Elevated Temperature Curing . ....... ........ ...... Surface Mount Adhesives ..... ........ ....... Standard Syringe Dispense, Syringe Dispense for High Stand-Off Components and Screen Printing, Hardware Pin Transfer, So&are Pin Transfer J.H. Young Co., Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . Temporary Adhesives and Waxes . . . . . . . . . . . . . .
. . . . . . . 104 . . . . . . . 106
. . . . . . . 108 . . . . . . . 108
............... SECTION II: ADHESIVES-CYANOACRnATE Apple Adhesives Inc. ................................. SUPERSET Cyanoacrylate Adhesives .................. Bostik ............................................ ......... Engineering Adhesives: Cyanoacrylate Adhesives General Purpose Cyanoacrylates, Special Pei$ormance Cyanoacylates Fel-Pro Chemical Products Division ...................... ...... PRO GRIP Instant Bonding Cyanoacrylate Adhesives ........................................ ITWDevcon ..... DEVCON ZIP GRIP Cyanoacrylate Instant Adhesives Loctite Corp. ....................................... Bonding ........................................ Instant Adhesives .............................. SUPERBONDER, PRISM, BLACK MAX, TAK PAK Oneida Electronic Mfg. Inc. ............................ ........ INSTANT-WELD Alpha Cyanaoacrylate Adhesive ..................... INSTANT-WELD 847 Adhesive INSTANT-WELD 8.50 Series ........................ .................................... Pacer Technology ........ Instant Adhesives: Standard Grade Cyanoacrylates Ethyl Types, Methyl Types Instant Adhesives: Advanced Technology Series .......... PX, m, HI, HC, HP .............................. Permabond International PERMABOND Cyanoacrylates (Instant Adhesives) ........ POWERBOND PERMABOND High Performance Cyanoacrylate ..................................... Adhesives
109 110 110 118 118
120 120 123 123 126 126 126 136 136 140 141 142 142 147 155 15.5
160
SECTION III: ADHESIVES-EPOXY . . . . . . . . . . . . . . . . . . . . . . . . 161 Abatron, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 One-Component Epoxy Systems . . . . . . . . . . . . . . . . . . , . . . 162 ABOCAST 5 Variable-Ratio Epoxy Adhesives for Structural
Contents and Subject Index and Electric Applications .......................... ABOWELD 80054/ABOCURE 8005-4 ................ Bacon Industries Inc. ................................. ALLABOND TWENTY/TWENTY Adhesive ............ BostIk ............................................ Engineering Adhesives: BOSTIK 7575 Two Component Epoxy ........................................ Engineering Adhesives: M890 Acrylic Adhesive .......... Conap, Inc. ........................................ CONASTIC Dielectric Adhesive AD-20 ................ CONASTIC Dielectric Staking Adhesive ST-115 .......... CONATHANE EN-5 .............................. CONATHANE EN-6 .............................. CONATHANE EN-7 .............................. CONATHANE EN-8 .............................. CONATHANE EN-9 .............................. CONATHANE EN-9 (OZR) ........................ CONATHANE EN-10 ............................. CONATHANE EN-11 ............................. CONATHANE EN-12 ............................. Copps Industries, Inc. ................................ Solvent-Free, 100% Solids Hi Rel Epoxies .............. Rapid Gel, Intermediate Gel, Extended Gel, Heat Cure Systems ITWDevcon ........................................ DEVCON Epoq Adhesives for Bonding All Durable Materials ...................................... S-MINUTE, 2-TON Dimiter Emulsion & Chemical Co. ....................... “F’ and “E” Series Epoxies .......................... Dow Chemical ...................................... Epoxy Products for Adhesives and Sealants .............. Bisphenol A Epoxy Resins ....................... D.E.R., Pol~@ycol Resins, Novolac Resins, TACTE Resins Fenwal Inc. ........................................ TRU-BOND Epoxy Adhesives ....................... H.B. Fuller Co. ..................................... Electrical/Electronic Products: Epoxies ................ FE Furane Products .................................... EPIBOND Die Attach Adhesives: Epoxy ............... EPIBOND Electrically Insulating Thermally Conductive Epoxy Adhesives .......................
xi 164 165 166 166 167 167 167 168 168 168 169 169 170 170 171 171 172 172 173 174 174
179 179 184 184 185 185 185
189 189 195 195 202 202 205
xii
Contents and Subject Indm
Hardman Inc. ...................................... ........................... Adhesive Selector Guide EPOWELD,
KALEX,
MONOPOXY;
EPOCAP
Key Polymer Corp. ................................... .................... Epoxy Products: General Purpose Mereco Division ..................................... MERECO System No. CLN-662 Thixotropic, High Operating Temperature, Room Temperature Hardening Epoxy System .......................... METRE-GRIP 303 Series-Multi-Purpose Epoxy ..................................... Adhesives .............................. Permabond International PERMABOND ESP308, ESP309, and ESP310 ........... Permagile Industries Inc. .............................. ............................. INSULCAST Epoxies Curing Agents ................................... Smooth-On, Inc. .................................... EA-40 ......................................... METALSET A-4. Highly Versatile Ahuninum Filled ....... SUPER INSTANT EPOXY ......................... Sympiastics Inc. ..................................... SYMPOXY 1010-596 A&B, 4235-596 A&B and 4440-596 A&B.. ....................................... ................... SYMPOXY 1574 Adhesive/Sealant SYMPOXY 4120 A&B, 4130 A&B and 4150 A&B Adhesive/ Sealants ....................................... ................. SYMPOXY 4235-72 Adhesive/Sealant ................. SYMPOXY 4234-10 Adhesive/Sealant Tra-Con, Inc. ....................................... ................................. Epoxy Adhesives SUPERTHEM,
206 206 214 214 215
215 216 217 217 218 218 221 222 222 223 224 225 225 226 227 228 228 229 229
TM-BOND
SECTION Iv: CAULKS AND SEALANTS .................... American Sealants, Inc. ............................... AS1 306 Electronic Grade Self-Levehing Sihcone ................................ Sealant/Adhesive ............. ASI 388 Electronic Grade Sealant/Adhesive Chomerics, Inc. ..................................... CHO-BOND Caulks and Sealants ..................... Dow Corning Corp. .................................. DOW CORNING 736 Heat Resistant Sealant ............ Fel-Pro Inc. ........................................ .............. PRO-LOCK Anaerobic Adhesive Sealants ....................................... GE Silicones
249 250 250 251 252 252 255 255 256 256 257
Contents and Subject Index RTV Silicone Adhesive Sealants: RTV 133, RTV 160, RTV 162, RTV 167, RTV 6424 .................. General Electric Co. .................................. RTV Adhesive Sealant Products ...................... Loctite Corp. ....................................... LOCTITE Impregnation System ...................... FLEXSEAL Mereco Division ..................................... ...... MERECO METASIL 5002 Flexible Adhesive/Sealant MERECO METASIL 5004T/MERECO METASIL 5004LV RTV-1 Non-Corrosive Adhesive Sealants ........ MERECO METASIL 5005 RTV General Purpose Silicone Adhesive Sealant ................................ METASIL 5017 Mold Making Silicone Rubber ........... MERECO XLN-647 Thixotropic Sealant Epoxy .......... MERECO 3890 Series: Age-Resistant Low-Slump ................. Elastomeric Epoxy Adhesive/SeaIant ................................ SECTION v: COATINGS Castall, Inc. ........................................ Coatings Specially Designed for Electronic or ............................. General Applications CASTALL Chomerics, Inc. ..................................... CHO-SHIELD Coatings ............................ Conap, Inc. ........................................ ..... CONAP Dielectric Conformal Coatings for Electronics CONATHANE Dock Resins Corp. ................................... Conformal Coatings ............................... Dymax Corp. ....................................... DYMAX Engineering Adhesives: MULTI-CURE 984-LVF UF Curing Conformal Coating ............... Electra-Science Laboratories, Inc. ........................ High Temperature, Polyimide-Based Coatings Conductive Gold and Silver Compositions: #A-25, #I-30, #A-25-G, #A-25-SD/Insulating Composition, #A-25-1 ............ Polymer Dielectric Coatings #500 Resin-Based Thick Films ........................................ Polymer Protective Coatings 242-S, 242-SB, 242-D ......... Polymer Resistive Coatings #RS-15100, #RS-15100P, #RS-16000, #RS-16100 Series ...................... .... Protective Coating #22H: Room Temperature, Aircure Protective Coatings #55H-D and #55H-S: High
xiii
257 260 260 262 262 263 263 264 265 265 266 267 268 269 269 276 276 279 279 284 284 285 285 286
286 287 288 289 290
xiv
Contents and Subject Index .......................... Temperature Application ......................... Protective Coating #240-SB Furan Products ..................................... Conformal Coatings ............................... ACRYLANE, EPOCAST, SILFLEX, URALANE GC Electronics ..................................... Coatings ....................................... PRINT KOTE, CONKOAT, RED-X, Q DOPE, EMI-RFI SHIELD, INSUL-VOLT, STATIC HALT, Q-DOPE, CORONA DOPE, RED GLPT, LIQUID TRPE, HIGH VOLTAGE PUTTY GE Silicones ....................................... Silicone Conformal Coatings: ECC 440, ECC 443, ECC 450, ECC 453, SR 900 ........................ Magnolia Plastics, Inc. ................................ MAGNOLIA 3900 & 3901 and MAGNOLIA 3900 & 3901 UV ...................................... Mavidon Corp. ..................................... Coatings ....................................... MAVIDON Mereco Division ..................................... ............. MERECO CN-785U Circuit Board Coating ....... META-CLAD 1175 Clear Epoxy Protective Varnish ............... METACLAD DP-537 Protective Coating ........... METACOTE 1031 Silicone Protective Coating METAGEL 1870 Series: Thixotropic Conformal Dip Coating Compound .............................. Miller-Stephenson Chemical Co., Inc. ..................... Couformal Coatings ............................... Conformal Protective Coating: Aerosol Products ......... Products Research & Chemical Corp. ..................... PR-1568 Couformal Coating ......................... Ranbar Technology Inc. ............................... Thermelec Electrical Insulating Varnishes ............... Electrical Specialties .............................. Solvent Baking Varnish, Clear, Water Reducible Varnish, Air Dry Clear Varnish, 100% Reactive Varnish Symplastics Inc. ..................................... SYMPOXY 1495 Dip Coating ....................... TACC International Corp. ............................. Conformal Coatings ...............................
SECTION VI: CONDUCTIVE
COMPOUNDS
291 292 293 293 294 294
298 298 301 301 302 302 312 312 313 313 314 315 316 316 317 320 320 321 321 321
325 325 326 326
. . . . . . . . . . . . . . . . . 328
Contents and Subject Index Abatron, Inc. ....................................... ................... Electrically Conductive Compounds Silver Filled .................................. Nickel Filled ................................. Carbon Filled ................................ ABOCOAT, ABOKELD, ABOCURE Able&k ........................................... Hybrid Adhesive Pastes ............................ ABLEBOND Polymer Conductor P2134 .......................... Polymer Conductor P2136 .......................... ....................... Polymer Conductor P2313-XP Polymer Conductor P2422 .......................... Polymer Conductor P2545 .......................... Polymer Conductor P254S .......................... Polymer Conductor P2609 .......................... ............. Polymer Overcoat P62OO Series Soldermask ..................... Polymer Dielectrics/Encapsulants Polymer Resistor Systems ........................... A.I. Technology, Inc. ................................. .......................... Flexible PRIMA SOLDER ........................... Rigid PRIMA SOLDER Aremco Products, Inc. ................................ ...... AREMCO-BOND Electrically Conductive Adhesives AREMCO-SHIELD EMI/RFI Conductive Adhesive/ Putty/Coating .................................. HEAT-AWAY High Temperature Conductive Greases ..... PYRO-DUCT High Temperature Electrically Conductive Coatings ...................................... Bacon Industries Inc. ................................. ..................... Electrically Conductive Adhesives CONDUCTING TWENTY/TWENTY .............. Thermally Conductive Silicone Compounds Thermally Conductive Adhesive LCA-127 ............... Chomerics ......................................... ................... CHO-BOND Conductive Adhesives CHO-FLEX Conductive Coatings and Ink .............. Cotronics Corp. ..................................... Hi Temp Conductive Adhesives: For Electronic and Industrial Applications ............................ .......................... Electrically Conductive .......................... Thermally Conductive DURALCO Dymax Corp. .......................................
xv 329 329 329 330 330 334 334 336 336 337 337 338 338 339 339 340 341 342 342 343 346 346 347 348 349 350 350 352 353 354 354 357 358 358 358 359 360
xvi
Contents and Subject Index DYMAX MULTI-CURE Thermally Conductive Adhesive 991 .......................................... Electra-Kinetic Systems, Inc. ........................... .................. CONDUCT-X Conductive Adhesives Electra-Science Laboratories, Inc. ........................ Conductive Adhesives and Coatings Silver Compositions: #1109, #1109-S, #1110-S, #2209/Thermally Conducting, Electrically Insulating #1109-I for Use as Adhesive .......................... and for Chip Attachment ESL #1107-S Silver-Filled Conductive Polymer ........... #1900 Silver-Filled Solventless Epoxy/#1000 Insulative ................ Epoxy/#610 Reactive Vehicle Thinner Epoxy Technology Inc. ................................ EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Silver Filled Elevated Temperature Cure ........ EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Silver Filled Room Temperature Cure .......... EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Gold Filled Elevated Temperature Cure ......... EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Pd:Ag Filled Elevated Temperature Cure ........ EPO-TEK Epoxies Thermally Conductive/Electrically Insulating-Microelectronic Grade .................... Alumina Filled Elevated Temperature Cure, Insulating Elevated Temperature Cure Furane Products .................................... ....... EPIBOND Electrically Conductive Epoxy Adhesives ............... URALANE Thermal Transfer Adhesives Key Polymer Carp .................................... ................ Epoxy Products: Conductive Adhesives Magnolia Plastics, Inc. ................................ Conductive Adhesives .............................. MAGNOLIA, MAGNOBOND Mavidon Corp. ..................................... Adhesives ...................................... Heat Sink Adhesive, Flameout Adhesive Electrically Conductive Products ...................... Conductive Adhesive, Conductive Ink, Dielectric, Resistive Ink, Conductive Epoxy Mereco Division ..................................... METADUCT 1202 Silver Adhesive and Cement .......... METADUCT 1240 Flexible, Electrically Conductive OneComponent Epoxy Adhesive and Coating .............. META-SHIELD 1234 Conductive Copper Paint ..........
360 361 361 365
365 366 367 368 368 371 372 374 375
379 379 380 382 382 383 383 387 387 388
399 399 400 401
Contents and Subject Index TACC International Corp. ............................. Electrically Conductive Resins ....................... Tecknit ........................................... Conductive Adhesives-Two Part: Silver, Nickel, or Carbon Filled RTV ..............................
xvii 402 402 404 404
CON/RTV Conductive Caulking: Silver-Filled Flexible Resin Caulking System .............................. Conductive Caulking: Silver-Filled Flexible Resin Caulking System (Conductive) .................... Conductive Epoxy: Silver-Filled Epoxy Systems .......... Conductive Grease: Conductive Silver-Filled Silicone Grease ....................................... Conductive Systems ............................... Electrically Conductive Acrylic and Latex ............... TECK-BOND Silver-Plated Copper-Filled Adhesives ....... Thermoset Plastics, Inc. ............................... Microelectronic Resin Systems: Electrically Conductive Materials ............................. Tra-Con, Inc. ....................................... Conductive Epoxy Adhesives ........................
TM-DUCT,
TM-SHIELD,
405 406 407 408 409 410 412 414
414 416 416
TM-CAST
SECTION VII: ENCAPSULATING, PO’ITING, CASTING, IMPREGNATING COMPOUNDS .......................... Abatron, Inc. ....................................... Casting for Electrical and Structural Uses ............... ABOCAST, ABOCURE, EPOXIT One-Component Structural/Dielectric Epoxy Systems
420 421 421 ......
427
ABOKELD The “VR” Epoxy Series ............................ Bacon Industries Inc. ................................. Clear General Purpose Potting Compound P-51 .......... General Purpose Potting Compound C-84/BA-63 ......... Instrument Grade Potting Compounds P-80C and P-80F .... Instrument Grade Potting Compounds P-82C and P-82F .... Low Cost Potting Compound P-85 .................... Microcircuit Grade Potting Compound P-86 ............. Coil Impregnants ................................. Epoxy Resin Potting Compounds .....................
428 433 433 434 435 436 437 438 439 442
Highly-Filled Gyro-Grade Low Coefficient of Expansion, Light Weight-Glass Microballoon Filled, Thermally Conductive Potting Compounds Non-Magnetic
Potting
Compounds
....................
453
...
XV111
Contents and Subject Index
Biwax Corp. ........................................ ............ Impregnating Compounds High Temperature ............. Impregnating Compounds Low Temperature .................. Potting Compounds Heat Conductive ............... Potting, Dipping and Coating Compounds Sealing Compounds ............................... Special Compounds ...............................
454 454 456 458 459 462 463
Screw and Fastener Coating, W?re Spotting, Potting Greases Miscellaneous Impregnating, Potting, Dipping Compounds Bonded Products, Inc. ................................ EPI-SEAL Clear Epoxy PE-X001 ..................... EPI-SEAL Clear Epoxy PE-X002 ..................... EPI-SEAL Clear Epoxy PE-X003 ..................... CasChem, Inc. ...................................... QURE Polyurethane Systems for Electrical Applications ....................... in Potting and Encapsulation Conap, Inc. ........................................ CONATHANE High Technology Potting, Casting and ............................. Molding Compounds Cotronics Corp. ..................................... DURAPOT Epoxies: High Performance Potting ............... Compounds for Electronic Applications John C. Dolph Co. ................................... DOLPHON Epoxy Resins ..........................
. . 466 468 468 469 470 471 471 482 482 483 483 487 487
One Package Impregnant, Dipping, Wet winding, Impregnating, Casting and Potting, Bonding DOLPHON Polybutadiene Resins: Potting, Casting and Coating ....................................... Solventless Polyester Resins ......................... Emerson & Cuming, Inc. .............................. .............. Encapsulants: General Purpose (Unfiied)
498 500 503 503
One Component-Epoxy Based, One Component Systems-UV Curable, Two Component SystemsEpoxy Based, Two Component Systems-Urethane Based Encapsulants:
General
Purpose
(Filled)
. . . . . . . . . . . . . . . . 507
One Component Systems-Epoxy Based, Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based Encapsulants:
Low Viscosity
. . . . . . . . . . . . . . . . . . . . . . . . 513
One Component System-Epoxy Based Two Component Systems-Epoxy Based Two Component SystemsUrethane Based
Contents and Subject Index Encapsulants:
Low Temperature
Performance
xiw
. . . . . . . . . . . 518
Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based Two Component SystemsUrethane Based Encapsulants:
High Temperature
Performance
. . . . . . . . . . . 525
One Component Systems-Epoxy Based; Two Component Systems-Epoxy Based, Two Component SystemsSilicone Based Encapsulants: Dispensable . . . . . . . . . . . . . . . . . . . . . . . . . . 533 One Component Systems-Epoxy Based . . . . . . . . . . . . . 533 Two Component Systems-Epoxy Based . . . . . . . . . . . . . 535
STYCXST Two Component Systems-Silicone Based . . . . . . , . . . . . 537 Encapsulants: Fire Resistant . . . . . . . . . . . . . . . . . . . . . . . . 538
One Component Systems-Epoxy Based Two Component Systems-Epoxy Based Encapsulants:
. . . . . . . . . . . . . . . . . . . . . . . . . . 542
Lightweight
One Component Systems-Epoxy Based Two Component Systems-Epoxy Based, Two Component SystemsSilicone Based; Two Component Systems-Urethane Based Encapsulants:
Optically
Clear
. . . . . . . . . . . . . . . . . . . . . . . 544
One Component Systems-Epoxy Based One Component Systems-Silicone Based, One Component SystemsW Curable, Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based Encapsulants:
Thermally
Conductive
. . . . . . . . . . . . . . . . . . 549
One Component Systems-Epoxy Based, Two Component Systems-Epoxy Based, Two Component Systems-Epoxy Based Encapsulants:
Specialty
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 555
One Component Systems-Silicone Based, Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based, Two Component SystemsUrethane Based Encapsulants: Curing Agents . . . . . . . Fenwal Inc. . . . . . . . . . . . . . . . . . . . . . . . TRU-CAST Potting and Casting Resins Furane Products ... ...... .......... EPOCAST Glob Top Encapsulants ... Potting, Encapsulating and Impregnating Conformal Coatings . . . . . . . . . . . . .
URALANE, ACRYLANE, GE Silicones
.. ..... .. ... .. ... .. . .... ... ..... .. Products .... ...
. . . . .
... ... ... ... ... for ....
. . . . .
. . . . .
. . . . .
.. .. _. .. ..
. . . . .
559 563 563 573 573
. . . . . . 576
EPOCAST, SZLFLEX
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579
xx
Contents and Subject Index Addition-Cure RTV Silicone Encapsulants: RTV 615, RTV 627, RTV 655 .............................. ........... Condensation-Cure RTV Silicone Encapsulants General Purpose Encapsulants: RTV 11, RTV 12, RTV 21, RTV 41 ................................ High-Temperature Encapsulants: RTV 31, RTV 60, RTV88 ....................................... Low-Temperature Encapsulants: RTV 511, RTV 560, RTV 577 ...................................... Encapsulants (Room Temperature Cure) ............... Encapsulants (RT or Heat Cure) ..................... General Polymers Corp. ............................... POLYCAST 25 Epoxy Resin Compound ................ POLYCAST 62 Epoxy Resin System ................... POLYCAST XP-242 Epoxy Resin System ............... Key Polymer Carp .................................... .................. Epoxy Products: Potting Compounds Magnolia Plastics Inc. ................................ Electrical Systems ................................ MAGNOLIA Mavidon Corp. ..................................... Encapsulants .................................... Semiconductor Encapsulant, Epoxy Casting Compound, Casting Compountt, Potthg Compound Permagile Industries Inc. .............................. INSULCAST Epoxy Selector, Guide for Electrical and ............................ Electronic Compounds INSULCURE Products Research & Chemical Corp. ..................... ............. PR-1201-Q Potting and Molding Compound PR-1201-RLS Potting and Se&rig ..................... ............... PR-1520 Potting and Molding Compound ............... PR-1527 Potting and Molding Compound ............... PR-1535 Potting and Molding Compound ............... PR-1538 Potting and Molding Compound PR-1546 Potting, Embedding and Encapsulating Compound .................................... .............. PRC-1547 Potting and Molding Compound ........................ PR-1564 Molding Compound ............... PR-1570 Potting and Molding Compound ............... PR-1574 Potting and Molding Compound ........................ PR-1590 Molding Compound ............... PR-1592 Potting and Molding Compound ............... PR-1660 Potting and Molding Compound
579 579 580 580 581 582 587 589 589 589 590 591 591 592 592 605 605
610 610 618 618 619 620 621 622 623 624 625 626 627 628 629 630 631
Contents and Subject Index P/S 727 Potting and Sealing Compound ................ P/S 799 Potting and Molding Compound ............... Quadrant Chemical Corp. ............................. A-2191F/B-2912F Encapsulating Resin ................. A-2238 VO/B-2250 Encapsulating Resin ................ A-2249 VO/B-2250 Encapsulating Resin ................ Symplastics Inc. ..................................... ARALDITE 506/SYMPOXY CA-803 ................. SYMPOXY 1002-31 and 1010-31 A & B ................ SYMPOXY 1002-32 and 1010-32 A & B ................ SYMPOXY 1003-3 A & B .......................... SYMPOXY 1004-201 A & B, 1007-201 A & B and 1010-201 A & B ................................ SYMPOXY 1005 A-B-C ............................ SYMPOXY 1006-35 ............................... .......... SYMPOXY1006-72A&BandlOlO-72A&B SYMPOXY 1006-284 and 1006-74 .................... SYMPOXY 1006-803 .............................. SYMPOXY 1007-213 A & B ........................ SYMPOXY 1007-728 and 1350-728 .................... SYMPOXY 1010 ABC ............................. SYMPOXY 1OlOFR ABC .......................... SYMPOXY 1010-6 and 1010-803 ..................... SYMPOXY 1010-35 ............................... SYMPOXY 1010-809 A & B ........................ SYMPOXY 1010-50 A & B, 4235-50 A & B and W-250 A & B ....................................... SYMPOXY 1010-74 A & B ......................... SYMPOXY 1010-802 A & B ........................ SYMPOXY 1010-807 A & B ........................ SYMPOXY 1010-812 A & B ........................ SYMPOXY 1015 A & B ........................... SYMPOXY 1064-561 A & B ........................ SYMPOXY 1064-809 A & B ........................ SYMPOXY 1225-35 ............................... SYMPOXY 1225-20 ............................... SYMPOXY 1225/85 .............................. SYMPOXY 1225FR-284 ............................ SYMPOXY 1225FR-803 ............................ SYMPOXY 1230-56 A & B and 1282-56 A & B for Small Potting Applications .............................. SYMPOXY 1230/284 Potting/Casting System ............ SYMPOXY 1230-561 Potting/Casting System ............ SYMPOXY 1230-803 Potting System ..................
xxi 632 633 634 634 635 636 637 637 638 639 640 641 642 643 644 645 646 647 648 649 650 651 652 652 653 654 655 656 656 657 657 658 658 659 659 660 660 661 662 662 663
xxii
Contents and Subject Index SYMPOXY 1230-201 A & B Potting/Casting System ...... SYMPOXY 1250 Potting/Casting Resin ................ SYMPOXY 1250-50 A & B and 1350-50 A & B .......... SYMPOXY 1250-213 A & B and Potting/Casting System ... ............ SYMPOXY 1273-72 A & B Adhesive/Sealant SYMPOXY 1273-20 Epoxy Sealant and Potting .................................... Compound .......... SYMPOXYUU-284A&Band1281_9A&B SYMPOXY 1282-201 Potting/Casting/Impregnating ................................... Applications SYMPOXY 1279FR-284 A & B Potting/Casting ................................... Applications ............ SYMPOXY 1282-284 End Fill Epoxy System SYMPOXY 1282-561 Potting/Casting System ............ SYMPOXY 1282-803 Potting/Casting/Impregnating ....................................... System SYMPOXY 1282-2213 A & B Potting/Casting System ...... ...... SYMPOXY 1287-809 A & B Potting/Casting System SYMPOXY 1350-6 Potting/Casting System .............. SYMPOXY 1350-8 Potting/Casting System .............. SYMPOXY 1350-803 Potting/Casting System ............ SYMPOXY 1350-2218 A & B Epoxy System for Potting/ Casting ....................................... SYMPOXY 1425/56 Potting System ................... SYMPOXY 1425-284 Potting/Casting/Adhesive/Sealant ................................... Applications SYMPOXY 1425-213 A & B Shock Resistant System ...... SYMPOXY 1426-596 A & B Potting/Casting System ...... SYMPOXY 1454-596 Potting/Casting System ............ SYMPOXY 1515-591 Epoxy Tooling Resin .............. SYMPOXY 1610-74 Potting/Casting Resin .............. SYMPOXY 1870 Tooling/Casting System ............... SYMPOXY 1871 Potting and Casting System ............ SYMPOXY 1873 Potting/Casting Resin ................ SYMPOXY 1874 ................................. SYh4POXY 1874: Physical and Electrical Properties ....... SYMPOXY 1949 Fluidized Bed Coating Powder .......... ... SYMPOXY 2100-810 A & B Potting and Casting System SYMPOXY 1950, 1951, 1954, 1955 Epoxy for Potting/ .................. Casting/Encapsulation Applications SYMPOXY 2202 A & B Potting/Casting/Coating System .... ......... SYMPOXY 2205 A & B Potting/Casting System SYMPOXY 2218 and 2221 FR A & B for Potting/Casting ................................... Applications
663 664 666 666 667 667 668 669 669 670 670 671 671 672 672 673 673 674 674 675 675 676 676 677 678 679 679 680 681 682 684 684 685 687 687 688
Contents and Subject Index SYMPOXY 2285 A & B Epoxy Potting/Casting/ Impregnating System . . . . . . . . . . . . . . . . . . . . . . . . . SYMPOXY 2650 ABC Epoxy System for Impregnations SYMPOXY 2660A,B,C Epoxy System for Impregnation SYMPOXY 2660FR A,B,C Epoxy System for Impregnation SYMPOXY 18752 Potting and Casting Resin . . . . . . . . SYMPOXY 18755 A & B Potting/Casting System . . . . . SYMPOXY 1877 Potting/Casting Resin . . . . . . . . . . . . 3M Co. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCOTCH-WELD EPX Applicator System .......... TACC International Corp. . . . . . . . . . . . . . . . . . . . . . . . . . Casting, Potting, Encapsulating Resins ............. Tra-Con, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Casting Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TRA-CAST ....................... SECTION VIII: FILMS AND TAPES Ablestik ........................................... Hybrid Adhesive Films ............................. Electrically Conductive .......................... ABLEFILM ........................... Electrically Insulative .......................... Thermally Conductive Adhesives Research, Inc. .............................. Conductive Pressure Sensitive Adhesives ................ ARCLRD A.I. Technology, Inc. ................................. Flexible ESP Series ............................... Flexible ZSP Series ............................... : .................. Flexible TACK FILM ........... American Biltrite Inc. ................................ Printed Circuit Board Products ....................... THERM-X Electrical Tapes ......................... Arlon ............................................. Circuit Materials ................................. High Performance Adhesive Coated Dielectrics Flame Retardant Acrylic Coated Aramid Paper: NOMEX, Phenolic Coated Aramid Dielectrk, Flame Retardant Acrylic Coated Polyimide Films, Acrylic Coated Poiyimide Film, Epoxy Coated Polyimide Film, Flame Retardant Epoxy Coated Polyimide Film ........................... Adhesive Cast Fiis Acrylic Cast Film, Flame Retardant Acrylic
.... .... .... .. .... .... .... . . . . .... .... .... .... ....
xxiii
689 689 690 691 692 693 693 694 694 697 697 700 700
710 711 711 711 713 714 715 715
.......
718 718 719 720 721 721 724 732 732 732
738
xxiv
Contents and Subject Index
Cast Film, Epoxy Cast Film, Flame Retardant Epoxy Cast Film Adhesive Coated Polyester Films .................. Flame Retardant Acrylic Coated Polyester Film, Heat Seal Coated Polyester Film Overlay, Heat Seal Coated Polyester Film Overlay Flame Retardant Copper Laminates ............................. Copper Foil/Polyester Film Laminate, Copper Foil/Polyester Film Laminate Flame Retardant Adhesive Coated Copper Foils .................... Epoxy Coated Copper Foil, Phenolic Coated Copper Foil CHR Industries ..................................... KAPTON TEMP-R-TAPE Protection Tape ............. STRIP-N-STICK Silicone Rubber Tapes ................ TEMP-R-TAPE D926 Wave Solder Protection Tape ....... TEMP-R-TAPE M797 Conformal Coating Protection Tape ......................................... TEMP-R-TAPE C-665 ............................. Custom Coating & Laminating Corp. ..................... Silicone Printed Circuit Board Masking Tapes ............ Dielectric Polymers, Inc. ............................... NELTAPE Specialty Tapes ......................... Fume Mask, Platers Tape, Printed Circuit Board Tape Finite Industries Inc. ................................. Electrical Tapes .................................. FINITE Printed Circuit Board Tapes ......................... Sheldahl .......................................... SHELDAHL FLEXCONNECT Materials Flame Retardant Adhesive on Polyester Film T-1694 ................... SHELDAHL FLEXCONNECT Materials Polyester Resin on Polyimide Film: T-320 ......................... SHELDAHL FLEXCONNECT Materials SellExtinguishing Adhesive Coated Polyester T-34.0 ......... SHELDAHL FLEXCONNECT Materials 1 Mil Adhesive x 2 Mil Polyester Film x 1 Mil Adhesive T-1502 ........... Thermosetting Structural Adhesive T-1401 .............. Tesa Tuck Inc. ...................................... Electronic Tapes ................................. Electronic Packaging (Bandoliering) Tapes ........... TESABELT Hot-Air Levelling Tape .........................
742
745
747
749 749 750 751 751 751 752 752 754 754 758 758 760 765 765 766 767 768 769 770 770 770 771
Contents and Subject Index TESAFILM Wave Solder Tape
xxv
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 771 772 773 773 773
SECTION Ix: INSULATING PRODUCTS .................... Ablestik ........................................... Hybrid Adhesive Pastes ............................ ........................... Electrically Insulative
ABLEBOND 775
Castall, Inc. ........................................ Epoxies Specially Designed for Electronic ............................ Insulating Applications
775
CASTALL, General Purpose, Military Grade, Thermally Conductive, Flame Retardant, Specialty Materials, Epoxy Hardeners Silicones Specially Designed for Electronic ............................ Insulating Applications
797
77termalIy Conductive Grease Compounds, Two Component RTV Compounds Urethanes Specially Designed for Electronic ............................ Insulating Applications John C. Dolph Co. ................................... Insulating Varnishes ............................... Baking Varnishes ..............................
808 824 824 824
HI-THERM, DOLPHON, AQUA-THERM Solventless Varnishes Air Drying Varnishes
........................... ...........................
828 828
............................ ............................ ............................ ...........................
830 830 831 831
SMVTHITE Insulating Lacquers Insulating Enamels Machinery Enamels Masking Compounds
DOLFLEX ............................. Sealing Compounds ................................. The P.D. George Co. PEDIGREE No. 1000-70 Water Borne Insulating Varnish Hexcel Chemical Products ............................. EPOLITE Brand Electrical Insulating Products ...........
...
832 833 833 834
834
Heat Cure Epoxies-One Component, Room Temperature Cure Epom-es-Two Component Thermoset Plastics, Inc. ............................... Electrical/Electronic Insulating Resins: Epoxy
...........
842 842
Oven Curing, Room Temperature Curing THERMOSET Polyurethane
Electrical/Electronic Insulating ...................................
Resins: 851
xxvi
Contents and Subject Index Room Temperature Curing THERMOSET Electrical/Electronic Insulating Resins: Silicone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853 Room Temperature Curing
SECTION x: SILICONES ................................ Ducey Chemical, Inc. ................................. 2-Part Silicone RTVs (Room Temperature Silicone Rubbers) ...................................... GE Silicones ....................................... ................... Semiconductor Packaging Materials Junction Coatings, Gels, Adhesives, Molding Compounds Solventless Silicone Dielectric Gels: RTV 6156, RTV 6166, RTV 6186, RTV 6196 .................... General Electric Co. .................................. Condensation Cure RTV Silicone Rubber Products ........ General Purpose Products, High Temperature Products, Special Purpose Products ........... Addition Cure RTV Silicone Rubber Products General Purpose Products, Special Purpose Products ....... Silicone General Purpose and Dielectric Compounds GE Dielectric Compounds ........................................ IlWDevcon ..................... DEVCON SILITE RTV Silicone Permagile Industries Inc. .............................. INSULCAST R.T.V.S. (Room Temperature Vulcanizing Silicone) ...................................... INSULCAST R.T.V.S. (Room Temperature Vulcanizing ....................... Silicone): R.T.V.S. Catalysts ......................... SECTION XI: MISCELLANEOUS Ablestik Laboratories .................................. P3300 Series Polymer Resistor Ink .................... P3500 Series Polymer Resistor System for Keypads and Contacts ................................... P3900 Series Polymer Resistor Ink .................... P7110-XP Flexible Polymer Multilayer Dielectric .......... P7130 Polymer Multilayer Dielectric Series .............. ................... P7552 Polymer Multilayer Dielectric Aremco Products,‘Inc. ................................ ............ AREMCO High Temperature Coatings/Tape CERAMACOAT, AREMCO-COAT, CERAMXDIP, PYRO-PAIN T. PYRO-TAPE
856 857 857 858 858
867 869 869
875 878 882 882 883 883 891 892 893 893 893 894 895 895 896 897 897
Contents and Subject Index Bacon Industries Inc. ................................. Epoxy Resin Finishing Compounds .................... Dock Resins Corp. ................................... Acrylics for Electronics Industry ...................... John C. Dolph Co. ...................................
DOLPH-SPRAY Fluorocarbons)
High Technology Electronic Resins: DOLPHON CB-1078 and DOLPHON CB-1109 ................... Dynaloy, Inc. .......................................
Solvent Selection Guide: Ethylene Glycol Ether Base ...... URESOLW,
Selection Selection Selection Selection
900 900 901
901 902
Aerosol Products (Contain no
................................. Insulators, Machinery Lacquers, Anti-Corrosion
Solvent Solvent Solvent Solvent
xxvii
URZBOLVE PLUS, DYh’ASOLW Methanol Base ...............
Guide: Guide: Guide: Guide:
Methylene Chloride Base ........ Propylene Glycol Ether Base ..... Special Solvents ...............
DECAP Dynamold, Inc. ..................................... Moldable Shim Material ............................ Moldable Shim Materials MS-26 AND DMS-4-828 ........ Electra-Science Laboratories, Inc. ........................ ESL High Technology Materials Systems ............... High Reliability System ......................... Conductive, Resistive, Dielectric, Solder, Protection Consumer Products System ...................... Nitrogen Firing System ......................... High Voltage System ........................... Microwave/High Frequency System ................ Aluminum Nitride Substrate System ................ Beryllia Substrate System ........................ Polymer Thick Film Systems ..................... Porcelain Enameled Steel (PES) System ............. Surface Mounting Materials ...................... Cerdip Dotting Metallizations ..................... Solar Cell System .............................. Thick Film Cermet Cap&or System ............... Potentiometer System .......................... Thermal Printhead System ....................... Sensor Systems ............................... Capacitive Pressure Sensors ...................... ....................... Resistance Thermometers Thermistors ..................................
902
904 905 905 906
907 908 909 910 910 912 915 915 915
915 916 916 916 917 917 917 918 918 919 919 919 919 919 920 920 920 920
xxviii
Contents and Subject Index
Display Systems ............................... DC Gas Dischaee, AC Gas Discharge Through-Hole Printing System .................... Ceramic or PC Boards Dielectric Tape Systems ......................... Cojire, Dimensionally Stable Chip Resistor System ........................... H.B. Fuller Co. ...................................... Electrical/Electronic Products: Hot Melts .............. .............. Electrical/Electronic Products: Urethanes Loctite Corp. ....................................... Electronic Assembly Aids ........................... .................. Thermally Conductive Adhesives OUTPUT Instant Adhesives ............................... TAK PAEC, SUPERBONDER ..................... Ultraviolet Curing Adhesives IMPRW LITE-TAK ..................... Conformal Coating Products SHRDO WCVRE, NWA-SIL Adhesives for Surface Mounted Devices ............. CHIPBONDER Potting Products .............................. Sealing Products .............................. Electronic Assembly Aids: Bonding Products Technical Information .................................... Electronic Assembly Aids: Coating Products Technical Information .................................... Electronic Assembly Aids: Potting Products Technical Information .................................... ................ Sealing Products Technical Information Electronic Assembly Aids: Surface Mount Products ............................ Technical Information ..................... Solvents, Primers, and Activators LOCQUIC, DEPEND Mavidon Corp. ..................................... SG 21 Thermal Grease ............................. Q-MAX A-27 RF Lacquer .......................... Mereco Division ..................................... META-GEL 156 Epoxy Dip Compound ................ National Starch and Chemical Corp. ..................... THERMID EL-5000 Series: Spin Coatable Polyimides ..... Ancillary Products ............................. Polyimide Thinner T-310, Adhesion Promoter AP-20
921 921 922 922 923 923 926 929 929 929 929 930 931 932 933 934 935 938 939 940 942 943 947 947 947 948 948 949 949 950
Contents and Subject Index THERMID Paste EL-9410 .......................... THERMID PASTE EL-9411: For Superior Hybrid .......................... Microcircuitry Protection .................................... Pacer Technology Accelerators, Primers, Debonder and Protective Hand Cream ................................... Pierce & Stevens Industrial Group ....................... .................. Products for the Electronics Industry .............................. Emission Binder External Black Conductive Coating ................. ........................... Aluminizing Coating Frit Vehicle .................................. P&S Products Research & Chemical Corp. ..................... P/S 775 Polyurethane Primer ......................... P/S 776 Polyurethane Primer ........................ Quadrant Chemical Corp. ............................. .......... Automotive Electronics/Automotive Computers .................. High Voltage Electronic Transformer ........................... Marine Coil and Ignition Telecommunications/General Potting and Casting ......... Thermoset Plastics, Inc. ............................... Microelectronic Resin Systems: Dielectric Materials ....... Transene Co., Inc. ................................... OHMEX-AG: Thermosetting Silver for Ohmic Bonding ............................... to Semiconductors Silver Epoxy Paste: Screenable Thermosetting Silver .............................. for Ohmic Bonding Microcircuit Silvers for Conductive Bonding in ................................ Microelectronics SILVER-BOND: Low Temperature Thermosetting Silver ... Gold-Epoxy Pastes: Thermosetting Gold for Ohmic Bonding ...................................... NICKEL-BOND Low Temperature Thermosetting Nickel ... INSUL-BOND Epoxy Adhesives ...................... TRANSEPOXY Self Catalyzed Epoxy Systems ........... .......................... TRANSISTOR EPOXIES General Purpose Epoxies ........................... ................................ LED Encapsulants .... EPOTHERM Thermally Conductive Epoxy Compounds Silver Conductive Pastes for Thick Film Microelectronic Circuits ........................... Palladium-Silver Pastes Conductor for Thick Film ................................... Microcircuits
xxix 951 952 953 953 955 955 955 955 956 956 957 957 957 958 958 960 962 963 966 966 968 968 968 969 969 970 970 971 972 972 973 974 974 975 975
xxx
Contents and Subject Index Gold Alloy Cermet Compositions: Conductors for .......................... Thick Fihn Microcircuits Gold Conductive Pastes: for Thick Fihn Microelectronics ................................ Nickel Electrode Paste-Type 801: Conductive Nickel Metallization ................................... Copper Conductive Paste: for Thick Fihn Hybrid Applications ................................... Buried Electrode Inks for Multilayer Ceramic Capacitor .... Moly Metalizing Preparations: High Temperature Metallizing for Alumina ........................... Tungsten Metallizmg Preparations: for Alumina and Sapphire Substrates ........................... Beryllia and Sapphire Metallizing: for High Temperature Metallizing .......................... RTM Process: Room Temperature Metallizing for Alumina ...................................... Dielectric Crossover Pastes: for Multilayer Thick Fihn Hybrid Circuits ............................. Vitreous-Crossover Paste: for Multilayer Thick Fihn Hybrid Circuits ................................. Microcircuit Silvers ............................... FARADEX Capacitor Dielectric Pastes ................ SES-Black: Modified Silicone Elastomer for Light Absorption .................................... MBS: Moisture Barrier Silicone ...................... Silicone Semi-Gel: Transparent Dielectric Potting ........
976 976 977 977 977 978 978 979 979 980 980 981 982 983 983 984
TRANSLASTIC HYBRISIL-100: Conformal Coatings for Thin Film/ ThickFihn .................................... Solder Glass Sealant Pastes: Hermetic Sealing of Hybrid Microelectronic Packages .................... OHM-RESIST: Thick Fihn ,Resistor Compositions ........ Improved Solder Fluxes: Selective Solder Fhtxing for Electronic Applications .........................
984 985 986 987
NEUTRAFLUX Solder Creams: for Microelectronic Soldering ........... Ziegler Chemical & Mineral Corp. ....................... Specialty Asphalt Products: Electronics Industry ..........
988 989 989
IMPREG WAX, Pottkg Compounds SUPPLIERS’
ADDRESSES
TRADE NAME INDEX
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 990
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 996
Section I Adhesives General
1
2
Adhesives, Sealants and Coatingsfor the Electronics Industry
ASHLAND CHEMICAL, INC.: PLIOBOND Industrial Adhesives: Base Polymer: Nitrile Rubber Base Resin: Thermosetting Phenolic PLIOBOND 20: Total Solids, %: 20 Viscosity, cps: 600 Specific Gravity: 0.87 Pounds/Gallon: 7.2 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PL IOBOND 30: Total Solids, %: 30 Viscosity, cps: 4,000 Specific Gravity: 0.89 Pounds/Gallon: 7.4 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PLIOBOND 40: Total Solids, %: 40 Viscosity, cps: 30,000 Specific Gravity: 0.93 Pounds/Gallon: 7.7 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PLIOBOND 1000: Total Solids, %: 20 Viscosity, cps: 600 Specific Gravity: 0.87 Pounds/Gallon: 7.2 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PLIOBOND HT-30: Total Solids, %: 30 Viscosity, cps: 4,000 Specific Gravity: 0.89 Pounds/Gallon: 7.4 Color: Tan Solvents: MEK/Alcohol Flash Point, F Seta: 21
Adhesives-General
BOSTIK: Contact Adhesives: 1096: Base: Neoprene Rubber Color: Buff Viscosity: Thin Syrup Solvent: Toluol Solids: 23-25% Application Technique: Brush, Roller Shelf Life: Minimum 6 mos. @ 7OF+lO Weight/Gallon: 7.3 lbs. High green strength & heat resistance. Heat reactivatable. Bonds wide range of materials. 1142A: Base: Neoprene Rubber Color: Red Viscosity: Very Thin Syrup Solvent: Ketone & Aliphatic Hydrocarbons Solids: 23% Application Technique: Spray, Brush, Roller Shelf Life: Minimum 6 mos. 8 70FklO Weight/Gallon: 6.9 lbs. Excellent heat and water resistance. Bonds wide range of materials. Flexible application methods. Meets MMM-A-121. 1515N: Base: Compounded Neoprene Color: Neutral Viscosity: Thin Syrup Solvent: Ketone w/Aliphatic & Aromatic Hydrocarbons Solids: 18%*1 Application Technique: Brush, Roller Shelf Life: Minimum 6 mos. @ 70FklO Weight/Gallon: 6.8 lbs. Excellent general purpose adhesive. Excellent heat and humidity resistance. High initial and ultimate strength. 1530N: Base: Compounded Neoprene Color: Red Viscosity: Very Thin Syrup Solvent: Ketone w/Aliphatic & Aromatic Hydrocarbons Solids: 16%*1 Application Technique: Spray Shelf Life: Minimum 6 mos. C 70F*lO Weight/Gallon: 6.7 lbs. Excellent heat, humidity and static stress resistance. High initial strength. Long "Open Tack."
3
4
Adhesives, Sealants and Coatingsfor the Electronics Industry
BOSTIK: Contact Adhesives(Continued): 1531: Base: Compounded Neoprene Color: Neutral Viscosity: Very Thin Syrup Solvent: Ketone w/Aliphatic & Aromatic Hydrocarbons solids: 16%+-l Application Technique: Spray Shelf Life: Minimum 6 mos. @ 70F+-10 Weiqht/Gallon: 6.7 lbs. Excellent heat, humidity and static stress resistance. High initial strength. Long "Open Tack." 1600: Base: Compounded Neoprene Color: Amber Viscosity: Thin Syrup Solvent: Chlorinated Solvents Solids: 12%+-l Application Technique: Brush, Roller Shelf Life: Minimum 6 mos. @ 70F+-10 Weight/Gallon: 10.75 lbs. Non flammable solvent. Flexible bonds. Excellent heat, humidity and solvent resistance. 8230: 8230 WH: Base: Synthetic Elastomer Color: Green White Viscosity: Very Thin Syrup Solvent: None-Water Solids: 50% Application Technique: Brush, Roller, Spray Shelf Life: Minimum 6 mos. @ 70F+-10 Weight/Gallon: 8.93 lbs. Broad bonding range. High solids. Aggressive adhesion to wide range of materials.
Adhesives-General
BOSTIK: General Purpose Adhesives: 1007: Base: Neoprene Color: Yellow-Brown Viscosity: 150-500 cps Solvent: Toluene Solids: 21% Application Technique: Brush, Roller, Spray Shelf Life: 12 mos @ 60-80F Weight/Gallon: 7.9 lbs Use as primer. Dries in 1 hour at room temperature. Improves adhesion on many surfaces. 1009A: Base: Neoprene Color: Black Viscosity: 2400 cps Solvent: Toluene Solids: 23% Application Technique: Brush, Roller, Coater Shelf Life: 6 mos @ 60-80F Weight/Gallon: 7.5 lbs. 2 part w/1008B. High performance. Repositionable up to 2 hours. 1074: Base: Neoprene Color: Buff Viscosity: Thin Syrup Solvent: Toluene Solids: 18-22% Application Technique: Brush Shelf Life: 12 mos. a 60-80F Weight/Gallon: 7.32 lbs. Excellent leather adhesive. Fast drvins. Good flexibility and resistance to heat and moisture. - 1076: Base: Neoprene Color: Tan Viscosity: 900 cps Solvent: Toluene Solids: 21% Application Technique: Brush, Roller Shelf Life: 6 mos. @ 60-80F Weight/Gallon: 7.0 lbs. High green strength. General purpose adhesion. Bonds rubber, fabrics, sponge plastics and woods.
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Adhesives, Sealants and Coatings for the Electronics Industry
BOSTIK: General Purpose Adhesives(Continued): 2009: Base: Natural Rubber Color: Tan Viscosity: 9500 cps Solvent: Naphtha Solids: 16% Aovlication Techniaue: Brush Shelf Life: 6 mos.‘@ 60-80F Weight/Gallon: 8.8 lbs. Fast, aggressive tack. Fast drying. Economical. 4041: Base: Nitrile Rubber Color: White Clear Viscosity: 1000 cps Solvent: Ketone Solids: 22% Application Technique: Roller, Coater, Brush Shelf Life: 6 mos. @ 60-80F Weight/Gallon: 7.1 lbs. Fast drying. High initial bond strength. Very flexible. 4050: Base: Nitrile Rubber Color: Straw-Clear Viscosity: 1000 cps Solvent: Ketone Solids: 22% Aoolication Techniaue: Roller, Coater Shelf Life: 12 mos: 8 60-80F Weight/Gallon: 7.2 lbs. Good plasticizer resistance. Low heat reactivation temperature. Bonds plastic films and metal foils. Meets MIL-A-43365. 4585: Base: Nitrile Rubber Color: Tan Viscosity: 9000-11,000 cps Solvent: MEK Solids: 28-30% Application Technique: Brush Shelf Life: 12 mos. 8 60-80F Weight/Gallon: 7.6 lbs. Fast drying. Fuel resistant. High temperature resistant. 8702: Base: Synthetic Resin Color: White-Clear Viscosity: 2000-2500 cps Solvent: Water Solids: 51% Application Technique: Roller, Coater, Brush Shelf Life: 6 mos. @ 60-80F Weight/Gallon: 8.4 lbs. High tack (pressure sensitive). Excellent peel strength. Non flammable.
Adhesives-General
BOSTIK: Hot Melt Adhesives: Bulk Hot Melts: 4101: Amber Form: l/4 in. Pellet Odor: None Softening Range: 233 to 262F Typical Viscosity @ 400F: 96,000 cps Temperature Resistance: -50 to 2OOF Operating Temperature: 375 to 450F Max Open Time: 7 sec. Excellent plasticizer resistance. Excellent resistance to solvents heat and oil. High performance adhesion. 4165: Cream l/4 in. Pellet Odor: None Softening Range: 304 to 320F Tvpical Viscosity @ 400F: 61,000 CPS Temperature Resistance: -50 to 250F Operating Temperature: 400 to 475F Max Open Time: 2 sec. Provides excellent bonds on vinyls and woven or non-woven fabrics. Excellent plasticizer resistance. Excellent heat resistance. 4252: Color: Light Amber Form: l/4 in. Pellet Odor: None Softening Range: 251 to 272F Typical Viscosity @ 400F: 2,200 Temperature Resistance: -20 to 250F Operating Temperature: 350 to 425F Max Open Time: 10 sec. High heat resistance. Low operating viscosity. Bonds many porous substrates. 4315: Color: Light Amber Form: 114 in. Pellet Odor: None Softening Range: 225 to 2351 Typical Viscosity @ 400F: 17,000 cps Temperature Resistance: -50 to 170F Operating Temperature: 325 to 475F Max. Open Time: 6 sec. General purpose adhesive. Bonds many packaging and porous materials. FDA food packaging approved.
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Adhesives, Sealants and Coatings for the Electronics Industry
BOSTIK: Hot Melt Adhesives: Bulk Hot Melts(Continued): 4342: Color: Amber Form: l/4 in. Pellet Odor: None Softening Range: 230 to 240F Typical Viscosity 8 400F: 30,000 cps Temperature Resistance: -20 to 165F Operating Temperature: 375 to 425F Max Open Time: 5 set Good adhesion to high pressure laminates. Excellent edge banding adhesive. Bonds wood and particle-board. 7102: Light Tan Form: Granular Odor: None Softening Range: 200 to 225F Typical Viscosity @ 400F: 50,000 cps Temperature Resistance: -50 to 165F Operating Temperature: 350 to 450F Max Open Time: 7 sec. Good plasticizer resistance. Bonds plastics, wood and paper. Particularly suited for vinyl. 7116: Light Tan Form: Granular Odor: None Softening Range: 259 to 277F Typical Viscosity @ 400F: 20,000 cps Temperature Resistance: -20 to 250F Operating Temperature: 375 to 450F Max Open Time: 3 sec. High performance. Bonds fabrics, PVC, films and foils. Excellent for vinyl edge folding. 7210: Light Amber Form: Granular Odor: None Softening Range: 225 to 250F Typical Viscosity @ 400F: 2,500 cps Temperature Resistance: -20 to 180F Operating Temperature: 350 to 400F Max. Open Time: 15 sec. Low operating viscosity. Good heat and chemical resistance. Bonds a broad range of materials.
Adhesives-General
BOSTIK: Hot Melt Adhesives: Bulk Hot Melts(Continued): 7213: Amber Form: Granular Odor: None Softening Range: 340 to 347F Typical Viscosity @ 400F: 5,000 cps Temperature Resistance: -40 to 270F Operating Temperature: 400 to 450F Max. Open Time: 3 sec. Excellent temperature resistance. Designed for electrical potting applications. Low viscosity. 7228: Amber Form: Granular Odor: None Softening Range: 355 to 365F Typical Viscosity @ 400F: 10,000 cps Temperature Resistance: -20 to 300F Operating Temperature: 400 to 450F Max Open Time: 2 sec. Exceptional heat resistance. Bonds non-wovens and filter material. Low viscosity. 8363: Off White Form: Pellets Odor: Slight Softening Range: 167 to 197F Typical Viscosity @ 400F: 10,000 cps Temperature Resistance: -20 to 125F Operating Temperature: 325 to 400F Max Open Time: 40 sec. General purpose adhesive. Bonds a broad range of materials. Designed for use in BOSTIK BOSS. 8384: Translucent Form: Pellets Odor: Slight Softening Range: 165 to 200F Typical Viscosity @ 400F: 9,500 cps Temperature Resistance: -20 to 125F Operating Temperature: 325 to 400F Max Open Time: 40 sec. Bonds wide range of materials. Economical. Designed for use in BOSTIK BOSS.
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Adhesives, Sealants and Coatings for the Electronics Industry
BOSTIK: Hot Melt Adhesives: Bulk Hot Melts(Continued): 8386: Light Amber Form: Slats Odor: Slisht Softening-Range: 179 to 184F Typical Viscosity @ 350F: 1,000 cps Temperature Resistance: -20 to 15iF Operating Temperature: 320 to 360F Max Open Time: 15 sec. High performance packaging. Bonds coated and wax substrates. Good adhesion at low temperature. 8387: Light Yellow Form: Slats Odor: Slisht Softening-Range: 199 to 207F Typical Viscosity @ 350F: 1,800 cps Temperature Resistance: -20 to 16iF Operating Temperature: 320 to 360F Max Open Time: 5 sec. General purpose packaging. Economical. Use for case and carton sealing. Rope Form Hot Melts: 1101: Amber
Form: l/4 in. Profile Odor: None Softening Range: 233 to 262F Typical Viscosity @ 400F: 96,000 cps Temperature Resistance: -50 to 200F Operating Temperature: 375 to 450F Max Open Time: 7 sec. High performance adhesion. Excellent plasticizer resistance. Excellent resistance to solvents heat and cold. 1165: Cream Form: l/4 in. Profile Odor: None Softening Range: 304 to 320F Typical Viscosity @ 400F: 61,000 cps Temperature Resistance: -50 to 250F Operating Temperature: 400 to 475F Max Open Time: 2 sec. Exceptional plasticizer resistance. Excellent heat resistance. Provides excellent bond on vinyls and woven or non-woven fabrics.
Adhesives-General
BOSTIK: Hot Melt Adhesives: Rope Form Hot Melts: 1252: Light Amber Form: l/4 in. Profile Odor: None Softening Range: 251-272F Typical Viscosity @ 400F: 2,200 cps Temperature Resistance: -20 to 250F Operating Temperature: 350 to 425F Max Open Time: 10 sec. High heat resistance. Low operating viscosity. Bonds many porous substrates. 1315: Light Amber Form: l/4 in. Profile Odor: None Softeninq Ranqe: 225 to 235F Typical Viscosity 8 400F: 17,000 cps Temperature Resistance: -50 to 170F Operating Temperature: 325 to 475F Max Open Time: 6 sec. General purpose adhesion. Bonds many packaging materials. Meets FDA regulations for food packaging 21 CFR 375-105. 1323: Off White Form: l/4 in. Profile Odor: None Softeninq Ranqe: 225 to 240F Typical Viscosity 8 400 F: 32,000 cps Temperature Resistance: -50 to 170F Operating Temperature: 400 to 450F Max Open Time: 3 sec. Good heat and cold resistance. General packaging and paper bonding. 1372: Light Amber Form: l/4 in. Profile Odor: None Softening Range: 186 to 192F Typical Viscosity 8 400F: 2,000 cps Temperature Resistance: -20 to 160F Operating Temperature: 325 to 375F Max Onen Time: 5 sec. Designed for carton closing applications. Meets FDA regulations for food packaging 21 CFR 375-105. Good heat and cold resistance.
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Adhesives, Sealants and Coatings for the Electronics Industry
BOSTIK: Hot Melt Adhesives & Applicators: Glue Guns: BOSTIK's TG-3 and TG-4 glue guns offer the industrial user ease and reliability in packaging, product assembly, potting, electronic and other industrial applications. The TG-4 is a rugged industrial glue gun that delivers more than 4 oounds of adhesive an hour. It offers electric solid state design, and five interchangeable nozzles. Designed for smaller jobs, the TG-3 delivers 1.4 pounds of adhesive an hour. Both are light weight for easy one-hand operation. Hot Melt Glue Cartridges--l" diameter: 2240 Amber: Typical Viscosity @ 375F/@ 450F: 1600 to 6750 cps Maximum Open Time: 30 sec. Temperature Resistance: OF to 300F High heat resistance. Good flow properties. Good electrical properties. 2370 Clear: Typical Viscosity @ 375F/@ 450F: 9000 to 1850 cps Maximum Open Time: 30 sec. Temperature Resistance: -4OF to 160F High performance. Good shock resistance. Good all-purpose adhesion in a clear product. 2385 Amber: Typical Viscosity @ 375F/@ 450F: 5400 to 2800 cps Maximum Open Time: 50 sec. Temperature Resistance: -2OF to 150F General purpose bonding of paper, wood, cardboard, foam and fabrics. 2391 Tan: Typical Viscosity @ 375F/@ 450F: 1450 to 525 cps Maximum Open Time: 40 sec. Temperature Resistance: -2OF to 160F Verastile packeging product. Good "hot tack." FDA listed 21 CFR 175-105.
Adhesives-General
BOSTIK: Hot Melt Adhesives & Applicators(Continued): Hot Melt Glue Sticks--&" diameter: 6160 White: Form: 4 in. Typical @ 400F: 25,000 cps Maximum Open Time: 30 sec. Temperature Resistance: -2OF to 175F Excellent plasticizer resistance. God vinyl adhesion. Very flexible bond. Amber: Form: 12 in. Typical @ 400F: 6,500 cps Maximum Open Time: 30 sec. Temperature Resistance: -OF to 300F High heat resistance. Good flow properties. Good electrical properties. 6240
Straw: Form: 4 in.115 in. Typical @ 400F: 6,000 cps Maximum Open Time: 50 sec. Temperature Resistance: -2OF to 140F Long open time. Good adhesion to metal and plastics. High performance. 6323
Clear: Form: 4 in. Typical @ 400F: 12,000 cps Maximum Open Time: 60 sec. Temperature Resistance: -4OF to 140F High performance, versatile adhesion. Good bonds on metals and polyolefins. Very flexible, long open time. 6330
Off White: Form: 4in.115 in. Typical @ 400F: 10,000 cps Maximum Open Time: 40 sec. Temperature Resistance: -2OF to 125F Good general purpose characteristics. materials. FDA listed 21 CFR 175-105. 6363
Bonds a broad range of
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Adhesives, Sealants and Coatingsfor the Electronics Industry
BOSTIK: Hot Melt Adhesives & Applicators(Continued): Hot Melt Glue Sticks--&" diameter: 6368 Light Amber: Form: 4 in.115 in. Typical @ 400F: 17,000 cps Maximum Open Time: 6 sec. Temperature Resistance: -5OF to 170F Designed for packaging. Good temperature resistance. Fast setting. 6370 Clear: Form: 4 in. 10 in. 15 in. Typical @ 400F: 6,000 cps Maximum Open Time: 60 sec. Temperature Resistance: -4OF to 140F Very flexible. Bonds wide range of floral, craft, and upholstery materials. Economical. 6377 White: Form: 4 in. Typical @ 400F: 5,750 cps Maximum Open Time: 60 sec. Temperature Resistance: -4OF to 140F Adhesive caulk sealer. Flexible with long open time. Bonds broad range of materials. 6384N Translucent: Form: 4 in./15 in. Typical @ 400F: 8,500 cps Maximum Open Time: 40 sec. Temperature Resistance: -2OF to 125F General purpose characteristics. Bonds plastics, wood, porous materials. Economical. 6390 Light Straw: Form: 4 in.110 in.115 in. Typical @ 400F: 9,000 cps Maximum Open Time: 40 sec. Temperature Resistance: -4OF to 160F Good heat resistance. Bonds plastics, wood, porous materia .s. Economical, general-purpose adhesion.
Adhesives-General
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications: CASTALL E-100: CASTALL E-100 is an unmodified epoxy resin which has high strength and is transparent material that adheres well to metals, ceramics, plastics, glass and acrylics. CASTALL E-110 A&B: CASTALL E-110 A&B is an excellent epoxy for use as a high temperature staking compound bonding to glass, plastic, stainless steel and titanium. CASTALL E-310 A&B: CASTALL E-310 A&B is an excellent thermally conductive epoxy adhesive for bonding metals, plastics, glass, masonry and wood. CASTALL E-341: CASTALL E-341 is an excellent thermally conductive epoxy adhesive for thin glue line applications to most substrates. CASTALL E-403 and CASTALL E-409: CASTALL E-403 and E-409 are excellent general purpose epoxy adhesives with good adhesion to metals, ceramics and plastics. CASTALL E-500 and E-505: CASTALL E-500 is a filled epoxy where high peel, shock and vibration resistance are needed. By varying the amount of hardener RT-10 used, you can vary the rigidity, peel strength, heat resistance, and thermal shock resistance. E-505 is an unfilled version of E-500. CASTALL E-523 A&B and E-523LV: CASTALL E-523 A&B is a filled two component, room temperature curing structural epoxy adhesive and E-523LV is a low viscosity version of E-523. Exhibiting exceptional adhesion to many substrates. CASTALL E-1520: CASTALL E-1520 is a thixotropic epoxy paste that is thermally conductive with good adhesion to a variety of substrates. Its prime use is to form bonds between fabricated heat sinks and power devices.
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Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): CASTALL QUICK CURE: CASTALL's QUICK CURE is a general epoxy adhesive where a very fast cure of approximately five minutes is required. CASTALL U-2630 R&I Series: CASTALL U-2630, U-2633 and U-2634 are a series of two part, solvent free urethane laminating adhesives and coatings. The laminating adhesives are used in plastic laminating. The coatings are used on plastics, fabrics, etc. CASTALL U-2710 and U-2720: CASTALL U-2710 and U-2720 are one-part, solvent based urethane adhesives. They provide excellent adhesion in bonding composition stocks to a variety of materials. Reactivation temperaatures as low as 130F consistently provide high quality bonds. U-2720 is an excellent general adhesive for difficult to bona substrates, such as PVC, rubber, nylon, polycarbonate, ABS, etc. CASTALL U-2730: CASTALL U-2730 is a one-part laminating adhesive with high initial green strength. Used to bona fabric to neoprene sponge, PVC to urethane, etc. E-100: Color: Amber Mix Ratio Resin/Hardener (ubw): 100/14 Specific Gravity @ 25C: 1;:s Viscosity @ 25C, cps: 12000 Shore Ha&ness: D89 Pot Life 50 gm @ 25C hrs.: 3/4 Cure Time Hrs. @ 25C, 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 11000 Lap Shear Al/Al: 1700 Compressive Strength @ 25C, psi: 18000 Linear Shrinkage in/in: 0.010 Thermal Conductivity: 5.1 (1.5) Dielectric Constant @ 25C/lOOkc: 4.2 Dielectric Strength volts/mil: 450 Dissipation Factor @ 25C/lOOkc: 0.035 Volume Resistivity @ 25C/ohm-cm: 10 15
Adhesives-General
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-110 A&B: Color: Amber Mix Ratio Resin/Hardener (pbw): 100/3.5 Specific Gravity @ 25C: 1.16 Viscositv B 25C. ens: Paste Shore Hardness:.D88 Pot Life 50gm @ 25C hrs.: 12 Cure Time Hrs. @ 25C, 65C, IOOC: ----/----12 Tensile Strength @ 25C, psi: 12800 Lap Shear Al/Al: 1200 Compressive Strength @ 25C, psi: 19300 Linear Shrinkage in/in: 0.010 Thermal Conductivity: 5.1 (1.5) Dielectric Constant @ 25C/lOOkc: 4.2 Dielectric Strensth volts/mil: 450 Dissipation Factor @ 25C/lOOkc: 0.035 Volume Resistivity @ ZSC/ohm-cm: 10 15 E-310 A&B: Color: Black Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity 8 25C: 1.60 Viscositv a 25C. cos: Paste Shore Hardness:'D75 Pot Life 50gm @ 25C hrs.: 2 Cure Time Hrs. B 25C. 65C. 1OOC: 16/l/---Tensile Strength @ 25C, psi: 8300 Lap Shear Al/Al: 2200 Compressive Strength @ 25C, psi: 7400 Linear Shrinkage in/in: 0.004 Thermal Conductivity: 37 (10.7) Dielectric Constant @ 25C/lOOkc: 4.7 Dielectric Strencth volts/mil: 450 Dissipation Factor @ 25C/iOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 13 E-341: Color: Black Mix Ratio Resin/Hardener (pbw): 100/5.5 Snecific Gravitv @ 25C: 1.90 Viscosity @ 25C; cps: 13000 Shore Hardness: D88 Pot Life 50gm @ 25C hrs.: 2 Cure Time Hrs. 8 25C, 65C, IOOC: l2-24/2/---Tensile Strength @ 25C, psi: 8340 Lap Shear Al/Al: 2100 Comoressive Strencth @ 25C. osi: 24500 Linear Shrinkage in/in: 0.803 Thermal Conductivity: 26 (7.7) Dielectric Constant-s 25C/lOOkc: 5.7 Dielectric Strength volts/mil: 500 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 16
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Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-403: Color: Black Mix Ratio Resin/Hardener (pbw): 100/7.0 Specific Gravity @ 25C: 1.55 Viscosity @ 25C; cps: 6000 Shore Hardness: D85 Pot Life 50gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C. 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, p&i: 7200 Lap Shear Al/Al: 2100 Compressive Strength @ 25C, psi: 16400 Linear Shrinkaue in/in: 0.004 Thermal Conductivity: 7.8 (2.3) Dielectric Constant @ 25C/lOOkc: 4.0 Dielectric Strength volts/mil: 450 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: IO 16 E-4092
Color: Grey Mix Ratio Resin/Hardener (pbw): 100/6.0 Specific Gravity @ 25C: 1.75 Viscositv a 25C. CDS: 50000 Shore Hardness:.D9i Pot Life 50gm @ 25C hrs.: 1 Cure Time Hrs. @ 25C. 65C. IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 8430 Lap Shear Al/Al: 1500 Comeressive Strensth @ 25C. nsi: 28400 Linear Shrinkage in/in: O.bO2 Thermal Conductivity: 8.5 (2.5) Dielectric Constant-@ 25C/lOOkc: 3.8 Dielectric Strength volts/mil: 425 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: IO 15 E-500/RT-10: Coior: Black Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity @ 25C: 1.35 Viscosity @ 25C, cps: 175000 Shore Hardness: D63 Pot Life 50gm @ 25C hrs.: l-3 Cure Time Hrs. @ 25C, 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 8000 Lap Shear Al/Al: 3100 Compressive Strength @ 25C, psi: 12000 Linear Shrinkage in/in: 0.002 Thermal Conductivity: 8.0 (2.3) Dielectric Constant (a 25C/lOOkc: 4.1 Dielectric Strength volts)mil: 450 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: IO 13
Adhesives-General
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-505/RT-10: Color: Amber Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity @ 25C: 1.05 Viscosity @ 25C; cps: 12000 Shore Hardness: D85 Pot Life 50gm @ 25C hrs.: l-3 Cure Time Hrs. @ 25C, 65C, 1OOC: 12-48/2/---Tensile Strength @ 25C, psi: 9000 Lap Shear Al/Al: 2400 Compressive Strength @ 25C, psi: 11000 Linear Shrinkaae in/in: 0.002 Thermal Conductivity: 5.1 (1.5) Dielectric Constant @ 25C/lOOkc: 3.2 Dielectric Strenath volts/mil: 450 Dissipation Factor @ 25C/iOOkc: 0.015 Volume Resistivity @ 25C/ohm-cm: 10 12 E-523 A&B: Color: Grey Mix Ratio Resin/Hardener (pbw): 150/100 Specific Gravity @ 25C: 1.24 Viscositv a 25C. CDS: 19000 Shore Hardness:'D75 Pot Life 50 gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C, 65C, 1OOC: 48/2-4/l-3 Tensile Strength @ 25C, psi: 8500 Lap Shear Al/Al: 1700 Comnressive Strenath @ 25C. usi: 17000 Linear Shrinkage in/in: O.oOi Thermal Conductivity: 5.1 (1.5) Dielectric Constant@ 25C/lOOkc: 3.5 Dielectric Strength volts/mil: 400 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 12 E-523LV A&B: Color: Grey Mix Ratio Resin/Hardener (pbw): 150/100 Specific Gravity @ 25C: 1.22 Viscosity @ 25C, cps: 10000 Shore Hardness: D75 Pot Life 50gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C, 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 8500 Lap Shear Al/Al: 1700 Compressive Strength @ 25C, psi: 17000 Linear Shrinkage in/in: 0.001 Thermal Conductivity: 5.1 (1.5) Dielectric Constant a 25C/lOOkc: 3.5 Dielectric Strength voltsjmil: 400 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 12
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Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-1520: Color: Black Mix Ratio Resin/Hardener (pbw): 100/3.4 Specific Gravity @ 25C: 2.35 Viscositv B 25C. cos: Paste Shore Hardness:.D93 Pot Life 50gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C, 65C, 1OOC: 12-24/2/---Tensile Strength @ 25C, psi: 10500 Lap Shear Al/Al: 2200 Compressive Strength @ 25C, psi: 29400 Linear Shrinkage in/in: 0.002 Thermal Conductivity: 33 (9.7) Dielectric Constant 8 25C/lOOkc: 6.1 Dielectric Strenath volts/mil: 500 Dissipation Factor @ 25C/jOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 16 QUICK CURE: Color: Yellow Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity @ 25C: 1.18 Viscositv a 25C. CDS: 17000 Shore Ha;dness:.DB?l Pot Life 50qm @ 25C hrs.: .05 Cure Time Hrs. a 25C. 65C. 1OOC: 2-4/----/---Tensile Strength @ 25C, psi: 3800 Lap Shear Al/Al: 900 Comnressive Strenath @ 25C. osi: 7000 Linear Shrinkage in/in: 0.606 Thermal Conductivity: 5.0 (1.5) Dielectric Constant @ 25C/lOOkc: 4.3 Dielectric Strength volts/mil: 350 Dissipation Factor 8 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 10 U-2360 R&I: Color: Tan Mix Ratio Resin/Hardener (pbw): 57/10 Soecific Gravitv @ 25C: 1.20 Viscosity @ 25C; cps: 13500 Shore Hardness: A55 Pot Life 5Ogm 8 25C hrs.: l/3 Cure Time Hrs. 8 25C, 65C, 1OOC: 4/l/---Tensile Strength 8 25C, psi: 2060 Lap Shear Al/Al: P17 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: 0.013 Thermal Conductivity: 1.8 (7.5) Dielectric Constant a 25C/lOOkc: 3.6 Dielectric Strength voltsjmil: 420 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 12
Adhesives-General
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): U-2633 R&I: Color: Tan Mix Ratio Resin/Hardener (pbw): 14/10 Specific Gravity @ 25C: 1.20 Viscosity @ 25C: cps: 12000 Shore Hardness: A80 Pot Life 50gm @ 25C hrs.: l/4 Cure Time Hrs. @ 25C. 65C. 1OOC: 4/1/---Tensile Strenath @ 25C. &i: 2170 Lap Shear Al/Al: 615 ’ _ Compressive Strength @ 2X, psi: N/A Linear Shrinkage in/in: 0.011 Thermal Conductivity: 1.8 (7.5) Dielectric Constant @ 25C/lOOkc: 4.1 Dielectric Strength volts/mil: 425 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 13 U-2634 R&I: Color: Tan Mix Ratio Resin/Hardener (pbw): 23/10 Specific Gravity @ 25C: 1.16 Viscosity @ 25C; cps: 12000 Shore Hardness: A85 Pot Life 5Ogm @ 25C hrs.: l/4 Cure Time Hrs. @ 25C, 65C, IOOC: 2/0.5/Tensile Strength @ 25C, psi: 6100 Lap Shear Al/Al: PI5 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: 0.013 Thermal Conductivity: 1.8 (7.5) Dielectric Constant @ 25C/lOOkc: 4.2 Dielectric Strenath volts/mil: 420 Dissipation Factror @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 13 U-2710: Color: Clear Mix Ratio: One part Specific Gravity @ 25C: 0.89 Viscositv B 25C; CDS: 3500 Shore Ha;&ess:.A8$ Pot Life 5Ogm @ 25C hrs.: N/A Cure Time H;s. @ 25C, 65C, 1OOC: 5 min. Tensile Strength @ 25C, psi: 5000 Lap Shear Al/Al: P15 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: N/A Thermal Conductivity: 1.7 (7.4) Dielectric Constant @ 25C/lOOkc: 5.5 Dielectric Strength volts/mil: 390 Dissipation Factor @ 25C/lOOkc: 0.04 Volume Resistivity @ 25C/ohm-cm: 10 13
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22
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): U-2720: Color: Clear Mix Ratio Resin/Hardener (pbw): One-part Specific Gravity @ 25C: 0.90 Viscosity @ 25C; cps: 2500 Shore Hardness: A85 Pot Life 50gm @ 25C hrs.: N/A Cure Time Hrs. @ 25C, 65C, 1OOC: 8 min. Tensile Strength @ 25C, psi: 5200 Lap Shear Al/Al: P18 Compressive Strength @ 25C, psi: N/A Linear Shrinkaae in/in: N/A Thermal Conductivity: 1.7.(7.4) Dielectric Constant @ 25C/lOOkc: 5.5 Dielectric Strength volts/mil: 390 Dissipation Factor @ 25C/lOOkc: 0.04 Volume Resistivity @ 25C/ohm-cm: 10 13 U-2730: Color: Amber Mix Ratio Resin/Hardener (pbw): One-part Specific Gravity @ 25C: 0.94 Viscosity @ 25C, cps: 8000 Shore Hardness: A80 Pot Life 50gm @ 25C hrs.: N/A Cure Time Hrs. @ 25C, 65C, 1OOC: 5 min. Tensile Strength @ 25C, psi: 5000 Lap Shear Al/Al: P12 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: N/A Thermal Conductivitv: 1.7 (7.4) Dielectric Constant-@ 25C/iOOkc: 5.5 Dielectric Strength volts/mil: 425 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 13
Adhesives-General
CASTALL, INC.: CASTALL LClOOO Light Cure Series: * Low medium and high viscosity one-part clear Shore D 85 compounds * Cure in seconds * Excellent electrical insulators Part of a series of visible light curing single part sealants, conformal coatings, wire tacking agents, and potting compounds. Typical Properties: Uncured: LClOOl: Viscosity - cps: 1000 Color: transparent Specific Gravity: 1.15 Lc1003: Viscosity - cps: 3000 Color: transparent Specific Gravity: 1.15 Lclolo: Viscosity - cps: 10,000 Color: transparent Specific Gravity: 1.15 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/0" thickness: lo-25 sec. Physical Properties: Shore D Hardness: 85 Dielectric Strength - v/mil: 790 Volume Resistivity -25C-ohm/cm: 10 13 Temperature Range: -60C to 125C t-761" to 257F)
23
24
Adhesives, Sealants and Coatings for the Electronics Zndzuty
CASTALL, INC.: CASTALL LC2000-T Light Cure Series: * High viscosity thixotropic one-part clear Shore D85 compounds * Cure in seconds * Excellent electrical insulators * Viscosities vary from pourable to non-sag A series of thixotropic visible light curing single part sealants, conformal coatings, wire tacking agents, and potting compounds. Typical Properties: Uncured: LC2009-T: Viscosity - cps @ 25C: 9300 Color: Amber Specific Gravity: 1.15 Thixotropic Index Range to LC2100-T: Viscosity - cps @ 25C: 100,000 Specific Gravity: 1.18 Thixotropic Index Range: 4.9 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: Shore D Hardness: 85 Dielectric Strength - v/mil: 790 Volume Resistivity - 25C -ohm/cm: 10 13 Use Temperature Range: -60 to 125C (-76 to 257F)
Adhesives-General
CASTALL,
INC.:
CASTALL
LC3000
25
Light Cure Series:
* Soft to hard one-part clear elastomer and adhesive compounds * Cure in seconds * Excellent adhesion and low shrinkage Part of a series of visible light curing single part sealants, gasketing conformal coatings, wire tacking agents, and potting compounds. Products with the suffix "H" are dual cure - visible light or heat - 15 minutes at 225F. Typical Properties: Uncured: Lc3010: Viscosity - cps @ 25C: 64,000 Color: amber Specific Gravity: 1.08 Lc3040: viscosity - cps @ 25C: 47,000 Color: amber Specific Gravity: 1.08 LC3060: Viscosity - cps @ 25C: 9,000 Color: amber Specific Gravity: 1.12 LC3065: Viscosity - cps @ 25C: 600 Color: amber Specific Gravity: 1.10 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: LC3010: Shore A Hardness: 30 Linear Shrinkage %: 0.2 Lc3040: Shore A Hardness: 50 Dielectric Strength - v/mil: 650 Volume Resistivity - 25C - ohm/cm: 10 i3 Use Temperature Range: -60 to 125C (-76F to 257F) Linear Shrinkage %: 0.9 LC3060: Shore A Hardness: 90 Linear Shrinkage %: 0.04 LC3065: Shore A Hardness: 90 Linear Shrinkage %: 0.04
26
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: CASTALL ~~3000 Light Cure Series (Continued): Typical Properties: Uncured: LC-3068: Viscosity - cps @ 25C: 300 Color: amber Specific Gravity: 1.08 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Phvsical Prooerties: *Shore A Hardness: 95 Dielectric Strength - v/mil: 650 Volume Resistivitv - 25C -ohm/cm: 10 13 Use Temperature Range: -60C to 125C (-76F to 257F) Linear Shrinkage %: .034 LC-3072: Uncured: Viscosity - cos @ 25C: 150 Color: amber Specific Gravity: 1.05 Physical Properties: Shore A Hardness: 98 Linear Shrinkage %: .055
Adhesives-General
CASTALL, INC.: CASTALL LC-3080 Light Cure Series: * Hard one-part clear elastomer and adhesive. * Cures in seconds. * Excellent adhesion and low shrinkage. Part of a series of visible light curing single part sealants, gasketing conformal coatings, wire tacking agents, and potting compounds. Products with the suffix "H" are dual cure - visible light or heat - 15 minutes at 225F. Typical Properties: Cured: LC3080: Viscosity - cps @ 25c: 47,000 Color: amber Specific Gravity: 1.08 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: Shore A Hardness: 50 Dielectric Strength - v/mil: 650 Volume Resistivity - 25C - ohm/cm: 10 13 Use Temperature Range: -60C to 125C (-76F to 257F) Linear Shrinkage %: 0.9 Typical Properties: Uncured: LC-3068: Viscosity - cps @ 25C: 300 Color: amber Specific Gravity: 1.08 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: Shore A Hardness: 95 Dielectric Strength - v/mil: 650 Volume Resistivity - 25C - ohm/cm: 10 13 Use Temperature Range: -60C to 125C (-76F to 257F) Linear Shrinkage %: 0.34 LC-3072: Viscosity - cps @ 25C: 150 Color: amber Specific Gravity: 1.05 Physical Properties: Shore A Hardness: 98 Linear Shrinkage %: 0.55
27
28
Adhesives, Sealants and Coatingsfor the Electronics Industry
DYMAX CORP: DYMAX Engineering Adhesives: Product 400 Gel: LIGHT-WELD W Curing Adhesives for Use with Clear Plastic: LIGHT-WELD product 488 Gel is a structural adhesive designed for high speed assembly of transparent film and sheet materials where structural strength is required. This product cures when exposed to UV light, in the 300-400 nanometer range. LIGHT-WELD 488 Gel is designed as a general purpose, laminating adhesive and for bonding, potting and tacking to difficult to bond plastics. Product 488 Gel is extremely flexible with a high degree of moisture resistance. It bonds to surfaces such as DAP, Noryl, glass, epoxy board, metal and Mylar. Uncured Properties: Composition: Urethane oligomer/(Meth)acrylate monomer blends Viscosity: 24000-29000 cps Color: Hazy Flash Point: >200F (93.3C) Solubility: Isopropyl alcohol, chlorinated solvents Toxicity: Low Cured Properties: Max Cured Film Thickness: l/4" Shore D Hardness: 25 Tensile (cured film at break): 500 psi Elongation: 300 Shrinkage on Cure: 5.8% Water Absorption: .l% Cure Data: Time to Full Cure: Bonding: (4 set Tacking: (60 set Potting: (60 set Coating: (10 set Lamp Intensity: Bonding: 20-45 milliwatts/cm 2 Tackins: 130-170 milliwatts/cm 2 Potting: 20-45 milliwatts/cm 2 Coating: 120-150 milliwatts/cm 2 Factors Affecting Curing: Dark surfaces lengthen cure time. Full range (UV-A, B & C) lamps provide faster cures than filtered sources. All UV sources degrade with use. Check output with a radiometer. Thicker films require longer cures. Light intensity decreases as distance from UV source increases. Some clear plastics may contain UV inhibitors.
Adhesives4eneral
DYMAX CORP.: DYMAX Engineering Adhesives: Products 911 and 912: MULTI-CURE Adhesives and LIGHT-WELD: The 900 Series UV curing adhesives have been formulated to cure rapidly under longwave (UV-A, 320 to 380 nanometers) UV light at intensities under 20 milliwatts/cm 2. Specifically, these products have been designed for wire tacking on printed circuit boards. Materials can also be used for a wide variety of strain relief and wire unit applications. These products withstand thermal shock from solder while resisting brief solvent and aqueous washes. MULTI-CURE 911: MULTI-CURE 911 is specifically designed to provide rapid, structural wire tacking of PCBs. Product 911 is a non-migrating gel. Cure occurs with W light or in combination with heat. MULTI-CURE 911 has excellent adhesion to a wide variety of surfaces. LIGHT-WELD 912: LIGHT-WELD 912 has been formulated to cure rapidly under long wave UV light. Product 912 is designed for wire-tacks on PCBS and withstands thermal shock from solder while resisting most solvent and aqueous washes. Uncured Properties: 911 and 912: Composition: Urethane oligomer/(Meth)acrylate monomer blends Viscosity Standard: Won-flowing thixotropic paste Color: Light straw Flash Point: >200F (93.3C) Solubility: Isopropyl alcohol, chlorinated solvents Toxicity: Low Cured Properties: 911: Max Cured Film Thickness: l/0" Thermal Range: -40/300F Shore D Hardness: 65-70 Dielectric Strength kv/mm: 800 Surface Resistivity (IO 13 Ohm): .301 Linear Coefficient of Expansion (mm/mm/CxlO -4): 1.41 Resistance to Freon TMS: (% strength retention): 100% 912: Max Cured Film Thickness: >1/8" Thermal Range: -65/350F Shore D Hardness: 80 Tensile Strength: glass to steel: 2,500 psi Dielectric Strength kv/mm: ,500 Surface Resistivity (IO 13 Ohm): .077 Linear Coefficient of Expansion (mm/mm/CxlO -4): 1.53 Resistance to Freon TMS: (% strength retention): 75%
29
30
Adhesives, Sealants and Coatings for the Electronics Zndusfry
DYMAX
CORP.:
DYMAX
MULTI-CURE
Surface Mount Adhesive 995:
MULTI-CURE 995 is a single component, solvent-free, electrical grade, urethane acrylic adhesive that has insulating characteristics. Because DYMAX adhesives are resilient, there is no need to carefullv match thermal expansion coefficients with the SMD and the circuit board materials. MULTI-CURE 995 is a non-stringing thixotropic paste with a high thixotropic ratio for easy dispensing in narrow peaks using needle-tip applicators, screening or pin transfers. There is no outflow at elevated temperatures. The SMD can be easily removed without damaging PWAs. (Use of standard hot air SMD board repair machines at 425F for several seconds and removing with tweezers is a typical procedure.) MULTI-CURE 995 can be cured several different ways: 1. Heat only 2. W light only 3. UV light followed by heat 4. Simultaneous UV light and heat Physical Properties: Resin type: Modified Urethane Consistency: Thixotropic paste Color: Red Viscosity: 65,000-85,000 cps Curing Options: Heat cure (following pre-heat cycle): 12oc:
UV Light Cure (long wave): High Intensity: 5-10 sec. Low Intensity: 15 sec. Typical Data: Tensile Shear Strength: ASTM D-1002 (steel or aluminum): 3.000 osi . . SMDs: >lO lbs Dielectric Strength (kv/mm): 63 Dielectric Constant (at 1MHz): 3.63 Dissipation Factor (at 1MHr)i .04 Volume Resistivity (ohm cm): 7.85 x 10 13 Surface Resistivity (ohm cm): 2.3 x 10 14 Coefficient of Thermal Expansion: 9x10 5 Repairability: Excellent Storage Recommended: Below 50F Glass Transition Temp. (Tg): 52C Tensile Modulus: 1.48 x 10 5 psi Thermal Conductivity: .I28 (W/mK)
Adhesives-General
31
FLEEBAR MACHINE CORP.: AUTOCRETE Hi-Temp Ceramic Adhesive: * * * * * * * *
It's easy to use and it's sodium free! Superior electrical insulation properties. Self-Curing Ceramic Adhesive, Coating and Filler. Conducts heat. (High heat conductivity) Resists thermal shock and ultra-high temperatures. High temperature strength and stability. Provides optimum dielectric strength, is moldable. Finer, more uniform particle size distribution.
For Use In: Lamps, appliances, heaters, furnaces, resistors, and elements. AUTOCRETE is a white, odorless powder that, when mixed with water, delivers outstanding bonding characteristics ideally suited to applications that demand superior electrical insulation properties. Physical Properties: Color: White Screen Analysis: 90% (325 Mesh Coefficient of Thermal Expansion: 5.6 x 10 -6 in/in/F Compression Strength: 5000 psi +- 500 psi Thermal Conductivity: 10 BTU/ft 2/hr/F/in Maximum Service Temperature: 3000F Volume Resistivity: @ 70F: 10 11 ohm-cm @ 750F: 10 10 ohm-cm @ 1475F: 10 9 ohm-cm Dielectric Strength: a 70F (21C): 77 to 103.5 volts/mil @ 750F‘(306C): 24 to 39.5 volts/mil @ 1475F (8OOC): 13.5 to 24 volts/mil Chemical Resistance: Does not exhibit resistance to acids or alkalies. Very oil resistant. Tensile Strength: 900 psi
32
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: Electronic Grade Adhesives: Surface Mounting: EPIBOND 7077: Color/Filler Type: silver Application Method: Syringe dispense, screen print Specific Gravity (system): 3.0 System Viscosity (x 1000 cps): 100 Pot Life @ 25C (hours): ,300 Gel Time (minutes/C): 3/150 2/215 Cure Schedule (minutes/C): 60/125 or 4/215 Lap Shear Strength at 25C (Al/Al) (psi): 2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conduuctivity: 40 x 10 -4 Tg (C): 75 CTE (in/in/C): Alpha 1: 59x10 -6 Alpha 2: 168x10 -6 Volume Resistivity 25C (ohm-cm): 0.003 Shelf Life (months/C): 6/O Flash Point (C): ,120 EPIBOND 7251 Blue: Color/Filler Type: blue Application Method: syringe dispense/screen print Specific Gravity (system): 2.5 System Viscosity (x 1000 cps): 100 Pot Life at 25C (hours): ,300 Gel Time (minutes/C): 3/150 Cure Schedule (minutes/C): 60/125 or 41215 Lap Shear Strength at 25C (Al/Al) (psi): 2500 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 18x10 -4 Tg (C): 84 CTE (in/in/C): Alpha 1: 40x10 -6 Alpha 2: 120x10 -6 Volume Resistivity 25C: (ohm-cm): >lxlO 15 Shelf Life (months/C): 6/O Flash Point (C): >I20
Adhesives-General
FURANE PRODUCTS: Electronic Grade Adhesives (Continued): Surface Mounting
(Continued):
EPIBOND 7251-200 Blue: Color/Filler Type: blue Application Method: syringe dispense/screen print Specific Gravity (system): 2.1 System Viscositv (x 1000 CDS): 200 Pot Life at 25C-(hours): ,300 Gel Time (minutes/C): 3/150 Cure Schedule (minutes/C): 60/125 or 4/215 Lap Shear Strength at 25C (Al/Al) (psi): 2500 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivitv: 18x10 -4 Tg (C): 84 CTE (in/in/C): Alpha 1: 35x10 -6 Alnha 2: 140x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 15 Shelf Life (months/C): 6/O Flash Point (C): >I20 EPIBOND 7261: Color/Filler Type: yellow Application Method: pin transfer/stamping Specific Gravity (system): 1.55 System Viscosity (x 1000 cps): 130 Pot Life at 25C (hours): ,168 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/Cl: 15/80 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Ts (C): 60 CTE.(in/in/C): Alpha 1: 50x10 -6 Alpha 2: 145x10 -6 Volume Resistivity 25C (ohm/cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120
33
34
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: Electronic Grade Adhesives Surface Mounting
(Cont
(Continued):
EPIBOND 7262: Color/Filler Type: yellow Application Method: syringe dispense/screen pr Specific Gravity (system): 1.95 System Viscosity (x 1000 cps): 100 Pot Life at 25C (hours): ,168 Gel Time (minutes/C): 5/80 Cure schedule (minutes/C): 15180 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 16x10 -4 Tg (C): 73 CTE (in/in/C): Alpha 1: 41x10 -6 Alpha 2: 131x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120 EPIBOND 7263: Color/Filler Type: black Application Method: pin transfer/stamping Specific Gravity (system): 1.42 System Viscosity (x 1000 cps): 34-48 Pot Life at 25C (hours): >168 Gel Time (minutes/C): lo/80 Cure schedule (minutes/C): 30/80 or 3/120 Lap Shear Strength at 25C (Al/Al) (psi): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Tg (C): 95 CTE (in/in/C): Alpha 1: 50x10 -6 Aluha 2: 147x10 -6 Volume Resistivit; 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >I20
Adhesives-General
FURANE PRODUCTS: Electronic Grade Adhesives Surface Mounting
(Continued):
(Continued):
EPIBOND 7272: Color/Filler Type: red Application Method: syringe dispense/screen print Specific Gravity (system): 2.02 System Viscosity (x 1000 cps): 110 Pot Life at 25C (hours): ,168 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 2% (Al/Al) (psi): ~2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Tg (C): 76 CTE (in/in/C): Alpha 1: 44x10 -6 Alpha 2: 155x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >I20 Thermal Transfer/Component
Protection:
URALANE 7760: Color/Filler Tvve: off-white Application Method: syringe dispense/screen print Specific Gravity (system): 2.06 System Viscosity (x-1000 cps): 500 Pot Life at 25C (hours): 3 Gel Time (minutes/C): 5/100 Cure Schedule (minutes/C): 60/100 Lap Shear Strength at 25C (Al/Al) (psi): 200 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 16.5x10 -4 Tg (C): -63 CTE (in/in/C): Alpha 1: 29x10 -6 Alpha 2: 88x10 -6 Volume Resistivity 25C (ohm-cm): 2.9x10 14 Shelf Life (months/C): 31-40 Flash Point (C): >93
35
36
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE
PRODUCTS:
Electronic Grade Adhesives
Thermal Transfer/Component
Protection
(Continued):
(Continued):
URALANE 7762: Color/Filler Type: pink Application Method: syringe dispense Specific Gravity (system): 2.0 System Viscosity (x 1000 cps): 190 Pot Life at 25C (hours): 3 Gel Time (minutes/C): 5/100 Cure Schedule (minutes/C): 30/100 Lap Shear Strength at 25C (~l/~l) (psi): 200 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 16.5x10 -4 Tg (C): -63 CTE (in/in/C): Alpha 1: 29x10 -6 Alwha 2: 88x10 -6 Volume Resistivity 25C (ohm-cm): 2.9x10 14 Shelf Life (months/C): 3/-40 Flash Point (C): >93 URALANE
7764:
Color/Filler Type: black Application Method: syringe dispense Specific Gravity (system): 2.0 System Viscosity (x 1000 cps): >2000 Pot Life at 25C (hours): 3 Gel Time (minutes/C): IO/l00 Cure Schedule (minutes/C): 60/100 Lap Shear Strength at 25C (Al/Al) (psi): >300 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 16.5x10 -4 Tg (C): -66 CTE (in/in/C): Alpha 1: 38x10 -6 Alpha 2: 245x10 -6 Volume Resistivity 25C (ohm-cm): 1x10 14 Shelf Life (months/C): 3/-40 Flash Point (C): >93
AdhesivesGeneral
FURANE PRODUCTS: Electronic Grade Adhesives Thermal Transfer/Component
(Continued):
Protection:
URALANE 7765: Color/Filler Type: orange Application Method: syringe dispense Specific Gravity (system): 0.95 System Viscositv (x 1000 cus):
93 URALANE 7766: Color/Filler Type: off-white Application Method: syringe dispense/screen print Specific Gravity (system): 1.32 System Viscosity (x 1000 cps): 210 Pot Life at 25C (hours): 3 Gel Time (minutes/C): lo/100 Cure Schedule (minutes/C): 90/100 or 180/85 Lap Shear Strength at 25C (Al/Al) (psi): 125 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 12x10 -4 Tg (C): -74 CTE (in/in/C): Alpha 1: 45x10 -6 Alpha 2: 124x10 -6 Volume Resistivity 25C (ohm-cm): 1.1x10 15 Shelf Life (months/C): 3/-40 Flash Point (C): ,120
37
38
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: Electronic Grade Adhesives
(Continued):
General Purpose: EPIBOND 7000-A/B: Color/Filler Type: silver-gray Mix Ratio (pbw): 100:85 Specific Gravity (system): 3.0 System Viscosity (x 1000 cps): non-flow paste Pot Life at 25C (minutes): 40 Gel Time (minutes/C): lo/150 Cure Schedule (hours/C): 2165 Lap Shear Strength at 25C (Al/Al) (psi): 1200 Operating Temperature (C): Continuous: 125 Intermittent: 150 Thermal Conductivity: 32x10 -4 Tg (C): 80 CTE (in/in/C): Alpha 1: 56x10 -6 Aloha 2: 155x10 -6 Volume Resistivity 25C (ohm-cm): 0.003 Shelf Life (months/C): 12/25 Flash Point (C): ,120 EPIBOND 7001-A/B: Color/Filler Type: silver Application Method: 100:6 Specific Gravity (system): 3.1 SVStem
ViSCOSitV
(X
1000
CDS):
100
Pot Life at 25C-(minutes):'3;5 Gel Time (minutes/C): 30165 Cure Schedule (hours/C): 2/65 Lap Shear Strength at 25C (Al/Al) (psi): >I200 Operating Temperature (C): Continuous: 125 Intermittent: 150 Thermal Conductivity: 47x10 -4 Tg (C): 60 CTE (in/in/C): Alpha 1: 95x10 -6 Aloha 2: 259x10 -6 Volume Resistivit; 25C (ohm-cm): 0.003 Shelf Life (months/C): 6125 Flash Point (C): ,120
Adhesives-General
FURANE
PRODUCTS:
General Purpose
Electronic Grade Adhesives
(Continued):
(Continued):
EPIBOND 7100-A/B: Color/Filler Type: copper Mix Ratio (pbw): 95:5 Specific Gravity (system): 2.3 System Viscosity (x 1000 cps): non-flow paste Pot Life at 25C (hours): 1 Gel Time (minutes/C): 25/150 Cure Schedule (hours/C): 24/25+ l/65 Lap Shear Strength at 25C (Al/Al) (psi): 1100 Operating Temperature (C): Continuous: 125 Intermittent: 175 Thermal Conductivity: 40x10 -4 Tg (C): 93 CTE (in/in/C): Alpha 1: 39x10 -6 Alpha 2: 123x10 -6 Volume Resistivity 25C (ohm-cm): 0.001 Shelf Life (months/C): 12125 Flash Point (C): ,120 EPIBOND
7101-A/B:
Color/Filler Type: copper Mix Ratio (pbw): 100:53 Specific Gravity (system): 2.3 System Viscosity (x 1000 cps): smooth paste Pot life at 25C (hours): 3 Gel Time (minutes/C): 25/150 Cure Schedule (hours/C): 24/25+ l/65 Lap Shear Strength at 25C (Al/Al) (psi): 1200 Operating Temperature (C): Continuous: 125 Intermittent: 175 Thermal Conductivity: 40x10 -4 Tg (C): 42 CTE (in/in/C): Alpha 1: 47x10 -6 Alpha 2: 210x10 -6 Volume Resistivitv 25C (ohm-cm): 0.003 Shelf Life (months/C): i2/25 Flash Point (C): >I20
39
40
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE
PRODUCTS:
Electronic Grade Adhesives
(Continued):
General Purpose (Continued): EPIBOND 7103: Color/Filler Type: copper Snecific Gravitv (system): 4.3 System Viscosity (x-1000 cps): 90 Pot Life at 25C (hours): >96 Gel Time (minutes/C): lo/l50 Cure Schedule (hours/C): 2/150 or l/l 75 Lap Shear Strength at 25C (Al/Al) (psi): 1500 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 40x10 -4 Tg (C): 150 CTE (in/in/C): Alpha 1: 79x10 -6 Alpha 2: 271x10 -6 Volume Resistivity 25C (ohm-cm): (0.01 Shelf Life (months/C): 3/O Flash Point (C): >120
Adhesives-General
FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives: Syringe Dispense: EPIBOND 7262: Color/Filler Type: yellow Other Application Method: screen print Suecific Gravitv (svstem): 2.09 System Viscosity iA Cps): 100 Pot Life at 25C (hours): ,300 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 12x10 -4 Tg (C): 73 CTE (in/in/C): Alpha 1: 41x10 -6 Alpha 2: 131x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >I20 EPIBOND 7272: Color/Filler Type: red Other Anolication Method: screen orint Specific-Gravity (system): 2.09 . System Viscosity (x1000 cps): 100 Pot Life at 25C (hours): ,300 Gel Time (minutes/C): S/80 Cure Schedule (minutes/C): 15/80 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivitv: 12x10 -4 Tg (C): 76 CTE (in/in/C): Alpha 1: 44x10 -6 Alpha 2: 155x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120
41
42
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives (Continued): Syringe Dispense (Continued): EPIBOND 7077: (conductive solder replacement) Color/Filler Type: silver Other Application Methods: screen print Specific Gravity (system): 3.17 System Viscosity (x1000 cps): Soft Paste Pot Life at 25C (hours): >300 Gel Time (minutes/C): 3/150 21215 Cure Schedule (minutes/C): 5/160 Lap Shear Strength at 25C (Al/Al) (psi) (I hr/lZOC): 1000 Operating Tempetrature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 40x10 -4 Tg (C): 75 CTE (in/in/C): Alpha 1: 59x10 -6 Alpha 2: 168x10 -6 Volume Resistivity 25C (ohm-cm): 0.003 Shelf Life (months/C): 6/O Flash Point (C): >I20 Screen Printing and Dispense for High Stand-Off Components: EPIBOND 7262-200: Color/Filler Type: yellow Specific Gravity (system): 2.0 System Viscosity (x1000 cps): 200 Pot Life at 25C (hours): ,300 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi) (I hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 12x10 -4 Tg (C): 73 CTE (in/in/C): Alpha 1: 41x10 -6 Alpha 2: 131x10 -6 Volume Resistivitv 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120
Adhesives-General
FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives: Software Pin Transfer: EPIBOND 7263: Color/Filler Type: black Other Application Method: syringe dispense Specific Gravity (system): 7.40 System Viscosity (x1000 cps): 42 Pot life at 25C (hours): >300 Gel Time (minutes/C): IO/80 Cure Schedule (minutes/C): 30180 or 31120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/l20C): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Tg (C): 95 CTE (in/in/C): Alpha 1: 50x10 -6 Alpha 2: 147x10 -6 Volume Resistivity 25C (ohm-cm): ,1x10 14 Shelf Life (months/C): 6/O Flash Point (C): ,120 Hardware Pin Transfer: EPIBOND 7261: Color/Filler Type: yellow Other Application Method: syringe dispense Specific Gravity (system): 1.55 System Viscosity (x1000 cps): 145 Pot Life at 25C (hours): ,500 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 25C (Al/Al)(psi)(l hr/lZOC): >2000 Operating Temperatures (C!):Continuous: 175 Intermittent: 220 Thermal Conductivity: 10x10 -4 Tg (C): 60 CTE (in/in/C): Alpha 1: 50x10 -6 Alpha 2: 145x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120
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Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives (Continued): Hardware Pin Transfer (Continued): EPIBOND 7271: Color/Filler Type: Red Other Application Method: syringe dispense Snecific Gravitv (svstem): 1.55 System Viscosity (xjOO0 Cps): 145 Pot Life at 25~ (hours): ,500 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 10x10 -4 Tg (C): 60 CTE (in/in/C): Alpha 1: 50x10 -6 Alpha 2: 145x10 -6 Volume Resistivitv 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >120
Adhesives-General
FURANE PRODUCTS: EPIBOND Die Attach Adhesives: Polyimide: EPIBOND 7300: Color/Filler Type: silver Specific Gravity: 3.0 System Application Method: Stamping/Styringe dispenser Pot Life 25C (days): 18 Gel Time ISOC (minutes): 30 Cure Schedule (hours/C): O-5/150+ 0.5;275 Die Shear Strength (psi): >2000 Thermal Conductivity: 60 Weight Loss 300C (%): 0.7 Tg (C): 196 Volume Resistivity 25C (ohm-cm): .00008 Shelf Life: 12/O Ammonium t5 Potassium (8 Chloride (5 Sodium t5
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Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: Surface Mount Adhesives: EPIBOND 7077 Electrically Conductive Surface Mount Adhesive: Features/Benefits: * 100% solids exhibiting low outgassing * Excellent wet strength to hold components in place during processing * Fast cures in less than 5 minutes at 160C in IR oven * Reworkable for component replacement * Low ionic contaminment levels minimize corrosion potential * Very smooth, thixotropic consistency designed for screening applications EPIBOND 7251 Blue Surface Mount Adhesive: Features/Benefits: * Highly thixotropic, displaying excellent dot-height retention without tailing during dispensing * Excellent wet strength to hold components in place during processing * Cures in less than 5 minutes at 160C in IR oven * Viscosity is factory adjustable to meet application needs * Low ionic contaminant levels meet corrosion EPIBOND 7260 Surface Mount Adhesive (for Software Pin Transfer Equipment): Features/Benefits: * Designed for software pin transfer equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked EPIBOND 7261 Surface Mount Adhesive (for Hardware Pin Transfer Equipment): * Designed for the attachment of standard components using hardware pin transfer equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked
Adhesives-General
FURANE PRODUCTS: EPIBOND Surface Mount Adhesives (Continued): EPIBOND 7262 Surface Mount Adhesive (for Automatic Dispensing Equipment): Features/Benefits: Designed for automated syringe dispensing equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked EPIBOND 7263 Surface Mount Adhesive (for Software Pin Transfer Equipment): Features/Benefits: Designed for software pin transfer equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked EPIBOND 7271 Red Surface Mount Adhesive (for Hardware Pin Transfer Equipment): Features/Benefits: Designed for the attachment of standard components using hardware pin transfer equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked EPIBOND 7272 Surface Mount Adhesive (for Automatic Dispensing Equipment): Features/Benefits: Designed for automated syringe dispensing equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked
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Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: EPIBOND Surface Mount Adhesives (Continued): EPIBOND 7272-200 Surface Mount Adhesive (for Automatic Dispensing Equipment): Features/Benefits: * Designed for automated syringe dispensing equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked EPIBOND 7274 Surface Mount Adhesive (for Hardware Pin Transfer Equipment): Features/Benefits: * Designed for the attachment of standard components using hardware pin transfer equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked
Adhesives-General
49
GC ELECTRONICS: Adhesives: Epoxy Cements: QUICK STIK: 5 Minutes Set Clear, fast curing epoxy adhesive. In view of its short pot life, use is recommended when a single repair must be made and the mixed adhesives can be used within one or two minutes. Cemented items can be safely handled within eight to twelve minutes, with full hardness obtained after several hours. This cement is relatively thin in consistency and should be used to cement closely matching surfaces. The glue line is usually invisible. Epoxy SUPER GLUE: 5-5 Hour Set Versatile epoxy cement particularly suitable for cementing non-porous materials. Cures at room temperature. Bond strength of over 3000 psi. Will not shrink through curing. Resistant to water, solvents, heat, cold and fungus. Excellent dielectric properties. Mix in equal parts from two tubes. Silicone Rubber Adhesive/Sealant: One-component elastomer cures to a tough, rubbery solid when exposed to moisture in the air. Designed to fulfill industrial and electronic service sealing and bonding requirements, Silicone Rubber Sealant has excellent adhesive strength, high elongation and outstanding insulation and heat resistance qualities. Develops primerless adhesion to a variety of materials, including metal, glass, most wood, silicone resin, vulcanized silicone rubber, ceramic, natural and synthetic fibers; most plastics and painted surfaces. Resists weathering, vibration and exposure to oil, moisture, ozone, and temperatures from sub-zero to 450F. Cures to a tack-free surface in 20 minutes. Full cure, 24 hours. Ideal for many sealing, bonding and insulating applications, including general electrical insulation, potting exposed electronic components, bonding gaskets for heating and refrigeration units, formed-in-place gaskets for gear boxes, compressors, pumps and outdoor motor covers, pressure sealing of aircraft cabins and cockpits, caulking sheet metal stacks, ductwork and equipment housings, and as an anti-abrasion coating. As Cured--Electrical: ASTM D257 Volume Resistivity, ohm-cm: 1.5 X 10 15 ASTM D149 Dielectric Strength, volts/mil: 550 ASTM D150 Dielectric Constant: at 60 Hz: 2.8 at 100 Hz: 2.8 at 100 KHz: 2.8 ASTM D150 Dissipation Factor: at 60 Hz: 0.0015 at 100 Hz: 0.0015 at 100 KHz: 0.0015
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Adhesives, Sealants and Coatings for the Electronics Industry
GC ELECTRONICS: Adhesives (Continued): Epoxy Glue: 5 Hours Set Provides an exceptionally hard and strong bond. Good dielectric properties. Gray-white in color with fillers added to increase viscosity and make it thixotropic (nonrunning). May be used to fill gaps or to replace broken sections. Bonds may be over-filled and filed or sanded after curing. Cyanoacrylate Adhesives: GR-R-RIP: World famous alpha cyanoacrylate rapid bonding adhesive. Bond strength not affected by temperatures from -112F to +212F (-8OC to +lOOC). GELWELD: Gel Cyanoacrylate Adhesive Alpha Cyanoacrylate super strength adhesive in a "gel" form-will not drip or run. Fills gaps well. PERMABOND Super Glue Regular Formula: Ethyl Cyanoacrylate Adhesive Medium viscosity formula for efficient wicking action, faster curing time. Excellent for bonding any combination of plastic, rubber or metal parts. This grade is ideal for small or fine work on non-porous, smooth surfaces. It fills gaps of .003-.005". Highly resistant to acid, alkali water, solvents and fungus. Non-toxic. Meets Mil. Spec. MIL-A-46050B Type 1 Class 2 PERMABOND High Viscosity Formula: Ethyl Cyanoacrylate Adhesive Higher viscosity means less wicking, no drop and slower speed of cure. Fills gaps .015-.017". This grade has a higher skin adherence, which makes it ideal for surfaces which are irregular or rough, or have a high degree of porosity, such as wood or ceramic. Its slowest cure time makes it ideal for applications where there is more than one operation, or minor adjustment is needed within 30 seconds. Meets Mil. Spec. MIL-A-46050C Type II Class 3.
Adhesives-General
51
GC ELECTRONICS: Adhesives (Continued): PERMABOND 910: Methyl Cyanoacrylate Adhesive Forms strong, lasting bonds in seconds between either similar or dissimilar materials--metal, porcelain, plastic, glass, most rubbers, hardwoods, and other non-porous materials with smooth, close-fitting surfaces. And, the bond resists softening at temperatures up to 320F (16OC). Your most versatile adhesive for bonding...attaching...fixturing. Cures to a strength of 5000 psi; because it is solvent-free, there is no shrinking during curing... and no solvent fumes. Meets Mil. Spec. MIL-A-46050C Type I Class 2 Solvent Release Adhesives: General Purpose Plastic Cement: A solvent-release adhesive with a special Nitrocellulose Lacquer Base. The bond is usually invisible and hard, but not brittle. It adheres especially well to plastics, paper, leather, ceramics and metal. Quick-drying and waterproof, this allpurpose cement is widely used by repairmen, model builders, hobbyists and do-it-yourselfers. GC BOND: Thermoplastic adhesive based on synthetic components with unusually strong bonding characteristics to most materials. Produces a waterproof, resilient and long-lasting flexible bond. Light tan in color. GC BOND's uses range from cementing paper and cardboard to cementing electronic components to circuit boards and chassis. Sticks well to all metals and glass. Dries in 15 to 30 minutes. Service Cement: A quick-drying and waterproof clear adhesive which forms a strong, hard but vibration-resistant bond with minimal shrinkage. This is a true universal adhesive for shop, industry, home and hobby use. Ideal for speaker repairs. May also be used for gluing porous or semi-porous materials to each other or to metals, plastics, etc. This cement is not suitable for metal-tometal, glass-to-metal or other non-porous to non-porous surfaces, for which PERMABOND, GR-R-RIP or epoxy cements are more suitable.
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Adhesives, Sealants and Coatings for the Electronics Industry
GC ELECTRONICS: Adhesives (Continued): Rubber-to-Metal Cement: A heavy-bodied, black rubber-based cement with outstanding bonding qualities to many materials such as natural and synthetic rubber, metal, wood and plastics. Dries fairly quickly and produces a lasting, flexible bond which often exceeds the strength of the material itself. Used to cement any rubber or flexible plastic part to cabinets, chassis or panels; also for gaskets, weather strips, etc. Acrylic Cement: Consists of solvent for acrylics (plexiglass, lucite and others). slishtlv thickened with dissolved acrylic resin. It actually t'weids112 items made of plexiglass. The-joint is usually invisible and stronger than the material itself. Cements many items used in electronics for decorative or functional purposes as well as acrylic signs, art objects and decorative pieces. Also has fairly good adhesive qualities to such surfaces as wood, other plastics, cardboard and fibers. Vinylite Cement: Vinyl resin-base cement that is waterproof, almost invisible and has excellent resistance to moisture, most acids and alkalis. Used to cement items made of rigid or flexible vinyl, wood, cardboard, paper, metal, plastics, glass. Very flexible. Lends itself particularly well to items where a rigid bond is not desirable.
Adhesives-General
GC ELECTRONICS: Adhesives
(Continued):
SUPER GLUE: Base: Bisphenol A (Resin) Polvamide (Hardener) Color: Transparent Light Straw Flashpoint: Above 149C (3OOF) Specific Gravity: 1.16 (Resin) 0.97 (Hardener) Curing/Drying Time: 4-6 Hrs. QUIK-STIK: Base: Mod. Epoxy Resin Color: Clear Flashpoint: Above 149C (300F) Specific Gravity: 1.17 (Resin) 1.13 (Hardener) Curing/Drying Time: 0-12 Mins. GR-R-RIP!: Base: Alpha or Ethyl Cyanoacrylate Color: Clear Flashpoint: 83C (182F) Specific Gravity: 1.05-1.08 Curing/Drying Time: 15-60 Sets. Suggested Solvent: GC #IO-130 or Acetone, M.E.K. PERMABOND: Base: Alpha or Ethyl Cyanoacrylate Color: Clear Flashpoint: 83C (182F) Specific Gravity: 1.05-1.08 Curing/Drying Time: 15-60 Sets. Suggested Solvent: GC #lo-130 or Acetone, M._E.K. PERMA-LOK: Base: Dimethylacrylate Esters Color: Green Flashpoint: 93C (200F) Specific Gravity: 1.07 Service Cement: Base: Nitrocellulose Lacauer Color: Clear Light Straw‘ Flashpoint: -9C (15F) (Extremely Flammable) Specific Gravity: 0.98 Curing/Drying Time: IO-15 Mins. Suggested Solvent: GC #lo-312 Series or Lacquer Thinner
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Adhesives, Sealants and Coatings for the Electronics Zndusty
GC ELECTRONICS: Adhesives (Continued): General Purpose Plastic Cement: Base: Nitrocellulose Lacquer Color: Clear Light Straw Flashpoint: -9C (ISF) O.C. (Extremely Flammable) Specific Gravity: 0.95 Curing/Drying Time: lo-15 Mins. Suggested Solvent: GC #lo-312 Series or Lacquer Thinner Epoxy Glue: Color: Grey White Flashpoint: Above 204C (400F) Specific Gravity: 1.14 (Resin) 1.2 (Hardener) Curing/Drying Time: 2 hrs. Rubber-to-Metal Cement: Base: Rubber Resin Color: Black Flashpoint: -lOC (14F) C.C. Specific Gravity: 0.90 Curing/Drying Time: 15-20 Mins. Suggested Solvent: Petroleum Naphtha or GC #IO-6702 Acrylic Cement: Base: Acrylic Resin Color: Clear Flashpoint: Non-Flammable Specific Gravity: 1.3-1.4 Curing/Drying Time: 15 Mins. Suggested Solvent: Methylene Chloride GC
BOND: Base: Synthetic Thermoplastic Resin Color: Tan Flashpoint: -7 (20F) O.C. (Extremely Flammable) Specific Gravity: -87 Curing/Drying Time: 4 hrs. Suggested Solvent: Methyl Ethyl Ketone
Vinylite Cement: Base: Vinvl Resin Color: Clear Flashpoint: -20C t-4") (Extremelv Flammable) Specific Gravity: .86 Curing/Drying Time: 25 min. Suggested Solvent: Acetone
Adhesives-General
IPS CORP.: WELD-ON 1007 High Strength Cement for Rigid Vinyl (PVC) and Kydex: For Bonding: Rigid vinyl and Kydex to themselves and to each other. General Description: WELD-ON 1007 is a clear, light bodied, syrupy, free flowing, very fast curing, high strength, solvent cement. It is specifically formulated for solvent cementing rigid Polyvinyl Chloride (PVC) and Kydex. Uses: General usage for vinyl where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical or electronic assemblies, decorator items, etc. Properties of Bond: Initial bond forms very quickly, so that some parts may be handled within just a few minutes of application. Bond strength continues to develop very rapidly, reaching a substantial level within hours. Joints are weather resistant and will generally have physical and chemical properties similar to those of rigid vinyl. WELD-ON 1591 Acrylonitrile-Butadiene-Styrene
(ABS):
For Bonding: ABS plastics to itself only - e.g., Cycolac, Kralon, Lustrane, etc. Description: WELD-ON 1591 is a black, sirupy, bodied, fast drying solvent cement. It forms high strength bonds in joining ABS materials. Uses: General usage for ABS where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies where black color is desirable, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical and electronic housings, decorator items, etc. For near clear cement, ask for WELD-ON 1707. Properties of Bond: High strength, rigid, generally free from crazing. Chemical, physical and electrical properties are similar to those of ABS materials.
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IPS CORP.: WELD-ON 1707 Acrylonitrile-Butadiene-Styrene
(ABS):
For Bonding: ABS plastics to itself only--e.g., Cycolac, Kralastic, Kralon-Lustrane, etc. Description: WELD-ON 1707 is a milky, sirupy, bodied, fast drying solvent cement. It forms high strength bonds in joining ABS materials. Uses: General usage for ABS where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical or electronic assemblies, decorator items, etc. Properties of Bond: High strength, rigid, generally free from crazing. Chemical, physical and electrical properties are similar to those of ABS materials. WELD-ON 1993 High Strength Cement for Rigid Vinyl (PVC), Kydex or Acrylivin: For Bonding: Rigid vinyl and Kydex or Acrylivin to themselves and to each other. May also be used for joining some flame retardant ABS materials 11%" or thicker. General Description: WELD-ON 1993 is a clear, medium bodied, syrupy, free flowing, very fast curing, high strength, solvent cement. It is specifically formulated for solvent cementing rigid Polyvinyl Chloride (PVC) and Kydex or Acrylivin. Uses: General usage for vinyl where a heavy bodied cement is required to fill unvoidable gaps. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical or electronic assemblies, decorator items, etc. Properties of Bond: Initial bond forms very quickly, so that some parts may be handled within just a few minutes of application. Bond strength continues to develop very rapidly, reaching a substantial level within hours. Joints are weather resistant and will generally have physical and chemical properties similar to those of rigid vinyl.
Adhesives-General
57
IPS CORP.: WELD-ON 3050 Noryl* Cement: For Bonding: Noryl to itself and to other plastics such as ABS, styrene, acrylics, etc. Description: WELD-ON 3050 is a milky, fast drying, medium bodied solvent type cement. It cures with the dissipation of solvents forming high strength, rigid joints. Initial bond will usually take place within minutes and may be of sufficient strength for handling. The following bond strength data was obtained with compressive shear loading, at 0_050"/min. The material tested was l/4" thick Noryl* with lap joints of 1 square inch of bonding area. Both surfaces were liberally coated with cement and assembled after 60 seconds. Samples were cured and tested at room temperature. R.T. Cure: 2 Hrs. Bond Strength (Avg. PSI): 200 R.T. Cure: 16 Hrs. Bond Strength (Avg. PSI): 890 R.T. Cure: 72 Hrs. Bond Strength (Avg. PSI): 1290 R.T. Cure: 1 Wk. Bond Strength (Avg. PSI): 1400 Uses: General usage for Noryl* where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, lighting fixtures, housewares, large and small containers, electrical or electronic assemblies, decorator items, etc.
* Note: Noryl is a registered trademark of General Electric Corp.
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Adhesives, Sealants and Coatings for the Electronics Zndustry
ITW DEVCON: DEVCON MVP Methacrylate Adhesives for Bonding All Materials: A one to one mix methacrylate that has high tensile, peel and impact strength. MVP 11 is formulated for bonding dissimilar substrates and offer some flexibility for thermal expansion and other high stress applications. Adheres well to most plastics and metal with minimal surface preparation. Designed Performance: * High non-sag viscosity * Excellent peel and impact * Gapfilling to .I25 * Rapid 5 minute fixturing * Easy mixing with 1:l available in dual syringe with metering * High strength, 4,000 psi * Bonds flexible vinyls and reinforced plastics * Bonds sheet metals and plastics in combination Uncured (Liquid): Type: Meter-Mix Viscosity (centipoise): 50,000 Color: amber Flashpoint (F): 50 Toxicity: Moderate Solvents present: none Application: Recommended maximum gap: typical use: plastics metals
.125"
Curing Hardening: Fixture strength on metals, steel, aluminum, alloys, brass: 7-10 min. Fixture strength on plastics, nylon, ABS, vinyl, urethane, acrylic, polycarbonate, phenolic: 7-10 min. Functional strength (hours): 1 Full strength (hours): 4 Cured Adhesive: Adhesive tensile shear (psi) on steel and aluminum laps: 4,000 Impact strength (ft. lbs./in 2): 25 T-Peel (lb per linear inch): 45 Compressive shear (psi) on plastics: substrate failure Temperature range (F): -65 to 250
Adhesives-General
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LOCTITE CORP.: Bonding: LOCTITE developed engineering adhesives to meet customer needs for adhesives that combine tensile, shear, and peel strength with maximum impact, shear, and peel strength with maximum impact, stress, and shock resistance. For maximum application versatility, these adhesives come in both activator-cured and UV-cured formulations. The UV-cured formulations are especially useful for bonding transparent substrates, and in sealing and coating applications. LOCTITE engineering adhesives can be conveniently dispensed and cured on line with either manual or automatic process equipment. High Impact SPEEDBONDER 324: Tough, activator-cured adhesive that bonds most any material. Cures in minutes when in contact with Activator 707 and forms flexible bonds on gaps up to .040" thick. Withstands shock and temperatures to 275F. Bonds: - Speaker magnets - Prepared surfaces where impact and peel are severe - Firearm parts - Auto glass components - DC motor magnets - Decorative wood to cutlery - Mirrors to housings Severe Environment SPEEDBONDER 325: Solvent-resistant, activator-cured adhesive. Cures in minutes when in contact with Activator 707 and forms flexible bonds on gaps up to .040" thick. Designed for severe environments and temperatures up to 350F. Bonds: - Electronic components used in high temperature systems - Fuel pump components - Identification tags on pipelines - DC motor magnets on motors designed for extreme environments High Performance SPEEDBONDER 326: Activator-cured adhesive with very high cure speed. Bonds rapidly when cured with LOCQUIC Primer N. Strong bonds on gaps up to .020" thick . Bonds: - DC motor magnets - Jewelry--stones to mounts - Ferrite magnets to steel housing - Preformed aluminum structural elements
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Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Bonding(Continued): Ultraviolet Adhesive 350: UV-cured adhesive with excellent adhesion. Forms tough bonds with glass, metal, and a variety of thermoplastics. Retains strength when exposed to water or humidity. Bonds and seals: - Glass to itself - Glass to other materials - Tamperproof screws - Seals electrical relays Tough Ultraviolet Adhesive 352: Tough, flexible, UV or activator-cured adhesive. Highly resistant to vibration and impact. Bonds and seals: - Glass to other materials - Metal with cured fillet - Small potting applications High Strength Flexible SPEEDBONDER 392: High tensile strength combined with flexibility for outstanding impact and peel resistance. Bonds bare and galvanized steel and steel coated with phosphate and dichromate. Resistant to thermal cycling and severe environment. Cures in less than a minute with Activator 792. Bonds: - Motor magnets to housings - Speaker magnet to pole pieces - Galvanized strectural elements DEPEND No Mix Adhesive 330: Versatile, tough, activator-cured adhesive with high peel and impact strength. Used with DEPEND Activator 738, it cures in just minutes. Excellent for porous substrates and applications that involve flexing and bending. Bonds almost all combinations of materials. Bonds: - Ferrite magnets to steel housings - Fuel pump components - Glass to steel in solar collector panels - Aluminum and steel to ABS/graphite - Screws to enclosures for tamperproofing - Metal signs to concrete walls - Metal automobile window latch levers to glass Primers: LOCQUIC Activator 707, LOCQUIC Primer N and DEPEND Activator 738 aid cure of Engineering Adhesive.
Adhesives-General
LOCTITE CORP.: Bonding(Continued): Engineering Adhesives Technical Information: 324: Color: Amber Gap Filling: .040" Viscosity cp: 15,000 Tensile Strength psi: 5,000 Temperature Range: -65 to 275F (-54 to 135C) Cure Speed: Fixture: 3 min. Full: 12-24 hrs. Recommended Primer: Activator 707 325: Color: Amber Gap Filling: -040" Viscosity cp: 20,000 Tensile Strength psi: 6,000 Temperature Range: -65 to 350F (-54 to 18OC) Cure Speed: Fixture: 5 min. Full: 12-24 hrs. Recomended Primer: Activator 707 326: Color: Amber Gap Filling: .020" Viscosity cp: 15,000 Tensile Strength psi: 5,000 Temperature Range: -65 to 225F (-54 to 107C) Cure Speed: Fixture: 2 min. Full: 12-24 hrs. Recommended Primer: N uv350: Color: Amber Gap Filling: .OlO" Viscosity cp: 5,000 Tensile Strength psi: 800 Temperature Range: -65 to 250F (-54 to 125C) Cure Speed: Fixture: 5-15 sec. Full: 30-90 sec. Recommended Primer: UV light
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Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Bonding(Continued): Engineering Adhesives Technical Information(Continued): UV352: Color: Lt. Brown Gap Filling: .040" Viscosity cp: 20,000 Tensile Strength psi: 5,000 Temperature Range: -65 to 275F (-54 to 15OC) Cure speed: Fixture: 2-3 min. Full: 24 hrs. Recommended Primer: UV light or Activator 707 DEPEND 330: Color: Pale Yellow Gap Filling: .030" Viscosity cp: 70,000 Tensile Strength psi: 2,700 Temperature Range: -60 to 250F (-51 to 12%) Cure Speed: Fixture: l-2 min. Full: 4-24 hrs. Recommended Primer: Activator 738 392 :
Color: Lt. Tan Gap Filling: .025" Viscosity cp: 68,000/15,000 Tensile Strbgth psi: 2,800 Temperature Range: -40 to 300F (-40 to 149C) Cure Speed: Fixture: 30-60 sec. Full: 4-24 hrs. Recommended Primer: Activator 792
AdhesivesGeneral
63
LOCTITE CORP.: Threadlocker Adhesives: Invented by Loctite Corporation as a revolutionary method to positively lock and seal threaded fasteners, LOCTITE threadlocker adhesives have found wide acceptance in a range of applicationsfrom delicate electronic components to heavy construction equipment. They have become a standard in worldwide automotive assembly, as well as critical military and aerospace systems. In response to industry needs, Loctite has pioneered threadlockers with precisely controlled strength; threadlockers resistant to extreme enviroments; and even pre-applied threadlockers for high volume applications and easier inspection. LOCTITE threadlocker adhesives can be applied with manual, semi-automatic, or automatic systems, and are formulated in strengths and viscosities for virtually any application. Removable Threadlocker 242: Medium strength, general purpose. Ideal for all nut and bolt applications. Especially well suited for l/4" or larger fasteners. Removable with hand tools. Replaces: - Lockwashers - Plastic insert fasteners Locks: - Machine tool access bolts - Conveyor roller bolts - Gear box bolts - Construction equipment nuts and bolts - Bearing cover cap screws - Crawler truck bolts - Drive shaft fasteners - Mounting bolts on motors, pumps, etc. - Shaft coupling bolts Small Screw Threadlocker 222: Low strength. Perfect for small fasteners, long engagement length fasteners, and components requiring occasional adjustment. Best for l/4" and smaller fasteners. Removable with hand tools. Locks: - Set screws - Adjustment screws - Calibration screws - Thermostat screws - Relay lock screws
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Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Threadlocker Adhesives(Continued): Permanent Threadlocker 262: High strength. Controlled torque tension. Designed for severe vibration/stress applications or extreme environmental/ chemical conditions. Especially useful where Grade 5 and 8 fasteners are subjected to heavy shock, vibration, and stress levels. Removable with heat and hand tools. Locks: - Loader transmission bolts - Refrigeration hardware - Railroad traction-motor mounting bolts - Railroad pedestal frame key bolts - Differential case bolts - Replaces 5a and 5b fits Penetrating Threadlocker 290: Formulated especially for pre-assembled fasteners. Penetrates by capillary action. Simplifies preventive maintenance. (Also used to seal welds.) Locks, vibration-proofs, and seals: - Instrumentation screws - Electrical connector set screws - Carburetor choke set screws - Virtually all small-to-medium size fasteners High Temperature Threadlocker 272: High temperature/high strength for extreme duty applications. Permanently locks: - Rolling mill conveyor bolts - Furnace mounting studs LOCTITE DRI-LOC Pre-applied Threadlockers: DRI-LOC Threadlocker is a dry-to-the-touch film applied by fastener suppliers and independent contractors. Locks: - Ring gear bolts - Carburetor screws - Transmission nuts - Head bolts - Truck axle bolts - Tower bolts Seals: - Transmission bolts - Pipe plugs, fittings Also Available for Specific Uses: - High Strength Threadlocker 271 (Very high strength for fasteners up to 1" in diameter.) - High Strength Threadlocker 277 (High viscosity/high strength for fasteners over 1" in diameter.) Primers: LOCQUIC Primers T and N aid cure on inactive surfaces such as aluminum, black oxide, stainless steel, and thermoset plastics.
Adhesives-General
LOCTITE CORP.: Threadlocker Adhesives(Continued): Threadlocker Performance Information: 200: Color: Yellow Torque in. lbs.: 220/105 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs. 201
: Color: Yellow Torque in. lbs.: 2451130 Temperature Range: -65 to 400F (-54 to 204C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs.
202: Color: Green Torque in. lbs.: 200/105 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs. 203: Color: Silver Torque in. lbs.: 160/75 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs. 204: Color: Red Torque in. lbs.: 280/250 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs.
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LOCTITE CORP.: Threadlocker Adhesives(Continued): Threadlocker Technical Information: 222: Color: Purple Gap Fill: .005" Viscosity cp: 2000 Torque in. lbs.: SO/20 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 20 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type II Grade M 242: Color: Blue Gap Fill: -005" Viscosity cp: 2000 Torque in. lbs.: 100/35 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 20 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type II Grade N 262: Color: Red Gap Fill: .005" Viscosity cp: 3000 Torque in. lbs.: 150/100 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type II Grade 0 271: Color: Red Gap Fill: -007" Viscosity cp: 500 Torque in. lbs.: 200/250 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 20 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type I Grade K
Adhesives-General
LOCTITE CORP.: Threadlocker Adhesives(Continued): Threadlocker Technical Information(Continued): 27'2: Color: Red Gap Fill: .007" Viscosity cp: 7000 Torque in. lbs.: 2251240 Temperature Range: -65 to 450F (-54 to 232C) Cure Speeds, Steel: Fixture: 30 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N 277: Color: Red Gap Fill: .OlO" Viscosity cp: 6500 Torque in. lbs.: 250/200 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 60 min. Full: 24 hrs. Fixture w/Primer: IO min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type I Grade L 290 :
Color: Green Gap Fill: .004" Viscosity cp: 12 Torque in. lbs.: 60/200 Temperature Range: -65 to 400F (-54 to 204C) Cure Speeds, Steel: Fixture: 3 min. Full: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type III Grade R
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MERECO DIVISION: MERECO CLN-738 Surface Mount Adhesive: Form: Thin Paste Color: As Specified SP. Gr.: 1.16 Viscosity: Thixotropic gel Cure Times: Recommended minimum cure - 5 minutes at 250F or 3 minutes at 300F. For maximum properties cure 30 min. at 300F. Gel time (2 mil film) at 250F = 2 min. at 300F = 1 min. Characteristics of Cured Components: Hardness Tests: 83: Shore D Lap Shear (Al-Al): 2500 psi METRE-SET 321 One-Part Adhesive Epoxy: METRE-SET 321 is a unique, one part, high strength, thermostting, epoxy adhesive. It does not contain plasticizers, other resin modifiers which detract from properties or solvents which release vapors during cure. The bonds formed are strong and resilient, have good electrical insulation, high dielectric strength, low loss factor, chemical resistance and are capable of continuous duty up to temperatures of 200C (400F). METRE-SET 321 bonds to glass, ceramics, wood, metals including brass and many plastics (not for use with acetal) including Ryton. METRE-SET 321 is cured with heat. Sources of heat include ovens, infra-red and hot plates. Recommended curing temperatures range from 140C (285F) to 204C (400F). Typical Product Properties: Color: Black, brown or gray Form: Soft paste Viscosity (25C), cP: 60,000 Specific Gravity (25/25C): 1.33 Flash Point, F: 380 Typical Cured Properties: (after 2 hours at ISOC): Mechanical: Color: Brown Form: Solid Specific Gravity (25/25C): 1.34 Tensile Shear (Aluminum to Aluminum), psi: 25C (77F): 3200 85C (185F): 3000 120C (250F): 2000 150C (300F): 1300 Thermal: Operating Range, C: -55 to 204 Electrical: Dielectric Constant (1000 Hz): 3.8
Adhesives-General
69
NORLAND PRODUCTS INC.: NORLAND Electronic Adhesive: NEA 121: NEA 121 is a clear, low viscosity adhesive that cures when exposed to uv light and/or heat. Applications include tacking, filling and sealing precision components, and tamperproofing adjustable components. NEA 121 is ideal for spot curing small areas. NEA 123: NEA 123 is a thixotropic paste that cures under uv light and/or heat. This fast curing adhesive is ideal for wire tacking, capacitor bonding and coil terminating. NEA 123 contains a latent heat catalyst that can quickly cure areas that are not exposed to ultraviolet light. The heat cure is not required if all the adhesive receives proper exposure to uv light. NEA 141: NEA 141 is a medium viscosity, thixotropic paste which cures under ultraviolet light. This adhesive was designed for coil terminating. NEA 155: NEA 155 is a red, thixotropic paste that cures in minutes at high temperatures to form an electrically insulating polymer. The adhesive can be readily applied by syringe, screen printing or pin transfer techniques. It is ideal for bonding SMT devices or printed circuit boards so that they can pass through the solder bath without shifting. NEA 121: Recommended For: Tacking, filling, sealing and tamperproofing precision components Cure: UV/heat Glass: Excellent Adhesion to Metal: Excellent Plastic: Fair Viscosity at 25 Degrees C: 300 cps Color: Clear Refractive Index: N/A Modulus psi: 160,000 Tensile psi: 3,500 Elongation at Failure: 30% Shore D Hardness: 85
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Adhesives, Sealants and Coatings for the Electronics Industry
NORLAND PRODUCTS INC.: NORLAND Electronic Adhesive(Continued): NEA 123: Recommended For: High viscosity thixotropic paste for wire tacking, chip bonding and coil terminating Cure: VV/heat Glass: Excellent Adhesion to Metal: Good Plastic: Good to Excellent Viscosity at 25C: Thixotropic Paste Color: Translucent Refractive Index: N/A Modulus psi: 50,000 Tensile psi: 3,600 Elongation at Failure: 60% Shore D Hardness: 60 NEA 141: Recommended For: Medium viscosity thixotropic paste ideal for coil terminating Cure: UV Glass: Excellent Adhesion to Metal: Good Plastic: Good to Excellent Viscosity at 25 Degrees C: Thixotropic Paste Color: Translucent Refractive Index: N/A Modulus psi: 40,000 Tensile psi: 2,800 Elongation at Failure: 60% Shore D Hardness: 55 NEA 155: Recommended For: A fast curing adhesive for bonding, sealing or potting electronic components Cure: Heat Glass: Excellent Adhesion to Metal: Excellent Plastic: Fair Viscosity at 25 Degrees C: Thixotropic Paste Color: Red Refractive Index: N/A Modulus psi: 160,000 Tensile psi: 3,500 Elongation at Failure: 5% Shore D Hardness: 90
Adhesives-General
71
PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds: ANL-22: Low strength * Removable for locking/sealing small screws under 1/4" in diameter * May be disassembled with hand tools * Meets MIL-S-46163A, Type II, Grade M ANL-42: Medium strength * Removable general purpose adhesive, for locking/sealing fasteners over l/4" in diameter * May be disassembled with hand tools * Meets MIL-S-46163A, Type II, Grade N ANL-71: High strength * Permanent, for locking/sealing fasteners up to 1" in diameter. Disassembly difficult * Meets MIL-S-46163A, Type I, Grade L ANL-77: High Strength * Permanent locking/sealing large bolts and studs for fasteners 1" in diameter and larger. Disassembly difficult; heat required. * Meets MIL-S-46163A, Type I, Grade L ANL-90: High Strength * Penetrating permanent, for locking/sealing preassembled fasteners. Also used to seal weld and casting porosity. Disassembly difficult. * Meets MIL-S-46163A, Type III, Grade R ANL-RC: High Strength * General purpose, retaining compound for retaining bearings, bushing, collars, keys, and splines. -005" gap filling capability allows slip fit instead of press fit parts. * Meets MIL-R-46082B, Type I ANL-RC/HT: High Temperature * Retaining compound for retaining bearings, bushings, collars, gears, and other cylindrical parts. Fills gaps to .015" and resists temperatures up to 450F (232C.3 * Meets MIL-R-46082B, Type II
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PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds (Continued): ANL-22: Generic Type: Low Strength Color: Purple Viscosity (cps): 900-5000 Fixture Time (min.): 5-15 Working Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .OlO Specific Gravity: 1.07 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 yr. min. Soluble in: Acetone, MEK, 1 ,I,1 Trichloroethane Locking Torque Breakaway: 25-70 (in-lbs) Prevail: 15-60 Shear Strength (lbs/in 2): 570-990 Service Temperature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 15 x 10 -5 Hardness: Rockwell: R25 Decomposition Temp. (F): 410 ANL-42: Generic Type: Medium Strength Color: Blue Viscosity (cps): 900-5000 Fixture Time (min.): 5-15 Working Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .OlO Specific Gravity: 1.11 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 vr. min. Soluble in/Acetone, MEK, l,l,l Trichloroethane Locking Torque Breakaway: SO-105 (in-lbs) Prevail: 60-130 Shear Strength (lb/in 2): 1140-2130 Service Temperature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 15 x 10 -5 Hardness: Rockwell: R65 Decomposition Temp. (F): 432
Adhesives-General
PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds (Continued): ANL-71: Generic Type: High Strength ((1" Fasteners) Color: Red Viscosity (cps): 450-550 Fixture Time (min.): 5-15 Working Time ihrs.j: 2 Full Cure (hrs.): 24 Gap Filled (inch): .008 Specific Gravity: 1.10 Flash Point (F, TOCf: 219 Corrosivity (MIL-S-22473D): none Toxicitv: Low Shelf Life (R-T.): 1 yr. min. Soluble In: Acetone, MEK, l,l,l, Trichloroethane Lockins Torcfue Breakaway: 175-260 (inllbs)- Prevail: 215-305 Shear Strength (lb/in 2): 215-305 Service Temoerature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 8 x 10 -5 Hardness: Rockwell: Ml10 Decomposition Temp. (F): 486 ANL-77: Generic Type: High Strength (>I" Fasteners) Color: Red Viscosity (cps): 6000-8000 Fixture Time (min.): 5-15 Workinc Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .OlO Soecific Gravitv: 1.11 Fiash Point (F,-TOC): 219 Corrosivitv (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, I,1 ,I Trichloroethane Locking Torque Breakaway: 220-305 (Prevail): 170-260 (in-lbs) Shear Strength (lb/in 2): 2840-4970 Service Temperature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 8 x 10 -5 Hardness: Rockwell: Ml10 Decomposition Temp. (F): 504
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PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds (Continued): ANL-90: Generic Type: Wicking Grade Color: Green Viscosity (cps): IO-25 Fixture Time (min.): l-10 Working Time (hrs.): 1 Full Cure (hrs.): 24 Gap Filled (inch): .002 Specific Gravity: 1.08 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): Toxicitv: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, l,l,l, Trichloroethane Locking Torque Breakaway: 50-105 Prevail: 170-350 (in-lbs) Shear Strength (lb/in 2): 2130-3550 Service Temaerature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/b): 7.3 x 10 -5 Hardness: Rockwell: M89 Decomposition Temp. (F): 437 ANL-RC: Generic Type: Retaining Compound Color: Green Viscosity (cps): 100-300 Fixture Time (min.): 5-25 Workina Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .005 Specific Gravity: 1.08 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): none Toxicitv: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, 1,l.l Trichloroethane Locking Torque Breakaway: 300-480 (in-lbs) Prevail: 220-440 Shear Strength (lb/in 2): 4260-5680 Service Temperature: (-65 to +3OOF) (-54 to +149C) Linear Expansion (mm/C): 4.6 x 10 -5 Hardness: Rockwell: Ml08 Decomposition Temp. (F): 496
Adhesives-General
PACER
TECHNOLOGY:
ANA-LOK
Anaerobic Compounds (Continued):
ANL-RC/HT: Generic Type: Retaining Compound Color: Green Viscosity (cps): 800-1100 Fixture Time (min.): lo-15 Working Time fhrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .015 Specific Gravity: 1.12 Flash Point (F, TOC): 212 Corrosivity (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, l,l,l, Trichloroethane Locking Torque Breakaway: 87-175 Prevail: 174-347 (in-lbs) Shear Strength (lb/in 2): 2500-3700 Service Temperature: (-65 to +430F): (-54 to +232C) Linear Expansion (mm/C): 2.41 x 10 -5 Hardness: Rockwell: Ml12 Decomposition Temp. (F): 548
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PERMABOND INTERNATIONAL: QUICKBOND High Speed Toughened Acrylic Adhesive System: QUICKBOND 650, 612: QUICKBOND Toughened Adhesives are two-component, no-mix acrylic adhesives that offer convenience in assembly combined with excellent peel and impact resistance, shear strength and durability. Cure of adhesive is achieved by interfacial contact of adhesive with activator. The Adhesive System cures rapidly at room temperature and bonds to oily metals, cleaned metals and plastics. It does not contain solvents. The resultant adhesive bond is load bearing and resistant to ultra-violet, radiation, weathering, humidity and high temperature conditions. Features and Benefits: * No mixing errors causing poor performance * No-mix system eliminates waste due to premature cure * 100% reactive * Room temperature cure saves energy * Cures fast for handling strength in minutes * Versatile--bonds to most materials including oily surfaces Typical Applications: * outdoor protective strips * speaker magnets * magnet to motors * honing stones * PCS stiffeners * paddle boards * elevator doors * brackets * cork clutch * nameplates * tophat stiffeners to sheetmetal * solar panels * fishing lures 612 Adhesive: Viscosity @ 25C/77F: 20,000 cps Color: translucent Solvent: none Flashpoint: 8C/47F On-part life, max.: 3 minutes 650 Adhesive: Viscosity @ 25C/77F: 30,000 cps Color: translucent Solvent: none Flashpoint: 67C/l52F On-part life, max.: 15 minutes 610 Activator: Viscosity @ 25C/77F: 100 cps Color: amber Solvent: none Flashpoint: over 93C/200F On-part life, max.: 24 hours
Adhesives-General
PERMAGILE INDUSTRIES INC.: INSULBOND Industrial and Electrical Adhesives: INSULBOND "Tough-Line" Adhesives Combine Toughness of Nylon with Adhesion and Chemical Inertness of Epoxy 810: (810
L.V.): Feature: Adjustable Flexibility Catalyst & Ratio: Cure 22 Variable (Cure 24) Mixed Viscosity: 60,000 (30,000) Pot Life: 90 Shear Al/Al psi: 3,000 Max. Service Temperature C: 130 Thermal Conductivity BTU's: 2.5 Thermal Expansion X10 -6/C: 50 Dielectric Strength Volts/Mil: 400
802: (802 L.V.): Feature: Adjustable Flexibility Transparent Catalyst & Ratio: Cure 22 Variable (Cure 24) Mixed Viscosity: 20,000 (15,000) Pot Life: 75 Shear Al/Al psi: 2,500 Max. Service Temperature C: 130 Thermal Conductivity BTU's: 1.5 Thermal Expansion X10 -6/C: 80 Dielectric Strength Volts/Mil: 400 861: Feature: Low Density Catalyst & Ratio: INSULCURE 9 9 PHR Mixed Viscosity: 2,500 Pot Life: 25 Shear Al/Al asi: 1,500 Max. Service-Temperature C: 125 Thermal Conductivity BTU's: 1.0 Thermal Expansion Xi0 -6/C: 40 Dielectric Strength Volts/Mil: 350
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PERMAGILE INDUSTRIES INC.: INSULBOND Industrial and Electrical Adhesives (Continued): 825-M: Feature: Metal Patch Catalyst & Ratio: Mix A & B I:1 Ratio Mixed Viscosity: Thixotropic Pot Life: 30 Shear Life Al/Al psi: 2,100 Max. Service Temperature C: 125 Thermal Conductivity BTU's: 12 Thermal Expansion X10 -6/C: 20 Dielectric Strength Volts/Mil: N.A. T-BOND 830: Feature: Thixotropic 1 to 1 Ratio Catalyst & Ratio: Mix A & B I:1 Ratio Mixed Viscosity: Thixotropic Pot Life: 120 Shear Al/Al psi: 3,200 Max. Service Temperature C: 100 Thermal Conductivity BTU's: 4.0 Thermal Expansion X10 -6/C: 4.0 Dielectric Strength Volts/Mil: 400 815: Feature: Fire Retardant Adjustable Flexibility Catalyst & Ratio: INSULCURE 24 Variable Mixed Viscosity: 30,000 Pot Life: 90 Shear Al/Al psi: 3,000 Max. Service Temperature C: 130 Thermal Conductivity BTU's: 2.5 Thermal Expansion X10 -6/C: 50 Dielectric Strength Volts/Mil: 400
Adhesives-General
PERMAGILE INDUSTRIES INC.: INSULBOND Special Purpose Adhesives: 820: Feature: Fast Cure 6-8 Min. Gel Transparent Catalyst & Ratio: Mix A & B I:1 Mixed Viscosity CDS: 2,000 Pot Life Min.:-5-6 . Shear Al/Al psi: 2,500 Max. Service-Temperature C: 130 Thermal Conductivity BTU's: 1.5 Thermal Expansion X10 -6/C: 75 Dielectric Strength Volts/Mil: 375 860: Feature: Flexible High Peel Strength Catalyst & Ratio: Mix A & B 3:2 Mixed Viscosity cps: 8,000 Pot Life Min.: 25 Shear Al/Al osi: 2,500 Max. Service-Temperature C: 100 Thermal Conductivity BTU's: 1.5 Thermal Expansion Xi0 -6/C: 75 Dielectric Strength Volts/Mil: 370 850: Feature: Water White R.T. Cure Tough Catalyst & Ratio: Mix A & B 100:40 Mixed Viscositv ens: 1,000 Pot Life Min.:-25‘ Shear Al/Al psi: 2,000 Max. Service-Temperature C: 130 Thermal Conductivity BTU's: 1.5 Thermal Expansion X10 -6/C: 80 Dielectric Strength Volts/Mil: 400
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PERMAGILE INDUSTRIES INC.: INSULBOND Special Purpose Adhesives (Continued): 841: Feature: High Thermal Conductivity Hard/Rigid Catalyst & Ratio: INSULCURE 9 or 17 3-4 PHR 4-5 Mixed Viscosity cps.: 90,000 Pot Life Min.: 5 hrs. (11) Shear Al/Al psi: 2,000 Max. Service‘TempeGature C: 180 Thermal Conductivity BTU's: 10.3 Thermal Expansion Xi0 -6/C: 24 Dielectric Strength Volts/Mil: 500 833: Feature: Fire Retardant Conforms to U.L. 94V-0 Catalyst & Ratio: INSULCURE 9 or 11 5-6 PHR 7-8 Mixed Viscosity cps: 2,200 (9) Pot Life Min.: 45 Shear Al/Al psi: 1,500 Max. Service Temperature C: 155 Thermal Conductivity BTU's: 4.6 Thermal Expansion X10 -6/C: 40 Dielectric Strength Volts/Mil: 425 840: Feature: Non-Flowing Sealant/Filler Catalyst & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Viscosity cps: Thixotropic Pot Life Min.: 30 (9) Shear Al/Al psi: 2,000 Max. Service Temperature C: 180 (11) Thermal Conductivity BTU's: 4.0 Thermal Expansion X10 -6/C: 40 Dielectric Strength Volts/Mil: 450
Adhesives-General
81
SAUEREISEN CEMENTS: Electric Heater Cement No. 6: Air-setting refractory for: * Appliances * Coatings * Embedding
* Heaters * Insulating * Molding
SAUEREISEN Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in powder form and need only be mixed with water to apply. Characteristics: * Resists oil, electricity, most solvents, and all acids (except hydrofluoric) * Resists temperatures up to 2500F (137OC) * Heat conductive and thermal shock resistant * Excellent abrasion resistance * Excellent for embedding and insulating * Withstands white heat * Can be applied to practically any surface * Air sets to extreme hardness * Odorless Physical Properties: Color: Tan to Gray Compessive strength: 2700 psi (189 kg/cm 2) Dielectric constant: 5.0-7.0 Dielectric strength: at 70F (2lC): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F (399C): (15.0 Volts/mil (59 Volts/mm) at 1475F (8OlC): (3.8 Volts/mil (149 Volts/mm) Maximum service temperature: 2500F (137OC) Shear strength: 300 psi (21 kg/cm 2) Tensile strength: 285 psi (20 kg/cm 2) Volume resistivity: at 70F (21C): 10 7 - 10 8 ohm-cm at 750F (398C): 10 4 - 10 5 ohm-cm at 1475F (8OlC): 10 2 - IO 3 ohm-cm
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Adhesives, Sealants and Coatings for the Electronics Industry
SAUEREISEN CEMENTS: INSA-LUTE Adhesive Cement No. 1: Strong inorganic adhesive for: * Insulating * Appliances * Metals * Assembling * Sealing * Ceramics Characteristics: * Heat conductive and thermal shock resistant * Insulates electricity * Resists all acids (except hydrofluoric) * Resists oil and fire * Resists temperature to 1800F (982C) * More economical than resins or silicones * Replaces resins for high temperature applications * Good mechanical bond * Can be colored * One part cement, ready to use * Odorless Physical Properties: Coefficient of thermal expansion: 6.2 x 10 -6 in/in/F Color: Off white Compressive strength: 3900 psi (274 kg/cm 2) Dielectric constant: 3.5-6.0 Dielectric strength: at 70F (21C): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F (399C): (15.0 Volts/mil (588 Volts/mm) at 1475F (8OlC): cl.3 Volts/rail (51 Volts/mm) Maximum service temperature: 1800F (982C) Modulus of rupture: 460 psi (32 kg/cm 2) Shear strength: 710 psi (49 kg/cm 2) Tensile strength: 410 psi (28 kg/cm 2) Volume resistivity: at 70F (2lC): 10 8 - 10 9 ohm-cm at 750F (399C): 10 4 - 10 5 ohm-cm at 1475F (8OlC): 10 2 - IO 3 ohm-cm ALUSEAL Adhesive Cement No. 2: Strong ceramic adhesive for: * Insulating * Assembling * Bonding * Sealing Characteristics: * Insulates electricity * Heat conductive * Good mechanical bond * Thermal shock resistant Physical Properties: Coefficient of thermal expansion, 200-IOOOF: 7.6 x 10 -6 in/in/F Color: White Compressive strength, 7 days: 3600 psi Density: 153 pcf (2.45 gm/cm 3) Dielectric constant @ 70F: 107.2 Dielectric strength @ 70F: 49 volts/mil Dissipation factor @ 70F: 0.55 Maximum service temperature: 3000F
Adhesives-General
83
SAUEREISEN CEMENTS: INSA-LUTE Hi-Temp Cement No. 7: High-grade silica refractory for: * Heaters * Appliances * Soldering Irons * Assembling * Coating * Switches SAUEREISEN INSA-LUTE Hi-Temp Cement No. 7 is a highgrade silica cement used by leading electrical manufacturers for assembling, coating resistors, embedding resistance wires and high-temperature insulation applications. Characteristics: * Heat conductive and thermal shock resistant * Resists electricity * Resists oil, most solvents and all acids (except hydrofluoric) * Adheres to glass, porcelain, metal and wood * Resists temperature to 2500F (1371C) * Replaces organics for high heat protection * More economical than organics * Odorless Physical Properties: Coefficient of thermal expansion: 6.0 x 10 -6 in/in/F Color: White Compressive strength: 3500 psi (246.1 kg/cm 2) Dielectric constant: 3.5-6.0 Dielectric strength: at 70F (21C): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F (399C): ~15.0 Volts/mil (588 Volts/mm) at 1475F (802C): cl.3 Volts/mil (51 Volts/mm) Maximum service temperature: 2500F (1371C) Shear strength: 600 psi (42.2 kg/cm 2) Tensile strength: 400 psi (28.1 kg/cm 2) Volume resistivity: at 70F (21C): 10 8 - 10 9 ohm-cm at 750F (399C): IO 4 - 10 5 ohm-cm at 1475F (802C): 10 2 - 10 3 ohm-cm
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SAUEREISEN
CEMENTS:
SAUEREISEN
Synthetic ceramic for: * Assembling * Insulating * Molding
Cement No. 31: * Potting * Refractories * Sealing
SAUEREISEN Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications, including assembling, sealing, insulating and cementing of porcelain, tile, ceramics, metal, wood and glass.
Characteristics: * Adheres to practically all surfaces that are clean and free of oil and grease * Resists oil, electricity, and most solvents * Heat conductive and thermal shock resistant * Resists all acids (except hydrofluoric) * Fireproof and qasproof * Resists temperatures to 1750F (954C) Physical Properties: Absorption: 13.8% Bond strength: 200 psi (14 kg/cm 2) Coefficient of thermal expansion: 6.5 x 10 -6 in/in/F (11.3 x 10 -6 cm/cm/C) Color: Off white Compressive strength: 2200 psi (154 kg/cm 2) Density: 121 pcf (1.94 gm/cm 2) Dielectric constant: 5.0-7.0 Dielectric strength: at 70F (21C): 12.5 to 38.0 Volts/mil (490 to 1490 Volts/mm) at 750F (399C): 12.5 to 38.0 Volts/mil (490 to 1490 Volts/ mm) at 1475F (8OlC): (2.0 Volts/mil (78 Volts/mm) Flexural strength: 455 psi (31 kg/cm 2) Linear shrinkage: 0.004 in/in (0.004 cm/cm) Maximum service temperature: 1750F (954C) Shear strength: 430 psi (30 kg/cm 2) Tensile strength: 400 psi (28 kg/cm 2) Volume resistivity: at 70F (21C): 10 9 - 10 11 ohm-cm at 750F (399C): 10 7 - 10 8 ohm-cm at 1475F (8OlC): 10 2 - 10 3 ohm-cm
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SAUEREISEN CEMENTS: SAUEREISEN Electric Insulating Cement No. 12: Excellent dielectric strength for: * Encapsulating * Embedding * Elements * Resistors * Potting * Assembling SAUEREISEN Electric Insulating Cement No. 12 is a two-part, inorganic cement used for applications requiring high dielectric strength and volume resistivity. However, the cement does not reauire firina at elevated temueratures to achieve its maximum properties. No. 12 will withstand temperatures to 2200F. No. 12 bonds extremely well to high alumina ceramics. Low shrinkage makes No. 12 an excellent cement for potting applications. No. 12 will not arc or support combustion. The cement does not give off toxic or noxious fumes during mixing, application, cure or heating. Characteristics: * High dielectric strength * Heat conductive and thermal shock resistant * Resists temperature to 2200F (1204C) * Oil and solvent resistant * Specially developed for potting and encapsulation * Excellent bond strength * Extremely hard surface upon setting/excellent abrasion resistance * Chemically setting at room temperature * Odorless Physical Properties: Coefficient of thermal expansion: 3.1 x 10 -6 in/in/F (5.58 x 10 -6 cm/cm/C) Color: Off white Compressive strength: 4000 psi (281 kg/cm 2) Density: 180 pcf (2.88 gm/cm 3) Maximum service temperature: 2200F (1204C) Modulus of rupture: 510 psi (35 kg/cm 2) Shrinkage: ~0.8% Tensile strength: 290 psi (20 kg/cm 2) Thermal conductivity: 8.0-11.0 Btu-in/ft 2-hr-F (2.74-3.77 x 10 -3 Cal-cm/cm 2-set-C)
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SAUEREISEN CEMENTS: SAUEREISEN Electric Refractory Cement No. 350: SAUEREISEN Electric Refractory No. 350 is a chemicalsetting refractory cement for assembling and bonding ceramic shapes; potting: and coating electric heating elements, resistors and induction heating coils. It can be used as a wash coating for sand-resin bodies and as a refractory coating. No. 350 exhibits excellent coating properties and can be applied by dipping, spraying, pouring or automatic dispenser. Characteristics: * Refractory - withstands temperatures to 1700F (927C) * Heat conductive and thermal shock resistant * Insulates electricity * Resists oil, solvents and most acids * Excellent coating/potting properties * Odorless, non-toxic Physical Properties: Color: Gray Compressive strength: 2000 psi (141 kg/cm 2) Density: Wet: 124 pcf (1.99 gm/cm 3) Dry @ 220F (104C): 99 pcf (1.59 gm/cm 3) Dielectric strength @ 70F (21C): 3.26 volts/mil (127 volts/mm) Dielectric constant: 8.08 Flexural strength: 1100 psi (77 kg/cm 2) Maximum service temperature: 1700F (927C) Modulus of elasticity: 6.57 x 10 4 psi (4.5 x 10 3 kg/cm 2) Pot life: 1 hr Tensile strength: 507 psi (35.2 kg/cm 2)
Adhesives-General
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SAUEREISEN CEMENTS: SAUEREISEN Electric Resistor Cement No. 78: Electrical refractory for: * Elements * Heaters * Hot Plates
* Irons * Ovens * Resistors
SAUEREISEN Electric Resistor Cement No. 78 is an ideal electrical refractory cement for coating resistors, coils, electric heating elements, furnaces, and embedding resistance wire. It replaces insulating varnish, enamel, mica, etc. The cement is also available in powder form known as SAUEREISEN Electric Resistor Cement No. P-78. When mixed with water to the proper consistency, No. P-70 has the same characteristics as No. 70. Characteristics: * Heat conductive and thermal shock resistant * Safely insulates electricity * Resists oil, solvents and most acids * Resists temperatures to 2600F (1427C) * Odorless Physical Properties: Coefficient of thermal expansion: 13.0 x 10 -6 in/in/F (23.4 x 10 -6 cm/cm/C) Color: Tan to Gray Compressive strength: 3300 psi (232 kg/cm 2) Dielectric constant: 3.4-4.5 Dielectric strength: at 70F (21C): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F‘(399C): (15.0 Volts/mil ?588 Volts/mm) at 1475F (8OlC): (1.3 volts/mil (51 Volts/mm) Maximum service temoerature: 2600F (1427C) Shear strength: 375.psi (26.4 kg/cm‘2) Tensile strength: 325 psi (22.8 kg/cm 2) Volume Resistivity: at 70F: 10 8 - 10 9 ohm-cm at 750F: 10 5 - IO 6 ohm-cm at 1475F: 10 3 - 10 4 ohm-cm
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SAUEREISEN
A * * *
CEMENTS:
SAUEREISEN
Electrical Cement No. DW-30:
porcelain-like sealer for: * Heaters Appliances * Insulating Elements * Cutlery Embedding
SAUEREISEN Electrical Cement No. DW-30 is an inorganic, chemically-setting, magnesium oxide base material which develops a slight expansion while hardening into a porcelain-like body. Since No. DW-30 is dimensionally stable from -1OOF to +900F and will not injure resistance wires at elevated temperatures, it is recommended for embedding heating elements and resistor wires. No. DW-30 is also recommended for cementing knife blades into plastic, ceramic, wood or metal handles, weighting candlesticks or similar items, or sealing set screws. No. DW-30 is supplied as a powder and need only be mixed with water to apply. Characteristics: Insulates electricity Refractory and fireproof Withstands temperatures to 900F (48X) Heat conductive and thermal shock resistant Resists water and most solvents Strong porcelain-like body Non-shrink Odorless Chemical set Physical Properties: Color: Tan/pink Compressive strength: 4500 psi (316 kg/cm 2) Density: 120 pcf (2 gm/cm 3) Maximum service temperature: 900F (482C) Tensile strength: 300 psi (21 kg/cm 2)
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SAUEREISEN CEMENTS: SAUEREISEN Electrical Refractory Cement No. 75: Calcium Aluminate castable cement for: * Gunning * Corrosion Resistance * Potting * Assembling * Sealing * Thermal Shock SAUEREISEN Electrical Refractory Cement No. 75 is a castable, hydraulically-setting cement. It is recommended as a bonding mortar or refractory coating and for embedding, potting, sealing, assembling, encapsulating, and insulating. It has excellent thermal shock resistance. Characteristics: * Insulates electricity at high and low temperatures * Withstands temperatures to 2600F (1427C) * Heat conductive and thermal shock resistant * Unaffected by water and moisture * Low shrinkage * Resists solvents, alkalies, and mild acids * Resists impact and abrasion * Easy to use/odorless * Adheres to metal, ceramics, brick, and other surfaces * High strength * Good volume stability * Unaffected by carbon monoxide or other reducing atmospheres * Hardens by hydraulic set even in confined areas * More economical than organics Physical Properties: Autoclave expansion: 0.04% Compressive strength: 3500 psi (246 kg/cm 2) Density: 150 pcf (240 gm/cm 3) Flexural strength: 800 psi (56 kg/cm 2) Maximum service temperature: 2600F (1427C) pH range: 4.0 thru 12.0
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SAUEREISEN CEMENTS: SAUEREISEN ELECTROTEMP Cement No. 8: Superior electrical insulation for: * Appliances * Heaters * Elements * Pyrometers * Furnaces * Resistors SAUEREISEN ELECTROTEMP Cement No. 8 is primarily used where high electrical insulation and thermal conductivity are desired. No. 8 is a non-corrosive, chemical-setting zircon base cement ideal for potting applications subject to high temperature and/or thermal shock. No. 8 is supplied in powder form and need only to be mixed with water to apply. Characteristics: * Provides maximum electrical resistance * Heat conductive and thermal shock resistant * Excellent bonding properties * Chemical set * Easy to mix and apply * Ideal for potting applications * Odorless Physical Properties: Coefficient of thermal expansion: 2.6 x 10 -6 in/in/F Color: Off white Compressive strength: 4500-5500 psi (316 kg/cm 2) Density: 160 pcf (2.56 gm/cm 3) Dielectric constant: 3-O-4.0 Dielectric strength: at 70F (21C): 76.0 to 101.5 Volts/mil (2900 to 3900 Volts/mm) at 750F (398C): 25.0 to 38.0 Volts/mil (980 to 1490 Volts/mm) at 1475F (8OlC): 12.5 to 25.0 Volts/mil (490 to 980 Volts/mm) Maximum service temperature: 2600F (1426C) Modulus of rupture: 450 psi (31 kg/cm 2) Tensile strength: 250 psi (17 kg/cm 2) Thermal conductivity: IO-12 Btu-in/ft 2-hr-F (3.4-4.1 x 10 -3 Cal-cm/cm 2-set-C) Volume resistivitv: at 70F (21C): i0 10 - 10 11 ohm-cm at 750F (398C): 10 9 - IO 10 ohm-cm at 1475F (8OlC): 10 8 - 10 9 ohm-cm
Adhesives-General
SAUEREISEN CEMENTS: SAUEREISEN INSULTEMP Cement No. 10: Superior electrical insulation/thermal conductivity for: * Heating Elements * Resistors * Induction Coils * Light Bulb Assembly SAUEREISEN INSULTEMP No. 10 is primarily used where high electrical insulation and/or thermal conductivity are desired and it is impractical to use a cement which must be fired at a high temperature. No. 10 offers the highest thermal conductivity and lowest coefficient of thermal expansion, making it the ideal material for high temperature ceramic bonding/ potting applications. Characteristics: * Heat conductive and thermal shock resistant * High electrical resistance * Excellent bonding properties * Chemical set * Low shrinkage * Mix with water Physical Properties: Coefficient of thermal expansion: 2.26 x 10 -6 in/in/F (4.06 x 10 -6 cm/cm/C) Color: White Compressive strenqth, 7 days: 2,500 psi (175 kg/cm 2) Density: 146 pcf (2.34 qm/cm 3) Dielectric constant @ 70F: 6.86 Dielectric strength @ 70F: 55 Volts/mil (2090 volts/mm) Maximum service temperature: 2400F (1316C) Modulus of rupture: 800 psi Tensile strength: 400 psi Thermal conductivity: 18-20 Btu-in/ft 2-hr-F 6.15-6.83 Cal-cm/cm 2-set-C Volume Resistivity @ 70F: 1.46 x 10 10 ohm-cm
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SAUEREISEN CEMENTS: SAUEREISEN Low Expansion Cement No. 29: Zircon base cement for: * Assembling * Elements * Embedding
* Insulating * Resistors * Sealing
SAUEREISEN Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements; insulating thermocouples; coating resistors and coils; sealing and assembling parts which require high resistance to electricity, chemicals, and thermal shock; and aerospace applications. No. 29 adheres to glass, porcelain, ceramics, metals and other surfaces. Characteristics: * Resists water, oil, electricity, most solvents, and all acids (except hydrofluoric) * Resists temperatures to 1550F (843C) as well as cryogenic conditions * Excellent mechanical strength * Heat conductive and thermal shock resistant * Ceramic-like body * Odorless * Chemical set Physical Properties: Absorption: IO-12% Coefficient of thermal expansion: 4.6 x 10 -6 in/in/F (8.28 x 10 -6 cm/cm/C) Color: Tan Compressive strength: 3900 psi (274 kg/cm 2) Density:,141 pcf (2.26 gm/cm 3) Dielectric constant: 5-O-7.0 Dielectric strength: at 70F (21C): 25.0 to 51.0 Volts/mil (980 to 2000 Volts/mm) at 750F (399C): 12.5 to 25.0 Volts/mil (490 to 980 Volts/ mm) at 1475F (8OlC): Cl.3 Volts/mil (51 Volts/mm) Maximum service temperature: 1550F (843C) Shrinkage: 0.50% Tensile strength: 425 psi (29 kg/cm 2) Thermal conductivity at 500F (260C): 8 Btu-in/ft 2-hr-F (2.7 x 10 -3 Cal-cm/cm 2-set-C!) Volume resistivity: at 70F (21C): 10 7 - IO 9 ohm-cm at 750F‘(399C): 10 4 - 10 6 ohm-cm at 1475F (8OlC): 10 2 - 10 3 ohm-cm
Adhesives-General
SHELDABL: SHELDAHL Bonding Materials: Unsupported Acrylic Adhesive T1615 (MUC): T1615 is an unsupported acrylic adhesive on a release carrier. This cast adhesive can be used in a variety of bonding applications. It has excellent adhesion to polyimide film, copper foils, (treated and untreated) and etched circuits as a bond ply. * * * * *
Excellent shelf life stability at ambient temperatures. Excellent dimensional stability during adhesive bonding. Lot-to-lot consistency. Low flow adhesive system minimizes adhesive squeezeout. Excellent electrical properties.
Properties: Peel Strength: As received: Treated copper: 8.0 lbs/in Shiny copper: 5.0 lbs/in After solder: Treated copper: 8.0 lbs/in Shiny copper: 5.0 lbs/in After thermal cvclins: Treated conoer: 8.0 lbs/in __ Dimensional Stability: _ Method B: .OOl" in/in Method C: .002" in/in Adhesive Flow: .005" in. Volatile Content: 1.5% volatiles Solder Float: 5 minutes: 550F 30 seconds: 600F Chemical Resistance: % of As Received Peel Strength: Isopropyl Alcohol: 90 Toluene: 90 MEK: 90 Methylene Chloride/Trichloroethylene (50/50): 90 2N NHCl: 90 2N NaOH: 90 RISTON Stripper S 1100X: 90 Sequential: Methylene Chloride: 2N NaOH: 90 2N H2S04: Insulation Resistance: 1 x 10 5 Dielectric Strength: 1000 Moisture Absorption: 5.5
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SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400:
SHELDAHL:
T-100: Unsupported Adhesive T-300: Adhesive on Polyester Film T-400: Adhesive on Both Sides of Polyester Film Unsealed tape is milky-white becoming clear when sealed: Visible evidence of seal Not sticky or tacky: Easy to apply Solvent-free adhesive system: No drying time Thermally activated adhesive system: Allows efficient processing High bond strength to a variety of substrates Five year shelf life when stored in ambient conditions T-100: 2.5 mil polyester based thermoplastic resin Physical: Ultimate tensile strength, psi: 840 Elongation %: 550 Propagating tear strength gm/mil: 152 Initial tear strenqth sm/mil: 160 Moisture Absorption %:-I;2 Water Vapor Permeability: 89.0 Hvdrosen Permeability: 277 F&g& Resistance: Inert Shelf Life, Yrs: >5 Bond Strength lb/in: 4 Density: 1.26 Dimensional: Area Factor ft Z/lb/mil: 153 Thickness Tolerance, %: +-lo max. Thermal: Melting Temperature Range F: 280-340 Service Temperature Intermittent, F: 260 Service Temperature Continuous, F: 180 El.ectrical: Dielectric Strength, volts/mil: 1000 Dielectric Constant: 4.6 Dissipation Factor: .13 Volume Resistivity ohm/cm: 1x10 13 Surface Resistivity, ohms: 3x10 9
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SHELDAHL: SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400 (Continued): T-300: I mil polyester resin on 1 mil polyester film Physical: Ultimate tensile strength, psi: 22,200 Elongation %: 120 Tensile modulus. osi: 500,000 Propagating tear strength'gm/mil: 85.5 Initial tear strength gm/mil: 222 Folding endurance I/2 kg loading: 50,000 Moisture Absorption %: 0.8 Water Vapor Permeability: 1.0 Hydrogen Permeability: 235 Fungus Resistance: Inert Shelf Life, Yrs.: >5 Bond Strength lb/in: 4 Density: I.33 Dimensional: Area Factor ft 2/lb/mil: 146 Thickness Tolerance, 8: +-lo max. Coefficient of linear expansion, inch/F: 1.5x10 -5 Coefficient of hygroscopic expansion inches/inch/% R.H.: 11x10 -6 Thermal: Melting Service Service Thermal
Temperature Range F: 280-340 Temperature Intermittent, F: 260 Temperature Continuous, F: 180 Shrink I/2 hr at 300F, 8: 1.25
Electrical: Dielectric Strength. volts/mil: 4000 Dielectric Constant: 3.4 Dissipation Factor: 0.005 Volume Resistivity ohm/cm: 1x10 17 Surface Resistivity, ohms: 5x10 II
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SHELDAHL: SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400 (Continued): T-400: 1 mil polyester resin on both sides of 2 mil polyester film Physical: Ultimate tensile strength, psi: 22,200 Elongation %: 130 Tensile modulus, psi: 550,000 Propagating tear strength gm/mil: 70 Initial tear strength gm/mil: 250 Folding endurance l/2 kg loading: 50,000 Moisture Absorption %: 0.8 Water Vapor Permeability: 1.0 Hydrogen Permeability: 200 Fungus Resistance: Inert Shelf Life, Yrs.: >5 Bond Strength lb/in: 4 Density: 1.33 Dimensional: Area Factor ft Z/lb/mil: 146 Thickness Tolerance, %: +-lo max. Coefficient of linear expansion, inch/F: 1.5x10 -5 Coefficient of hygroscopic expansion inches/inch/% R.H.: 11x10 -6 Thermal: Melting Service Service Thermal
Temperature Range F: 280-340 Temperature Intermittent, F: 260 Temperature Continuous, F: 180 Shrink l/2 hr at 300F, 8: 1.25
Electrical: Dielectric Strength, volts/mil: 3500 Dielectric Constant: 3.3 Dissipation Factor: 0.005 Volume Resistivity ohm-cm: 1x10 17 Surface Resistivity, ohms: 3x10 9
Adhesives-General
3M
co.: High Performance Adhesives for the Electrical and Electronics Industry:
Two-Part Epoxies: SCOTCH-WELD DP-100 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Clear Viscosity (cps): B-12,000 A-14,000
@ 23C
Mixed Work Life @ 23C: 3-5 Min. Handling Strength @ 23C: 15-20 Min. Full Cure Schedule: 24-28 Hr. @ 23C or 1-2 Hr. @ 65C Shore D Hardness: 81 Comments: Low viscosity Rigid Good for component sealing Clear Meets corrosion resistance requirements Mil-S-46163 SCOTCH-WELD DP-100 NS Epoxy Adhesive: Base Resin: Epoxy Mix Ratio: I:1 Color: Translucent Viscosity (B:A): B-100,000 A- 90,000 @ 23C Mixed Work Life (a 23C: 3-5 Min. Handling Strength @ 23C: 15-20 Min. Full Cure Schedule: 24-48 Hr. @ 23C or l- 2 Hr. @ 65C Shore D Hardness: 80-85 Comments: Non-sag version of DP-100 SCOTCH-WELD DP-110 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): I:1 Color: Translucent Gray Viscosity (cps): B: 30,000 A: 30.000 (d 23C Mixed Work Life @ 23C:'9-IO-Min. Handling Strength @ 23C: 20-30 Min. Full Cure Schedule: 48-72 Hr @ 23C or I- 2 Hr:' @ 65C Shore D Hardness: 40-45 Comments: Flexible Translucent/Gray Fast cure Good for structural bonding
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3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): Two-Part Epoxies(Continued): SCOTCH-WELD DP-190 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Gray Viscosity (cps): B-100,000 A- 52,000 @ 23C Mixed Work Life @ 23C: 90 Min. Handling Strength @ 23C: 12-16 Hr. Full Cure Schedule: 7D @ 23C or 2 Hr. @ 65C Shore D Hardness: 76 Comments: High flexibility Good adhesion to metals, ceramics & plastics Good for structural bonding SCOTCH-WELD DP-260 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Translucent Viscosity (cps): B-90,000 A-50,000 @ 23C Mixed Work Life (a 23C: 50-60 Min. Handling Strength @ 23C: 4-6 Hr. Full Cure Schedule: 2D @ 23C or 1 Hr. @ 80C Shore D Hardness: 83 Comments: Noncorrosive to copper Meets corrosion resistance requirements of Mil-S-4616 Non-exothermic potting compounds Clear version is crystal clear SCOTCH-WELD DP-270 Potting Compound/Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Clear Biack Viscosity (cps): B-22,000 ~-18,000 @ 23C Mixed Work Life @ 23C: 60-70 Min. Handling Strength @ 23C: 4-6 .Hr. Full Cure Schedule: 2D @ 23C or 1 Hr. @ 80C Shore D Hardness: 82 Comments: Noncorrosive to copper Meets corrosion resistance requirements of Mil-S-46163 Non-exotherming potting compounds Clear version is crystal clear
Adhesives-General
3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): Two-Part Epoxies(Continued): SCOTCH-WELD DP-420 EPOXY Adhesive: Base Resin: Epoxy- Mix Ratio (B:A): 2:l Color: Off White Viscosity (cps): B-80,000 A-10,000 @ 23C Mixed Work Life @ 23C: 20 Min. Handling Strength @ 23C: 2-3 Hr. Full Cure Schedule: 3-4 D @ 23C l-2 Hr. @ 65C Shore D Hardness: 80 Comments: High peel and shear strength Excellent durability Controlled flow SCOTCH-WELD DP-460 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 2:l Color: Off White Viscosity (cps): B-80,000 A-10,000 @ 23C Mixed Work Life @ 23C: 60 Min. Handling Strength @ 23C: 4-6 Hr. Full Cure Schedule: 7D @ 23C or 2 Hr. @ 65C Shore D Hardness: 80 Comments: High peel and shear strength Excellent durability Controlled flow SCOTCH-WELD 1838 B/AL Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Translucent Viscosity (cps): B-11,000 A-10,000 @ 23C Mixed Work Life @ 23C: 90 Min. Handling Strength @ 23C: 8-10 Hr. Full Cure Schedule: 7D @ 23C or 2 Hr. @ 65C Shore D Hardness: 66 Comments: Excellent environmental resistance Low viscosity Rigid Good for potting
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3M co. : High Performance Adhesives for the Electrical and Electronics Industry(Continued): Two-Part Urethanes: SCOTCH-WELD DP-605 Urethane Adhesive: Base Resin: Urethane Mix Ratio (B:A): I:1 Color: Off White Viscosity (cps): B-100,000 A-175.000 B 23C Mixed work Life @ 23C:'3-5 Min. Handling Strenqth @ 23C: 15-20 Min. ~~11 Cure Schedule: 24-48 Hr. @ 23C l-2 Hr. @ 65C Shore D Hardness: 50 Comments: Very flexible, Shore A Hardness--92 Impact resistant Non-sag Excellent plastic adhesion One-Part Epoxies: SCOTCH-WELD 1386 Epoxy Adhesive: Base Resin: Epoxy Color: Cream Viscosity (cps): Syrup 200,000 @ 23C Full Cure Schedule: 60 Min @ 177C or 10 Min @ 204C or 5 Min @ 232C Shore D Hardness: 75 Comments: High strength at elevated temperatures Good impregnation resin Meets Mil-A-8623A, Type III SCOTCH-WELD 2214 Regular Epoxy Adhesive: Base Resin: Epoxy Color: Gray Viscosity (cps): Paste 130 Set @ 23C Full Cure Schedule: 40 Min @ 12lC or 10 Min @ 149C or 5 Min @ 177C Shore D Hardness: 81 Comments: High temperature resistant High impact strength Metallic filled Meets MMM-A-132, Type 1, Class 3
Adhesives-General
3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): One-Part Epoxies(Continued): SCOTCH-WELD 2214 Hi-Flex Epoxy Adhesive: Base Resin: Epoxy Color: Gray Viscosity (cps): Paste 200 Set @ 23C Full Cure Schedule: 40 Min. @ 121C or 10 Min. @ 149C or 5 Min. @ 177C Shore D Hardness: 81 Comments: Flexible Deaerated Metallic filled SCOTCH-WELD 2214NMF Epoxy Adhesive: Base Resin: Epoxy Color: Cream Viscosity (cps): Paste 100 Set @ 23C Full Cure Schedule: 40 Min. @ 121C or 10 Min. @ 149C or 5 Min. @ l77C Shore D Hardness: 84 Comments: Good electrical properties Non-metallic filled SCOTCH-WELD 2290 Epoxy Adhesive: Base Resin: Epoxy Color: Amber Viscosity (cps): Solution 40-80 cps Full Cure Schedule: Dry 15 Min. @ 121C (B-Stage) Cure 30 Min. @ 177C Shore D Hardness: Comments: 21% solids, B-stageable Passes solder float @ 288C Hot Melts: --___ JET-MELT 3748 Hot Melt Adhesive: Base Resin: Polypropylene Color: Translucent Viscosity (cps): 5000 @ 19OC Bonding Range/Set Time: 45-50 sec. Shore D Hardness: 25 Comments: Excellent hot/cold thermal shock resistance Noncorrosive to copper Good polyolefin adhesion UL94 v-2
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3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): Hot Melts(Continued): JET-MELT 3764 Hot Melt Adhesive: Base Resin: Ethylene vinyl acetate Color: Clear Viscosity (cps): 10,500 @ 19OC Boiling Range/Set Time: 35-40 sec. Shore D Hardness: 18 Comments: Bonds to polyolefins Good shock resistance Low cost, clear UL 94 v-2 JET-MELT 3779 Hot Melt Adhesive: Base Resin: Polyamide Color: DK Amber Viscosity (cps): a000 @ 19OC Bonding Range/Set Time: 25-30 sec. Shore D Hardness: 45 Comments: High temperature resistance UL 94 v-o Cyanoacrylates: PRONTO CA-4OH Instant Adhesive: Base Resin: Cyanoacrylate (ethyl) Color: Clear Viscosity (cps): 400-600 @ 23C Bonding Range/Set Time: l-30 Set w/o Activator Full Cure Schedule: 12-24 Hr. @ 23C Shore D Hardness: 83 Comments: Higher viscosity version of CA-40 Meets Mil-A-46050C PRONTO CA-50 Gel Instant Adhesive: Base Resin: Cyanoacrylate (ethyl) Color: Clear Viscosity (cps): 50,000 @ 23C Bonding Range/Set Time: 60-120 Set w/o Activator Full Cure Schedule: 12-24 Hr. @ 23C Shore D Hardness: M73 Rockwell Comments: Slowest cure time Non-sag, non-running Allows .020" gap filling
Adhesives-General
High Performance Adhesives for the Electrical and Electronics Industry(Continued):
3M co.:
Cyanoacrylates(Continued): PRONTO CA-100 Instant Adhesive: Base Resin: Cyanoacrylate (ethyl) Color: Clear Viscosity (cps): 3000 @ 23C Boiling Range/Set Time: 35-60 Sec. w/o Activator Full Cure Schedule: 12-24 Hr. @ 23C Shore D Hardness: M50 Rockwell Comments: Slow cure Tough, impact resistant Meets Mil-A-46050C, Type II, Class 3 Bondinq Film: SCOTCH-WELD 4060 Thermoplastic Film Adhesive: Base Resin: Ethvlene Acrvlic Acid Co-oolvmer _ _ Color: Translucent Viscosity (cps): 3 mil and 5.5 mil unsupported film Full Cure Schedule: Bring Bondline to 150C then cool Shore D Hardness: 52 Comments: Thermoplastic film Low flow at bonding temperature Excellent solvent resistance Shore A Hardness--93
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THERMOSET PLASTICS, INC.: Electronic Grade Adhesives One Component/Elevated Temperature Curing: EP-233: Thixotropic formula with a slight degree of flow for venetration into bonds. Available in several colors and viscosities. Good thermal conductivity. Mixed Viscosity: Thixotropic, slightly flowable Mix Ratio: One Part Shelf Life @ 25C: 3-6 MO. Typical Cure Schedule: 60 Min. @ 12OC Method of Application: Automatic Dispensing/Syringe Weight of Tubular Extrusion: 0.00372 lbs (1.6867 grams) Specific Gravity @ 25C: 1.68 Color Resin/Hardener Mixed: Gray Tensile Shear Strength @ 25C (Substrate indicated): 1,800 psi (Al/Al) DC-232: Clear, low viscosity, unfilled. Provides excellent impregnation to fine void spaces. Formulated with a degree of high temperature flexibility to withstand thermal cycle stress. Appropriate for closely fitting substrates. Mixed Viscosity @ 25C: 1,500 cps Mix Ratio: One Part Approx. Shelf Life @ 25C: 3 MO. Typical Cure Schedule: 4-6 Hrs. @ 12OC Method of Application: Brush/Automatic Dispensing/Syringe Weight of Tubular Extrusion: 0.00237 lbs (1.0743 grams) Specific Gravity @ 25C: 1.07 Color Resin/Hardener Mixed: Clear Tensile Shear Strength @ 25C (Substrate indicated): 1,700 psi (Al/Al) EP-539: High peel strength, thermally conductive, moderately fast curing. High viscosity, but slightly flowable. Mixed Viscosity @ 25C: 250,000 cps Mix Ratio: One Part Approx. Shelf Life @ 25C: l-3 MO. Tvnical Cure Schedule: 40 Min B 12OC Method of Application: Automatic Dispense/Syringe Weight of Tubular Extrusion: 0.00418 lbs (1.8976 grams) Specific Gravity @ 25C: 1.89 Color Resin/Hardener Mixed: Black Tensile Shear Strength @ 25C (Substrate indicated): 2,000 psi (Al/Al)
Adhesives-General
THERMOSET PLASTICS, INC.: Electronic Grade Adhesives One Component/Elevated Temperature Curing (Continued): EP-548: Light bodied paste. Very fast cure. Frequently used in high volume bonding of small dimension parts. Mixed Viscosity @ 25C: Paste Mix Ratio: One Part Approx. Shelf Life @ 25C: 2 MO. Typical Cure Schedule: 2 Min. @ 130C (at bond line) Method of Application: Automatic Dispense/Syringe Weight of Tubular Extrusion: 0.00261 lbs (1.847 grams) Suecific Gravitv B 25C: 1.18 Color Resin/Hardener Mixed: Yellow Tensile Shear Strength @ 25C (Substrate indicated): 1,500 psi (Al/Al) EP-598: Heavy bodied paste which will not sag on a vertical surface during an elevated temperature cure. Mixed Viscosity @ 25C: Paste Mix Ratio: One Part Approx. Shelf Life @ 25C: 2 MO. Typical Cure Schedule: 2 Hrs. @ 12OC Method of Application: Automatic Dispense/Spatula Weight of Tubular Extrusion: 0.00338 lbs. (1.5361 grams) Specific Gravity @ 25C: 1.53 Color Resin/Hardener Mixed: Tan Tensile Shear Strength @ 25C (Substrate indicated): 1,900 psi (Al/Al)
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THERMOSET PLASTICS, INC.: Surface Mount Adhesives: standard Syringe Dispense: ME 147: Yellow Viscosity @ 25C (cP): 125,000 Thixotropic Index (lRPM/lORPM): 4.8 Specific-Gravity: 1.21 Cure Schedule (IR Oven): 2 minutes @ 12OC Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2 Syringe Dispense for High Stand-off Components and Screen Printing: ME 160: Red Other Application Methods: Hardware Pin Transfer Viscosity @ 25C (cP): 200,000 Thixotropic Index (lRPM/lORPM): 6.5 Specific Gravity: 1.13 Cure Schedule (IR Oven): 2 Minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2 Hardware Pin Transfer: ME 133: Yellow Other Application Methods: Syringe Dispense/Screen Print Viscosity @ 25C (cP): 100,000 Thixotropic Index (lRPM/lORPM): 4.0 Specific Gravity: 1.21 Cure Schedule (IR Oven): 2 minutes @ 120~ Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2
Adhesives-General
THERMOSET PLASTICS, INC.: Surface Mount Adhesives
(Continued):
Hardware Pin Transfer(Continued): ME
161: Red Other Application Methods: Syringe Dispense/Screen Print Viscosity @ 25C (cP): 350,000 Thixotropic Index (lRPM/lORPM): 7.0 Specific Gravity: 1.13 Cure Schedule (IR Oven): 2 minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2
ME 163: Red Other Application Methods: Syringe Dispense/Screen Print Viscosity @ 25C (cP): 150,000 Thixotropic Index (lRPM/lORPM): 5.0 Scecific Gravitv: 1.13 &re Schedule (IR Oven): 2 minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2 Software Pin Transfer: ME 127: Yellow Other Application Methods: Syringe Dispense Viscosity @ 25C (cP): 36,000 Thixotrocic Index (lRPM/lORPM): 2.5 Specific-Gravity: i.22 Cure Schedule (IR Oven): 2 minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 1,500 Thermal Conductivity (W/mK): 0.2
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J.H. YOUNG CO., INC.: Temporary Adhesives and Waxes: The J.H. Young Company manufactures a line of temporary adhesives and waxes. In general, these products are used to hold down glass lenses, prisms, semiconductors, or ceramics and ferrites during all phases of production. These waxes are used when mechanical clamping is not reasonable. They are temporary, and are easily removed when the process is complete, using a solvent or other means. The terms used in the industry, such as "wax" and "pitch" often have little to do with the ingredients of these materials. Here are some common applications: Semiconductors: Most work in semiconductors or ceramics would use stacking waxes. Applications include polishing and dicing. The 7036 is widely used in these fields because of its resistance to solvents and pH extremes. (7036 is easily removed with acetone). Application details vary widely with circumstances. The best bonds are achieved when the workpiece, the substrate and the wax are all at least warm (roughly 200F, IOOC). Naturally, the thinnest glue line is achieved when all are hot (roughly 400F, 2OOC). For some users, a hair-dryer may provide the necessary heat. Ceramics: The chief application in ceramics is in polishing recording heads, mostly for computer disks. Blocking: An inexpensive material is generally used to hold lenses with a noticeable curvature to an alumimum or cast iron block. Blanchard Grinding: A Blanchard Grinder is used to grind a lens blank to the intended curvature. Stacking or Edging: Many flat pieces are stacked together so the edges may be ground to size. Centering: A finished lens is mounted against the end of a tube which fits in a lathe. Polishing Other
Section II Adhesives Cyanoacrylate
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APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives: SUPERSET increases productivity and offers substantial cost saving advantages: - Eliminates fastening procedures such as drilling, tapping, riveting, brazing, soldering, etc. saving time, space and manpower. - Eliminates heat curing. - Eliminates clamping. - Frees up space required to store parts during bond cure. - Can be automatically dispensed. SUPERSET is convenient and easy to use: - Applies directly from bottle. - Contains no solvents. - Is non-flammable. - Does not require special ventilation equipment. SUPERSET improves product design: - Eliminates the need for bulky fasteners. - Improves strength by the reduction of stress points associated with metal fasteners. - Reduces weight by the elimination of metal fasteners. - Provides more variety due to the ability to bond dissimilar materials without special assembly techniques and the ability to use materials which cannot be brazed, welded or soldered. SUPERSET Cyanoacrylate Adhesives are available in two different types: Ethyl and Methyl. Ethyl Cyanoacrylates are recommended for use where bonding rubber and plastic together or in combination with metals. Methyl Cyanoacrylates are recommended when bonding metal to metal. SUPERSET Accelerator: SUPERSET Adhesives are the fastest and most economical approach to bonding. They can be used on an unlimited number of substrates of similar materials. However, when bonding dissimilar metals or surfaces that contain an acidic residue, a slow or inhibited cure may result. This can easily be prevented by the use of SUPERSET Accelerator. SUPERSET Accelerator can also be used to lessen cure time of higher viscosity SUPERSET grades, especially where gaps or voids exist up to .020", and to prevent whitening. SUPERSET Adhesives meet Military Specification MIL-A-46050B as follows: Type I Class 2--SUPERSET 170E, 175M Type I Class I--SUPERSET 104E, 103M
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APPLE ADHESIVES, INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive (Monomer): 104E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Very Fast Setting - Low Viscositv - Penetrating action - Parts should be closely matched Setting Time (Sec.): 15 Specific Gravity: i-046 Viscosity (cps) @ 20C: 2-3 Flash Point:.80C (176F) Soluble in: MEK. Acetone, Nitromethane Shelf Life @ 5OC (moS.):'l4 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 104E: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (0 10 MHZ): 3.5 Dielectric Loss (8 10 MHZ): 0.066 LOW Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, (DMF) dimethylformamide, dimethyl sulfoxide.
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APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive Monomer: 170E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Fast Setting - Medium Viscosity - Parts should be closely matched - Moderate strength on hard to bond plastics such as polyethylene and polypropylene Setting Time (Sec.): 30 Soecific Gravitv: 1.046 Viscosity (cps)-@ 20C: 50-75 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 170E Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ 10 MHZ): 3.5 Dielectric Loss (@ 10 MHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresoondina 1 Yr.) Maximum Cure Time: 24 Hours _ Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, (DMF) dimethylformamide, dimethyl sulfoxide
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APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive (Monomer): 180E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - For use in bonding wood, plastic and other porous materials - Very fast setting - High viscositv Setting-Time (Sec.7: 15 Specific Gravity: 1.046 Viscosity (cps)-@ 20C: 250-350 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point 8 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 180E: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 126 Dielectric Constant (@ 10MHZ): 3.5 Dielectric Loss (@ 10 MHZ): 3.5 Low Temperature Resistance: -8OC/24 Hrs (-112F) No Change Vol. Insulation Resistance (ohm-cm 8 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, DMF (dimethylformamide), dimethyl sulfoxide
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APPLE
ADHESIVES
INC.:
SUPERSET
Cyanoacrylate Adhesives
(Continued): Liquid Adhesive (Monomer): 198E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Very High Viscosity - Bonds irregular surfaces - Excellent for bonding rubber and plastic parts - Slower setting allows for adjustment of parts Settina Time (Sec.): 45 Specific Gravity: 1.046 Viscosity (cps) @ 20C: 1300-1700 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 198E: Appearance: Colorless, Transparent and Solid Soecific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ IOMHZ): 3.5 Dielectric Loss (@ IOMHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 20C) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, DMF (dimethylformamide), dimethyl sulfoxide
Adhesives-Cyanoacrylte
APPLE
ADHESIVES
INC.:
SUPERSET
115
Cyanoacrylate Adhesives
(Continued): Liquid Adhesive (Monomer): 103M: Resin: Methyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Fast Setting - Low Viscosity - Penetrating action - Parts should be closely matched - Bonds Metals Setting Time (Sec.): 25 Specific Gravity: 1.046 Viscosity (cps) @ 20C: 2-3 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life (a 50C (mos.): 14 Refractive Index inZO/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer) 103M: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value of 10 -4): 1.22 Softening Temp.: 165C (329F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ 10 MHZ): 3.3 Dielectric Loss (a 10 MHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 8.5 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in nitromethane and dimethyl-formamide (DMF)
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APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive (Monomer): 175M: Resin: Methyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Fast Setting - Medium Viscosity - Parts should be well matched Setting Time (Sec.): 40 Specific Gravity: 1.046 Viscosity (cps)-@ ZOC: 50-100 Flash Point: 8OC (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 175M: Appearance: Colorless, Transparent and Solid Snecific Gravitv: 1.25 Refractive Inde; (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.22 Softeninu Temo.: 165C (329F'3 Coef. of-Thermal Exp. iin/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ 10 MHZ): 3.3 Dielectric Loss (@ IO MHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 90 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in nitromethane and dimethyl-formamide (DMF)
Adhesives-Cyanoacrylate
APPLE
ADHESIVES
INC.:
SUPERSET
117
Cyanoacrylate Adhesives
(Continued): Liquid Resin (Monomer): 185M: Resin: Methyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - High Viscosity - Bonds irregular surfaces - Bonds Metals - Slow setting allows adjustment of parts Setting Time (Sec.): 55 Specific Gravity: 1.046 Viscosity (cps) @ 20C: 300-500 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6mm Hg.: 65C (149F) Cur
.ed Adhesive (Polymer): 185M: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.22 Softening Temp.: 165C (329F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (8 10 MHZ): 3.3 Dielectric Loss (8 10 MHZ): 0.066 Low Temperature Resistance: -800124 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 90 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in nitromethane and dimethyl-formamide (DMF)
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BOSTIK: Engineering Adhesives: Cyanoacrylate Adhesives: Cyanoacrylate adhesives are instant bonding adhesives for metal, plastics, rubber, ceramics and glass. Single component, solvent-free adhesives that bond in seconds to closely mated surfaces, cyanoacrylates offer convenience and ease for production assembly and maintenance applications. Bostik cyanoacrylate adhesives are available in several different formulations and sizes. 7430: Designation: General purpose fast cure. Viscosity (cp): 40-50 Cure Time: 2-3 sec. Gap Fill: .003" Temperature Range: -65F to 180F Tensile Lbs/In: 4700 Impact Lbs/In: 7-10 7431: Designation: Penetrating type. Viscosity (cp): 2-5 Cure Time: l-2 sec. Gap Fill: .002" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 3-5 7432: Designation: Rubber and plastic. Viscosity (cp): 90-110 Cure Time: 3-5 sec. Gap Fill: .004" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 3-5 7433: Designation: Wood and fiber Viscosity (cp): 275-325 Cure Time: 7-10 sec. Gap Fill: .006" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 4-6
Adhesives-Cyanoacrylafe
BOSTIK: Engineering Adhesives: Cyanoacrylate Adhesives (Continued): General Purpose Cyanoacrylates: 7434: Desisnation: Porous surfaces. Viscosity (cp): 1450-1550 Cure Time: IO-15 sec. Gap Fill: .OlO" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 4-6 7435: Designation: Maximum qan filler. Viscosity (cp): 2300 - _ Cure Time: 15-25 sec. Gap Fill: .015" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 4-6 Special Performance Cyanoacrylates: 7532: Designation: For critical surfaces. Viscositv (co): 90-110 Cure Time:.315 sec. Gap Fill: .004" Temperature Range: -65F to 18OF Tensile Lbs/In: 4000 Impact Lbs/In: 3-5 7533: Designation: High temperature. Viscosity (cp): 90-110 Cure Time: 3-5 sec. Gap Fill: .004" Temperature Range: -65F to 275F Tensile Lbs/In: 3600 Impact Lbs/In: IO-15 7535: Designation: Severe service. Viscosity (cp): 4800-5200 Cure Time: 2-4 min. Gap Fill: .020" Temperature Range: -65F to 250F Tensile Lbs/In: 3200 Impact Lbs/In:.20-25
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FEL-PRO CHEMICAL PRODUCTS DIVISION: PRO GRIP Instant Bonding Cyanoacrylate Adhesives: -
Instant Bond High Strength Bonds Metal, Rubber and Plastic 1 Part - No Mixing No Heating No Solvents
PRO GRIP 4000: Its viscosity and "ethyl-cyanoacrylate" formula make it the most versatile of the PRO GRIP adhesives. It has high water resistance, weather resistance, and is suited to rubber, plastic, and metal bonding. Use PRO GRIP 4000 for production and maintenance bonding of rubber and plastic, replacing or installing knobs and handles, bonding plexiglass, attaching nameplates, fastening rubber to conveyor belts, etc. Meets Military Specification MIL-A-46050B, Type 1, Class 2. PRO GRIP 5500: PRO GRIP 5500 is a "methyl-cyanoacrylate" designed for maximum bonding strength for metals and ceramics. PRO GRIP 5500 is a good all-around adhesive for such diverse jobs as making O-rings, bonding electronics parts to PC boards, applying strain gages, appliance manufacturing, instrumentation and fastening metal parts on machinery for both maintenance and production. Meets Military Specification MIL-A-46050B, Type 1, Class 2. PRO GRIP 7000: The higher viscosity of PRO GRIP 7000 makes it the ideal adhesive where some porosity and surface roughness is present. Like PRO GRIP 4000, it is an "ethyl-cyanoacrylate" which gives it excellent water and weathering resistance. Set-up time is slightly longer than other PRO GRIP adhesives. PRO GRIP 7000 is especially useful on vertical or inverted surfaces. Its higher viscosity keeps it in place while the parts are being positioned and mated. Features of PRO GRIP, the professional cyanoacrylate adhesive: Single part: No catalyst or mixing needed. Fast bonding: Instantly sets up. Seldom needs clamping. High strength: Good initial strength. Depending on surface material, ultimate bond strengths up to 3200 psi are achieved. Clean to use: Transparent, no stringy and sticky residue. No solvents: Cures without shrinkage. No heat needed for cure.
Adhesives-Cyanoacrylte
FEL-PRO INC.: PRO GRIP Instant Bonding Cyanoacrylate Adhesives (Continued): PRO GRIP 4000: Adhesive Strength, PSI (Lap Shear): Rubber: Neoprene: 120 psi SF# Nitrile: 90 psi SF# SBR: 70 asi SF# Plastic: A ~ Rigid PVC: 550 psi SF# Polystyrene: 550 psi SF# Polyacrylic: 900 psi SF# ABS: 640 psi SF# Nylon: 900 psi SF# Phenolic: 680 psi SF# Polycarbonate: 1300 psi SF# Cellulose Acetate: 500 psi Metal: Steel: 2400 psi Aluminum: 1600 psi Copper: 1600 psi Stainless Steel: 2450 psi Color: Clear Viscosity: medium 100 cps Maximum Temperature: 175 Setting Time: 3-40 sec. PRO GRIP 5500: Adhesive Strength, Psi (Lap Shear): Rubber: Neoprene: 190 psi SF# Nitrile: 155 psi SF# SBR: 40 vsi SF# Plastic: _ ~ Rigid PVC: 500 psi SF# Polystyrene: 480 psi SF# Polyacrylic: 850 psi SF# ABS: 640 psi SF# Nvlon: 850 nsi SF# Phenolic: 680 psi SF# Polycarbonate: 1250 psi SF# Cellulose Acetate: 400 psi Metal: Steel: 3200 psi Aluminum: 1850 psi Copper: 1580 psi Stainless Steel: 2750 psi Color: Clear Viscosity: medium 100 cps Maximum Temperature: 175 Setting Time: 3-40 sec. # SF: Substrate Failed
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FEL-PRO INC.: PRO GRIP Instant Bonding Cyanoacrylate Adhesives (Continued): PRO GRIP 7000: Adhesive Strength, PSI (Lap Shear): Rubber: Neoprene: 195 psi SF# Nitrile: 90 psi SF# SBR: 70 psi SF# Plastic: Rigid PVC: 580 psi SF# Polystyrene: 580 psi SF# Polyacrylic: 850 psi SF# ABS: 640 psi SF# Nylon: 850 psi SF# Phenolic: 890 psi SF# Polycarbonate: 1320 psi SF# Cellulose Acetate: 500 psi Metal: Steel: 2300 psi Aluminum: 1500 psi Copper: 1420 psi Stainless Steel: 2200 psi Color: Clear Viscosity: high 1500 cps Maximum Temperature: 175 Setting Time: IO-80 sec. #SF: Substrate Failed
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ITW DEVCON: DEVCON ZIP GRIP Cyanoacrylate Instant Adhesives: ZIP GRIP 4495 General Purpose Adhesive: DEVCON's ZIP GRIP adhesives are single component, moisturecuring cyanoacrylates which cure in seconds on most smooth, close-fitting substrates. They cure best at room temperature and need not be refrigerated during storage. Devcon offers several different types of ZIP GRIP adhesives formulated with specific properties. Original ZIP GRIP 4404: This is the original ZIP GRIP cyanoacrylate designed to bond all metal and rubber parts with smooth, clean, closefitting surfaces. It performs well for bonding O-rings and making static seals, can be used to fixture small parts in place for machining or alignment, and is used to permanently bond metal-to-metal and rubber/plastics to metal surfaces. High-Performance ZIP GRIP 4414: This is a medium viscosity adhesive that features fast fixturing time and good weather resistance. It bonds plastics, insulating trims, and vinyl. Gap Filling ZIP GRIP 4416: A high-viscosity (1,500 cps) adhesive with a slower fixturing time which permits some repositioning following assembly and application of the adhesive. Maximum recommended gap: .OlO". Wicking Grade ZIP GRIP 4420: Designed for bonding close-fitting components, this grade of ZIP GRIP features an extremely low viscosity (3 cps.), and rapid fixturing speed. High-Viscosity ZIP GRIP 4422: With a viscosity of 2,500 cps., this grade is ideal for filling large gaps up to .020". It is an excellent choice for bonding poorly machined surfaces, and porous materials including plastics and metals. ZIP GRIP 95 Gel: This is a high-performance ethyl gel designed for bonding all types of rubber, plastics, and combinations of metals and non-metal surfaces. Recause of its thick gel consistency, it is recommended for bonding on porous and rough surfaces, as well as for filling large gaps.
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ITW DEVCON:
DEVCON
ZIP
GRIP
Cyanoacrylate Instant Adhesives
(Continued): 4404: Base: Methyl Color: Clear Gap fill: .003" Viscositv (ens): 40 Adhesive-tensile shear strength, psi: 2,500 Cure Speed: Fixture: 15-20 sec. Full: 8 hours MIL-SPEC: Type 1 MIL-A-46050C: Class 2 Temperature range: -65F to 180F 4414: Base: Ethyl Color: Clear Gap fill: .006" Viscositv (cos): 120 Adhesive^tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: 20-30 sec. Full: 24 hours MIL-SPEC: Type II MIL-A-46050C: Class 2 Temperature range: -65F to 18OF 4416: Base: Ethyl Color: Clear Gap fill: -010" Viscosity (cps) 1,500 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure Speed: Fixture: 40-50 sec. Full: 4 hours MIL-SPEC: Type II MIL-A-46050C: Class 3 Temperature renge: -65F to 180F 4420: Base: Ethyl Color: Clear Gap fill: .002" Viscosity (cps): 3 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: lo-20 sec. Full: 4 hours MIL-SPEC: Type II MIL-A-46050C: Class 1 Temperature range: - 65F to 180F
Adhesives-Cyanoauylate
ITW DEVCON:
ZIP GRIP
125
Cyanoacrylate Instant Adhesives (Continued):
4422: Base: Ethyl Color: Clear Gap fill: .020" Viscosity (cps): 2,500 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: 50-60 sec. Full: 4 hours MIL-SPEC: Type II MIL-A-46050C: Class 3 Temperature range: -65F to 180F 4496:
Base: Methyl Color: Clear Gap fill: .006" Viscosity (cps): 120 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: 30-40 sec. Full: 24 hrs. MIL-SPEC: Type I MIL-A-46050C: Class 2 Temperature range: -65F to 180F ZIP GRIP 95 Gel:
Base: Ethyl Color: Clear Amber Gap fill: .030" Viscosity (cps): Gel Adhesive tensile shear strength, psi: 2,200 Cure speed: Fixture: IO-15 sec. Full: 8 hours MIL-SPEC: N/A Temperature range: -65F to 180F
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LOCTITE CORP.: Bonding: Instant Adhesives: LOCTITE instant adhesives are available in a choice of viscosities, cure speeds, gap-filling capability, and substrate compatibility. The ultra-high performance PRISM family offers additional products that surpass the most stringent demands, including toughened formulations, low odor and low blooming products, and surface insensitive formulations. SUPERBONDER Instant Adhesives: SUPERBONDER Instant Adhesives offer a wide range of application versatility. They may be applied directly from containers or with automated equipment. They contain no solvents and are non-flammable. Low toxicity. Mild odor. SUPERBONDER 409 Gel Instant Adhesive: Thixotropic gel formulation fills large gaps and is nonrunning. For general purpose use on metal, plastic and rubber. SUPERBONDER 414 Plastic & Vinyl Instant Adhesive: Medium viscosity (IlOcp), high strength. Ideal for bonding plastic and vinyl parts with gaps to .006". Good humidity and weather resistance. SUPERBONDER 416 Gap Filling Instant Adhesive: High viscosity (1500 cp). Designed to bond irregular surfaces or large gaps between mating surfaces. This slower-setting adhesive allows adjustment of parts after assembly. SUPERBONDER 420 Penetrating Instant Adhesive: Very low viscosity (5 cp). Designed to penetrate by capillary action between pre-assembled components. Parts must be closefitting: gaps to .002". SUPERBONDER 430 Metal Bonding Instant Adhesive: Medium viscosity (80 cp). Fills gaps to .005". Especially effective on plated and anodized metals bonded to themselves or to other materials. SUPERBONDER 495 General Purpose Instant Adhesive: Low viscosity (40 cp). Engineered to bond rubber, metal and plastic parts with gaps to -004". Will wick between pre-assembled parts with gaps to .006".
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LOCTITE CORP.: Bonding(Continued): Instant Adhesives(Continued): SUPERBONDER Instant Adhesives(Continued): SUPERBONDER 498 Thermal Cycling Resistant Instant Adhesive: Medium viscosity (700 cp) high temperature (to 223F, intermittent to 250F) instant adhesive with excellent resistance to thermal cycling. SUPERBONDER 499 Gel Instant Adhesive: Thixotropic high temperature (to 223F, intermittent to 250F) gel formation bonds all metals, and most plastics and rubber compounds. Offers excellent thermal cycling resistance. PRISM Instant Adhesives: PRISM adhesives are LOCTITE's highest performance instant adhesives. They work where other instants fail. They are specially formulated to provide the strongest bond on hard-to-bond surfaces and resist extreme environmental conditions. PRISM Surface Insensitive Instant Adhesives: Creates stronger bonds on a wider variety of difficult substrates and under a greater range of surface and environmental conditions than other instant adhesives. PRISM 401 Surface Insensitive Instant Adhesive: Medium viscosity (100 cp). Excellent strength and cure speed on porous substrates. Cures in dry conditions. PRISM 406 Surface Insensitive Instant Adhesive: Low viscosity (20 cp). Very fast curing speed in dry conditions. Excellent results with difficult to bond rubber compounds. PRISM 447 Surface Insensitive Instant Adhesive: Medium high viscosity (600 cp). Excellent strength and adhesion to a wide range of porous substrates. Cures in dry conditions. PRISM 454 Surface Insensitive Instant Gel Adhesive: Non-flowing gel. Ultra high performance general purpose adhesive with excellent gap-filling, strength, and adhesion to a very wide range of substrates.
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LOCTITE CORP.: Bonding(Continued): PRISM Instant Adhesives(Continued): PRISM Surface Insensitive Instant Adhesives(Continued): PRISM Toughened Instant Adhesives: Combine excellent peel and impact resistance with shear strength. For high stress, high temperature, high humidity, and high vibration and impact applications. PRISM 405 Toughened Instant Adhesive (White): Medium viscosity (300 cp). For excellent strength in high stress, high temperature (to 223F) high humidity applications. PRISM 410 Toughened Instant Adhesive (Black): High viscosity (3,500 cp). Good gap filling ability for high temperature (to 223F), high humidity applications. PRISM 411 Toughened Instant Adhesive (Clear): Very high viscosity (5,000 cp). Good gap filling ability for applications needing a stress, humidity and temperature resistant (to 212F) adhesive. PRISM Odorless, Non-Frosting Instant Adhesives: Cure on sensitive substrates with invisible bond line without frosting or crazing. Eliminates need for ventilation. PRISM 408 Odorless, Non-Frosting Instant Adhesive: Very low viscosity (5 cp). Designed to penetrate by capillary action between preassembled components. Parts must be close-fitting: gaps to .002". PRISM 460 Odorless, Non-Frosting Instant Adhesive: Low viscosity (50 cp). Excellent strength and appearance combined with minimal odor. PRISM 403 Odorless, Non-Frosting Instant Adhesive: Medium viscosity (1,OOOcp). Excellent strength and appearance. For less precisely fitted parts. Ethyl based.
Adhesives-Cyanoacylate
LOCTITE CORP.: Bonding(Continued): SUPERBONDER Instant Adhesives Technical Information: 409: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: Thixo. Gel Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: 50-70 sec. Full: 24 hrs. Specific Gravity: 1.05 414: Color: Clear Gap Fill: .006" Base: ethyl Viscosity cp: 110 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F(-54 to 82C) Cure Speed: Fixture: 30-40 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class II Specific Gravity: 1.05 416: Color: Clear Gap Fill: .OlO" Base: ethyl Viscosity cp: 1500 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: SO-60 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class III Specific Gravity: 1.05 420: Color: Clear Gap Fill: .002" Base: ethvl Viscosity-cp: 5 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: 15-30 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class I Specific Gravity: 1.05
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LOCTITE CORP.: Bonding(Continued): SUPERBONDER Instant Adhesives Technical Information(Continued): 430: Color: Clear Gap Fill: .005" Base: methyl Viscosity cp: 80 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C1 Cure Speed: Fixture: 20-40 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type I Class II Specific Gravity: 1.09 495: Color: Clear Gap Fill: .004" Base: ethyl Viscosity cp: 40 Strength psi Tensile Shear: 2500 Temnerature Ranse: -65 to 180F (-54 to 82C) Cur;? Speed: Fixture: 20-40 sec. Full: 24 hrs. Mil-A-Spec MIL-A-46050C: Type II Class I Specific Gravity: 1.05 498: Color: Clear Gap Fill: .006" Base: ethyl Viscosity cp: 700 Strength psi Tensile Shear: 3000 Temuerature Ranqe: -40 to 223F (-40 to 106C) Cure Speed: Fixture: 30-60 sec. Full: 24 hrs. Specific Gravity: 1.05 499: Color: Clear Gap Fill: .004" Base: ethyl Viscosity cp: Thixo. Gel Strength psi Tensile Shear: 3200 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 60-80 sec. Full: 24 hrs. Specific Gravity: 1.10
Adhesives-Cyanoacylate
LOCTITE CORP.: Bonding(Continued): PRISM Adhesives Technical Information: 401: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: 100 Strength psi Tensile Shear: 3235 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: O-20 sec. Full: 24 hrs. Specific Gravity: 1.05 Approvals: USP Class IV 406: Color: Clear Gap Fill: .004" Base: ethyl Viscosity cp: 20 Strength psi Tensile Shear: 2878 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: O-20 sec. Full: 24 hrs. Specific Gravity: 1.05 Approvals: USP Class IV 447: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: 600 Strength psi Tensile Shear: 3386 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: O-20 sec. Full: 24 hrs. Specific Gravity: 1.05 454: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: Thixo. Gel Strength psi Tensile Shear: 3000 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: 15-90 sec. Full: 24 hrs. Specific Gravity: 1.10 Approvals: USP Class VI
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LOCTITE CORP.: Bonding(Continued): PRISM Adhesives Technical Information(Continued): 405: Color: White Gap Fill: .007" Base: ethvl Viscosity*cp: 300 Strenqth psi Tensile Shear: 3273 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.05 410: Color: Black Gap Fill: .008" Base: ethyl Viscosity cp: 3500 Strength psi Tensile Shear: 3568 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.10 411: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: 5000 Strength psi Tensile Shear: 3191 Temperature Range: -65 to 212F (-54 to 1OOC) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.10 408: Color: Clear Gap Fill: .002" Base: alkoxy alkyl Viscosity cp: 5 Strength psi Tensile Shear: 2608 Temperature Range: -65 to 160F (-54 to 71C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.05 Approvals: USP Class IV
Adhesives-Cyanoacrylate
LOCTITE CORP.: Bonding(Continued): PRISM Adhesives Technical Information(Continued): 460: Color: Clear Gap Fill: .004" Base: alkoxy alkyl Viscositv cw: 50 Strength-psi Tensile Shear: 2400 Temperature Range: -65 to 160F (-54 to 71C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.06 Approvals: USP Class IV 403: Color: Clear Gap Fill: .008" Base: alkoxy alkyl Viscosity cp: 1000 Strength psi Tensile Shear: 2954 Temwerature Range: -65 to 160F (-54 to 71C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.09
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LOCTITE CORP.: Bonding(Continued): PRISM Surface Insensitive Instant Adhesives(Continued): BLACK MAX Tough Adhesive 380: A one-part, fast curing, high temperature (to 223F, intermittent to 250F) adhesive. Excellent peel, impact, and tensile shear strength. Exceptional thermal cycling resistance. Bonds metal, rubber, and plastics. Bonds: - Joints in speakers - Automotive engine vacuum harness - Plastic sole plate to golf club head TAK PAK 444 Instant Adhesive: Medium viscosity (700~~) instant adhesive formulated specifically for PCB assembly and repair. Replaces epoxies, silicones, hot melts for mounting components, reinforcing standoffs, wire tacking and board repair. Available in kit form with TAK PAK accelerator or as separate items. TAK PAK 382 Ultra Performance Adhesive Kit: Designed to cut PCB assembly, repair and modification, TAK PAK 382 is a high temperature (to 223F, intermittent to 250F), high viscosity instant adhesive that withstands thermal cycling. Cures instantly with TAK PAK Accelerator. Available in kit or as separate items. Can be applied with high-speed process equipment. Applications: - Secure wires - Tamperproof settings - Attach capacitors - Repair cracks - Strain relieve leads TAK PAK Accelerator 710: Speeds cure of all TAK PAK adhesives. Contains no salts. Can be sprayed, brushed, or applied with fine felt tip. Primers: - TAK PAK Accelerator, Accelerator 711 aid cure of instant adhesives. Solvent: X-NMS Clean-Up Solvent 768 quickly and safely dissolves cured instant adhesives.
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LOCTITE CORP.: Bonding(Continued): SUPERBONDER Instant Adhesives Technical Information(C!ontinued): BLACK MAX 380: Color: Black Gap Fill: -015" Base: ethvl Viscosity*cp: 1000 Strenqth psi Tensile Shear: 3100 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 2-3 min. Full: 120 hrs. Specific Gravity: 1.10 U.P. TAK PAK 382: Color: Clear Base: ethyl Viscositv cw: 5000 Strength-psi Tensile Shear: 3500 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 10 sec. Full: 24 hrs. Specific Gravity: 1.05 TAK PAK 444: Color: Clear Base: ethyl Viscosity cp: 700 Temwerature Ranqe: -65 to 180F (-54 to 82C) Cure Speed: _ Fixture: 30-60 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class III Specific Gravity: 1.05
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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanaoacrylate Adhesive: Red Label (Ethyl): Use when bonding any combination of plastic, r,ubber, ceramic or glass. Red Label No. 101: Viscosity: 2-3 cps Setting Time: lo-20 seconds Physical Properties: Appearance: Colorless, Transparent liquid Viscosity (cps @ 2OC): 2-3 Refractive Index: 1.45 Flash Point: 182F Solubilitv Parameter: 10.5 Density: i.O5-1.08 Shelf-Life at 5C: 12 Months Soluble in: M.E.K./Acetone/Nitromethane Main Ingredients: Ethyl Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless transparent solid Softening Point: 284-293F Melting Point: 347-374F Blue Label (Ethyl): Use when bonding any combination of plastic, rubber, ceramic or glass. Blue Label No. 102: Viscosity: 75 cps Setting Time: 45-60 seconds Physical Properties: Type: Blue Label Appearance: Colorless, Transparent Liquid Viscosity (cps @ 2OC): 75' Refractive Index: 1.44 Flash Point: 182F Solubilitv Parameter: 10.5 Density: i .05-1.08 Shelf-Life at 5C: 12 Months Soluble in: Acetone/methvlethvlketone (MEK)/nitromethane Main Ingredients: Ethyl Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless transparent solid Softening Point: 280-293F Melting Point: 340-365F
Adhesives-Cyanoacylate
ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanoacrylate Adhesive (Continued): Purple Label (Ethyl): This formula of a special ethyl cyanoacrylate was developed for bonding natural latex rubber and hard to bond plastics. It has superior wetting properties and a very fast speed of cure. In general, Oneida does not recommended using it for bonding metal to metal. Purple Label No. 105: Viscosity: 30-40 cps Setting Time: 45-60 seconds Physical Properties: Type: Brown Label Appearance: Colorless Viscosity (cps @ 2OC): 30-40 cps Refractive Index: 1.45 Flash Point: 182F Density: 1.05-1.08 Shelf-Life at 5C: 12 months Soluble In: Acetone, methylethylketone (MEK), nitromethane, dimethvlformamide (DMF) Main Ingredients: Ethyl-Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless Transparent (Solid) Softening Point: 284-293F Melting Point: 340-3651;' Red/White Label (Ethyl): Highly suitable for wire tacking applications on printed circuit boards (in combination with #55-15 Filler/Setter). This viscous ethyl cyanoacrylate has good nonmigrating and gapfilling properties. Red/White Label No. 106: Viscosity: 1300-1700 cps Setting Time: 60-120 seconds Type: Red/White Label Appearance: Colorless, Transparent Viscosity (cps @ 2OC): 1300-1700 Refractive Index: 1.45 Flash Point: 182F Density: 1.05-1.08 Shelf-Life at 5C: 12 months Soluble in: Acetone, methylethylketone (MEK), nitromethane, dimethylformamide (DMF) Main Ingredients: Ethyl-Cyanoacrylate Polymer (Solid State After Resinated): Appearance: Colorless, Transparent (Solid) Softening Point: 284-293F Melting Point: 340-365F
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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanoacrylate Adhesives (Continued): Yellow/Blue Label (Methyl): INSTANT-WELD 107 is a methyl cyanoacrylate of medium viscosity to complement INSTANT-WELD 747 and 130. Recommended for metal to metal bonding because of its higher strength and better thermal behavior than ethyl cyanoacrylates. Yellow/Blue Label No. 107: Viscosity: 80-100 cps Setting Time: 45-60 seconds Yellow/Blue Label TvDe: __ Appearance: Colorless Transparent Viscosity (cps @ 20C): 80-100 Refractive Index: 1.46 Flash Point: 175F Density: 1.08-1.10 Shelf-Life at 5C: 12 months Soluble in: Dimethylformamide and nitromethane, MEK, Toluene Main Ingredients: Methyl-Cyanoacrylate Polvmer (Solid State After Resinified): Appearance: Colorless Transparent (Solid) Softening Point: 320-328F Melting Point: 392-401F White Label (Methyl): Use when metal is one or both of the bonded components, such as metal to plastic or metal to rubber, glass, etc; White Label No. 130: Viscosity: 500-550 cps Setting Time: 90 seconds Physical Properties: Type: White Label Viscosity (cps @ 20C): 500-550 Refractive Index: 1.50 Flash Point: 181F Densitv: 1.08-1.10 Shelf-Life at 5C: 12 months Soluble in: MEK/Nitromethane/Toluene Main Ingredients: Methyl-Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless, transparent Softening Point: 320-329F Melting Point: 392-401F
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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanoacrylate Adhesives (Continued): Green Label (Ethyl): Bonds porous and nonporous materials. (Other grades of INSTANT-WELD bond nonporous materials - metals, plastics, glass, porcelain, hardwoods, rubber, etc.) This formula holds all of these materials plus leather, paper, soft woods, many fibrous substances, etc. Green Label No. 240: Viscosity: 2000-2400 cps Setting Time: 60-120 seconds Physical Properties: Type: Green Label Appearance: Colorless, Transparent, Viscous Liquid Viscosity (cps @ 2OC): 2,000-2,400 cps Refractive Index: 1.46 Flash Point: 181F Density: 1.05-1.08 Shelf-Life at 5C: 12 months Soluble In: Acetone, Nitromethane, Toluene Main Ingredients: Ethyl Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless, transparent, same as glass Softening Point: 284-293F Melting Point: 347-365F Yellow Label (Methyl): Use when metal is one or both of the bonded components, such as metal to plastic or metal to rubber, glass, etc. Yellow Label No. 747: Viscosity: 15-25 cps Setting Time: 30-45 seconds Physical Properties: Type: Yellow Label Appearance: Colorless, Transparent Liquid Viscosity (cps @ 2OC): 15-25 Refractive Index: 1.45 Flash Point: l75F Solubility Parameter: 11.0 Density: 1.08-1.10 Shelf-Life at 5C: 12 months Soluble in: Dimethyl-formamide and nitromethane, MEK, Toluene Main Ingredients: Methyl-Cyanoacrylate Polymer (Solid State After Resinated): Appearance: Colorless transparent solid Softening Point: 320-329F Melting Point: 392-401F
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ONEIDA ELECTRONIC MFG. CO.: INSTANT-WELD 847 Adhesive: The One Adhesive Cyanoacrylate for Many Applications High Bond Strength: Bond strength of up to 5,000 psi makes INSTANT-WELD 047 adhesives excellent for high-performance applications. In the case of some materials, such as most rubbers and plastics, the bond formed after 10 minutes is actually stronger than the substrate itself. Versatile: One adhesive for many applications: Forms strong, long-lasting bonds in just seconds with both similar and dissimilar materials. Outstanding for bonding metals, as well as most rubbers, plastics, hardwoods, and other non-porous materials with smooth, close-fitting surfaces. Because one adhesive can be used in many different applications, inventory requirements are greatly reduced. Economical: Under controlled conditions, as little as one drop (0.015 gram) of adhesive per square inch has been found to give optimum results. One pound of adhesive typically yields 30,000 drops. Viscosity: 75-125 cps * * * * * * * *
Fast-setting High strength Versatile Easy-to-use Solvent-free Colorless, transparent bond lines Meets MIL-A46050-C Type 1 Class 2 (methyl) Formulated for automatic dispensing
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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD 850 Series: High Temperature Resistant Cyanoacrylate Adhesives The INSTANT-WELD #850 Series adhesives were developed to satisfy the need for quick setting adhesives with better heat resistance. A modification of the cyanoacrylate molecule, covered in U.S. Patent 3 254 111, allows the adhesive to crosslink and thereby enhance its resistance to temperature above IOOC (212F). INSTANT-WELD #850 Series cyanoacrylate adhesives are simple, one-part systems. They cure by reacting with the moisture absorbed on most surfaces under ambient conditions, as do regular cyanoacrylate adhesives. Thus, there is no need to store, handle or mix in special chemical additives which can shorten shelf life, require special storage conditions and higher skilled personnel. They can be handled and dispensed with the same equipment and personnel as is used with regular cyanoacrylates. INSTANT-WELD #850 Series adhesives react as standard cyanoacrylate adhesives but provide higher heat resistance. Thus, the adhesive provides: * Instant Setting * High Strength * Bonds to a great variety of materials * Ease of Application * One Part System * LOW Cost per Bond and, the special crosslinking of the #850 Series Adhesives extends its useful ranqe to above 1OOC (212F) as can be seen in the tables. INSTANT-WELD #850: Viscosity: l-5 cps Mil Spec: Type V, Class Use: Wicking, High Flow INSTANT-WELD #851: Viscosity: 75-125 cps Mil Spec: Type V, Class _. use: tienerai Purpose, controlled Flow INSTANT-WELD #852: Viscosity: 1800-2400 cps Mil Speck Type V, Class 3 Use: Large Gaps, Low Flow
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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates: Ethyl Types: For bonding similar as well as dissimilar material; including ceramics, metal, plastic, rubber, and wood. Features include: good heat aging characteristics, moisture resistance, and weatherability. Excellent for adhering glass but bond will deteriorate with age. E-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to .OOZ" gap fill capability * meets MIL-A-46050-C Type II Class 1 E-40: Fast Cure * General Purpose * 40 cps viscosity allows up to .004" gap fill capability * Meets MIL-A-46050-C Type II Class 1 E-100: Medium Cure * Broad use adhesive * 100 cps viscosity allows up to -005" gap fill capability * Meets MIL-A-46050-C Type II Class 2 E-1500: Slow Cure * Bridges gaps, allows work piece alignment * 1500 cps viscosity allows up to .OlO" gap fill capability * Meets MIL-A-46050-C Type II Class 3 E-2500: Very Slow Cure * ~110~s maximum time for positioning of parts. Use to bond fibrous and porous materials. * 2500 cps viscosity allows up to .020" gap fill capability * Meets MIL-A-46050-C Type II Class 3
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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): Methyl Types: Specifically formulated for metal to metal bonding. Features include solvent resistance and higher strength at specific temperatures. Better in fatigue cycling and repetitive stress loading. M-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" gap fill capability * Meets MIL-A-46050-C Type I Class 1 M-50: Fast Cure * Solvent resistant * 50 cps viscosity allows up to -004" gap fill capability * Meets MIL-A-46050-C Type I Class 1 M-100: Medium Cure * Solvent resistant, general assembly * 100 cps viscosity allows up to -005" fill capability * Meets MIL-A-46050-C Type I Class 2 E-5: Chemical Type: Ethyl Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 185 Vapor Pressure (@7OC, mmHg): 8 Soluble in: PACER X Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 365 Softening Point (F): 311 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M75 Gap Filled, Typical, Inches: .002 Outgassing @ 10 -6 mm Hg (72F): 0 Elonuation (%): (2 Tensile strength, Steel/Steel (ASTM D-2095) (lbs/in 2): 4000 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 3-5 Soluble in: PACER X-7 Debonder, Acetone, DMF
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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): E-40: Chemical Tvoe: Ethvl 30-70 Viscosity Range, cps: _ Specific Gravity (25/4C): 1.06 Flashpoint (COC-F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Meltinu Point (F): 365 Softening Point (F): 307 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/Dt-.03): 1.45 Hardness - Rockwell: M75 Gap Filled, Typical, Inches: .004 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4700 E-100: Chemical Type: Ethyl Viscosity Range, cps: 80-120 Specific Gravity (25/4C): 1.08 Flashooint (COC F): 185 Vapor‘Pressure (@'7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Meltina Point (F): 365 Softening Point (F): 306 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M74 Gap Filled, Typical, Inches: -005 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4000 E-1500: Chemical Type: Ethyl Viscosity Range, cps: 1300-1700 Specific Gravity (25/4C!): 1.10 Flash point (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 301 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M72 Gap Filled, Typical, Inches: .OlO Outaassina B 10 -6 mm Ha (72F): 0 Elongation (%): (2 _ Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4000 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-6
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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): E-2500: Chemical Type: Ethyl Viscosity Range, cps: 2200-2700 Specific Gravity (25/4C): 1.11 Flashpoint (COC F): 185 Vapor Pressure (@7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 368 Softenins Point (F): 301 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M72 Gap Filled, Typical, Inches: -020 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4000 M-5: Chemical Type: Methyl Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.10 Flashpoint (COC F): 167 Vapor Pressure (@ 7OC, mmHg): 10 Soluble in: PACER-X Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 401 Softening Point (F): 332 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M85 Gap Filled, Typical, Inches: .002 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 M-50: Chemical Tvoe: Methvl Viscosity Range, cpS: 30-70 Specific Gravity (25/4C): 1.08 Flashpoint (COC-F): 167 Vapor Pressure (@7OC, mmHg): 10 Soluble in: PACER-X Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 388 Softening Point (F): 327 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M80 Gap Filled, Typical, Inches: .004 Outgassing @ ib -6 mm Hg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000
146
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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): M-100: Chemical Type: Methyl Viscosity Range, cps: 80-120 Specific Gravity (25/4C): 1.08 Flashpoint (COC F): 167 Vapor Pressure (@ 7OC, mmHg): 10 Soluble in: PACER K-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 388 Softening Point (F): 325 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness-Rockwell: M79 Gap Filled, Typical, Inches: .005 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact strength, Steel/Steel, ASTM 950 (lbs/in 2): 3-6 Soluble in: PACER K-7 Debonder. Acetone, DMF
Adhesives-Cyanoacrylate
147
PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series: PX Plastics-Extended Performance grades provide the maximum strengths for bonding various plastics and elastomerics together or in combination with metals and other materials. Select PX whenever organic materials are to be bonded. Service temperature range -65F to 200F, impact strengths, 4-8 lbs/in 2. The PX chemistry provides an intermediate grade between the RX and the HI type capabilities. Excellent performance on nylon, DELRIN, ABS, MYLAR, PVC, certain fluorocarbons, etc. Will not crack or craze ABS. PX-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" gap fill capability * Meets MIL-A-46050C, Type II, Class 1 PX-50: Fast Cure * General purpose * 50 cps viscosity allows up to .004" gap fill capability * Meets MIL-A-46050C, Type II, Class 1 PX-500: Slow Cure * Allows workpiece alignment * 500 cps viscosity allows up to .008" gap fill capability * Meets MIL-A-46050C, Type II, Class 3 TX Temperature Extended: Single component, high temperature cyanoacrylates for use at service temperatures up to 300F. Best for wire tacking and component bonding to printed circuit boards before and after wave soldering. TX chemistry is specially designed to permit rapid "wire tacking" to plain printed circuit boards; boards covered with solder masks; and provides the best performance for "tacking" when board processing includes water washing operations. These formulations work well on chromate conversion coatings and oily parts. Excellent impact strengths of IO-15 lbs/in 2 can be obtained. TX-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" fill capability * Meets MIL-A-46050C, Type II, Class 1 TX-100: Medium Cure * Broad use adhesive * 100 cps viscosity allows up to .004" gap capability * Meets MIL-A-46050C, Type II, Class 2 TX-750: Slow Cure * Allows workpiece alignment * 750 cps viscosity allows up to .OlO" gap fill capability * Meets MIL-A-46050C, Type II, Class 3 TX-2000: Very Slow Cure * Allows workpiece alignment * 2000 cps viscosity allows up to .015" gap filling capability * Meets MIL-A-46050C, Type II, Class 3
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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Serie (Continued): PX-5: Chemical Type: Ethyl Propyl Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.04 Flashpoint (COC F): 186 Vapor Pressure (@ 7OC, mmHg): 7 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 363 Softening Point (F): 303 Service Temperature Range: (-65 to +200F) (-54 to c94C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -002 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4200 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-8 PX-50: Chemical Type: Ethyl Propyl Viscosity Range, cps: 30-80 Specific Gravity (25/4C): 1.04 Flashpoint (COC F): 186 Vapor Pressure (@ 7OC, mmHg): 7 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 363 Softenins Point (F): 303 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -004 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): t2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4400 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-8 PX-500: Chemical Type: Ethyl Propyl Viscosity Range, cps: 400-600 Specific Gravity (25/4C): 1.04 Flashooint (COC F): 186 Vapor-Pressure (@7OC, mmHg): 7 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 363 Softening Point (F): 302 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -008 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4400 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-8
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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): TX-5: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 369 Softening Point (F): 313 Service Temperature Range: (-65 to +300F) (-54 to c149C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M71 Gap Filled, Typical, Inches: -002 Outgassing @ 10 -6m Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 TX-100: Chemical Tvwe: Ethvl Hvbrid Viscosity Range, cps: SO-150 Specific Gravity (25/4C): 1.08 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 369 Softenins Point (F): 312 Service Temperature Range: (-65 to +300F) (-54 to +149C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -004 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 TX-750: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 650-850 Specific Gravity (25/4C): 1.09 Flashwoint (COC F): 185 Vapor-Pressure (@.7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 309 Service Temperature Range: (-65 to +300F) (-54 to +149C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -010 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15
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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (continued): TX-2000: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 1800-2400 Specific Gravity (25/4C): 1.11 Flashpoint (COC F): 185 Vapor Pressure (8 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 309 Service Temperature Range: (-65 to +300F) (-54 to +149C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: .015 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): t2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4200 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 Soluble in: PACER X-7 Debonder, Acetone, DMF Hi High contribute attainable and rubber
Impact: A structural instant adhesive formulated to toughness and impact resistance. Maximum impact values (15-25 lbs/ft 2). Also recommended for bonding plastic together or to metals, especially aluminum.
HI-50: Fast Cure * General purpose * 50 cps viscosity allows up to .004" gap fill capability * Meets MIL-A-46050C, Type II, class 1 HI-150: Medium Cure * Broad use adhesive * 150 cps viscosity allows up to .005" gap fill capability * Meets MIL-A-46050C, Type II, class 2 HI-500: Slow Cure * Allows workpiece alignment * 500 cps viscosity allows up'to .008" gap fill capability * Meets MIL-A-46050C, Type II, Class 3
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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HI-5f-l:
__ _
Chemical Type: Ethyl Hybrid Viscositv Ranse. CDS: 30-70 Specific-Gravity (25/4(Z): 1.07 Flashpoint (COC F): 185 Vanor Pressure (0 7OC. mmHs): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 366 Softening Point (F): 309 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-0.3): 1.45 Hardness - Rockwell: M75 Gap Filled, Typical, Inches: .004 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 HI-150: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 100-200 Specific Gravity (25/4C): 1.07 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 367 Softenins Point (F): 309 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M73 Gap Filled, Typical, Inches: .005 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 15-20 HI:-500: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 400-600 Specific Gravity (25/4(Z): 1.09 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 315 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M73 Gap Filled, Typical, Inches: .008 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 20-25
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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HC High Clarity: Adhesive is an isopropyl formulation that generates 75% less adhesive vapor during cure, resulting in dramatically reduced chlorisis (i.e., formation of white deposition of low molecular weight) in applications where cosmetics are important. High clarity grades have better moisture resistance than ethyl type cyanoacrylates. HC-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" gap capability HC-150: Medium Cure * Broad use adhesive * 150 cps viscosity allows up to .006" fill capability HP High Peel/High Performance. This newly developed chemistry exhibits characteristics unique to instant adhesives: high T-peel strength, impact strength (impact resistance), thermal shock resistance, excellent performance for metal to metal structural bonds. HP-IO: Fast Cure * Able to penetrate betwwen parts * 10 cps viscosity allows up to .002” gap fill capability * Meets MIL-A-46050C, Type II, class 1 HP-500: Slow Cure * Allows parts positioning time * 500 cps viscosity allows up to . 012" qap fill capability * Meets-MIL-A-4605tiC, Type II, class 3 _ HP-3000: Very Slow Cure * Allows workpiece alignment * 3000 cps viscosity allows up to .020" gap fill capability * Meets MIL-A-46050C, Type II, class 3 HP-5000: Slowest Cure Time * Large gap fill * 5000 cps viscosity allows up to .025" gap fill capability * Meets MIL-A-46050C, Type II, class 4
Adhesives-Cyanoacrylate
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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HC-5: Chemical Type: Propyl Hybrid Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.02 Flashpoint (COC F): 190 Vapor Pressure (@ 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 343 Softening Point (F): 290 Service Temperature Range: (-65 to 175F) (-54 to 79C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M71 Gap Filled, Typical, Inches: 0.002 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): t2 _ Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 2800 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 3-5 HC-150: Chemical Type: Propyl Hybrid Viscosity Range, cps: 100-200 Specific Gravity (25/4C): 1.02 Flashooint (COC F): 190 Vapor-Pressure (@.7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 343 Softening Point (F): 290 Service Temperature Range: (-65 to 175F) (-54 to 79C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M71 Gap Filled, Typical, Inches: .006 Outgassing @ 10 -6 mm Hg (72F): 0 Elonaation (%I: t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 3-5 HP-lo: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 5-15 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Meltina Point (F): 366 Softening Point iF): 310 Service Temperature Range: (-65 to 180F) (-54 to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M73 Gap Filled, Typical, Inches: .002 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): (3 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 12-25
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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HP-500: Chemical Tvoe: Ethvl Hvbrid Viscosity Range, cps: _ 400-600 Specific Gravity (25/4C): 1.05 Flashpoint (COC-F): 186 Vapor Pressure (0 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 361 Softenina Point (F): 300 Service Temperature Range: (-65 to +260F) (-54 to 127C) Refractive Index (n20C/D+--03): 1.408 Hardness - Rockwell: M60 Gap Filled, Typical, Inches: -012 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): 7-10 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4500 T-peel strength, Steel/Steel, ASTM D-1876-83 (lbs/in 2): 13 Aluminum/Aluminum: 15.9 HP-3000: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 2500-4500 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 187 Vapor Pressure (0 7OC, mmHg): 5 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 356 Softening Point (F): 296 Service Temperature Range: (-65 to +260F) (-54 to 127C) Refractive Index (n20C/D+-.03): 1.442 Hardness - Rockwell: M50 Gap Filled, Typical, Inches: .020 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): lo-15 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 15-20 T-Peel strength, Steel/Steel ASTM D-1876-83 (lbs./in. 2): 15.4 Aluminum/aluminum: 17.6 HP-5000: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 4000-6000 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 187 Vapor Pressure (0 7OC, mmHg):. 5 Soluble in: Acetone, MEK, Nitron, I' ,ne, Methylene Chloride Melting Point (F): 356 Softening Point (F): 296 Service Temperature Range: (-65 to +26OF) (-54 to 127C) Refractive Index (n20C/D+-.03): 1.444 Hardness - Rockwell: M50 Gap Filled, Typical, Inches: .025 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): IO-15
Adhesives-Cyanoactyl&e
PERMABOND
INTERNATIONAL:
PERMABOND
Cyanoacrylates
(Instant
Adhesives): PERMABOND Cyanaoacrylate Adhesives are single component, solids adhesives which bond almost all close fitting surfaces in seconds. They cure at room temperature and bond metals, plastics, ceramics, elastomers and wood to each other and to themselves. The adhesives contain no solvents and are resistant to most chemicals and a broad range of temperature. Application may be directly from dispenser tipped bottles or from automatic dispensing equipment. They fixture in seconds and develop full cure strength of up to 4000 psi in hours. 100%
PERMABOND 910 Adhesive: Metal Bonding-General Purpose PERMABOND 910 bonds metals, plastics and rubber. It is especially well suited for metal bonding, providing superior strength. PERMABOND 910 resists long term exposure to temperatures up to 190F and short term peaks of up to 300F. Handling strength is reached as quickly as IO-30 seconds. Typical Application: * Wiper Blades & Other Rubber to Metal * Name Plates * Temporary Fixturing * Gear Shift Indicators * Meets MIL-A-46050C Type I Class 2 PERMABOND 910 FS Adhesive: Metal Bonding--Fast Cure, Post assembly applications PERMABOND 910 FS is a faster curing, low viscosity Version of PERMABOND 910. It is a penetrating adhesive that allows application to pre-assembled parts. Handling strength is reached in 5-15 seconds. 910 FS works best with gaps not exceeding .OOl". Typical Application: * Close fitting metal parts * Tamper proof adjustment screws * Lock set screws * Lock fasteners * Meets MIL-A-46050C Type I Class 1
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PERMABOND INTERNATIONAL: PERMABOND Cyanoacrylates PERMABOND 130 Adhesive: Metal Bonding--Intermediate
(Continued):
Gap Fill
PERMABOND 130 is an intermediate viscosity version of the 910 family. It provides excellent flow control for more uniform surface coverage, enhancing dispensing for automated assembly operations. Typical Application: * Bonding pressed metal parts * Bonding powdered metal parts * Bonding metal parts, where short term adjustment is required * Meets MIL-A-46050C Type I Class 3 PERMABOND 170 Adhesive: Metal Bonding--Maximum Gap Fill PERMABOND 170 is a slower curing, higher viscosity version of the 910 family. Because of the better gap filling capability it is well suited for production lines bonding molded parts, developing a strong bond rapidly on a wide variety of materials. Handling strength is achieved within seconds. Typical Application: * Potting * Fixturing * Bonding molded parts * Bonding porous metal parts PERMABOND 102 Adhesive: Plastic Bondina--General Puroose PERMABOND 102 is a medium viscosity, general purpose adhesive specifically formulated for plastics. PERMABOND 102 is fast setting, fixturing wihtin 5-30 seconds, achieving bond strengths up to 2500 psi after curing. Bonds material with small gaps. Typical Application: * Bonding Plastic Parts * High volume automatic applications requiring fast fixturing * Liquid Clamp * Meets MIL-A-46050C Type II Class 2
Adhesives-Cyanoacylate
PEREABOND INTERNATIONAL: PERMABoND Cyanoacrylates PERMABOND 101 Adhesive: Plastic Bonding--Fastest
157
(Continued):
Fixturing--Post Application
PERMABOND 101 is a low viscosity adhesive, ideal for use with tight fitting parts. It is PERMABOND's fastest setting cyanoacrylate formulated for elastics and other substrates. PERMABOND 101 is a penetrating adhesive that may be applied to pre-assembled parts. It is also an excellent adhesive for rubber and metals, reaching bond strengths up to 2500 psi. Designed to bond materials with gaps not exceeding .OOl". Typical Application: * Bonding close fitting plastic parts * Bonding pre-assembled parts * Locks plastic fasteners * Tamper proofs adjustable fasteners * Meets MIL-A-46050C Type II Class 1 PERMABOND 105 Adhesive: Elastomer Bonding PERMABOND 105 is specifically formulated for natural and synthetic rubber. This product reaches high bond strength in 5-15 seconds on closely fitted parts. Typical Application: * Bonds natural and synthetic rubber * Bonds hard to bond plastics * Meets MIL-A-46050C Type II Class 1 PERMABOND 108 Adhesive: Plastic Bonding--Intermediate
gaps
PERMABOND 108 is an intermediate viscosity adhesive. It exhibits better flow control for more uniform surface coverage. PERMABOND 108 dispenses consistently for automated assembly. Typical Application: * Bonds molded parts * Bonds ceramics * Bonds parts with rough surfaces * Excellent for tacking wires on PC boards
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PERMABOND INTERNATIONAL: PERMABOND Cyanoacrylates
(Continued):
PERMABOND 200 Adhesive: Wire Tacking Applications PERMABOND 200 is a higher viscosity adhesive providing greater gap filling capabilities. Perfectly formulated for wire tacking and other applications that require greater flow control, it fixtures in 15-40 seconds. Typical Application: * Wire Tacking * Component mounting * Potting * Encapsulating * Meets MIL-A-46050C Type II Class 3 PERMABOND 240 Adhesive: Plastic Bonding--Maximum Gap Fill PERMABOND 240 is the highest viscosity adhesive, providing maximum gap filling and maximum flow control. Typical Application: * Bonds molded parts with large gaps * Solvent resistant coating * Process aid, liquid clamp for large gaps * Can be used on porous substrates * Meets MIL-A-46050C Type II, Class 3 POWERBOND 920 Adhesive: High Temperature Metal Bonding--General Purpose POWERBOND 920 is a general purpose instant adhesive specifically formulated for high temperature metal bonding applications. 920 provides high strength and withstands heat aging temperatures of up to 500F on closely fitting metal parts. Typical Application: * Bonding closely fitted metal and ceramic parts for electronic and automotive applications
Adhesives-Cyanoacrylate
PERMABOND INTERNATIONAL: PERMABOND Cyanoacrylates
159
(Continued):
POWERBOND 919 Adhesive: High Temperature Metal Bonding--Fast Cure--Post Application POWERBOND 919 is a penetrating, high temperature instant adhesive specifically formulated for fast cure and post assembly applications. It develops high bond strength and resists heat aging temperatures up to 500F. Typical Application: * Bonding pre-assembled metal & ceramic parts for: * Electronic Applications * Automotive Applications POWERBOND 922 Adhesive: High Temperature Metal Bonding--Maximum Gap Fill POWERBOND 922 is a high temperature instant adhesive specifically formulated for maximum gap filling capabilities. 922's higher viscosity provides maximum flow control. It develops high bond strength and resists heat aging temperatures up to 500F. Typical Application: * Bonding parts with large gaps * Encapsulating * Bonds heat sinks
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PERMABOND INTERNATIONAL: PERMABOND High Performance Cyanoacrylate Adhesives: * Maximum Purity * Maximum Cure Through Gap * Plastic and Elastomer Bonding The PERMABOND 260 Series of adhesives represents the ultimate in cyanoacrylate purity. This increased purity provides improved performance on difficult to bond materials. The 260 series will bond faster through a larger gap than standard cyanoacrylates. The PERMABOND 260 series is ideal for high speed production line applications. The fast cure of the 260 series reduces frosting on parts and odor problems in the work area. PERMABOND 260 Adhesive: PERMABOND 260 is a penetrating adhesive for application on pre-assembled parts. * Meets MIL-A-46050C Type II Class 1 PERMABOND 261 Adhesive: PERMABOND 261 is a low viscosity adhesive for closely fitted parts. * Meets MIL-A-46050C Type II Class 1 PERMABOND 262 Adhesive: PERMABOND 262 is a medium viscosity adhesive for general purpose applications. * Meets MIL-A-46050C Type II Class 2 PERMABOND 265 Adhesive: PERMABOND 265 is an intermediate viscosity adhesive for improved flow control for more uniform surface coverage. PERMABOND 268 Adhesive: PERMABOND 268 is a high viscosity adhesive for maximum gap filling capabilities and maximum flow control. * Meets MIL-A-46050C Type II Class 3 Typical Application: * EPDM rubber bonding * High speed automated & robqtic assembly lines * Speaker component bonding * Gasket and seal bonding
Section III Adhesives Epoxy
161
162
Adhesives,
ABATRON,
Sealants
and Coatings for the Electronics
Industry
INC.: One-Component Epoxy Systems:
Solventless Casting, Adhesive and Coating Compounds for Structural and Electric Uses. ABOCAST 8504-l: All-purpose - Clear - Good balance of properties. ABOCAST 8504-5: Plasticized - Clear - Very high strength and impact. ABOCAST 8103-13: Low-viscosity - Clear - Easy casting; deep impregnation. ABOCAST 8103-14: Lowest-viscosity - Clear - Maximum wetting and penetration. ABOCAST 8501-6: High-temperature - Clear - Very high temperature uses. ABOWELD 8504-a: 8504-l in putty form - Black - Adhesive paste; heat transfer ABOWELD 8504-g: 8501-6 in putty form - Black - Very high temp., heat transfer ABOWELD 8007-6: Flexible paste - Gray-tan - High thermocycling requirements. Suggested Uses: Casting, Potting, Enscapulating, Embedding Applications where 2-component systems can not be used. Electronic and structural components, patterns, medical equipment. Coating, Impregnation, Resurfacing, Insulation. Bonding metal, ceramics, glass, most rigid materials. Assembly, Patching, Filling. Comparative Parameters: ABOCAST 8504-l: Viscosity (approx.): 12,000 cps Pot life @ IOOC: 200 minutes Cure cycle: l-2 hours 8 150-160C Hardness, Rockwell M: 115 Deflection temperature: 168C Flexural strength, psi: 12,000 Compressive II , II : 31,200 1, , II : 4,200 Tensile Elongation: 1.1% Flexural modulus (xl0 5): 4.0 Thermal conductivity: 4-4.8 x 10 ABOCAST 8504-S: Viscosity (approx.): 1,500 cps Pot life 8 IOOC: 220 min. Cure cycle: l-2 hours 8 ISO-16OC Hardness, Rockwell M: 95 Deflection temperature: 72C Flexural strength, psi: 14,500 Compressive II , II : 40,500 II : 8,900 Tensile I *I II : 7.6% Elongation II Flexural modulus ix10 5): 4.4 Thermal conductivity: 4-4.8 x 10
+ optional l-4 hrs 8 160-18OC
-4 Cal/cm s C
+ optional l-4 hrs 8 160-18OC
-4 Cal/cm s C
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ABATRON, INC.: One-Component Epoxy Systems(Continued1: Comparative Parameters(Continued): 8103-13: Viscosity (approx.): 600 cps Pot life 8 1OOC: 180 min. Cure cycle: l-2 hours 8 150-160C + optional l-4 hrs @ 160-180C Hardness, Rockwell M: 98 Deflection temperature: 104C Flexural strength, psi: 13,400 Compressive 11 , 11 : 13,100 II ' 11 : 6,400 Tensile Elongation: 3.3% Flexural modulus (x10 5): 3.9 Thermal conductivity: 4-4.8 x 10 -4 Cal/cm s C 8103-14: Viscosity (approx.): 200 cps Pot life @ 1OOC: 205 min. Cure cycle: l-2 hours @ 150-160C + optional l-4 hrs @ 160-180C Hardness, Rockwell M: 88 Deflection temperature: 79C Flexural strength, psi: 12,100 Compressive 11 , 11 : 10,900 I, Tensile I II : 8,400 Elongation: 5.1% Flexural modulus (x10 5): 3.3 Thermal conductivity: 4-4.8 x 10 -4 Cal/cm s C 8501-6: Viscosity (approx.): 17,000 cps Pot life 8 1OOC: 160 min. Cure cycle: l-2 hours 8 150-160C+optional l-4 hours 8 160-180C Hardness, Rockwell M: 121 Deflection temuerature: 255C Flexural strength, psi: 14,500 Compressive W , W : 35,400 Tensile II II : 3,800 Elongation: 0.7% ' Flexural modulus (x10 5): 5.0 Thermal conductivity: 4-4.8 x 10 -4 Cal/cm s C
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Adhesives, Sealants and Coatings for the Electronics Industry
ABATRON, INC.: 5 Variable-Ratio Epoxy Adhesives for Structural & Electric Applications: 2-component systems offering high strength and versatility ABOWELD/ABOCURE 48-8: High-viscosity, most versatile, fast hardening. ABOCAST/ABOCURE 45-10: Lower-viscosity, very versatile, faster then 48-8. ABOCAST/ABOCURE 37-10: Low-viscosity, easy to cast, slow, low exotherm. ABOCAST/ABOCURE 53-15: Variable-viscosity, easy to cast, fast-hardening. ABOWELD/ABOCURE 48-14: Thixotropic, for spreading & dipping, very slow. Suggested Uses: Bonding structural assemblies, like honey-comb sandwich doors and panels, aluminum or fiberglass panels on ships, trains, trucks and other carriers. Bonding, potting, encapsulating, dipping electric components like fuses, insulators, junction boxes, terminals, transformers, capacitors, diodes, switches, chips. Brushes, filters, laminates, furniture, mounts, repairs, patches. Comparative Parameters: ABOWELD 48-8: ABOCURE 48-8: Blend: Color: White: Black: Gray Viscosity: Poises 8 25-27C: 200 Pot Life 100 gm: 30-40 min Main Annlications: Assemblies/Panels/Reoairs/Mounts ABOCAST 45110: ABOCURE 45-10: Blend: Color: White: Black: Gray Viscosity: Poises @ 25-27C: 170 Pot Life 100 gm: 25-35 min Main Applications: Composites/Repair kits/Insulators/ Capacitors ABOCAST 37-10: ABOCURE 37-10: Blend: Color: White: Black: Gray Viscosity: Poises @ 25-27C: 100 Pot Life 100 gm: 2.5 hrs Main Applications: Loudspeakers/Magnets/Potting/Encapsulation ABOCAST 53-15: ABOCURE 53-15: Blend: Color: White: Black: Gray Viscosity: Poises 8 25-27C: 120-20 Pot Life 100 gm: 25-35 min Main Applications: Brushes/Potting/Impregnation/Injection ABOWELD 48-14: ABOCURE 48-14: Blend: Color: White: Black: Gray Viscosity: Poises 8 25-27C: Thixotropic Pot Life 100 gm: 8-11 hrs Main Applications: Fuses/Terminals/Dipping/Laminates
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ABATRON, INC.: ABOWELD 8005-4/ABOCURE 8005-4: Heavy Duty Dielectric & Structural Adhesive Paste, Filler and Patching Compound for Underwater, Marine, Cold and General Applications 2-Component, Gray Flexibilized Epoxy System. Suggested Uses: Heavy-duty industrial, electrical, marine and construction maintenance. Underwater repairs and maintenance by divers. Bonding metals and porcelain in SF6-Gas-filled power circuit breakers. Dielectric encapsulation of electronic components, especially where high thermocycling and shock resistance are needed. Shrinkfree, weatherproof embedments of cables and conduits in floors, ceilings and walls. General purpose adhesion, patching and maintenance. Specifications: ABOWELD 8005-4: Resin: White Thixotropic Paste, about 13 Lbs/ Gallon (1.5 Kg/Liter) ABOCURE 8005-4: Converter: Black Thixotropic Paste, about 12 Lbs/Gallon (1.4 Kg/Liter) Mixing Ratios: Equal parts (by weight or volume) Pot Life: 30 minutes at room temperature; faster with heating. Cure: Full strength is reached in 2-7 days at room temperature Characteristics: Formulated for versatility, high impact and thermoshock resistance. Outstanding adhesion to wet as well as dry surfaces, both under water (for skin-diver applications) and above. This property is also used where a permanent bonding surface is needed to literally weld wet new-poured concrete to old concrete, metal and other construction surfaces. Usable for applications at very low temperatures that would be too cold for conventional epoxy compounds. Virtually unaffected by atmospheric conditions, soft and salt water, alkalis and diluted acids, several solvents, detergents, oils and greases. Visual control of mixing and ratios. Streaks in the blend show insufficient mixing. Too light or dark gray indicate, respectively, too much resin or too much converter. Tenacious adhesion to metals, ceramics, wood, fiberglass, masonry and most materials, to form permanent structural and dielectric bonds.
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Adhesives, Sealants and Coatings for the Electronics Industy
BACON INDUSTRIES INC.: ALLABOND TWENTY/TWENTY Adhesive: ALLABOND TWENTY/TWENTY is an epoxy adhesive that has an over twenty minute working life at room temperature and a twenty second cure at 250F. It therefore combines a relatively long pot life and yet a very fast cure. It may be mixed by hand or dispensed conveniently and rapidly from automatic or hand metering and mixing equipment. TWENTY/TWENTY is ideal for production applications now requiring soldering, welding or brazing. Also available is TWENTY/TWENTY NM which is similar but does not contain ingredients that are magnetic. It should be considered for applications requiring a non-magnetic adhesive. The cured properties of the "NM" grade are essentially identical. Also available is TWENTY/TWENTY Clear which contains no fillers and pigments. It is fluid and runny and, after cure, is not quite as strong or stiff. Also available is electrically conductive Conducting TWENTY/TWENTY. Mixing and Handling Parameters: TWENTY/TWENTY: Resin: TWENTY/TWENTY Activator: BA-66B Parts by weight of activator required per hundred parts by weight of resin*: 10 Viscositv of mixed adhesive at 77F. noise: 55 Work Life at 77F, minutes: 40 . _ Pot Life (Tack-Free Time) at 77F, minutes: 45 Recommended Cure: 1 hr/ZOOF Alternate Cure: 20 sec/250F or 24 hr/77F Properties of TWENTY/TWENTY After Recommended Cure: Color: Black Specific Gravity: 1.50 Hardness, Shore D: 88 Lap Shear Strength to Aluminum, psi: 1 hr/ZOOF: 3000 24 hr/77F: 2800 Flexural Strength, psi: 1 hr/200F: 12000 24 hr/77F: 6000 Flexural Modulus, psi x 10 6: 1 hr/2OOF: 0.9 24 hr/77F: 0.6 ASTM Heat Distortion Temperature (264 psi), F: 163 Coefficient of Linear Expansion between -5OF and +120F, (ASTM E831), 10 -6/F: 26 Glass Transition Temperature (TMA), F: 169 Moisture Absorption at 77F after 24 hr immersion, %: 0.17 * With TWENTY/TWENTY Clear, use 16.2 parts by weight of Activator BA-66B per hundred parts by weight of resin (phc) and with Conducting TWENTY/TWENTY use 5.5 phc of Activator BA-66B.
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BOSTIK: Engineering Adhesives: BOSTIK 7575 Two Component Epoxy: BOSTIK 7575 is a two-component epoxy that cures in just five minutes to form strong bonds to metal, wood, ceramic, fabric, and some plastics. Convenient syringe dispenser pre-measures hardener and resin. Use 7575 for fast production, potting and maintenance applications. 7575: Designation: General purpose epoxy. Large gap filler. Cure Time: 5-10 min. Gap Fill: .050" Temperature Range: -65F to 250F Tensile Lbs/In: 3000 Impact Lbs/In: 25-30 Engineering Adhesives: M890 Acrylic Adhesive: M890 acrylic adhesive consists of a surface activator and adhesive that require no mixing and provide fast, permanent bonds even to plastics. M890 requires no special surface preparation. It forms tough, shock-resistant, water-resistant bonds with excellent shear and peel strengths. Recommended for use with all engineering materials including metal, rigid plastics, FRP's, hardwoods, rigid foams, ceramic and glass. M890: Designation: General purpose, high performance acrylic. Cure Time: 3-5 min. Gap Fill: .020" TemDeratUre Ranse: -65F to 250F Tensile Lbs/In:-3300 Impact Lbs/In: 40-50
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Adhesives, Sealants and Coatings for the Electronics Industry
CONAP, INC.: CONASTIC Dielectric Adhesive AD-20: Mix Ratio (Pbw) Part A/Part B: lOO/l7.5 Mixed Viscosity, cps @ 25C: 5500 Working Life @ 25C: (l/2 lb. mass) minutes: 15 Cure Schedule: Days @ 25C: 5-7 Hours @ 8OC: 4-6 Color: Opaque Amber Specific Gravity: 0.99 Shore A Hardness: 90 Tensile Strength, psi: 2000 Tear Strength, pli: 275 Elongation, %: 500 Water Absorption, %, 24 hr.130 days: 0.3/0.5 Linear Shrinkage, %: 1.00 Thermal Shock -70 to 130C (10 cycles): Passes Funaus Resistance: Non Nutrient Dieiectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds 8 25C: >120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 Hz: .030 a 1 MHz: .Oll Volume Resistivity,-ohm-cm: 2.10x10 15 Insulation Resistance, ohms: ,2.5x 10 13 CONASTIC Dielectric Staking Adhesive ST-115: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps @ 25C: Thixotropic Paste Working Life 8 25C (l/2 lb. mass) minutes: 30 Cure Schedule: Days @ 25C: 5-7 Hours @ 8OC: 4-6 Color: Opaque Specific Gravity: 1.01 Shore A Hardness: 90 Tensile Strength, psi: 1900 Tear Strength, pli: 275 Elongation; %: 450 Water Absorption, %, 24 hr./30 days: 0.3-0.5 Linear Shrinkage, %: 1.00 Thermal Shock -70 to 130C (IO cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 Hz: .030 @ 1 MHz: .Oll Volume Resistivity, ohm-cm: 2.10x10 15 Insulation Resistance, ohms: >2.5x 10 13
Adhesives-Epoxy
CONAP, INC.: CONATHANE EN-5: Mix Ratio (Pbw) Part A/Part B: 100117.5 Mixed Viscosity, cps @ 25C: 6000 Working Life 8 25C (l/2 lb. mass) minutes: 20 Cure Schedule: Days @ 25C: 5-7 Hours 8 80C: 4-6 Color: Opaque Amber Specific Gravity: 0.98 Shore A Hardness: 90 Tensile Strength, psi: 1950 Tear Strength, pli: 240 Elongation, %: 520 Water Absorption, %. 24 hr./30 davs: 0.4/0.5 Linear Shrinkage; %I 0.55 Thermal Shock -70 to 130C (IO cycles): Passes Funsus Resistance: Non NutrientDieiectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant 8 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor 8 100 Hz: -030 8 1 MHz: .Oll Volume Resistivity,.ohm-cm: 2.10x10 15 Insulation Resistance, ohms: ,2.5x10 13 CONATHANE EN-6: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 6000 Working Life 8 25C: (l/2 lb. mass) minutes: 120 Cure Schedule: Days @ 25C: N/A Hours 8 80C: 8 8 1OOC Color: Opaque Specific Gravity: 0.98 Shore A Hardness: 90 Tensile Strength, psi: 1950 Tear Strength, pli: 240 Elongation, %: 520 Water Absorption, %, 24 hr.130 days: O-4/0.5 Linear Shrinkage, %: 1.22 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" 8 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 Hz: .030 @ 1 MHz: -011 Volume Resistivity, ohm-cm: 2.10x10 15 Insulation Resistance, ohms: >2.5x 10 13
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CONAP, INC.: CONATHANE EN-7: Mix Ratio fPbw) Part A/Part B: 100117.5 Mixed Viscosity, cps @-25C: 5500 Working Life @ 25C (l/2 lb. mass) minutes: 35 Cure Schedule: Days @ 25C: 7 Hours @ 80C: 16 Color: Opaque Amber Specific Gravity: 1.01 Shore A Hardness: 90 Tensile Strength, psi: 2300 Tear Strength, pli: 320 Elonsation. %: 450 Water Absorption, %, 24 hr.130 days: .2/.43 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (10 cvcles): Passes Fungus Resistance: Non NutrientDielectric Strength, VPM, l/16" @ 25C: 785 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.00 @ 1 MHz: 2.80 Dissipation Factor @ 100 Hz: .032 @ 1 MHz: .012 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13 CONATHANE EN-8: Mix Ratio (Pbw), Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 5500 Working Life @ 25C (l/2 lb. mass) minutes: 10 Cure Schedule: Days @ 25C: 7 Hours @ 80C: 4-6 Color: Opaque Amber Soecific Gravitv: 1.01 Shore A Hardness: 90 Tensile Strength, psi: 2300 Tear Strength; plii 320 Elongation, %: 450 Water Absorption, %, 24 hr./30 days: .2-.43 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (10 cvcles): Passes Fungus Resistance: Non NutrientDielectric Strength, VPM, l/6" @ 25C: 785 Arc Resistance. seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.00 @ 1 MHz: 2.80 Dissipation Factor @ 100 Hz: .032 @ 1 MHz: .012 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13
Adhesives-Epoxy
CONAP, INC.: CONATHANE EN-g: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 6800 Working Life @ 25CC(1/2 lb. mass) minutes: 70 Cure Schedule: Days @ 25C: 7-10 Hours @ 80C: 16 Color: Opaque Specific Gravity: 1.01 Shore A Hardness: 85 Tensile Strength, psi: 2000 Tear Strength, pli: 275 Elongation, %: 450 Water Absorption, %, 24 hr.130 days: 0.2/0.4 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (IO cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 750 Arc Resistance, seconds 8 25C: >I20 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.00 @ 1 MHz: 2.80 Dissipation Factor 8 100 Hz: .032 @ 1 MHz: .012 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: >2.5xlO 13 CONATNANE EN-9 (OZR): Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 6800 Working Life @ 25C (l/2 lb. mass) minutes: 70 Cure Schedule: Days @ 25C: 7-10 Hours 8 80C: 8 Color: Opaque Specific Gravity: 1.01 Shore A Hardness: 85 Tensile Strength, psi: 2500 Tear Strength, pli: 275 Elongation, %: 450 Water Absorption, %, 24 hr./30 days: 0.2/0.4 Linear Shrinkage, %: 1.00 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.03 @ 1 MHz: 2.81 Dissipation Factor @ 100 Hz: .031 8 1 MHz: .OlO Volume Resistivity, ohm-cm: 3.42x10 15 Insulation Resistance, ohms: >2.5xlO 13
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Adhesives, Sealants and Coatings for the Electronics Industry
CONAP, INC.: CONATHANE EN-lo: Mix Ratio (Pbw) Part A/Part B: 100/37 Mixed Viscosity, cps 8 25C: 5000 Working Life @ 25C (l/2 lb. mass) minutes: 60 Cure Schedule: Days 8 25C: 7-10 Hours @ 8OC: 16 Color: Opaque Amber Specific Gravity: 0.99 Shore A Hardness: 75 Tensile Strength, psi: 1200 Tear Strength, pli: 180 Elongation, %: 500 Water Absoration. %. 24 hr.130 davs: .24/.43 Linear Shrinkage; %I 1.19 * Thermal Shock -70 to 130C (IO cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 710 Arc Resistance, seconds 8 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.10 @ 1 MHz: 2.70 Dissipation Factor 8 100 Hz: .027 8 1 MHz: .014 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13 CONATHANE EN-11: Mix Ratio (Pbw) Part A/Part B: 100/55 Mixed Viscosity, cps @ 25C: 5800 Working Life @ 25C (l/2 lb. mass) minutes: 50 Cure Schedule: Days 8 25C: 7-10 Hours @ 8OC: 16 Color: Opaque Amber Specific Gravity: 0.98 Shore A Hardness: 65 Tensile Strength, psi: 800 Tear Strength, pli: 140 Elongation, %: 400 Water Absorption, %, 24 hr.130 days: .23/.42 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non NutrientDielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant 8 100 Hz: 3.30 @ 1 MHz: 2.90 Dissioation Factor B 100 Hz: .027 @ 1 MHz: .009 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13
Adhesives-Epoxy
CONAP, INC.: CONATHANE EN-12: Mix Ratio (Pbw) Part A/Part B: 100/95 Mixed Viscositv. CDS (a 25C: 6500 Working Life @-25C‘(lj2 lb. mass) minutes: 40 Cure Schedule: Days @ 25C: 7-10 Hours @ 8OC: 16 Color: Opaque Amber Specific Gravity: 0.99 Shore A Hardness: 55 Tensile Strength, psi: 300 Tear Strength, pli: 90 Elongation, %: 250 Water Absorption, %, 24 hr./30 days: .2/.31 Linear Shrinkage, %: 1.25 Thermal Shock - 70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dieiectric Strength, VPM, l/16" @ 25C: 600 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.40 @ 1 MHz: 2.90 Dissipation Factor @ 100 Hz: .026 @ 1 MHz: .OlO Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13
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COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies: Rapid Gel: A-014BK/B-069: Mixed viscositv (CDS.) @ 77F: 2,500 Pot Life @ 77F: iO‘Min.Mixed Color: Black Gel Time @ 77F.: Mass: 15 Min. Film: 40 Min. Cure Time @ 77F. Initial: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: 2:l By Weight: 3.5:l A-018/B-033: Mixed Viscosity (cps.) @ 77F.: 15,000 Pot Life 8 77F: 3-5 Min. Mixed Color: Clear Gel Time @ 77F.: Mass: 5 Min. Film: 7 Min. Cure Time 8 77F. Initial: 15 Min. Resin:Hardener Mix Ratio: By Volume: I:1 By Weight: 1:l A-083/B-086: Mixed Viscosity (cps.) 8 77F.: 6,000 Pot Life C 77F.: 5 Min. Mixed Color: Lt. Green Gel Time @ 77F.: Mass: 7 Min. Film: 10 Min. Cure Time @ 77F. Initial: 20 Min. Resin:Hardener Mix Ratio: By Volume: 1:1 By Weight: I:1 Applications: Switches, Relays, Appliances, Speakers, Sporting Goods, Safety Equipment Intermediate Gel: A-005BK/B-005: Mixed Viscosity (cps.) @ 77F.: 14,000 Pot Life @ 77F: 35 Min. Mixed Color: Black Gel Time @ 77F.: Mass: 50 Min. Film: 2 Hrs. Cure Time @ 77F.: Initial: 8 Hrs. Resin:Hardener Mix Ratio: By Volume: IO:1 By Weight: 20:1
Adhesives-Epoxy
17s
COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Intermediate Gel(Continued): A-008/B-008: Mixed Viscosity (cps.) @ 77F: 600 Pot Life @ 77F: 45 Min. Mixed Color: Clear Gel Time @ 77F.: Mass: 60 Min. Film: 2-3 Hrs. Cure Time @ 77F. Initial: 16 Hrs. Resin:Hardener Mix Ratio: By Volume: I:1 By Weight: 1.2:1 A-036/B-011: Mixed Viscosity (cps.) @ 77F.: 5,000 Pot Life @ 77F.: 20 Min. Mixed Color: Tan Gel Time @ 77F.: Mass: 40 Min. Film: 2 Hrs. Cure Time @ 77F.: Initial: 8 Hrs. Resin:Hardener Mix Ratio: By Volume: 3:l By Weight: 6:l A-204BL/B-013: Mixed Viscosity (cps.) s 77F.: 4,000 Pot Life @ 77F.: 35 Min. Mixed Color: Blue Gel Time @ 77F.: Mass: 45 Min. Film: 3 Hrs. Cure Time @ 77F. Initial: IO Hrs. Resin:Hardener Mix Ratio: By Volume: 6.5:1 By Weight: 12:l A-254/B-456BK: Mixed Viscosity (cps.) @ 77F.: 2,300 Pot Life @ 77F: 40 Min. Mixed Color: Black Gel Time @ 77F.: Mass: 60 Min. Film: 3 Hrs. Cure Time @ 77F. Initial: 16 Hrs. Resin:Hardener Mix Ratio: By Volume: 1:l By Weight: 1.2:1 Applications: Potting or Encapsulation of Electrical/Electronic Subassemblies such as Voltage Regulators, Signal Systems, and Transformers.
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Adhesives, Sealants and Coatings for the Electronics Industry
COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Extended Gel: A-009/B-009: Mixed Viscosity (cps.) @ 77F.: 1,500 Pot Life @ 77F.: 90 Min. Mixed Color: Clear Gel Time @ 77F.: Mass: 3 Hrs. Film: 8 Hrs. Cure Time @ 77F.3 Initial: 24 Hrs. Resin:Hardener Mix Ratio: Bv Volume: 1:l By Weight: 1:l A-014BK/B-014: Mixed Viscosity (cps.) @ 77F.: 7,000 Pot Life @ 77F.: 60 Min. Mixed Color: Black Gel Time @ 77F.: Mass: 2 Hrs. Film: 4 Hrs. Cure Time @ 77F. Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 1:l By Weight: 1:l A-036BK/B-002: Mixed Viscosity (cps.) @ 77F.: 6,000 Pot Life @ 77F.: 2 Hrs. Mixed Color: Black Gel Time @ 77F.: Mass: 3-4 Hrs. Film: 6-8 Hrs. Cure Time @ 77F. Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 3:1 By Weight: 6:l A-055/B-058: Mixed Viscosity (cps.) @ 77F.: 500 Pot Life @ 77F.: 4 Hrs. Mixed Color: Clear Gel Time @ 77F.: Mass: 8 Hrs. Film: 12 Hrs Cure Time @ 77F.: Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 2:l By Weight: 2.2:1
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COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Extended Gel(Continued): A-085BK/B-085WH: Mixed Viscosity (cps.) 8 77F.: 80,000 Pot Life @ 77F.: 2 Hrs. Mixed Color: Grey Gel Time @ 77F.: Mass: 4 Hrs. Film: IO Hrs. Cure Time 8 77F. Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: I:1 By Weight: I:1 A-210/B-410: Mixed Viscosity (cps.) @ 77F.: 7,000 Pot Life @ 77F.: 4 Hrs. Mixed Color: Grey Gel Time 8 77F.: Mass: 8 Hrs. Film: 14 Hrs. Cure Time @ 77F.: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 2:1 By Weight: 2:l Applications: Products detailed provide both excellent Electrical Insulating Properties as well as High Compressive Strengths and Hardness Figures. Common uses include Electrical Brake and Clutch Manufacturing and Assembly, Electric Coils and Switches. Heat Cure Systems: A-018/B-029: Mixed Viscosity (cps.) 8 77F.: 600 Pot Life @ 77F.: 24 Hrs. Mixed Color: Clear Gel Time 8 200F: Mass: 40 Min. 8 250F: Film: 20 Min. Cure Time @ 200F: 4 Hrs. @ 250F: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: l.l:l By Weight: I:1
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Adhesives, Sealants and Coatings for the Electronics Industry
COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Heat Cure Systems (Continued): A-OZgBK/B-029: Mixed Viscosity (cps.) @ 77F: 3,000 Pot Life @ 77F: 16 Hrs. Mixed Color: Black Gel Time @ 200F: 45 Min. @ 250F: 25 Min. Cure Time @ 200F: 4 Hrs. @ 250F: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: 2.6:1 By Weight: 3.3:1 A-036/B-036: Mixed Viscosity (cps.) @ 77F: 15,000 Pot Life @ 77F.: 24 Hrs. Mixed Color: Tan Gel Time @ 200F: 40 Min. @ 250F: 20 Min. Cure Time @ 200F: 4 Hrs. @ 250F: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: 1:l By Weight: 1.3:1 D-105: Mixed Viscosity (cps.) 8 77F.: 300 Pot Life @ 77F.: 6 Months Mixed Color: Amber Gel Time @ 200F: 60 Min. @ 250F: 30 Min. Cure Time @ 200F: 6-8 Hrs. @ 250F: 3-5 Hrs. Resin:Hardener Mix Ratio: N.A. Applications: These Filled and Unfilled Systems have been used to Impregnate/Encapsulate High Voltage Coils, Transformers, Detectors and Resistors.
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ITW DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials: 5 MINUTE Epoxy: A rapid cure, medium viscosity epoxy for general purpose use. It is designed for bonding, potting, sealing and encapsulating all delicate electronic and mechanical components. It bonds rigid, durable substrates such as metals, ceramics, glass, concrete and wood in all combinations. It forms a clear, hard rigid bona or coating when fully cured in 4 hours. Design Performance: * Rapid 7 minute fixture * Hard, durable bonds * Easy mixing 1:l ratio * Good dielectric strength * Good solvent resistance 5-MINUTE Epoxy Gel: A very high viscosity, non-sagging epoxy that has high tensile strength and good solvent resistance. It bonds rough textures like concrete as well as smooth glass-like surfaces. Rapid cure allows handling in 7 minutes and use within an hour. Design Performance: * Non-sag, stay in place form * Fills gaps * Rapid cure * High strength to 2500 psi * Color coded mixing * Easy to meter and mix * Bonds concrete, wood, metal and ceramics 2-TON Clear Epoxy: A medium viscosity, high strength epoxy especially formulated for c00a clarity and water resistance. The viscositv urovides easy-dispensing; mixing and good wetting of rigid bondable substrates. Slower cure time allows for longer pot life and parts alignment. Design Performance: * Non-shrinking clear coating * High tensile strength to 2200 psi * Water and solvent resistant * Fills gaps and voids * Good impact strength
I80
Adhesives,
Sealants
and Coatings for the Electronics
Industy
ITW DEVCON: DEVCON Epoxy Adhesives for Bonding all Durable Materials (Continued): High Performance Epoxy: A high viscosity toughened epoxy with high impact, peel, and fatigue strength for use with all metals, laminates and structural parts. It has high tensile and tensile shear strength. Will fill gaps and bond rough surfaces. Bonds thermoset plastics to metals and each other. Design Performance: * Easy mixing * High impact, peel and fatigue * Fills gaps * Slow cure for parts positioning * High strength to 2500 psi * High dielectric strength * Good solvent resistance Only High Performance Epoxy is recommended for use with plastics. 5-MINUTE Epoxy: Mixed Vise. cps: 8,000 cps Pot Life Min.: 3 to 5 Min. Shrinkage in-/in.: 0.0216 Hardness Shore D: 85 Impact ft. lbs.: 1.084 Cured Density: 1.10 Thermal Cod.: 0.93 Thermal Exvan. x 10 -6 in./in. F: 88.5 Adhesive Shear psi: 1379 Compression Strength psi: 10,674 Flexural Strength psi: 11,496 Tensile Strength psi: 6305 Elastic Modulus psi: 2.43 Dielectric Strength V/Mil.: 490 Max. Temperature Resistance: 200 Functional Cure (80%): 314 - 1 hour Color: Clear Mix Ratio: 1:l
Adhesives-Epoxy
ITN DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials (Continued): 5-MIN. Gel: Mixed Vise. cps: Gel Pot Life Min.: 3 to 6 Min. Shrinkase in./in.: 0.0240 Hardness Shore D: 80 Cured Density: 1.17 Adhesive Shear usi: 2500 Dielectric Strength V/Mil.: 440 Max. Temperature Resistance: 200 Functional Cure (80%): 3/4 - 1 Hour Color: Amber Mix Ratio: I:1 Z-TON
Clear: Mixed Vise. cps: 4,000 cps Pot Life Min.: 8/12 Min. Shrinkage in./in.: 0.0035 Hardness Shore D: 83 Imnact ft. lbs: 1.246 Cured Density: 1.10 Thermal Cond.: 0.83 Thermal Expan. x 10 -6 in-/in. F: 161.5 Adhesive Shear psi: 2250 Compression Strength psi: 11,248 Flexural Strength psi: 11,202 Tensile Strencth osi: 5709 Elastic Modulus psi.: 2.07 Dielectric Strength V/Mil.: 600 Max. Temperature-Resistance: 200 Functional Cure (80%): 8 to 16 Hours Color: Clear Mix Ratio: I:1
High Perf.: Mixed Vise. cps: 50,000 cps Pot Life Min.: 40/60 Min. Shrinkage in-/in.: 0.0009 Hardness Shore D: 83 Cured Density: 1.20 Adhesive Shear psi: 2500 Dielectric Strensth V/Mil.: 550 Max. Temperature-Resistance: 200 Functional Cure (80%): 4 to 48 Hours Color: Grey Mix Ratio: I:1
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Adhesives, Sealants and Coatingsfor the Electronics Industry
ITW DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials (Continued): Special F Epoxy: Mixed Vise. cps: Paste Pot Life Min.: 150 Min. Shrinkage in-/in.: 0.001 Hardness Shore D: 85 Impact ft. lbs: 0.559 Cured Density: 2.46 Thermal Cond.: 1.21 Thermal Exnan. x 10 -6 in./in. F: 111.4 Adhesive Shear psi: 2472 Compression Strength psi: 12,386 Flexural Strength psi: 8210 Tensile Strength psi: 4367 Elastic Modulus psi: 2.74 Dielectric Strength V/Mil.: 100 Max. Temperature Resistance: 250 Functional Cure (80%): 16 to 36 Hours Color: Aluminum Mix Ratio: I:1 Plastic S. S-5: Mixed Vise. cps: Putty Pot Life Min.: 90 Min. Shrinkage in./in.: 0.0006 Hardness Shore D: 84 Impact ft. lbs: 0.389 Cured Density: 1.70 Thermal Cond.: 1.21 Thermal Expan. x 10 -6 in-/in. F: 116.0 Adhesive Shear psi: 1985 Compression Strength psi: 10,752 Flexural Strength psi: 5522 Tensile Strength psi: 3148 Elastic Modulus psi: 2.64 Dielectric Strength V/Mil.: 50 Max. Temperature Resistance: 225 Functional Cure (80%): 12 to 16 Hours Color: Dark Grey Mix Ratio: I:1
Adhesives-Epoxy
ITW DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials (Continued): 2-TON White: Mixed Vise. cps: Paste Pot Life Min.: 150 Min. Shrinkage in-/in.: 0.0035 Hardness Shore D: 85 Imoact ft. lbs: 0.3675 Cured Density: 1.85 Thermal Cond.: 1.06 Thermal Expan. x 10 -6 in./in. F: 79.4 Adhesive Shear psi: 2651 Compression Strength psi: 8449 Flexural Strength psi: 5649 Tensile Strength psi: 2256 Elastic Modulus psi: 2.25 Dielectric Strength V/Mil.: 365 Max. Temperature Resistance: 225 Functional Cure (80%): 16 to 36 Hours Color: White Mix Ratio: 1:l
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Adhesives,
DIMITER
Sealants
EMULSION
and Coatings for the Electronics
& CHEMICAL
CO.:
"F"
Industry
and "E" Series Epoxies:
Designed exclusively for Microelectronics Applications. "F" series electronically-conductive gold and silver Epoxies for bonding substrates, chip bonding, mounting Semiconductor chips in hybrid circuits. "F" and "E" series Epoxies represent the most complete selection of high technology, and uniquely qualified in solving most perplexing problems with standard or customformulated types. "Testing Program" available by request. F-17 E-21 E-22 PC-24 - "Photo-Cure" ~~-31 - "Photo-Polymer"
Adhesives-Epoxy
DOW CBEMICAL: Epoxy Products for Adhesives and Sealants: Bisphenol A Epoxy Resins: Liquid: D.E.R. 317: Epoxide Equivalent Weight: 192-203 Viscosity (cps): 16000-25000 Color: 5Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 330: Epoxide Equivalent Weight: 176-185 Viscositv (CDS): 7000-10000 Color: 125‘ c ’ Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 331: Epoxide Equivalent Weight: 182-192 Viscosity (cps): 11000-14000 Color: 125 Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 332: Epoxide Equivalent Weight: 172-176 Viscosity (cps): 4000-6000 Color: 75 Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 337: Epoxide Equivalent Weight: 230-250 Viscosity (cps): 400-800 Color: 3 Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 362: Epoxide Equivalent Weight: 185-205 Viscosity (cps): 4500-6500 Color: 1 Density (lbs/gal): 9.5 Flash Point (F): 485
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DOW CHEMICAL: Epoxy Products for Adhesives and Sealants (Continued): Diluted: D.E.R. 324: Epoxide Equivalent Weight: 197-206 Viscosity (cps): 600-800 Color: 3 Density (lbs/gal): 9.3 Flash Point (F): 350 D.E.R. 325: Epoxide Equivalent Weight: 185-201 Viscosity (cps): 1600-2800 Color: 2 Density (lbs/gal): 9.5 Flash Point (F): 375 Solid: D.E.R. 661: Epoxide Equivalent Weight: 500-560 Viscosity (cps): 400-800 Color: 1 Softening Point (C): 75-85 Cast Density (lbs/gal): 9.9 Specific Gravity: 1.18 D.E.R. 662: Epoxide Equivalent Weight: 575-685 Viscosity (cps): 900-2000 Color:
1
Softening Point (C!):84-94 Cast Density (lbs/gal): 9.9 Specific Gravity: 1.18 D.E.R. 664: Epoxide Equivalent Weight: 875-955 Viscosity (cps): 4000-8000 Color: 1 Softening Point (C): 98-108 Cast Density (lbs/gal): 9.9 Specific Gravity: 1.18
Adhesives-Epoxy
DOW CHEMICAL: Epoxy Products for Adhesives and Sealants (Continued): Polyglycol Resins: D.E.R. 732: Epoxide Equivalent Weight: 310-330 Viscosity (cps): 55-75 Color: 60 Density (lbs/gal): 8.9 Flash Point (F): 310 D.E.R. 736: Epoxide Equivalent Weight: 175-205 Viscosity (cps): 30-60 Color: 125 Density (lbs/gal): 9.5 Flash Point (F): 320 D.E.R. 755: Epoxide Equivalent Weight: 265-295 Viscosity (cps): 1000 Color: 2 Density (lbs/gal): 9.4 Flash Point (F): 310 Novolac Resins: D.E.N. 431: Epoxide Equivalent Weight: Viscosity (cps): 1100-1700 Color: 3 Density (lbs/gal): 10.1 Flash Point (F): 425
172-179
D.E.N. 438: Epoxide Equivalent Weight: 176-181 Viscosity (cps): 20000-50000 Color: 2 Density (lbs/gal): 10.2 Flash Point (F): 425
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DOW CHEMICAL: Epoxy Products for Adhesives and Sealants (Continued): TACTIX Resins: TACTIX 785: Epoxide Equivalent Weight: 165-195 Viscosity (cst): 400-1150 Color: N/A Softening Point (C): 66-85 Flash Point (F): N/A TACTIX 742: Epoxiae Equivalent Weight: 150-170 Viscosity (cst): 25-60 Color: 13 Softening Point (Cl: semi-solid Flash Point (F): N/A TACTIX 695: Epoxiae Equivalent Weight: 640-665 Viscosity: 2000-6000 (cps) Color: N/A Softening Point (C): semi-solid Flash Point (F): N/A
Adhesives-Epoxy
189
FENWAL INC.: TRU-BOND Epoxy Adhesives: TRU-BOND 201: High Strength--Thermosetting (Epoxy Type--loo% Solids)
Structural Adhesive
TRU-BOND 201 - Structural adhesive for bonding dissimilar or like surfaces of metals, ceramics, concrete, abrasives, wood products, thermosetting plastics, etc. Easy to use with a SO/SO ratio by weight or volume. TRU-BOND 201 can be room temperature or heat cured to produce higher strengths. Cured assemblies have a degree of resilience making them resistant to shock loading. Suitable for use with temperatures of -1OOF to +250F, showing good retention of properties over the range. Properties: Color: Gray Pot Life (100 gms.): 2 hours @ 75F Consistency: Flowable Paste Shear Tensile (psi) @ -65F: 3200 75F: 4100 180~: 1200 Hardness, Shore D: 85/05 Specific Gravity (Cured System): 1.27 TRU-BOND 203: High Strength Thixotropic Adhesive (100% Solids) TRU-BOND 203 is a modified epoxy adhesive which had tenacious adhesion to most substrates. It has a buttery consistency and is supplied with a choice of three curing agents to cover a wide range of applications. TRU-BOND 203 may be used in the bonding of metals, rubber, ceramics, plastics, foams, wood, etc., to themselves and to each other. It is 100% solids and resistant to oil, gasoline, jet fuel, hydraulic fluid, acids, alkalis, salt, moisture, etc. It is a true insulator and is used in the prevention of corona and galvanic attack. TRU-BOND 203 handles easily, like spreading soft butter. It is generally applied with a spatula or trowel, and has excellent leveling properties in the filling of voids and non-uniform surfaces. Selection of Curing Agent: 901: Produces firm bonds with excellent physical properties 902: Produces firm bonds and withstands continuous temperatures up to 300F. 907: Produces structural bonds with most materials. 911: Produces structural bonds with most materials and is used for the bonding of rubber to itself and other substrates.
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Adhesives, Sealants and Coatings for the Electronics Industry
FENWAL INC.: TRU-BOND Epoxy Adhesives
(Continued):
TRU-BOND 203/911: High strength thixotropic adhesive TRW-BOND 203 used in equal portions with Curing Agent 911 is a 100% solids, structural adhesive. It can be cured at room temoerature and develoos full strensth in 48 hours. It handles easily and having the consistency of soft butter, it is easily applied with a trowel or spatula. TRU-BOND 203 does not flow after aoolication. makins it easv to spread to the right thickness. It-is used for the-structural bonding of metals; glass, ceramics, rubber, cellulose products, thermosetting resins and foams, to themselves and to each other. TRU-BOND 203 is an excellent adhesive for the bonding of "sandwich" panels. Properties: Type: Epoxide Color: Opaque Shear Tensile, psi (Al to Al): 3,000 Consistency: Thixotrooic Dielectric-Strength, volts/mil: 400 Dielectric Constant 8 10 3 cps: 3.55 Volume Resistivitv: 10 15 Pot Life: 2 hrs. in 100 gram batches Time to Harden: 4 to 6 hrs. @ R.T. Cure Schedule: 48 hrs. @ 70F., or 1 hour @ 150F TRU-BOND 204: Flexible Adhesive TRU-BOND 204 is an excellent bonding agent where the resilient bonds and low temperature characteristics are required. It is particularly suitable for bonding materials having unlike coefficients of thermal expansion. Properties: Pot Life, minutes: 23 Hardness @ 5 days, Shore Tensile Shear Strength @ Tensile Shear Strength @ Tensile Shear Strength @ Cure Cycle: Curing Temperature 68. 104 158 212 266
(F)
D: 85 -4OF, psi: 2470 68F, psi: 3200 158F, psi: 750 Minimum Time 30 hours 10 hours 3 hours 45 minutes 15 minutes
Adhesives-Epoxy
FENWAL INC.: TRW-BOND Epoxy Adhesives
191
(Continued):
TRU-BOND 205: Epoxide Adhesive (Casting - Laminating - Adhesive) TRU-BOND 205 is a two-part system, formulated for variable flexibility and hardness and is used as an adhesive, a casting resin and for laminating applications. Flexibility and hardness are changed by using different ratios of resin/hardener. The resin is extremely tough and impact resistant, having a high peel strength, long pot life, low shrinkage and low exotherm. TRU-BOND 205 has superior qualities for embedments, having a high dielectric strength and excellent electrical properties. Properties: Color: Amber, may be blended with fillers Adhesion: Tenacious to metals, ceramics & thermosetting elastics Pot Life (100 grams): 2 hours 82/78 Hardness, Shore D Ratio: (Parts by weight): 60/40 62/58 so/50 40/60 30170 Ratio of Resin to Hardener, 60/40 (Castins): Tensile, psi: 6,600 . Compressive Strength, psi: 12,000 Flexural Strength; psii 12,300 Specific Gravity: 1.06 Coef. Linear Expansion, in/in/C: 37x10 -6 Dielectric Strength, volts/mil: 430 Dielectric Constant, 10 3 cps: 3.32 Volume Resistivity (ohm-cm): 1.1 x IO 14 Arc Resistance (sec.): 82 Power Factor, 10 3 cps: 0.0108 Ratio of Resin to Hardener, 50/50 (Laminating): Flexural Strength, psi: 60,000 Flexural Modulus of Elasticity, psi: 2.5 x 10 -6 Tensile Strength, psi, 80F: 50,000 Cure schedule: 300F: 10 minutes 200F: 45 minutes 150F: 120 minutes
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Adhesives, Sealants and Coatings for the Electronics Industy
FENNAL INC.: TRU-BOND Epoxy Adhesives
(Continued):
TRU-BOND 206: Conductive Adhesive Solder TRU-BOND 206 is a two-part, epoxide based compound used for bonding components requiring good electrical conductivity. It is used in manv aonlications where hot solder would damage or destroy the el&trical or electronic components. It may also be used in cases where hot solder will not bond to the types of metals or metal wires to be joined. The volume resistivity is less than 1 x 10 -3 ohm cm, and bond strengths range as high as 2500 lbs. per inch in shear. In using this conductive solder, the same care should be taken to clean the parts to be bonded as setup for standard epoxy adhesives. Parts should be free of paint, oil, dirt or other foreign materials when preparing so as to prevent weak boundary layers between the substrates. Application Data: Ratio, parts by weight, A/B: 100/6 Pot life: 25 minutes, approximate Time to harden: 45 to 60 minutes at 70F Cure: 48 hours at 70F or 1 hour at 130F TRU-BOND 208: Epoxide Adhesive: High Peel Strength TRU-BOND 208 is a two-part epoxide-based resin adhesive which is used in equal proportions by weight, Part A to Part B. It has good shear and peel strength and is used for bonding most substrates to themselves and to each other. TRU-BOND 208 has good dielectric strength and the cured adhesive has excellent resistance to oils, gasoline, JP4 jet fuel, salt spray, acids, alkalis and most solvents. TRU-BOND 208 is used in the construction of honeycomb panels and other types of core construction. Properties: Pot Life, hours: 2 Initial Mix Viscosity, cps: 8000 Color: Amber Dielectric Strength, volts/mil: 450 Tensile shear strength @ 75F. psi: 1000 Tensile shear strength @ 75F, cured 24 hours @ 75F, psi: 500 Chemical resistance - Tensile shear strength (psi) @ 75F after 7 days immersion in: Type 3 Hydrocarbon Fluid: 1000 JP4 Fuel: 1000 Distilled H20: 700 Cure Schedules: 75F: 7 days 160F: 1 hour 250F: 20 minutes
Adhesives-Epoxy
FENWAL INC.: TRW-BOND Epoxy Adhesives
193
(Continued):
TRU-BOND 209: Structural Adhesive - High Shear Strength TRU-BOND 209 is a 100% solids modified epoxy adhesive used for the structural assembly of metals, ceramics, rigid plastics, rubber, foams, etc. TRU-BOND 209 is sufficiently flowable to give uniform surface wetting and coverage with application by brush, roller, knife or spatula. It is a two-component mixture consisting of equal parts by weight and may be metered visually for non-critical applications. Description: Type: two-component, modified epoxy Color: opaque Tensile shear strength, psi (Al to Al): 3,000 Consistency: Moderate Thixotrope Pot Life (100 grams), hours: 2 Time to Set (Hours at room temperature): 4 to 6 Time to Cure - Hours at 70F: 48 Hours at 15OF: 1 TRU-BOND 210: Epoxy Resin Base, High Shear Past Adhesive TRU-BOND 210 is a thixotropic, epoxy paste compound which meets all requirements of MMM-A-187a. TRU-BOND 210 is 100% solids, a two-part system and is used in an equal part ratio by volume or by weight. It does not run, drip or sag when used in sections up to l/16". With properly cleaned surfaces, TRU-BOND 210 bonds securely under contact only and at room temperatures or moderate elevated temperatures. Properties: Type: non sag paste Color: light gray Pot Life (100 grams @ 75F): 90 minutes Shear strength, Al to Al: -65~: 2,000 psi 75F: 4,000 psi 160F: 1,200 psi Ratio: equal parts by weight or volume
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Adhesives, Sealants and Coatings for the Electronics Industry
FENWAL INC.: TRU-BOND Epoxy Adhesives
(Continued):
TRU-BOND 212: Conductive Adhesive solder TRU-BOND 212 is a two-part thixotropic epoxy which is filled with conductive silver powder. The system combines a convenient equal parts mix ratio with a long pot life and rapid cure under heat. TRU-BOND 212 is intended for use in demanding electronics applications. Volume resistivity is a low 0.0003 ohm-cm. As a 100% solids system it also has applications where low outgassing is required. In using this conductive solder, the same care should be taken to clean the parts to be bonded as set up for standard epoxy adhesives. Parts should be free of paint, oil, dirt or other foreign materials when preparing so as to prevent weak boundary layers between the substrates. Application Data: Ratio A/B: lOO/lOO PBW Pot Life: 4 days 8 77F Cure Schedule: 1 min. @ 345F or 5 min. @ 300F or 15 min. @ 250F or 1 l/2 hrs. @ 175F Tensile Shear Strength: 1450 psi Heat Deflection Temp.: 130F TRU-BOND 214: Silver-Filled Epoxy Adhesive Federal Specification MMM-A-1931 Types 1 & 2 TRU-BOND 214 is a two-part, room temperature curing, conauctive epoxy which meets Federal Specification MMM-A-1931 types l&2. It is suited for any application where hot soldering is impractical. The adhesive has proven successful in the preparation of conductive paths on circuit boards and in the preparation of electrodes for capacitance and loss measurement. Properties: Color: silver Percent solids: 100 Sag flow, at l/4": non-sag Pot life, minutes: 60 Volume resistivity, ohm/cm: 0.003 Hardness, Shore D: 80 Corrosivity (FED sta 175,4031): non-corrosive Tensile shear strength @ -67F, psi: 1200 Tensile shear strength @ 73F, psi: 1200 Tensile shear strength @ 140F, psi: 1200
Adhesives-Epoxy
H.B. FULLER CO.: Electrical/Electronic
Products: Epoxies:
FE-0004: Viscosity of Blend @ 25C, cps: 62,500 Mix Ratio by Weight(A/B): 100/111 Pot Life @ 25C: 60-120 Min. Max Exotherm C: 37 Typical Cure Schedule: 24 Hrs. @ 25C Color: Tan Specific Gravity: 1.31 Hardness: 90 Shore D Tensile Properties: Strength, PSI: 5,700 Elongation, %: 3.5 Maximum Operating Temperature, C: 130 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 62.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 158 Glass Transition Temperature (TG) C: 73 Dielectric Constant 8 23C: 60HZ: 3.75 Dielectric Constant @ 23C: 100KHZ: 3.62 Dissipation Factor 8 23C: 60HZ: 0.00642 Dissioation Factor B 23C: 100HZ: 0.0150 Volume Resistivity @ 23C (ohm-cm): 6.9x10 15 Offers low exotherm properties coupled with excellent heat resistance. This product is QPL'D against MMM-A-134, Type I. FE-0086: Viscosity of Blend @ 25C, cps: 55,000 Mix Ratio by Weight (A/B): 100/150 Pot Life @ 25C: 60-120 Min. Max Exotherm C: 93 Typical Cure Schedule: 48 Hrs. @ 25C Color: Gray Specific Gravity: 1.32 Hardness: 95 Shore A Tensile Properties: Strength, psi: 1,900 Elongation, %: 150 Maximum Operating Temperature C: 80 Thermal Conductivity CAL/CM-SEC-C: 9.4x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 75.3 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 177 Glass Transition Temperature (TG) C: 3 Dielectric Constant @ 23C: 60HZ: 6.53 Dielectric Constant @ 23C: 100HZ: 4.63 Dissipation Factor @ 23C: 60HZ: 0.164 Dissination Factor 8 23C: 100KHZ: 0.0736 Volume Resistivity @ 23C (ohm-cm): 8.8x10 11 Offers outstanding flexibility, good electrical properties and excellent adhesion to a variety of difficult-to-bond plastics.
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Adhesives, Sealants and Coatings for the Electronics Zndzuty
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Epoxies
FE-0185: Viscosity of Blend 8 25C, cps: Thixotropic Mix Ratio By Weight (A/B): One Component Pot Life @ 25C: N/A Max Exotherm C: N/A Typical Cure Schedule: 4 Hrs. @ 15OC Color: Tan Specific Gravity: 1.15 Hardness: 86 Shore D Tensile Properties: Strength, PSI: 8,400 Tensile Properties: Elongation, %: 15.1 Maximum Operating Temperature C: I55 Thermal Conductivity CAL/CM-SEC-C: 6.4x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 76.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 160 Glass Transition Temoerature ITG) C: 91 Dielectric Constant @ 23C: 6OHZ:.3.97 Dielectric Constant 8 23C: IOOKHZ: 3.75 Dissipation Factor: 60HZ: 0.0106 Dissipation Factor: 100KHZ: 0.0252 Volume Resistivity @ 23C: (ohm-cm): 6.5x10 15 Exhibits thixotropy at room temperature, but is self leveling at cure temperature. Excellent heat resistance and toughness. FE-4066: Viscosity of Blend @ 25C, cps: 12,000 Mix Ratio By Weight (A/B): 100/67 Pot Life @ 25C: 90-160 Min. Max Exotherm C: 73 Typical Cure Schedule: 48 Hrs. @ 25C Color: Light Straw Specific Gravity: 1.07 Hardness: 75 Shore D Tensile Properties: Strength, PSI: 7,980 Tensile Properties: Elongation, %: IO.4 Maximum Operating Temperature, C: I30 Thermal Conductivity CAL/CM-SEC-C: 6.6x10 -4 Thermal Coefficient of Expansion: urn/m/C: Alpha I: 80.1 Thermal Coefficient of Expansion: urn/m/C: Alpha 2: 179 Glass Transition Temperature (TG) C: 83 Dielectric Constant 8 23C: 60HZ: 3.26 Dielectric Constant @ 23C: IOOKHZ: 3.14 Dissipation Factor @ 23C: 60HZ: 0.00719 Dissipation Factor @ 23C: 100KHZ: 0.0193 Volume Resistivity 8 23C (ohm-cm): 1.2x10 I6 Offers a long pot life in conjunction with excellent electrical properties. Meets MIL-A-81236 when blended at 5A/4B by volume. FDA 175.105 and 175.300 component approved.
Adhesives-Epoxy
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Epoxies
FE-7004: Viscosity of Blend 8 25C, cps: 7,500 Mix Ratio By Weight(A/B): 100/42 Pot Life @ 25C: 50-70 Min. Max. Exotherm C: 117 Typical Cure Schedule: 24 Hrs. @ 25C Color: Amber Specific Gravity: 1.09 Hardness: 85 Shore D Tensile Properties: Strength, PSI: 8,730 Tensile Properties: Elongation, %: 9.8 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.1x10 -4 Thermal Coefficient of EXDanSiOn urn/m/C: Aloha 1: 80.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 203 Glass Transition Temperature (TG) C: 49 Dielectric Constant @ 23C: 60HZ: 3.01 Dielectric Constant @ 23C: 10OKHZ: 2.88 Dissipation Factor @ 23C: 60 HZ: 0.0110 Dissipation Factor @ 23C: 100KHZ: 0.0186 Volume Resistivity @ 23C (ohm-cm): 6.7x10 15 Offers excellent electrical property performance coupled with outstanding versatilty within the product line. FE-7014: Viscosity of Blend @ 25C, cps: 1,500 Mix Ratio By Weight (A/B): 100/42.5 Pot Life @ 25C: 50-70 Min. Max. Exotherm C: 127 Typical Cure Schedule: 24 Hrs. @ 25C Color: Amber Specific Gravity: 1.06 Hardness: 80 Shore D Tensile Properties: Strength, PSI: 8,430 Tensile Properties: Elongation, %: 10.0 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.7x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 77.2 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 190 Glass Transition Temperature (TG) C: 67 Dielectric Constant @ 23C: 60HZ: 3.40 Dielectric Constant @ 23C: 100KHZ: 3.25 DiSSiDatiOn Factor P 23C: 60HZ: 0.0111 Dissipation Factor @ 23C: 100KHZ: 0.0192 Volume Resisivity @ 23C (ohm-cm): 1.3x10 16 Low-viscosity, general-purpose potting epoxy.
I97
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Adhesives, Sealants and Coatings for the Electronics Industy
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Epoxies
FE-7041: Viscosity of Blend 8 25C, cps: 1,750 Mix Ratio By Weight (A/B): 100/43 Pot Life @ 25C: 50-70 Min. Max Exotherm C: 125 Typical Cure Schedule: 24 Hrs. 8 25C Color: Amber Specific Gravity: 1.08 Hardness: 86 Shore D Tensile Properties: Strength, PSI: 9,900 Tensile Properties: Elongation, %: 10.9 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.0x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 86.1 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 261 Glass Transition Temperature (TG) C: 62 Dielectric Constant @ 23C: 60HZ: 3.31 Dielectric Constant @ 23C: 100KHZ: 3.16 Dissipation Factor @ 23C: 60HZ: 0.00894 Dissipation Factor 8 23C: 100KH.Z: 0.0194 Volume Resistivity 8 23C (ohm-cm): 1.2x10 16 Low-dermatetic version of FE-7014 FE-7074: Viscosity of Blend @ 25C, cps: 20,000 Mix Ratio By Weight (A/B): 100/42 Pot Life @ 25C: 60-100 Min. Max Exotherm C: 123 Typical Cure Schedule: 24 Hrs. @ 25C Color: Light Amber Specific Gravity: 1.08 Hardness: 80 Shore D Tensile Properties: Strength, PSI: 7,910 Tensile Properties: Elongation, %: 15.8 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.8x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 76.8 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 193 Glass Transition Temoerature(TG) C: 67 Dielectric Constant ‘@ 23C: 6iHZi 3.28 Dielectric Constant @ 23C: IOOKHZ: 3.12 Dissipation Factor @ 23C: 60HZ: 0.0129 Dissipation Factor @ 23C: 100KHZ: 0.0188 Volume Resistivity @ 23C (ohm-cm): 1.2x10 16 Low-dermatetic version of FE-7004
Adhesives-Epoxy
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Epoxies:
FE-7200: Viscosity of Blend @ 25C, cps: 180 60% Solids Mix Ratio By Weight (A/B): 100/45 Pot Life @ 25C: 18-60 Hrs Max Exotherm C: N/A Typical Cure Schedule: See Data Sheet Color: Amber Specific Gravity: 1.07 Hardness: 93 Shore A Tensile Properties: Strength, PSI: N/A Tensile Properties: Elongation, %: N/A Maximum Operating Temperature, C: 80 Thermal Conductivity CAL/CM-SEC-C: 6.6x10 -4 Thermal Coefficient of Expansion inn/m/C: Alpha 1: 116 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 274 Glass Transition Temperature (TG) C: 16 Dielectric Constant @ 23C: 60HZ: 4.42 Dielectric Constant @ 23C: 100KHZ: 3.47 Dissipation Factor @ 23C: 60HZ: 0.0788 Dissipation Factor @ 23C: 100KHZ: 0.0428 Volume Resistivity @ 23C (ohm-cm): 1.4x10 13 Excellent choice for conformal coating applications. This solvent-cut coating offers excellent electrical property performance. FE-7233: Viscosity of Blend @ 25C, cps: 750 98% Solids Mix Ratio By Weight (A/B): 100/46 Pot Life @ 25C: 35-65 Min. Max Exotherm C: 150 Typical Cure Schedule: 24 Hrs. @ 25C Color: Clear Specific Gravity: 1.11 Hardness: 86 Shore D Tensile Properties: Strength, PSI: 9,040 Tensile Properties: Elongation, %: 10.6 Maximum Operating Temperature C: 95 Thermal Conductivity CAL/CM-SEC-C: 6.1x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 66.5 Thermal Coefficient of ExDansion urn/m/C: Aloha 2: 193 Glass Transition Temperature (TG) C: 52 _ Dielectric Constant @ 23C: 60HZ: 3.80 Dielectric Constant @ 23C: 100KHZ: 3.55 Dissipation Factor @ 23C: 60HZ: 0.00857 Dissipation Factor @ 23C: IOOKHZ: 0.0251 Volume Resistivity @ 23C (ohm-cm): 6.0x10 15 Optically clear when blended void free at thicknesses less than 0.25 inches.
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Adhesives, Sealants and Coatings for the Electronics Industry
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Epoxies
FE-7235: Viscosity of Blend 8 25C, cps: 3,000 Mix Ratio By Weight (A/B): 100/82 Pot Life @ 25C: 15-25 Min. Max Exotherm C: 137 Typical Cure Schedule: 24 Hrs. @ 25C Color: Transparent Amber Specific Gravity: 1.06 Hardness: 83 Shore D Tensile Properties: Strength, PSI: 8,110 Tensile Elongation, %: 8.7 Maximum Operating Temperature, C: 80 Thermal Conductivity CAL/CM-SEC-C: 5.7x10 -4 Thermal Coefficient of Expansion urn/m/C: Aloha 1: 66.9 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 199 Glass Transition Temperature (TG) C: 37 Dielectric Constant $ 23C: 60HZ: 3.40 Dielectric Constant 8 23C: 100KHZ: 2.99 Dissipation Factor @ 23C: 60HZ: 0.0122 Dissipation Factor @ 23C: 100KHZ: 0.0110 Volume Resistivity @ 23C (ohm-cm): 1.0x10 16 Fast-curing, clear, amber potting compound FE-7600: Viscosity of Blend @ 25C, cps: 100,000 Mix Ratio By Weight (A/B): 100/33.3 Pot Life @ 25C: 50-100 Min. Max Exotherm C: 63 Typical Cure Schedule: 48 Hrs. @ 25C Color: Black Specific Gravity: 1.36 Hardness: 89 Shore D Tensile Properties: Strength, PSI: 6,000 Tensile Properties: Elongation, %: 7.0 Maximum Operating Temperature C: 105 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 55.3 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 160 Glass Transition Temperature (TG) C: 64 Dielectric Constant @ 23C: 60HZ: 34.0 Dielectric Constant B 23C: IOOKHZ: 15.9 Dissipation Factor @-23C: 60HZ: 0.444 Dissipation Factor @ 23C: 10OKHZ: 0.180 Volume Resistivity @ 23C (ohm-cm): 3.2x10 9 Excellent coice where hardness, machineability, and electrical semi-conductivity properties are required.
Adhesives-Epoxy
H.B. FULLER CO.: Electrical/Electronic (Continued):
201
Products: Epoxies
FE-7610: Viscosity of Blend @ 2X, cps: Thixotropic Mix Ratio By Weight (A/B): 100/30 Pot Life @ 25C: 60-100 Min. Max Exothkm C: 60 Typical Cure Schedule: 48 Hrs. @ 25C Color: Metallic Grav Specific Gravity: 1137 Tensile Properties: Strength, PSI: 4,000 Tensile Properties: Elongation, %: 3.0 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 13.9x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 71.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 200 Glass Transition Temperature (TG) C: 69 Dielectric Constant @ 23C: 60H.Z: 7.73 Dielectric Constant B 23C: 100KHZ: 7.59 Dissipation Factor @-23C: 60HZ: 0.00801 Dissipation Factor @ 23C: IOOKHZ: 0.00940 Volume Resistivity @ 23C: (ohm-cm): 1.2x10 16 Thixotropic, non-electrically conductive version of FE-7600 FE-7800: Viscosity of Blend @ 25C, cps: 1,200 Mix Ratio BY Weisht(A/B): 100/43.5 Pot Life L 25C: SO-75 Min. Max Exothkm C: 98 Typical Cure Schedule: 24 Hrs. @ 25C Coior: Amber Specific Gravity: 1.06 Hardness: 82 Shore D Tensile Properties: Strength, PSI: 6,400 Tensile Properties: Elongation, %: 15.5 Maximum Operating Temperature C: 95 Thermal Conductivity CAL/CM-SEC-C: 6.3x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 87.7 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 205 Dielectric Constant @ 23C: 60HZ: 3.27 Dielectric Constant P 23C: 100KHZ: 3.07 Dissipation Factor @-23C: 60HZ: 0.0183 Dissipation Factor @ 23C: 100KHZ: 0.0175 Volume Resitivity @ 23C (ohm-cm): 4.3x10 15 Offers excellent toughness and impact resistance coupled with excellent electrical properties.
202
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: EPIBOND Die Attach Adhesives: Epoxy: EPIBOND 7002M: Color/Filler Type: silver Specific Gravity: 3.0 System Application Method: Stamping Pot Life 25C (days): 4 Gel Time 150C (minutes): l/165 or 1.5/150 Die Shear Strength (psi): >3000 Thermal Conductivity: 40 Weight Loss 300C (%): (0.3 Tg (C): 150 CTE (in/in/C)xlO -6: Alpha 1: 50 Alpha 2: 190 Volume Resistivity 25C (ohm-cm): <.OOOl Shelf Life (months/C): 12/-40 Potassium t2 Ammonium (1 Chloride ~7 Sodium (2 EPIBOND 7002-50M: Color/Filler Tvoe: silver Specific Gravity: 3.6 System Application Method: Syringe dispenser Pot Life-25C (days): 4 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/165 or 1.5/150 Die Shear Strength (psi): >3000 Thermal Conductivity: 42 Weight Loss 300C (%): (0.2 Tg (C): 155 CTE (in/in/C)xlO -6: Alpha 1: 50 Alpha 2: 186 Volume Resistivity 25C (ohm-cm): <.OOOl Shelf Life (months/C): 12/-40 Long pot life, high purity, electrically conductive adhesives. Storable at -40C. EPIBOND 7002-100M: Color/Filler Type: silver Specific Gravity: 3.9 System Application Method: Screen printing Pot Life 25C (days): 4 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/165 or 1.51150 Die Shear Strength (psi): iZOO Thermal Conductivity: 45 Weight Loss 300C (%j: 0.25 Tg (C): 150 CTE (in/in/C)xlO -6: Alpha 1: 45 Alpha 2: 152 Volume Resistivitv 25C (ohm-cm): <.OOOl Shelf Life (month&/C): i2/-4C Long pot life, high purity, electrically conductive adhesives. Storable at -40C.
Adhesives-Epoxy
203
FURANE PRODUCTS: EPIBOND Die Attach Adhesives: Epoxy (Continued): EPIBOND 7007-50M: Color/Filler TVDe: uold Specific Gravity: 411 System Application Method: Stamping/Syringe dispenser Pot Life-25C (days): 4 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/165 Die Shear Strength (psi): >3000 Thermal Conductivity: >40 Weight Loss 300C (%): 0.6 Tg (C): 152 CTE (in/in/C)xlO -6: Alpha 1: 33 Alpha 2: 127 Volume Resistivity 25C (ohm-cm): .OOl Shelf Life (months/C): 12/-40 Materials meet MIL STD 883C Method 5011. BPIBOND 7015: Color/Filler Type: silver Specific Gravity: 3.0 System Application Method: Stamping/Styringe dispenser Pot Life 25C (davs): >7 Gel Time 15OC‘(minutes): 5 Cure Schedule (hours/C): l/l50 Die Shear Strength (psi): >2500 Thermal Conductivity: >40 Weight Loss 300C (%): 0.15 Tg (C): 105 CTE (in/in/C)xlO -6: Alpha 1: 67 Alpha 2: 160 Volume Resistivity 25C (ohm-cm): .OOOl Shelf Life (months/C): 6/O Long pot life, high purity, electrically conductive adhesives. Storable at 0-5C. EPIBOND 7200M: Color/Filler Type: mineral Soecific Gravitv: 2.5 System Application Method: Stamping Pot Life 25C (days): 4 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/165 or 1.5/150 Die Shear Strength (psi): >2500 Thermal Conductivity: 16 Weight Loss 300C (%): 0.1 Tg (C): 155 CTE (in/in/C)xlO -6: Alpha 1: 30 Alpha 2: 110 Volume Resistivity 25C (ohm-cm): 7.9x10 15 Shelf Life (months/C): 12/-40 Ammonium:
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Adhesives, Sealants and Coatings for the Electronics Industry
FDRANE PRODUCTS: EPIBOND Die Attach Adhesives: Epoxy(Continued): EPIBOND 7200-50M: Color/Filler Type: mineral Specific Gravity: 2.6 S&item Application Method: Syringe dispenser Pot Life 25C (days): 4 Gel Time 15OC (minutes): 5 Cure Schedule (hours/C): l/165 or 1.5/150 Die Shear Strength (psi): i2500 Thermal Conductivity: 16 Weight Loss 300C (%): 0.1 Tg (C): 155 CTE (in/in/C)xlO -6: Alpha 1: 32 Alpha 2: 115 Volume Resistivity 25C (ohm-cm): 7.9x010 15 Shelf Life (months/C): 12/-40 Long pot life, high purity, thermally conductive adhesives. Storable at -40C. EPIBOND 7200-1OOM: Color/Filler Tvoe: mineral Specific Gravity: 2.7 System Application Method: Screen printing Pot Life 25C (days): 4 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/165 or 1.5/150 Die Shear Strength (psi): >2500 Thermal Conductivity: 16 Weight Loss 300C: (0.1 Tg (C): 155 CTE (in/in/C)xlO -6: Alpha 1: 34 Alpha 2: 117 Volume Resistivity 25C (ohm-cm): 7.9x10 15 Shelf Life (months/C): 12/-40 Materials meet MIL STD 883C Method 5011. EPIBOND 7210: Color/Filler Type: mineral Specific Gravity: 2.5 System Application Method: Stamping/Syringe dispenser Pot Life 25C (days): >7 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/150 Die Shear Strength (psi): >2500 Thermal Conductivity: 16 Weight Loss 300C (%): >0.5 Tg (C): 80 CTE (in/in/C)xlO -6: Alpha 1: 32 Alpha 2: 84 Volume Resistivity 25C (ohm-cm): >lxlO 15 Shelf Life (months/C): 6/O Long pot life, high purity, thermally conductive adhesive. Storable at 0-5C.
Adhesives-Epoxy
FURANE PRODUCTS: EPIBOND Electrically Insulating Thermally Conductive Epoxy Adhesives: EPIBOND 7200M: Features/Benefits: * Low-bleed out, increased productivity capability * Meets MIL-STD 803C, Method 5011 requirements * 100% solids, very low outsassins * High purity; low-corrosion tendency * Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br * Designed for stamping/pin transfer applications (other grades available) EPIBOND 7200-501: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD 883C, Method 5011 requirements * High purity, low corrosion tendency * Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br * 100% solids/low outgassing * Designed for syringe dispensing (other grades available) EPIBOND 7200-100M Features/Benefits: Low bleed out, increased productivity capability Meest MIL-STD 883C, Method 5011 requirements _ 100% solids, very low outgassing High purity, low corrosion tendency Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br Designed for screen printing applications (other grades available) EPIBOND 7210: Features/Benefits: * Lona oat and shelf life * High purity * Excellent thermal conductivity * 100% solids * Designed for dispensing and pin transfer * Viscosity can be factory adjusted for alternative application techniques EPIBOND 7300 Electrically Conductive Polyimide Adhesive: Features: * Extremely high purity. * High continuous operating service temperatures. * Adaptable to screen printing.
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HARDMAN
INC.:
Adhesive Selector Guide:
EPOWELD 3243: Mix Ratio (Parts by Weight): A:B: 100:72 Viscosity Centipoise @ 25 C (Mixed): 15,000 Gel Time-(Gms./deg. C/Min): 227/25/180 Cure (Timeldeg. C): 7 days/25 Color: Ivory Sp. Gr. gms/cc: 1.17 Lap Shear Strength: (Al/Al--Pounds/Square Inch): -40 deg. F: 3037 77 deg. F: 3330 180 deg. F: 537 300 deg. F: 274 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.4 77 deg. F: 3.6 180 deg. F: 3.3 Hardness (Shore D): 85 EPOWELD 7897: Mix Ratio (Parts bv Weiuht): 100:50 Viscosity Centipoise @ 25 aeg. C (Mixed): 2,200 Gel Time (Gms./deq. C/Min): 454/25/75 Cure (Time/deg. Cj: 15 Min.1100 Color: Black Sp. Gr. gms/cc: 1.21 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3162 77 deg. F: 3410 180 deg. F: 389 300 deg. F: 212 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.2 77 deg. F: 5.5 180 deg. F: 1.9 Hardness (Shore D): 85 EPOWELD 7929: Mix Ratio (Parts By Weight): A:B: 100:63 Viscosity Centipoise @ 25 deg. C (Mixed): 2,500 Gel Time (Gms./deg. C/Min): 163/25/60 Cure (Time/deg. C): 7 days/25 Color: Black _ Sp. Gr. gms/cc: 1.09 Lap Shear Strength: (Al/Al--Pounds/Square Inch): -40 deg. F: 3012 77 deg. F: 4178 180 deg. F: 315 300 deg. F: 190 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.5 77 deg. F: 3.8 180 deg. F: 1.4 Hardness (Shore D): 83
Adhesives-Epoxy
HARDMAN INC.: Adhesive Selector Guide (Continued): EPOWELD 16331-A/8173-B: Mix Ratio (Parts by Weight): 1OO:lOO Viscosity Centipoise @ 25 deg. C (Mixed): 40,000 Gel Time (Gms./deg. C/Min): 4/25/5 Cure (Time/deg. C): 24 hrs/25 Color: Amber Sp. Gr. gms/cc: 1.13 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1476 77 deg. F: 3000 180 deu. F: 175 300 deg. F: 122 Peel Strenqth (Pounds/Linear Inch): -40 deg; F: 3.4 77 deg. F: 3.6 180 deg. F: 1.1 Hardness (Shore D): 80 EPOWELD 13230: Mix Ratio (Parts By Weight): A:B: 100:140 Viscosity Centipoise @ 25 deg. C (Mixed): 50,000 Gel Time (Gms./deg. C/Min): 100/25/90 Cure (Time/deg. C): 7 days/25 Color: Grev Sp. Gr. gms/cc: 1.27 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3206 77 deg. F: 2800 180 deg. F: 970 300 deg. F: 237 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.8 77 deg. F: 24.0 180 deg. F: 2.0 Hardness (Shore D): 65 EALEX 15036: Mix Ratio (Parts by Weight): 100:100 Viscosity Centipoise @ 25 deg. C (Mixed): 11,000 Gel Time (Gms./deg. C/Min): 412515 Cure (Time/deg. C): 24 Hrs/25 Color: Off White Sp. Gr. gms/cc: 1.24 Lap Shear Strength (Al/Al - Pounds/Square Inch): -40 deg. F: 4105 77 deg. F: 4075 180 deg. F: 485 300 deg. F: 275 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.9 77 deg. F: 10.0 180 deg. F: 2.6 Hardness (Shore D): 85
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Adhesives,
Sealants
and Coatings for the Electronics
Industry
HARDMAN INC.: Adhesive Selector Guide (Continued): KALBX
15038: Mix Ratio (Parts by Weight): A:B: 1OO:lOO Viscosity Centipoises @-25 deg. C (Mixed): 12,000 Gel Time (Gms./deg. C/Min): 4/25/5 Cure (Time/deg. C): 24 Hrs/25 Color: Beige Sp. Gr. gms/cc: 1.25 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3966 77 deg. F: 3942 180 deg. F: 494 300 deg. F: 367 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.1 77 deg. F: 70.0 180 deg. F: 2.7 Hardness (Shore D): 70
EPOWELD 16469: Mix Ratio (Parts by Weight): A:B: 100:74 Viscosity Centipoise @ 25 deg. C (Mixed): 52,000 Gel Time (Gms./deg. C/Min): 100/25/12 Cure (Time/deg. C): 7 days/25 Color: Grey Sp. Gr. gms/cc: 1.52 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2420 77 deg. F: 2765 180 deg. F: 520 300 deg. F: 395 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.3 77 deg. F: 2.5 180 deg. F: 1.8 Hardness (Shore D): 90 MONOPOXY 16365-O: Mix Ratio (Parts By Weight): ---Viscosity Centipoise @ 25 deg. C (Mixed): 80,000 Gel Time (Gms./deg. C/Min): 20/107/14 Cure (Time/deg. C): 1.5 Hrs/lO7 Color: Blue Sp. Gr. gms/cc: 1.38 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2659 77 deg. F: 2400 180 deg. F: 4008 300 deg. F: 331 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.3 77 deg. F: 1.5 180 deg. F: 2.4 Hardness (Shore D): 85
Adhesives-Epoxy
HARDMAN INC.: Adhesive Selector Guide (Continued): MONOPOXY 16551-o: Viscosity Centipoise @ 25 deg. C (Mixed): 1,200,OOO Gel Time (Gms./deg. C/Min): 20/121/11 Cure (Time/deg. C): 40 Min/l21 Color: Grey Sp. Gr. gms/cc: 1.58 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3620 77 deg. F: 4310 180 deg. F: 4470 300 deg. F: 480 Peel Strength (Pounds/Linear Inch): -40 deg. F: 4.2 77 deg. F: 3.2 180 deg. F: 3.1 Hardness (Shore D): 90 EPONELD 16562: Mix Ratio (Parts By Weight): lOO:lOO Viscosity Centipoise @ 25 deg. C (Mixed): 126,000 Gel Time (Gms./deg. C/Min): 100/25/45 Cure (Time/deg. C): 3 Days/25 Color: Grey Sp. Gr. gms/cc: 1.38 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 4760 77 deg. F: 3215 180 deg. F: 905 300 deg. F: 485 Peel Strength (Pounds/Linear Inch): -40 deg. F: 35.8 77 deg. F: 44.3 180 deg. F: 4.3 Hardness (Shore D): 82 MONOPOXY 18512-O: Mix Ratio (Parts by Weight): ---Viscosity Centipoise @ 25 deg. C (Mixed): Paste Gel Time-(Gms./deg. C/Min): 20/121/12 Cure (Time/deg. C): 40 MinII Color: Grey Sp. Gr. gms/cc: 1.52 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3432 77 deg. F: 4100 180 dea. F: 4600 300 deg. F: 1100 Peel Strength (Pounds/Linear Inch): -40 des; F: 3.8 77 deg. F: 4.3 180 deg. F: 3.3 Hardness (Shore D): 85
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HARDMAN INC.: Adhesive Selector Chart (Continued): EPOWELD 19157: Mix Ratio (Parts by Weight): A:B: 100:40 Viscosity Centipoise 8 25 deg. C (Mixed): 8,000 Gel Time (Gms./deg. C/Min): 500/25/50 Cure (Time/deg. C): 20 Min/80 Color: Black Sp. Gr. gms/cc: 1.18 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1926 77 deg. F: 4658 180 deg. F: 1500 300 deg. F: 244 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.8 77 deg. F: 3.8 180 deg. F: 4.6 Hardness (Shore D): 80 EPOWELD 20018: Mix Ratio (Parts By Weight): 100:30 Viscosity: Paste Gel Time (Gms./deg. C/Min): 100/25/32 Cure (Time/deg. C): 24 Hrs/25 Color: Grey Sp. Gr. gms/cc: 1.53 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1258 77 deg. F: 4405 180 dea. F: 2943 300 deg. F: 1590 Peel Strenqth (Pounds/Linear Inch): -40 deg; F: 5.0 77 deg. F: 3.2 180 deg. F: 4.9 Hardness (Shore D): 95 EPOWELD 8173: Mix Ratio (Parts By Weight): 100:94 Viscosity Centipoise @ 25C (Mixed): 40,000 Gel Time (Gms./deg. C/Min): 4/25/5 Cure (Time/deg. C): 24 Hrs/25 Color: Amber Sp. Gr. gms/cc: 1.16 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1695 77 deg. F: 3000 180 deg. F: 655 300 deg. F: 245 Peel Strength (Pounds/Linear Inch): -40 deg. F: 1.5 77 deg. F: 1.8 180 deg. F: 2.5 Hardness (Shore D): 80
Adhesives-Epoxy
HARDMAN INC.: Adhesive Selector Guide (Continued): EALEX 16308: Mix Ratio (Parts BY Weisht): 100:67 Viscosity Centipoise 8 25 deg. C (Mixed): 40,000 Gel Time (Gms./deg. C/Min): 4/25/7 Cure (Time/deg. CT: 7 days/25 Color: Black Sp. Gr. gms/cc: 1.22 Lao Shear Strensth (Al/Al--Pounds/Square Inch): -40 deg. F: 4310 77 deg. F: 950 180 deg. F: 390 300 deg. F: 175 Peel Strength (Pounds/Linear Inch): -40 deg. F: 83.0 77 deg. F: 24.0 180 deg. F: 15.0 Hardness (Shore D): 40 EPOCAP 16400: Mix Ratio (Parts by Weight): A:B: 100:7.5 Viscosity Centipoise 8 25 deg. C (Mixed): 4,600 Gel Time (Gms./deg. C/Min): 200/25/130 Cure (Time/deg. C): 7 Days/25 Color: Blue SP. Gr. gms/cc: 2.09 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2590 77 deg. F: 3150 180 deg. F: 510 300 deg. F: 325 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.5 77 deg. F: 2.5 180 deg. F: 2.8 Hardness (Shore D): 85 EPOWELD 15217: Mix Ratio (Parts By Weight): A:B: 100:50 Viscosity Centipoise 8 25 deg. C (Mixed): Paste Gel Time (Gms./deg. C/Min): 100/25/130 Cure (Time/deg. C): 7 Days/25 Color: Beige SP. Gr. gms/cc: 1.19 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3152 77 deg. F: 2557 180 deg. F: 471 300 deg. F: 50 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.6 77 deg. F: 20.3 180 deg. F: 1.8 Hardness (Shore D): 65
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HARDMAN INC.: Adhesive Selector Guide (Continued): EPOWELD 16161: Mix Ratio (Parts By Weight): A:B: 100:35 Viscosity Centipoise @ 25 deg. C (Mixed): Paste Gel Time (Gms./deg. C/Min): 100/25/55 Cure (Time/deg. C): 7 Days/25 Color: Amber Sp. Gr. gmsfcc: 1.1 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2220 77 deg. F: 3390 180 dea. F: 300 300 deg. F: 230 Peel Strenqth (Pounds/Linear Inch): -40 dec: F: 2.5 77 deg. F: 2.5 180 deg. F: 2.0 Hardness (Shore D): 80 EPOWELD 16535: Mix Ratio (Parts By Weight): 100:58 Viscosity Centipoise @ 25C deg. C (Mixed): 10,000 Gel Time (Gms./deg. C/Min): 100/25/42 Cure (Time/deg. C): 7 Days/25 Color: Amber Sp. Gr. gms/cc: 1.11 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1764 77 deg. F: 2452 180 deg. F: 2018 300 deg. F: 701 Peel Strength (Pounds/Linear Inch): -40 deg. F: 1.5 77 deg. F: 1.0 180 deg. F: 2.1 Hardness (Shore D): 85 EPOWELD 18530: Mix Ratio (Parts By Weight): A:B: 100:37 Viscosity Centipoise @ 25 deg. C (Mixed): 16,000 Gel Time (Gms./deg. C/Min): 100/25/45 Cure (Time/deg. C): 7 Days/25 Color: Black SP. Gr. gms/cc: 1.14 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 5235 77 deg. F: 3618 180 deg. F: 614 300 deg. F: 371 Peel Strength (Pounds/Linear Inch): -40 deg. F: 40.4 77 deg. F: 37.3 180 deg. F: 2.1 Hardness (Shore D): 75
Adhesives-Epoxy
EARDMAE INC.: Adhesive Selector Guide (Continued): EPOWELD 18531: Mix Ratio (Parts By Weight): A:B: 100:37 Viscosity Centipoise 8 25 deg. C (Mixed): 14,000 Gel Time (Gms./deg. C/Min): 100/25/55 Cure (Time/deg. C): 7 days/25 Color: Black SP. Gr. gms/cc: 1.14 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3105 77 deg. F: 3555 180 deg. F: 600 300 deg. F: 305 Peel Strength (Pounds/Linear Inch): -40 deg. F: 4.8 77 deg. F: 35.0 180 deg. F: 3.5 Hardness (Shore D): 75
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KEY POLYMER CORP.:
Epoxy Products: General Purpose:
C4-49A/B: Quick Set Epoxy Tvoe: Two Dart. room temo. cure Cure Schedule:. Handling strength after 1 hr. @ 25C Full strength after 4 hrs. @ 25C Consistencv: Low Viscositv Liquid Specific Gravity: 1.01 Comments: Very fast cure. Convenient equal volume mix ratio. Clear film when cured. C6-92A/B: Two component, unfilled epoxy adhesive Type: Two part, room temp. cure Cure Schedule: 7 days @ 25C for full properties, or 2 hrs. at 1OOC. Consistency: Low Viscosity Liquid Specific Gravity: 1.15 Comments: Excellent moisture resistance and hot strength. Clear film when cured. C6-183A/B: Two component, flexible, fast curing epoxy adhesive Type: Gray, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C Consistency: Thixotropic Paste Specific Gravity: 1.49 Comments: Fast cure at ambient temperature. Excellent heat & chemical resistance C4-78AjB: Two component, thermally conductive, epoxy adhesive Type: Gray, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C, or 1 hr. @ 65C. Consistency: High Viscosity Paste Specific Gravity: 2.30 Comments: High thermal conductivity for heat dissipation. Good adhesion to metals, ceramics, and most plastics. c4-104: Thermally conductive heat sink compound Type: White, one part, no cure necessary Cure Schedule: N/A Consistency: White Thixotropic Paste Specific Gravity: 2.45 Comments: Excellent thermal resistance. Will not harden, melt or dry out after 1000 hours @ 200C.
Adhesives-Epoxy
21.5
MERECO DIVISION: MERECO system No. CLN-662 Thixotropic, High Room Temperature Hardening Epoxy Operating Temperature,
system: MERECO System No. CLN-662 is a specially developed thixotropic two component epoxy system. Cured castings will withstand temperatures up to 200C. The combination makes a unique system because it is possible to accomplish this without baking. The working life of the mixture allows it to be used for potting, coating, encapsulating, laminating and sealing. Fully cured MERECO System No. CLN-662 exhibits excellent chemical resistance, good mechanical strength, adhesion and machinability. Outstanding Attributes: * Thixotropic * Low Exotherm * High Operating Temperature * Room Temperature Cure
* * * *
Minimal Shrinkage Non-settling Filler Easy Handling Chemical Resistance
Typical Properties of Uncured MERECO System No. CLN-662 Components: Base: Form: Pourable syrup Color: White, yellow or black Viscosity (2X), cps: 70,000 Specific Gravity, 25C/25C: 1.60 Weight per Gallon, lbs: 13.3 Non-volatile, %: 100 Curing Agent: Form: Thin paste Color: Clear Brown Viscosity (25C), cps: 60,000 Specific Gravity, 25C/25C: 1.13 Weight per Gallon, lbs: 9.4 Non-volatile, %: 100 Typical Properties of Resin/Activator Blend: Activator weight ratio, phr: 30 Viscosity (77F). cos: 40,000 Density j77F);iblgal: 12.3 Gel time (1OOg) minutes at 68F: 100 77F: 90 104F: 75 Peak exotherm (1OOg at 77F), F: 88 Cure time, hours at 68F: 96 104F: 8 Cured State Properties: Ultimate tensile, psi: 9,000 Tensile elongation, %: 5.0 Ultimate flexural strength, psi: 15,000 Weight gain, %: water: 24 hr: 0.12 Dielectric constant (1 meg) 77F: 3.9
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MERECO DIVISION: METRE-GRIP 303 Series--Multi-Purpose Epoxy Adhesives: METRE-GRIP 303 series multi-purpose epoxy adhesives are availanle in four viscosity ranges. Each adhesive provides maximum bond strength and exceptional adhesion to all common materials such as wood, glass, rubbers, plastics, ceramics, metals and concrete. Additionally these adhesives have the outstanding ability to bond strongly to difficult substrates such as Teflon, Tedlar, Nylon, Polyethylene, Vinyl and many others. In-plant parts assembly and field repairs are simplified with the ease of non-critical mixing ratios coupled to room temperature setting. Curing times can be shortened by heating to suit a wide variety of individual production schedules. METRE-GRIP 303 adhesives meet the requirements of Military Specifications MIL-A-8623, MIL-A-14042 and MMM-A-134 and Naval Ordnance Number 2662718. 303: Paste Form* Viscosity Range (cps): 1,000,000 303 MV: Medium Cream Viscosity Range (cps): 100,000 303 Lv: Light Syrup** Viscosity Range (cps): 25,000 303 VLV: Very Light Syrup Viscosity Range (cps): 4,000 * Thixotropic, Anti-slump, Asbestos-free ** Non-outgassing Typical Characteristics: Specific Gravity (25C/25C): 1.23-1.35 Flexural Strenath (osi): 5.0 x 10 4 Tensile Strength (psi); 2.3 x 10 4 Linear Expansion Coefficient (/F): 4.8 x 10 -5 Thermal Shock: passes Operational Temperature (C): -65 to 145 Moisture Absorption (%): 0.8 Dielectric Strength (volts/mil): 440 Volume Resistivity (ohm-cm): 1.2 x 10 14 Dielectric Constant (10 3 Hz): 3.12 Dissipation Factor (10 3 Hz): 0.01
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PERMABOND INTERNATIONAL: PERMABOND ESP308, ESP309, and ESP310: PERMABOND ESP--Single part toughened epoxy adhesive PERMABOND ESP toughened epoxies form a new class of adhesives. They combine the structural strength of standard epoxies with unparalleled peel, impact and cleavage resistance. Often metal deformation or metal fatigue results before the adhesive fails. These epoxies also have excellent adhesion to a wide range of other materials. PERMABOND ESP are pre-mixed and thus require less handling than two-component epoxies. They require a heat cure in the range of 300-400F. Cure through large volumes can easily be effected, thus making it also suitable for potting applications. ESP308: Silver grey Filler type: metallic Specific gravity (g/cc): 1.5 Viscosity at 25C/77F, cps: 200,000 Flow characteristics (at cure temp): free flow Electrical and Thermal Prooerties: Thermal expansion coefficient, in/in/C: below Tg: 53.4 x 10 -6 above Tq: 178 x 10 -6 Glass transition temperature--Tg: 118C Thermal conductivity: 0.41 Volume resistivity, ohm-cm: 1.5 x 10 6 ESP309: Cream Filler type: inorganic Specific gravity (g/cc): 1.6 Viscosity at 25C/77F, cps: 150,000 Flow characteristics (at cure temp): partial flow Electrical and Thermal Prooerties: Thermal expansion coefficient, in/in/C: below Tg: 58.6 x 10 -6 above Tg: 176 x 10 -6 Glass transition temperature--Tg: 113C Thermal conductivity: 0.32 Volume resistivity,-ohm-cm: 3 x 10 15 Dielectric strength, Volts/mil: 1400 ESP310: Silver grey Filler type: metallic Specific gravity (g/cc): 1.5 Viscosity at 25C/77F, cps: 400,000 Electrical and Thermal Properties: Thermal expansion coefficient, in/in/C: below Tg: 57.7 x 10 -6 above Tg: 173 x IO -6 Glass transition temperature--Tg: 118C Thermal Conductivity: 0.40 Volume resistivity, ohm-cm: 3.1 x 10 -6
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PERMAGILE INDUSTRIES INC.: INSULCAST Epoxies: INSULCAST 136: Features great versatility and conforms to MIL. I-16923. INSULCAST 135: Is similar, but lower viscosity. INSULCAST 125 is low viscosity for fast impregnation and easy evacuation. INSULCAST 333: Is fire retardant. Conforms to U.L. 94 V.O. INSULCAST 100-M: Lowest cost. 1:l ratio by volume. INSULCASTS 140, 141: 141 features very high thermal conductivity and good thermal shock. 140 is a low viscosity version of 141. INSULCAST 166: Castable aluminum. Good flow. Machines like metal. INSULCAST 275: Thixotropic dip compound. Leaves component or board with uniform coating. INSULCAST 612: A "cold-solder" I high electrical conductivity. INSULGEL 30: R.T. Curing, repairable epoxy gel. No. 30 is softest in a series of four, with increasing Shore A hardness. INSULCAST 510: Water-white casting system for casting/encapsulating where clarity is important. INSULCAST 961: Low density syntactic foam, composed of rigid, hollow spheres, in an epoxy matrix. Used for flotation, and light weight. INSULCAST 174 (L-V.): Variable flexibility. Available in low viscosity version (L.V.) INSULCAST 981: Semi-rigid. Best thermal shock and high temperature I.R. INSULCAST 70-C.C.: Semi-flexible. Low shrinkage, low stress on components. Extremely low coefficient of expansion.
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PERMAGILR INDUSTRIES INC.: INSULCAST Epoxies (Continued): New technology, low temperature curing, one component series 771, 772, 773 rigid epoxies; 781, 782, 783 flexible epoxies. These two Series can be blended for any degree of rigidity or flexibility. 771: Color: Clear Viscosity - cps: 700 Hardness - Shore D: 88 Elongation - %: 2.0 Tensile Strength: 8,700 Dielectric Strength: 420 Volume Resistivity: 4 x 10 14 772: Color: Black Viscosity - cps: 12,000 Hardness - Shore D: 93 Elongation - %: 1.5 Tensile Strength: 9,500 Dielectric Strength: 440 Volume Resistivity: 1 x 10 15 773: Color: Black Viscosity - cps: Thixotropic Hardness - Shore D: 92 Elongation - %: 1.5 Tensile Strength: 9,500 Dielectric Strength: 440 Volume Resistivity: 1 x 10 15 781 : Color: Clear Viscosity - cps: 1,350 Hardness - Shore D: 40 Elongation - %: 125 Tensile Strength: 5,500 Dielectric Strength: 410 Volume Resistivity: 3 x 10 14
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PERMAGILB INDUSTRIES INC.: INSULCAST Epoxies (Continued): 782: Color: Black Viscosity - cps: 25,000 Hardness - Shore D: 45 Elongation - %: 75 Tensile Strength: 6,500 Dielectric Strength: 420 Volume Resistivity: 10 15 783: Color: Black Viscosity - cps.: Thixotropic Hardness - Shore D: 45 Elonsation - %: 75 Tensile Strength: 6,500 Dielectric Strength: 420 Volume Resistivity: 10 15
Adhesives-Epoxy
PERMAGILE INDUSTRIES INC.: Curing Agents: 9: Cps. Vise.: 100 Avg. Pot Life Min.: 30-40 Cure Schedule: 12-24 hrs. Feature: Fast Cure 11:
cps. Vise.: 700 Avg. Pot Life Min.: 4-6 hrs. Cure Schedule: 16 hrs. @ 70C 3 hrs. @ 1OOC 1 hr. @ 125C Feature: Temperature Resistant - Rigid 12: Cps. Vise.: 500 Avg. Pot Life Min.: 45 Cure Schedule: 12-24 hrs. Feature: Safety Hardener 20: Cos. Vise.: 700 Avg. Pot Life Min.: 60 Cure Schedule: 12-36 hrs. Feature: Good Impact & Rapid Cure 22: Cps. Vise.: 10,000 Avg. Pot Life Min.: 90 Cure Schedule: 24-36 hrs. Feature: Variable Flexibility Large Castings 26: Cps. Vise.: 800 Avg. Pot Life Min.: 2 hrs. Cure Schedule: 24-36 hrs. or 3 hrs @ 65C Feature: Low Viscosity, Good Impact, Very Large Castings 30: Cos. Vise.: 50 Avg. Pot Life Min.: 18 hrs. Cure Schedule: 4 hrs. @ IOOC 2 hrs. @ 125C Feature: Lowest Viscosity Highest Temperature Resistance
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SMOOTH-ON, INC.: EA-40: Inconspicuous glue line Good electrical properties EA-40 is an unfilled slightly thixotropic epoxy that can be spread readily in thin films that are almost transparent after curing. It sets slowly at room temperature, but cures in 24 hours to provide good electrical properties and water resistance. Heat resistance above 1OOC. is acheived by mixing 2 parts resin to 1 part hardener and providing a heat cure. EA-40 is a non-shrinking wood glue with excellent gap-filling capabilities. Typical Applications: - Bonding and insulating electrical and electronic components - Inconspicuous glue line for assembly of glass, ceramics, hard plastics and rigid foam parts - Jewelry for manufacturing and stone setting Color: Part-A: Translucent Part-B: Clear Amber Mixed: Clear Amber Mixing Ratio By Weight: 100/83 By Volume: lOO/lOO Specific Gravity: Part-A: 1.17 Part-B: 1.02 Mixed: 1.10 Viscosity Poise: Part-A: 1800 Part-B: 500 Resistance to Sag:
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SMOOTH-ON, INC.: NETALSET A-4. Highly Versatile Aluuminum Filled: METALSET A-4 is the most widely used of the SMOOTH-ON epoxy resin cements, as a result of its versatility. It contains an aluminum filler to provide a metallic appearance and enhance machining qualities. METALSET A-4 can be applied in thick sections, up to l/4" thick, on vertical surfaces without sagging. Thin films set in 1 to 2 hours at room temperature; thicker films, more rapidly. After 24 hours, METALSET A-4 is hard enough to be machined with conventional tools (drilled and tapped), and tough enough to resist thermal and mechanical shock. It is resistant to alkalies, dilute acids, many solvents and petroleum derivatives. Typical Aoolications: Make-jigs and fixtures Stops leaks in pipes, tanks, fittings and valves Aerodynamic-smoothing compound Alter or repair foundry patterns Repair flaws in metal castings Repair corroded hull and deck areas Set abrasion-resistant tile in conveyors and pulverizing equipment fill dents and cover countersunk Fillet sheet metal joints, rivet heads Use as an auto or truck body solder Anchor bolts in wood, concrete or plaster Use as shim material between uneven surfaces Color: Part-A: Metal Gray Part-B: White Mixed: Metal Gray Mixinq Ratio By Weiqht: lOO/lOO By Volume: lOO/lOO Specific Gravity: Part-A: 1.44 Part-B: 1.43 Mixed: 1.44 Viscosity Poise: Part-A: 1600 Part-B: 3200 Resistance to Sac: l/4" Pot Life-Minutes; 20-25 Maximum Exotherm C: 120 Barcol Hardness: 70 Tensile Shear Adhesion: Aluminum, psi: -50C: 2,300 25C: 2,400 80C: 800 Steel, psi: 25C: 4,300 Tensile Strength, psi: 3,600 Elongation %: 1.2 Modulus of Elasticity: 165,000 Compressive Strength, psi: 7,500 Modulus of Elasticity: 160,000
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SMOOTH-ON, INC.: SUPER INSTANT EPOXY: Fastest way to bond two unmatched surfaces. SUPER INSTANT EPOXY is a two-component adhesive that bonds in 2 to 5 minutes providing permanent or temporary assembly or repair. It is a quick way to bond like or unlike surfaces and can be applied in almost any joint thickness (it holds even or uneven surfaces.) SUPER INSTANT adheres to virtually any material including glass, ceramics, hard plastics, wood, masonry and most metals. Sets clear at room temperature to form a tough, flexible bond without clamping or waiting. It is ideal for applications requiring quick handling strength. Due to its very short working time, SUPER INSTANT is Sold only in sets of self-metering tubes. Typical Applications: Tacking for large scale bonding with higher strength, slower setting epoxy adhesives Fasten metal fixtures or sisns to masonry Assemble or repair of jewel;y or plaquesNon-conductive bonding of electrical or electronic parts Automotive repair and maintenance Color: Part-A: Translucent Part-B: Clear Amber Mixed: Clear Amber Mixing Ratio By Weight: lOO/lOO By Volume: lOO/IOO Specific Gravity: Part-A: 1.17 Part-B: 1.17 Mixed: 1.17 Viscosity Poise: Part-A: 1800 Part-B: 400 Pot Life-Minutes: 2-3 Maximum Exotherm C: 90 Barcol Hardness: 60 Tensile Shear Adhesion: Aluminum, psi: -50C: 2,100 25C: 2,900 80C: 300 Steel, psi: 25C: 4,000 Tensile Strength, psi: 1,100 Elongation %: 10 Modulus of Elasticity: 27,000 Compressive Strength, psi: 4,500 Modulus of Elasticity: 115,000
Adhesives-Epoxy
SYMPLASTICS INC.: SYMPOXY 4440-596 A&B:
1010-596
225
A&B, 4235-596 A&B &
Heat cured, medium viscosity, semi-thixotropic and non sag, thermal and thermal shock resistant to 15OC, epoxy adhesive/ sealant systems Three SYMPOXY systems designed for three different areas of application. All three have excellent adhesion, excellent thermal shock and ease of application. SYMPOXY 1010-596 A&B is for thin adhesive films where heavy run-off is not desirable. SYMPOXY 4235-596 A&B is semi-thixotropic and will have some run on vertical surfaces. This system can be used where metal slip fit type of application is used and some inter-flow is desirable. SYMPOXY 4440-596 A&B can be used where the adhesive is to be used on vertical surface and requires no-flow whatsoever. This system is also qood for mounting componentry within a container prior to potting-or where good thermal conductanc e is required. Typical Properties (Cured 2 hours @ 80C plus 3 hours @ 150C ): 1010-596: Viscosity, cps, Part A/B: 12-13000/5,200 Mixed: 8,200 Mixing ratios, Part A/B: 100155 Pot life 100 grams, hrs. @ 25C: 8+ Specific gravities, Part A/B: 1.16/1.01 Cured color: White Hardness, Shore D: 8% Heat distortion temoerature. C: 130 Thermal expansion chef, 10 16: 55 Thermal Conductivity: 2.8 4235-596:
Viscosity, cps, Part A/B: Thixo/5,200 Mixed: Semi-thixotropic Mixing ratios, Part A/B: 100/50 Pot life 100 grams, hrs. @ 25C: 8+ Specific gravities, Part A/B: 1.20/1.01 Cured color: White Hardness, Shore D: 86 Heat distortion temperature, C: 130 Thermal expansion coef, 10 -6, C: 54 Thermal Conductivity: 3.0 4440-596: Viscosity, cps, Part A/B: Thixo/5,200 Mixed: Thixotropic Mixina ratios. Part A/B: 100/20 Pot life 100 grams, hrs. @ 25C: 6+ Specific qravities, Part A/B: 1.7511.01 Cured color: Tan Hardness, Shore D: 82 Heat distortion temperature, C: 150 Thermal expansion coef, IO -6, C: 32 Thermal conductivity: 8.0
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SYMPLASTICS INC.: SYMPOXY 1574 Adhesive/Sealant: One component, heat cured, high strength, epoxy adhesive/ sealant SYMPOXY 1574 is a one component, filled, epoxy adhesive which exhibits high peel strength, excellent tensile shear strengths (Alum/Alum) and moisture resistance, with heat resistance to 200C (392F) S/T. This system has excellent spreading qualities allowing thin bond line aunlications without strinaina. thus makina clean up an easy-wipe off procedure. At c&i& temperature of 18OC, the system does have some flow for leveling and air release without applied pressure. Color: Grey Viscosity, cps @ 25C: 128,000 Cure schedule, minutes, @ 18OC: 60 Tensile strength, psi: 9,200 Tensile shear strength, psi @ -60C (-76F): 4,700 B 25C (78F): 6,100 @ 1ooc i212F): b,300 @ 125C (257F): 1,600 @ 200C (392F): 520 After 24 hr. water boil tested @ 25C (78F): 5,800
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SYMPLASTICS INC.: SYMPOXY 4120 A&B, 4130 A&B and 4150 A&B Adhesive/Sealants: Low viscosity, room and heat cured, high peel and shear strength epoxy adhesive/sealants SYMPOXY 4100 series adhesive/sealants are 100% solids, in low viscosity form for thin glue line metal/metal adhesion. Three systems give you a choice between room temperature curing or a short heat cure, clear or opaque adhesives with excellent peel and shear strengths. SYMPOXY 4120 A&B Clear, pli of 3.2, room temperature or heat cured. 4130 A&B Opaque, pli of 15.1, H.C., thermal shock resistant. 4150 A&B Opaque, pli of 16.7, R.C. or 1 hour at 125C. The opaque, two phase systems are superior after room temperature curing or heat curing but a clear, water white system, is sometimes required. This system also has excellent impact strength. 4120 A&B: Viscosity, cps, mixed @ 25C: 600 Mixing ratios, Part A/Part B: by weight: 100133 Pot life, 200 grams, min. @ 25C: 22-25 Cured color: clear Cure schedule, hrs. @ 25C: 24 Hardness, Shore D: after 24 hrs. @ 25C: 70-75 Operating temperature, C: 110 4130 A&B: Viscosity, cps, mixed @ 25C: 950 Mixina ratios. Part A/Part B: by
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SYMPLASTICS INC.: SYMPOXY 4235-72 Adhesive/Sealant: Two component, slightly thixotropic, epoxy clear adhesive/ sealant SYMPOXY 4235-72 is a 100% solid epoxy adhesive/sealant system designed for thin film adhesive between metal to metal, pressboard to metal, plastic to metal, plastic to plastic, etc. Mixins ratios are variable so that a risid to flexible bond may be obtained. For rigid substrates, fhe more rigid material should be used at a lOOA/33B mix ratio. For increasing flexibility for more flexible substrates, the Part B may be increased to lOOA/lOOB mix ratio. Excellent adhesion and moisture resistance obtained with any ratio used. SYMPOXY 4235-72 may be room temperature cured for 24-40 hours, or cured 30-45 minutes at 125C to 150C or 2 hours 65C. Typical Cured Properties: Mix Ratio, Part A/Part B (Alum/Alum Bond): 100/33 Specific gravity, mixed: l-18/.99 Color: Clear/Amber Pot life. 200 crams. hrs.: 3 Tensile shear strength, psi: 4200 Peel strength, lbs./in.: 8.0 Compressive strength, psi: 13,700 Tensile strength, psi: 8,000 SYMPOXY
4234-10
Adhesive/Sealant:
Semi-thixotropic epoxy adhesive/sealant fiberglass
for fiberglass to
SYMPOXY 4234-10 is a two component, long pot life, 100% epoxy solids system designed specifically for seaming or adhering fiberglass to fiberglass but may be used for the bonding of metal and some plastics. It is a rigid system yet with some resiliency for thermal shock. When used with fiberglass inmpregnated with SYMPOXY 1010 A,B,C, this system has withstood 180C continuous temperatures. Components: 2 Mixed viscosity, cps: Semi-thixotropic Standard color: Milky Pot life, hrs., 100 grams: 12 Hardness, Shore D: 82 Tensile strength, psi: 8,500 Tensile shear/strength: 2,200 Peel strength, lbs/in/width: 28 Cure schedule, hrs. @ 25C: 24 @ 85C: 2 @ 125C: 1 Service temperature to: 150C
Adhesives-Epoxy
TRA-CON,
229
INC.: Epoxy Adhesives:
SUPERTHERM 2003: High performance die-attach diamond epoxy adhesive SUPERTHERM 2003 is a one-part smooth paste ultra-high thermally conductive diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the extraordinary combination of very high thermal conductivity coupled with excellent electrical insulation over a wide temperature range is required. This high performance epoxy adhesive is specially formulated to meet the stringent low-ion and physical requirements of MIL-STD-883C (method 5011). It develops superior adhesion--after a required high temperature cure cycle--to and between many different semiconductor sub2003 strates, metals, glass, ceramics and laminates. SUPERTHERM has a four (4) day pot life at 25C, and a shelf life of six (6) months when stored at -40C. It provides both enhanced thermal conductivity and excellent electrical isolation for active or passive chip-type electronic or surface-mounted components in the fabrication of printed, integrated and hydbrid circuits, and is just right for screen, dispenser or pin transfer application methods. Color: Tan Specific gravity: 2.4 Viscosity, (after mixing) cps @ 25C: Thixotropic paste Mix ratio: One part Operating temperature range, C: -60 to 160 Hardness, Shore D: 90 Coefficient of expansion, cm/cm/C: 18-10 -6 Thermal conductivity, W/M K: 2.7 cal-cm/cm 2 set C: 65-10 -4 Volume resistivity, ohm-cm @ 25C: 2 x 10 14 Dielectric strength, Volts/mil: 600 Dielectric constant, 1 KHz @ 25C: 4.7 Dissipation factor, 1 KHz @ 25C: 0.006 Reactive solids content, %: 100
TRA-BOND 2101: General purpose epoxy adhesive TRA-BOND 2101 is a medium-viscosity epoxy formulation recommended for laminating, bonding, repair, and other adhesive applications where the combination of its superior structural, mechanical and electrical performanace properties are required. This two-part adhesive easily mixes and cures at room temperature, and develops strong, durable, tough bonds to most clean, dry material surfaces--including metals, ceramics, glass and glass fabrics, wood, leather, and many rigid plastics. The fully cured TRA-BOND 2101 bonds are good electrical insulators which also provide excellent resistance to weather, galvanic action, many mild acids and alkalis, salt solution, petroleum solvents, lubricating oil, gasoline, jet fuels, alcohol, and many other organic and inorganic materials.
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TRA-CON, INC.: Epoxy Adhesives
(Continued):
TRA-BOND 2101 (Continued): Color: Clear. sliuht haze Specific gravity:-1.20 Viscosity (after mixing) poise, @ 25C: 190 OneratinG temverature ranse. C: -60 to 135 Hardness; Shore D: 85 Mix ratio, parts by weight: 25H/lOOR Coefficient-of expansion, cm/cm/C: 55-10 -6 Impact, Izod, ft. lbs/inch of notch: 0.80 Dielectric strength, Volts/mil: 370 Dielectric constant, 1 KHz @ 25C: 4.3 Dissipation factor, 1 KHz @ 25C: 0.02 Volume resistivity, ohm-cm @ 25C: 6-10 15 ohm-cm @ 1OOC: 5-10 9 Reactive solids content, %: 100 TRA-BOND 2106: Fast medium viscosity epoxy adhesive TRA-BOND 2106 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, two-part, medium viscosity system mixes easily at room temperature, contains no solvents, and is suitable for high performance structural bonding applications where the combination of very fast room temperature cure coupled with low shrinkage and excellent mechanical and electrical properties is required. It develops strong, tough bonds to metals, phenolic plastics, polyesters, glass and glass fabrics, hardboards and forestry products, ceramics, rubber, masonry materials, and other construction materials. Fully cured TRA-BOND 2106 is an excellent electrical insulator, and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solutions, and many other organic and inorganic compounds. Color: Transparent, straw Specific gravity: 1.22 Viscosity (after mixing) cps @ 25C: 15,500 Operating temperature range, C: -60 to 115 Mix ratio, parts by weight Hardener/Resin: 93/100 Coefficient of expansion, cm/cm/C: 60-10 -6 Impact, Izod, ft. lbs/inch of notch: 1.9 Dielectric strength, Volts/mil: 410 Dielectric constant, 1 KHz @ 25C: 4.8 Volume resistivity, ohm-cm @ 25C: 5-10 11 Hardness, Shore D @ OC: after 10 minutes: 25 after 30 minutes: 67 after 60 minutes: 72 Reactive solids content, %: 100
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TRA-CON, INC.: Epoxy Adhesives (Continued): TRA-BOND 2106T: Fast cure thixotropic epoxy adhesive TRA-BOND 2106T is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where fast curing is required. This versatile, thixotropic, two-part system contains no solvents, mixes easily at room temperature, and is suitable for high performance structural bonding applications where the combination of very fast room temperature curing coupled with low shrinkage and excellent mechanical and electrical properties is needed. It develops strong, tough bonds to metals, plastics, glass and glass fabrics, hardboards and forestry products, ceramics, rubber, masonry materials, and other construction materials. When fully cured, TRA-BOND 2106T is an excellent electrical insulator, and provides superior resistance to vapors, and gases, water, galvanic action, petroleum fuels, salt solutions, and many other organic and inorganic compounds. Color: Hazy, light straw Specific gravity: 1.22 Viscositv (after mixina). CDS R 25C: Thixotroaic Operating temperature &Age; CT -60 to 115 _ Mix ratio, parts by weight Hardener/Resin: 93H/lOOR Coefficient-of exnansion. cm/cm/C: 60-10 -6 Impact, Izod, ft.-lbs/inch of notch: 1.9 Dielectric strength, Volts/mil: 410 Dielectric constant, 1 KHz @ 25C: 4.8 Volume resistivity, ohm-cm @ 25C: 5-10 11 Hardness, Shore D @ 25C: after 10 minutes: 25 after 30 minutes: 67 after 60 minutes: 72 Reactive solids content, %: 100 TRA-BOND 2111: Epoxy staking compound (high impact) TRA-BOND 2111 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and menufacturing applications where long pot-life, good wetting, non-sag, non-drip and improved impact strength properties are required. This easy-to-use two-part adhesive system contains no volatile solvents, and readily cures at room temperature, and bonds to most materials including glass and glass fabrics, ceramics, wood, leather, most metals, and many plastics. Fully cured TRA-BOND 2111 is strong, tough, resilient, has superior mechanical impact and thermal shock resistance characteristics, and is also highly resistant to weather, water, gases and vapors, most petroleum products and fuels, salts, mild acids and alkalis, and many other organic and inorganic compounds.
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TRA-BOND 2111 (Continued): Color: Hazy, off-white Specific gravity: 1.24 Heat distortion temperature, C: 38 Ooeratins temperature range, C: -70 to 100 Tensile strength, psi: 3,700 Hardness, Shore D: 81 Elongation, %: 26 Comoressive strensth. psi: 4,800 Coefficient of expansion, cmjcm/C: 55-10 -6 Impact, Izod ft lbs/inch of Notch: 2.0 Dielectric constant, 1 KHz @ 25C: 4.7 Dissipation factor, 1 KHz. @ 25C: 0.013 1 KHz @ 80C: 0.31 Dielectric strength, Volts/mil: 430 Volume resistivity, ohm-cm @ 25C: 9.5-10 8 ohm-cm @ 80C: 2.8-10 2 TRA-BOND 2112: Rigid epoxy staking compound TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. This two-part, solventfree adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bondins. involving _. laminatinq and repair applications _. metals, glass, ceramics, wood and many plastics. TRA-BOND 2112 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds. Color: Milky, translucent Specific gravity: 1.20 Viscosity (after mixing) cps @ 25C: >27,000 Operating temperature range, C: -60 to 125 Hardness, Shore D: 90 Mix ratio, parts by weight: 22H/lOOR Coefficient of expansion, cm/cm/C: 55-10 -6 Impact, Izod, ft. lbs/inch of notch: 0.75 Dielectric strength, Volts/mil: 410 Dielectric constant. 1 KHz P 25C: 4.6 Dissipation factor,.1 KHz @-25C: 0.01 Volume resistivity, _ ohm-cm @ 25C: 6-10 13 ohm-cm 8 IOOC: l-10 10 Reactive solids content, %: 100
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TRA-BOND 2113: Clear low viscosity epoxy adhesive TRA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to glass, ceramics, most metals and many plastics. It is particularly recommended for assembly and repair work of fiber optic and other high performance electronic and aerosoace svstems and comoonents. and for structural laminating applications where an-initial low viscosity and near transparent "color" are needed. Fully cured TRA-BOND 2113 is a q00a electrical insulator, nrovides excellent resistance to weather, galvanic action, .salt solutions and many other chemicals including mild acids and alkalis, petroleum solvents, lubricating oils, jet fuels and gasoline, and alcohol. Color: Transparent, clear Specific gravity: 1.16 Viscosity (after mixing) cps 8 2X: 300 Operating temperature range, C: -60 to 130 Hardness, Shore D: 88 Mix ratio, pats by weight: llH/lOOR Coefficient of exnansion. cm/cm/C: 60-10 -6 Impact, I20a, ft.‘lbs/inch of notch: 0.24 Dielectric strength, Volts/mil: 410 Dielectric constant, 1 KHz @ 25C: 4.3 Dissipation factor, KHz @ 25C: 0.02 Volume resistivity, ohm-cm @ 25C: 6-10 13 ohm-cm @ 1OOC: l-10 10 TRA-BOND 2114: Water-white transparent epoxy adhesive TRA-BOND 2114 is a transparent, low viscosity epoxy resin formulation recommended for industrial adhesive and laminating applications where sparkling clarity and excellent structural, mechanical and electrical properties are required. In addition, this 100% reactive solids (contains no solvents) adhesive system is easily mixed, handled and cured at room temperature, and it readily bonds to a wide variety of modern materials and surfaces (includes metals, glass, glass fabrics and glass products, ceramics, and many plastics). Fully cured TRA-BOND 2114 is a tough, strong, durable and almost water-white electrical insulator which is resistant to water, gases and vapors, most petroleum products and fuels, salt solution, mild acids and alkalis, and many other organic and inorganic compounds.
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TRA-BOND 2114 (Continued): Color: Transparent, clear Soecific aravitv: 1.17
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TRA-CON, INC: Epoxy Adhesives (Continued): TRA-BOND 2116: Low vapor pressure epoxy staking compound TRA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronic, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies. This two-part, solvent-free compound is readily mixed, handled, used, and cured at room temoerature. and develons strons bonds to most clean. arv material s&faces including metals, glass, ceramics,.wood and many plastics. Fully cured TRA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis. Color: Milky, translucent Specific gravity: 1.26 Viscosity (after mixing) cps @ 25C: >lOO,OOO Operating temperature range, C: -60 to 130 Hardness. Shore D: 90 Mix ratio, parts by weight: 22.5H/lOOR Coefficient of expansion, cm/cm/C: 55-10 -6 Impact, Izod, ft. lbs/inch of notch: 0.22 Dielectric strength, Volts/mil: 415 Dielectric constant, 1 KHz @ 25C: 4.5 Dissipation factor, 1 KHz @ 25C: 0.011 Volume resistivity, ohm-cm @ 25C: 6-10 13 ohm-cm @ IOOC: IO-10 9 Reactive solids contents, %: 100 Outgassing (NASA): Passes TRA-BOND 2125: Syntactic Repair Adhesive (Rigid) (Color-coded for easy mixing) TRA-BOND 2125 is a medium viscosity, low density syntacticfoam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting applications where a light-weight, low shrinkage and low expansion material is required. This adhesive is color-coded for smooth easy mixing and handling at room temperature, and it develops strong, highly reliable bonds to most surfaces--including metals, building-construction products, glass and glass fabrics, and many plastics. TRA-BOND 2125 is a completely unicellular material composed of micron-sized glass spheres in a high-performance epoxy binder, has a very uniform point-to-point structure and exhibits low shrinkage during cure, good dimensional stability, low density, high strength-to-weight ratio. hish dielectric strensth. and a low dielectric constant. The f;lly-cured adhesive is 2 strong, light weight and durable electrical insulator which can be cut, drilled, sawed and shaped (as needed) with ordinary shop tools.
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TRA-BOND 2125 (Continued): Color: Light Gray Specific sravitv: 0.68 Operating-tempe;ature range, C: -50 to 150 Compressive strength, psi: 13,000 Hardness, Shore D: 75 Imoact. Izod. ft. lbslinch of notch: 0.2 Coefficient of thermai expansion, cm/cm/C: 22-10 -6 Thermal conductivity, gm Cal-cm/cm Z/set/C: 3-10 -4 Dielectric strength, Volts/mil: 375 Dielectric constant, 1 KHz @ 25C: 2.9 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 2.4-10 14 TRA-BOND 2129: Clear low viscosity epoxy adhesive TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production, repair, small casting, coating, tooling, and rigid laminating applications where a "clear system" with good mechanical and electrical properties is required. This easy-to-use epoxy adhesive cures at room temperature and develops strong, low shrinkage bonds to most materials--metals, ceramics and ceramic inserts, glass and glass fibers, wood and many rigid plastics. Fully cured TRA-BOND 2129 is an effective electrical insulator with good low temperature mechanical and impact resistance properties, and outstanding resistance to water, most petroleum products, salt solutions, mild acids and alkalis and many other organic and inorganic compounds. Color: Clear, transparent Specific gravity: 1.19 Viscosity (after mixing) cps 8 25C: 1,900 Operating temperature range, C: -60 to 140 Hardness, Shore D: 88 Mix ratio, parts by weight Hardener/Resin: 25H/lOOR Coefficient of expansion, cm/cm/C: 58-10 -6 Impact, Izod, ft. lbs/inch of notch: 0.48 Dielectric strength, volts/mil: 410 Dielectric constant, 1 KHz @ 25C: 4.0 Dissipation factor, 1 KHz @ 25C: 0.02 Volume resistivity, ohm-cm @ 25C: 5.9-10 13 ohm-cm 8 1OOC: 9.5-10 9 Reactive solids content, %: 100
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TRA-BOND 2130: Medium viscosity epoxy adhesive TRA-BOND 2130 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting plus improved mechanical and electrical properties is required. This two-part liquid epoxy adhesive contains no solvents and is easy to mix, use and apply at room temperature. TRA-BOND 2130 develops strong, rigid high-performance bonds to itself and to ceramics, glass and glass fabrics, metals, laminates and other composite materials, forestry and masonry products, and to most rigid plastics. Fully cured TRA-BOND 2130 is an effective electrical insulator, and further provides excellent resistance to weather, water, galvanic action, vapors, JP4 fuel, gasoline, lubricants and other petroleum products, mild acids and alkalis, salts, and other organic and inorganic compounds. Color: Clear, transparent Specific gravity: 1.21 Viscosity (after mixing) cps, @ 25C: 12,000 Operating temperature range, C: -60 to 125 Hardness, Shore D: 87 Mix ratio. Darts bv weisht Hardener/Resin: 25H/lOOR Coefficient-of expansion, cm/cm/C: 52-10 -6 Impact, Izod, ft. lbs/inch of notch: 0.20 Dielectric strength, Volts/mil: 420 Dielectric constant, 1 KHz @ 25C: 4.1 Dissipation factor, 1 KHz @ 25C: 0.02 Volume resistivity, ohm-cm @ 25C: 6.0-10 13 ohm-cm @ IOOC: 9.8-10 9 Reactive solids content, %: 100 TRA-BOND 2132: Polysulfide epoxy adhesive (rigid) TRA-BOND 2132 is a low viscosity, 100% solids (no solvents) polysulfide/epoxy polymer compound with excellent adhesion to a wide range of materials including most metals, glass, wood, ceramics, rubber, leather, concrete and many plastics. Amber colored TRA-BOND 2132 is readily mixed, handled and cured at room temperature, and it is recommended for bonding, laminating and sealant applications that require some flexibility in combination with superior mechanical and electrical properties at low temperatures. The fully cured adhesive is strong, tough and resilient, has imnroved imnact and thermal shock resistance. and is resistint to water, weather, gases and vapors, petroleum. solvents, lubricants and fuels, salt solutions, mild acids and alkalis, and many organic and inorganic compounds.
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TRA-BOND 2132 (Continued): Color: Amber Specific gravity: 1.21 Viscosity (after mixing) cps: 2,500 Operating temperature range, C: -60 to 120 Tensile strenth, psi 8 25C: 6,200 Hardness, Shore D: 78 Elongation, %: 10 Coefficient of exoansion. cm/cm/C: 55-10 -6 Impact resistance; ft. lbs. 8 25C: 2.0 (MIL-C-16923) @ -38C: 0.5 Dielectric strenath. Volts/mil: 390 Dielectric constant; 1 KHz-8 25C: 4.2 Dissipation factor, 1 KHz 8 25C: 0.011 Tensiie Shear Strength, Aluminum-to-Aluminum, 8 -4oc: 2,200 8 20C: 2,500 @ 7oc: 580
psi:
TRA-BOND 2133: Flexible polysulfide/epoxy adhesive TRA-BOND 2133 is a low viscosity 100% solids (it contains no solvents) polysulfide/epoxy polymer compound with excellent adhesion to a wide range of materials that includes most glass, metals, leather, wood, concrete, rubber, ceramics and many plastics. This unfilled, amber (almost clear) adhesive may be used for bonding, sealant, and laminating applications where improved flexibility coupled with superior mechanical and electrical properties are needed. TRA-BOND 2133 is tough and resilient, bonds on contact (no pressure required) and cures at room temperature. The fully cured adhesive develops appreciable flexibility, has improved impact and thermal shock resistance, and is also resistant to water, petroleum products and many chemicals. Color: Amber Specific gravity: 1.21 Viscosity (after mixing) cps: 2,200 Operating temperature range, C: -60 to 115 Tensile strength, psi 8 25C: 2,700 Hardness. Shore D: 65 Elongation, %: 30 Coefficient of expansion, cm/cm/C: 55-10 -6 Impact resistance, ft. lbs 8 25C: 64.0 (MIL-C-16923) 8 -38C: 1.5 Dielectric strength, Volts/mil: 380 Dielectric constant, 1 KHz @ 25C: 5.1 Dissipation factor, 1 KHz @ 25C: 0.016 Volume resistivity, ohm-cm 8 25C: 2.7-10 13
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TRA-BOND 2135D: High impact epoxy adhesive TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact strength properties are required. This superior, two-part adhesive is easily mixed and handled at room temperature, and develops strong, tough, high-performance bonds to metals, ceramics, wood, concrete, phenolics, polyesters, epoxies, many urethanes and other plastics, and to many other materials. Fully cured TRA-BOND 2135D is a tough, durable, electrically insulating adhesive with excellent mechanical, impact and shock resistance properties. In addition, it provides good resistance to gases, vapors, weather, water, petroleum solvents, antiicing fluids, salt solutions, many mild acids and alkalis, and many other organic materials. Color: Light amber Specific gravity: 1.11 Viscosity (after mixing) cps @ 25C: 1,200 Operating temperature range, C: -60 to 100 Hardness, Shore D: 70 Mix ratio, parts by weight Hardener/Resin: 60H/lOOR Coefficient of expansion, cm/cm/C: 55-10 -6 Dielectric strength, volts/mil: 435 Dielectric constant, 1 KHz @ 25C: 3.68 Dissipation factor, 1 KHz @ 25C: 0.02 Volume resistivity, ohm-cm @ 25C: 2.7-10 13 Reactive solids content, %: 100 TRA-BOND 2141: Polyamido-amine epoxy adhesive (rigid) TRA-BOND 2141 is a medium viscosity polyamido-amine epoxy liquid polymer compound that provides strong bonds between most common materials including metals, glass, many plastics, leather, rubber, wood, ceramics and concrete. This solventfree amber colored, almost transparent adhesive and sealant readily bonds and cures at room temperature, has a moderate pot-life and exotherm, and exhibits low shrinkage and good dimensional stability. Fully cured TRA-BOND 2141 is a tough, resilient adhesive with good low temperature electrical, mechanical and impact resistant properties, superior thermal shock resistance, low permeability to gases and vapors and outstanding resistance to water, weather, oxygen and ozone, most petroleum products, mild acids and alkalis, and many other chemicals.
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TRA-BOND 2141 (Continued): Color: Amber Specific gravity: 1.14 Viscosity @ 25C, poise: 215 Operating temperature range, C: -60 to 115 Tensile strength, psi: 7,400 Elongation, %: 7.2 Hardness, Shore D: 83 Coefficient of thermal exoansion. cm/cm/C: 78-10 -6 Dielectric strength, volts/mil: 420 Dielectric constant, 1 KHz @ 25C: 3.54 Dissipation factor, 1 KHz @ 25C: 0.07 Volume resistivity, ohm/cm/25C: IO-IO 13 TRA-BOND 2142: Polyamido-amine epoxy adhesive (semi-rigid) TRA-BOND 2142 is a medium viscosity solvent-free polyamidoamine epoxy liquid polymer compound that provides strong bonds between most common materials including metals, glass, many plastics, leather, rubber, wood, ceramics and concrete. This amber colored, almost transparent adhesive and sealant readily bonds and cures at room temperature, has a moderate pot-life and exotherm, and exhibits low shrinkage and good dimensional stability. Fully cured TRA-BOND 2142 is a tough, resilient adhesive with good low temperature electrical, mechanical and impact resistant properties, superior thermal shock resistance, low permeability to gases and vapors and outstanding resistance to water, weather, oxygen and ozone, most petroleum products, mild acids and alkalis, and many other chemicals. Color: Amber Specific gravity: 1.12 Viscosity (after mixing) poise, @ 25C: 320 Operating temperature range, C: -60 to 110 Tensile strength, psi: 5,300 Elongation, 8: 4.6 Coefficient of expansion, cm/cm/C: 70-10 -6 Hardness. Shore D: 82 Dielectric strength, Volts/mil: 420 Dielectric constant 1 KHz @ 25C: 3.62 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity @ 25C: 2.2-10 14
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TRA-BOND 2143D: Medium viscosity polyamide/epoxy adhesive TRA-BOND 2143D is a medium viscosity polyamide/epoxy adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This two-part adhesive is easily mixed and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including most metals, rigid plastics, glass, ceramics, leather, rubber, wood and concrete. Fully cured TRA-BOND 2143D bonds offer good low-temperature electrical, mechanical, and impact resistant properties, superior thermal shock resistance, low permeability to gases and vapors, good dimensional stability, and resistance to water, weather, oxygen and ozone, most petroleum products, mild acids and alkalis, and many other chemicals. Color: Amber Specific gravity: 1.12 Viscosity, (after mixing) cps, @ 25C: 30,000 Operating temperature range, C: -60 to 100 Hardness, Shore D: 77 Mix ratio, parts by weight Hardener/Resin: lOOH/lOOR Coefficient of expansion, cm/cm/C: 64-10 -6 Impact Izod, ft. lbs/inch of notch: 1.14 Dielectric strength, volts/mil: 460 Dielectric constant, 1 KHz @ 25C: 3.35 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity, ohm-cm @ 25C: I-IO 14 Reactive solids content, %: 100 TRA-BOND 2147: Thixotropic epoxy/polyamide adhesive TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/ polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting, toughness, and superior mechanical properties are required. This easy-to-use amber-colored epoxy adhesive system has a moderate pot-life and a low exotherm. It cures at room temperature, and develops strong bonds to most material surfaces, including many metals, rigid plastics, glass, ceramics, leather, rubber, wood and concrete. Fully cured TRA-BOND 2147 is a tough, resilient adhesive with good low temperature electrical, mechanical and impact resistant properties, superior thermal shock resistance, low permeability to gases and vapors, good dimensional stability and oustanding resistance to water, weather, oxygen and ozone, most petroleum products, mild acids and alkalis, and many other chemicals.
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TRA-BOND 2147 (Continued): Color: Amber Specific gravity: 1.13 Viscosity, (after mixing) poise 8 25C: 600 Operating temperature range, C: -60 to 110 Elongation, %: 10 Coefficient of expansion, cm/cm/C: 64-10 -6 Hardness, Shore D: 75 Dielectric strength, Volts/mil: 460 Dielectric constant, 1 KHz @ 25C: 3.35 Dissipation factor, 1 KHz @ 25C: 0.011 Volume resistivity, ohm-cm @ 25C: 1.2-10 14 Reactive solids, %: 100 Tensile shear strength, psi: Alum./Alum., after 60 minutes 8 IOOC: 2,500 TRA-BOND 2212: High temperature epoxy adhesive TRA-BOND 2212 adhesive was developed for high temperature bonding, laminating, filament winding and potting applications where the combination of good physical and mechanical properties plus superior wetting and handling characteristics is required. This dark (reddish) amber solvent-free all-liquid system is easily mixed, handled and applied at room temperature--although a final elevated-temperaturep-step is required for complete cure. TRA-BOND 2212 develops tough high-strength bonds to metals, ceramics, glass and glass fabrics, and to many other Electronic and Aerospace materials. The fully cured adhesive exhibits low weight-loss and an improved retention of mechanical properties at elevated service temperatures. It also displays excellent chemical resistance and low permeability to gases and vapors coupled with superior electrical insulation properties. In addition, TRA-BOND 2212 provides very good resistance to water, weather, jet fuels, most petroleum products, salt solutions, mild acids and alkalis, and other organic and inorganic compounds. Color: Dark Amber Specific gravity: 1.21 Viscosity (after mixing) @ 25C, poise: 215 Operating temperature range, C: -60 to 200 Heat distortion temperature, C: 158 Tensile strength, psi: 6,900 Compressive strength, psi: 12,700 Hardness, Shore D: 89 Elongation, %: 2.3 Dielectric strength, Volts/mil: 395 Dielectric constant, 1 KHz @ 25C: 3.9 Dissipation factor, 1 KHz 8 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 7.7-10 14
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TRA-BOND 2151: Heat conductive electrical insulating compound TRA-BOND 2151 is a thixotropic (smooh paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. TRA-BOND 2151 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its cofficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured TRA-BOND 2151 provides excellent resistance to salt solutions, mild acids and alkalis. and manv other chemicals includins petroleum solvents, lubricating-oils and alcohol. This adhesive complies with the requirements of NASA's Outgassing Specification. Color: Blue Specific gravity: 2.30 Viscosity, (after mixing) cps @ 25C: 33,000 Operating temperature range, C: -70 to 115 Hardness, Shore D: 90 Mix ratio, parts by weight: lOH/lOOR Coefficient of expansion, cm/cm/C: 26-10 -6 Imoact. Izod. ft. lbs/inch of notch: 0.49 Dielectric strength, Volts/mil: 410 Dielectric constant, 1 KHz @ 25C: 5.9 Dissipation factor, KHz @ 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 2.1-10 15 ohm-cm @ 75C: 3.2-10 13 Thermal conductivity, Cal-cm/cm 2 set C: 21-10 -4 Reactive solids content, %: 100 Outgassing (NASA): Passes TRA-BOND 2153: Thermal conductive electrical insulating compound TRA-BOND 2153 Thermal Conductive COmDoUnd is a thixotrooic (smooth paste) thermal conductive epoxy-system that passesthe NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, intesrated circuits and other heat-sensitive components to printed-circuit boards. This twopart adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. TRA-BOND 2153 Compound bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured TRA-BOND 2153 Thermal Conductive Compound provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including solvents, oils, and alcohol.
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TRA-BOND 2153 (Continued): Color: Dark gray Specific gravity: 2.45 Viscosity (after mixing) cps @ 2X: Thixotropic Paste Operating temperature range, C: -70 to 125 Hardness, Shore D: 90 Mix ratio. uarts bv weiaht Hardener/Resin: lOH/lOOR Coefficient-of expansion, cm/cm/C: is-10 -6 Thermal conductivity, Cal-cm/cm 2 set C: 24-10 -4 Dielectric strenath; volts/mil: 410 Dielectric constant; 1 KHz.@ 25C: 6.0 Dissipation factor, 1 KHz 8 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 5.5-10 15 ohm-cm @ 1OOC: 4.0-10 13 Reactive solids content, %: 100 Outgassing (NASA): Passes TRA-BOND 2162A: Epoxy adhesive (Multi-range group) smooth paste (Color-coded for easy mixing) TRA-BOND 2162A is one of a multi-range epoxy adhesive group developed for industrial bonding and sealing applications where good wetting, toughness and improved impact strength properties are needed. Several formulations comprise this multirange group, and these span the mechanical spectrum from rigid (TRA-BOND 2162A) through semi-flexible (TRA-BOND 2162D). This epoxy system is color-coded for easy-mixing and handling as a smooth paste, and it develops strong bonds to most materials-including metals, glass, ceramics, leather, wood, concrete and many plastics--exhibits low shrinkage during cure, and has excellent dimensional stability over a wide temperature range. The fully cured TRA-BOND 2162A is a durable, tough electrical insulator with good low temperature mechanical, thermal shock, and impact resistance properties. In addition, it provides superior resistance to gases and vapors, weather, water, petroleum solvents, lubricants, fuels, alcohol, salts, mild acids and alkalis, and other chemical compounds. Color: Light yellow Specific gravity: 1.43 Viscosity @ 25C, poise: 1,170 Operating temperature range, C: -70 to 125 Heat distortion temperature, C: 58 Tensile strength, psi: 7,800 Elongation, %: 3.8 Hardness, Shore D: 88 Impact, Izod, ft. lbs/inch of notch: 0.4 Dielectric strength, volts/mil: 395 Dielectric constant, 1 KHz 8 25C: 4.1 Dissipation factor, 1 KHz 8 25C: 0.04 Volume resistivity, ohm-cm 8 25C: 3.1-10 13
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TRA-BOND 2162B: Epoxy adhesive (Multi-range group) smooth paste (Colorcoded for easy mixing) TRA-BOND 2162B is one of a multi-range epoxy adhesive group developed for industrial bonding and sealing applications where good wetting, toughness and improved impact strength properties are needed. Several formulations comprise this multi-range group, and these span the mechanical spectrum from Rigid (TRA-BOND 2162A) through semi-flexible (TRA-BOND 2162D). This epoxy system is color-coded for easy mixing and handling as a smooth paste, and it develops strong bonds to most materials--including metals, glass, ceramics, leather, wood, concrete and many plastics-exhibits low shrinkage during cure, and has excellent dimensional stability over a wide temperature range. Fully cured TRA-BOND 2162B is a durable, tough, medium rigidity electrical insulator with good low temperature mechanical, thermal shock, and impact resistance properties. It also provides superior resistance to gases, vapors, water, petroleum solvents, alcohol, fuels, lubricants, salts, mild acids and alkalis, and many other chemical compounds. Color: Light yellow Specific gravity: 1.35 Viscosity @ 25C, poise: 1,110 Operating temperature range, C: -70 to 125 Heat distortion temperature, C: 54 Tensile strength, psi: 7,400 Elongation, %: 5.2 Hardness, Shore D: 86 Impact, Izod, ft. lbs/inch of notch: 1.2 Coeffiecient of thermal expansion, cm/cm/C: 14.1-10 -5 Dielectric strength, volts/mil: 390 Dielectric constant, 1 KHz @ 25C: 4.1 Dissipation factor, 1 KHz @ 25C: 0.05 Volume resistivity, ohm-cm @ 25C: 2.5-10 13 TRA-BOND 2162C: Epoxy adhesive (Multi-range group) smooth paste (Color-coded for easy mixing) TRA-BOND 2162C is one of a multi-range epoxy adhesive group developed for industrial bonding and sealing applications where good wetting, toughness and improved impact strength properties are needed. Several formulations comprise this multi-range group, and these span the mechanical spectrum from Rigid (TRA-BOND 2162~) through Semi-flexible (TRA-BOND 2162~). This epoxy system is color-coded for easy mixing and handling as a smooth paste, and it develops strong bonds to most materials--including metals, glass, ceramics, leather, wood, concrete and many plastics-exhibits low shrinkage during cure, and has excellent dimensional stability over a wide temperature range. The fully cured TRA-BOND 2162C is a tough, high peel, durable electrically insulating adhesive with good low temperature mechanical, thermal shock, and impact resistance properties.
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TRA-CON, INC.: Epoxy Adhesives (Continued): TRA-BOND 216X (Continued): Color: Light yellow Specific gravity: 1.31 Viscosity @ 25C, poise: 660 Operating temperature range, C: -70 to 115 Tensile strength, psi: 4,100 Elongation, %: 25 Hardness, Shore D: 78 Impact, Izod, ft. lbslinch of notch: 1.7 Coefficient of thermal expansion, cm/cm/C: 12.5-10 -5 Dielectric strength, volts/mil: 375 Dielectric constant, 1 KHz @ 25C: 4.3 Dissipation factor, 1 KHz @ 25C: 0.07 Volume resistivity, ohm/cm/25C: 11-10 12 TRA-BOND 2162D: Epoxy adhesive (Multi-range group) smooth paste (Colorcoded for easy mixing) TRA-BOND 2162D is one of a multi-range epoxy adhesive group developed for industrial bonding and sealing applications where good wetting, toughness and improved impact strength properties are needed. Several formulations comprise this multi-range group. This epoxy system is color-coded for easy mixing and handling as a smooth paste, and it develops strong bonds to most materials--including metals, glass, ceramics, leather, wood, concrete and many plastics--exhibits medium shrinkage during cure and has good dimensional stability over a wide temperature range. Fully cured TRA-BOND 2162D is a tough, durable, high peel, semi-flexible electrically insulating adhesive with good low temperature mechanical, thermal shock and impact resistance properties. In addition, it provides good resistance to gases and vapors, weather, water, salt solutions, petroleum solvents and lubricants, gasoline, mild acids and alkalis, and other organic and inorganic compounds. Color: Light yellow Specific gravity: 1.23 Viscosity @ 25C, poise: 540 Operating temperature range, C: 170 to 110 Tensile strength, psi: 1,000 Elongation, %: 45 Hardness, Shore D: 60 Impact, Izod, ft. lbs/inch of notch: 4.1 Coefficient of thermal expansion, cm/cm/C: 11.1-10 -5 Dielectric strength, volts/mil: 360 Dielectric constant, 1 KHz @ 25C: 4.6 Dissipation factor, 1 KHz @ 25C: 0.10 Volume resistivity, ohm/cm/25C: 3.12-10 12
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INC.: Epoxy Adhesives (Continued):
TRA-BOND 2165: Rigid epoxy adhesive, smooth paste (Color-coded for easy mixing) TRA-BOND 2165, a smooth paste epoxy resin adhesive system, is recommended for rigid structural repair, laminating and bonding applications where easy handling and superior electrical insulation characteristics are needed. This combination liquid and paste system is color-coded for easy mixing and handling at room temperature, and it bonds strongly to the surfaces of most materials, exhibits low shrinkage during cure, and has excellent dimensional stability over a wide temperature range. Fully cured TRA-BOND 2165 is a strong and durable electrical insulator; in addition, it provides outstanding resistance to water, weather, ozone, oxygen, most petroleum fuel and solvent products, salts, mild acids and alkalis, and many other organic and inorganic compounds. Color: Dark Grey Specific gravity: 1.54 Viscosity @ 25C, poise: 1,300 Operating temperature range, C: -70 to 125 Heat distortion temperature, C: 105 Tensile strength, psi: 9,200 Hardness, Shore D: 90 Coefficient of thermal expansion, cm/cm/C: 30-10 -6 Dielectric strength, volts/mil: 435 Dielectric constant, 1 KHz @ 25C: 4.5 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 5.1-10 15 TRA-BOND 2202: Clear, low viscosity high temperature epoxy adhesive TRA-BOND 2202 is a low viscosity, high temperature cure epoxy resin system developed for rigid laminating, filament winding, potting and bonding applications where a clear, almost transparent adhesive system with good mechanical and electrical properties plus good heat resistance is required. This all liquid system has a long pot life and is easily mixed and handled at room temperature--however, a final elevated temperature cure is required for the complete development of its superior properties. TRA-BOND 2202 bonds to metals, glass, ceramics and other high temperature resistant products. Fully cured TRA-BOND 2202 is a strong, durable electrical insulator, and it provides excellent resistance to weather, water, vapors and gases, most petroleuem products and solvents, salts, mild acids and alkalis, and many other organic and inorganic compounds.
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TRA-CON, INC.: Epoxy Adhesives (Continued): TRA-BOND 2202: Color: Clear Specific gravity: 1.21 Viscosity (after mixing) cps @ 25C: 1,740 Operating temperature range, C: -60 to 175 Heat distortion temperature, C: 153 Mix ratio, parts by weight Hardener/Resin: 76H/lOOR Hardness, Shore D: 87 Dielectric strensth. volts/mil: 380 Dielectric constant; 1 KHz.@ 25C: 3.4 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 7.2-10 15 ohm-cm @ 150C: 5.1-10 12 Tensile Shear Strength, Alum. to alum., cured 8 hrs @ 12X, psi: 2,970 Reactive solids content, %: 100 TRA-BOND 2203: Clear high temperature epoxy adhesive (semi-rigid) TRA-BOND 2203 is a clear, near transparent epoxy adhesive recommneded for bonding, laminating and small volume casting applications where the combination of strong tough bonds and excellent wetting is required. This low viscosity all-liquid system is 100% reactive without the use of solvents, and is easily mixed, handled and applied at room temperature as it has a long useful pot-life and low exotherm--however it must be cured at elevated temperatures for satisfactory bonds. Fully cured TRA-BOND 2203 develops resilient, tough highstrength bonds to and between a wide range of materials which includes metals, glass, glass products and fabrics, ceramics and most rigid plastics. It has excellent thermal shock and impact resistance over a wide temperature range, has superior electrical properties, and exhibits low permeability to gases and vapors and outstanding resistance to fresh and salt water, weather, petroleum solvents, fuels and products, salt solutions, mild acids and alkalis, and many other chemical materials. Color: Clear, pale straw Specific gravity: 1.12 Viscosity after mixing @ 2X, cps: 890 Operating temperature range, C: -60 to 140 Tensile strength, psi: 7100 Hardness, Shore D: 85 Elongation, %: 4.1 Impact, Izod, ft. lbs/inch of notch: 0.34 Dielectric strength, Volts/mil: 405 Dielectric constant, 1 KHz @ 25C: 2.9 Dissipation factor, 1 KHz @ 25C: 0.008 Volume resistivity, ohm-cm @ 25C: 1.4-10 14 ohm-cm @ 150C: 9.7-10 11
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Adhesives, Sealants and Coatings for the Electronics Industry
AMERICAN SEALANTS, INC.: AS1 306 Electronic Grade Self-Levelling Silicone Sealant/Adhesive: AS1 306 Electronic Grade Self-Levelling Silicone is a one component, RTV (room temperature vulcanizing) product which uses a new cross-linking mechanism as a curing method. No acetic acid or other corrosive by-products are generated during its cure. Thus AS1 306 can be used in corrosion-sensitive electrical and/or electronic equipment with no adverse effect. Supplied ready-to-use, AS1 306 cures at room temperature to form a tough, high-modulus rubber. AS1 306 has excellent unprimed adhesion to a very wide range of substrates including metals (i.e. chrome), glass, most woods, ceramics and various plastics. Because AS1 306 is a 100% silicone sealant, it resists weathering, moisture, vibration, ozone, ultra-violet and temperature extremes. AS1 306 remains flexible from -60 to +2OOC (-75 to +48OF). Typical Uses: AS1 306 is primarily used in applications where a flowable, self-levelling silicone sealant is required to fill small gaps or voids. Applications include potting electrical terminals and coating electrical devices. Typical Properties: Uncured: Type: One-part, self-levelling RTV Appearance: Smooth, thick liquid Specific Gravity: Clear 1.02--Colors 1.04 Application Temperature Range: -18 to +5OC (0 to +120F) Cure method: Neutral, non-corrosive, moisture cure Skin Over Time: 40 minutes Cure Time: 24 hours (l/8" thickness) Slump/Sag: Flowable Cured: Durometer Hardness (Shore A) (ASTM D2240): 25 Tensile Strength (ASTM D 412): 230 psi (1.6 MPa) Elongation at Break (ASTM D 412): 400% Tear Resistance (ASTM D 624, Die B): 26 ppi (4.6 kN/m) Temperature Range After Cure: -60 to +25OC (-75 to +480F) Shrink Factor: Nil Thermal Expansion Coefficient: 9 x 10 -4 l/K 0 to IOOC (32 to 212F) Dielectric Strength (ASTM D 149): 452 V/mil (173 kV/cm) Volume Resistivity (ASTM D 257): >2.19 x 10 15 ohm/cm Dissipation Factor (ASTM D 150): 0.00106 at 100 Hz 0.00022 at 10 kHz Dielectric Constant (ASTM D 150): 2.71 at 100 Hz 2.71 at 10 KHz
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AMERICAN SEALANTS, INC.: AS1 388 Electronic Grade Sealant/ Adhesive: AS1 388 is a one-part, moisture-curing RTV (room temperature vulcanizing) silicone sealant/adhesive that is non-slump and cures to form a tough, permanently flexible rubber. The non-corrosive curing system of AS1 388 makes it ideally suited for protecting, sealing and insulating corrosion-sensitive electronic and electrical materials such as copper, brass, S ilver, etc. AS1 388 has been specifically formulated for use in electr ,ical/electronic production and assembly because it: * has good dielectric properties * has high surface resistivity * resists electrical tracking * repels water to protect electrical properties AS1 388 is a 100% silicone and has excellent resistance to: * ozone * uv * airborne chemicals * temperature changes from -60 to +2OOC (-70 to +390F) Typical Uses: AS1 388 is an excellent sealant/adhesive for many electrical and electronic applications where corrosion to metals, particularly copper, brass, silver, etc., is a problem. Characteristic: Shore A Hardness: 30+-2 Tensile @ Break: 250+-25 psi Elongation @ Break: 400+-25% Modulus @ 100% Elongation: 90+-10 psi Tear Strength: 30+-10 ppi Adhesion Strength (Peel): Glass: IO+-2 ppi Aluminum (Primed): 8+-2 ppi Mortar (Primed): 12+-2 ppi Sag, or Slump: Nil Shrinkage (Weight Loss): <5% Extrusion Rate: 130+-5 gm/min Service Temperature: -50C to 150C -58F to 302F Tack Free Time: 15 Minutes Time to Full Cure (l/8" Bead): 48 Hours Joint Movement Capability: +-25% Chemical Resistance: Excellent Color Retention: Excellent Weatherability: Excellent Reactivity of Byproducts: Non-corrosive to most substrates Electrical Properties @ 72F (22C): Dissipation Factor: 50 Hz: 0.0009 Dielectric Constant: 50 Hz: 2.7 Volume Resistivity: 2 x 10 14 Surface Resistivity: 3 x 10 15 Dielectric Strength, KV/mm: 18
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CHOMERICS, INC.: CHO-BOND Caulks and Sealants: CHO-BOND caulks and sealants provide effective EMIlEM?? shielding and sealing where large gaps must be filled (in contrast to adhesives, which are typically applied in a thin layer). These conductive epoxy, acrylic, and polyisobutylene resins are filled with a choice of silver, silver-plated copper, silver-plated aluminum, or silver-plated glass, providing a range of price and performance levels. For enhanced corrosion resistance, silver-plated-aluminum-filled material should be selected. 360-208: Binder: epoxy Filler: Ag/Cu, Ag Mix Ratio (by wgt.): 100:33 Consistency: very thick Specific Gravity: 4.OkO.40 Minimum Lap Shear Strength (psi): 1400 Maximum DC Volume Resistivity (ohm-cm): 0.01 Use Temperature: -80 to 212F (-62 to 1OOC) Elevated Temperature Cure Cycle: 0.75 hr. @ 212F (IOOC) Room Temperature Cure: 24 hrs. Working Life: 1.0 hr. Room Temperature Shelf Life (mos.): 9 Coverage (in2/lb.): 700 Recommended Thickness (in.): 0.010 min. Large particle size allows for thick bond-lines and oxide layer bite. No contact pressure required. 1035#: Binder: silicone Filler: Ag/glass Mix Ratio (by wgt.): l-part Consistency: thin paste Specific Gravity: 1.9+0.10 Minimum Lap Shear Strength (psi): 100 Maximum DC Volume Resistivity (ohm-cm): 0.05 Use Temperature: -67 to 392F (-55 to 2OOC) Room Temverature Cure: 1 wk. Working Life: 0.05 hr. Room Temperature Shelf Life (mos.): 6 Coverage-(in2/lb): 1,500 Recommended Thickness (in.): 0.007 min. Lowest cost silicone caulk. Bonds well to primed aluminum. Non-corrosive, room temperature cure system. Not recommended for vibration and EMP environments. # U.S. Patent 4,011,360
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CHOMERICS, INC.: CHO-BOND Caulks and Sealants(Continued): 1038#:
Binder: silicone Filler: Ag/Cu Mix Ratio (by wgt.): l-part Consistency: medium paste Specific Gravity: 3.55+-O-35 Minimum Lap Shear Strength (psi): 150 Maximum DC Volume Resistivity (ohm-cm): 0.01 Use Temperature: -67 to 257F (-55 to 125C) Room Temnerature Cure: 1 wk. Working Life: 0.05 hr. Room Temperature Shelf Life (mos.): 6 Coverage- (in.2/lb.): 750 Recommended Thickness (in.): 0.007 min. Maximum EM1 performance. Excellent fillet in military environment. Non-corrosive, room temperature cure system. No maximum thickness limits. 1075:
Binder: silicone Filler: Ag/Al Mix Ratio (bv wst.): I-Dart Consistency:-medium paste Specific Gravity: 2.0+-0.2 Minimum Lap Shear Strength (psi): 120 Maximum DC Volume Resistivity (ohm-cm): 0.05 Use Temperature: -67 to 2571 (-55 to 125C) Room Temperature Cure: 1 wk. Workins Life: 0.25 hr. Room Temperature Shelf Life (mos.): 6 Coverage (in2/lb): 1,200 Recommended Thickness (in.): 0.010 min. Values shown for 1075 reflect typical properties. 4660:
Binder: polyisobutylene Filler: Ag/Cu Mix Ratio (by wgt.): l-part Consistency: gritty paste Specific Gravity: 2.0+-0.30 Maximum DC Volume Resistivity (ohm-cm): 0.08 Use Temperature: -67 to 212F (-55 to 1OOC) Room Temperature Cure: 1 wk. Working Life: 0.5 hr. Room Temperature Shelf Life (mos.): 6 Coverage (in2/lb): 900 Recommended Thickness (in): 0.015 min. Resists acids, alkalis, salts. Attacks by oxidizing agents and halogens. Best applied before assembly. Remains flexible. # U.S. Patent 4,011,360
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CHOMERICS, INC.: CHO-BOND Caulks and Sealants(Continued): 4669: Binder: polyisobutylene Filler: AgfCu Mix Ratio (by wgt.): 1 -part Consistency: gritty paste Specific Gravity: 2.0+-0.30 Maximum DC Volume Resistivity (ohm-cm): 0.08 Use Temperature: -67 to 212F (-55 to 1OOC) Room Temperature Cure: 1 wk. Workins Life: 2.5 hrs. Room Temperature Shelf Life (mos.): 6 Coverage (in2/lb): 900 Recommended Thickness (in.): 0.015 min. Same as 4660, but longer working life. New:
Binder: urethane Filler: Ag/Al Mix Ratio (By wgt.): 2-part Consistency: medium paste Newly introduced for improved corrosion resistance. Also remains flexible. 1086: Binder: primer for 1035, 1038 Mix Ratio: l-part Consistency: thin fluid Specific Gravity: 0.78+-0.10 Use Temperature: -112 to 392F (-80 to 2OOC) Room Temperature Cure: 0.5 hr. Room Temoerature Shelf Life (mos.1: 6 Coverage-(in2/lb).: 14,400 Recommended Thickness (in.): 0.0002 max. Wipe on surface and let air dry 30-60 min.
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DOW CORNING CORP.: DOW CORNING 736 Heat Resistant Sealant: DOW CORNING 736 heat resistant sealant is a one-part, nonslumping paste that cures to a tough, rubbery solid at room temoerature on exwosure to water vawor in the air. This silicone product was formulated to perform at temperatures ranqinq from -65 to 260C (-85 to 500F) for continuous operation and to 316C (600F) for intermittent exposure. It can be used for numerous sealing and bonding applications. Uses: The high temperature properties of this sealant make it ideally suited for: * Sealing and encapsulating heating elements in appliances * Aerospace gasketing * Moving oven belts * Industrial ovens * Bag filters on smoke stacks * Other critical bonding, sealing, potting, encapsulating and protective coatings where parts must perform at high temperatures Type: One-part, nonslumping silicone paste Cure: Cures at room temperature by reaction with moisture in the air Special Properties: Performs at temperatures ranging from -65 to 260C (-85 to 500F) for continuous ooeration and to 316C (600F) for intermittent exposure Primary Uses: Bonding, sealing, potting, encapsulating and protective coating operations where parts must perform at high temperatures Typical Properties: As Supplied: Color: Red Flow/Slump: Nil Extrusion Rate (l/8-inch orifice, 90 psi), grams/minute: 335 Specific Gravity: 1.04 Cure Characteristics - exposed to air, 25C (77F) and 50% RH: Skin-Over Time, minutes: 6 Tack-Free Time, minutes: 15 Cure Time (l/8-inch thickness), hours: 24 As Cured - after 72 hours at 25C (77F) and 50% RH: Durometer, Shore A, points: 32 Tensile Strength, psi: 350 Elongation, percent: 500 Unprimed Adhesion (most substrates): Good
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FEL-PRO INC.: PRO-LOCK Anaerobic Adhesive Sealants: PRO-LOCK anaerobics are uniquely different from other types of metal adhesives or sealants. They need no catalysts and contain no solvents; instead, they cure in the absence of air. PROLOCK anaerobic adhesives remain liquid on exposed metal surfaces, so you don't have to assemble parts immediately. However, when placed between snug-fitting metal surfaces which exclude air, they cure to full strength, producing a tough, inert plastic. Product: --___ Nut-type: blue Viscosity: Medium 1300 cps Stud-type: red Viscosity: Medium 500 cps Wicking-type: green Viscosity: LOW 20 cps Retaining-I: green Viscosity: Medium 125 cps Retaining-II: green Viscosity: High 2000 cps Hydraulic Sealant: brown Viscosity: Medium 400 cps Pipe Sealant with Teflon: white Viscosity: Light Paste Flange Sealant: red Viscosity: Light Paste Cleaner/Primer: green Viscosity: Spray or Thin Liquid
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GE SILICONES: RTV Silicone Adhesive Sealants: RTV 133, RTV 160, RTV 162, RTV 167, RTV 6424: RTV silicone adhesive sealants are one-component products in liquid or paste form which cure to strong, durable, resilient silicone rubbers at room temperature and on exposure to atmospheric moisture (except RTV 6424, which requires heat to cure). They offer both high- and low-temperature resistance, which means excellent dielectric performance in applications characterized by wide thermal cycling. Key Performance Properties: * Extreme high/low-temperature resistance [-75 to 400F (-60 to 204C)l * Excellent ultraviolet and ozone resistance * Primerless adhesion to many materials * Outstanding bonding and long service life * Excellent dielectric properties RTV 133: This paste consistency, UL-recognized RTV silicone adhesive sealant is used as a sealant on firewalls or as a flame-retardant coating. It is also an excellent choice for coating electronic printed circuits, and semiconductors on electronic assemblies. Suitable for use on vertical applications. RTV 160: This white, flowable silicone adhesive sealant is non-corrosive and cures with low odor. Recommneded for insulating, encapsulating and coating thin sections on electronic printed circuits, semiconductors and copper connections. RTV 162: Paste consistency, non-corrosive silicone adhesive sealant. Excellent bonding material for capacitors, resistors and integrated circuits to printed circuit boards. Insulates relays, exposed copper wires, terminals. Seals and protects connectors and miniature circuits. Also used as a formed-inplace gasket for electronic units. RTV 167: Paste consistency, high-strength, non-corrosive silicone adhesive sealant. Suitable for use on horizontal and vertical surfaces. For mechanical or electrical applications where the highest adhesion and strength are required. Excellent electrical insulator. RTV 6424: White, paste consistency, heat-curing silicone adhesive sealant bonds to many substrates without primer and will cure rapidly at high temperatures. This product has a very long working time at room temperature, but does not cure until exposed to 150C (300F) for about 30 minutes, with full cure time dependent upon the mass of the assembly which must be heated. And because RTV 6424 adhesive sealant has no cure byproduct, it offers very low linear shrinkage.
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GE SILICONES: Adhesive Sealants (Continued): RTV 133: Flame Retardant UL94 V-l/V-O Paste Typical Properties: Color: Black Cure Conditions: RT Silicone Content, %: 100 Viscosity, cps (8 25C, 77F): Paste Soecific Gravitv: 1.23 Hardness, Shore-A Durometer: 45 Tensile Strength, psi (kg/cm 2): 650 (46) Elongation, %: 250 Dielectric Strencrth. volts/nil (kV/mm): 500 (19.7) Dielectric Constant'(1000 Hz): 28 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 3 x 10 15 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) RTV 160: Flowable Non-Corrosive Typical Properties: Color: White Cure Conditions: RT Silicone Content, %: 100 Viscosity, cps (a 25C, 77F): 20,000 Specific Gravity: 1.04 Bardness, Shore A Durometer: 25 Tensile Strength, psi (kg/cm 2): 275 (19) Elongation, %: 275 Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 2.8 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 4 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) RTV 162: Non-Corrosive UL Recognized Paste Typical Properties: Color: White Cure Conditions: RT Silicone Content, 8: 100 Viscosity, cps (8 25C, 77F): Paste Specific Gravity: 1.09 Hardness, Shore A Durometer: 35 Tensile Strength, psi (kg/cm 2): 475 (33) Elongation, 8: 400 Dielectric Strength. volts/mil (kV/mm): 450 (17.7) Dielectric Const&t.(lOOO Hz): 2.8. Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 3 x 10 15 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)
Caulks and Sealants
GE SILICONES: Adhesive Sealants (Continued): RTV 167: High-Strength Non-Corrosive UL Recognized Paste Typical Properties: Color: Gray Cure Conditions: RT Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): Paste Specific Gravity: 1.12 Hardness, Shore A Durometer: 37 Tensile Strength, psi (kg/cm 2): 800 (56) Elongation, %: 650 Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 2.8 Dissipation Factor (1000 Hz): 0.003 Volume Resistivity, ohm-cm: 3 x 10 15 Useful Temperature Range, F (C!):-75 to 400 (-60 to 204) RTV 6424: Heat Cure Paste Tvoical Proaerties: __ Color: White Cure Conditions: Heat Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 880,000 Specific Gravity: 1.17 Hardness, Shore A Durometer: 30 Tensile Strensth. 2): 650 (46) _ ._ osi (kq/cm ._. Elongation, %: 500 Tear Resistance, lb/in (kq/cm): 100 (17.9) Dielectric Strenath. volts/mil (kV/mm): 500 (19.7) Dielectric Constant'(1000 Hz): 2.8. Dissipation Factor (1000 Hz): 0.002 Volume Resistivity, ohm-cm: 1 x 10 15 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)
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GENERAL ELECTRIC CO.: RTV Adhesive Sealant Products: RTV RTV RTV RTV
102 White: 103 Black: 108 Translucent: 109 Aluminum: Outstanding Property: Paste-Consistency, Standard Grade Applications: For use on horizontal, vertical or overhead surfaces for applications such as bonding, sealing, electrical insulation, and formed-in place gaskets. Specific Gravity: 1.05 Hardness Shore A: 30 Tensile Strength kg/cm 2 (lb/in 2): 28(400) Elong. %: 450 Heat Resistance: Continuous Operation To: 204C(400F) Short Periods To: 260C(SOOF)
RTV 112 White: RTV 118 Translucent: Outstanding Property: Pourable/Self-Leveling, Standard Grade Applications: For applications requiring flow into small surface crevices or hard-to-reach places such as bonding and sealing, electrical insulation, encapsulating, protective coatings, and thin section potting. Specific Gravity: 1.05 Hardness Shore A: 25 Tensile Strength kg/cm 2(lb/in 2): 23(325) Elong. %: 325 Heat Resistance: Continuous Operation To: 204C(400F) Short Periods To: 260C(500F) RTV 157 Gray: RTV 159 Red: Outstanding Property: High Strength Applications: For use on horizontal, vertical or overhead surfaces for applications requiring very high mechanical bond strength and physical or tear strength, such as mechanical bonding and sealing, aerospace, automotive and industrial assembly sealing and gasketing; and other high stress applications. RTV 159 for applications where a combination of high strength and very high temperature resistance is required. Specific Gravity: 109 Hardness Shore A: 25 Tensile Strength kg/cm 2 (lb/in 2): 53(750) Elong. %: 800 Heat Resistance: Continuous Operation To: 204C(400F) RTV 157 Gray 260C(500F) RTV 159 Red Short Periods To: 260C(SOOF) RTV 157 Gray 315C(600F) RTV 159 Red
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GENERAL ELECTRIC CO.: RTV Adhesive Sealant Products(Continued): RTV 106 Red: RTV 116 Red: Outstanding Property: High Temperature Applications: For applications such as aerospace gasketing and sealing; and other critical bonding, sealing, potting, insulating, encapsulating and protective coating applications where parts must perform to extreme high temperatures. RTV 106 for use on horizontal, vertical and overhead surfaces. RTV 116 for flow into small surface crevices or hard-to-reach places and thin section potting. Specific Gravity: l.O7(RTV 106)--l.O9(RTV 116) Hardness Shore A: 30(RTV 106)--2O(RTV 116) Tensile Strength kg/cm Z(lb/in 2): 26(375)(RTV 106)/25(RTV 116) Elong. %: 4OO(RTV 106)/350(RTV 116) Heat Resistance: Continuous Operation To: 260C(500F) Short Periods To: 315C(600F) RTV 161 White: RTV 162 White: Outstanding Property: Non-Corrosive Applications: Typical applications include coatings for electronic and integrated circuits and semi-conductors, copper connections on electronic parts assemblies, and applications where compliance with military specification MIL-A-46146A is required. For use where neutral cure by-products are required to prevent corrosion. Specific Gravity: l.O4(RTV 161)--l.O9(RTV 162) Hardness Shore A: 25(RTV 161)--35(RTV 162) Tensile Strength kg/cm 2 (lb/in 2): 19(275)(RTV 161)--33(475) (RTV 162) Elong. %: 275(RTV 16 l)--375(RTV 162) Heat Resistance: Continuous Operat ion To: 204C(4OOF)(RTV 161) 204C(400F)(RTV 162) Short Periods To: 260C(500F)(RTV 161) 26OC(500F)(RTV 162) RTV 133 Black: Outstanding Property: Containing Flame Retardant _. Applications: Use on electrical or mechanical applications where flame retardancy or UL recognition is required. Specific Gravity: 1.23 Hardness Shore A: 45 Tensile Strength kg/cm 2 (lb/in 2): 46(650) Elong. %: 250 Heat Resistance: Continuous Operation To: 204C(400~) Short Periods To: 260C(500F)
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LOCTITE CORP.: LOCTITE Impregnation System: LOCTITE Impregnation System (LIS) is a unique, porositysealing technology for castings, powder metal parts, electronic components, and a wide variety of other types of parts. The LIS has eliminated pressure and fluid leakage for many manufacturers, and has also helped others seal products against moisture and solvent damage. LIS provides consistent, permanent sealing of castings and powdered metal parts for liquid and gas pressure application. Also improves dramatically the machinability of P/M parts. LIS has replaced part scrapping and costly repair methods and has become a design tool allowing manufacturers and users to improve and maintain part quality and reliability. FLEXSEAL XT: LOCTITE's FLEXSEAL XT resin seals potential leak paths on molded electronic components such as pin connectors,-switches and wire harnesses. LOCTITE LIS is available as in-plant processing or through Authorized LOCTITE Contractors. Assembly Services: The LOCTITE Application Process Center offers bonding and sealing assembly operations on a contract basis, enabling manufacturers to test prototypes or make small or large production runs without capital investment. Some of the services include: Vacuum impregnation of castings, die castings and powder metal parts with LOCTITE RESINOL impregnant to eliminate microsporosity. Vacuum impregnation of electonic components with FLEXSEAL impregnant to eliminate leak paths between metal connections and plastic molded parts. Robotic tracing of gaskets, adhesives, and other materials. Potting and encapsulation of components. Conformal coating of printed circuit boards. Application and cure of LOCTITE UV adhesives and sealants.
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MERECO DIVISION: MERECO METASIL 5002 Flexible Adhesive/Sealant: MERECO METASIL 5002 is a one-part silicone rubber designed for high performance mechanical sealing and bonding. It is a thixotropic paste designed for the formation of tough, rubbery bonds between most engineering materials such as aluminum, glass, nickel, steel, stainless steel, tin, titanium, acrylate, polycarbonate, polyester, polystyrene and silicone rubber itself. The high peel strength, high tear strength, electrical insulation, weatherability, resistance to vibration, ozone and moisture provide reliability in high performance applications including sealing pressurized aircraft cabins, bonding silicone rubber gaskets, metal bonding, sealing electrical and electronic equipment, sealing windows in hot and cold environments and attaching nameplates, brackets and trim materials to machines, fabrics and plastic housings. Curing is affected by relative humidity, degree of confinement, porosity of the substrate and cross-sectional thickness of the silicone. On exposure to air, curing forms a skin on the surface and then progresses through the material. At 77F and 50% relative humidity, a tack-free skin is formed within 20 minutes. Tooling is not practical after skin formation and should be completed within 10 minutes of application. Sections up to 0.125 inches become rubbery solids in 24 hours at 77F. For thicknesses over 0.25 inches, the two-component silicone rubber compounds avoid prolonged curing periods. Lower temperature and humidity decrease the rate of cure. Higher temperature and humidity accelerate the cure. During curing, acetic acid vapors release from the surface. When cure is complete, the odor disappears. If required, cured product can be repaired easily with fresh sealant. Typical Properties: Color: Translucent Form: Soft Paste Viscosity (25C), cP: Thixotropic Specific Gravity (25/25C): 1.08 Flash Point, F: Not applicable Product JJser Data: Slump: None Skin over time, minutes: 20 Tack-free time, hours: 1 Cure time (77F, 50% RH): Handling strength, hours: 12-24 Full cure, days: 7 Typical Cured State Properties (after 7 days at 77F): Color: Translucent Form: Rubberv solid Specific Gravity (25/25C): 1.07 Ultimate Tensile Strength, psi: 650 Elongation at Break, %: 400 Tear Strength (Die B), ppi: 70 Hardness (Shore A): 30
Adhesives, Sealants and Coatings for the Electronics Industry
264
MERECO DIVISION: MERECO METASIL 5004T/MERECO METASIL 5004LV RTV-1 Non-Corrosive Adhesive Sealants: MERECO METASIL 5004T and 5004LV adhesive sealants are single component non-corrosive materials that cure at room temperature to provide a tough, durable and flexible silicone rubber. These products employ a neutral curing system that has no corrosive by-products and no exotherm and does not revert. These attributes combined with their excellent dielectric properties and lack of reversion permit their use in sensitive electric and electronic applications. Their translucence allows visual inspection of sealed parts. MERECO METASIL 5004T and 5004LV adhesive sealants are recommended for primary protection of printed circuits, electrical connectors, semi-conductors, junctions, terminals and shock and vibration sensitive components. They are designed for applications where cross-sections of cured rubber will be 114 inch or less. Although they may be used for thicker applications, MERECO METASIL two component RTV products should be used to avoid prolonged curing times. * * * * * * * * *
Single component-ready to use No measuring or mixing No exothermic heat No corrosive by-products No solvents High strength Excellent dielectric Excellent adhesion Excellent weathering and ozone resistance
MERECO METASIL 5004T conforms to MIL-A-46146A Type 1 specifications. MERECO METASIL 5004LV conforms to MIL-A-46146A Type 2 specifications. Uncured Properties: 5004T: Color: Translucent Form: Non-slump Extrusion Rate, g-min -1: 200 Corrosion (MIL-A-46146): Pass Skin-over Time, minutes: 10 Tack-free Time, hours: 3 5004Lv: Color: Translucent Form: Flowable Extrusion Rate, g-min -1: Self-leveling Corrosion (MIL-A-46146): Pass Skin-over Time, minutes: 10 Tack-free Time, hours: 3
Caulh3 and Sealants
MERECO
DIVISION:
MERECO
METASIL
5005 RTV General Purpose
Silicone Adhesive Sealant: MERECO METASIL 5005 is a one-component, general purpose, RTV silicone adhesive/sealant for industrial or domestic use. METASIL 5005 will bond well to most surfaces, is nonslumping, and will not sag or run when applied to vertical or overhead surfaces. METASIL 5005 is also a good general purpose sealant for electrical or electronic applications where a non-corrosive, easily dispensed system is necessary. Color: Clear, White Specific Gravity: 1.03 Viscosity: Thixotropic Durometer, Shore A: 27 Tensile Strength, psi: 300 Elongation, %: 325 Dielectric Strength, volts/mil: 550 Dielectric Constant, 100Hz: 2.65 Volume Resistivity, ohm-cm: 1.5 x 10 14 METASIL 5017 Mold Making Silicone Rubber: High strength, RTV silicone rubber for epoxy and polyester casting. Resin Portion: Form: Liquid Color: Off-white SP. Gr.: 1.14 Activator: Form: Liquid Color: Nearly colorless Sp. Gr.: 0.98 Flash Point, F: 93 Mixture: Form: Liquid Color: Off-white SP- Gr.: 1.14 Characteristics of Cured Components: Tear: 90 ppi Hardness Tests: Durometer: 25: Shore A Tensile Strength: 650 psi Elongation: 275% Shrinkage (2 days at 12OC): 1%
265
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Adhesives, Sealants and Coating for the Electronics Industry
MERECO DIVISION: MERECO XLN-647 Thixotropic Sealant Epoxy: MERECO XLN-647 is a two-component thixotropic sealant epoxy system. It is useful as a sealant, adhesive or coating for a variety of uses. It has a particular utility as a microwave tube sealant. The oustanding properties of MERECO XLN-647 are excellent adhesion, room temperature (24 hr) cure and easy (1 to 1) mix ratio. Curing time may be shortened to 3 to 4 hours with a mild (50 to 65C) heat cure. Uncured: Curing Agent: Appearance: Amber Form: Paste Storage Life, months: 6 Flash Point, F: over 365 Specific Gravity: 1.0 Viscosity, cP: Thixotropic EDOXY Resin: Appearance: Nearly colorless Form: Liquid Storage Life, months: 6 Flash Point, F: 390 Specific Gravity: 1.2 Viscosity, cP: 8,500 Mixture: Appearance: Yellow Form: Paste Specific Gravity: 1.1 Viscosity, cP: Thixotropic Cured: Thermal Shock (MIL-I-16923): Passes Operating Range, C: -65 to 145 Mass Loss at 125C (24 hr), %: 0.8 Durometer, Shore D: 80 Dielectric Strength, volts/mil: 440 Volume Resistivity, ohm-cm: 1 x 10 14 Dissipation Factor: 0.01 Dielectric Constant: 3.1
Caulks and Sealants
267
MERECO DIVISION: MERECO 3890 Series: Age-Resistant Low-Slump Elastomeric Epoxy Adhesive/Sealant: MERECO 3890 is a thixotropic two-component, epoxy adhesive specifically designed for applications where a tough, flexible material is a requirement. The cured product can be cut away for examination or replacement of components. It is easily repaired with fresh mixture. MERECO 3890 has a long working life at room temperature, mixes easily and affords economical production speeds and energy costs. Outstanding properties of MERECO 3890 are high adhesion, overnight cure at room temperature, forgiving (1 to 1) mixing ratio, repairability and flexibility. The system is a costeffective replacement for silicone and fluorosilicone RTV adhesive/sealants especially where operating temperatures do not justify the use of silicone elastomers. Additionally, release of acetic acid or other vapors during cure is eliminated and primers are not generally needed. MERECO 3890 adheres well to most metals, glass and plastics including aluminum, diallylphthalates, parylenes, phenolics, polyesters, polyimides and polyphenylene sulfides. This outstanding adhesion is related, in part, to the exceptional surface wetting of its unique epoxy elastomeric structure. It passes shock testing in MIL-S-901C applications and meets the requirements of MIS-34882. Features: * Epoxy elastomer * Simple mixing ratio * Excellent adhesion * Ambient cure temperatures * Rapid cure with heat * Good mechanical strength * Very good dielectric * Resistant to chlorofluorocarbon washing Typical Product Properties: Activator: Color: Pale Yellow Form: Soft Paste Viscosity (25C), cP: 160 000 Specific Gravity (25/25C): 1.03 Flash Point, F: 190 Base: Color: Translucent Form: Soft Paste Viscosity (25C), cP: 150 000 Specific Gravity (25/25C): 1.18 Flash Point, F: 400
Section IV Coatings
268
Coatings
269
CASTALL, INC.: Coatings Specially Designed for Electronic or General Applications: E-124 A&B and E-126 A&B: Low and medium viscosity semi-flexible two-part systems that lend themselves to coatings as well as potting applications. E-124 is a clear unfilled material while E-126 is the filled version of E-124. CASTALL E-208 and E-209: CASTALL E-208 is a transparent, clear epoxy general purpose rigid coating resistant to water and chemicals. E-209 is a filled rigid black material used for surface coatings. CASTALL E-240 A&B: CASTALL E-240 A&B is a two component epoxy thermally conduective dip coating material. This coating is heat cured to give good protection against moisture and chemicals. CASTALL E-247 and E-248: CASTALL E-247 is a general purpose thixotropic epoxy dip coating material while-E-248 is a-higher strength version of E-247. Both materials provide a tough enamel like envelope that has good resistance to moisture and chemicals. CASTALL E-343 A&B: CASTALL E-343 A&B is a thermally conductive epoxy conformal coating with high electrical insulation properties. E-343 A&B lends itself to spraying with conventional equipment with thicknesses of 1 to 6 mils. CASTALL U-2629 R&I: CASTALL U-2629 is a solvent free, two part, light stable, low flow urethane material that is suitable for use as a soft repairable coating. CASTALL U-2861, U-2862, U-2863, and U-2864: CASTALL U-2861. U-2863 and U-2864 are a series of urethane solvent base conformal coatings. U-2861 is a two part system while the others are one part materials. They can be applied by brush, dipping or spray techniques. CASTALL S-1280 A&B, S-1307 A&B and S-1332 A&B: CASTALL S-1280 A&B is a silicone dip coating requiring elevated temwerature cure and use of wrimer P-1292 if sood adhesion is required. CASTALL S-1307 A&B, is an easy to use thermally conductive silicone coating that will normally bond to most substrates when cured at elevated temperatures. CASTALL S-1332 A&B is a clear two part silicone coating that will bond to most substrates when cured at elevated temperature. S-1307 and S-1332 are primerless silicone compounds.
270
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Coatings Specially Designed for Electronic or General Applications (Continued): E-124 A&B: Color: Amber Mix Ratio: 100/82 Specific Gravity @ 25C: 1.06 Viscosity @ 25C; cps: 7100 Shore Hardness: D73 Pot Life 50gm-hr. 25C: 1 l/2 - 2 Cure Time Hrs. @ 25C. 65C. 1OOC: 24-48/2/---Tensile Strength @ 25C, psi: 7500 Linear Shrinkage in/in: 0.006 Thermal Conductivity: 4.4 (1.3) Dielectric Constant @ 25C/lOOkc: 4.4 Dielectric Strength @ 25C/lOOkc: 350 Dissipation Factor @ 25C/lOOkc: 0.040 Volume Resistivity @ 25C: 10 14 E-126 A&B: Color: Beige Mix Ratio: lOO/lOO Specific Gravity C 25C: 1.40 Viscosity @ 25C; cps: 25000 Shore Hardness: D73 Pot Life 50gm-hr. 25~: 1 l/2 - 2 Cure Time Hrs. @ 25C, 65C, 1OOC: 24-48/2/---Tensile Strength @ 25C, psi: 12000 Linear Shrinkage in/in: 0.004 Thermal Conductivitv: 8.0 (2.41 Dielectric Constant-@ 25C/iOOkc: 4.6 Dielectric Strength @ 25C/lOOkc: 350 Dissipation Factor @ 25C/lOOkc: 0.060 Volume Resistivity @ 25C: 10 14 E-208: Color: Clear Mix Ratio: lOO/ll Specific Gravity @ 25C: 1.10 Viscosity @ 25C, cps: 400 Shore Hardness: D73 Pot Life 50gm-hr. 25C: 1-2 Cure Time Hrs. @ 25C, 65C, 1OOC: 12-24/2/---Tensile Strength @ 25C, psi: 8000 Linear Shrinkase in/in: 0.010 Thermal Conductivity: 5.1 (1.5) Dielectric Constant @ 25C/lOOkc: 4.1 Dielectric Strength @ 25C/lOOkc: 450 Dissipation Factor @ 25C/lOOkc: 0.030 Volume Resistivity @ 25C: 10 13
Coatings
CASTALL, INC.: Coatings Specially Designed for Electronic or General Applications (Continued): E-209: Color: Black Mix Ratio: 100/5.6 Specific Gravity @ 2%: 1.45 Viscosity @ 25C, cps: 1300 Shore Hardness: D78 Pot Life 50gm-hr. 25C: l-2 Cure Time Hrs. @ 25C, 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 9000 Linear Shrinkaue in/in: 0.008 Thermal Conductivity: 6.2 (1.8) Dielectric Constant @ 25C/lOOkc: 4.1 Dielectric Strength @ 25C/lOOkc: 450 Dissipation Factor @ 25C/lOOkc: 0.030 Volume Resistivity @ 25C: 10 13 E-240 A&B: Color: Black Mix Ratio: 100/4.6 Specific Gravity @ 25C: 1.80 Viscosity @ 25C, cps: 6500 Shore Hardness: D85 Pot Life 50gm-hr. 25C: 6-8 Cure Time Hrs. @ 25C, 65C, 1OOC: ----/3-4/l-2 Tensile Strensth B 25C. wsi: 8320 Linear Shrinkage in/in; ‘0.002 Thermal Conductivity: 20.2 (8.3) Dielectric Constant@ 25C/lOOkc: 4.1 Dielectric Strength @ 25C/lOOkc: 475 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C: IO 16 E-247: Color: Black Mix Ratio: lOO/ll Specific Gravity @ 25C: 1.2 Viscosity @ 25C, cps: 30000 Shore Hardness: D85 Pot Life 50gm-hr. 25C: 3/4 Cure Time Hrs. @ 25C, 65C, 1OOC: 8-10/1-2/Tensile Strength @ 25C, psi:.7200 Linear Shrinkage in/in: 0.010 Thermal Conductivity: 5.1 (1.5) Dielectric Constant B 25C/lOOkc: 4.1 Dielectric Strength @ 25C/lOOkc: 450 Dissipation Factor @ 25C/lOOkc: 0.030 Volume Resistivity @ 25C: 10 13
271
272
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Coatings Specially Designed for Electronic or General Applications (Continued): E-248: Color: Black Mix Ratio: lOO/lO Specific Gravity @ 25C: 1.35 Viscosity @ 25C, cps: 25000 Shore Hardness: D05 Pot Life 50gm-hr. 25C: 1 Cure Time Hrs. @ 25C. 65C. 1OOC: 12-24/1-2/---Tensile Strength @ 25C, psi: 9200 Linear Shrinkage in/in: 0.008 Thermal Conductivity: 7.8 (2.3) Dielectric Constant B 25C/lOOkc: 4.2 Dielectric Strength @ 25CjlOOkc: 475 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C: 10 15 E-343 A&B*: Color: Black Mix Ratio: 100/3.9 Specific Gravity @ 25C: 1.35 Viscositv @ 25C. ens: 200 Shore Hardness:.D89 Pot Life 50qm-hr. 25C: 6 Cure Time Hrs @ 25C, 65C, IOOC: ----/2/---Tensile Strength @ 25C, psi: 8300 Linear Shrinkage in/in: 0.003 Thermal Conductivity: 26.2 (7.7) Dielectric Constant @ 25C/lOOkc: 5.6 Dielectric Strength @ 25C/lOOkc: 1000 (3M) Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C: 10 16 * % Solids: E-343: 70 S-1280 A&B: Color: White Mix Ratio: lOO/lO Specific Gravity @ 25C: 1.48 Viscosity @ 25C, cps: 300,000 Shore Hardness: A58 Pot Life 50gm-hr. 25C: 168 Cure Time Hrs. @ 25C, 65C, IOOC: ----/----11 Tensile Strength @ 25C, psi: 850 Linear Shrinkage in/in: 0.002 Thermal Conductivity: 3.0 (0.9) Dielectric Constant @ 25C/lOOkc: 3.8 Dielectric Strength @ 25C/lOOkc: 550 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C: 10 15
Coatings
CASTAL, INC.: Coatings Specially Designed for Electronic or General Applications (Continued): S-1307 A&B: Color: Red Mix Ratio: 100/100 Specific Gravity 25C: 2.18 Viscosity @ 25C, cps: 30000 Shore Hardness: A75 Pot Life 50gm-hr. 25C: 4 Cure Time Hrs. @ 25C, 65C, 1OOC: ----/2/l Tensile Strencth C 25C. nsi: 600 Linear Shrinkage in/in; 0.004 Thermal Conductivity: 34.3 (10.1) Dielectric Constant@ 25C/lOOkc: 5.7 Dielectric Strength @ 25C/lOOkc: 500 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C: 10 14 S-1332 A&B: Color: Clear Mix Ratio: lOO/lO Specific Gravity @ 25C: 1.00 Viscosity @ 25C, cps: 3100 Shore Hardness: A40 Pot Life 50gm-hr. @ 25C: 8 Cure Time Hrs. @ 25C, 65C, 1OOC: ----/4/2 Tensile Strength @ 25C, psi: 750 Linear Shrinkage in/in: 0.003 Thermal Conductivity: 4 (1.2) Dielectric Constant 8 25C/lOOkc: 3.0 Dielectric Strength @ 25C/lOOkc: 450 Dissipation Factor @ 25C/lOOkc: 0.001 Volume Resistivity @ 25C: 10 15 R&I: Color: Clear Mix Ratio: 100/50 Specific Gravity @ 25C: 1.07 Viscosity @ 25C, cps: Thixo Shore Hardness: A25 Pot Life 50gm-hr. 25C: 20 Cure Time Hrs. 8 25C. 65C. 1OOC: 24/4/---Tensile Strength @ 25C, psi: 157 Linear Shrinkage in/in: 0.008 Dielectric Constant @ 25C/lOOkc: 545 Dissipation Factor @ 25C/lOOkc: 0.0190 Volume Resistivity @ 25C: 10 13
u-2629
273
274
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Coatings Specially Designed for Electronic or General Applications (Continued): U-2861 R&I*: Color: Amber Mix Ratio: 100/70 Specific Gravity @ 25C: 1.08 Viscosity @ 25C, cps: 90 Shore Hardness: HB** Pot Life 50gm-hr. 25C: 6 Cure Time Hrs. 8 25C, 65C, IOOC: 12-24/----/---Tensile Strength @ 25C, psi: N/A Linear Shrinkage in/in: N/A Dielectric Constant 8 25C/lOOkc: 3.5 Dielectric Strength 8 25C/lOOkc: 3000 Dissipation Factor @ 25C/lOOkc: 0.0138 Volume Resistivity @ 25C: 10 16 * 8 Solids: U-2861 - 60 Meets Mil I 46058C Type UR ** Pencil Hardness U-2862*: Color: Amber Mix Ratio: One-part Specific Gravity @ 25C: 0.98 Viscosity @ 25C, cps: 200 Shore Hardness: HB** Pot Life 50gm-hr. 25C: N/A Cure Time Hrs. @ 25C, 65C, 1OOC: 8-16/----/---Tensile Strength @ 25C, psi: N/A Linear Shrinkage in/in: N/A Dielectric Constant C 25C/lOOkc: 3.2 Dielectric Strength 8 25C/lOOkc: 2500 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C: 10 16 * % Solids: U-2862 - 50 Meets Mil I 46058C Type UR ** Pencil Hardness U-2863*: Color: Amber Mix Ratio: One-part Specific Gravity @ 25C: 0.96 Viscosity @ 25C, cps: 60 Shore Hardness: B** Pot Life 50gm-hr. 25C: N/A Cure Time Hrs. @ 25C, 65C, IOOC: 12/----/---Tensile Strength @ 25C, psi: N/A Linear Shrinkage in/in: N/A Dielectric Constant @ 25C/lOOkc: 3.9 Dielectric Strength @ 25C/lOOkc: 3800 Dissipation Factor @ 25C/lOOkc: 0.038 Volume Resistivity @ 25C: 10 13 * % Solids: U-2863 - 30 ** Pencil Hardness
Coatings
CASTALL, INC.: Coatings Specially Designed for Electronic or General Applications (Continued): U-2864*: Color: Amber Mix Ratio: One-Dart Specific Gravity @ 25C: 1.01 Viscosity @ 25C, cps: 120 Shore Hardness: HB** Pot Life 50gm-hr. 25C: N/A Cure Time Hrs. @ 25C, 65C, 1OOC: 24/----/---Tensile Strength @ 25C, psi: N/A Linear Shrinkaae in/in: N/A Dielectric Constant'@ 25C)lOOkc: 3.0 Dielectric Strength @ 25C/lOOkc: 3500 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C: 10 15 * % Solids: u-2864: 50 ** Pencil Hardness
Meets MIL-I-46058C Type UR
275
276
Adhesives, Sealants and Coatings for the Electronics Indastry
CHOMERICS, INC.: CHO-SHIELD Coatings: Sprayable CHO-SHIELD conductive coatings offer a familiar, inexpensive method of EM1 shielding, anti-static protection, corona shielding, and surface grounding of electronic enclosures and components. To meet a full range of requirements, CHO-SHIELD coatings are oroduced as silver, nickel or nickel-silver blend formulations. While nickelifilled coatings are relatively inexpensive, they provide only moderate levels of EM1 shielding over a wide frequency range. Silver-filled systems are highly conductive, achieving 60-80 dB of EM1 shielding in the 30MHz to IGHz range, but at higher cost. 596: Binder: epoxy Filler: Ag Mix: 100:37 Consistency: medium fluid Specific Gravity (Density): 1.8?0.15 Suggested Spraying Viscosity #2 Zahn Cup: 19-26 sec. Maximum Surface Resistivity (ohm/sq.): 0.06 Use Temperature: -85 to 257F (-65 to 125C) Elevated Temperature Cure Cycle: 1.0 hr. @ 250F (121C) Room Temperature Cure: 1 wk. Working Life: 8 hrs. Shelf Life (mos.): 9 Coverage (sa. ft.): 50/lb. Recommended-Thickness iin.): 0.001 min. Long pot life. Highly conductive. Resists solvents, abrasion, high temperature and salt spray. 598:
Binder: epoxy Filler: Ag Mix: 1:l Consistency: medium fluid Specific Gravity (Density): 1.8kO.15 Suggested Spraying Viscosity #2 Zahn Cup: 19-26 sec. Maximum Surface Resistivity (ohm/sq.): 0.06 Use Temperature: -85 to 257F (-65 to 12513) Elevated Temperature Cure Cycle: 1.0 hr. @ 250F (121C) Room Temperature Cure: 1 wk. Working Life: 8 hrs. Shelf Life (mos.): 9 Coverage (sq. ft.): 50/lb. Recommended Thickness (in.): 0.001 min. Same as 596, with superior resistance to salt spray corrosion.
Coatings
277
CHOMERICS, INC.: CHO-SHIELD Coatings(Continued): 4076: Binder: polyurethane Filler: Ni Mix: l-part Consistencv: medium fluid Specific Gravity (Density): 1.8~0.20 (15 lbs./gal.) Maximum Surface Resistivity (ohmlsq.): 0.5 Use temperature: -65 to 185F (-54 to 85C) Room Temperature Cure: 24 hrs. Shelf Life (Mos.): 12 Coverage (sq. ft.): 200/gal. Recommended Thickness (in.): 0.002 min. Bonds well to plaster,.concrete, drywall, glass, wood, most metals. Exceptional room shielding. Quick air dry. No primer required. 4900:
Binder: acrylic Filler: Ag Mix: l-part Consistency: thin fluid Specific Gravity (Density): 1.5*0.15 Suggested Spraying Viscosity #2 Zahn Cup: 19-22 sec. Maximum Surface Resistivity (ohm/sq.): 0.05 Use Temperature: -85 to 257F (-65 to 125C) Room Temperature Cure: 24 hrs. Shelf Life (mos.): 9 (bulk)/6 (spray) Coverage (sq. ft.): 34/lb. Recommended Thickness (in.): 0.001 min. Highest EM1 shielding performance. Excellent for anti-static protection and grounding surfaces. Fast tack and dry. 4904:
Binder: acrylic Filler: Ni Mix: I-oart Consistency: heavy fluid Specific Gravity (Density): 1.4kO.2 (12 lbs./gal.) Suggested Spraying Viscosity #2 Zahn Cup: 19-22 sec. Maximum Surface Resistivity (ohm/sq.): 2.0 Use Temperature: -65 to 185F (-54 to 85C) Room Temperature Cure: 24 hrs. Shelf Life (mos.1: 9 Coverage (sq. ft;): 225/gal. Recommended Thickness (in.): 0.002 min. Lowest cost. Bonds to ABS, NORYL, polycarbonate, polystyrene, and polyester. Good anti-static protection. Fast tack and dry.
278
Adhesives, Sealants and Coatings for the Electronics Industry
CHOMERICS, INC.: CHO-SHIELD Coatings(Continued): 4914: Binder: acrylic Filler: Ni Mix: l-part Consistency: medium fluid Specific Gravity (Density): 1.7-i0.2 (14 lbs./gal.) Suggested Spraying Viscosity #2 Zahn Cup: 19-22 sec. Maximum Surface Resistivity (ohm/sq.): 2.0 Use Temperature: -65 to 185F (-54 to 85C) Room Temperature Cure: 24 hrs. Shelf Life (mos.): 9 Coverage (sq.ft.): 225/gal. Recommended Thickness (in.): 0.002 min. LOW cost. Bonds to ABS, NORYL and polyester. High solvent resistance. Fast tack and dry. (Not for use with polycarbonate or polystyrene). 4916:
No
Binder: acrylic Filler: Ni Mix: l-part Consistency: heavy fluid Specific Gravity (Density): 1.9tO.l (15 lbs./gal.) Suggested Spraying Viscosity #2 Zahn Cup: 19-22 sec. Maximum Surface Resistivity (ohm/sq.): 0.7 Use Temperature: -65 to 185F (-54 to 85C) Room Tempearture Cure: 24 hrs. Shelf Life (mos.): 12 Coverage (sq. ft.): 225/gal. Recommended Thickness (in.): 0.002 min. Bonds to ABS, NORYL, polystyrene, polycarbonate. Air drying. primer required.
4925:
Binder: acrylic Filler: Ag, Ni Mix: l-part Consistency: thin fluid Specific Gravity (Density): 1.13kO.l Suggested Spraying Viscosity #2 Zahn Cup: 25 sec. Maximum Surface Resistivity (ohm/sq.): 0.2 Use Temperature: -65 to 185F.(-54 to 85C) Elevated Temperature Cure Cycle: 0.5 hr. @ 150F (66C) Room Temperature Cure: 24 hrs. Shelf Life (mos.): 12 Coverage (sq. ft.): 210/gal. Recommended Thickness (in.): 0.001 min. Compatible with polycarbonate and ABS. Thin (1 mil) coverage provides excellent shielding at low cost. Modified formulation available for use on NORYL housings.
Coatings
279
CONAP, INC.: CONAP Dielectric Conformal Coatings for Electronics: CONAP CE-1132: Polyester Viscosity @ 25C (77F) cps: 700 Flashpoint, F (TCC): 55 % Solids Content: 32 Pot Life @ 25C: Indefinite Shelf Life @ 25C: 1 Year Tack Free Time @ 25C: 15 min. @ 50C Recommended Cure Schedule: 15 Min. @ 50C Plus 1 hr. @ 75C Cure Mechanism: Solvent Evap. Operating Temperature Range: -55C to 130C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (l/8" Bend Mandrel Test): Fails Chemical & Solvent Resistance: Fair Dielectric Strength, vpm: 6500 Dielectric Constant: 3.30 Dissipation Factor (1 MHZ @ 25C): .006 Insulation Resistance Ohms-Cm: Initial (25C, 50% R-H.): 2.5x10 13 During 10th day Cycling (65C, 95% R.H.): 2.0x10 10 Recovery 24 hrs. after 10 day Cycling: 5.7x10 10 CONATHANE CE-1163: Polyurethane Viscosity @ 25C (77F) cps: 200 Flashpoint, F (TCC): 55 % Solids Content: 50 Pot Life @ 25C: Indefinite Shelf Life @ 25C: 1 Year Tack Free Time @ 25C: 2 hr. Mix Ratio, Parts by Weight Part A/Part B: N.A. Recommended Cure Schedule at 25C/6OC: 7 days/4 hrs. Cure Mechanism: Moisture Cure Operating Temperature Range: -55C to 130C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (l/8" Bend Mandrel Test): Passes Chemical &-Solvent Resistance: Excellent Dielectric Strength, vpm: 3500 Dielectric Constant: 2.67 Dissioation Factor (I MHZ d 25Cl: .022 Insulation Resistance OhmslCm: Initial (25C-50% R-H.): 2.5x10 13 During 10th day Cycling (65C-95% R.H.): 1.0 X 10" Recovery 24 hrs. after 10 day cycling: 1.4x10 13
280
Adhesives, Sealants and Coatings for the Electronics Industry
CONAP, INC.: CONAP Dielectric Conformal Coatings for Electronics (Continued): CONATHANE CE-1164: Polyurethane Viscosity @ 25C (77F) cps: 150 Flashpoint, F (TCC): 55 % Solids Content: 50 Pot Life @ 25C: Indefinite Shelf Life @ 25C: 1 Year Tack Free Time @ 25C: 20-30 min. Recommended Cure Schedule at 25C/6OC: 7 days/l hrs. Cure Mechanism: Moisture Cure Operating Temperature Range: -55C to 13OC Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (l/8" Bend Mandrel Test): Passes Chemical &-Solvent Resistance: V. Good Dielectric Strength, vpm: 3500 Dielectric Constant: 2.70 Dissioation Factor (I MHZ a 25C): .020 Insulation Resistance ohmslcm: Initial (25C-50% R.H.): 2.5x10 13 During 10th day cycling (65C-95% R-H.): 1.3x10 10 Recovery 24 hrs. after 10 day Cycling: 4.5x10 12 CONAP CE-1170 : Acrylic Viscosity @ 25C (77F) cps: 400 Flashpoint, F (TCC): 55 % Solids Content: 30 Pot Life @ 25C: Indefinite Shelf Life @ 25C: 1 Year Tack Free Time @ 25C: IO-15 min. Recommended Cure Schedule at 25C/6OC: 24 hrs./l hr. Cure Mechanism: Solvent Evap. Operating Temperature Range: -55C to 130C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (118" Bend Mandrel Test): Passes Chemical & Solvent Resistance: Poor Dielectric Strength, vpm: 3000 Dielectric Constant: 3.20 Dissipation Factor (1 MHZ @ 25C): -020 Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 1.5x10 16 During 10th day Cycling (65C-95% R.H.): 2.5x10 12 Recovery 24 hrs. after IO day Cycling: 1.0x10 16
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CONAP, INC.: CONAP Dielectric Conformal Coatings for Electronics (Continued): CONAP CE-1171: Acrylic Viscosity @ 25C (77F) cps: 850 Flashpoint, F (TCC): 65 % Solids Content: 30 Pot Life @ 25C: Indefinite Shelf Life @ 25C: 1 Year Tack Free Time @ 25C: 20 min. Recommended Cure Schedule at 25C/6OC: 24 hrs./l hr. Cure Mechanism: Solvent Evap. Operating Temperature Range: -55C to 130C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (l/8" Bend Mandrel Test): Passes Chemical &-Solvent Resistance: Poor Dielectric Strength, vpm: 3000 Dielectric Constant: 3.15 Dissination Factor (I MHZ @ 25C): .OlO Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 1.5x10 16 During 10th day Cycling (65C - 95% R.H.): 2.5x10 12 Recovery 24 hrs. after 10 days Cycling: 1.0x10 16 CONATHANE CE-1175: Polyurethane Viscosity @ 25C (77F) cps: 1200 Flashpoint, F (TCC): >2bO % Solids Content: 32 Pot Life @ 25C: Indefinite Shelf Life @ 2X: 1 Year Tack Free Time @ 25C: l-2 hrs. Recommended Cure Schedule at 25C/6OC: 3-5 days @ 25C 3 hrs. @ 60C 1.5 hrs. @ 80C Cure Mechanism: Solvent Evap. Operating Temperature Range: -65C to 125C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (l/8" Bend Mandrel Test): Passes Chemical & Solvent Resistance: Good Dielectric Strength, vpm: >I000 Dielectric Constant: N.A. Dissipation Factor (1 MHZ @ 25C): N.A. Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 1.5x10 14 During 10th day Cycling (65C - 95% R.H.): 6.5x10 10 Recovery 24 hrs. after 10 day Cycling: 3.2x10 12
282
Adhesives, Sealants and Coatings for the Electronics Industry
CONAP, INC.: CONAP Dielectric Conformal Coatings for Electronics (Continued): CONAP CE-1181: Silicone Viscosity 8 25C (77F) cps: 1200 Flashpoint, F (TCC): 68 % Solids Content: 60 Pot Life 8 25C: Indefinite Shelf Life @ 25C: 6 Months Tack Free Time @ 25C: 10 Seconds Recommended Cure Schedule at 25C/6OC: 24 hrs. @ 25C Cure Mechanism: UV and/or CO2 Operating Temperature Range: -80C to 150C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (l/8" Bend Mandrel Test): Passes Chemical & Solvent Resistance: Good Dielectric Strength, vpm: 420 Dielectric Constant: 2.70 Dissipation Factor (1 MHZ 8 25C): .0003 Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 7.6x10 13 During 10th day Cycling (65C - 95% R.H.): 2.3x10 11 Recovery 24 hrs after 10 day Cycling: 6.2x10 13 CONATHANE CE-1155: Polyurethane Viscosity 8 25C (77F) cps: 75 Flashpoint, F (TCC): 55% Solids Content: 60 Pot Life @ 25C: 4-6 hr. Shelf Life @ 25C: 1 Year Tack Free Time I 25C: 4-5 hrs. Mix Ratio, Parts by Weight Part A/Part B: 100/70 Recommended Cure Schedule at 25C/6OC: 7 days/3 hrs. Cure Mechanism: Chemical Cure Operating Temperature Range: -55C to 130C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility: Passes Chemical & Solvent Resistance: Excellent Dielectric Strength, vpm: 3000 Dielectric Constant: 3.42 Dissipation Factor (1 MHZ 8 25C): .016 Insulation Resistance Ohms-Cm: Initial(25C - 50% R.H.): 2.5x10 13 During 10th day Cycling (65C - 95% R.H.): 6.1x10 10 Recovery 24 hrs. after 10th day Cycling: 6.0x10 12
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CONAP, INC.: CONAP Dielectric Conformal Coatings for Electronics (Continued): CONATHANE CE-1155-35: Polyurethane Viscosity @ 25C (77F) cps: 35 Flashpoint, F (TCC): 55 % Solids Content: 34 Pot Life @ 25C: E-10 hr. Shelf Life @ 25C: 1 Year Tack Free Time @ 25C: 4-5 hrs. Mix Ratio, Parts by Weight Part A/Part B: lOO/lOO Recommended Cure Schedule @ 25C/6OC: 5 days/3 hrs. Cure Mechanism: Chemical Cure Operating Temperature Range: -55 to 13OC Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibilitv (l/8" Bend Mandrel Test): Passes Chemical &-Solvent Resistance: Excellent Dielectric Strength, vpm: 3000 Dielectric Constant: 3.42 Dissiwation Factor (I MHZ @ 25C): -016 Insulation Resistance OhmslCm: Initial (25C - 50% R.H.): 2.5x10 13 During 10th day Cycling (65C - 95% R.H.): 6.1x10 10 Recovery 24 hrs. after 10 day Cycling: 6.0x10 12 CONATHANE CE-1165: Polyurethane Viscosity @ 25C (77F) cps: 100 Flashpoint, F (TCC): 65% Solids Content: 58 Pot Life @ 25C: 6-7 hr. Shelf Life @ 25C: 1 Year Mix Ratio, Parts by Weight Part A/Part B: 100/37 Recommended Cure Schedule at 25C/6OC: 7 days/5 hrs. Cure Machanism: Chemical Cure Operating Temperature Range: -55C to 13OC Thermal Shock Test: Passes Funsus Resistance: Non Nutrient Flexibility (118” Bend Mandrel Test): Passes Chemical & Shock Resistance: Excellent Dielectric Strength, vpm: 3000 Dielectric Constant: 3.10 Dissipation Factor (1 MHZ @ '25C): .020 Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 2.8x10 15 During 10th day Cycling (65C - 95% R.H.): 1.4x10" Recovery 24 hrs. after 10 day Cycling: 4.4x10 13
284
Adhesives, Sealants and Coatings for the Electronics Industry
DOCK RESINS CORP.: Conformal Coatings: L91-1: Acrylic, Thermoplastic % NV: 51 Solvents: Toluol General purpose acrylic solution; used in textile edge binding; conformal coating removable for repairs; nitrocellulose compatible; seals roofing tiles. L91-17: Acrylic, Thermoplastic % NV: 40 Solvents: Methyl ethyl ketone Hard resistant film; blended with VYHH to coat vinyls; conformal coating removable for repairs; used to coat backside of tracing film TA22-27: Acrylic, Thermosetting % NV: 38 Solvents: Isopropanol, Methyl ethyl ketone Low crosslink density, low temperature curing, self-crosslinking vehicle; solvent cleanable and-or removable conformal coating
Coatings
285
DYMAX CORP.: DYMAX Engineering Adhesives: MULTI-CURE 984-LVF UF Curing Conformal Coating: MULTI-CURE 984-LVF is a single component, 100% solids conformal coating specifically formulated for rapid room temperature cure when exposed to long wave (320-380 nanometer) UV light. Thin layer coatings cure almost instantly to a depth of 7 mils and fluoresce intensely upon exposure to "black" light. MULTI-CURE 984-LVF exhibits excellent adhesion to a variety of metal, ceramic and glass-filled epoxy surfaces. It is a moderately low viscosity coating which can be cured by exposure to UV light and secondarily with heat for shadowed areas on densely populated circuit boards. MULTI-CURE 984-LVF passes the on part UV-94V-0 test and is Mil Spec approved to Mil 46058-C (QPL#356-88). Properties: Appearance: Single Component Clear Liquid (Solventless) Soecific Gravitv: 1.05 Nominal Viscosity: 150 cps Dielectric Constant: 3.4 (23C, IMHZ) Dissipation Factor: 0.03 (23C, IHMZ) Dielectric Strength: 1800 Volts/Mil Volume Resistivity: 3.58 x 10 13 ohm-cm Surface Resistivity: 3.84 x 10 14 ohm-cm Shore D Hardness: 80 Elongation: 10% Cross Hatch Adhesion: Copper: 100% G-10: 100% Coefficient of Linear Thermal Expansion: 6.9 x 10 -5 in/in/C Pot life: 12 Months Cure Schedule: with 365 nm UV light: 100 milliwatts/cm 2 Intensity: 30 seconds 300 milliwatts/cm 2 Intensity: 5 seconds Application Method: Dip, Curtain, Coat or Spray Water Absorption: .06% Factors Affecting Curing: Dark surfaces lengthen cure time. Full range (UV-A, B & C) lamps provide faster cures than filtered sources. All UV sources degrade with use. Check output periodically with a radiometer. Thicker films require longer cure times. Light intensity decreases as distance from UV source increases. Method of application and topography of PCB may require secondary cure mechanism for shadow areas.
286
Adhesives, Sealants and Coatings for the Electronics Industry
ELECTRO-SCIENCE LABORATORIES, INC.: High Temperature, PolyimideBased Coatings Conductive Gold and Silver Compositions: #A-25, #I-30, #A-25-G, #A-25_SD/Insulating Composition, #A-25-1: These silver, gold or mineral-filled polymeric adhesives have much higher service temperatures than most conductive organics and effectively bridge part of the temperature gap between ordinary epoxies and inorganic materials. #A-25: Filler: Ag Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohms/sq: .05 max. #I-30: Filler: Ag Rheology: Thixotropic Service Temperature, C: continuous: 300-350 intermittent: 400-450 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohms/sq: .05 max. #A-25-1: Filler: Mineral Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): 10 11 Sheet Resistivity ohmsjsq: Insulator
10
#A-25-G: Filler: Au Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohmsfsq: -03 max. #A-25-SD: Filler: Ag Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohms/sq: .05 max.
12 min.
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287
ELECTRO-SCIENCE LABORATORIES, INC.: Polymer Dielectric Coatings #500 Resin-Based Thick Film: ESL #500 is a white low temperature curing, filled thermoplastic dielectric thick film paste designed for application by screen printing. Its low curing temperature and flexibility allow #500 to be used on paper, low softening temperature plastics, plastic films and printed circuit board materials as well as ceramic and glass substrates. Printing and Curing: #500 may be screen printed using standard microcircuit thick film printers with 200 to 325 mesh stainless steel screens and a 38 micron (1.5 mil) emulsion thickness. Applications: ESL #500 may be used to make crossovers and double conductor level printed wiring in conjunction with ESL #1111-S, #1112-S or #1112-S-45 silver conductive paste. Multiple or thicker prints of #500 are also used as a spacer in membrane switches. #500 can be used as a protective coating over ESL polymer resistor and conductor systems. In conjunction with polymer conductors, low value capacitors can be constructed. Typical Properties: Viscosity, Kcps: 50+-IO Shelf Life, OC: 6 mos. Thinner: ESL #422 Cure: 125C, 30 min. or 6OC, 1 hr. Dielectric Constant, 1K Hz: 8-9 Dissipation factor, 1K Hz: 0.10% Breakdown voltage, volts/25 microns: 500 Insulation resistance, ohms: 2 x IO 10 Color: White Substrates: Paper, low temperature resistance plastics, polyimide (Kapton) and polyester (Mylar) films, printed circuit board materials, glass, ceramics.
288
Adhesives, Sealants and Coatings for the Electronics Industry
ELECTRO-SCIENCE LABORATORIES, 242-S, 242~SB, 242-D:
INC.: Polymer Protective Coatings
Better protection with lower curing temperatures ESL #242-S is a screen printable, yellow, mineral-filled epoxy coating which is extremely solvent resistant even with harsh solvents and under high pressure when sufficiently cured. It is thermosetting, and curing in 10 to 30 minutes at 150C is possible although solvent resistance improves with longer curing times. Lower temperature cures are possible. This coating can be used to protect cermet circuits on alumina or porcelain enameled steel. It can also be used as a crossover or multilayer dielectric for additive polymer thick film circuits. It is compatible with ESL thermosetting polymer silvers such as 1109-S, 1110-S, etc., on PC boards. Due to its mineral filler, it is not recommended for repeated flexing actions or plastic film substrates. ESL #242-SB is the blue version, and ESL #242-D is the spraying/dipping (low viscosity) grade. Filled epoxy systems: For screening - 242-S (yellow), 242-SB (blue) For dipping - 242-D (yellow only) Screen: 200 mesh, 1.2 mil emulsion For cleaning screen, use Cellosolve Acetate or BCA followed by acetone. Thinner: 242-S, 242-SB: #402 thinner or butyl carbitol acetate 242-D: #421 thinner or cellosolve acetate Substrates: Alumina, porcelain steel, mylar, KAPTON #242-S: Viscosity, 25.5-26C: 85+-15 kcps Drying: 125C, 10 min. Curing schedules: 125C, 1 hr. or 15OC, 30 min. Dielectric constant K, 1 kHz: 8-12 #242-SB: Viscosity, 25.5-26C: 85+-15 kcps Drying: 125C, 10 min. Curing schedules: 125C, 1 hr. or 15OC, 30 min. Dielectric constant K, 1 kHz: 8-12 #242-D: Viscosity, 25.5-26C: 2+-0.5 kcps Drying: 125C, 10 min. Curing schedules: 125C, 30 min. or 15OC, 20 min. Dielectric constant K, 1 kHz: 8-12
Coatings
289
ELECTRO-SCIENCE LABORATORIES, INC.: Polymer Resistive Coatings #RS-15100, #RS-15100P, #RS-16000, #RS-16100 Series: ESL #RS-15100 and #RS-15100P resistor systems are thermosetting resin compounds which supplement the #RS-15000 Resistor Series. #RS-16000 and #RS-16100 are thermoplastic polymer systems. All except the #RS-16000 Series are applied by screen printing and produce carbon-based resistors with stability and tolerances suitable for many electronic applications. By proper choice among these series, any of a variety of substrates may be used including phenolic, glass-epoxy and other printed circuit board materials, ceramic, glass, paper and flexible plastic films such as polyester, polyimide and various lower softening temperature plastics. #RS-15100: Viscosity, cps: 70+-10K Shelf Life, OC: 6 mos. Resistivity Ranges, ohmslsq.: 100: RS-15112 IK: RS-15113 10K: RS-15114 100K: RS-15115 1M: RS-15116 #RS-15100P: Viscosity, cps: 70+-10K Shelf Life, OC: 6 mos. Resistivity Ranges, ohmsfsq.: 100: RS-15112P 1K: RS-15113P IOK: RS-15114P IOOK: RS-15115P IM: RS-15116P #RS-16000: Viscosity, cps: 1750+-500 Shelf Life, OC: 6 mos. Resistivity Ranges, ohmslsq.: 1K: RS-16013 1OK: RS-16014 #RS-16100: Viscosity, cps: 225+-50K Shelf Life, OC: 6 mos. Resistivity Ranges, ohmsjsq.: 10: RS-16111 100: RS-16112 IK: RS-16113 IOK: RS-16114 1OOK: RS-16115 IM: RS-16116 1OM: RS-16117
290
Adhesives, Sealants and Coatings for the Electronics Industry
ELECTRO-SCIENCE LABORATORIES, INC.: Protective Coating #22H: Room Temperature, Aircure: Properties of #22H Polyurethane Type Films: Color: Transparent Build-up: (one-dip): l-2 mils Adhesion: Excellent to epoxy, phenolic metal, glass and ceramic substrates. Flexibility: Passes l/8" mandrel test Service Temperature: -55C to +15OC, continuous; up to 180C intermittent Temperature Shock: Passes ten cycles (15 min. each) -70C to c15oc Water Immersion: (48 Hrs.): No weight gain. Volume Resistivity 25C: 8 x 10 12 ohm-cm No change after one week exposure to 100% R.H. 80C Solvent Resistance: (1 hr immersion) Not affected by alcohols and chlorinated solvents. Characteristics of #22H as a Liquid Coating: Specific weight: 0.930 Viscosity: 28 ctp. Solids: 25% Shelf Life: 6 months Coverage (one dip): 350-450 sq. ft. per gal. Solvent: xylene Drying Time: (25C): Tack Free: IO-20 min. Thru Dry: 1 l/2 hrs. Hard: 3 hrs. Description: ELECTRO-SCIENCE's #22H protective coating has an exceptional combination of characteristics which make it ideal for many electronic uses. Features include: Easy application--spray or brush not for printing Fast air dry Protects metal surfaces from oxidation. Can be soldered through Continuous service temperature -55C to +15OC. Excellent adhesion to most surfaces. High flexibility Chemical resistance against flux removal solvents. Cures by absorption of water vapor from the atmosphere. These characteristics make #22H especially suitable for the protection of printed circuit boards. Numerous other applications, such as in process protection of solderable surfaces in the manufacture of electronic components or protection of component markings on the printed circuit board, will be found by the development engineer.
Coatings
291
ELECTRO-SCIENCE LABORATORIES, INC.: Protective Coatings #55H-D and #55H-S: High Temperature Application: #55H-D: Resin Tvne: Modified Imide Polvmer Solids Content: 15 to 20% _ Viscosity (25C): 8000 to 12000 cps. Adhesion- Good adhesion to all nblar surfaces like Glasses, Metals, Ceramics _ Service Temp.: -200C to c25OC continuous Weight loss at +25OC less than 1% (1000 hrs.) Cure: (Min. Time): 150C--over night (16 hrs.) (After initial pre-dry) or 2OOC--20 min. or 3OOC-- 5 min. Shelf Stability: 3-6 months (Closed container, refrigerated) Weight per Gallon: 8.5 lbs. Dielectric Strength: 3000V/mil dry Dielectric Constant: 3.6 to 4 (1 megacycle) Dissipation Factor: .003 (1 megacycle) #55H-S: Resin Type: Modified Amide Polymer Solids Content: 30 to 35% Viscosity (25C): 450 to 550 cps. Service Temp.: -80C to +22OC continuous Cure: (Min. Time) (After initial pre-dry): 4 hrs. at +2OOC or, 1 hr. at +25OC Shelf Stability: 3-6 months (Closed container, refrigerated) Weight per Gallon: 8.8 lbs. Dielectric Strength: 4000V/mil dry Dielectric Constant: 3.4 to 3.6 Dissipation Factor: .017 Description: Due to their very stable structure, ESL's #55H-D and #55H-S are useful over a very wide temperature span. #55H-D can be used at temperatures of 300C for limited periods of time. No embrittlement at low temperatures, combined with exceptional oxidation resistance, yield coating materials useful for the most stringent applications. While these characteristics have been optimized in #55H-D, #55H-S has somewhat better adhesion to glass surfaces, and also good for impregnation applications while giving almost equally good characteristics. Both have excellent resistance to solvent attack and moisture penetration. These coatings have been used successfully for the protection of various electronic components against corrosion, heat and cold shock, moisture, etc.
292
Adhesives, Sealants and Coatings for the Electronics Industry
ELECTRO-SCIENCE LABORATORIES,
INC.: Protective Coating #240-SB:
A screen printable, resin type mineral filled silicone protects thick film resistors, capacitors, and circuits ELECTRO-SCIENCE's #240-SB is a filled, modified silicone coating, specifically formulated for screen printing. It is useful as a protective coating for thick film conductors, resistors and capacitors on ceramic, porcelain enameled steel and printed circuit board substrates. It helps to prevent the effects of corrosion, moisture, oxidation, abrasion, and thermal shock. Polymer thick film systems may utilize #240-SB as a dielectric. It is thermosetting and cures by cross linking. No chemicals that are corrosive or harmful to electronic components are in this material. Standard #240-SB has an opaque blue color. It is also available in black, white, red, orange, yellow and green. Three rheologies are available for the standard blue and black colors: 1. Normal printing grade. 2. Fine line (for solder stop-offs, multilayer uses, etc.). 3. Low viscosity (for high speed printing). Typical Properties: Colors (opaque): Standard blue, black, white, red, orange, yellow and green Surface: Semigloss Viscosity: Kcps @ 25-26C #240-SB standard & colors: 150+-25 Fine line version: 225+-25 Low viscosity version: 80+-15 Adhesion: All ceramic substrates, plastic PC boards and porcelain enameled steel. Curing Temperature C: 150-200 Service Temperature C: -100 to t150 Breakdown Voltage: Greater than 500 volts/mil Dielectric Constant: 6 to 8 @ 1 KHz Dissipation Factor: Less than 0.1% Volume Resistivity: ohms/cm: Greater than 10 10 Insulation Resistance: at 500 V (ohms): Greater than IO 10 at 1000 V (ohms): Greater than 10 10 Solvent Resistance: When properly cured, #240-SB is resistant to most solvents. It may be softened by acetone or methylene chloride. When tested for solvent absorption after a 2 minute ultrasonic immersion in trichloroethylene, #240-SB will increase in weight by less than 3%.
Coatings
FURANE PRODUCTS: Conformal Coatings: ACRYLANE 5730 Acrylic Conformal Coating: Features/Benefits: * One component, no mixing required * Quick drying * Easy repairability * Mil-I-46058 REV C Type AR approved ACRYLANE 5731 Acrylic Conformal Coating: Features/Benefits: * One component. no mixins_ reauired _ * Quick drying * Easy repairability * Sprayable EPOCAST 8122-A/B Epoxy Circuit Board Coating: * Flexible - * 100% Solids * Long Pot Life SILFLEX SP6200 A/B Clear (RTV) Silicone Potting System: Benefits/Features: * Clear, repairable * Reversion resistant * Convenient ratio URALANE 5750-A/B (LV) Urethane Conformal Coating: Benefits/Features: * Low modulus * Repairable * Low outgassing * MIL-I-46058C, Type UR approved URALANE 5751-A/B Urethane Conformal Coating: Features/Benefits: * Low modulus * Easv reoairabilitv * Low-outgassing _ * MIL-I-46058C, Type UR approved URALANE 5780 Urethane Conformal Coating: Benefits/Features: * One component * Contains no TDI or MOCA * Room temperature cure * Meets rule 66 "SCQAMD"
293
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Adhesives, Sealants and Coatings for the Electronics Industry
GC ELECTRONICS: Coatings: Silver Print (Conductive Paint): For PC repair or add-on circuit traces. Pure silver in lacquer based carrier may be brushed on for either conductors or shielding. Connections have equal or better conductivity than copper (0.1 ohms per square). Nickel Print (Conductive Paint): A quick drying lacquer-based coating, oigmented with powdered nickel. For repair and modification of printed circuits. Conductivity is 5 to 6 ohms per square. Red GLPT Insulating Varnish: Alkyd-based compound, especially resistant to environmental extremes includins oils, water and most acids and alkalis. Retains its high dielectric strength even if wet and is, therefore, especially adaptable to the insulation of electrical and electronic devices or components which may be operated in a very humid climate and up to 250F (121C). For general insulation of coils, transformers, motor windings and for all-around protection against oxidation and atmospheric attacks. PRINT KOTE Conformal Coating: The ultimate coating for PC boards . ..provides a protective shield to resist environmental contaminants. Prevents arcing and shorting. Air dry 15 to 30 minutes. May be baked at 200C for 30-60 minutes for extreme high temperature applications. CONKOAT - Conformal Coating: UV Traceable This is a tough, clear coating for the protection of PC boards and components; prevents exposure to moisture, contaminants in air, etc. UV Tracer permits easy visual inspection; any non-coated area will not fluoresce under W light and stands out very noticeably. Features: * Superior moisture resistance * Meets the rigid MIL-I-46058C specification. * Excellent adhesion, even to Teflon. * Solvent repairable. * Transoarent. * Silicone resin base, excellent dielectric properties. * Tack free 2-3 hours, full cure - 24 hours (may be heated to accelerate: 20-30 min. at 125C. degrees). _ Physical Properties: Durometer, Shore A: 60 Tensile, PSI: 220 Elongation, %: 200 Coefficient of Thermal Expansion cm/cm, C: 230 x 10 -6 Electrical Properties: Dielectric strensth. volts/nil: 560 Dielectric constant'(l0 5 Hz): 2.54 Dissipation factor, (10 5 Hz): Tan.002 Volume Resistivity, ohm/cm: 3.5 x 10 16
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295
GC ELECTRONICS: Coatings (Continued): RED-X Corona Dope: Thixotropic polyester-base red enamel that will not drip or sag, has excellent adhesion and is oil and waterproof. Temperature range: to 220F (IO&). An excellent inSulatOr and corona and spark preventive coating. For moisture-proofing and insulation of high voltage coils and other high voltage components, especially in high humidity problem areas. Also recommended for rotor and field coils in motors, to coat transformers, etc. Q DOPE: Solution of pure polystyrene in solvents. Dries fast and leaves a clear, protective coating on coils and transformers, with no or minimal effect on inductive values. May also be used as a cement for molded or fabricated items made of polystyrene. Liquid Tape: Heavy-bodied, black insulating coating which replaces insulating tape in applications where wrap-around tape could not readily be applied. This compound dries quickly to a strong pliable finish that will not crack, peel or chip. It is water and oil proof and may be used outdoors to insulate any electrical terminal, connection or wire splice. Excellent for providing insulation on handles? etc. Acrylic Plastic: Transparent (glass-like) lacquer. Seals, protects, insulates and tarnish-proofs any object to which it is applied. This coating has high dielectric strength and resists moisture, caustic solutions and alcohols. Used to coat electronic components and connections as well as metal or art objects (to protect against tarnish and corrosion). Meets Fed. Spec. TT-L-50-G Type II Corona Dope: Quick drying, black lacquer insulating coating based on cellulose resin. This lacquer has excellent dielectric, arc and corona resisting properties, and protects surfaces against moisture. Temperature range: to 325F (163C). This lacquer is used to coat flybacks, coils, transformers to improve the insulation and weather resistant properties of wires. EMI-RF1 SHIELD: An effective method for protecting circuitry from external interference or for keeping low level signals inside circuit housing. An extremely conductive graphite coating in a tough binder that requires no undercoat. Adheres well to most plastics and also glass. May be applied.in more than one coat for severe interference problems. Sheet resistance of properly-applied SHIELD is approximately 7.5 ohms/square @ 1 mil. Point-to-point 10 ohms @ 1 inch spacing @ 1 mil. Maximum service temperature 180F. Shielding ability may vary with your particular application but generally ranges from 35-50 dR at 2 mils in conventionally-used RF devices. Full R.F. spectrum tests have not been conducted and may be different in your application.
296
Adhesives, Sealants and Coatings for the Electronics Industry
GC ELECTRONICS: Coatings (Continued): INSUL-VOLT: Base: Phenolic Resin Varnish Color: Black Flashpoint: 25F O.C. (Extremely Flammable) Specific Gravity: 1.05 Curing/Drying Time: 3-5 Hrs. Useful Temp. Range: To 105C (220F) STATIC HALT: Base: H20 & Proprietary Ingredients Color: Clear Flashpoint: None Specific Gravity: 0.98 Curing/Drying Time: 10 Mins. Q-DOPE: Base: Polystyrene in Aromatic Hydrocarbon Solvents Color: Clear Flashpoint: 45F Specific Gravity: 0.98 CurinsfDrvins Time: 30-60 Mins. Viscosity- WIX Gardner Scale CP @ 25C Useful Temp. Range: -65C to +71C (-70F to +160F) Suggested Solvent: GC #IO-4102 CORONA DOPE: Base: Cellulose Comuound Color: Black Flashpoint: -lC (30F) O.C. Specific Gravity: 0.90 Curing/Drying Time: 30-60 Mins. Viscosity: 220 cp @ 25C Useful Temp. Range: Up to 340F Suggested Solvent: GC #lo-312 Series or Lacquer Thinner EMI-RF1 SHIELD: Base: Lacquer & Graphite Color: Dark Grey Flash Point: -4C (2.5F) O.C. Specific Gravity:‘0.89. Curing/Drying Time: 3-9 Mins. Viscosity- 015-0.7 Brookfield @ 25C Useful Temp. Range: Max. 197F Constant Suggested Solvent: GC #lo-312 Series or Lacquer Thinner
Coatings
GC ELECTRONICS: Coatings (Continued): RED-X Corona Dope: Base: Thixotropic Polyester Enamel Color: Red Flashpoint: IOC (50F) O.C. Specific Gravity: 1.12 Curing/Drying Time: 2 Hrs. Viscosity: 6,000-10,000 (Brookfield) Useful Temp. Range: To 105C (220F) Suggested Solvent: GC #IO-6702 Naphtha or Xylol RED GLPT Insulating Varnish: Base: Alkyd Resin-Based Enamel Color: Red Flashpoint: 27C (8lF) C.C. Specific Gravity: 1.1 Curing/Drying Time: Dry to Touch 30 Min. Hard Dry 4-8 hrs. @ 77F Viscosity: #4 Ford Cup 65-85 Sec. @ 25C Useful Temp. Range: Up to 260F Suggested Solvent: Xylene LI:QUID TAPE: Base: Synthetic Resin in Solvent Color: Black Flashpoint: 7C (45F) C.C. Specific Gravity: 0.90 Curing/Drying Time: 12 Min. Tack Free Viscosity: 2000-3000 cp @ 25C Useful Temp. Range: 2 to 66C Suggested Solvent: GC #22-209 Acrylic Plastic: Base: Polymeric Acrylic Type Ester Color: Clear Flashooint: 4C (39F1 C.C. Specific Gravity: 1.0 Curing/Drying Time: Tack Free 10 Mins. Viscosity: 250 cp @ 25C Useful Temp. Range: To 19OC (375F) Suggested Solvent: GC #lo-4182 HIGH VOLTAGE PUTTY: Base: Silicone Rubber Compounds Color: Off White Flashpoint: None Specific Gravity: 1.13 Useful Temp. Range: 4 to 85C
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Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: Silicone Conformal Coatings: ECC 440, ECC 443, ECC 450, ECC 453, SR 900: GE Silicones offers a choice of silicone conformal coatings designed to meet performance requirements of specific packages. These reliable conformal coatings are compatible with standard production equipment. Key Performance Properties: * Solventless or solvent-borne * Primerless adhesion * Heat-cure or room-temperature processing * Fast thermal cures increase productivity * MIL-I-46058C, type SR, QPL status * IPC CC-830A conformance * Dip, spray or flow-coat application ECC 440, ECC 443, ECC 450, ECC 453: A solventless conformal coating system specifically designed to provide atmospheric protection and preserve the dielectric integrity of extremely sensitive circuit assemblies. These silicone conformal coatings are blendable to adjust viscosity. Temperature range: -75 to 400F (-60 to 204C). * ECC 440 and 450 conformal coatings are clear * ECC 443 and 453 conformal coatings are black All products can be used separately, or blended together to achieve optimum coating viscosity and performance. SR 900: Easy-to-use, one-part coating with UV tracer to facilitate QC inspection. This product protects delicate components from environmental stress, contamination, humidity and moisture. Offers primerless adhesion to most printed circuit board substrates coupled with solvent removability and repairability. SR 900 silicone conformal coating withstands temperatures from -75 to 400F (-60 to 204C).
Coatings
GE SILICONES: Conformal (Continued): ECC 440: Fast Cure Solventless Typical Properties: Color: Clear Cure Conditions: Heat Silicone Content, %: 100 Viscosity, cps (0 25C, 77F): 3500 Specific Gravity: 1.02 Hardness, Shore A Durometer: 20 Tensile Strength, psi (kg/cm 2): 175 (12) Elongation, %: 150 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) ECC 443: Fast Cure Solventless Typical Properties: Color: Black Cure Conditions: Heat Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 3500 Specific Gravity: 1.03 Hardness, Shore A Durometer: 20 Tensile Strength, psi (kg/cm 2): 175 (12) Elongation, 8: 150 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) ECC 450: Fast Cure Solventless Typical Properties: Color: Clear Cure Conditions: Heat Silicone Content, 8: 100 Viscosity, cps (@ 25C, 77F):,40,000 Specific Gravity: 1.02 Hardness, Shore A Durometer: 25 Tensile Strength, psi (kg/cm 2): 300 (21) Elongation, 8: 200 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)
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GE SILICONES: Conformal Coatings (Continued): ECC 453: Fast Cure Solventless Typical Properties: Color: Black Cure Conditions: Heat Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 40,000 Specific Gravity: 1.03 Hardness, Shore A Durometer: 25 Tensile Strength, psi (kg/cm 2): 300 (21) Elongation, %: 200 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) SR 900: Solvent Repairable Typical Properties: Color: Clear Cure Conditions: RT/Heat Silicone Content, %: 50 Solvent Type: Toluene Viscosity, cps (@ 25C, 77F): 500 Specific Gravity: 0.97 Hardness, Shore A Durometer: 60 Tensile Strength, psi (kg/cm 2): 220 (15) Elongation, %: 200 Dielectric Strength, volts/mil (kV/mm): 560 (22.0) Dielectric Constant (1000 Hz): 2.5 Dissipation Factor (1000 Hz): 0.002 Volume Resistivity, ohm-cm: 3.5 x 10 16 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)
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MAGNOLIA PLASTICS, INC.: MAGNOLIA 3900 & 3901 and MAGNOLIA 3900 & 3901 uv: MAGNOLIA 3900 is a solvent-containing epoxy resin SySteItI designed for coating circuit boards, providing electrical insulation and environmental protection to 8X. This system will cure at room temperature and may be applied by brush, dip or spray techniques. MAGNOLIA 3901 is a more fluid system differing from 3900 only in solids content. It is easier to spray, produces a thinner film and has a different mix ratio. Special Features: MAGNOLIA 3900 and 3901 provide a long pot life, low viscosity system which can be consistently applied in film thicknesses of 3 mils with conventional spray equipment. This semi-rigid coating resists chipping and cracking while exhibiting superior adhesion to most substrates. Excellent humidity resistance and solvent resistance make these systems ideal for providing environmental protection to electronic hardware. Merely one application of this coating will prevent shorting and other contamination. Special versions of 3900 and 3901 are available containing an ultra violet light sensitive agent for inspection of cured boards. This agent will settle to the bottom of the container and must be thoroughly stirred in prior to use. The products containing this agent are called 3900 UV and 3901 UV. All other properties and handling characteristics are identical to 3900 and 3901. Typical Physical Properties: 3900 & 3900 uv: Mix specific gravity: 1.0 Mix viscosity (Ford Cup #4): 30 to 50 seconds Solids content (% by weight): 62 to 65 Coverage (3 mil cured film): 330 sq ft/gal (approx) Color: Clear (very light amber) Pot Life: 8 hrs., approx. Hardness, Pencil: 2 H Tensile Strength, psi: 5,000 Tensile Elongation (%): 8 Mix Ratio (parts by weight or by volume): Part A: I parts Part B: 3 ,oarts 3901 & 3901 uv: Mix specific gravity: 1.0 Mix viscosity (Ford Cup #4): 10 to 20 seconds Solids content (% by weight)': 30 to 35 Coverage (3 mil cured film): 165 Color: Clear Pot Life: 12 hrs., approx. Hardness, Pencil: 2 H Tensile Strength, psi: 5,000 Tensile Elongation (%): 8 Mix Ratio (parts by weight or by volume): Part A: 9 parts Part B: 4 parts
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MAVIDON CORP.: Coatings: MAVIDON LS 315 Conformal Coating: MAVIDON LS 315 is a one component, solvent base, air dry acrylic conformal coating specifically formulated as a printed circuit board coating. Product Specification: Solids Content: 35% Viscosity at 25C: 450 cps Weight per gallon: 7.6 pounds Flash point: 30F Shelf Life (unopened): 12 months Cure Schedule: Tack free in 15 minutes at room temperature. Totally cured 24 hours at room temperature. Typical Cure Properties: Volume Resistivity: 2.6 x 10 14 ohm-cm Dielectric Constant (1 MHz): 2.5 Dissipation Factor (i MHz); 0.012 Dielectric Strength: 8000 volts/mil Thermal Conductivity: 5x10 -4 Cal/cm/set cm 2 C Coefficient of Thermal Expansion: 82 ppm/C Hardness: 40 Shore A Operating Range: -55C to +13OC Moisture Resistance: 4 x 70 10 ohm Insulation Resistance: 3 x 10 14 ohm T 720 Conformal Coating: MAVIDON T 720 is a one component, solvent base, moisture cure urethane specifically formulated as a printed circuit board. MAVIDON T 720 meets or exceeds all requirements of Mil-I-46058C, Type PUR. Product Specification: Solids Content: 50% Viscosity at 25C (77F): 300 cps Density (Lb/gal): 8.55 lbs. Flash Point: 80F Shelf Life (unopened) @ 25C (77F): 12 months Cure Schedule: Tack free in 1 hour at room temperature. Totally cured 7 days at room temperature.
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303
MAVIDON CORP.: Coatings (Continued): T-720 Conformal Coating (Continued): Typical Cure Properties: Volume Resistivity: 2.6 x 10 14 ohm-cm Dielectric Constant (120Hz): 4.4 Dissipation Factor (120 Hz): 0.012 Dielectric Strength: 800 volts/mil Thermal Conductivity: 5x10 -4 Callcmlsec cm 2 C Coefficient of Thermal Expansion: 82 ppm/C Hardness: 40 Shore A MAVIDON T 721 Conformal Coating: MAVIDON T 721 is a one component, moisture cure, urethane printed circuit board coating. MAVIDON T 721 has been formulated to provide flexibility, abrasion resistance, chemical and corrosion resistance. Product Specifications: Solids Content: 40% Viscosity at 25C (77F): 150 cps Density (Lb/gal): 8.0 lbs. Flash Point: 80F Shelf Life (unopened) @ 25C (77F): 1 year Cure Schedule: Tack free in 3 hours at room temperature. Totally cured 7 days at room temperature. Cure times may be shortened to 20 minutes by heating to 120F at 65% relative humidity. Typical Cure Properties: Volume Resistivity: 2.6 x 10 14 ohm-cm Dielectric Constant (120 Hz): 4.4 Dissioation Factor (120 Hz): 0.012 Dielectric Strength: 800 volts/mil Tensile Strength: 3500 psi Elongation: 150%
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MAVIDON CORP.: Coatings (Continued): T-742 Conformal Coating: MAVIDON T-742 is a one component urethane conformal coating that cures at room temperature. (T-742 is not dependent upon ambient moisture). Applications include wire and printed circuit board coatings. Product Specifications: Solids Content: 35% Viscosity @ 25C (77F): 250 cps Density (Lb/gal): 8.8 Flash Point: 45F Shelf Life (unopened) 25C (77F): 6 months Cure Rate: After application, T-742 will be tack-free within 20 minutes at room temperature. Full cure in 24 hours. Typical Cured Characteristics: Tensile Strength: 4000 psi Dielectric Strength: 400 volts per mil Dielectric Constant: (10 2 Hz) 4.16 Dissipation Factor: (10 2 Hz) .OlO Volume Resistivity: (ohm-cm): 2.07 x 10 13 T-743 Conformal Coating: FAVIDON T 743 is a one component urethane conformal coating that cures at room temperature. (T-743 is not dependent upon ambient moisture). Applications include wire and printed circuit board coatings. Product Specifications: Solids Content: 35% Viscosity @ 25C (77F): 250 cps Density (Lb/gal): 8.1 Flash Point: IllF Shelf Life (unopened) @ 25C (77F): 6 months Cure Rate: After application, T 743 will be tack-free within 30 minutes at room temperature. Full cure in 24 hours. rpical Cured Characteristics: Tensile Strength: 4000 psi Dielectric Strength: 400 volts per mil Dielectric Constant: (IO 2 Hz) 4.16 Dissipation Factor: (10 2 Hz) .OlO Volume Resistivity: 2.07 x 10 13 Thermal Conductivity: 5 x 10 -4 Cal/cm/set cm 2 C Coef. of Thermal Expansion: 70 ppm/C Hardness: 75 Shore A
Coatings
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MAVIDON CORP.: Coatings (Continued): 1110 Encapsulating Compound: MAVIDON System 1110 is a two component, green epoxy casting compound featuring low viscosity, rapid cure rate and excellent flexibility. MAVIDON 1110 has good thermal stability. Physical Characteristics: 1110-A: Appearance: Green Liquid Viscosity @ 25C (77F): 1,750 cps Density: 8.8 Shelf Life @ 25C (77F): 1 year 1110-B:
Appearance: Amber Liquid Viscosity @ 25C (77F): 3,000 cps Density: 8.0 Shelf Life @ 25C (77F): 1 year Mix Ratio: 100 parts 1110 A to 90 parts 1110 B by weight. 1 part 1110 A to 1 part 1110 B by volume. Pot Life: 25 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: 1 hour at room temperature for handling strength, overnight for full cure. rpical Cured Characteristics: Hardness: 15 Shore D Volume Resistivity (ohm-cm): 2 x 14 Thermal Coefficient of Expansion: 65 x 10 -5 in/in/F Dielectric Constant: 4.0 Dielectric Strength (volts/Mil): 375 Operating Class: B (13OC)
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MAVIDON
CORP.:
Coatings (Continued):
1610 Casting Compound: MAVIDON system 1610 is a black, two component, room temperature curing epoxy system encapsulating compound featuring long pot life, convenient 1:l by volume mix ratio and good dielectric properties. Physical Characteristics: 1610 A: Appearance: Black Liquid Viscosity @ 25C (77F): 12,000 Filler Content: 0 Density (lb/gal): 9.0 Shelf life: 1 year
cps
1610 B: Appearance: Pale liquid Viscosity @ 25C (77F): 700 cps Filler Content: 0 Density (lb/gal): 8.7 Shelf Life: 1 year Mix Ratio: By weight: 100 parts 1610 A to 83 parts 1610 B By volume: 1 part 1610 A to 1 part 1610 B Pot Life: 1 hour in a 100 gram mass @ 25C (77F) Cure Schedule: Twenty-four hours at room temperature or 2 hours @ 140F Typical Cured Characteristics: Hardness: 77D Dielectric Strength: 390 volts/mil Volume Resistivity: 8.6 x 10 13 ohm-cm Thermal Expansion Coefficient: 6 x 10 -5 in/in/C Operating Class: A (105C)
Coatings
MAVIDON CORP.: Coatings (Continued): 1617 Casting Compound: MAVIDON system 1617 is a black, two component, room temperature curing epoxy encapsulating compound featuring long pot life, and good electrical properties. Physical Characteristics: 1617~: Appearance: Black Liquid Viscositv @ 25C (77F): 800 cps Filler Content: 0 Density (lb/gal): 9.0 Shelf Life: 1 year 1617B: Appearance: Pale Liquid Viscositv P 25C (77F): 700 Filler Content: 0 Density (lb/qal): 8.7 Shelf Life: 7 year
CDS
Mix Ratio: By Weight: 100 parts 1617 A to 83 parts 1617 B. By Volume: 1 part 1617 A to 1 part 1617 B. Pot Life: 1 hour in a 100 gram mass at 25C (77F) Cure Schedule: Twenty-four hours at room temperature or 2 hours at 140F. Typical Cured Characteristics: Hardness: 65 D Dielectric Strenath: 390 volts/mil Volume Resistivity: 8.6 x 10 13 ohm-cm Thermal Expansion Coefficient: 6 x 10 -5 in/in/C Operating Class: A (105C) 1617-I
: Modified to improve air release properties.
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MAVIDON CORP.: Coatings (Continued): 1618 Epoxy Resin: MAVIDON casting system 1618 is a two component, filled epoxy resin which features fast cure, low viscosity, good dielectric properties and provides Class B insulating properties. Physical Characteristics: 1618 A: Appearance: Black Liquid Viscosity 8 25C (77F): 7850 cps Density (lb/gal): 13.8 Shelf Life 8 25C (77F): 6 months 1618 B: Appearance: Amber Liquid Viscosity 8 25C (77F): 500 cps Density (lb/gal): 8.30 Shelf Life @ 25C (77F): 1 year Mix Ratio: 100 parts 1618 A to 13 parts 1618 B by weight. Pot Life: 60 minutes in a 100 gram mass at 25C (77F). Cure Schedule: 2 hours at 60C (140F) or 24 hours at room temperature Typical Cured Characteristics: Shore D Hardness: 85 Tensile Strength: 2100 psi Thermal Conductivity: 3.0 (BTU/hr/ft 2 F) Heat Distortion Temperature: IOOC Flammability, UL 94: VO Dielectric Constant: 4.19 8 25C (I KH) Volume Resistivity: 2.8 x 10 16 ohm-cm Thermal Expansion Coeffiecient in/in/C: 3.0 x 10 -4 Dissipation Factor (I KHz at 25C): .02 Operating Class: B (13OC)
Coatings
MAVIDON CORP.: Coatings (Continued): 1619 Casting Compound: MAVIDON system 1619 is a black, two component epoxy encapsulating compound which features a convenient mix ratio, good dielectric properties, and cures to yield a very flexible casting. Physical Characteristics: 1619 A: Aooearance: Black Svruv Viscosity @ 25C (77%'):‘1,700 cps Density (Lb/gal): 8.7 Shelf Life @-25C (77F): 1 year 1619 B: Appearance: Amber Liquid Viscosity @ 25C (77F): 200 cps Density (Lb/gal): 8.2 Shelf Life @ 25C (77F): 1 year Mix Ratio: 2 parts 1619 A to 1 part 1619 B by volume. 100 parts 1619 A to 47 parts 1619 B by weight. Pot Life: 20 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: Overnight at room temperature. Typical Cured Characteristics: Hardness: 25D Thermal Exuansion Coefficient (in/in/C): 6 x 10 -5 Dissipation Factor (IO 3 Hz): ;039 Thermal Conductivity (btu/hr ft 2 F/in): 1.5 Dielectric Constant (IO 3 Hz): 3.9 Operating Class: A (105C)
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MAVIDON CORP.: Coatings (Continued): 1717-1 Casting Compound: MAVIDON system 1717-1 is a black, two component, room temperature curing epoxy encapsulating compound featuring long pot life, convenient mix ratio and good dielectric properties. Physical Characteristics: 1717-IA: Appearance: Black Syrup Viscosity @ 25C (77F): 13,000 cps Filler Content: 50% Density (g/cc): 1.5 Shelf Life: 6 months 1717-IB: Appearance: Amber Syrup Viscosity @ 25C (77F): 1000 cps Filler Content: 0% Density (g/cc): 1.0 Shelf Life: 6 months Mix Ratio: By weight: 100 parts 1717-1A to 42 parts 1717-IB By volume: 3 parts 1717-IA to 2 parts 1717-1B Pot Life: 1 hour in a 100 gram mass initially at 25C (77F) Cure Schedule: Twenty-four hours at room temperature or 2 hours at 140F. Tvnical Cured Characteristics: zAHardness: 72D Dielectric Strenqth: 390 volts/mil Volume Resistivity: 8.6 x 10 13 ohm-cm Thermal Expansion Coefficient: 5 x 10 -5 in/in/C Operating Class: A
Coatings
MAVIDON CORP.: Coatings (Continued): 4180 High Temperature Casting Compound: MAVIDON system 4180 is a two component, heat-cured epoxy encapsulating compound formulated for applications requiring good electrical insulating and high temperature capabilities. 4180 features low viscosity, long pot life and a convenient mix ratio by weight or volume. Phi rsical Characteristics: 41E 10 A: Appearance: Grey Liquid Viscosity @ 25C (77F): 10,000 cps Density (Lb/gal): 12 Shelf Life @ 25C (77F): 6 months B: Appearance: Tan Liquid Viscosity @ 25C (77F): 2,800 cps Density (lb/gal): 12 Shelf Life @ 25C (77F): 6 months
4180
Mix Ratio: 100 parts 4180 A to 100 parts 4180 B by weight 1 part 4180 A to 1 part 4180 B by volume Pot Life: Greater than 24 hours in a 100 gram mass at 25C. (Pot life is dependent upon mass and temperature) Cure Schedule: For optimum properties cure for 2 hours at 85C followed by a post cure of 3 hours at 150C. (In many applications wide variations from the optimum conditions yield acceptable results; e.g.: 4 hours at 120C or 1 hour at 1OOC followed by 1 hour at 15OC.) Typical Cured Characteristics: Tensile Strength: 10,000 psi Compressive Strength: 24,000 psi Thermal Expansion Coefficient C -1: 28 x 10 -6 Water Absorption (% gain): .l after 240 hrs at 20C Dielectric Constant (50 Hz at 2OC): 3.9 Volume Resistivity: 2.0 x IQ 15 Operating Class: F (155C)
31 I
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MERECO
DIVISION:
MERECO
CN-785U
Circuit Board Coating:
Single component, repairable, flexible, rapid drying, moisture resistant urethane circuit board coating MERECO CN-785U is a single component, rapid room temperature drying, solvent based, moisture curing, oil free, polyurethane coating. It is specifically designed for printed circuits, electronic components and electronic devices requiring a high moisture resistance and environmental protection. MERECO CN-785U meets the requirements of MIL-I-46058C Type UR, and may be used wherever a high performance coating is required for maximum environmental protection. MERECO CN-785U is also used as an environmentally long lasting premium grade floor coating for industrial environments. Outstanding Features: * Sinsle comnonent, no soecial mixins or oreoaration. - * Fast drying, tack free‘3 hours. * High gloss, "walk hard" coatings (floor coatings). * Excellent moisture resistance. * Excellent abrasion resistance. * Excellent electrical insulating properties. * Repairable (after component exchange on P.C. boards). Typical Properties: Uncured Liquid (Bulk): Gardner Color: 1 Solids, %: 40 Viscosity, cps (25C): 120 NC0 Content, %: 2.9 Pounds/gallon: 8.1 Flash Point, F: 81 Wet Film (40% solids, 3 mil thickness): Set to touch, minutes: 10 Surface dry, minutes: 45 Hard dry, hours: 4 Full cure, hours: 12 Sward Hardness (1 day): 25 Cured Film: Color of Film: Clear Sward Hardness: 38 Taber Abrasion Loss, mq: 18 Tensile strength, psi:-5000 Elongation, %: (20 in/min. Instron): 85 Impact resistance, in pounds: Direct: 160 Reverse: 140 Thermal Shock (MIL-I-46058C, UR): Passes Dielectric Strength, volts/mil: 380 Dielectric Constant, (60 Hz): 4.1 Insulation Resistance, ohms: 1.5 x 10 12
Coatings
MERECO DIVISION: META-CLAD 1175 Clear Epoxy Protective Varnish: META-CLAD 1175 is a 100% reactive epoxy protective coating system which may be used as a lacquer, a clear varnish, or paint. It may be applied by any of the standard techniques, such as brush, roller, dip or spray. The material is supplied to a brush or dip coating consistency, but may be thinned with lacquer solvents, xylol or toluol to achieve the desired consistency for spray coating. META-CLAD 1175 provides the usual high level of chemical resistance, corrosion resistance, flexibility and outstanding adhesion properties associated with 100% reactive type epoxy paints. Its exceptional resistance to abrasion and convenient air curing properties suggest itself for use in industrial maintenance areas where corrosive fumes are a serious problem. Also, META-CLAD 1175 may be used as a coating for equipment to be used in such areas on which, because of size, a baking type coating cannot be used. Where faster drying is desired, a convenient baking schedule may be used. Cure Schedules: Room Temperature Cure: Dry to touch - 2 to 3 hours Light traffic - ,24 hours Full cure - 4 to 7 days Alternate Bake Schedule: Air dry or force dry to touch; then bake 15 mins. at 300F, or 25 mins. at 250F. METACLAD DP-537 Protective Coating: Single component, fast air-dry, solderable, all purpose protective coating, temp. Class B (13OC) Liquid Properties: Specific Weight (lbs/gal): 7.3 Solids Content (8 by weight): 25 Viscosity (Centistokes): 30 Flash Point (C): 45 Drying Time: 10 min. Complete Drying Time Room Temp.: 30 min. Thermal Properties: Maximum continuous use temp. (C): 140 Maximum Intermittent Use (C): 160 Maximum Low Temp. (C): -45 Thermal Shock Test: Passes Temperature Cycling Test: Passes Solderability: Good Physical Properties of Cured METACLAD DP-537: Color: Water Clear Specific Gravity: 0.88 Average Build per Dip (Mils): l/2 Humidity Resistance: Passes Salt Spray Test: Passes Moisture Resistance Test (Megohms): 30,000 Water Absorption (% Wt. Gain after 24 hrs. Immersion): 0. 17 Adhesion: Excellent
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Adhesives, Sealants and Coatings for the Electronics Industy
MERECO DIVISION: METACOTE 1031 Silicone Protective Coating: 250 Single Component Clear Silicone Protective Coating for Electronic Components METACOTE 1031 is a unique silicone resin system designed for protection of electronic components for 250C service. Cured films of METACOTE 1031 are thermally and mechanically stable--do not crack, chip or craze and provide a corrosion resistant barrier. METACOTE 1031 is particularly well suited to the protection of pyrolitically deposited films, and will stabilize resistance values against changes induced by subsequent encapsulation. METACOTE 1031 is also suitable as a "cushion coating", or impregnant, for wire wound resistors or coils to prevent open circuits due to broken wires during encapsulation. METACOTE 1031 is also supplied mica filled (1031-M) for specialized thixotropic coating applications. Outstanding Features: Impermeable to moisture vapor, chemical and corrosion resistant, non-crazing or cracking, tough yet resilient, optically clear, impact resistant, outstanding electrical properties, barrier to silver migration. Suggested Uses: Stabilization of Pyrolylic film resistors against changes due to encapsulation process, protective environmental varnish, undercoating for epoxy, phenolic, silicone-ester, and other coatings. Typical Properties: Uncured Liquid: Solids Content (8): 50 Specific Gravity @ 25C: 1.02 Color, Gardner: 2 Viscosity @ 25C: 150-200 Cured Films: Dielectric Constant @ 10 5 cycles: 3.0 Power Factor @ 10 5 cycles: 0.0008 Arc Resistance, seconds: 180 Dielectric Strength, Volts/mil: 300 Heat Resistance @ 500F: Excellent @ 600F: Good
Coatings
MERECO DIVISION: METAGEL 1870 Dip Coating Compound:
315
Series: Thixotropic Conformal
METAGEL 1870 is an epoxy dipping and sealing compound especially formulated to meet the most difficult requirements for encapsulating and conformally coating electronic components. * * * * *
Excellent mechanical properties Excellent electrical properties High chemical resistance Environmental protection Heat induced thixotropy
The thixotropic nature of METAGEL 1870 is adjusted for dipping applications. The coating thickness is controlled by the temperature of the units to be coated, by vibration of the bath and bv the speed with which the units enter and leave the bath. Curing produces an enamel-like finish. METAGEL 1870 is a two-component system. Pot life is about 4 hours, but is dependent on the volume and temperature of the mixture. Typical Product Properties: Activator: Color: Translucent straw Form: Soft gel Brookfield Viscosity: Thixotrooic Specific Gravity (25/25C): 1.0' Flash Point, F: 256 Base: Color: As specified Form: Pourable paste Brookfield Viscosity, P: 1500 Specific Gravity (25/25C): 1.5 Flash Point, F: 300 Product User Data: Mixing Ratio, phr: 20 Brookfield Viscositv. P: 850 Specific Gravity (25j25C): 1.2 Pot Life (100 g mass), hr: 4 Curing Schedules, C: 3 hrs.: 60 1 l/2 hrs.: 85 Typical Cured State Properties (after 90 minutes at 85C): Color: As specified Form: Enamel Soecific Gravitv (25/25C): 1.2 Ultimate Flexural‘strength, psi: 15000 Ultimate Compressive Strength, psi: 22000 Izod Impact, Strength, ft-lb/in of notch: 0.46
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MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Coatings: MS-465 Acrylic Coating: Wet: Aerosol/Liquid Contains acrylic resin TWA ppm: 533 Initial Boiling Point C/F: 47.71118 Internal Pressure at 21C/70F: ~40 psia Flash Point F: None MS-475 Acrylic Coating (Mil Spec): Wet: Aerosol/Liquid MIL-I-46058 Type AR/MIL-T-l52B Contains acrvlic resin TWA ppm: 575Initial Boliinq Point C/F: 48/119 Internal Pressure at 21C/70F: ~40 psia MS-460 Silicone Resin Coatins: Wet: Aerosol/Liquid MIL-I-46058 Type SR/MIL-T-152B Contains silicone resin TWA ppm: >650 Initial Boiling Point C/F: 143.2/290 Internal Pressure at 21C/70F: ~40 psia Flash Point F: None MS-470 Urethane Coating: Wet: Aerosol/Liquid MIL-I-46058 Type UR/MIL-C-47175A/MIL-T-152B Contains urethane resin TWA ppm: 491 Initial Boiling Point C/F: 36.2197.2 Internal Pressure at 21C/70F: ~40 psia MS-450 Protective Varnish: Wet: Aerosol/Liquid MIL-V-173C/MIL-T-152B Contains paraphenyl phenol-formaldehyde TWA ppm: 360 _ _ Initial Boiling Point C/F: 110/230 Internal Pressure at 21C/70F:' ~40 psia Flash Point F: 104 (TOC)
resin
Coatings
MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Protective Coating: Aerosol Products: MS-450 Protective Varnish: Available in bulk as MS-452 Excellent protection for adverse environmental conditions. Dries in minutes to form a moisture- and fungus-resistant coating. Base Material: varnish Dielectric Constant: 2.00 @ 10 5 HZ Dielectric Strength: 850 Volts/Mil Conforms to Military Specification: Mil-V-173C Ultraviolet Indicator: No Ease of Repair: Fair Fungus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -55C/-67F to 85Cfl85F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 30 min. Coverage @ 2 mil Thickness (16 oz. Aerosol): 11.7 sq. ft. MS-460 Silicone Resin Coating: Available in bulk as MS-462 Solderable coating for ease of repair and replacement of components. Offers good dielectric properties and excellent moisture resistance. Curing may be heat accelerated. Base Material: silicone resin Dielectric Constant: 2.58 @ 10 5 HZ Dielectric Strength: 1200 Volts/Mil Conforms to Military Specification: Mil-1-46058 (Type SR) Ultraviolet Indicator: Yes Ease of Repair: Excellent Fungus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -55C/-67F to 150C/302F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 60 min. (Curing may be heat accelerated.) Coverage @ 2 mil Thickness (16 oz. Aerosol): 3.5 sq. ft.
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MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Protective Coating: Aerosol Product (Continued): MS-465 Acrylic Coating: Available in bulk as MS-467 Provides insulation against high voltage arcing and corona shorts. Contains an ultraviolet indicator for quality control inspection. Fast drying. Base Material: acrylic resin Dielectric Constant: 1.57 @ IO 5 HZ Dielectric Strength: 2000 Volts/Mil Ultraviolet Indicator: Yes Ease of Repair: Good Funaus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -5C/23F to 150C/302F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 10 min. Coverage @ 2 mil Thickness (16 oz. Aerosol): 8.1 sq. ft. MS-470 Urethane Coating: Available in bulk as MS-472 Solderable for ease of repair. A durable coating with excellent dielectric properties and chemical resistance. Contains an ultraviolet indicator for quality control inspections. Base Material: urethane resin Dielectric Constant: 1.45 @ 10 5 HZ Dielectric Strenqth: 1500 Volts/Mil Conforms to Military Specification: Mil-1-46058 (Type UR) Ultraviolet Indicator: Yes Ease of Repair: Excellent Funaus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -55C/-67F to llOC/23OF Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 30 min. Coverage @ 2 mil Thickness (16 oz. Aerosol): 9.5 sq. ft.
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MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Protective Coatings: Aerosol Products (Continued): MS-475 Acrylic Coating: Available in bulk as MS-477 Superior toughness and abrasion resistance. Provides excellent insulation and moisture resistance. Solderable for ease of repair. Easily removed by solvent systems. Base Material: acrylic resin Dielectric Constant: 3.0 @ 100 HZ Dielectric Strength: 2000 Volts/Mil Conforms to Military Specification: Mil-1-46058 (Type AR) Ultraviolet Indicator: Yes Ease of Repair: Excellent Fungus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -65C/-85F to 125C/257F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25Cf77F: 60 min. (Curing may be-heat accelerated.) Coverage @ 2 Mil Thickness (16 oz. Aerosol): 7.0 sq. ft.
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PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1568 Conformal Coating: Use: As a thin film, conformal coating on printed circuit assemblies, to protect against environmental stresses. Description: PR-1568 is a one-part urethane coating. It may be applied by brushing, dipping or spraying, to obtain a tough, void-free, clear amber film. Specifications: PR-1568 meets the requirements of MIL-I-46058C(6), Type UR. Application Properties: Color: Clear Amber Viscosity (Ford #4 cup at 75F): 20 seconds Nonvolatile Content: 40% Flash Point: 85F (PMCC) Tack-Free Time: 1 hour @ 75F, 50% RH Cure Time: 2 days @ 75F, 50% RH or 15 hrs. @ 120F or 3 hrs. @ 180F Recommended Thickness: 1.5 to 2 mils Approximate Coverage: 700 sq.ft./gal/mil Volatile Organic Compounds: 600 gms/liter Performance Properties: Color: Clear Q (resonance): Change before and after coating: At 1 MHz: t5.0% At 50 MHz: (4.0% Change before and after immersion in distilled water at 75F for 24 hours: At 1 MHz: (8% At 50 MHz: t6% Dielectric Withstanding Voltage: No leakage Insulation Resistance: Initial: 1x10 7 mesaohms After IO days condensing moisture and temperature cycling between 75F and 158F in accordance with MIL-STS-202, Method 106C: 1x10 6 megaohms Power Factor: 1 KHz: 0.013 2 MHz.: 0.016 Dielectric Constant: 1 KHz: 3.2 2 MHz: 2.9 Low Temperature Flexibility: -65F
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RANBAR TECHNOLOGY INC.: THERMELEC Electrical Insulating Varnishes: The extensive product line includes: - Air Dry Varnishes (clear, colors, and aerosol cans) - Baking Systems - Water Reducible Varnishes - Potting Compounds - High solids and 100% reactive materials - Vacuum pressure impregnating materials - Conformal Coatings - Magnet Core Coatings - Aqua Strip strippable coating for leads and connections The products are based upon modified alkyds, polyesters, and epoxy resins. A broad range of solids, viscosities, and dry times provide the customer with versatility and ease of application. Many products have received Underwriters Laboratory approva and meet Military Specification MIL-I-24092B. A partial listing of the product line is included below. Electrical Specialties: Solvent Baking Varnish, Clear: THERMELEC G-3726: Type: Polyester Non Volatile %: 48% Viscosity cps: 500-800 Flash Pt Seta. F: 104 Cure Hours (C): 2 @ [149Cl UL Class Recog.: 180 MIL. Spec.: MIL-I-24092B, Grade CB I, II General purpose varnish for stators, rotors, armatures, and coils THERMELEC G-4020: Type: Polyester Non Volatile %: 48% Viscosity cps: 250-450 Flash Pt. Seta. F: 139 Cure Hours (C): 2 @ [149C] UL Class Recog.: 180 MIL Spec.: MIL-I-24092B, Grade CB I, II General purpose varnish for coils, transformers, stators
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RANBAR TECHNOLOGY, INC.: Electrical Specialties(Continued): Solvent Baking Varnish, Clear(Continued): THERMELEC G-4101: Type: Polyester Non Volatile %: 50% Viscosity cps: 250-450 Flash Pt. Seta. F: 114 Cure Hours (C): 2-4 @ [149Cl UL Class Recog.: 180 MIL. Spec.: MIL-I-24092B Grade CBH I, II General purpose varnish with high bond strength THERMELEC G-4130: Type: Epoxy Non Volatile %: 50% Viscosity cps: 900-1100 Flash Pt. Seta. F: 105 Cure Hours (C): 3 @ [16OCl UL Class Recog.: 180 Fast cure, chemically resistant, excellent for hermetic applications. Water Reducible Varnish: THERMELEC G-4173: Type: Polyester Non Volatile %: 35% Viscositv cos: 300-500 Flash Pt: Seta. F: 118 Cure Hours (C): 2 @ [149Cl UL Class Recog. 180 (DuPont #I61 General purpose varnish THERMELEC G-4221: Type: Polyester Non Volatile 8: 31% Viscositv cos: 300-400 Flash Pt: Seta. F: 123 Cure Hours (C): 1 @ [126Cl UL Class Recog.: 180 General purpose varnish low'temperature cure
Coatings
RANBAR TECHNOLOGY INC.: Electrical Specialties(Continued): Air Dry Clear Varnish: THERMELEC G-3575: Type: Uralkyd Non Volatile %: 50% Viscosity cps: 150-200 Flash Pt. Seta. F: 100 Cure Hours (C): 5 @ [25Cl Flexible, moisture and abrasion resistant conformal applications THERMELEC G-3879: Type: Modified Alkyd Non Volatile %: 42% Viscosity cps: 100-150 Flash Pt. Seta. F: 76 Cure Hours (C): l/2 @ 125Cl MIL Spec.: MIL-I-24092B Grade CA I, II Fast dry, excellent dielective properties THERMELEC G-4355: Type: Epoxy Ester Non Volatile %: 37% Viscosity cps: 300-500 Flash Pt. Seta. F: 80 Cure Hours (C): 3-4 @ [25Cl Excellent for high humidity THERMELEC G-4192: Type: Polyurethane Non Volatile %: 45% Viscosity cps: 270-370 Flash Pt. Seta. F: 82 Cure Hours (C): l/4 @ [25C] Conformal applications THERMELEC G-4039: Type: Acrylic Non Volatile %: 25% Viscosity cps: 40-75 Flash Pt. Seta. F: 61 Cure Hours (C): l/2 @ [25Cl MIL. Spec.: MIL-I-46058C Type AR Conformal applications
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RANBAR TECHNOLOGY INC.: Electrical Specialties(Continued): 100% Reactive Varnish: THERMELEC G-2054: Tvoe: Polvester Gei Time:- 15-25/1OOC Viscosity CPS: 150-250 Flash Pt; S&a. F: 94 Cure Hours 8 [Cl: l/2-2 8 f149Cl UL Class Recog.: 155 Monomer: Styrene General purpose, excellent stability, low viscosity THERMELEC G-4103: Type: Polyester Gel Time: IO-20/100c Viscosity cps: 700-1100 Flash Pt. Seta. F: 165 Cure Hours (C): 1 8 [149C] UL Class Recog.: 155 MIL. Spec.: T-butyl Styrene V.P.I. high flash point THERMELEC G-4171: Type: Epoxy Gel Time: 15-20/15OC Viscosity cps: 1500-2500 Flash Pt. Seta. F: 200~ V.P.I. Epoxy can be used as potting compound THERMELEC G-426814269: Type: Epoxy Gel Time: lo-15/15oc Viscosity cps: 650-1050 Flash Pt. Seta. F: 200+ Trickle impregnation epoxy
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325
SYMPLASTICS INC.: SYMPOXY 1495 Dip Coating: Two component epoxy dip coating SYMPOXY 1495 is a two component heat or room temperature cure epoxy system used for dipping small ceramic chips, tubular or oval capacitors or any component where a true conformal coating is desired which covers sharp edges with an even coating. Coating build up of .050 may be made with this system. Very little air entrapment makes this system excellent for one coat dip, but to insure maximum moisture resistance two coats are suggested. A maximum drop in IR of 15-208 may be expected with proper application of this system. The adhesion of SYMPOXY 1495 is excellent and will adhere to most materials including ceramic, plastic, metals, etc. No induction time is required. Components: 2 Color: Black Pot life, I# mass, hours: 3 Perfect conformal coating life, l# mass. min. @ 78F: 60 I# mass, min. @ 60F: 120 Pencil Hardness (24 hrs. @ 25C): 4H Dielectric strength (volt/mil): 450 Dielectric constant to 10 6 cps: 3.20
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Sealants
and Coatings for the Electronics
Industry
TACC INTERNATIONAL CORP.: Conformal Coatings: CR-3117: Type: Epoxy Flexible circuit board coating, solvent based conformal protective coating. Fluorescent under black light for coverage and identification. Passes MIL-E5722 and MIL-STD-202 (106). Catalyst Number: CR-3117-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 50 Workable Pot Life 100 gm. Mass @ 25C: Days Mixed Viscosity 8 25C cps: 500 Recommended Cure Time: Room Temp - 24 hrs. or 3 hrs. at 50C Hardness Shore: 70-D Color: Amber CR-3200:
Type: Urethane One part polyurethane coating varnish which forms a resilient high gloss finish. Excellent salt spray resistance. Ideal moisture barrier for IC's and PCB's Catalyst Number: No catalyst required Workable Pot Life 100 gm. Mass @ 25C: 6 mos. Mixed Viscosity @ 25C cps: 100 Recommended Cure Time: Room Temp. 8 hrs. Hardness Shore: 75-D Color: Clear CR-3200
WS:
Type: Urethane Water borne urethane air dry coating. Excellent adhesion to a broad range of substrates, including: steel, aluminum, nickel, bronze, brass, copper, ceramics, etc. Catalyst Number: No catalyst required Workable Pot Life 100 gm. Mass @ 25C: 3 days Mixed Viscosity @ 25C cps: 200 Recommended Cure Time: Room Temp. 1 hr 20 min. Hardness Shore: 80-D Color: Amber 16-600: Type: Epoxy Conformal dip coating for foil, metalized film, ceramic, mica and tantalum capacitors. Meets UL 94 V-O requirements. Catalyst Number: 64 Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 15 Workable Pot Life 100 gm. Mass @ 25C: 90 min. Mixed Viscosity @ 25C cps: Thixotropic Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 86-D Color: Black or Green
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327
TACC INTERNATIONAL CORP.: Conformal Coatings (Continued): CR-3912: Type: Silicone High temperature resistant, excellent adhesion polymer for barrier, protective or conformal coating. Catalyst Number: CR-3912-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 10 Workable Pot Life 100 cm. Mass a 25C: 24 hrs. Mixed Viscosity @ 25C cps: 200 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 70-D Color: Clear
Section VI Conductive Compounds
328
Conductive Compounds
ABATRON, INC.: Electrically Conductive Compounds: Basic conductive adhesives and coatings for industrial requirements. Silver Filled: ~Resin portion: 8401-IA Hardener portion: 8401-1B Vehicle type: epoxy Filler: silver Color: gray Solids, % by weight: 81.5 Metal % of vehicle: 95.7 Ohms/square: <=O.Ol Max Operating temp.: 12OC Resin portion: 8505-1A Hardener oortion: 8505-IB Vehicle type: epoxy Filler: silver Color: cfrav Solids, -% by weight: 100 Metal % of vehicle: 75 Ohms/square: <=O.Ol Max operating temp.: 12OC Resin oortion: 8709-12A Hardener portion: 8505-IB Vehicle type: epoxy Filler: silver % by weight: 87.5 Metal 4 of vehicle: 80.6 Ohms/square: <=O.Ol Max operating temp.: IIOC Resin portion: 8709-10 Vehicle type: acrylic Filler: silver Color: gray Solids, % by weight: 44.9 Metal % of vehicle: 82.4 Ohms/square: <=O.Ol Max operating temp.: 80C
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ABATRON, INC.: Electrically Conductive Compounds(Continued): Nickel Filled: ___~ Resin portion: 8109-18A Hardener portion: 50-12~ Vehicle type: epoxy Filler: nickel Color: gray Solids, % by weight: 98.0 Metal % of vehicle: 76.5 Ohms/square: (~0.6 Max operating temp.: 9OC Resin portion: 8709-83 Hardener portion: 50-l2B Vehicle type: epoxy Filler: nickel % by weight: 88.4 Metal 4 of vehicle: 77.8 Ohms/square: (~0.7 Max operating temp.: llOC Resin portion: 8709-7 Vehicle type: acrylic Filler: nickel Color: grav Solids, -% by weight: 50.9 Metal % of vehicle: 82.5 Ohms/square: ~~0.7 Max operating temp.: 80C Carbon Filled: ~~ Resin portion: 8201-14~ Hardener vortion: 8201-14B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 100 Carbon, % by vehicle: 69 Ohms/square~(K=1000): c=O.O1 Max. operating temp.: 60C
Conductive Compounds
ABATRON, INC.: Electrically Conductive Compounds(Continued): Carbon Filled AContinued): Resin portion: 8201-14A Hardener portion: SO-12B Vehicle type: epoxy Filler: carbon Color: black Solids. % bv weisht: 100 Carbon; % b; weight: 64 Ohms/square (K=lOOO): <=0.5 Max. operating temp.: 9OC Resin portion: 8509-13 Hardener portion: 8509-1B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 100 Carbon, % of vehicle: 7.2 Ohms/square (K=lOOO): <=400K Max. operating temp.: 5OC Resin portion: 8509-2A Hardener portion: 8509-1B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 100 Carbon, % of vehicle: 7.2 Ohms/square (K=lOOO): <=200K Max operating temp.: 50C Resin portion: 8509-3A Hardener portion: 8509-3B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 100 Carbon, % of vehicle: 6.1 Ohms/square (K=lOOO): <=300K Max operating temp.: 50C Resin portion: 8509-4A Hardener portion: 8509-4B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 100 Carbon, % by weight: 6.8 Ohms/square (K=lOOO): <=300K Max operating temp.: 50C
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ABATRON, INC.: Electrically Conductive Compounds(Continued): Carbon Filled (Continued): ~~ Resin portion: 8602-2A Hardener portion: 8602-2B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 100 Carbon, % of vehicle: 4.4 Ohms/square (K=lOOO): <=6000K Max operating temp.: 60C Resin portion: 8709-2A Hardener portion: 8709-2B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 79 Carbon, % of vehicle: 15 Ohms/square (K=lOOO): <=200K Max operating temp. 70C Resin portion: 8709-3A Hardener portion: 8709-38 Vehicle type: epoxy Filler: carbon Color: black Solids, 8 by weight: 100/40 Carbon, % of vehicle: 800 Ohms/square (K=lOOO): <=lOOK Max operating temp.: 70C Resin portion: 8709-5A Hardener portion: 8709-5B Vehicle type: epoxy Filler: carbon Color: black Solids, % by weight: 68 Carbon, % of vehicle: 25 Ohms/square (K=lOOO): <=lOK Max operating temp.: 70C
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333
ABATRON, INC.: Electrically Conductive Compounds(Continued): ABOCOAT 8401-l A/B: Conventional highly-filled coating to produce conductive paths with the highest silver content possible.-Requires strict controls. Resistivity may rise to 0.1 ohm/sq under unfavorable mixing, application and atmospheric conditions. ABOWBLD 8505-IA/B: Probably the best solventless silver-epoxy adhesive and resurfacer on the market. High rigidity, chemical and heat resistance. Superb adhesion to most rigid materials. ABOCOAT 8709-l%/ABOCURE 50-12: Versatile silver-epoxy high-solids coating with superb conductive and adhesive properties. Most successful conductive compounds for most electronic uses. ABOCOAT 8709-12: High-grade silver-acrylic l-component coating that needs no A/B mixing. Excellent where the epoxy adhesion and thermochemical properties are not needed. ABOWELD 8709-18/ABOCURE 50-12: Practically solventless nickel-epoxy adhesive and resurfacing system with good coating capabilities in the intermediate conductivity range. Very versatile. ABOCOAT 8709-8/ABOCURE 50-12: Versatile nickel-epoxy conductive coating. ABOCOAT 8709-7: Easy-to-use nickel-acrylic conductive coating. ABOWBLD 8201-14 with ABOCURE 8201-14 or 50-12: The most conductive carbon-epoxy pastes. The 8201-14 A/B system is easier to use and more conductive. ABOWELD 8201-14/ ABOCURE 50-12 is preferred where higher heat and chemical resistance are more important. As the size of the conductive particles is relatively coarse, these two products are used primarily as thick adhesives and conductive pastes rather than thin and smooth coatings. 8509-l A/B, 8509-21/8509-lB, 8509-3 A/B, 8509-4 A/B, 8602-2 A/B: Are solventless carbon-epoxy systems used as adhesives and silk-screening materials with anti-static and other lower-conductivity requirements. ABOCOAT 8709-2 A/B, ABOCOAT 8709-3 A/B, ABOCOAT 8709-5 A/B: High-solids carbon-epoxy coatings with various conductivity ranges widely used in silk-screening.
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ABLBSTIK: Hybrid Adhesive Pastes: Electrically Conductive: ABLEBOND 84-1LMI: Work Life 8 RT: 2 weeks Cure Schedule(s): 1 hour 8 150C or 2 hours @ 125C Die Shear Strength: 6500 psi Volume Resistivity: 0.0002 ohm-cm Weight Loss 8 300C: 0.19% Storage Life: 3 months @ 5C or 6 months @ -lOC or 1 year @ -40C Meets 5011: Yes Silver filled, solvent-free, high purity adhesive for microelectronic chip bonding. Apply by screen printing, automatic dispensing, or hand. ABLEBOND 84-1LMINBl: Work Life @ RT: 2 weeks Cure Schedule(s): 1 hour @ 150C Die Shear Strength: 6200 psi Volume Resistivity: 0.0001 ohm-cm Weight Loss @ 3OOC: 0.20% Storage Life: 3 months @ 5C or 6 months 8 -lOC or 1 year 8 -40C Meets 5011: Yes Higher purity version of 84-1LMI designed to bond difficultto-wet surfaces, such as palladium silver capacitor terminations. Excellent thermal conductivity (2.3 BTU ft-1 hr-1 F-l). ABLEBOND 84-1LMITl: Work Life @ RT: 2 weeks Cure Schedule(s): 1 hour 8 150C or 2 hours @ 125C Die Shear Strensth: 6600 asi Volume Resistivity: O.OOOi ohm-cm Weight Loss 8 300C: 0.16% Storage Life: 3 months @ 5C or 6 months 8 -lOC or 1 year @ -40C Meets 5011: Yes Thermally conductive, screen printable version of 84-1LMl.
Conductive Compounds
335
ABLESTIK: Hybrid Adhesive Pastes (Continued): Electrically Conductive (Continued): ABLEBOND 85-l: Work Life @ RT: 2 days Cure Schedule(s): 1 hour @ 150C or 2 hours 8 125C Die Shear Strength: 7050 psi Volume Resistivity: 0.0008 ohm-cm Weight Loss @ 300C: 0.22% Storage Life: 3 weeks @ 5C or 3 months @ -lOC or 1 year @ -40C Meets 5011: Yes Gold filled, solvent-free epoxy adhesive designed for hybrid applications where silver migration is a critical concern. ABLEBOND 958-7: Work Life @ RT: 1 week Cure Schedule(s): 1 hour @ 150C Die Shear Strength: 5700 psi Volume Resistivity: 0.0001 ohm-cm Weight Loss @ 300C: 0.23% Storage Life: 3 months @ 5C or 1 year @ -40C Meets 5011: Yes Stress-absorbing, silver filled, high purity, solvent-free adhesive which provides improved adhesion to gold. ABLEBOND 967-l: Work Life @ RT: 2 days Cure Schedule(s): 6 hours @ 65C or 5 minutes @ 150C Die Shear Strength: 3300 psi Volume Resistivity: 0.015 ohm-cm Weight Loss @ 300C: 0.52% Storage Life: Premixed/Frozen 1 year @ -40C Kits 6 months 8 25C or 1 year @ 5C Meets 5011: No Two component, silver filled, solvent-free epoxy designed for applications which require electrical conductivity and lower cure temperatures.
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ABLBSTIK
LABORATORIES:
Polymer Conductor P2134:
P2134 Polymer Silver conductor is designed for high conductivity applications such as crossovers in conjunction with ~7130 multilayer dielectric, as well as for terminating P3900 series resistors on PC boards. Sheet Resistance: 0.020 ohms/square/mil Viscosity: 50 Kcps+-20 Kcps @ 25C. Solids: 71%+-2. Pencil Hardness: 8H per ASTM standard D3363 Adhesion: 5B per ASTM standard D3359 method B using #810 tape. Printing: Screen Type: Stainless Steel Emulsion: .OOl" Maximum Wire/Thread Dia: .0016" Maximum Mesh Opening: .0024” Screen Type: Polyester Emulsion: .OOl" Maximum Wire/Thread Dia: .0013" Maximum Mesh Opening: .0020" Line Definition: Stainless steel mesh: .015" polyester mesh: .OlO" Cure Schedule: 165C for 30 minutes in a circulating air convection oven or belt furnace. Wet Thickness: 34+-4 microns Cure Thickness: l7+-2 microns Coverage: 100 cm 2/gm at 35 microns wet. Polymer Conductor P2136 P2136 is a plateable Polymer Nickel designed for surface mount applications on top of P7130 dielectric or directly on PC boards. Sheet Resistance:
Conductive Compounds
337
ABLBSTIK LABORATORIES: Polymer Conductor P2313-XP: P2313-XP Polymer Silver conductor is designed for use in flexible polyimide flexible circuit applications in conjunction with P7110-XP multilayer dielectric. The P2313-XP conductor can be used for terminating P3900 series resistors. Sheet Resistance: co.035 ohms/square/l4 microns cured. to.020 ohms/square/mil Viscosity: 30 Kcps+-10 Kcps at 25C Solids: 62%+-2. Adhesion: Passes ASTM D3359, method B, cross hatch with a 5B rating. Printing: Screen Type: Stainless Steel Emulsion: .OOl" Maximum Wire/Thread Dia: .0016" Maximum Mesh Opening: -0024" Screen Type: Polyester Emulsion: .OOl" Maximum Wire/Thread Dia: .0013" Maximum Mesh-Opening: .0020" Cure Schedule: 165C for 30 minutes in a circulating air oven or belt furnace. Wet Thickness: 32+-2 microns. Cured Thickness: 14+-2 microns. Coverage: 180 cm 2/gm at 34 microns wet. Polymer Conductor P2422: P2422 Polymer Silver conductor is suitable for use in crossover (jumper) applications in conjunction with P7130 multilayer dielectric, as well as for terminating P3900 series resistors on PC boards. Sheet Resistance: +-0.035 ohms/square/mil Viscosity: 50 Kcps+-20 Kcps at 25C Solids: 70%+-2. Adhesion: Pull strength is greater than 5 pounds on a 100x100 mil pad. Apply RMA flux, preheat substrate for 5 seconds, and dip for 3 seconds in 62 Sn/36 Pb/2 Ag solder at 200C. Printing: Screen Type: Stainless Steel Emulsion: .OOl" Maximum Wire/Thread Dia: .0016" Maximum Mesh Opening: .0024" Screen Type: Polyester Emulsion: .OOl" Maximum Wire/Thread Dia: .0013" Maximum Mesh Opening: .0020" Line Definition: Stainless steel mesh: .015" polyester mesh: .OlO" Cure Schedule: 165C for 30 minutes in a circulating air convection oven or belt furnace. Wet Thickness: 34+-4 microns---Cured Thickness: 17+-2 microns. Coverage: 100 cm 2/gm at 35 microns wet.
338
Adhesives, Sealants and Coatings for the Electronics Industry
ABLKSTIK LABORATORIES: Polymer Conductor P2545: P2545 Polymer Silver conductor has been formulated for use as a termination for potentiometer applications on rigid board. Sheet Resistance: 0.050 ohms/square/mil. Viscosity: 40 Kcps+-12 Kcps at 25C. solids: 72%+-1.5 Pencil Hardness: 5H per ASTM standard D3363. Adhesion: 5B per ASTM standard D3359 method B using #810 tape. Printing: Screen Type: Stainless Steel Emulsion: .OOl" Maximum Wire/Thread Dia: .0016" Maximum Mesh Opening: .0024" Screen Type: Polyester Emulsion: .OOl" Maximum Wire/Thread Dia: .0013" Maximum Mesh Opening: .0020" Line Definition: Stainless steel mesh: .015" polyester mesh: .OlO" Cure schedule: 165C for 30 minutes in a circulating air convection oven or belt furnace. Wet Thickness: 34+-4 microns. Cured Thickness: 18+-2 microns. Coverage: 100 cm 2/gm at 35 microns wet. Polymer conductor P2540: The P2548 Polvmer Nickel Silver is a solderable conductor designed for wave or dip soldering applications. Sheet Resistance:
Conductive Compounds
339
ABLESTIK LABORATORIES: Polymer Conductor P2609: P2609 is a low temperature curing flexible Polymer Silver. This material is ideally suited for use on polyester or polyimide films for membrane switch and flexible circuit manufacturing. Sheet Resistance: co.035 ohms/square/mil Viscosity: 50,000+-20,000 cps at 25C Solids: 60%+-2. Adhesion: Cross hatch is 5B per ASTM D3359 method B. Printing: Screen Type: Stainless Steel Emulsion: .OOl" Maximum Wire/Thread Dia: .0016" Maximum Mesh Opening: .0024" Screen Type: Polyester Emulsion: .OOl" Maximum Wire/Thread Dia: .0013" Maximum Mesh Opening: .0020" Line Definition: .OlO" with polyester and about .015" with stainless steel. Cure Schedule: 125C for 15 minutes in an air circulating convection oven or belt furnace. Wet Thickness: 29+-3 microns. Cured Thickness: 12+-2 microns. Coverage: 150 cm 2/gm at 30 microns wet. Polymer Overcoat P6200 Series Soldermask: The P6200 Series was designed to be used with both the P2422 Polymer silver and P3900 series Resistors on printed circuit boards as an overcoat to provide protection from solder, acid baths and most solvents. It can also be used on cermet hybrids for mechanical protection from solder and moisture. EMCA P/N: P6270B-2 Color: Green Viscosity: 70 Kcps+-20 Kcps EMCA P/N: P6273 Color: Black Viscosity: 50 Kcps+-20 Kcps EMCA P/N: P6277-1 Color: Medium Blue Viscosity: 75 Kcps+-IO Kcps Solvent Resistance: Unaffected by 30 minutes exposure to boiling trichloroethane. Curing Time: 165C for 35 minutes in a circulating air convection oven or belt furnace. Clean Up: EMCA-REMKX 102
340
Adhesives, Sealants and Coatings for the Electronics Industry
ABLESTIK: Polymer Conductors: P2609:
ohms/sq/mil, flexible silver for Hiqh conductivity, (0.035 membrane switches/keyboards. P2609L: Low viscosity version of P2609 for large area circuits or continuous inline printing. P2545: Rigid board termination for polymer P3900 series potentiometers. P2422A: High conductivity, co.035 ohms/sq/mil, conductor for crossover applications with P7130 dielectric or termination to P3900 series on P.C.B's. P2422: High performance termination for P3900 series resistors on a varietv of P.C.B's. P2313-XP: High conductivity silver, (0.020 ohms/sq/mil., for flexible high temperature polyimide substrates. p2131: Removable silver for electroplating process or preassembly test in P.C.B's. 2P2134: High performance silver for crossovers on rigid P.C.B.'s. P2136: Plateable Nickel conductor providing excellent solderability and high adhesion on P.C.B's. P2196: Hiqh performance silver for die attach applications requiring excellent adhesion. P2548: Premium nickel/silver conductor providing excellent solderability and leach resistance with Sn/Pb solders. Polymer DielectricsjEncapsulants: P6200 Series: Soldermaskfencapsulants providing excellent solvent/scratch resistance and mechanical protection. P6270B-2: Light green P6271: Opaque light blue P6272: Opaque rust color P6273: Opaque black P6277-1: Opaque dark blue P6306-XP: Removable plate resist, for electroplating process on P.C.B.'s (Light blue). P7110-XP: Premium thermoset flexible multilayer dielectric and or spacer, for flexible substrates (translucent blue).
Conductive Compounds
ABLESTIK: Polymer Dielectrics/Encapsulants
341
(Continued):
P7130 series: Crossover dielectric for rigid P.C.B.'s. P7130: Light blue P7134: Dark blue P7135: Cadmium red P7138: Translucent blue Thermoplastic flexible overcoat 7552R: Encapsulant for P.C.B. 's or chip resistors providing excellent moisture protection (red). P7552A: White Polymer Resistor Systems: P3300 series: 10 ohm - 1 Meg ohm. High performance carbon resistor system for flexible substrate applications. P3500 series: Premium carbon resistor system for both keyboard and edge contact applications. Can be terminated directly onto the copper clad. P3503: 30 ohms P3505: 50 ohms P3512: 100 ohms P3900 series: 10 ohms - 100K ohms. High temperature carbon resistor system for termination with P2422 conductor on rigid printed circuit boards.
342
Adhesives, Sealants and Coatings for the Electronics Industry
A. I. TECHNOLOGY, INC.: Flexible PRIMA SOLDER: "No-Stress" Epoxy Adhesives with high Electrical Conductivity. Smooth Thixotropic Paste for Screen-printing and Needle Dispensing. Excellent Adhesion to Metals, Ceramics, and Plastic Substrates. Low Ionic Content of Chlorides, Sodium and Potassium ((10 ppm). "No-Stress", Flexible Epoxy for highly Mismatched Substrates. Description: The adhesive is a "No-stress" conductive epoxy paste offering excellent reworkability at 80-150C. Designed to meet hybrid adhesive specification MIL-STD-883C/ Type 5011 except for high bond strength. The Paste passes NASA outgassing requirements. It has excellent thermal conductivity. MH8450: Filler: Silver Curing schedule: 2h/125C 30m/150C lOm/175C Strength: Lap shear: at 25C: (psi): 1200 (N/mm 2): 8.5 MH8452: Filler: Silver Curing schedule: 4h/lOOC 2h/125C Strength: Lap shear: at 25C: (psi): 1200 (N/mm 2): 8.5 MH8456: Filler: Silver Curing schedule: 4h/lOOC 2h/l25C Strength: Lap shear: at 25C: (psi): 1200 (N/mm 2): 8.5 ME8459:
Filler: Gold Curing schedule: 4h/lOOC 2h/125C Strength: Lap shear: at 25C: (psi): 1200 (N/mm 2): 8.5
Conductive Compounds
A.I. TECANOMGY,
343
INC.: Rigid PRIMA SOLDER:
Epoxy Adhesives with High Electrical Conductivity - Smooth Thixoptopic Paste for Screen-printing and Needle Dispensing. - Excellent Adhesion to Metals, Ceramics, and Plastic Substrates. - Low Ionic Content of Chlorides, Sodium and Potassium (
344
Adhesives, Sealants and Coatings for the Electronics Industry
A-1. TECHNOLOGY, INC.: Rigid PRIMA SOLDER(Continued): ME8412: Filler: Silver Curing Schedule: 30m/150C lOm/175C 2m/l75C Strenath: Lap Shear at 25C: (psi): 2500 (N/mm 2): 17.6 at 150C: (psi): 2000 (N/mm 2): 14 Device push-off: (psi): 6000 (N/mm 2): 12.7 Thermal conduct.: (Btu-in/hr-ft 2-F): 45 (Watt/m-C): 6.5 The;rm;;l.e;;;n;:on:(ppm/C): Tg(C): 130 Max. cont. oper. temp.: (C): 180 Volume resistivity: (ohm.cm): t0.00005 Dielectric Strength: (Volt/mil): N/A 100% solid: Yes Cured Density: (gm/cc): 3.5 Hardness (Shore D): 85 ME8416: Filler: Silver Curing schedule: 4h/lOOC 2hjl25C Strenath: Lap Shear: at 25C: (psi): 2500 (N/mm 2): 17.6 at 150C: (psi): 2000 (N/mm 2): 14 Device push-off: (usi): 6000 iif/mm 2): 12.7 Thermal conduct: (Btu-in/hr-ft 2-F): 45 iwatt/mk): 6.5 Thermal expansion: (PPm/C) Below Tg: 40 Tg(C): 145 Max. cont. oper. temp.: C: 180 Volume resistivity: (ohm-cm): tO.OOO1 Dielectric strength: (Volt/mil): N/A 100% solid: No Cured Density: (gm/cc): 3.5 Hardness(Shore D): 85
Conductive Compounds
A. I. TECHNOLOGY, INC.: Rigid PRIMA SOLDER(Continued): ME8419: Filler: Gold Curing schedule: 4h/lOOC 2h/l25C Strength: Lap shear: at 25C: (psi): 2500 (N/mm 2): 17.6 at ISOC: (psi): 2000 (N/mm 2): 14 Device push-off: (psi): 6000 (N/mm 2): 12.7 Thermal conduct.: (Btu-in/hr-ft 2-F): 45 (Watt/m-C): 6.5 Thermal expansion: (ppm/C) Below Tg: 40 Tg(C): 145 Max. cont. oper. temp. (C): 150 Volume resistivity: (ohm.cm): 2500 psi (17.6 MN/m 2) 8 15oc: >I200 osi (8.5 MN/m 2) 8 25C after 1080 hrs @ 15bC: >2500 psi (17.6 MN/m 2) Thermal Conductivity: 4.0 Watt/m-C (2.3 Btu-ft-I-hr-l-F-1) Volume Resistivity @ 25C:
34.5
346
Adhesives, Sealants and Coatings for the Electronics Industry
AREMCO PRODUCTS, INC.: AREMCO-BOND Electrically Conductive Adhesives: AREMCO-BOND adhesives offer a fast convenient way of producing electrically conductive bonds to metals, ceramics, glass and plastics. They are used in many applications such as bonding IC chips, cementing EMI/RFI shielding gaskets, replacing solder joints, printed circuit board repair, and attaching heat sensitive components. AREMCO-BOND adhesives are available in three basic compositions: AREMCO-BOND 525: A single component silver/epoxy with no mixing or pot life problems. Cures as low temperatures. AREMCO-BOND 556: Two component silver/epoxy which can be cured at room temperature. AREMCO-BOND 614: Low cost nickel/epoxy offering economical high strength bonding. 525: Major Constituent: Silver Temperature Limit: 340F Intermittent Temperature Limit: 370F Volume Resistivity (ohm-cm): .Ol Thermal Conductivity: 5.18 Water Absorption: -03% Viscosity: Paste Visual Appearance: Silver 556: Major Constituent: Silver Temperature Limit: 350F Intermittent Temperature Limit: 600F Volume Resistivity (ohm-cm): .Ol Thermal Conductivity: 4.97 Water Absorption: .025% Viscosity: Paste Visual Appearance: Silver 614: Major Constituent: Nickel Temoerature Limit: 350F Intermittent Temperature Limit: 600F Volume Resistivity (ohm-cm): -025 Thermal Conductivity: 1.52 Water Absorption: .03% Viscosity: Paste Visual Appearance: Dark Gray
Conductive Compounds
347
AREMCO PRODUCTS, INC.: AREMCO-SHIELD EMI/RFI Conductive Adhesive/ Putty/Coating: AREMCO-SHIELD comnounds are conductive materials used to solve a number of EMI/RFI shielding problems. Two basic materials are now offered by Aremco: AREMCO-SHIELD 615, a conductive putty/ coating; and AREMCO-SHIELD 616, a unique conductive adhesive. AREMCO-SHIELD 615 is an unusual silver-elastomer based compound which can be used as a putty or coating. The user has the option of filling holes or gaps in electronic enclosures when using the 615 as a putty; or by mixing in an additional liquid component the 615 can be converted to a conductive coating. AREMCO-SHIELD 616 is a conductive adhesive system which uses a new low cost silver-silica matrix which makes it ideal for high strength, economical, conductive cementing of EMI/RFI shielding gaskets. Both of these AREMCO-SHIELD systems have the ability to bond to aluminum, copper, steel, stainless steel, glass, ceramic and many plastics such as ABS, styrene, and even polyethylene, offering an efficient conductive path. AREMCO-SHIELD materials are also easy to apply and can be cured at room temperature which is vital to its use for on-site work. 615: Major Constituent: Silver Binder System: Elastomer Temperature Limit: 400F Intermittent Temperature Limit: 500F Coefficient of Thermal Expansion (in/F): 3.6x10 -5 Thermal Conductivity: 2.32 Volume Resistivity (ohm-cm): .012 Thermal Shock Resistance: Excellent Abrasion Resistance: Good Viscosity: Liquid/Paste Visual Appearance: Sandy Gray Components: 2 Tensile Strength: 800 psi Lap Shear: 1200 psi Percent Solids: 70-90% 616: Major Constituent: Silver Binder System: Epoxy Temoerature Limit: 400F Intermittent Temperature Limit: 600F Coefficient of Thermal Expansion (in/F): 3.9 x 10 -5 Thermal Conductivity: 2.33 Volume Resistivity (ohm-cm): -018 Thermal Shock Resistance: Excellent Abrasion Resistance: Good Viscosity: Thick Syrup Visual Appearance: Beige Components: 2 Tensile Strength: 2500 psi Lap Shear: 3000 psi Percent Solids: 100%
348
Adhesives, Sealants and Coatings for the Electronics Zndustry
AREMCO PRODUCTS, INC.: HEAT-AWAY High Temperature Conductive Greases: HEAT-AWAY greases are high temperature conductive materials used to achieve thermal dissipation from high power electronic components such as power resistors, rectifiers and transistors. HEAT-AWAY greases will withstand temperatures to 550F. They include two ceramic filled compounds and three metal filled materials. If electrical insulation combined with heat dissipation is required, the ceramic filled greases should be used. For example, HEAT-AWAY 638 based on an alumimum nitride filler is offered for high reliability applications where both high thermal conductivity and high dielectric strength are required. The metal filled HEAT-AWAY greases offer a wide range of much higher thermal conductivity with the 641 the ultimate in thermal dissipation. 637: Basic Filler: Alumina Filler Type: Ceramic Thermal Conductivity: 0.475 Color: White Temperature limit F: 550 Dielectric Strength volts per mil: 550 638: Basic Filler: Aluminum Nitride Filler Type: Ceramic Thermal Conductivity: 2.23 Color: Gray Temperature limit F: 550 Dielectric Strength volts per mil: 550 639: Basic Filler: Alumimum Filler Type: Metal Thermal Conductivity: 3.04 Color: Alumimum Temperature limit F: 550. Dielectric Strength volts per mil: 40 640: Basic Filler: Coooer Filler Type: Me&i Thermal Conductivity: 5.45 Color: Copper Temperature limit F: 550 Dielectric Strength volts per mil: 4 641: Basic Filler: Silver Filler Type: Metal Thermal Conductivity: 5.58 Color: Silver Temperature limit F: 550 Dielectric Strength volts per mil: Conductive
Conductive Compounds
349
AREMCO PRODUCTS, INC.: PYRO-DUCT High Temperature Electrically Conductive Coatings: AREMCO now offers a new family of high temperature adhesive coatings which offer the user the ability to bond or coat dissimilar materials to produce electrically conductive paths at temperatures as high as 2450F. The new PYRO-DUCT coatings are based on silver, nickel and graphite in a high strength, high temperature ceramic binder system containing no organics. The PYRO-DUCT coatings exceed the temperature limits of epoxy based conductive coatings, and with their convenient low temperature cure are easier to work with than glass frit based materials. PYRO-DUCT coatings can be applied by conventional paint spray technique, screen printed, brushed on, injected or dipped. The materials will adhere to metals, ceramics, glass and most plastics. PYRO-DUCT coatings offer applications as EMR shielding, solar cell lead attachment, high temperature sensor coatings, and as high temperature electrical circuits. These materials also offer potential for replacing ceramic metallizing in nonhermetic sealing applications. PYRO-DUCT coatings are available in three basic compositions: 597 based on silver, 598 based on nickel, and 599 which uses a graphite matrix. 597: Major Constituent: Silver Temperature Limit: 1700F Intermittent Temperature Limit: 1750F Weight: 3.2 gms/cc Specific Gravity: 3.2 Coefficient of Thermal Expansion (in/in/F): 9.6 x 10 -6 Thermal Conductivity: 5.26 Electrical Resistivity (micro-ohms cm): 22 598: Major Constituent: Nickel Temperature Limit: 1200F Intermittent Temperature Limit: 2450F Weight: 5.4 lbs/qt Specific Gravity: 2.7 Coefficient of Thermal Expansion (in/in/F): 4.2 x 10 -6 Thermal Conductivity: 1.49 Electrical Resistivity (micro-ohms cm): 58 599: Major Constituent: Graphite Temperature Limit: 700F Intermittent Temperature Limit: 2000F Weight: 2.6 lbs/qt Specific Gravity: 1.3 Coefficient of Thermal Expansion (in/in/F): 4.0 x 10 -6 Thermal Conductivity: 0.286 Electrical Resistivity (micro-ohms cm): 2800
350
Adhesives, Sealants and Coatings for the Electronics Industry
BACON INDUSTRIES INC.: Electrically Conductive Adhesives: Bacon Industries offers three silver-filled epoxy adhesives for making electrical connections in applications where the high temperatures necessary to make soldered connections are detrimental to components. Because these materials are filled with silver, they also have relatively high thermal conductivity. Adhesive LCA-12XM, the most highly filled and least fluid of the three systems, has been specially processed to remove paramagnetic particles; it is used where small amounts of magnetic contamination are detrimental to the operation of sensitive electro-magnetic devices. Comparing the other two systems, Adhesive LCA-24 is an excellent all-around system with better strength above 160F and better long-term conductivity stability. CONDUCTING TWENTY/TWENTY is the most fluid of the three systems being self-leveling at room temperature and, therefore, the easiest to apply. Recommended Mixing and Handling Parameters: LCA-12xbl: Activator used: BA-17XM * Amount per hundred parts by weight of adhesive: 1.84 Work Life at 77F, minutes: 90 Minimum Shelf Life (3), months: 24 Recommended Cure, hr/F: 2/200 Typical Physical Properties After Recommended Cure: Color: Grey Specific Gravity: 3.6 Hardness, Shore D: 89 Volume Resistivity, ohm-cm: 0.003 after heat aging: 160F: 3 months: 0.003 6 months: 0.003 200F: 3 months: 0.003 6 months: 0.003 Weight Loss after Six Months: at 250F, %: 0.23 Bond Strength to Aluminum, psi: at -65F: 2400 at 75F: 2400 at 160F: 3000 at 200F: 1800 at 250F: 700 Heat Distortion Temperature (264 psi), F: 181 * Also supplied on special order with Activator BA-9. The amount used is 2.32 parts by weight per hundred parts by weight of Adhesive LCA-12XM. The recommended cure is two hours at 200F. The cured properties are similar.
Conductive Compouds
BACON INDUSTRIES INC.: Electrically Conductive Adhesives (Continued): Recommended Mixing and Handling Parameters: LCA-24: Activator used: BA-9 Amount per hundred parts by weight of adhesive: 5.00 Work Life at 77F, minutes: 60 Minimum Shelf Life, months: 12 Recommended Cure, hr/F: 2/200 Typical physical Properties After Recommended Cure: Color: Silver Specific Gravity: 2.7 Hardness, Shore D: 91 Volume Resistivity, ohm-cm: 0.002 after heat aging: 160F: 3 months: 0.003 6 months: 0.003 200F: 3 months: 0.006 6 months: 0.030 250F: 3 months: 0.070 6 months: 0.090 Weight Loss after Six Months: at 200F, %: 0.09 at 250F, %: 0.21 Recommended Mixing and Handling Parameters: CONDUCTING TWENTY/TWENTY: Activator used: BA-66B Amount per hundred parts by weight of adhesive: 5.50 Work Life at 77F, minutes: 60 Minimum Shelf Life, months: 3 Recommended Cure, hr/F: 2/200 Typical Physical Properties After Recommended Cure: Color: Silver Specific Gravity: 2.7 Hardness, Shore D: 07 Volume Resistivity, ohm-cm: 0.002 after heat aging: 160F: 3 months: 0.002 6 months: 0.002 200F: 3 months: 0.020 6 months: 0.060 Weight Loss after Six Months: at 200F, %: 0.10 at 250F. %: 0.25
351
352
Adhesives,
Sealants
and Coatings for the Electronics
Industry
BACON INDUSTRIES INC.: Thermally Conductive Silicone Compounds: These compounds are filled silicone-based polymers which cure to resilient solids. They have high thermal conductivity, good thermal stability and excellent electrical properties. They are useful in electronic applications requiring a heat conductive encapsulant. The cured compounds may be knife-cut for replacement of components. New compound may be poured in place and cured to re-form a tight seal. SC-lo: Resin Compound: SC-IO Activator: BA-52 Parts of Activator required per 100 parts by weight of compound: 2.30 Recommended potting temperature, F: 160 Working Life at potting temp, hours: 0.5 Viscosity of mixed compound, poise: at 77F: 1800 at 160F: 525 Recommended Cure, hr/F: 2/200 Cured Properties After Recommended Cure: Color: Turquoise Hardness: Shore A: 80 Specific Gravity: 2.16 Thermal Conductivity (ASTM F433), Btu-in/hr-ft 2-F: at 104F: 6.9 at 250F: 6.4 Coefficient of Thermal Expansion, test), IO -6/F: 50 Dielectric Constant at 1 kHz: 5.2 Dissipation Factor at 1 kHz: 0.001 Volume Resistivity, ohm-cm: 2 x 10 15 SC-17: Resin
Compound:
SC-1 7
Activator: BA-58 Parts of Activator required per 100 parts by weight of compound: 2.50 Recommended potting temperature, F: 77 Working Life at potting temp, hours: 16 Viscosity of mixed compound, poise: at 77F: 2500 Recommended Cure, hr/F: l/212 Cured Properties After Recommended Cure: Color: White Hardness: Shore A: 74 Shore D: 25 Specific Gravity: 2.23 Thermal Conductivity (ASTM F433), Btu-in/hr-ft 2-F: by ASTM C51t3-76 at 75F: 4.2 Coefficient of Thermal Expansion, test), 10 -6/F: 60 Volume Resistivity, ohm-cm: 8 x 10 14
Conductive Compounds
353
BACON INDUSTRIES INC.: Thermally Conductive Adhesive LCA-127: Adhesive LCA-127 is a thermally conductive electrically insulating epoxy adhesive. It has a paste consistency and will not run from vertical surfaces. Recommended Mixing and Handling Parameters: Adhesive: LCA-127 Activator: BA-49 Parts by weight of activator required per hundred parts by weight of adhesive: 3.83 Consistency: Thixotropic paste (a4000 poise) Work Life at 77F, minutes: 150 Tack-free time at 77F, hours: 7 Recommended Cure, minutes/F: 30/200 Properties After Recommended Cure: Color: Black Specific Gravity: 2.32 Hardness, Shore D: 95 Lap Shear Strength to Aluminum, psi: at -65F: 2300 at 77F: 2300 at 150F: 2400 at 200F: 900 Thermal Conductivity (ASTM F433): Btu-in/hr-ft 2-F: at 104F: 8.7 at 250F: 8.3 Coefficient of Linear Thermal Expansion (ASTM E831), 10 -6/F: -65~ to 77F: 15 77F to 150F: 22 77F to 212F: 34 ASTM Heat Distortion Temperature (264 psi), F: 170 Glass Transition Temperature, F: By DSC: 170 By TMA: 142 Flexural Strength, psi: 12,700 Flexural Modulus, 10 6 psi: 1.5 Water Absorption, 7 days at 77F, %: 0.11 Flammability (ASTM D635): Average Time of Burning, set: 125 Average Extent of Burning, mm: 15 Dielectric Constant at 1 kHz: 77F: 5.87 150F: 6.23 200F: 7.49 Dissipation Factor at 1 kHz: 77F: 0.008 150F: 0.008 200F: 0.042 Volume Resistivity, ohm-cm: 77F: 9 x 10 15 150F: 2 x 10 14 200F: 9 x 10 10
354
Adhesives, Sealants and Coatings for the Electronics Indusfy
CHOMERICS: CHO-BOND Conductive Adhesives: Chomerics' CT-IO-BOND conductive epoxies and silicone resin systems offer mechanical and electrical properties to meet a full range of specific requirements. Formulated with both pure silver and silver-plated particle fillers, they are employed to ensure electrical continuity in such applications as bonding EM1 gaskets in place, sealing microwave modules, chip-bonding, and solder replacement. Curing for both one- and two-component systems occurs at room temperature, but two-component systems can be accelerated under elevated temperature. 360-20: Binder: epoxy Filler: Ag/Cu Mix Ratio (by wgt.): 1:1 Consistency: very thick Specific Gravity: 5.0+-0.30 Minimum Lap Shear Strength (psi): 1600 Maximum DC Volume Resistivity (ohm-cm): 0.005 Use Temperature: -80 to 212F (-62 to 1OOC) Elevated Temperature Cure Cycle: 2.0 hrs. @ 150F (66 C) Room Temperature Cure: 24 hrs. Working Life: 1.0 hr. Large particle size allows for thick bond-lines and oxide layer bite. 360-208: Binder: epoxy Filler: Ag, Ag/Cu Mix Ratio (by wgt.): 100:33 Consistency: very thick Specific Gravity: 4.0+-0.40 Minimum Lap Shear Strength (psi): 1400 Maximum DC Volume Resistivity (ohm-cm): 0.01 Use Temperature: -80 to 212F (-62 to 1OOC) Elevated Temperature Cure Cycle: 0.75 hr. @ 212F (IOOC) Room Temperature Cure: 24 hrs. Working Life: 1.0 hr. Same as 360-20; no contact pressure required. 584-29: Binder: epoxy Filler: Ag Mix Ratio (by wgt.): 100:6.3 Consistency: light paste Specific Gravity: 2.5+-0.20 Minimum Lap Shear Strength (psi): 1200 Maximum DC Volume Resistivity (ohm-cm): 0.002 Use Temperature: -67 to 257F (-55 to 125C) Elevated Temperature Cure Cycle: 0.25 hr. @ 235F (113C) Room Temperature Cure: 24 hrs. Working Life: 0.5 hr. Excellent conductivity, easy application. Best general-purpose system. Available in CHO-PAKs.
Conductive Compounds
355
CHOMERICS: CHO-BOND Conductive Adhesives(Continued): 584-208: Binder: epoxy Filler: Ag Mix Ratio (by wgt.): 1:l Consistency: medium paste Soecific Gravity: 2.7+-0.20 Minimum Lap Shear Strength (psi): 700 Maximum DC Volume Resistivity (ohm-cm): 0.005 Use Temperature: -80 to 210F-(-62 to 99C) Elevated Temperature Cure Cycle: 0.75 hr. @ 212F (IOOC) Room Temperature Cure: 24 hrs. Working Life: 1.0 hr. Shelf Life (mos.): 9 Ease of application for circuit board repair. 592:
Binder: epoxy Filler: Ag Mix Ratio (by wgt.): 100:50 Consistency: nearly liquid Specific Gravity: 2.6+-0.25 Minimum Lap Shear Strength (psi): 1500 Maximum DC Volume Resistivity (ohm-cm): 0.05 Use Temperature: -80 to 210F (-62 to 99C) Elevated Temperature Cure Cycle: 0.5 hr. @ 212F (1OOC) Room Temperature Cure: 1 wk. Working Life: 4.0 hrs. Shelf Life (mos.): 9 Bonds dissimilar materials. 1029:
Binder: silicone Filler: Ag/Cu Mix Ratio (by wgt.): 1.0:2.5 Consistency: thick paste Specific Gravity: 3.0+-0.35 Minimum Lap Shear Strength (psi): 450 Maximum DC Volume Resistivity (ohm-cm): 0.06 Use Temperature: -67 to 257F (-55 to 125C) Elevated Temperature Cure Cycle: 0.5 hr. @ 250F (121C) Room Temperature Cure: 1 wk. Working Life: 2.0 hrs. Shelf Life (mos.): 6 Two-component compound used with primer. Bond-line < 8 mils. (Conductivity decreases sharply >20 mils.) Long pot life. Cured under pressure (6 psi). For quick bonding or conductive elastomers.
356
Adhesives, Sealants and Coatings for the Electronics Industy
CHOMHRICS, INC.: CHO-BOND Conductive Adhesives(Continued): 1030: Binder: silicone Filler: Ag/Cu Mix Ratio (by wgt.): l-part Consistency: gritty paste Specific Gravity: 3.75~0.25 Minimum Lao Shear Strenath (osi): 200 Maximum DC‘Volume Resisfivity (ohm-cm): 0.05 Use Temperature: -67 to 392F (-55 to 2OOC) Room Temperature Cure: 1 wk. Working Life: 0.5 hr. Shelf Life (mos.): 6 Coverage (in2/lb): 1,300 Recommended Thickness (in.): 0.010 max. One-component. Cures at room temperature and moderate humjLdity. Highly conductive. No corrosive curing agents. 1085: Binder: primer for 1029 Mix Ratio (by wgt.): l-part Consistency: thin fluid Specific Gravity: 0.87iO.15 Use Temperature: -112 to 392F (-80 to 2OOC) Room Temperature Cure: 0.5 hr. Shelf Life (mos.): 6 Coverage (in2/lb): 14,400 Recommended Thickness (in.): 0.0002 max. Wipe on surface and let air dry 30-60 min. 1086: Binder: primer for 1030 Mix Ratio fbv wat.): 1-oart Consistency:&thin fluidSpecific Gravity: 0.78&0.10 Use Temperature: -112 to 392F (-80 to ZOOC) Room Temperature Cure: 0.5 hr. Shelf Life (mos.): 6 Coverage (in2/lb): 14,400 Recommended Thickness (in.): 0.0002 max. Wipe on surface and let air dry 30-60 min.
Conductive Compounds
357
CHOMERICS, INC.: CHO-FLEX Conductive Coatings and Ink: CHO-FLEX materials are designed for EM1 shielding of flexible circuitry and composite structures, and for screenable applications such as membrane keyboards. One- and two-part urethane systems are available, as is a choice of pure silver or silver-nickel blend for silk-screening on flexible circuits. CHO-FLEX 602 is a two-part system designed as a room-temperature curable EM1 shielding coating for composite structure air-frame components. The polyester resin based.conductive PTF inks have been used extensively on membrane keyboards. 600: Binder: polyurethane Filler: Ag, Ni Consistency: Thixotropic paste Typical Density: 1.66 Maximum Surface Resistivity (ohm/sq): 0.1 Use Temperature: >225F (>107C) 601: Binder: polyurethane Filler: Ag Consistency: Thixotropic paste Typical Density: 1.67 Maximum Surface Resitivity (ohmlsq): 0.06 Use Temperature: >225F (>107C) 602: Binder: polyurethane Filler: Ag Consistency: Thixotropic paste Typical Density: 2.10 Maximum Surface Resistivity (ohm/sq): 0.06 Use Temperature: -65 to 2251 (-54 to 107C) 4430: Binder: polyester Filler: Ag Consistency: Thixotropic paste Typical Density: 3.80 Maximum Surface Resistivity (ohm/sq): 0.08 4432: Binder: polyester Filler: Ag, Sn Consistency: Thixotropic paste Typical Density: 3.80 Maximum Surface Ressitivity (ohm/sq): 0.25 Use Temperature: -65 to 185F (-54 to 85C)
358
Adhesives, Sealants and Coatings for the Electronics Industry
COTRONICS CORP.: Hi Temp Conductive Adhesives: For Electronic and Industrial Applications: DURALCO Conductive Adhesives and Coatings combine unique high temp. resins and binders and electrically or thermally conductive pigments. Now applications requiring high conductivity at high temperatures can easily be satisfied with the DURALCO series. DURALCO Conductive Adhesives have withstood, in independent tests, over 1 year at 400F at room temp curing type 120, and over 6 months at 670F for type 124. Electrically Conductive: 118 Silver: Form: Paint Temperature Limit: 200F Volume Resistance: 0.01 Thermal Conductivity: 50 Viscosity - cps: 35 Cure Cycle @ R-T.: 1 Hr. Cure Cycle @ 200F: 5 Min. Components: 1 120 Silver: Form: Paste Temoerature Limit: 500F Volime Resistance: 0.002 Thermal Conductivity: 65 Viscosity - cps: 15;OOO Cure Cycle @ R-T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 122 Nickel: Form: Paste Temperature Limit: 500F Volume Resistance: 0.7 Thermal Conductivity: 15 Viscosity - cps: 25;OOO Cure Cycle @ R.T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 124 Silver: Form: Paste Temperature Limit: 700F Volume Resistance: 0.002 Thermal Conductivity: 65 Viscosity - cps: 20,000 Components: 2
Conductive Compounds
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COTRONICS CORP.: Hi Temp Conductive Adhesives: For Electronic and Industrial Applications (Continued): Thermally Conductive: 128 Ceramic: Form: Paste Temperature: 500F Volume Resistance: 10 15 Thermal Conductivity: 40 Viscosity - cps: 15,000 Cure Cycle 8 R.T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 132 Aluminum: Form: Paste Temperature Limit: 5OOF Volume Resistance: 10 6 Thermal Conductivitv: 60 Viscosity - cps: 22;OOO Cure Cycle @ R.T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 134 Ceramic: Form: Grease Temperature Limit: 500F Volume Resistance: 10 16 Thermal Conductivity: 50 Viscosity - cps: grease Components: 1 DURALCO 118, 120, 122 were developed to provide an electrically conductive adhesive for use to 500F with long term stability. Ultra HiTemp 700F Type 124 is now available. Hi-temp formulations, and easy to use - No mixing - single component (250F curing systems) are available on request. Thermally Conductive Bonders: DURALCO High Thermal Conductive Adhesives are based on COTRONICS unique high temperature epoxy resins and hardeners. DURALCO 132 has a metallic aluminum filler. DURALCO 128 has a high thermal conductive ceramic filler. DURALCO 134 is a nonhardening thermally conductive grease. These products provide a thermally conductive layer for bonding and dissipation of heat required in many electronic, electrical, instrumentation, heating, and cooling applications. Applications include bonding heating elements, cooling coils, semi conductors, heat sinks, solar cells, ceramic substitutes, etc. Now: Ultra High Temp. 700F formulations are available on request
360
Adhesives, Sealants and Coatings for the Electronics Industry
DYMAX CORP.: DYMAX MULTI-CURE Thermally Conductive Adhesive 991: MULTI-CURE 991 is a filled, thermally conductive adhesive for mounting heat sinks and heat sensitive electronic components to boards or for use in any application where it is desirable to increase thermal conductivity between assembled parts. MULTI-CURE 991 may be cured by any one or a combination of different cure methods: Pre-application of Activator 535, UV light or with heat as low as 250F. Uncured Properties: Composition: Modified Urethane Co&: Off-white Viscosity: Thixotropic Paste Toxicity: Very Low Specific Gravity: 1.71 cured Properties: Tensile-Shear Strength: ner ASTM D-1002 (steel): 2,500 nsi Theimal Range: -65 to 35OF: Coefficient of Thermal Conductivity: 5-7 BTU-in/Hr-Ft-F Dielectric Strength: 1600 volt/milActivator 535: Fixture Time: 30-40 sec. UV Cure (between glass - 2 Mil Gap): 100 mw/cm: (365 nanometer W light): 5-10 sec. Heat Cure at 300F: IO-15 min. Alternative Curing Methods: - Activator 535 - UV Light - Heat Factors Affecting Curing: Dark surfaces mav lensthen W cure time. Heat from high intensity lamps shortens cure times. Full range UV-A, B & C lamps provide faster cures than filtered sources. All UV sources degrade with use. Check output with a radiometer. Thicker films require longer cures. Light intensity decreases as distance from W sources increases. Some clear plastics may contain W inhibitors. Thick bondlines require longer cures with activator.
Conductive Compoundr
ELECTRO-KINETIC
SYSTEMS,
INC.:
CONDUCT-X
361
Conductive Adhesives:
CONDUCT-X 5002: CONDUCT-X 5002 is a one-part, highly conductive epoxy copolymer containing pure copper filler. Its vsrsatility and stability suaaest its use as a reolacement for silver-filled systems in va;ious applications requiring high conductivity, including component termination bonding, RF shielding and printed circuit repair. Typical Properties: As Packaged: Shelf Life: Six months, under refrigeration Specific Gravity: 3.6 Curing Conditions: 20-60 minutes at 125C (260~) to 140C (285F) is preferred. Longer periods below 125C, down to a minimum of 85C (185F) are possible. Do not exceed 200C (390F) while curing. Fully Cured: Volume Resistivity: 0.00005-0.001 ohm-cm Tensile Strength: 5000 psi 180 Peel Strength: 3 to 10 lbs. per inch of width, depending upon substrate. Coefficient of Linear Thermal Expansion: 50 x 10 -6 cm/cm/C Thermal Conductivity: 50 BTU/hr/ft Z/F/in CONDUCT-X
5031:
Two-Part, Electrically Conductive, Copper-Filled Adhesive CONDUCT-X 5031 is a two part, highly conductive, epoxy containing pure copper filler. It adheres well to metals, plastics, and similar substrates, and in many applications serves as an excellent substitute for solder. CONDUCT-X 5031 may be cured at room temperature, which enhances its use in many applications where a high curing temperature cannot be tolerated; e.g., capacitor lead bonding, semiconductor chip bonding, and the like. Typical Properties: As Packaged: Shelf Life: One year, at room temperature Specific Gravity: 2 g/cc Curing Conditions: 45 min. @ 125C (260F) 1 hr. @ 1OOC (212F) 4 hrs. @ 50C (122F) 48 hrs. @ Room Temperature (75F) Pot Life (100 gm mass): 30 min.-l hr. (75F) Fully Cured: Volume Resistivitv: 0.0015 ohm-cm Tensile Strength:-5600 psi 180 Peel Strength: 4 to 12 lbs. per inch of width, depending upon substrate. Coefficient of Linear Thermal Expansion: 50x10 -6 cm/cm/C Thermal Conductivity: 25 BTU/hr./ft Z/F/in Maximum Operating Temperature: 150C (3OOF)
362
Adhesives, Sealants and Coatings for the Electronics Industry
ELECTRO-KINETIC SYSTEMS, INC.: CONDUCT-X Conductive Adhesives (Continued): CONDUCT X-5003: Two-Part, Electrically Conductive, Copper-Filled Adhesive CONDUCT-X 5033 is a two-part, room temperature curing resin system with high electrical and thermal conductivity. It adheres well to metals, plastics and similar substrates, and, in many applications, serves as an excellent substitute for solder. The combinations of its high conductivity and low curing temperature suggests its use in many critical applications where a high curing temperature cannot be tolerated: e.g., in capacitor terminations; semiconductor chip bonding; and the like. The particle size of CONDUCT-X 5033 is sufficiently fine to enable its application by screen printing, or by spraying. Typical Properties: As Packaged: Shelf Life: Six months or more, under refrigeration Specific Gravity: 2.0 g/cc Curing Conditions: 16 to 24 hours at room temperature (70F) with less time required at higher temperatures. One hour at 140F (6OC) is suggested as a starting point. Catalyst must be thoroughly mixed before application. Note: CONDUCT-X 5033 can also be cured by application of electrical current in lieu of heat or room temperature curing by use of a special catalyst. Fully Cured: Volume Resistivity: 0.001 ohm-cm Tensile Strength: 4500 psi 180 Peel Strength: 2 to 7 lbs. per inch of width, depending upon substrate. Thermal Conductivity: ("K" Factor)-50 BTU/hr/ft a/F/in Coefficient of Linear Thermal Expansion: 50 x 10 -6 cm/cm/C
Conductive Compounds
363
ELECTRO-KINETIC SYSTEMS, INC.: CONDUCT-X Conductive Adhesives (Continued): CONDUCT-X 4001: Two-part, room temperature curing, silver conductive epoxy system CONDUCT-X 4001 is a highly conductive, two-part, silverfilled epoxy system, which can be cured at room temperature. Its relative insensitivity to curing conditions, which allows it to cure at temperatures down to 40F, suggest.its use in field applications where a constant or reliable temperature source is not always available. Its high conductivity makes it ideal for such applications as printed circuit board repair, automotive backlite defogger repair, and delicate electronic circuit fabrication or repair. Typical Properties: As Mixed: Pot Life: 60-90 minutes at room temperature Solids: 100% Specific Gravity: 3.2 g/cc Curing Conditions: 24 hrs. at 70F. Allow longer times at lower temperatures (to 40F). Cure may be accelerated by heating (300F Max) Fully Cured: Volume Resistivity: 0.001 ohm-cm Thermal Conductivity: 48 BTU/hr/ft/F/in Maximum Service Temperature: 275F Chemical Resistance: Excellent to water, aliphatic solvents, alkalis and alcohols. Good to acids. CONDUCT-X 4003 Silver-Conductive Epoxy Adhesive: CONDUCT-X 4003 is a two-part, electrically conductive epoxy adhesive. Its excellent adhesion to smooth substrates such as glass, and its unusually long working life make it ideal for bonding problem surfaces. CONDUCT-X 4003 adheres well to metals, plastics, and ceramics, and in many applications serves as an excellent substitute for solder. It may be dispensed by such standard methods as trowelling, drawdown, syringe dispensing, etc., and is readily adapted to mechanized or automated systems. Typical Properties: As mixed: Pot Life: 24 hrs. at normal ambient temperatures Specific Gravity: 3.3 Curing Conditions: 1 hr. at 150C (300F) 2 hrs. at 12OC (255F) 3 hrs. at 75C (165F) Fully Cured: Volume Resistivity: 0.002 ohm-cm Tensile Strength: 3800 psi Peel Strength: 1.5 to 4.0 per inch of width, depending substrate. Coefficient of linear thermal expansion: 4.8x10 cm/cmC Thermal Conductivity: 50 BTU/hr/ft/F/in. Lap Shear Strength: 1000 psi (alumimum to aluminum)
364
Adhesives, Sealants and Coatings for the Electronics Industy
ELECTRO-KINETIC SYSTEMS, INC.: CONDUCT-X Conductive Adhesives (Continued): CONDUCT-X 5001 Conductive Adhesive: CONDUCT-X 5001 is a one-part, highly conductive, epoxy copolymer containing pure copper filler. Its versatility and stability suggest its use as a replacement for silver-filled systems in various applications requiring high conductivity, particularly where superior long term temperature stability is required. Suggested applications include component termination and bonding, hybrid circuit chip bonding, electric warmers, and the like. Typical Properties: Shelf Life: One year at room temperature Specific Gravity: 3.3 Curing Conditions: 20 to 60 minutes at 18OC (355F) is optimal, but longer periods below 18OC, down to a minimum of 150C (300F) are possible ubder certain conditions. Do not exceed 200C (39OF) while curing. Fully Cured: Volume Resistivity: 0.0005-0.001 ohm-cm Tensile Strength: 5600 psi 180 Peel Strength: 4 to 12 lbs. per inch of width, depending upon substrate. Thermal Conductivity: 48 BTU/hr/ft Z/F/in Coefficient of Linear Thermal Expansion: 50x10 -6 cm/cm/C
Conductive Compounds
365
ELECTRO-SCIENCE LABORATORIES, INC.: Conductive Adhesives and Coatings Silver Compositions: #1109, #1109-S, #1110-S, #2209/ Thermally Conducting, Electrically Insulating #1109-I For Use as Adhesive and for Chip Attachment: The 1109, 1109-S, 1110-S and 2209 adhesives are noble-metal filled thermosetting resin compounds, designed for use as electrical contacts, terminations and adhesives. #1109, Silver: Viscosity, CPS 26C: 40K - 1OOK Rheology_.One Component Thixotropic Paste Solids Content: 95% Minimum Pot Life: 3 months, replenish solvent losses Cure: 150C for 2-3 hours or 180-220C for 1-2 hours #1109-S, Silver Screen Printable: Viscosity, cps 26C: 125K - 175K Rheology: One Component Thixotropic Paste Solids Content: 85% Minimum Pot Life: 6 months Cure: 150C for 2-3 hours or 180-220C for l-2 hours #1110-S, Silver Screen Printable: Viscosity, cps 26C: 125K - 175K Rheology: One Component Thixotropic Paste Solids Content: 87% minimum Pot Life: 6 months Cure: 150C for 2-3 hours or 18OC-220C for 1-2 hours #2209, Silver: Viscosity, cps 26C: Parts A and B 28~ - 65 K Adjust as needed Rheology: Two Components Both A & B are viscous pastes Solids Content: 95% Minimum Pot Life: 2 to 3 hours Cure: 16 hrs at 75C or 5 hrs at 1OOC or 2 hrs at 15OC #1109-l Mineral-Filled Insulator Screen Printable: Viscosity, cps 26C: 300K - 350K Rheology: One Component Thixotropic Paste Solids Content: 80% Minimum Pot Life: 6 months Cure: 150C for 2-3 hours or 18OC-220C for 1-2 hours
366
Adhesives, Sealants and Coatings for the Electronics Industry
ELECTRO-SCIENCE LABORATORIES, INC.: ESL #1107-S Conductive Polymer:
Silver-Filled
A smooth surface, phenolic base, Ag filled thermosetting conductive composition. Especially good where surface smoothness is essential. Metallic Phase: Ag Viscosity, Brookfield: 80+-20 Pa.s Substrate for Calibration: FR-4 Processing: A. Screen mesh/emulsion: 200 or 325 mesh/ 25 microns B. Level @ room temperature: 5-10 minutes C. Drying, ventilated box oven @ 125C: lo-15 minutes D. Firing (curing): 1) Ventilated box oven @ 15OC: 2 hrs. 2) YEfrared furnace @ 220C peak: 3-4 minutes at peak Resistivity: Measured from 10,000 sq. micron line 25 microns thick: max. 40 milliohm Thinner: ESL #402 Coverage: 15 microns thickness: 150 cm 2/gm Print Speed: 20 inchesfsec. max. Nickel Plating: ESL Ni-Clad-10 System Compatibility: Resistor: ESL #15100 Resistor Series Dielectric: ESL #1109-l ESL #240-SB and other ESL polymer materials Shelf Life: 0-5C refrigeration necessary: 6 months
Conductive Compounds
367
ELECTRO-SCIENCE LABORATORIES, INC.: #1900 Silver-filled Solventless Epoxy/#1000 Insulative Epoxy/#610 Reactive Vehicle Thinner: ESL #1900 is a silver filled, medium viscosity, one part, solventless conductive epoxy adhesive. ESL #lOOO is a mineral filled, medium viscosity, one part, solventless insulative epoxy. It is intended for use in mounting and sealing applications where electrical conductivity is not required. #1900: Rheology, Brookfield: Thixotropic Paste IOOK +- 25 Color: Silver Service Temperature, Continuous Duty: 150C (cure 50C above max. expected service temp. for hermetic package sealing uses) Intermittent Duty: Up to 350C for short periods during TC wire bonding or package sealing operations. Shelf Life: 3-6 months under freezing or refrigeration Alternate Cure Cycles: 125C, 2 hours 15OC, 60-120 minutes lSOC, 30-60 minutes Volume Resistivity, ohm-cm: 0.0005-0.001 Sheet Resistivity, ohm per square, 25 microns thick: 0.03-0.10 Recommended Cured Thickness, microns: 20-40 Adhesion: Silicon Chip Bonding: Excellent; Chips cannot be removed without fracturing. Lab shear, Cu to Cu, kg. per sq. cm.: 70-140 lbs. per sq. in.: 1000-2000 #lOOO: Rheology, Brookfield: Thixotropic Paste 75K +-20 Color: Tan Continuous Duty: 150C (cure 50C above max. expected service temp. for hermetic package sealing uses) Intermittent Duty: up to 350C for short periods during TC wire bonding or package sealing operations. Alternate Cure Cycles: 125C, 2 hours 15OC, 30-60 minutes 1SOC. 15-30 minutes Volume Resistivity, ohm-cm:'Insulator Sheet Resistivity, ohm per square, 25 microns thick: Insulator Recommended Cured Thickness,-microns: 20-40 Adhesion: Silicon Chip Bonding: Excellent; Chips cannot be removed without fracturing. Lab shear, Cu to Cu: kg. per sq. cm.: 70-140 lbs. per sq. in.: 1000-2000
368
Adhesives, Sealants and Coatings for the Electronics Industry
Electrically Conductive Epoxies TECHNOLOGY INC.: EPO-TEK Microelectronic Grade: Silver Filled Elevated Temp. Cure:
EPOXY
H20E: No. of Components: Two Shore D Hardness: 79 Cure Temperature: 175C-1 min. 15OC-5 min. Volume Resistivity (ohm-cm): 0.0001 to 0.0004 Thermal Conductivity (BTU in/ft 2 hrF): 11.5 approx. Tg 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1500 Viscositv B 25C cos: 25.000-35.000 TGA Degradation Temp.: 425C . CTE Below Tg/Above Tg (in/in/C): 43 x 10 -6/150 x 10 -6 Pot Life (@-Room Temp.): 3-4 Days Shelf Life (0 Room Temp.): 1 yr. H20E-175: No. of Components: Two Shore D Hardness: 81 Cure Temperature (Typical): 15OC-1 hr. laoc-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0004 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 approx. Tg 15OC/l hr Cure: 16OC lSOc/lSOc/cure Max. Oper. Temp. Continuous C: 175 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1500 400
@ 2ooc
Viscositv B 25C CDS: 25.000-35.000 TGA Degradation Temp.: h25C . CTE Below Tg/Above Tg (in/in/C): 43 x 10 -6/175 x 10 -6 Pot Life (@-Room Temp.): 3-4 days Shelf Life (0 Room Temp.): 1 yr.
Conductive Compounds
369
EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies Microelectronic Grade: Silver Filled Elevated Temp. Cure (Continued): H20F: No. of Components: Two Shore D Hardness: (50 Cure Temperature: 15OC-10 min. IOOC-60 min. Volume Resistivity (ohm-cm): 0.0002-0.0004 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg (Typical) 15OC/l hr Cure: Sub-Ambient Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: N/A Viscosity @ 25C cps: 20,000 TGA Degradation Temp.: 400C Pot Life (8 Room Temp.): 3-4 days Shelf Life (8 Room Temp.): 1 yr. H20S: No. of Components: Two Shore D Hardness: 75 Cure Temperature: 15OC-5 min. IOOC-90 min. Volume Resistivity (ohm-cm): 0.0001-0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 80C Max. Oper. Temp. Continuous C: 150 Max. ODer. TemD. Intermittent C: 300 Lap Shear Strength psi @ RT: 1500 Viscosity @ 25C cps: 15,000-20,000 TGA Degradation Temp.: 425C CTE Below Tg/Above Tg (in/in/C): 75 x 10 -6/170 x 10 -6 Pot Life (@ Room Temp.): 3-4 days Shelf Life (@ Room Temp.): 1 yr. H31: No. of Components: One Shore D Hardness: 80 Cure Temperature: 15OC-30 min. 12OC-60 min. Volume Resistivity (ohm-cm): 0.0001-0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tq 15OC/l hr Cure: 80C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent: 300-400 Lap Shear Strength psi @ RT: 1000 Viscosity @ 25C cps: 45,000-50,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 61 x 10 -61152 x 10 -6 Shelf Life (8 Room Temp.): 6 mo.
370
Adhesives, Sealants and Coatings for the Electronics Industy
EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies - Microelectronic Grade: Silver Filled Elevated Temp. Cure (Continued): H31D: NO. of Components: One Shore D Hardness: 65 Cure Temperature: ISOC-30 min. 12OC-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.5 Tg 15OC/l hr Cure: 95C Max. Oper. Temp. Continuous C: 150 Max. ODer. TenID. Intermittent C: 300-350 Lap Shear Strength psi @ RT: 1000 Viscosity 8 25C cps: 120,000-150,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 41 x 10 -6/140 x 10 -6 Shelf Life (8 Room Temp.): 6 mo. H35-175MP: MIL-STD 883, 5011 No. of Components: One Shore D Hardness: 80 Cure Temperature: 18OC-1 hr. 165C-1.5 hr. Volume Resistivity (ohm-cm): 0.00007-0.0003 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 8OC 180C/l80C/cure Max. Oper. Temp. Continuous C: 175 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 2000 450 @ 2ooc Viscosity 8 25C cps: 45,000 TGA Degradation Temp.: 350C CTE Below Tg/Above Tg (in/in/C): 40 x 10 -6/165 x 10 -6 Shelf Life (@ Room Temp.): >6 mo.
Conductive
Compounds
371
EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies Microelectronic Grade: Silver Filled Room Temp. Cure: 410E: No. of Components: Two Shore D Hardness: 70 Cure Temperature: RT-2-3 days 15OC-30 min. Volume Resistivitv (ohm-cm): 0.0001-0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 75C Max. Oper. Temp. Continuous: C: 150-heat cure 125-RT cure Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 1000 150 @ 2ooc Viscosity @ 25C cps: 25,000 TGA Degradation Temp.: 380C CTE Below Tg/Above Tg (in/in/C): 59 x 10 -6/179 x 10 -6 Pot Life (@ Room Temp.): 8 hrs. Shelf Life (@ Room Temp.): 1 yr. 41oLv: No. of Components: Two Shore D Hardness: 60 Cure Temperature: RT-2-3 days 15OC-30 min. Volume Resistivitv (ohm-cm): 0.001 to 0.003 Thermal Conductivity (BTU in/ft 2 hrF): 6.0 Tg 15OC/l hr Cure: 70C Max. Oper. Temp. Continous C: 150-heat cure 125-RT cure Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 1000 Viscosity @ 25C cps: 15,000 TGA Degradation Temp.: 380C CTE Below Tg/Above Tg (in/in/C): 61 x 10 -6/180 x 10 -6 Pot Life (@ Room Temp.): 8 hrs. Shelf Life (@ Room Temp.): 6 mo.
372
Adhesives, Sealants and Coatings for the Electronics Industry
EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies Microelectronic Grade: Silver Filled Room Temp. Cure (Continued): 415G: No. of Components: Two Shore D Hardness: 70 Cure Temuerature: 3 hr. R RT Tack Free Volume Resistivity (ohm-cm): 24 hr. Rt cure: 0.0007 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg lSOC/l hr Cure: 54C Max. Oper. Temp. Continuous C: 150-Heat cure 125-RT cure Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 1000 Viscosity @ 25C cps: >200,000 TGA Degradation Temp.: 350C CTE Below Tg/Above Tg (in/in/C): 60 x 10 -6/190 x 10 -6 Pot Life (a Room Temp.): 30 min. Shelf Life (@ Room Temp.): 6 mo. Gold Filled Elevated Temp. Cure: H43: No. of Components: One Shore D Hardness: 85 Cure Temperature: 15OC-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 12.0 Tg 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 2000 Viscosity @ 25C cps: >200,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 35 x 10 -61120 x 10 -6 Shelf Life (@ Room Temp.): 6 mo.
Conductive Compounds
373
EPOXY TECHNOLOGY INC.: EPO-TEK Electically Conductive Epoxies Microelectronic Grade: Gold Filled Elevated Temp. Cure (Continued): H44: No. of Components: One Shore D Hardness: 86 Cure TemDeratUre: 15OC-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0005 Thermal Conductivity (BTU injft 2 hrF): 12.0 Tu 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-350 Lap Shear Strength psi @ RT: 2000 Viscosity @ 25C cps: >200,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 32 x 10 -6/125 x 10 -6 Shelf Life (8 Room Temp.): 6 mo. H81E: No. of Components: Two Shore D Hardness: A80 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 0.0004 to 0.0008 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 1OOC Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1300 Viscositv B 25C CDS: >200.000 TGA Degradation Temp.: 4lUC CTE Below Tg/Above Tg (in/in/C): 45 x 10 -6/140 x 10 -6 Pot Life (@-Room Temp.): 3 day Shelf Life (a Room Temp.): 1 yr.
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Adhesives, Sealants and Coatings for the Electronics Industry
Electrically Conductive Epoxies TECHNOLOGY INC.: EPO-TEK Microelectronic Grade: Pd:Ag Filled Elevated Temp. Cure:
EPOXY
H32C: (Black Opaque) No. of Components: One Shore D Hardness: 80 Cure Temperature: 15OC-30 min. Volume Resistivitv (ohm-cm): 0.002 to 0.004 Thermal Conductivity (BTU in/ft 2 hrF): 14.7 Tq 15OC/l hr Cure: 9OC Mix. ODer. TemD. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 2000 Viscosity @ 25C cps: 150,000 TGA Degradation Temp.: 400C CTE Below Tg/Above TG (in/in/C): 50 x 10 -6/135 x 10 -6 Shelf Life (8 Room Temp.): 6 mo. H32E: (Black Opaque) No. of Components: Two Shore D Hardness: 75 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 0.001 to 0.003 Thermal Conductivity (BTU in/ft 2 hrF): 12.0 Tg 15OC/l hr Cure: 55C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1500 Viscositv (a 25C CDS: 250.000 TGA Degradation Temp.: 4iOC CTE Below Tq/Above Tq (in/in/C): 45 x 10 -6/155 x 10 -6 Pot Life (@-Room Temp.): 2 days Shelf Life (@ Room Temp.): 1 yr.
Conductive
Compounds
EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating - Microelectronic Grade: Alumina Filled Elevated Temp. Cure: H7OE: No. of Components: 2 Shore D Hardness: 88 Cure Temperature: ISOC-5 min. Volume Resistivity (ohm-cm): 1.5 x 10 13 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg lSOC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 150 Max. Ooer. Temo. Intermittent C: 300-400 Lap Shiar Strength (psi): 1200 Viscosity @ 25C CPS: 20,000 TGA (Degradation Temp.)i 410C CTE Below Tg/Above Tg (in/in/C): 52 x 10 -6/175 x 10 -2 Pot Life @ Room Temp.: 4 days Shelf Life @ Room Temp.: 1 yr. H70E-2: No. of Components: 2 Shore D Hardness: 75 Cure Temperature: 15OC-5 min. Volume Resistivitv (ohm-cm): 1.0 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tq 15OC/l hr Cure: 8OC Max. Oner. TemD. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength (psi): 1300 Viscosity @ 25C cps: 30,000 TGA (Degradation Temp.): 425C CTE Below Tg/Above Tg (in/in/C): 46 x 10 -6/170 x 10 -6 Pot Life @ Room Temp.: 4 days Shelf Life @ Room Temp.: 1 yr. H70E-4: No. of Components: 2 Shore D Hardness: 80 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 1.0 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg 15OC/l hr Cure: 70C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1150 Viscosity @ 25C cps: 115,000 TGA (Degradation Temp.): 415C CTE Below Tg/Above Tg (in/in/C): 55 x 10 -6/185 x 10 -6 Pot Life @ Room Temp.: 4 days Shelf Life @ Room Temp.: 1 yr.
375
376
Adhesives, Sealants and Coatings for the Electronics Industry
EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating - Microelectronic Grade (Continued): H70S: No. of Components: 2 Shore D Hardness: 85 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 1.5 x 10 13 Thermal Conductivity (BTU in/ft 2 hrF): 8.0 To 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 150 Max. Ooer. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1200 Viscosity 8 25C cps: 15,000 TGA (Degradation Temp.): 410C CTE Below Tg/Above Tg (in/in/C): 50 x IO -6/170 x IO -6 Pot Life @ Room Temp.: 4 days Shelf Life 8 Room Temp.: 1 yr. H72: No. of Components: 2 Shore D Hardness: 81 Cure Temperature: 15OC-10 min. Volume Resistivity (ohm-cm): 2.5 x 10 15 Thermal Conductivity (BTU in/ft 2 hrF): 6.0 Tg 15OC/l hr Cure: 125C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 2500 Viscosity @ 25C cps: 40,000-60,000 TGA (Degradation Temp.): 420C CTE Below Tg/Above Tg (in/in/C): 42 x 10 -6/110 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr. H74: No. of Components: 2 Shore D Hardness: 94 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 2.5 x 10 15 Thermal Conductivity (BTU in/ft 2 hrF): 7.6 Tg 15OC/l hr Cure: 125C Max. Oper. Temp. Continuous C: 150 Max. Ooer. Temo. Intermittent C: 300-400 Lap Shear Strength (psi): 2500 Viscosity 8 25C cps: 70,000-100,000 TGA (Degradation Temp.); 400C CTE Below Tg/Above Tg (in/in/C): 30 x 10 -6/110 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr.
Conductive Compounds
377
EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating - Microelectronic Grade (Continued): Alumina Filled Elevated Temp. Cure (Continued): H77: No. of Components: 2 Shore D Hardness: 92 Cure Temperature: 15OC-30 min. Volume Resistivity (ohm-cm): 1 x 10 16 Thermal Conductivity (BTU in/ft 2 hrF): 6.0 Ts 15OC/l hr Cure: 95C Max. Oper. Temp. Continuous C: 200 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 2700 Viscositv (a 25C CDS: 15,000 TGA (De$adation ;femp.)I 430C CTE Below Tg/Above Tg (in/in/C)): 29.5 x 10 -6/100 x 10 -6 Pot Life @ Room Temp.: 24 hrs. Shelf Life @ Room Temp.: 1 yr. H61: No. of Components: 1 Shore D Hardness: 76 Cure Temnerature: 15OC-30 min. Volume Rkistivity (ohm-cm): 1 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 7.0 Tg 15OC/l hr Cure: 35C Max. Oper. Temp. Continuous C: 160 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1000 Viscosity @ 25C cps: 70,000 TGA (Degradation Temp.): 400C CTE Below Tg/Above Tg (in/in/C): 79 x 10 -6/171 x 10 -6 Shelf Life @ Room Temp.: 6 mo. H62: No. of Components: 1 Shore D Hardness: 76 Cure Temnerature: 15OC-30 min. Volume Resistivity (ohm-cm): 1 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 7.0 Tg 15OC/l hr Cure: 7OC Max. Oper. Temp. Continuous C: 160 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1000 Viscosity @ 25C cps: 30,000 TGA (Degradation Temp.): 400C CTE Below Tg/Above Tg (in/in/C): 50 x 10 -6/140 x 10 -6 Shelf Life @ Room Temp.: 6 mo.
378
Adhesives, Sealants and Coatings for the Electronics Industry
EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating-Microelectronic Grade (Continued): Alumina Filled Elevated Temp. Cure (Continued): H65-175MP: MIL-STD 883C, 5011 No. of Components: 1 Shore D Hardness: 85 Cure Temperature: 18OC-1 hr. Volume Resistivity (ohm-cm): 1 x 10 13 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg 15OC/l hr Cure: 9OC/155C Max. Oper. Temp. Continuous C: 175 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength (psi): 2000 Viscosity @ 25C cps: 50,000 CTE Below Tg/Above Tg (in/in/C): 55 x 10 -6/165 x 10 -6 Shelf Life @ Room Temp.: 6 mo. Insulating Elevated Temperature Cure: H54: No. of Comnonents: 2 Shore D Hardness: 70 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 5.0 x 10 15 Tg 15OC/l hr Cure: 9OC Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 2000 Viscosity @ 25C cps: 160,000 TGA (Degradation Temp.): 410C CTE Below Tg/Above Tg (in/in/C): 45 x 10 -6/145 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr. H55: No. of Components: 2 Shore D Hardness: 70 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 3.0 x 10 15 Ta 15OC/l hr Cure: 9OC Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 200-300 Lap Shear Strength (psi): 3000 Viscosity @ 25C cps: 250,000 TGA (Degradation Temp.): 410C CTE Below Tg/Above TG (in/in/C): 40 x 10 -6/135 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr.
Conductive Compounds
FURANE
PRODUCTS:
379
EPIBOND Electrically Conductive Epoxy Adhesives:
EPIBOND 7002M: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD-883C Method 5011 requirements * 100% solids system, very low outgassing * Extremely hish ouritv, low corrosion tendency * Less than 5 ppm‘each-of Na, K, NH4, Fe, Cl, Br * Designed for stamping/pin transfer applications (other grades available) EPIBOND 7002-50M: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD-883C, Method 5011 requirements * Extremely high purity, very low corrosion tendency * Less than 10 ppm each of Na, K, NH4, Fe, Cl, Br * 100% solids/low outgassing * Designed for syringe dispensing (other grades available) EPIBOND 7002-100M: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD-883C Method 5011 requirements * Extremely high purity, low corrosion tendency * Less than 10 ppm each of Na, K, NH4, Fe, Cl, Br * 100% solids system, very low outgassing * Designed for screen printing applications (other grades available) FLEXBOND 7007-50M: Features/Benefits: Low bleed out, increased productivity capability Gold filled High purity, low corrosion tendency Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br 100% solids, low outgassing Viscosity can be factory adjusted for alternative application techniques EPIBOND 7015: Features/Benefits: * High purity * Long pot and shelf life * Silver filled * 100% solids * Viscosity can be factory adjusted for alternative application techniques
380
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: URALANE Thermal Transfer Adhesives: URALANE 7760: Features/Benefits: * Excellent thermal shock resistance giving improved reliability * High purity and very low outgassing (meets NASA requirements) * Easily reworkable * Excellent hydrolytic stability * High thixotropylnon slump capability offering excellent process control * Good thermal conductivity * Automatically dispensible offering reduced handling and improved production output URALANE 7762: Features/Benefits: Excellent thermal shock resistance giving improved reliability High purity and very low outgassing (meets NASA requirements) Easily reworkable Excellent hydrolytic stability High thixotropyfnon slump capability offering excellent process control Good thermal conductivity Controlled bondline thickness (5 mil) Automatically dispensible offering reduced handling and improved production output URALANE 7764: Features/Benefits: Excellent thermal shock resistance giving improved reliability High purity and very low outgassing (meets NASA requirements) Easily reworkable Excellent hydrolytic stability High thixotropy/non slump capability offering excellent process control in robotic and automatic dispense equipment Good thermal conductivity Excellent resistance to fungal growth
Conductive Compounds
381
FURANE PRODUCTS: URALANE Thermal Transfer Adhesives (Continued): URALANE 7765: Features/Benefits: Excellent thermal shock resistance giving improved reliabilitv High purity Non-foaming, low outgassing (meets NASA requirements) Reduced iunction temperature of bonded devices Easily reworkable High surface tension which facilitates flow under components Resistant to l,l,l - trichloroethane and trichlorotrifluoroethane Excellent hydrolytic stability URALANE 7766: Features/Benefits: * Low dielectric constant * High thixotropy/non slump capability * Easily reworked * Excellent thermal shock resistance * High purity and very low outgassing * Good thermal conductivity * Resistant to PWB cleaning solvents URALANE 7768: Features/Benefits: Excellent thermal shock resistance giving improved reliability High purity Non-foaming, low outgassing (meets NASA requirements) Reduced junction temperature of bonded devices Easily reworkable High surface tension which facilitates flow under components Resistant to l,l,l - trichloroethane and trichlorotrifluoroethane Excellent hydrolytic stability
382
Adhesives, Sealants and Coatings for the Electronics Industry
KEY POLYMER CORP.: Epoxy Products: Conductive Adhesives: C4-208A/B: Two component, 100% solids, silver filled epoxy adhesive Type: Silver, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C, or 2 hrs. @ 65C, or 1 hr. @ 1ooc Consistency: Low Viscosity Paste Specific Gravity: 2.80 Storage Informnation: Store @ room temp. up to 1 year in sealed containers Comments: Volume resistivity: 0.001 ohm-cm. High strength. Good heat resistance. C4-214: One component silver filled epoxy adhesive Type: Silver, one part, heat cure Cure Schedule: 5 min. @ 18OC, or 15 min. @ IOOC, or 90 min. @ 125C Consistency: Viscous Paste Specific Gravity: 3.34 Storage Information: Store @ 0 for up to 6 months in sealed container Comments: Lower cost. Recommended when premium conductivity is not required. Good chemical resistance. Excellent adhesion. C6-234A/B: Silver Filled Sprayable Adhesive Type: Silver, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C, or 1 hr. @ 65C Consistency: Sprayable Liquid Specific Gravity: 1.70 Storage Information: Store @ room temp. up to 6 months in sealed containers Comments: Volume Resistivity: 0.005 ohm-cm. Contains solvent EA1017: One component, silver filled, die attach adhesive Type: Silver, one part, heat cure Cure Schedule: 1 hr. @ 15OC. or l/2 hr. @ 175C Consistency: Thixotropic Paste Specific Gravity: 2.50 Storage Information: Store @ OC up to 6 months in sealed containers Comments: Low levels of extractable ionic impurities. Volume resitivity: 0.0001 ohm-cm
Conductive Compounds
383
MAGNOLIA PLASTICS, INC.: Conductive Adhesives: MAGNOLIA 3870: Compound 3870 is a two part electrically conductive adhesive formulated to meet the requirements of MPD-9148B. Special Features: This unique, silver-filled, epoxy was formulated to give better tensile strength and lower resistance values than other traditional silver-filled systems. Properties: Color: A: Tan B: Amber Mix: Tan Viscosity: A: Paste B: Fluid Mix: Semi-Paste Specific Gravity: A: 1.7 B: 1.0 Mix: 1.6 SPI Classification: A: 4 Mix Ratio: Parts by ziiiht: 100/4 Cure Schedule: 24 hours at room temperature Pot Life: 60 minutes MAGNOBOND 8000: MAGNOBOND 8000 is a two part electrically conductive epoxy adhesive system. Special Features: 1. High silver loading assures high conductivity. 2. Low viscosity. Despite its high percentage of silver, 8000 has a smooth, fluid consistency for ease of application. Properties: Mix Ratio: 100 Parts by weight "A" 3 Parts by weight "B" Pot Life, 1OOcc at 25C: 30 minutes Flash Point: Part A: >lOOC Part B: >lOOC ANSI Classification: Part A: 4 Part B: 4 Silver Content, per cent: 80 Lap Shear Strength, psi, 23C: 1500 Cure Schedule: 1 to 2 davs at 25C or 1 to 2 hours at 7OC-9OC Volume Resistivity, ohm-cm, 25C: 4.32 x 10 -4 Volume Resistivity, ohm-cm, Condition 72 hours at 1OOC: 1.47 x 10 -4
384
Adhesives, Sealants and Coatings for the Electronics Industv
MAGNOLIA PLASTICS, INC.: Conductive Adhesives (Continued): MAGNOBOND 8001: MAGNOBOND 8001 is a single component silver-filled epoxy for chip bonding. Special Features: 1. This system will "B Stage" through solvent evaporation to form a solid adhesive casting for bonding at a later time. 2. 8001 has outstanding high purity characteristics. 3. The high electrical conductivity of 8001 remains essentially unchanged even after 200 hours at ZOOC. Special Note: Compound 8001 has excellent reflow properties from "B" stage and once cured has outstanding high temperature strength. In order to get the best hot strength it is important that the solvent be evaporated prior to bonding. Wet film thickness should be controlled to .005-.008 cm and "B" stage should be 30 minutes at 65C. This schedule gets the solvent out without advancing the resin to the point of poor reflow. Properties: Cure Schedule: "B Staqe" for 30 minutes at 65C. Cure - 15 to 30 seconds at 230C for, high soeed nroduction or 1 to 2 hours at 125-i5OC: . Volume Resistivity, ohm-cm: 9.7 x 10 -4 % Solids: 85 % Silver-Dry Film: 70 MAGNOBOND 8002: MAGNOBOND 8002 is a conductive epoxy adhesive system designed for applications requiring low ionic contamination and high electrical conductivity. Special Features: 1. This product is based upon 100% reactive epoxy resins and contains no solvents. 2. Compound 8002 is made from high epoxy resins __ purity___ and-silver flakes. 3. Low viscosity. Despite the high silver content, 8002 is very fluid. 4. Cure temperatures as low as 125C have been used where excessive heat can damage sensitive components. Properties: Cure Schedule: 1 to 2 hours at 125-175C Specific Gravity: 4.0 Viscosity: 35,000 cps Silver Content: 70% Volume Resistivity, ohm-cm: 1.0 x 10 -3 Weight Loss, %, 168 hours 8 180C: 0.07 1000 hours @ 180C: .28 Lap Strength, psi, ASTM D 1002, 23C: 2000
Conductive Compounds
385
MAGNOLIA PLASTICS, INC.: Conductive Adhesives (Continued): MAGNOBOND 8003: MAGNOBOND 8003 is a single component epoxy adhesive system designed to have a high degree of electrical conductivity, outstanding thermal resistance and low levels of ionic contamination. Special Features: 1. Low ionic concentration. Each batch is checked using an ion chromatograph. 2. High Tg. MAGNOBOND 8003 is made from highly purified, temperature resistant epoxy resins and curing agents. Weight loss values are low even after 1000 hours at 18OC. 3. 100% Reactive. There is no solvent to evaporate from dispensing tanks and, therefore, no viscosity drift during application. With no volatiles released during cure, void density in the cured film is low. Properties of Uncured Material: Specific Gravity: 3.3 Viscosity at 23C: 80,000 cps SPI Classification: 2 Flash Point: >lOOC Suggested Cure Schedule: 1 to 3 hours at 15OC to 200C Properties of Cured Material: Volume Resistivity: 1.8 x 10 -4 ohms-cm Shear Strength, psi, ASTM D1002, 23C: 1900 Wt. Loss, Percent, ASTM D794: After 168 hours at 18OC: -0.24 After 1000 hours at 18OC: -0.59 MAGNOBOND 8004: MAGNOBOND 8004 is a two part epoxy adhesive designed to have a high degree of electrical conductivity. Special Features: 1. Adhesive strength exceeds 2000 psi with only a 24 hour room temperature cure. 2. Pot Life >4 hours at 25C 3. Volume Resistivity of 3.0 x 10 -3 ohm-cm Properties: Mix Ratio: 100 parts by weight "A" 92 parts by weight "B" Cure Schedule: 1 hour at 125C-175C or 24 hours at 23C Pot Life - 100 cc at 25C: >4 hours ANSI Classification: 4 Volume Resistivity, ohm-cm: 3.0 x IO -3 Lap Shear Strength, psi, ASTM D-1002, Cured 24 hours at 23C: 2100
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Adhesives, Sealants and Coatingsfor the Electronics Industry
MAGNOLIA PLASTICS, INC.: Conductive Adhesives (Continued): MAGNOLIA 8005: MAGNOLIA 8005, A and epoxy adhesive designed and good adhesion. This lined in Drawing Number
B is a two part 100% silver filled to have high electrical conductivity material meets the requirements outA3049246.
Properties: Mix Ratio: 100 parts by weight A to 57 parts by weight B Cure Schedule: 24 hours at 75F or 30 minutes at 210F Viscosity @ 77F: A: Compound - Paste B: Curing Agent - Paste Mix - Paste SPI Classification: A: 4 B: 4
Conductive Compounds
387
MAVIDON CORP.: Adhesives: 1135 Heat Sink Adhesive: MAVIDON system 1135 is a two component, thermally conductive heat sink adhesive specifically formulated for the semi conductor industry. 1135 offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. Physical Characteristics: 1135 A: Appearance: Black Paste Specific Gravity: 2.28 Shelf Life: 1 year Viscosity @ 25C (77F): 700,000 cps 1135 B: Appearance: Amber Liquid Specific Gravity: 1.0 Shelf Life: 1 year Viscosity @ 25C (77F): 30 cps Mix Ratio: By weight: 100 parts 1135A to 7.5 parts of 1135B Cure Schedule: 24 hrs at room temperature or 2 hours at 60C (14OF) rpical Cured Characteristics: Thermal Coefficient of Expansion: 22 x 10 -6 in/in/C Tensile Strength: 8,500 psi Heat Distortion Temperature: 55C Linear Shrinkage (in/in): .0015 Hardness: 75 Shore D Volume Resistivity: 1 x 10 16 ohm-cm Dielectric Strength: 425 volts/mil Thermal Conductivity: 10 (BTU/Ft Z/hr/F/in) 1216 A/B Flameout Adhesive: MAVIDON system 1216 A/B is a dark grey, thixotropic, two component adhesive that cures at room temperature and will not sag or flow during cure. Cured 1216 meets the flame retardant properties of UL94VO.
388
Adhesives,
Sealants
and Coatings for the Electronics
Industry
MAVIDON CORP.: Electrically Conductive Products: C 368-l Conductive Adhesive: MAVIDON C 368-l A/B is a two component, carbon/silver filled room temperature curing epoxy adhesive. 368-l features improved electrical and thermal conductivity. Physical Characteristics: c 368-1A: Appearance: Black Paste Viscosity: Thixotropic Specific Gravity: 1.55 C 368-1B: Appearance: Amber Liquid Viscosity: 300 cps Specific Gravity: 1.04 Mix Ratio: 100 parts 368-1A to 11 parts 368-IB. Pot Life: 30 minutes in a 100 gram mass. Cure Schedule: Parts can be handled and shipped after room temperature cure for 10 hours. Ultimate properties are reached after 24 hours at room temperature. C 865 Conductive Ink: MAVIDON C 865 is a water based one component, carbon filled, screen printable polymer featuring long open time and excellent adhesion to mylar. Physical Characteristics: ADDearanCe: Black Paste Specific Gravity: 1.0 Viscosity at 25C (77F): 50,000 cps Shelf Life at 25C (77F): 1 year Cure Schedule: 1 hour at 65C or 10 minutes at 1OOC Typical Cured Characteristics: Volume Resistivity: 3 ohm-cm Sheet Resistivity: 1200 ohm/sq Coverage (1 mil): 60 in Z/gram
Conductive Compounds
MAVIDON CORP.: Electrically Conductive Products (Continued): D 600 Dielectric: MAVIDON D 600 is a one component, silk screenable dielectric ink featuring a ready to use viscosity and a low temperature cure schedule. D 600 exhibits excellent adhesion to such substrates as mylar and offers good flexibility. Physical Characteristics: Appearance: Blue Liquid Viscosity (TB at 5 rpm): 10,000 cps Specific Gravity: 1.1 Shelf Life @ 25C (77F): 1 year Cure Schedule: 1 hour at 65C, or 10 minutes at 1OOC Typical Cured Characteristics: Volume Resistivity: 1 x 10 15 ohm-cm G 170 Resistive Ink: MAVIDON G 170 is a one component, carbon filled, screen printable polymer featuring long open time and excellent adhesion to mylar. G 170 was specificaly formulated for membrane switch circuitry. Physical Characteristics: Appearance: Black Liquid Specific Gravity: 1.0 Viscosity at 25C (77F): 25,000 cps Shelf Life at 25C (77F): 1 year Cure Schedule: 1 hour at 65C or 10 minutes at 100 C Typical Cured Characteristics: Volume Resistivity: 2 ohm-cm Sheet Resistivity: 800 ohm/sq Coverage: 25 in Z/gram, 1 mil thick
389
390
Adhesives, Sealants and Coatings for the Electronics Industry
MAVIDON CORP.: Electrically Conductive Products (Continued): K 26 A/B Conductive Ink: MAVIDON system K 26 is a two component, heat cured, silver filled conductive ink specifically formulated for screen printed circuitry. K 26 features excellent abrasion resistance, very high electrical conductivity and good adhesion to a variety of substrates. Physical Characteristics: K 26 “A” : Appearance: Silver Syrup Viscosity: 17,000 cps Specific Gravity: 2.8 K 26 "B": Appearance: Amber Liquid Viscosity: 120 cps Specific Gravity: 1.0 Mix Ratio: 100 parts K 26 "A" to 1.5 parts K 26 "B" by weight. Pot Life: 48-72 hours in a 100 gram mass at 25C. Cure Schedule: The length of cure will vary with the curing temperature. System K 26 can be cured at any of the following temperatures: 8OC: 2 hours 1OOC: 1 hour 125C: 15 minutes 15oc: 5 minutes Typical Cured Characteristics: Sheet Resistivity: Less than .lO ohm/sq/mil Coverage: 148 cm Z/gm/mil (wet film thickness)
Conductive Compounds
391
MAVIDON CORP.: Electrically Conductive Products (Continued): K 26-2/CA 3 Conductive Epoxy: MAVIDON System K 26-2/CA 3 is a two component, heat cured conductive epoxy with extremely long pot life. The cured system has excellent adhesion to mylar and other plastic substrates, good electrical conductivity, excellent abrasion resistance and is crease resistant. K 26-2/CA 3 is designed for thin (less than 2 mil) coatings for shielding and grounding applications. It is also used for conductive paths on matrix boards. Physical Characteristics: K 26-2: Aoaearance: Silver Liauid Viscosity @ 25C (77F)i 35,000 cps Specific Gravity @ 25C (77F): 2.8 Shelf Life @ 25C (77F): 6 months CA 3: Appearance: Amber Liquid Viscositv a 25C: 120 CDS Specific*Gravity @ 25C‘(77F): 1.0 Shelf Life @ 25C (77F): 6 months Mix Ratio: By weight: 100 parts K 26-2 to 1.5 parts CA 3 Mixed viscosity @ 25C (77F): 32,000 cps Pot Life: >48 hours in 200 gram mass @ 25C (77F) Can be extended to several days by refrigeration Cure Schedule: 2 hours a 80C (176F) or 1 hour @-1OOC (212F) or 15 minutes 8 125C (257F) Typical Cured Characteristics: Volume Resistivity ohm-cm: Less than .OOlO Note: Material may be used as supplied. If a lower vicosity is desired, thin with Butyl Cellosolve Acetate.
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Adhesives, Sealants and Coatings for the Electronics Industry
MAVIDON
cow.:
Electrically Conductive Products (Continued):
K 27 Conductive Adhesive: MAVIDON K 27 is a 100% solid, silver filled two component epoxy adhesive which can be cured at ambient or elevated temperatures. K 27 features aood electrical and thermal conductivity, high strength, and_ heat resistance after cure. Originally formulated for antennae bonding, K 27 has also been successfully used in lead attach and RF shielding applications. Physical Characteristics: K 27 A: Appearance: Silver Cream Viscosity @ 25C (77F): Soft Paste Specific Gravity: 3.49 Shelf Life @ 25C: 6 months K 27 B: Appearance: Water White Liquid Viscosity @ 25C (77F): 450 cps Specific Gravity: 1.01 Shelf Life @ 25C: 6 months Mix Ratio: 100 parts K 27 A to 6 parts K 27 B by weight. Pot Life: 1 hour in a 20 gram mass at 25C (77F). Cure Schedule: 24 hours at room temperature or
1
hour at 1OOC (212F)
Typical Cured Characteristics: Hardness: 82D Volume Resistivity (cured at 25C): 0.20 ohm-cm (after 2 hours at 65C): .02 ohm-cm Tensile Strength: 1,600 psi min Thermal Conductivity [cal x cm/ (set x cm 2 x Cl: 28 x 10 -4 K 29-2 Conductive Adhesive: MAVIDON K 29-2 is a two component, silver filled epoxy adhesive featuring room temperature cure and exceptional adhesive strength. MAVIDON K 29-2 exhibits good electrical and thermal conductivity. Physical Characteristics: K 29-2A: Appearance: Silver Paste Specific Gravity: 3.6 Viscosity @ 25C (77F): 500,000 cps Shelf Life @ 25C (77F): 1 year K 29-2B: Appearance: Amber Liquid Specific Gravity: 1.0 Viscosity @ 25C (77F): 14,000 cps Shelf Life @ 25C (77F): 1 year
Conductive Compounds
393
MAVIDON CORP.: Electrically Conductive Products (Continued): K 29-2 Conductive Adhesive (Continued): Mix Ratio: 100 parts K 29-2A to 15 parts K 29-2B by weight. Pot Life: 40 minutes in a 100 gram mass @ 25C (77F). Cure Schedule: Cure at room temperature for 24 hours or 15 minutes @ 71C (160F). Typical Cured Characteristics: Volume Resistivitv: Less than .Ol ohm-cm Shore D Hardness;-79 Tensile Strenqth: 1,600 psi min (Al-Al) Shrinkage (5%i: 0.3 Thermal Conductivity [cal x cm/ : 25 x 10 -4 (set x cm 2 x Cl1 K 31 A/B Conductive Adhesive: MAVIDON K 31 is a two component silver filled epoxy adhesive featuring an easy 1:l mix ratio that cures at room temperature. Physical Characteristics: K 31 A: Appearance: Silver Paste Viscosity: Thixotropic Specific gravity: 3.6 Shelf Life @ 25C (77F): 6 months K 31 B: Appearance: Silver Paste Viscosity: Thixotropic Specific gravity: 3.2 Shelf Life @ 25C (77F): 6 months Mix Ratio: 100 parts K 31 A to 100 parts K 31 B by weight. Pot Life: 30 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: Cure time is dependent upon mass of the mixed material as epoxy compounds must generate their own heat for cure. Typical Cures Characteristics: Hardness: 78 D Volume Resistivity: Less than .OOl ohm-cm Thermal Expansion Coefficient (in/in F): 1.7 x 10 -5 Thermal Strength (Al-Al): 1,800 psi
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Adhesives, Sealants and Coatings for the Electronics Industry
MAVIDON CORP.: Electrically Conductive Products (Continued): K 30 Conductive Adhesive: MAVIDON K 30 is a two component, room temperature cure epoxy adhesive featuring excellent electrical and thermal conductivity. K 30 provides good adhesion to a variety of substrates including glass and most plastics. Physical Characteristics: j8 A: Appearance: Silver cream Viscosity @ 25C (77F): 14,000 cps Specific Gravity: 3.1 Particle Size: .4 microns Shelf Life 8 25C (77F): 1 year 38 B: Aooearance: Clear Liquid Viscosity @ 25C (77Fj: 30 cps Specific Gravity: .96 Particle Size: 0 Shelf Life @ 25C (77F): 1 year Mix Ratio: 100 parts K 38 A to 2.7 parts K 38 B. Pot Life: 30 minutes at 25C (77F) in a 100 gram mass. Cure Schedule: 24 hours at room temperature or 1 hour at 65C (149F) Typical Cured Characteristics (1 hour at 65C): Volume Resistivity: Less than .OOl ohm-cm Tensile Strength (Al-Al): 1500 psi min. Operating Range: -50C to +15OC Thernal Expansion Coefficient: 42 x 10 -6/C K-134 Conductive Adhesive: MAVIDON K-134 is a one component, heat cured conductive adhesive. K-134 features high electrical and thermal conductivity and cures quickly at temperatures as low as 125C. Fully cured, K-134 is non-bleeding, non-corrosive, and contains no fluorides. Phvsical Characteristics: Appearance: Smooth Silver Paste Viscosity at 25C: 300,000 +- 30,000 cps Soecific Gravity: 3.3 Cure‘Schedule: At 125C: 60 minutes At 150C: 30 minutes At 200C: 2 minutes Typical Cured Characteristics: Volume Resistivity - at 25C: .OOl ohm-cm max at 155C: -001 ohm-cm max Tensile Strength: 1,300 psi min.
Conductive Compounds
395
MAVIDON CORP.: Electrically Conductive Products (Continued): K 149-2 Conductive Adhesive: MAVIDON K 149-2 is a one component, heat-cured silver-filled conductive adhesive. K 149-2 features hiqh electrical and thermal conductivity and high shear strength, and high temperature resis both non-bleeding and non-corrosive. Applicaistance. K 149-2 tions include electronics assembly that requires high tensile strength and good impact. Physical Characteristics: Appearance: Smooth, Silver Paste Viscosity at 25C (77F): 150,000 cps Specific Gravity: 3.3 Thixotropic Index: 3.2 Shelf Life @ 25C (77F): 6 months @ OC (32F): 1 year Cure Schedule: At 150C (302F): 30 minutes * At 125C (257F): 90 minutes * Longer cure times, or post cures, will generally improve the glass transition temperature. Tvoical Cured Characteristics: --Volume Resistivity @ 25C (77F): <0.0008 ohm-cm Tensile Strength: 1,500 psi min. Shore Hardness: 84D Operating Temperature: -55 to 150C KLI 159 Conductive Adhesive: MAVIDON KLI 159 is a one component, heat-cured, silver-filled conductive adhesive. KLI 159 features high electrical and thermal conductivity, high shear strength, and high temperature resistance. KLI 159 is both non-bleeding and non-corrosive. Applications include die bonding and other electronic assembly that requires low ionic contamination. Physical Characteristics: Appearance: Smooth, Silver Paste Viscosity @ 25C (77F): 150,000 cps Specific Gravity: 3.3 Thixotropic Index: 3.2 Shelf Life @ 25C (77F): 3 months @ OC (32F): 12 months
396
Adhesives,
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MAVIDON CORP.: Electrically Conductive Products (Continued): KLI 159 Conductive Adhesive (Continued): Cure Schedule: At 15OC (302F): 30 minutes* At 125C (257F): 60 minutes * Longer cure times, or post cures, will generally improve the glass transition temperature. Typical Cured Characteristics: Volume Resistivity @ 25C:
Conductive Compounds
397
MAVIDON CORP.: Electrically Conductive Products (Continued): K 206 Conductive Coating: MAVIDON K 206 is a silver filled thermoplastic resin solution for injection molded plastic surfaces featuring high electrical conductivity. Uses include coatings on wave guides, radio frequency deflectors, radar dishes and radio frequency shielding. Physical Characteristics: Anoearance: Silver Liauid Viscosity at 25C (77Fj: 150 centipoise Specific Gravity @ 25C (77F): 1.8 Shelf Life @ 25C (77F): 1 year Volume Resistivity: Less than .OOl ohm-cm Percent Solids: 30 Cure Schedule: One hour at 60C (140F) or 15 minutes at room temperature followed by 15 minutes at 12OC (2481) K 644-11 Conductive Ink: MAVIDON K 644-11 is a one component, screen printable, conductive ink formulated for flexible circuitry. K 644-11 is a graphite modified version of K 644 and exhibits good adhesion to mylar and other substrates. Physical Characteristics: Appearance: Silver gray liquid Specific Gravity: 2.1 gram/cc Viscosity at 25C: 20,000 cps Shelf Life @ 25C: 1 year Cure Schedule: One hour at 65C or 10 minutes at 1OOC for optimum properties Typical Properties: Coverage: 30 in 2/gm Sheet Resistivity: <.I ohm/sq/ml Instructions for Use: Should thickening occur through solvent loss or should a lower viscosity be required, thin with cellosolve acetate.
398
Adhesives, Sealants and Coatings for the Electronics Industry
MAVIDON CORP.: Electrically Conductive Products (Continued): K 057 Conductive Adhesive: MAVIDON K 857 is a silver filled, pre-catalyzed epoxy adhesive offering excellent electrical and thermal conductivity as well as providing high bond strengths. Originally formulated as a two component system, K 057 has been premixed and frozen to facilitate ease of use by the consumer. Physical Characteristics: Appearance: Silver Paste Viscosity: 200,000 cps Specific Gravity: 3.4 Cure Schedule: 60 minutes at 125C or, 30 minutes at 150C Typical Cured Characteristics: Volume Resistivity: .OOl ohm-cm max Tensile Shear Strength (l/2" overlap): 1400 psi Storage and Handling Information: K 587 must be refrigerated to prolong shelf life of product. Typical shelf lives are listed below: 25C: 7 days OC: 0 weeks -40C: 6 months K 902 Conductive Adhesive: MAVIDON K 902 is a one component, heat cured conductive adhesive. K 902 features high electrical and thermal conductivity and cures quickly at temperatures as low as 125C. Fully cured, K 902 is non-bleeding, non-corrosive, and contains no fluorides. Applications include LED, IC, chip bonding and other electronic assemblies. Physical Characteristics: Appearance: Smooth Silver Paste Viscosity at 25C: 200,000 cps Specific Gravity: 3.3 Cure Schedule: At 125C: 90 minutes At 150C: 60 minutes Typical Cured Characteristics: Volume Resistivity - at 25C: .OOl ohm-cm max at 155C: .OOl ohm-cm max Tensile Strength: 1,300 psi min. Extractable Ionic Impurities: Cl-: 60 ppm Na+: 10 ppm K+: 4 ppm
Conductive Compounds
399
MERECO DIVISION: METADUCT 1202 Silver Adhesive and Cement: METADUCT 1202 is a silver filled, solvent-free, room temperature curing, electrically and thermally conductive epoxy paste for advesive and coating applications. It is used for bonding electrical and electronic devices where soldering is not practical and electrical conductivity is a requirement. The excellent adhesion, temperature, moisture and corrosion resistance of epoxies are combined with silver to give stable cured properties, extremely high conductivity, high strength and heat resistance and low outgassing. METADUCT 1202 provides good adhesion to aluminum, nichrome, steel, glass, ceramics, Ga/As, and most plastic (including conductive plastic) substrates. It is a two-component adhesive; curing can be accomplished overnight at room temperature or in a few minutes at elevated temperature. Low temperature curing avoids loss of sensitive components due to thermal damage. Applications: * Lead attachments for LED's, potentiometers, filters, wave guides, crystals and other frequency controls. * Cold "soldering" of discrete components such as resistors, flat packs, antenna, hybrids and other miniaturized circuits. * Chip bonding and "die" attachment. * Adaptable to brush, spray or screen print coatings for RF shielding and electrically conductive patterns. * Solderable conductive coatings for tantalum capacitors. Features: * No solvent...lOO% active * Non-bleeding... Useful from -55 to 175C * Thixotropic . ..No drip or sag * Complete cure . ..Low outgassing METADUCT 1202 can be cured in 16 hours at room temperature. Faster cure and improved conductivity are obtained with a three hour cure at 65C. Typical Product Properties: Activator: Color: Pale Yellow Form: Clear Liquid Viscosity (25C), cP: 450 Sp Gr (25/25C): 0.9 Flash Point, F: 140 Ease: Color: Silver Form: Soft Paste Viscosity (25C), cP: 1.5 x 10 6 Sp Gr (25/25C): 3.1 Flash Point, F: 470
400
Adhesives, Sealants and Coatings for the Electronics Industry
MERECO DIVISION: METADUCT 1240 Flexible, Electrically Conductive One-Component Epoxy Adhesive and Coating: METADUCT 1240 imparts new dimensions to "one-component" electrically conductive polymer technology. Flexibility, coupled with superior electrical performance and ease of handling are some of its outstanding characteristics. METADUCT 1240 may also be used as a coating to provide excellent EMI/ RF1 shielding when thinned with solvents. Other attributes are: * Exceptionally highly conductive (0.0001 ohm-cm) yet flexible Flexes full 180 without cracking or tearing! Screen printable or sprayable Resists heat aging Sprayable for EMI/RFI shielding coatings Superior adhesion to Kapton No mixins required - "One-Component" Compatible with and resists wave soldering operations Continuous operation to 150C with virtually no change METADUCT 1240 can be used to attach lead wires, terminate L.E.D.'s, assemble wave guides, oscillators, filters and repair defective components as well as to provide an EMI/RFI shielding layer for flexible circuits and similar applications. METADUCT 1240 has superior adhesion to most materials including glass, ceramics, metals and PC Boards as well as all bondable plastics includins treated Rulon, Teflon and polyethylene.- Additionally, METADUCT 1240 will bond tenacibusiy to "difficult to bond" surfaces such as polysulfone, Kapton and polyimide substrates. Cure schedules: 15 to 30 minutes at 15OC, or 40 to 70 minutes at 125C Typical Properties: Phvsical: -Linear Shrinkage: 0.005 Hardness Shore, D-ASTM: 45 Specific Gravity, 25C/25C: 2.4 Viscosity, 10 3 cps: 400 to 500 Shelf stability: 3 months Thermal: Thermal Conductivity K-Factor: 100 Operating Range, C: -55 to +175 Electrical: Volume Resistivity, ASTM D-1002, ohm-cm: 0.0001
Conductive
Compounds
MFRECO DIVISION: META-SHIELD 1234 Conductive Copper Paint: Low cost, oxidation stable, conductive copper paint for EMI/RFI shielding and coating for electrostatic isolation META-SHIELD 1234 is a revolutionary and innovative concept in EMI/RFI coatings! A stabilized unique inert copper particulate, permanently resistant to corrosion and nonoxidizing, provides pseudo metallic isotropic barrier attenuation shield. META-SHIELD 1234 is designed for shielding plastic molded housings of electronic equipment, computers, CRT monitors, business machines, meter boxes, etc. and for isolating microelectronic devices generating interference signals. META-SHIELD 1234 provides excellent adhesion to most substrates, is ideal for structural foam, dense molded plastics and is polycarbonate compatible. Cured coatings are durable, show no tendency to flake or significant change in shielding effectiveness after humidity testing. Outstanding Attributes: * LOW cost * Easy Application * Excellent Adhesion * Excellent Attenuation * Low Surface Resistivity * Polycarbonate Compatible * High Humidity Resistance Typical Characteristics: Properties of Cured Coatings (After air dry 24 hours): Dry Weight (grams per sq. ft.): 2.9 Coverage (sq. ft./gal.): 425 Attenuation (1 MHz to 1000 MHz): 40 dB Conductivity (ohms/sq): tl Adhesion: Excellent Humidity Resistance: Excellent Properties of Liquid Paint: Classification: Single Component, Rapid Air Drying Conductive Particulate: Non-Oxidizing Corrosion Resistant Stabilized Copper Particulate Solvent: Ethanol Mixture Color: Copper/Bronze Specific Gravity: 1.02
401
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Adhesives, Sealants and Coatings for the Electronics Industry
TACC INTERNATIONAL CORP.: Electrically Conductive Resins: 4010: Type: Epoxy Single component, heat cure designed for ease in handling. Soft paste. Excellent mechanical integrity and thermal stability. Catalyst Number: No catalyst requiired Workable Pot Life 100 gm. Mass @ 25C: 6 mos. closed can Mixed Viscosity @ 25C cps: Paste Recommended Cure Time: 2 hrs. at 1OOC Hardness Shore: 80-D Color: Silver 4100: Type: Epoxy Pure silver filled electrically conductive with high adhesion and maximum continuity of conductivity. Can be thinned as a coating for FRI and EM1 shielding. Catalyst Number: 4100-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 5 Workable Pot Life 100 gm. Mass @ 25C: 1 hr. Mixed Viscosity @ 25C cps: Paste Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 85-D Color: Silver 4200: Type: Epoxy Low cost, light weight silver electrical conductor, can be used in adhesive, potting and coating applications. Low volume resistivity. Catalyst Number: 4200-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 5 Workable Pot Life 100 gm. Mass 8 25C: 1 hr. Mixed Viscosity @ 25C cps: Paste Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 82-D Color: Silver 4230: Type: Epoxy Single component designed for ease in handling. Quick cure at elevated temperatures. Low cost, light weight. Catalyst Number: No catalyst required Workable Pot Life 100 gm. Mass @ 25C: 6 mos. closed can Mixed Viscosity @ 25C cps: Paste Recommended Cure Time: 2 hrs. at 125C Hardness Shore: 82-D Color: Silver
Conductive Compounds
TACC INTERNATIONAL CORP.: Electrically Conductive Resins (Continued): 4443: Type: Acrylic Single component, solvent based conductive designed to dip, spray, brush or screen print. Solderable. Catalyst Number: No catalyst required Workable Pot Life 100 gm. Mass @ 25C: 6 mos. closed can Mixed Viscosity @ 25C cps: 210 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 2-H Pencil Color: Silver
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Adhesives, Sealants and Coatings for the Electronics Industry
TECKNIT: Conductive Adhesives - Two Part: Silver, Nickel, or Carbon Filled RTV: Three RTV silicone two-part adhesive-sealants comprise TECKNIT electrically conductive, medium viscosity adhesive-sealant systems. They are CON/RTV-II (silver-flled), CON/RTV-Ni (nickelfilled), and CON/RTV-SC (carbon filled). CON/RTV-II: Filler: Silver plated inert particles Resin System: Silicone & Hardeners Typical Properties: Volume Resistivitv-Cured at 23C. max.: 0.01 ohm-cm Cured Density: 2.;3 g/cm 3 ’ Shear Strength, Full Cure, min.: 0.69 MPa (100 psi) Peel Strength, 80% of Full Cure: Silicone-Silicone: 175 N/m (1 lbf./in.) Silicone-Aluminum: 525 N/m (3 lbf./in.) Solids: 80% Temperature Range: -55C to 15OC (-67F to 302F) Color: Beige CON/RTV-NI: Filler: Nickel Resin Svstem: Silicone & Hardeners Typical Properties: Volume Resistivity-Cured at 23C, max.: 0.1 ohm-cm Cured Density: 3.95 q/cm 3 Shear Strength, Full-Cure, min.: 1.03 MPa (150 psi) Peel Strength, 80% of Full Cure: Silicone-Silicone: 175 N/m (1 lbf./in.) Silicone-Aluminum: 525 N/m (3 lbf./in.) Solids: 70% Temperature Range: -55C to 15OC (-67F to 302F) Color: Dark Gray CON/RTV-SC: Filler: Carbon Resin System: Silicone & Hardeners Tvwical Prowerties: --Volume Resistivity - Cured at 23C, max.: 100.0 ohm-cm Cured Density: 1.14 q/cm 3 Shear Strength, Full Cure, min.: 1.37 MPa (200 psi) Peel Strength, 80% of Full Cure: Silicone-Silicone: 700 N/m (4 lbf./in.) Silicone-Aluminum: 875 N/m (5 lbf./in.) Soids: 32% Temperature Range: -55C to 150C (-67F to 302F) Color: Black
Conductive Compounds
TECKNIT: Conductive Caulking: Silver-Filled Flexible Resin Caulking System: TECKNIT standard electrically conductive caulks consist of three one-component resin systems filled with silver coated particles. These systems are formulated to provide over 100 dB total shielding effectiveness across the RF spectrum. They may be used to improve joint or seam integrity for all tvnes of electronic enclosures. An outstanding feature of these one-component systems is the ease with which they may be applied with conventional caulking guns and dispensing equipment, such as small bead orifice syringes. Hand application with spatula or putty knife is also simple. Hish vield ner pound is another advantase offered in these conductive cauiks.- Proprietary formulation-techniques result in lower density than most current state-of-the-art caulking compounds. These systems are safe to handle, very easily applied and free of any corrosive binders. They contain only pure silver coated particles for electrical conductivity, assuring stable operation over wide temperature ranges not generally possible with carbon-black filled systems. Silver/Acetate: Resin System: Polyolefin Acetate (Thermo-plastic) in solvent Filler: Silver-coated inert particles Cured Conditions: Flexible Number of Components: One Typical Properties: Volume Resistivitv Final State. max.: .005 ohm-cm Final Density: l.i4+--05 g/cm 3 Operatins Temp. Ranqe: -54C to +94C (-65F to +200F) Cblor: Siver Gray Lap Shear, min.: 4 psi Peel Strength, min.: N/A Shrinkage, max.: 46% Use and Handling: Room Temp. Set-up, Time: 4 hrs. Tack Free, Open Container: 114 hr. Consistency: Pourable Liquid Application Methods: Caulking Gun: Yes Larger Syringe: Yes Spatula or Putty Knife: Yes Clean-Up Solvents: Trichloroethane Packaging: Can
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Adhesives, Sealants and Coatingsfor the ElectronicsIndustry
TECKNIT: Conductive Caulking: Silver-Filled Flexible Resin Caulking System: (Conductive): Silver/Silicone: Resin System: Silicone in solvent Filler: Silver-coated inert particles Cured Condition: Flexible Number of Components: One Typical Properties: Volume Resistivity Final State, max.: .Ol ohm-cm Final Density: 2.20+--05 g/cm 3 Operating Temp. Range: -63C to +204C (-80F to +400F) Color: Silver Gray Lap Shear, min.: 25 psi Peel Strength, min.: N/A Shrinkage, max.: 26% Use and Handling: Room Temp. Set-up, Time: 4 hrs. Tack Free, Open Container: l/4 hr. Consistency: Self-Leveling Paste Application Methods: Caulking Gun: Yes Larser Svrinse: Yes Spatula or Putty Knife: Yes Clean-Up Solvents: Trichloroethane Packaging: Can Silver-Silicone: Resin System: Silicone RTV Filler: Silver-plated copper Cured Condition: Flexible Number of Components: One Typical Properties: Volume Resistivity Final State, max. .Ol ohm-cm Final Density: 3.6+-.35 g/cm 3 Operating Temp. Range: -55 to +125C (-65 to +257F) Color: Silver Gray Lap Shear, min.: 150 psi Peel Strength, min.: 2.5 ppi Shrinkage, max.: 10% Use and Handlinq: Room Temp. Set-up, Time: 48 hrs. Tack Free, Open Container: 1 hr. Consistency: Paste Application Methods: Caulking Gun: Yes Larger Syringe: Yes Spatula or Putty Knife: Yes Clean-Up Solvents: Trichloroethane Packaging: Tube
Conductive Compound5
TECKNIT: Conductive Epoxy: Silver-Filled Epoxy Systems: 72-00008 - Epoxy Adhesive, Conductive Two-Component: This commercial grade, conductive epoxy is designed for use in bonding applications where good conductivity is required. When mixed in a ratio of 1:1.4 by volume or weight, the two components produce a light colored creamy paste which can be easily applied. 72-08116 - Epoxy Solder, Conductive, High Silver Content, Two-Component: This is a silver filled epoxy system designed for maximum performance and lowest volume resistivity. It is easily mixed 1:1 by volume or weight, from the two one-ounce jars. Its consistency is that of a thick paste, making it easy to apply or dispense. 72-00008: Filler: Silver-coated inert particles Resin System: Epoxy plus hardener No. of Components: Two Properties, Cured: Volume Resistivity (max.): .02 ohm-cm Cured Density: 1.88 g/cm 3 Operating Temp. Range: -63C to +99C (-8OF to +210F) Shear Strength (min.): Cured at Room Temp.: 6.9 MPa (1000 psi) Cured at 99C (210F): 6.2 MPa (900 psi) Color: Silver Gray Shrinkage (max.): 1.0% Properties, Uncured: Room Temp. Cure Time: 24 hrs. 99C 12lOF) Cure Time: l/2 hr. Pot Life:.112 hr. Shelf Life at Room Temp.: 12 months Consistency: Light Creamy Paste Mix Ratios (Pl:P2): 1:1.4 Weight or Volume 72-08116: Filler: Pure Silver Resin System: Epoxy plus hardener No. of Components: Two Properties, Cured: Volume Resistivitv (max.): .OOl ohm-cm Cured Density: 2.3O‘g/cm.3 Operating Temp. Range: -63C to +15OC (-80F to +300F) Shear Strength (min.): Cured at Room Temp.: 9.6 MPa (1400 psi) Cured at 99C (2lOF): 9.3 MPa (1350 psi) Color: Bright Silver Shrinkage (max.): 1.0% Properties, Uncured: Room Temp. Cure Time: 24 hrs. 99C (210F) Cure Time: l/2 hr. Pot Life: l/2 hr. Shelf Life at Rbom Temp.: 12 months Consistency: Light creamy paste
407
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Adhesives, Sealants and Coatings for the Electronics Industy
TECKNIT: Conductive Grease: Conductive Silver-Filled Silicone Grease: TECKNIT Conductive Grease is a highly conductive silverfilled silicone grease which contains no carbon or graphite. The material will maintain its electrical and lubricating properties over a broad environmental range. These conditions and properties include high and low temperatures, excellent resistance to moisture and humidity, inertness to many chemicals, ozone and radiation. TECKNIT Conductive Grease is a viscous paste which can be applied to vertical or overhead surfaces without dripping or running at elevated operating temperatures. Material Description: System Type: Silicone Grease filled with silver coated inert particles Components: One Volume per unit weight: 0.39 cm 3/g. (.66 in. 3/oz.) Properties: Volume Resistivitv (max.): 0.02 ohm-cm Final Condition: Non-Setting Operating Temperature Range: -54C to +232C (-65F to 450F) Pot Life: Indefinite Shelf Life: Indefinite Density: 2.59 g/cm 3 Color: Silver Gray Consistency: Light Paste Clean-up Solvents: Trichloroethane Worked-Penetration: 245 mm Dropping Point (min.): 220C Bleed: 2.74% Evaporation: 8.31%
Conductive Compounds
409
TECKNIT: Conductive Systems: Conductive Adhesive - One Part: Silver-Filled Silicone RTV: TECKNIT CON/RTV-1 System is a pure silver loaded, one component RTV silicone adhesive-sealant. It is ready to use without mixing and cures quickly at room temperature on exposure to moisture in the air to form a flexible, resilient, conductive bond or seal. Material Description: Resin: RTV Silicone, One Part Filler: Pure Silver Consistency: Thick Paste Color: Silver-Tan Properties, Uncured (at 50% RH, 23C): Volume per unit weight: 325 cm 3/ks [9 in. 3/lb.l Tack Free Time: 2-4-minutes Handling Time: 2 hours Shelf Life: 4 months in original, sealed package Tvuical Prooerties. Cured (at 50% RH. 23C): -‘Volume Resistivity (maxi): 0.01 ohm-cm Density: 3.06+-0.05 g/cm 3 Temperature Range: -60 to +175C (-76 to 347F) Shear Strength (Alum.-Alum.): 1.03 MPa (150 psi) Peel Strength (min. after full cure): 350 N/m (2 lbf./in.) Shrinkage (max.): 1.0%
410
Adhesives, Sealants and Coatings for the Electronics Industry
TECKNIT: Electrically Conductive Acrylic and Latex: TECKNIT manufactures Conductive Coatings which are organictype paints highly filled with conductive particles, such as graphite, silver or nickel. Electrically conductive coatings are the most adaptable cost effective method for shielding and grounding of plastic enclosures susceptible to EMI. These coatings can be applied with conventional spray equipment. Their shielding effectiveness is a function of the type and amount of conductive material used. Silver is preferred for maximum conductivity and reliability. Nickel is recommended for corrosive environments. Application Information: Conductive Acrylic Paints have been applied sucessfully to many applications. Conductive Latex Paints can be applied by brushing, spraying, dipping and rolling. Because of the non-solvent carrier, it can be utilized on all types of dielectric substrates--although tests should be run on each application. Excellent on Urethane Foams and Styrofoams. Shelf Life and Storage Recommendations: TECKNIT Conductive Acrylic Paints should be used within six months of the manufactured date. Elevated Temperature Curing of Conductive Emulsion Paint: The drying time of TECKNIT Conductive Emulsion Acrylic Paint mav-be-reduced bv increasing ambient temuerature to 65C maximum and subjecting to a circulating air oven. Typical elevated temperature curing for a -05 mm (.002 in.) thick coating at 5b% relative humidity is approximately 5 to 10 minutes. Note that the temperature exposure should be compatible with the substrate. Acrylic-l: Method of Application: Sprayable Conductive Filler: Silver Coated Inert Particles Surface Resistivity (max.): 1 ohm/sq. Density - wet: 1.69 g/cm 3 dry: 2.30 g/cm 3 Color: Silver Gray Consistency: Thin Paint Temperature Range: -54C to +148C (-65F to +298F) Final Condition: Durable Film (4H pencil) Acrylic-N/Z: Method of Application: Sprayable Conductive Filler: Nickel Surface Resistivity (max.): 0.5 ohms/sq. Density - wet: 1.59 g/cm 3 dry: 5.53 g/cm 3 Color: Black Consistency: Medium Thick Paint Temperature Range: -54C to +148C (-65F to +298F) Final Condition: Durable Film (4H pencil)
Conductive Compounds
411
TECKNIT: Electrically Conductive Acrylic and Latex (Continued): Acrylic-N5: Method of Application: Sprayable Conductive Filler: Nickel Surface Resistivity (max.): 5 ohms/sg. Density - wet: 1.50 g/cm 3 dry: 3.82 g/cm 3 Color: Black Consistency: Medium Thin Paint Temperature Range: -54C to +148C (-65F to +298F) Final Condition: Durable Film (4H pencil) Latex-1000: Method of Application: Brush/Spray/Dip Conductive Filler: Graphite Surface Resistivity (max.): 1000 ohms/q. Density - wet: 1.10 g/cm 3 dry: 1.82 g/cm 3 Color: Black Consistency: Thin Paint Temperature Range: -40C to +148C (-40F to +298F) Final Condition: Durable Film (4H pencil) Conductive Emulsion: Method of Application: Brush Conductive Filler: Silver Coated Inert Particles Surface Resistivity (max.): 1 ohm/q. Density - wet: 1.38 g/cm 3 dry: 2.11 g/cm 3 Color: Beige Consistency: Thin Paint Temperature Range: -54C to +148C (-65F to +298F) Final Condition: Durable Film (4H pencil) Dielectric Overcoat: Method of Application: Sprayable Conductive Filler: Insulator Surface Resistivity (max.): Dielectric Strength 300V/mil Density - wet: 1.02 g/cm 3 dry: 1.04 g/cm 3 Color: Translucent Consistency: Thin Paint Temperature Range: -54C to +148C (-65F to +298F) Final Conditon: Durable Film
412
Adhesives, Sealants and Coatings for the Electronics Industry
TECKNIT: TECK-BOND Silver-Plated Copper-Filled Adhesives: TECK-BOND systems are a silicone rubber base filled with silver-plated copper particles to produce highly conductive one-component and two-component adhesive sealants. The onecomponent adhesive system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing. The compound cures at room temperature to form a flexible resilient conductive bond or sealant. The twocomponent adhesive is a catalyst and temperature cure system. One Part: Part Number: 72-00118 Resin: Silicone RTV Conductive Filler: Silver-Plated Copper Uncured Consistency: Thick Paste Cured Condition: Flexible Performance Characteristics: Volume Resistivitv (max.): 0.01 ohm-cm Cured Specific Gravity: 3.6+-0.15 Temperature Ranqe: -62C to 205C (-80F to 401F) Lap-Shear Bond Strength (min.): 1.73 MPa (250 psi) Peel Bond Strength (min.): 0.7 N/m (4 ppi) Shrinkage (max.): 1% Color: Gray Shelf Life: 6 mos. Pot Life @ 25C: 30 mins. Recommended Cure: 72 hours at room temperature and 50% RR Full Cure: 7 days Clean-Up Solvents: Trichloroethane Two-Part: Part Number: 72-00119 Resin: Silicone Catalyst Conductive Filler: Silver-Plated Copper Uncured Consistency: Light Paste Cured Condition: Flexible Performance Characteristics: Volume Resistivity (max.): 0.05 ohm-cm Cured Specific Gravity: 2.9+-0.15 Temperature Range: -55C to 125C (-67F to 257F) Lap Shear Bond Strength (min.): 3.1 MPa (450 psi) Peel Bond Strength (min.): 1.22 kN/m (7 ppi) Shrinkage (max.): 1% Color: Red Shelf Life: 6 mos. Pot Life @ 25C: 30 mins. Recommended Cure: 1 hour @ 9OC (194F) Full Cure: N/A Clean-Up Solvents: Trichloroethane
Conductive Compounds
TECKNIT: TECK-BOND Silver-Plated Copper-Filled Adhesives (Continued): One-Part: Part Number: 72-00125 Resin: Fluorosilicone RTV Conductive Filler: Silver-Plated Copper Uncured Consistency: Thick Paste Cured Condition: Flexible Performance Characteristics: Volume Resistivity (max.): 0.01 ohm-cm Cured Specific Gravity: 3.8+-0.15 Temperature Range: -55C to 125C (-67F to 257F) Lap Shear Bond Strength (min.): 1.38 MPa (150 psi) Peel Bond Strength (min.): 0.7 kN/m (4 ppi) Shrinkage (max. 1: 1% Color: Tan Shelf Life: 6 mos. Pot Life @ 25C: 30 mins. Recommended Cure: 72 hours at room temperature and 50% RH Full Cure: 7 days Clean-Up Solvents: Trichloroethane
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Adhesives, Sealants and Coatings for the Electronics Industry
THERMOSET PLASTICS, INC.: Microelectronic Resin Systems: Electrically Conductive Materials: ME-101: Low Temperature Curing, General Purpose Silver Mix Ratio by Weight: 1OO:lO Room Temperature Working Life: 60 min. Typical Cure Schedule: 60 min. @ 1OOC Cured Properties: Volume Resistivity: 5 x 10 -3 Glass Transition Temperature (Cl: 105 Adhesive Strength (psi): 1,500 ME-120:
Semi Flexible, Long Working Life Silver Mix Ratio bv Weight: 1OO:lO Room Temperature-Working Life: 0 hr. Typical Cure Schedule: 60 min. @ 120C Cured Properties: Volume Resistivity: 5 x 10 -2 Glass Transition Temperature (C): 90 Adhesive Strength (psi): 2,000 ME-l
22: Stable RT Storage, Fast Cure Silver Mix Ratio by Weight: One Part Room Temperature Working Life: 3 weeks Typical Cure Schedule: 30 min. @ 150C Cured Properties: Volume Resistivity: 1.5 x 10 -4 Glass Transition Temperature (C!): 140 Adhesive Strength (psi): 1,800
ME-135:
Low Ionics, High Tg For Syringe Dispense Silver Mix Ratio by Weight: One Part Frozen Room Temperature Working Life: 5 days Typical Cure Schedule: 60 min. @ 180C Cured Properties: Volume Resistivity: 5 x 10 -5 Glass Transition Temperature (C): 180 Adhesive Strength (psi): 3,200
Conductive Compounds
THERMOSET PLASTICS, INC.: Microelectronic Resin Systems: Electrically Conductive Materials (Continued): ME-137: I:1 Mix Ratio, 2 part version of ME-135 Silver Mix Ratio by Weight: 1OO:lOO Room Temperature Working Life: 5 days Tvnical Cure Schedule: 60 min. @ 18OC Cured Properties: Volume Resistivity: 5 x 10 -5 Glass Transition Temperature (C): 180 Adhesive Strength (psi): 3,200 ME-I 39:
Low Ionics, High Tg for Screen Printing Silver Mix Ratio bv Weight: One Part Frozen Room Temperature-Working Life: 3 days Typical Cure Schedule: 60 min. @ 150C Cured Properties: Volume Resistivity: 5 x 10 -4 Glass Transition Temperature (C): 175 Adhesive Strength (psi): 2,500 ME-145: Low Ionics, Fast Cure for Syringe Dispense Silver Mix Ratio by Weight: One Part Frozen Room Temperature Working Life: 2 days Typical Cure Schedule: 5 min. @ 15OC Cured Properties: Volume Resistivity: 5 x 10 -5 Glass Transition Temperature (C): 130 Adhesive Strength (psi): 1,500 ME-146: Low Ionics, Low Thermal Stress on Die Silver Mix Ratio by Weight: One Part Frozen Room Temperature Working Life: 24 hr. Typical Cure Schedule: 30 min. @ 160C Cured Properties: Volume Resistivity: 2 x 10 -3 Glass Transition Temperature (C): 70 Adhesive Strength (psi): 3,500
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Adhesives, Sealants and Coatings for the Electronics Industry
TRA-CON,
INC.: Conductive Epoxy Adhesives:
TRA-DUCT 2701: Room temperature conductive nickel epoxy adhesive. TRA-DUCT 2701 Conductive Nickel Epoxy Adhesive is an electrically-conductive nickel filled epoxy adhesive recommended for electronic bonding, sealing, and EMI/RFI shielding applications that require a combination of good electrical and mechanical properties. This two-part smooth paste formulation of pure nickel and epoxy components is free of solvents, silver, copper or copper additives, and is in fact a low-cost replacement for many silver based products. Color: Nickel (grey) Specific gravity: 3.3 Viscosity, (after mixing) cps @ 25C: Smooth paste Mix ratio, parts by weight Hardener/Resin: 6H/lOOR Operating temperature range, C: -60 to 110 Hardness, Shore D: 05 Coefficient of expansion, cm/cm/C: 49-10 -6 Thermal conductivity, cal-cm/cm 2 set C: 37-10 -4 Reactive solids content, %: 100 TRA-SHIELD 2867: Conductive silver epoxy coating TRA-SHIELD 2867 is an electrically conductive, silver-filled, solvent-borne, epoxy coating recommended for EM1 shielding, EM1 gasket flange coating, surface ground, anti-static charge dissipation, and corona shielding applications. This easy-to-use twopart epoxy formulation develops strong, durable, electrically and thermally conductive coatings to many different materials, such as semiconductors, dielectrics, ceramics, glass, metals, and plastic laminates. It also can be used for assembly and repair of electronic modules, wave guides, flat cable, and high frequency shields. TRA-SHIELD 2867 has an effective sprayable "pot-life" of more than eight (8) hours after thorough mixing at room temperature. Color: Silver Specific gravity (wet): 1.71 Specific gravity (dry): 3.2 Viscosity (after mixing), cps @ 25C: Sprayable Mix ratio, parts by weight: 34H/lOOR Mix ratio, parts by volume: lOOH/lOOR Operating temperature range C: -65 to 125 Pot Life, after mixing @ 25C, hours: 8 Volume Resis'civity, @ 25C, ohm-cm: 0.0005 Reactive solids content, %: 70
Conductive Compounds
TRA-CON, INC.: conductive Epoxy Adhesives
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(Continued):
TRA-DUCT 2902: Room temperature conductive silver epoxy adhesive TRA-DUCT 2902 Conductive Epoxy Adhesive is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. This twopart, smooth-paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic laminates. TRA-DUCT 2902 Epoxy Adhesive cures at room temperature and can be used as a "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, printed circuits, wave guides, flat cable and high frequency shields. This adhesive complies with the requirements of NASA's Outgassing Specification. Color: Silver Specific gravity: 2.45 Viscosity, (after mixing) cps @ 25C: Smooth paste Mix ratio, parts by weight Hardener/Resin: 6H/lOOR Operating temperature range, C: -60 to 110 Hardness, Shore D: 80 Coefficient of expansion, cm/cm/C: 49-10 -6 Thermal conductivity, Cal-cm/cm 2 set C: 37-10 -4 Outgassing (NASA): Passes VCM (volatile condensable materials NASA), %: 0.040 TRA-DUCT 2916: Room temperature flexible conductive silver epoxy adhesive TRA-DUCT 2916 is a flexible, electrically conductive silverfilled epoxy adhesive recommended for electronic bonding, coating and sealing applications that require a combination of high flexibility coupled with good electrical and mechanical properties. This two-part, smooth paste formulation of refined pure silver and epoxy resin components is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates. TRA-DUCT 2916 cures as room temperature and can be used as a flexible "cold-solder" for heatsensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, wave guides, flat cable and high frequency shields. Color: Silver Specific gravity: 2.9 Viscosity, (after mixing) cps @ 25C: Smooth paste Mix ratio; parts by weight Hardener/Resin: li5H/lOOR Operating temperature range, C: -60 to 110 Hardness, Shore A: 64 Thermal conductivity, Cal-cm/cm 2 set C: 37-10 -4 Reactive solids content, %: 100
418
Adhesives, Sealants and Coatings for the Electronics Industry
TRA-CON,
INC.: Conductive Epoxy Adhesives
(Continued):
TRA-DUCT 2924: High temperature conductive silver epoxy adhesive TRA-DUCT 2924 Conductive Epoxy Adhesive is a two-part electrically conducting composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperature range (up to 19OC) are required. This smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It can be used--after a required high temperature cure cycle--for the assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for highfrequency RF shielding, and for applications when a "hot" soldering iron is impractical. Fully cured TRA-DUCT 2924 Epoxy Adhesive is a hard, dimensionally stable, conductive material which is resistant to water, weathering, gasses and vapors, lubricants, fuels, alcohol, and also to those salts, salt solutions, mild acids and alkalis, and other organic and inorganic compounds with which silver itself is compatible. Color: Silver Specific gravity: 2.65 Viscosity (after mixing), cps @ 25C: Smooth paste Mix ratio, parts by weight Hardener/Resin: 5H/lOOR Operating temperature range, C: -60 to 190 Hardness, Shore D: 85 Coefficient of expansion, cm/cm/C: 49-10 -6 Thermal conductivity, Cal-cm/cm 2 secC: 37-10 -4 Reactive solids content, %: 100 TRA-DUCT 2971: High temperature conductive silver epoxy adhesive TRA-DUCT 2971 is a one-part smooth paste electrically conductive silver filled (solvent-free) epoxy adhesive recommended for electronic bonding and sealing applications where excellent electrical conductivity and mechanical properties are required. It has a six month room temperature shelf life, and develops strong, durable, electrically and thermally conductive bonds and coatings--after a required high temperature cure cycle-between many different materials such as semiconductors, ceramics, glass, metals, and laminates. It is recommended for bonding active and/or passive chip-type components in the fabrication of printed, integrated and hybrid circuits, and is just right for screen printing and epoxy die mounting applications, or for the assembly and repair of printed circuits, wave guides, electrical modules, and high frequency shielding. Color: Silver Specific gravity: 2.65 Viscosity, (after mixing) cps @ 25C: Smooth paste Mix ratio: One part Operating temperature range, C: -60 to 125 Hardness, Shore D: 80 Coefficient of expansion, cm/cm/C: 49-10 -6 Thermal conductivity, Cal-cm/cm 2 secC: 39-10 -4 Reactive solids, %: 100
Conductive Compounds
TRA-CON, INC.: Conductive Epoxy Adhesives
419
(Continued):
TRA-CAST FS-245: Thermal conductive electrical insulating compound TRA-CAST FS-245 is a medium viscosity thermal conductive epoxy adhesive that is used for staking and setting transistors, diodes, resistors, integrated circuits and other heat-sensitive components in printed circuit electronic applications. This two-part compound develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. TRA-CAST FS-245 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temuerature range. Fully cured TRA-CAST FS-245 provides excellent resistance tosalt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol. Color: Black Specific gravity: 1.52 Viscosity (after mixing) cps @ 25C: 16,000 Operating temperature range, C: -70 to 125 Hardness, Shore D: 90 Mix ratio, oarts bv weisht: 5.2H/lOOR Coefficient-of expansion, cm/cm/C: 28-10 -6 Thermal conductivity, Cal-cm/cm 2 set C: 20-10 -4 Dielectric strength, Volts/mil: 410 Dielectric constant, 1 KHz @ 25C: 5.9 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 3-10 15 ohm-cm @ 75C: Z-10 13 Reactive solids content, %: 100
Section VII Encapsulating, Potting, Casting, Impregnating Compounds
420
Encapsulating, Potting, Casting, Impregnating Compounds
421
ABATRON, INC.: Casting for Electrical & Structural Uses: ABOCAST 4-4: Machinable Metal-Filled Casting Compound for Tooling & Molds The classic casting resin for tooling. Available with many different hardeners for special requirements. Uses: Available with ABOCURE 50-12 (very hard, r.t. cure), ABOCURE 50-4 (large castings, r.t. cure), ABOCURE 50-17 (very large castings, 160C & high chemical resistance) and more. Technical Characteristics: 100% solids. Clear. 2-part. Ratios, potlife, cure and properties depend on hardener chosen. A standard for casting molds, patterns, fixtures, models, forms, die surfaces, tools. Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Room temp. of heat cure depending on hardener and application. ABOCAST 22-3O/ABOCURE 50-3: All-Purpose Potting/Encapsulating
Compound
The most used potting/encapsulating system. Very versatile a-part dielectric. Very easy to use. Black or colors. Uses: Most used to embed, pot, encapsulate, insulate electric parts, magnets, circuits, electronic components for in/outdoor aonlications. Technical Characteristics: 100% solids. Black or colors. 100/20 ratio. 40-50 min. potlife. Hard in 1-S hrs. or faster with heat. Available also with other hardeners for other specs. Application: Clean and dry surfaces. Mix thoroughly. Pour into mold or part to be filled. Cure at 25C or accelerate with heat. ABOCAST 50-3: All-purpose Clear Standard Casting & Adhesive Resin. All-purpose "Workhorse" clear resin available with many different hardeners for general, electric, marine, industrial and building trade. Uses: Available with ABOCURE 50-12 (rigid r.t. cure), ABOCURE 50-l (viscous) or 50-3 thin (variable-ratios), ABOCURE 50-17 (15OC) and more Technical Characteristics: 100% solids. Clear. 2-part. Ratios, potlife, cure and properties depend on hardener chosen. Used for casting, bonding, coating, resurfacing, potting. Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Room temp. or heat cure depend on hardener and application.
422
Adhesives, Sealants and Coatings for the Electronics Industry
ABATRON, INC.: Casting for Electrical & Structural Uses (Continued): ABOCAST 53-15: Variable Ratio/Viscosity Resin Variable-Ratio/Variable-Viscosity Casting & Adhesive 2-part resin with exceptional versatility. Typical use: assembling brushes. Uses: One of the "VR-Series" compounds. Ratio varaition 30-60 (B) per 100 (A) charges viscosity 20-120 poises without significant changes of other properties. Technical Characteristics: 100% solids. Gray (white/black). 100/30-60 ratios. 30 minute potlife. Hard in 2-3 hrs. at 25C, 0.3-I min. at 15OC (302F). Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Room temp. or accelerated heat cure depend on required output. ABOCAST 8101-l: Low-Viscosity Versatile Clear Resin Low-Viscosity Variable-Ratio Clear Resin 2-part systems with the highest heat (13OC) & chemical resistance in its "VR" class. Uses: Top of the "VR-Series", in which rigidity and heat/chemical resistance are increased by increasing part (A) amount to part (B). Technical Characteristics: 100% solids. Clear. Ratios: 100/40-120. l-2 hrs potlife. Hard in 2-12 hours at 25C or minutes with heat. Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Room temp. or accelerated heat cure depend on required output. ABOCAST 8103-23: High-Grade Flexible Potting/Impregnating Clear Resin Casting, Potting/Impregnating/Encapsulating clear a-part system. 140% elongation, superb electric properties. Uses: Superior resistivity & arc-track resistance. Wide range of uses extending into most applications requiring good adhesion, thermocycling, impact, flexibility, in-outdoor dielectrics. Technical Characteristics: 100% solids. Clear. 2-part. 100/112 ratio. Potlife: greater than 8 hours at 25C. 0.5 hrs. at 8OC (176F). Cure: 2-4 hrs at IOO-160C. Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Heat cure is required.
Encapsulating, Potting, Casting, Impregnating Compounds
423
ABATRON, INC.: Casting for Electrical & Structural Uses (Continued): ABOCAST 8109-5: 180C (356F)-Resistant Dielectric Casting/Impregnating Compound Hi-Temp Hi-Chem Potting/Impregnating/Encaspulating 2-part clear system for high chemical resistance up to 180C (356F). Uses: One of the 8109-Series compounds. Easily handled at high temperatures. Outstanding for high requirements. ABOCAST 8502-3 is a red (or other colors) filled version. Technical Characteristics: 100% solids. Clear. 2-part. 100/85 ratio. Potlife greater than 2 days at 25C; 7 hrs. at 60C (14OF). Application: Clean and dry surfaces. Mix thoroughly. Pour into mold or part. Heat to desired viscosity & reactivity for impregnation, potting, encapsulating, vacuuming. ABOCAST 8109-10: Low-K Slow Casting/Impregnating
Dielectric Compound
Slow potting/impregnating/encapsulating 2-part clear system. A classic for low dielectric constant and good thermocycling properties. Uses: One of the 8109-Series compounds. Long potlife & low viscosity permit handling & vacuuming in wide temperature range. ABOCAST 8502-4 is a red (or other colors) filled version. Technical Characteristics: 100% solids. Clear. 2-pert. 100/130 ratio. Potlife 3-5 days at 25C; 18-40 hrs. 40C; 4-12 hrs. at 60C (14OF). Traditional use: ignition coils. Aoolication: '-Clean and dry surfaces. Mix thoroughly. Heat to desired viscosity & reactivity for impregnation or potting. Easy hightemp. vacuum. ABOCAST 8504-l: l-component Hi-Temp Hi-Chem Dielectric Resin One-Component Hi-Temp/Hi-Chem Clear casting & adhesive resin. For high requirements up to 168C (334F). Uses: One of the "One-Component Systems", for casting, potting, encapsulating, embedding. ABOWELD 8504-8 is a black putty version widely used as a heatsink. Technical Characteristics: 100% solids. Clear. 4-6 month shelf life. 200-minute potlife at 1OOC (212F). Cure: l-2 hrs. at 150-160C (302-320F). Application: Clean and dry surfaces. No mixing necessary. Pour, spread or brush. Heating is necessary to activate the latent catalyst in the resin.
424
Adhesives, Sealants and Coatings for the Electronics Industry
ABATRON, INC.: Casting for Electrical & Structural Uses (Continued): ABOCAST 8602-2: Electrically conductive compound. 2-part. Carbon-filled, solventless, 6-meg-ohm/sq. for casting, silk-screening or resurfacing. Uses: Widely used for anti-static protection, moderate conductivity, hi-tech, medical & industrial applications. Silver-filled alternates are ABOCAST 8505-1, ABOCOAT 8401-l. Technical Characteristics: 100% solids. Black. Ratio: 2/l. 2-4 hrs. potlife. Hard in 212 hrs. at 25C or faster with heat. Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Room temp. or accelerated heat cure depend on required output. ABOCAST 8612-1: Versatile Low-Viscosity Variable-Ratio Resin Typical variable-ratio clear resin. 2-part system with unusual versatility for research & production in electric & electronic fields. Uses: Typical of the "VR Series", in which flexibility is increased and heat/chemical resistance decreased by increasing (B) amount relative to (A) in the (A)/(B) blend. Technical Characteristics: 100% solids. Clear. Ratios: 100/40-80. l-2 hrs. potlife. Hard in 2-12 hrs. at 25C or minutes with heat. Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Room temp. or accelerated heat cure depend on required output. EPOXIT-9: Clear "Decoupage" resin to cast "colorless" layers on wood, pictures, tabletops and decorative surfaces. 2-part standard low-cost system. Uses: Standard "tabletop" transparent resin for decorative applications, used by casting to cover and embed tabletops, pictures, inlays, decoupages on wooden & other surfaces. Technical Characteristics: 100% solids. Clear. a-part. l/l ratios. 30 min. potlife. Hard in 1-8 hrs. at room temp. or approx. 6-12 at 50-70C (122-158F). Application: Clean and dry surfaces. Mix thoroughly. Pour, spread or brush. Room temp. or accelerated heat cure depend on required output.
Encapsulating, Potting, Casting, Impregnating Compounds
ABATRON, INC.: Comparative Parameters of 13 Basic Liquid Epoxy Systems for Electric and Electronic Applications: ABOCAST 8109-l/ABOCURE 8109-I: Parts by weight of (A)/(B) blend: 100/30 Mixing temperature: C: 130-140 Viscosity of (A)/(B) blend: Poises/C: 2-61120 Pot life: 1.5h/l20 Typical cure cycles: 16h/120 lOh/l40 8h/160 2h/200 Main applications: Heavy-duty casting & potting in electric and other industry ABOCAST 8109-2/ABOCURE 8109-2: Parts by weight of (A)/(B) blend: lOO/lO Mixing temperature: C: 130-140 Viscosity of (A)/(B) blend: Poises/C: 50-500/120 Pot life: 1.5h/120 Typical cure cycles: ~~~~l-&~~ 8h/l60 2h/200 Main applications: Heavy-duty casting & potting in electric and other industry. ABOCAST 8109-3/ABOCURE 8109-3: Parts by weight of (A)/(B) blend: lOO/lO Mixing temperature: room temp. Viscosity of (A)/(B) blend: Poises/C: 16-20/21 Pot life: 2.5h/20 30m/40 15m/60 Typical cure cycles: 24h/20 2-3h/60 15m/lOO Laminating, small components potting ABOCAST 8109-4/ABOCURE 8109-4: Parts by weight of (A)/(B) blend: lOO/lO Mixing temperature: room temp. Viscosity of (A)/(B) blend: Poises/C: 20-26/21 Pot life: 2.5h/20 30m/40 15m/60 Typical cure cycles: 24h/20 :;I% Main applications: Laminating, small components potting
425
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Adhesives, Sealants and Coatings for the Electronics Indust~
ABATRON, INC.: Comparative Parameters of 13 Basic Liquid Epoxy Systems for Electric and Electronic Applications(Continued): ABOCAST 8109-5/ABOCURE 8109-S: Parts by weight of (A)/(B) blend: 100/20 Mixing temperature: C: room temp. Viscositv of (A)/(B) blend: Poises/C: 15-25/25 .8-1.5170 .2-.3/120 Pot Life: 7-lo/20 5-7h/60 Typical cure cycles: 4h/lOO + 3h/190 Main applications: Castings & laminates for high-temperature applications ABOCAST 8109-C/ABOCURE 8109-6: Parts by weight of (A)/(B) blend: 100/90 Mixing temperature: C: room temp. Viscosity of (A)/(B) blend: Poises/C: lo-25/25 Pot life: i5-208/20 7-lOh/120 Typical cure cycles: 3h/lOO + 3h/190 Main applications: Castings & laminates for high-temperature applications ABOCAST 8109-7/ABOCURE 8109-7: Parts bv weicrht of (A)/(B) blend: 100/80 Mixing %empe;ature: C: 50-80 Viscosity of (A)/(B) blend: Poises/C: IO-20/21 2-4140 .5-1.5/60 Pot Life: 6-7d/20 12-24h/40 .75-7h/60 Typical cure cycles: lh/lOO + 4h/150 Main applications: Potting impregnating laminating ABOCAST 8109-8/ABOCURE 8109-8: Parts by weight of (A)/(B) blend: 100/12 Mixing tempegature: room temp. Viscosity of (A)/(B) blend: Poises/C: 45-60/21 Pot life: 45m/20 20m/40 lOm/60 Typical cure cycles: 24h/20 2-3h/60 lo-20m/100 Main applications: Potting small components and laminating
Encapsulating, Potting, Casting, Impregnating Compounds
ABATRON, INC.: One-Component Structural/Dielectric systems:
427
Epoxy
Highly filled, class H (18OC) structural adhesives, casting and potting compounds. ABOWELD 8708-5: Heat-conductive adhesive paste curing. ABOWELD 8708-7: Heat-conductive adhesive paste curing. ABOWELD 8708-8: Heat-conductive adhesive paste curing. ABOCAST 8708-6: Castable adhesive compound for ABOCAST 8708-9: Castable adhesive compound for ABOCAST 8708-10: Castable adhesive compound for
for slow high-temperature for faster high-temperature for fast high-temperature slow high-temperature
curing.
faster high-temperature
curing.
fast high-temperature curing.
Suggested Uses: Structural bonding, Casting, Potting, Encapsulating, Embedding applications where 2-component systems are not practical. Appliances, radiators, electronic compoments, medical equipment. Excellent bond to metals, ceramics, glass. Assembly, Patching, Filling, Resurfacing, Insulation. Comparative Parameters: ABOWELD 8708-5: Standard Color: black Other colors available: yes Viscosity, cps @ 25C: 180000 ABOWELD 8708-7: Standard Color: black Other colors available: yes Viscosity, cps @ 25C: 180000 ABOWELD 8708-8: Standard Color: black Other colors available: yes Viscosity, cps @ 25C: 180000 ABOCAST 8708-6:. Standard Color: black Other colors available: yes Viscosity, cps @ 25C: 20000 ABOCAST 8708-9: Standard Color: black Other colors available: yes Viscosity, cps @ 25C: 20000 ABOCAST 8708-10: Standard Color: black Other colors available: yes Viscosity, cps @ 25C: 20000
428
Adhesives, Sealants and Coatingsfor the ElectronicsIndustry
ABATRON, INC.: The "VR" Epoxy Series.. Variable-Ratio versatile resins with controllable results and easy proportioning. Equally reliable as adhesives, coatings, or casting, laminating, patching and filling compounds. ABOCAST 5O-4/ABOCURE 50-22: High-viscosity (like molasses), light amber. A structural & dielectic standard. Pot life: 50-90 minutes. l/l ratio. All-purpose structural adhesive where bonding, repair, filling, resurfacing with a thick clear material is needed. ABOCAST 50-3/ABOCURE 8012-2: High viscosity (like above), dark amber. Excellent if light color is not required. Pot Life: do-60 minutes. 211 Ratio. Industrial. Recommended for harsher chemical & water exposure. Faster hardening in cold weather and on wet surfaces. ABOCAST 50-3/ABOCURE 50-l: Medium-viscosity (like honey), light amber. A structural & dielectric "workhorse". Pot Life: 60-90 minutes. l/l Ratio. Best combination of high strength and versatility. Generalpurpose for casting, thick coating, bonding, embedding. ABOCAST 8101-l /ABOCURE 8101-l: Medium-viscosity, light amber. Best "VR" for heat, solvent & chemical resistance. Pot life: l-2 hrs. 211 ratio. Full _ properties developed by _ heat cure or postcure. Heavy-duty. No "VR" type on the market can match it for its heat, chemical, dielectric and structural properties. ABOCAST 8101-Z/ABOCURE 8101-2: Lower-viscosity version of above resin for easier casting, encapsulating & potting. Pot life: 2-3 hrs. 2/l ratio. Full properties developed by heat cure or postcure. Best "VR" combination of low viscosity, chemical, structural, thermal & dielectric properties for critical casting.
Encapsulating, Potting, Casting, Zmpregnating Compounds
429
ABATRON, INC.: The "VR" Epoxy Series(Continued): ABOCAST 50-3/ABOCURE 8012-7: Low-viscosity, light amber, slow. It combines lower viscosity and longer pot life.Pot life: 3-4 hrs. 2/l ratio. As thin as motor oil. For casting, potting, encapsulation, large-mass casting, laminating, floor resurfacing. ABOCAST 7802-l/ABOCURE 50-11: Low-viscositv. lisht amber, faster. Best where longer pot _ _ life hardens too.slowly. . Pot-life: 40-50 minutes. 2/l ratio. Thinner than above. Excellent for general-purpose casting, floor resurfacing and coating. A standard for floors. ABOCAST 8012-3/ABOCURE 8012-3: Low-viscosity, heavy duty, dark amber. Outstanding for food & dairy plant floors. Pot life: 30 minutes, 2/l ratio. It combines superior resistance to alkalies, organic acids & water with faster hardening in cold weather & water. ABOCAST 8008-6/ABOCURE 8008-6: Colorless "liquid glass". Very low viscosity. Standard for table & counter tops. Pot life: 40-60 minutes. 2/l ratio. Best color retention & lowest shrinkage. Unusually resistant to discoloration. Also used for lighttransmitting dielectric, analytical & other embedments. ABOCAST ElOl-3/ABOCURE 8101-3: Colorless, like above. Premium grade for superior thermal & chemical resistance. Pot life: l-2 hrs. 2/l ratio. Full properties developed by heat cure or postcure. Better than the 8008-6 system for heat, chemical resistance & hardness. Its lower exotherm permits larger castings. ABOCAST ElOl-4/ABOCURE 8101-4: Wood consolidant, impregnant, penetrating coating and casting resin. Medium amber. Pot life: 20-30 minutes. 2/l ratio. Very low viscosity. To impregnate, restore, harden or waterproof wood (even if deteriorated) or other fibrous materials. Flexibilized.
430
Adhesives, Sealants and Coatings for the Electronics Industry
ABATRON, INC.: The "VR" Epoxy Series(Continued): ABOCAST 8102-l/ABOCURE 8102-l: Medium viscosity, heavy duty, amber. Industrial casting, filling 8 coating resin. Pot life: 40-60 minutes, 2/l ratio. Alternative to the 8012-3 system when solvent or heat resistance is more important than organic acid resistance. ABOCAST 8012-B/ABOCURE 8012-g: "5-Minute Epoxy". Medium viscosity, light amber. Films harden as fast as castings. Pot Life: 5 minutes. Best ratio: l/l. Not as brittle as common "S-minute Epoxy". Fastest "VR" with good physical & chemical properties. Hardens even at OC. Popular in l-ounce MIXPACK pouches. ABOWELD 8101-5/ABOCURE 8101-5: "5-Minute Epoxy Paste". Thixotropic. A Vaseline-like form of 8012-g. Light amber. Pot life: 5 minutes. Best ratio: l/l Non-runny, but light to mix. Recommended for patches and filling in all-weather, emergency & difficult conditions. ABOWELD 55-22/ABOCURE 55-22: General-purpose, Vaseline-like thixotropic paste. Light amber. High performance. Pot life: 1-2 hrs. l/l ratio. A non-runny structural and dielectric "workhorse". Easy to spread and dispense. Reliable for most industrial needs. ABOWELD 8101-6/ABOCURE 8101-6: Vaseline-like, thix., light amber, bset "VR" heat, chemical & solvent resistance. Pot life: l-2 hrs. 2/l ratio. Full properties developed by heat cure or postcure. Same consistency of 55-22, but best where rigidity, hardness, heat and chemical resistance are main requirements. ABOWELD 55-25/ABOCURE 55-25: Peanutbutter-like, thix., more filled for minimum shrinkage & better heat transfer. Pot life: l-2 hrs. l/l ratio. Heavier. A standard in electric motor repairs, metal filling, structural & dielectric patching, bonding, repairing.
Encapsulating, Potting, Casting, Impregnating Compounds
431
ABATRON, INC.: The "VR" Epoxy Series(Continued): ABOWELD 8101-7/ABOCKJRE 8101-7: Peanutbutter-like, thix., more filled for minimum shrinkage & better heat transfer. Pot life: 4-6 hrs. l/l ratio. Full properties developed by heat cure or postcure. Same consistency as 55-25, but best where rigidity, hardness, heat and chemical resistance are the primary factors. ABOCAST 8108-8/ABOCURE 8101-8: Tar-filled, low-viscosity, black, plasticized resurfacing & patching compound. Pot life: l-2 hrs. l/l ratio. For asphalt, masonry, metal, wood, concrete, etc. Mainly designed to resurface asphaltic & blacktop surfaces, runways, driveways, roofs, decks, docks, boats, etc. ABOWELD 8012-5/ABOCURE 8012-5: Aluminum-filled putty, "Plastic Alumimum". Non-shrinking, Tough adhesive filler. Pot life: l-2 hrs. 2/l ratio. Most generally used adhesive putty for metals, primarily as a filler, when an "all metal" filler is specified. ABOWELD 8012-6/ABOCURE 8012-6: The iron-filled putty, "Plastic Steel". Non-shrinking, standard adhesive filler. Pot life: l-2 hrs. 2/l ratio. Preferred when iron filler is required for special purposes, magnetic properties, weight, steel appearance, etc. ABOWELD 7801-5/ABOCURE 7801-5: Alumimum-filled thixotropic paste. The most versatile of metal-filled pastes. Pot life: l-2 hrs. 2/l ratio. Lighter, easier to spread than putty. All-purpose structural adhesive, high-strength filler & patching compound. ABOWELD 8101-9/ABOCURE 8101-g: Alumimum-filled thixotropic paste. Highest heat, solvent & them. resistance. Pot life: l-2 hrs. 2/l ratio. Full properties developed by heat cure or postcure. Highest grade llVR"metal-filled adhesive paste, filler and patching compound mainly for heat & chemical resistance.
432
Adhesives, Sealants and Coatings for the Electronics Industty
ABATRON, INC.: The "VR" Epoxy Series(Continued): ABOWELD 0012-4/ABOCURE 8012-4: "Woodewox": The lisht-weisht structural adhesive waste for wood. Neutral or colored. Pot life: 30-40 minutes. l/l ratio. Filled. Lighter than water. It repairs, fills & replaces wood, without the shrinkage and limitations of the wood fillers. ABOWELD 48-33/ABOCDRE 48-33: The most versatile "VR" thixotropic paste. A structural and dielectric standard. Pot life: l-2 hrs. l/l ratio. Filled. All-purpose adhesive; filler, insulating & patching compound. White/black blend is standard. Also in other colors.
Encapsulating, Potting, Casting, Impregnating Compounds
433
BACON INDUSTRIES INC.: Clear General Purpose Potting Compound p-51: Potting Compound P-51 is a general purpose unfilled epoxy potting compound that will cure at room temperature to a clear slightly flexible material. It is suitable for the encapsulation of electronic components to be used at temperatures up to 250F and other applications requiring a transparent resilient compound. Recommended Mixing and Handling Parameters: Resin Compound: 51 Activator: BA-21 Activator Required, parts by weight/hundred of compound: 19.5 Viscosity of Activated Comvound at 75F... voise: 4 _ Working Life at 75F, hours: 2 Recommended Cure: 48 hr at 75F Alternate Cure: 4 hr at 140F Typical Physical Properties After Cure: Color (Gardner) - l/2 inch thick: 1 Shore D Hardness at 75F: 50 Tensile Strength, psi: 2100 Ultimate Elongation, percent: 65 Weisht Loss. 8 hours at 400F.. vercent: 1.9 Dielectric Constant at 1kHz: 4.54 Dissipation Factor at 1 KHz: 0.029 D.C. Volume Resistivity, ohm-cm: >lO 14 Refractive Index: 1.51 Water Absorption (24 hr/77F), percent: 2.1 Instructions For Use: To each 100 parts by weight of Compound 51, add 19.5 parts by weight of Activator BA-21 and mix thoroughly. Proceed with the casting operation. If the casting contains interstices, vacuum degassing for a few minutes will be required to obtain void-free castings.
434
Adhesives, Sealants and Coatings for the Electronics Industy
BACON INDUSTRIES INC.: General Purpose Potting Compound C-84/ BA-63: Compound 04, when used with Activator BA-63, yields an easyto-handle-at-room-temperature epoxy potting compound that after curing has good properties at moderate temperatures. It is a reasonably priced system that is recommended for potting and casting applications of up to one pound mass. It has inherently a high degree of resistance to flame propagation without the use of noxious additives. Recommended Mixing and Handling Parameters: Resin Compound: 04 Activator: BA-63 Activator Required, parts by weight per hundred of compound: 7.3 Mixing and Potting Temperature, F: 70 to 80 Work Life at 77F, minutes: 300 grams: 30 100 grams: 120 Viscositv of Comoound at 77F. noise: 600 Viscosit; of Activated Compound at 77F, poise: 60 Recommended Cure, hr/F: 3/77 + 21250 Alternate Cure, hr/F: 24/77 Typical Properties After Cure: Cure, hr/F: 16/77: Color: Black Linear Shrinkage, %: 0.06 Specific Gravity: 1.68 Hardness, Shore D: 81 Flexural Strength, psi: 7500 Young's Modulus in Flexure, psi: 1.1 x 10 6 Heat Distortion Temperature (264 psi), F: 122 Water Resistance (24 hr at 77F), %: 0.05 3177 plus 21250: Color: Black Linear Shrinkage, %: 0.00 Specific Gravity: 1.68 Hardness, Shore D: 86 Flexural Strength, psi: 10,000 Young's Modulus in Flexure, psi: 1.1 x 10 6 Heat Distortion Temperature (264 psi), F: 154 Water Resistance (24 hr at 77F), %: 0.04 Coefficient of Linear Thermal Expansion, 10 -6/F: 200F to 75F: 34 75F to -65F: 19
Encapsulating, Potting, Casting, Impregnating Compounds
435
BACON INDUSTRIES INC.: Instrument Grade Potting Compounds P-8OC and P-80F: Potting Compounds P-8OC and P-80F are highly-filled high performance epoxy systems featuring relatively low viscosity along with very low coefficient of thermal expansion, high strength, high modulus of elasticity and low shrinkage upon cure. These materials are useful in applications requiring high dimensional stability to temperatures over 200F as well as low outgassing in applications such as gyro motor stators, electro-magnetic devices and precision electronic devices operating in extreme environments. Both systems have outstanding thermal shock resistance. The two potting compounds are interchangeable in most aaolications. Pottins Comoound P-80C contains a ceramic filler that is purchased from an-outside vendor. Potting Compound P-80F contains a similar ceramic filler known as LO-X that was developed and is manufactured by Bacon. Because these compounds contain ceramic fillers, carbide or diamond-tipped cutting tools are necessary for machining. P-80C: Resin Compound: 24C Activator: BA-42 Activator Required, phr: 6.0 Mixing Temperature, F: 160 Viscosity of Activated Compound at 160F, poise: 15 Work Life at 160F (3OOg), min.: 50 Tack Free Time at 160F (3OOg), minutes: 60 Typical Properties After Cure: Cure, hr/F: in mold: 8/160+ in oven post cure: 16/212 Color: Red Density, g/cm 3: 1.86 Hardness, Shore D: 93
P-80F: Resin Comnound: 24F Activator: BA-42 Activator Required, phr: 6.0 Mixing Temperature, F: 160 Viscosity of Activated Compound at 160F, poise: 12 Work Life at 160F (3OOg), min.: 60 Tack Free Time at 160F (3OOg), minutes: 70 Typical Properties After Cure: Cure, hr/F: in mold: 8/160+ In oven oost cure: 161212 Color: Red _ Density, g/cm 3: 1.86 Hardness, Shore D: 93
436
Adhesives, Sealants and Coatings for the Electronics Industry
BACON INDUSTRIES INC.: Instrument Grade Potting Compounds P-82C and P-82F: Potting Compounds P-82C and P-82F are highly-filled high performance epoxy systems featuring relatively low viscosity along with practically no shrinkage stresses upon cure, low coefficient of thermal expansion, high strength and high modulus of elasticity. These materials are useful in applications requiring high dimensional stability to temperatures over 200F and for low outgassing in applications such as gyro motor stators, electromagnetic devices and precision electronic devices operating in extreme environments. Both systems have outstanding thermal shock resistance. The two potting compounds are interchangeable in most applications. Pottins Comoound P-82C contains a ceramic filler that is purchased-from-an outside vendor. Potting Compound P-82F contains a similar ceramic filler known as LO-X that was developed at Bacon's Watertown facility. Potting Compound P-82FXM is available also. This is the same as Potting Compound P-82F except that it contains no red pigment and the fillers, resins and activators have been specially processed to remove magnetic particles. It is used where magnetic contamination is detrimental to sophisticated sensitive electromagnetic devices. P-82C: Resin Compound: 24C Activator: BA-45 Activator Required, parts by weight per hundred of compound: 6.0 Viscosity of Activated Compound, poise at 135F: 49 at 160F: 15 Work Life (3OOg), minutes: at 135F: 65 at 160F: 55 Tack Free Time (3OOg), minutes: at 135F: 85 at 160F: 60 P-82F: Resin Compound: 24F Activator: BA-45 Activator Required, parts by weight per hundred of compound: 6.0 Viscosity of Activated Compound, poise at 135F: 47 at 160F: 9 Work Life (3OOg), minutes: at 135F: 80 at 160F: 55 Tack Free Time (3OOg), minutes: at 135F: 100 at 160F: 60
Encapsulating Potting, Casting, Impregnating Compounds
BACON INDUSTRIES INC.:
LOW
cost Potting Compound P-85:
Potting Compound P-85 is a highly filled heat-curing epoxy system designed for casting applications requiring ease of handling, long work life and short cure time. It has a low coefficient of thermal expansion, high heat distortion temperature and g00a electrical properties. Potting Compound P-85 is useful in electronic applications involving high voltages. Recommended Mixing and Handling Parameters: Resin Compound: C-85 Activator: BA-60 Activator Required, parts by weight per hundred of compound: 8.0 Mixinc and Pottins Temverature, F: 180 Viscosity of acti;ated‘compound at 180F, p: 22.5 Working Life at 180F, minutes: 45 Pot Life (tack-free time) at 180F, minutes: 90 Recommended Cure, hr/F: 4/180 Typical Properties After Cure: Cure, hr/F: 41180 Black Specific Gravity: 1.81 Linear Shrinkage on cure, %: 0.05 Flexural Strength, psi: 14,000 Glass Transition Temperature, F: By TMA: 207 By DSC: 218 ASTM Heat Distortion Temperature, F: 213 Hardness, Shore D: 91 Coefficient of Thermal Expansion, 10 -6/F: from -65~ to 80F: 15 from 80F to 200F: 19 Dielectric Constant at 1 kHz, 77F: 4.54 Dissipation Factor at 1 kHz, 77F: 0.0035 Volume Resistivity, ohm-cm: 77F: 4 x 10 16 Cure, hr/F: 21180 + 2/300: Black Specific Gravity: 1.81 Flexural Strength, psi: 11,500 Flexural Modulus, 10 6 psi: 1.2 Glass Transition Temperature, F: Bv TMA: 300 B; DSC: 324 ASTM Heat Distortion Temperature, F: 294 Hardness, Shore D: 91 Coefficient of Thermal Expansion, 10 -6/F: from -65~ to 80F: 15 from 80F to 200F: 19 Machineability: Fair
437
438
Adhesives, Sealants and Coatings for the Electronics Industy
BACON INDUSTRIES INC.: Microcircuit Grade Potting Compound P-86: Potting Compound P-86 is a highly filled heat-curing system designed for use in electronic and microcircuit packaging. It is exceptionally fluid, can be handled easily at room temperature, cures in a relatively short time and has excellent electrical properties at high temperatures. Because Potting Compound P-86 uses a liquid anhydride curing agent, it usually can be used over semiconductor junctions without causing poisoning failure. The costly step of protecting chips with silicone rubber barrier coatings can be eliminated in many applications. Recommended Mixing and Handling Parameters: Resin Compound: C-85 Activator: BA-62 Activator Required, parts by weight per hundred of compound: 27.0 Viscosity of Activated Compound, poise: at 75F: 40 at 180F: 3.0 Working Life, hours: at 75F: ~16 at 180F: 1 Work Life at 180F, minutes: 80 Pot Life (tack-free time) at 180F, minutes: 100 Recommended Cure, hr/F: 4/180 Alternate Cure, hr/F: 2/185 plus 3/300 Typical Properties After Recommended Cure: Color: Black Specific Gravity: 1.72 Linear Shrinkase on Cure. %: 0.16 Flexural Strength, psi: i2100 Flexural Modulus, 10 6 psi: 1.6 Water Absorption (24 hours at 77F), %: 0.02 Heat Distortion Temperature (264 psi), F: 185 Glass Transition Temperature (Tg) by DSC, F: 165 Hardness, Shore D: 90 Coefficient of Thermal Expansion, 10 -6/F: 80 to 200F: 22 -65 to 80F: 18 Machineability: Fair Dielectric Constant at 1 kHz: 77F: 3.91 212F: 3.77 Dissipation Factor at 1 kHz: 77F: 0.0033 212F: 0.0033 Volume Resistivity, ohm-cm: 77F: 2 x 10 16 212F: 4 x 10 16
Encapsulating, Potting, Casting, Impregnating Compounds
439
BACON INDUSTRIES INC.: Coil Impregnants: Unfilled, low viscosity, two-part compounds. Their prime application is the impregnation of electronic components containing a high percentage of fine wires where complete penetration and freedom from voids is important. These compounds are useful also for casting and coating applications where a low viscosity material is required. Coil Impregnants 2, 3 and 6 are pure epoxy compounds. Coil Impregnant 2 is the preferred material unless the shorter work life or cure cycle of Coil Impregnant 3, or the longer work life of Coil Impregnant 6 is desired. Adhesive FA-14 is a modified epoxy compound having very low viscosity and the best ability to penetrate cracks and crevices. CI-2 *: Activator: BA-1 Parts by weight of activator per hundred parts by weight of impregnant: 10.0 Viscosity of activated impregnant at 75F, poise: 5 Surface Tension of activated impregnant at 75F, dyne/cm: 49 Recommended Cure, hr/F: 81212 Pot Life at 75F, hr: 8 Cured Properties: Gyro Grade: yes Hardness, Shore D: 85 Coefficient of Linear Exp between -65F and 80F, 10 -6/F: 49 Moisture Absorption, 24 hr at 75F, %: 0.08 Young's Modulus in flexure, psi x 10 -6: 0.5 Yield Strength in flexure,.psi x 10 -6: 13 Specific Gravity: 1.18 Dielectric Constant at 1 kHz.: 3.5 Dissipation Factor at 1 kHz: 0.002 Volume Resistivity, ohm-cm: 5 x 10 16 * Coil Impregnant 1 is also available. It has the same cured properties as Coil Impregant 2 but has an activated viscosity of 15 poise at Room Temperature.
440
Adhesives, Sealants and Coatings for the Electronics Industry
BACON INDUSTRIES INC.: Coil Impregnants (Continued): CI-3: Activator: BA-4 Parts by weight of activator per hundred parts by weight of impregnant: 5.0 Viscosity of activated impregnant at 75F, poise: 20 Surface tension of activated impregnant at 75F, dyne/cm: 43 Recommended Cure, hr/F: 21200 Pot Life at 75F, hr: 4 Cured Properties: Gyro Grade: yes Hardness, Shore D: 85 Coefficient of Linear Exp between -65F and 80F, IO -6/F: 42 Moisture Absorption, 24 hr at 75F, 3: 0.09 Young's Modulus in flexure, psi x 10 -6: 0.4 Yield Strength in flexure psi x 10 -3: 12 Specific Gravity: 1.18 Dielectric Constant at 1 kHz: 3.8 Dissipation Factor at 1 kHz: 0.003 Volume Resistivity, ohm-cm: 1 x 10 17 CI-6: Activator: BA-45 Parts by weight of activator per hundred parts by weight of impregnant: 23.0 Viscosity of activated impregnant at 75F, poise: 8.5 Surface Tension of activated impregnant at 75F, dyne/cm: 43 Recommended Cure, hr/F: 4/212 Pot Life at 75F, hr: 24 Cured Properties: Gyro Grade: yes Hardness, Shore D: 85 Coefficient of Linear Exp between -65F and 80F, 10 -6/F: 40 Moisture Absorption, 24 hr at 75F, 3: 0.10 Young's Modulus in flexure, psi x 10 -6: 0.3 Yield Strength in flexure psi x 10 -3: 12 Specific Gravity: 1.18 Dielectric Constant at 1 kHz: 3.7 Dissipation Factor at IkHz: 0.002 Volume Resistivity, ohm-cm: 1 x 10 16
Encapsulating, Potting, Casting, Impregnating Compounds
BACON INDUSTRIES INC: Coil Impregnants (Continued): FA-14: Activator: BA-45 Parts bv weisht of activator ner hundred warts bv weisht of impregnant: 24.5 Viscosity of activated impregnant at 75F, poise: 3 Surface Tension of activated-impregnant at75F, dyne/cm: 37 Recommended Cure, hr/F: 81160 Pot Life at 75F, hr: 8 Cured Properties: Gyro Grade: yes Hardness, Shore D: 84 Coefficient of Linear Exw between -65F and 80F. 10 -6/F: 37 Moisture Absorption, 24 hr at 75F, %: 0.16 Young's Modulus in flexure, psi x 10 -6: 0.5 Yield Strength in flexure psi x 10 -3: 10 Specific Gravity: 1.12 Dielectric Constant at 1 kHz: 3.7 Dissipation Factor at 1 kHz: 0.007 Volume Resistivity, ohm-cm: 1 x 10 17
441
442
Adhesives, Sealants and Coatings for the Electronics Industry
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds: Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-11: Compound: 1119 Activator: BA-1 Activator Required, PHC: 3.20 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot Life: Temperature, F: 212 Minutes: 90 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 16 4 Temperature, F: 212 Typical Properties After Recommended Cure: Specific Gravity: 1.85 Color After Cure: Brown Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 23 80~ to -65~: 14 Linear Shrinkage on Cure, %: 0.3 Machinability: Excellent Tensile Strength, psi: 6800 Young's Modulus in Flexure, at 70F, 10 6 psi: 1.1 Creep at 200F mil/in (3000 psi load for 24 hr): 60 Moisture Absorption after 10 days at 96% RH, %: 0.2 Weisht Loss After 6 Months at 300F. %: 0.5 Crack Resistance Factor: 1040 Dissipation Factor at 1kHz: 0.002 Dielectric Constant at IkHz: 5.37 Volume Resistivity, ohm-cm: 6 x IO 16 Thermal Conductivity, BTU-in/hr-ft 2-F: 2.0 Flammability: SE Chief Advantages: Excellent machinability, general purpose
Encapsulating, Potting, Casting, Impregnating Compounds
443
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-14: Compound: Activator:'~~~~ Activator Reauired. PHC: 3.12 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot LifeTemperature, F: 212 Minutes: 60 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 16 4 Temperature, F: 212 Typical Properties After Recommended Cure: Soecific Gravitv: 1.77 Color after Cure: Brown Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 2080~ to -65F: 11 Linear Shrinkage on Cure, %: 0.3 Machinability: Fair Tensile Strength, psi: 12200 Young's Modulus in Flexure, at 70F, 10 6 psi: 1.6 Creep at 200F mil/in (3000 psi load for 24 hr): 50 Moisture Absorption After 10 days at 96% RH, 8: 0.3 Weight Loss after 6 months at 300F, %: 0.4 Crack Resistance Factor: 1740 Dissioation Factor at 1 kHz: 0.030 Dielectric Constant at 1 kHz: 4.79 Volume Resistivity, ohm-cm: 2 x IO 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: SE Chief Advantages: Low coefficient High tensile strength
*
Compounds 1420A and 1420F are also available. These comoounds have a lonaer wot life than the warent comwound with 1420F being the iongest. 1420 and i42OA are tan in color, 1420F is grey-white to pink-white. The cured properties of the potting compounds are similar.
444
Adhesives, Sealants and Coatings for the Electronics Indasty
BACON
INDUSTRIES
INC.:
Epoxy Resin Potting compounds (Continued):
Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-19: compound: 1119 Activator: BA-2A Activator Required, PHC: 35.2 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot Life: Temperature, F: 212 Minutes: 50 Recommended Cure: In Mold, Hours: 8 4 Temperature, F: 212 Plus in Oven, Hours: 40 8 Temperature, F: 300 Typical Properties After Recommended Cure: Specific Gravity: 1.87 Color after Cure: Blue Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 18 80F to -65F: 15 Linear Shrinkage on Cure, %: 0.2 Machinabilitv: Excellent Tensile Strekgth, psi: 6900 Younq's Modulus in Flexure, at 70F. 10 6 osi: 1.0 Creep at 200F mil/in (3000.psi load for 24 hr): 1 Moisture Absorption after 10 days at 96% RH, %: 0.2 Weight Loss after 6 Months at 300F, 8: 0.3 Crack Resistance Factor: 830 Dissipation Factor at 1 kHz: 0.002 Dielectric Constant at IKHz: 4.78 Volume Resistivity, ohm-cm: 3 x 10 16 Thermal Conductivity, Btu-in/hr-ft 2-F: 2.0 Flammability: NB Chief Advantages: Excellent machinability, low creep
Encapsulating, Potting, Casting, Impregnating Compounds
445
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-20: Compound: 1420 Activator: BA-3A Activator Required, PHC: 32.0 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot Life: Temperature, F: 212 Minutes: 25 Recommended Cure: In Mold, Hours: 8 4 Temperature, F: 212 Plus in Oven, Hours: 16 8 Temperature, F: 300 Typical Properties After Recommended Cure: Specific Gravity: 1.79 Color after Cure: Red Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 16 80~ to -65~: 13 Linear Shrinkage on Cure, %: 0.1 Machinability: Fair Tensile Strength, psi: 10100 Young's Modulus in Flexure, at 70F, 10 6 psi: 1.3 Creep at 200F mil/in (3000 psi load for 24 hr): 1 Moisture Absorption After 10 days at 96% RH, %: 0.2 Weisht Loss after 6 Months at 300F. F: 0.1 Crack Resistance Factor: 1290 Dissipation Factor at 1 kHz: 0.019 Dielectric Constant at 1 kHz: 4.35 Volume Resistivity, ohm-cm: 2 x 10 15 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: NB _ Chief Advantages: High tensile Low creep
446
Adhesives, Sealants and Coatings for the Electronics Industry
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: P-24: Compound: 24 * Activator: BA-2A Activator Required, PHC: 26.3 Potting Temperature, F: 250 Viscositv at Potting Temp, Poise: 35 Pot LifeTemperature, F: 250 Minutes: 20 Recommended Cure: In Mold, Hours: 84 Temperature, F: 212 Plus in Oven, Hours: 168 Temperature, F: 300 Typical Properties After Recommended Cure: Soecific Gravitv: 1.89 Color after Cure: Maroon Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 14. 80~ to -65~: 10 Linear Shrinkage on Cure, %: 0.1 Machinability: Fair Tensile Strenoth. osi: 12.900 _. young's Modulus in Flexure, at 70F, 10 6 psi: 1.8 Creep at 200F mil/in (3000 psi load for 24 hr): 1 Moisture Absorption after IO days at 96% RH, %: 0.1 Weight Loss after 6 Months at 300F, 8: 0.1 Crack Resistance Factor: 1930 Dissipation Factor at 1 kHz: 0.025 Dielectric Constant at 1 kHz: 4.44 Volume Resistivity, ohm-cm: 4 x 10 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: NE Chief Advantages: Low coefficient high tensile, low creep L
* Compound 24P is available also with a longer pot life than 24. Cured properties are similar.
Encapsulating, Potting Casting, Impregnating Compounds
447
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: P-38: Compound: 38 Activator: BA-1 Activator Required, PHC: 2.12 Potting Temperature, F: 300 Viscosity at Potting Temp, Poise: 9 Pot Life: Temperature, F: 300 Minutes: 60 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 16 4 Temperature, F: 212 Typical Properties After Recommended Cure: Specific Gravity: 1.92 Color after Cure: Brown Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 12 80F to -65F: 8 Linear Shrinkage on Cure, %: 0.1 Machinability: Fair Tensile Strength, psi: 13,600 Young's Modulus in Flexure, at 70F, 10 6 psi: 2.4 Creep at 200F mil/in (3000 psi load for 24 hr): 5 Moisture Absorption after 10 days at 96% RH, %: 0.1 Weight Loss After 6 Months at 300F, %: 0.3 Crack Resistance Factor: 2300 Dissipation Factor at 1 kHz: 0.034 Dielectric Constant at 1 kHz: 5.31 Volume Resistivity, ohm-cm: 2 x 10 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: SE Chief Advantages: Least tendency to crack, lowest coefficient
448
Adhesives, Sealants and Coatings for the Electronics Industy
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-70: Potting Compound: 24 * Activator: BA-1 Activator Required, PHC: 2.5 Potting Temperature, F: 250 Viscosity at Potting Temp, Poise: 40 Pot Life: Temperature, F: 212 Minutes: 60 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 20 12 Temperature, F: 212 Typical Properties After Recommended Cure: Saecific Gravity: 1.87 Color After Cure: Red Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 14. 80F to -65~: 9 Linear Shrinkage on Cure, 8: 0.2 Machinability: Fair Tensile Strenath. osi: 13.000 Young's Modul& in&Flexure, at 70F, 10 6 psi: 2.0 Creep at 200F mil/in (3000 psi load for 24 hr): 40 Moisture Absorption after 10 days at 96% RH, %: 0.2 Weight Loss After 6 Months at 300F, %: 0.3 Crack Resistance Factor: 1950 Dissipation Factor at 1 kHz: 0.031 Dielectric Constant at 1 kHz: 5.0 Volume Resistivity, ohm-cm: ---Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: SE Chief Advantages: Properties between P-41 & P-81 * Compound 24F is available also with a longer pot life than 24. Cured properties are similar.
Encapsulating, Potting, Casting, Impregnating Compounds
449
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: P-82c: Compound: 24C * Activator: BA-45 Activator Reauired. PHC: 6.0 Potting Temperature, F: 160 Viscosity at Potting Temp, Poise: 20 Pot LifeTemperature, F: 160 Minutes: 45 Recommended Cure: In Mold, Hours: 24 Temperature, F: 135 Plus in Oven, Hours: 24~24 Temperature, F: 160 200 Typical Properties After Recommended Cure: Specific Gravity: 1.86 Color after Cure: Red Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 13 80F to -65~: 11 Linear Shrinkage on Cure, %: -0.05 Machinability: Fair Tensile Strenath. nsi: ---Young's Modulus in*Flexure, at 70F, 10 6 psi: 2.2 Creep at 200F mil/in (3000 psi load for 24 hr): 8 Moisture Absorption after 10 days at 96% RH, %: 0.02 Weight Loss After 6 months at 300F, %: ---Crack Resistance Factor: 1500 Dissipation Factor at 1 kHz: 0.016 Dielectric Constant at 1 kHz: 4.87 Volume Resistivity, ohm-cm: 1 x 10 15 Thermal Conductivitv. Btu-infhr-ft 2-F: 5 Flammability: ---- ^. Chief Advantages: Easier to process than P-38 and P-81. Low-stress. * Compound 24F is available also to make P-82F. Cured properties are similar.
450
Adhesives, Sealants and Coatings for the Electronics Industry
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Light Weight - Glass Microballoon Filled: Potting Compound: P-75: Comoound: 75 Activator: BA-57 Activator Required, PHC: 15.5 Potting Temperature, F: 160 Viscosity at Potting Temp, Poise: 30 Pot Life: Temperature, F: 160 Minutes: 30 Recommended Cure: In Mold, Hours: 8 Temperature, F: 160 Plus in Oven, Hours: 16 Temperature, F: 250 Typical Properties After Recommended Cure: Specific Gravity: 0.75 Color after Cure: Black Coef. of Linear Expansion, 10 -6/F: 200F to 80F: ---80F to -65F: 16 Linear Shrinkage on Cure, %: 0.27 Machinability: Excellent Tensile Strength, psi: ---Young's Modulus in Flexure, at 70F, 10 6 psi: 0.37 Creep at 200F mil/in (3000 psi load for 24 hr): ---Moisture Absorption after 10 days at 96% RH, %: 0.15 Weisht Loss after 6 Months at 300F. %: ---Crack Resistance Factor: ---Dissipation Factor at 1 kHz: 0.010 Dielectric Constant at 1 kHz: 2.54 Volume Resistivity, ohm-cm: 3 x 10 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 1.4 Flammability: SE Chief Advantages: Low density non-settling self-extinguishing
Encapsulating, Potting, Casting, Impregnating Compounds
451
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Thermally Conductive Potting Compounds: P-56: Comoound: 56 Activator: BA-22 Activator Required, PHC: 71 Potting Temperature, F: 160 Viscosity at Potting Temperature, poise: 16 Work Life: Temperature, F: 160 Minutes: 50 Recommended Cure: In Mold, Hours: 16 Temperature, F: 160 Plus in Oven, Hours: ---Temperature, F: ---Typical Properties After Recommended Cure: Specific Gravity: 2.5 Specific Heat, cal/gm: 0.3 Color after Cure: Brown Coefficient of Linear Expansion, 150F to 32F, IO -6/F: 18 Machinability: Good Moisture Absorption after IO days at 96% RH, %: 0.08 Dissipation Factor at 1 kHz: 0.003 Dielectric Constant at 1 kHz: 5.80 Thermal Conductivitv. Btu-in/hr-ft 2-F: IO Flammability: SE _' Chief Advantages: Settles but maximum thermal conductivity for settled portion P-56A: Compound: 56 Activator: BA-22A Activator Required, PHC: 71 Potting Temperature, F: 160 Viscosity at Potting Temperature, poise: 13 Work Life: Temperature, F: 160 Minutes: 40 Recommended Cure: In Mold, Hours: 3 Temperature, F: 160 Plus In Oven, Hours: 5 Temperature, F: 160
452
Adhesives, Sealants and Coatings for the Electronics Industy
BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Thermally Conductive Potting Compounds(Continued): P-56A (Continued): Typical Properties After Recommended Cure: Specific Gravity: 2.3 Snecific Heat. Cal/am: 0.3 Color after Cure: Brown Coefficient of Linear Expansion, 150F to 32F. 10 -6/F: 18 Machinability: Good _ Moisture Absorption after 10 days at 96% RH, %: 0.08 Dissipation Factor at 1 kHz: 0.003 Dielectric Constant at 1 kHz: 5.76 Thermal Conductivity, Btu-in/hr-ft 2-F: 7 Flammability: SE Chief Advantages: Like P-56 but almost non-settling P-178: Compound: 17% Activator: BA-47 Activator Required, PHC: 6.0 Potting Temperature, F: 160 Viscosity at Potting Temperature, poise: 14 Work Life: Temperature, F: 160 Minutes: 100 Recommended Cure: In Mold, Hours: 8 Temperature, F: 160 Plus In Oven, Hours: 0 Temperature, F: 160 Typical Properties After Recommended Cure: Specific Gravity: 2.32 Specific Heat, cal/gm: 0.3 Color after Cure: Black Coefficient of Linear Expansion, 150F to 32F, 10 -6/F: 19 Machinability: Poor Moisture Absorption after 10 days at 96% RH, %: 0.16 Dissipation Factor at 1 kHz: 0.006 Dielectric Constant at 1 kHz: 6.32 Thermal Conductivity, Btu-in/hr-ft 2-F: 7 Flammability: ---Chief Advantages: Non-Settling
Encapsulating, Potting, Casting, Impregnating Compounds
453
BACON INDUSTRIES INC.: Non-Magnetic Potting Compounds: Several of Bacon Industries gyro grade epoxy potting compounds are avalable in non-magnetic (XM) versions. These potting compounds are the same as the regular gyro grades except that the fillers and resins used have been specially processed to remove para-magnetic particles. They are used where magnetic contamination is detrimental to sophisticated sensitive electromagmetic assemblies. The currently available gyro grade XM potting compounds* are: P-IIXM: Compound: 1119XM Activator: BA-IXM P-IICXM: Compound: 1420CXM Activator: BA-IXM P-14FXM: Compound: 1420FXM Activator: BA-IXM P-19XM: Compound: 1119XM Activator: BA-2AXM P-ZOCXM: Compound: 1420CX~ Activator: BA-3AXM P-ZOFXM: Compound: 1420FXM Activator: BA-3AXM P-24CXM: Compound: 24CXM Activator: BA-2AXM P-24FXM: Compound: 24FXM Activator: BA-2AXM P-82CXM: Compound: 24CXM Activator: BA-45XM P-82FXM: Compound: 24FXM Activator: BA-45XM * Other Bacon Industries potting compounds can be specially processed to meet specific applications.
454
Adhesives, Sealants and Coatings for the Electronics Zndustry
BIWAX CORP.: Impregnating Compounds High Temperature: Compound E-715: Softening Point: 290-300F. Penetration: 12-17 Flash Point: Over 400F. Color: Lt. Yellow Impregnating Temperature: 310-360F. Suecial Prooerties and Applications: Condenser impregnating-compound for 125C. operation. Dielectric Constant: 2.20-2.40 Dissipation Factor: .0002-.0007 Volume Resistivity (ohm-cm): >l x 10 14 Dielectric Strength V/Mil: 440 Compound A-5999: Softening Point: 225-230F. Penetration: lo-12 Specific Gravity: .98 - .99 Flash Point: Over 400F. Viscosity: At 260F.: 19 cps. Color: Tan Impregnating Temperature: 260-265F. Special Properties and Applications: Rapid setting coil dipping and impregnating compound. Low moisture permeability. Dielectric Constant: 2.53-2.55 Dissipation Factor: .0048 - .0050 Dielectric Strength V/Mil: 561 Compound E-5923: Softening Point: 267-269F. Penetration: 8-10 Specific Gravity: .93 - .94 Flash Point: Over 400F. Viscosity: At 275F. IO-12 cps. Color: Lt. Amber Impregnating Temperature: 275-285F. Dipping Temperature: 265-275F. Special Properties and Applications: Impregnation of transformer coils requiring high drip point. Dielectric Constant: 2.24-2.26 Dissipation Factor: .0078-.0080 Volume resistivity (ohm-cm): >3.41 x 10 14
Encapsulating, Potting, Casting, Impregnating Compounds
BIWAX CORP.: Impregnating Compounds High Temperature
455
(Continued):
Compound E-5983: Softening Point: 267-272F. Penetration: 8-10 Specific Gravity: .96 - -98 Flash Point: Over 400F. Viscosity: At 300F. 21 cps. Cold Flow: None at 250F. Color: Tan Impregnating Temperature: 280-310F. Dipping Temperature: 290-330F. Special Properties and Applications: Potting and dipping wax suitable for -40 to 235F. operating temperatures. Dielectric Constant: 2.90-3.10 Dissipation Factor: .0570-.0590 Dielectric Strength V/Mil: 500
456
Adhesives,
Sealants
and Coatings for the Electronics
Industry
BIWAX CORP.: Impregnating Compounds Low Temperature: Compound 745: Softening Point: 188-1931. Penetration: 11-15 Specific Gravity: .92 - .94 Flash Point: Over SOOF. Viscosity: At 210F. 15-16 cps Color: Amber Impregnating Temperature: 235-245F. Dipping Temperature: 210-2301. Pouring Temperature: 225-250F. Special Properties and Applications: Impregnation of fine wire coils, condensers, ceramic & wlastic warts. Dielectric Constant: 2.20-2.22 Dissipation Factor: .0004-.0006 Volume Resistivity (ohm-cm): >3.4 x 10 14 Comwound 796: Softening Point: 188-193F. Penetration: 11-15 Specific Gravity: -92 - .94 Flash Point: Over 500F. Viscosity: At ZIOF. 15-16 cps. Color: Amber Imwreonatins Temwerature: 215-220F. Dipping Temperature: ZOO-220F. Pouring Temperature: ZIO-230F. Special Properties and Applications: Impregnation of audio coils, chokes & paper tubes & forms Porous ceramics IF & RF coils. Dielectric Constant: 2.00-2.20 Dissipation Factor: .OOOl-.0005 Volume Resistivity (ohm-cm): >l x 10 14 Compound C-748: Softening Point: 195-ZOOF. Penetration: 7-9 Specific Gravity: .92 - -93 Flash Point: Over 450F. Viscosity: At ZIOF. 12-13 cps Cold Flow: None at 135F. Color: Amber Impregating Temperature: 220-235F. Special Properties and Applications: Transformer coil impregnation. Lt. color. Dielectric Constant: 2.00-2.20 Dissipation Factor: .OOOl - .0005 Volume Resistivity (ohm-cm): >I x 10 14
Encapsulating, Potting, Casting, Impregnating Compounds
BIWAX CORP.: Impregnating Compounds Low Temperature
(Continued):
Compound D-726: Softening Point: 217-222F. Penetration: 13-14 Specific Gravity: .92 - .94 Flash Point: Over 450F. Viscosity: At 250F. 16-20 cps. Color: Ivory Impregnating Temperature: 250-270F. Special Properties and Applications: Condenser imvresnatins comnound. hish IR retention at 85C. Dielectric Constant: 2.24-2.26 . Dissipation Factor: .OOOl - .0002 Volume Resistivity (ohm-cm): >2.05 x 10 14 Dielectric Strength V/mil: 380 Compound M-262: Softening Point: 165-180F. Penetration: 15-20 Svecific Gravitv: -92 - -94 Flash Point: Over 500F. Viscosity: At 210F. 15-25 cps. Color: Amber Impregnating Temperature: 210-230F. Dipping Temperature: 200-220F. Pouring Temperature: 210-230F. Special Properties and Applications: Dipping and impregnating wax.
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Adhesives, Sealants and Coatings for the Electronics Industry
BIWAX CORP.: Potting
Compounds Heat Conductive:
Compound C-1314: Softenins Point: 285-295F. Specific-Gravity: 2.20-2.40 Flash Point: Over 475F. Cold Flow: None at 260F. Color: Black Pouring Temperature: 310-350F. Special Properties and Applications: Heat conductive potting compound for transformers. Compound C-1316: Softening Point: 280-290F. Specific Gravity: 1.88-1.94 Flash Point: Over 400F. Cold Flow: None at 260F. Color: Black Pouring Temperature: 320-350F. Special Properties and Applications: Heat conductive potting compound for transformers. Compound C-1325: Softening Point: 270-275F. Penetration: 20-25 Snecific Gravitv: l-45-1.50 Fiash Point: Over 475F. Cold Flow: None at 250F. Color: Black Pouring Temperature: 300-350F. Special Properties and Applications: Soft adhesive potting compound for transformers.
Encapsulating, Potting Casting, Impregnating Compounds
BIWAX CORP.: Potting, Dipping & Coating Compounds: Compound C-1334: Softening Point: 270-280F. Snecific Gravitv: 1.45-1.50 Flash Point: Over 500F. Cold Flow: None at 105C. Color: Black Pouring Temperature: 300-350F. Special Properties and Applications: Heat conductive potting compound for transformers. Compound B-1128: Softening Point: 170-180F. Penetration: 20-25 Specific Gravity: .99-1.01 Flash Point: Over 425F. Viscosity: At 300F: 100-150 cps. Cold Flow: None at 145F. Color: Black Pouring Temperature: 275-325F. Special Properties and Applications: Sealing condensers and special coils, small dry cell assemblies. adhesive and oliable seal for coils. No crack, low temperature. Dielectric Constant: 2.61-2.65 Dissipation Factor: .0145--0155 Volume Resistivity (ohm-cm): >l x 10 14 Compound F-1125: Softening Point: 260-270F. Penetration: lo-22 Specific Gravity: 1.00-1.01 Flash Point: Over 450F. Cold Flow: None at 105C. Color: Black Pouring Temperature: 320-370F. Special Properties and Applications: Soft potting compound for filters. Compound C-1152: Softening Point: 270-275F. Penetration: 23-26 Specific Gravity: -94 - .99 Flash Point: Over 500F. Viscosity: At 360F: 180-200 cps. Cold Flow: None at 250F. Color: Black Dipping Temperature: 285-310F. Pouring Temperature: 290-350F. Special Properties and Applications: Flyback coil tire compound for corona suppression. Dielectric Strength V/Mil: 364
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Adhesives, Sealants and Coatings for the Electronics Industry
BIWAX CORP.: Potting, Dipping & Coating Compounds (Continued): Compound C-1348: Softening Point: 265-275F. Penetration: 5-15 Specific Gravity: 2.05-2.10 Flash Point: Over 450F. Cold Flow: None at 105C. Celor: Black Pouring Temperature: 340-360F. Special Properties and Applications: Heat conductive potting compound for transformers and line filters. Compound C-1328: Softening Point: 224-234F. Penetration: 15-20 Specific Gravity: 1.45-1.50 Flash Point: Over 400F. Cold Flow: None at 170F. Color: Black Pouring Temperature: 250-280F. Special Properties and Applications: LOW pouring temperature heat conductive potting compound. Compound 1613: Softening Point: 260-265F. Penetration: 23-24 Specific Gravity: 1.00-1.02 Flash Point: Over 400F. Viscosity: At 325F. 70-90 cps. Cold Flow: 230-235F. Color: Black Pouring Temperature: 300-325F. Special Properties and Applications: Potting compound. High cold flow combined with low pour temperature. Dielectric Constant: 2.52-2.54 Dissipation Factor: .0090-.OlOO Volume Resistivity (ohm-cm): >2.31 x 10 14
Encapsulating, Potting Casting Impregnating Compounds
461
BIWAX CORP.: Potting, Dipping & Coating Compounds (Continued): Compound 1628: Softening Point: 235-240F. Penetration: 15-18 Specific Gravity: 1.01-1.02 Flash Point: Over 425F. Viscosity: At 350F. 75 cps. Cold Flow: 215-220F. Color: Black Pourins Temnerature: 325-350F. Special Properties and Applications: Low viscosity potting compound for small units. No flow in 24 hrs. at 212F. Excellent adhesion and sealing properties. Compound 1655: Softening Point: 235-240F. Penetration: 7-10 Specific Gravity: 1.34-1.36 Flash Point: Over 450F. Cold Flow: 210-215F. Color: Black Pourins Temnerature: 325-340F. Specia? Properties and Applications: Excellent for potting small units where heat dissipation important. Heat conductive, high cold flow, low pouring temperature. Compound 1697: Softening Point: 271-276F. Penetration: 12-16 Suecific Gravity: .96 - 1.01 Flash Point: Over 450F. Viscosity: At 360F. 90-110 cps. Cold Flow: None at 265F. Color: Black Dipping Temperature: 290-330F. Pouring Temperature: 290-350F. Special Properties and Applications: Reduces corona losses on high voltage coils. Dielectric Constant: 2.30-2.32 Dissipation Factor: .OlOO - .OllO Volume Resistivity (ohm-cm): =3.35 x 10 14 Dielectric Strength V/Mil: 470
462
Adhesives, Sealants and Coatings for the Electronics Industry
BIWAX CORP.: Sealing Compounds: Compound B-6528: Softening Point: 345-355F. Penetration: 11-16 Specific Gravity: .97-.99 Flash Point: Over 500F. Cold Flow: None at 320F. Color: Black Pouring Temperature: 400-430F. Special Properties and Applications: Used for sealing high current circuit breakers. Compound B-6541: Softening Point: 325-335F. Specific Gravity: 1.45-1.50 Flash Point: Over 450F. Cold Flow: None at 270F. Color: Brown Pouring Temperature: 390-440F. Compound G-2043: Softening Point: 240-250F. Penetration: O-l Specific Gravity: 1.45-1.50 Flash Point: Over 450F. Cold Flow: None at 220F. Color: Black Pouring Temperature: 350-360F. Special Properties and Applications: Sealing compound having good adhesion. Compound A-6563: Softening Point: 270-2SOF. Penetration: 3-7 Specific Gravity: 1.43-1.45 Flash Point: Over 400F. Cold Flow: None at 240F. Color: Red Pouring Temperature: 310-360F. Special Properties and Applications: High melting with excellent adhesion for sealing recesses in sockets switchbases etc. Compound 2078: Softening Point: 185-195F. Penetration: O-l Specific Gravity: 1.45-1.50 Flash Point: Over 400F. Cold Flow: None at 140F. Color: Red Pouring Temperature: 275-3251 Special Properties and Application: General purpose sealing compound.
Encapsulating, Potting, Casting, Impregnating Compounds
BIWAX CORP.: Special Compounds: Compound H-7088: Softening Point: 193-198F. Penetration: 2-7 Specific Gravity: .95 - .98 Flash Point: Over 375F. Color: Lt. yellow to tan Dipping Temperature: 275-335F. Pouring Temperature: 275-335F. Special Properties and Applications: Wafer mounting adhesive. Protective dip for small parts. Compound I-7004: Softening Point: 210-220F. Penetration: l-5 Specific Gravity: -96 - .99 Flash Point: Over 375F. Color: Lt. vellow to tan Dipping Temperature: 270-330F. Pouring Temperature: 300-340F. Special Properties and Application: Wafer mounting adhesive. Compound A-6575: Softening Point: 348-358F. Penetration: 11-16 Flash Point: Over 500F. Color: Amber brown Dipping Temperature: 400-425F. Screw & Fastener Coating: Compound A-6576: Softening Point: 340-350F. Penetration: 19-23 Specific Gravity: .97 - .99 Flash Point: Over 500F. Viscosity: At 420F 184 cps. Cold Flow: None at 270F. Color: Dk. Amber Dipping Temperature: 380-415F. Special Properties and Application: Plastic dip for screws used in the automotive industry.
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Adhesives, Sealants and Coatings for the Electronics Zndustry
BIWAX CORP.: Special Compounds (Continued): Wire Spotting: Compound A-6557: Softening Point: 335-345F. Penetration: 6-10 Specific Gravity: 1.18-1.21 Flash Point: Over 450F. Cold Flow: None at 265F. Color: Tan Dipping Temperature: 380-420F. Pouring Temperature: 370-430F. Special Properties and Applications: Excellent adhesion to paper, metal, glass, and ceramic. Dielectric Constant: 3.30-3.50 Dissipation Factor: -3500 - .3700 Compound B-6515: Softening Point: 215-225F. Penetration: 8-13 Specific Gravity: -97 - 1.00 Flash Point: Over 400F. Cold Flow: None at 200F. Color: Brown Dipping Temperature: 275-375F. Pouring Temperature: 300-375F. Potting Greases: Comnound 7048: Specific Gravity: .90 - .91 Flash Point: Over 475F. Viscosity: At 325F. 160-200 cps. Cold Flow: None at 185F. Color: Translucent Pouring Temperature: 275-300F. Special Properties and Applications: Soft adhesive potting compound. Excellent low temperature characteristics. Dielectric Constant: 2.21-2.27 Dissipation Factor: .OOOl - .0002 Volume Resistivity (ohm-cm): >3.5 x 10 15
Encapsulating,
Potting
Casting, Impregnating
Compounds
465
BIWAX CORP.: Special Compounds (Continued): Potting Greases (Continued): Compound 7022: Softening Point: 277-281F. Penetration: 169-172 Specific Gravity: .91 - -92 Flash Point: Over 450F. Viscosity: At 320F. 80 cps. Cold Flow: None at 225F. Color: Translucent Pouring Temperature: 320-370F. Special Properties and Applications: Very soft and adhesive. High drip point and cold flow -6OF. operating temperature.
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Adhesives, Sealants and Coatings for the Electronics Industry
BIWAX CORP.: Miscellaneous Impregnating, Potting, Dipping Compounds: Compound 6264: Softening Point: 170-180F. Penetration: 12-15 Suecific Gravitv: -98 - 1.00 Flash Point: Over 450F. Viscosity: At 250F. 22 cps Color: Tan Impregnating Temperature: 240-260F. Dipping Temperature: 220-240F. Special Properties and Applications: Impregnation of transformer coils. Low viscosity and good penetration into windings. Dielectric Constant: 2.38-2.40 Dissipation Factor: .0048 - .0050 Volume Resistivity (ohm-cm): >3.24 x 10 14 Compound D-6261: Softening Point: 227-232F. Penetration: 3-4 Specific Gravity: .97 - 1.00 Flash Point: Over 450F. Viscosity: At 260F. 20-24 cps Color: Tan Impregnating Temperature: 250-270F. Dipping Temperature: 250-2701. Pouring Temperature: 260-270~. Special Properties and Applications: Transformer impregnating compound. Low viscosity. Good penetration with high melting point. Dielectric Constant: 2.53-2.55 Dissipation Factor: .0023 - .0025 Volume Resistivity (ohm-cm): >2.95 x 10 14 Compound B-5913: Softening Point: 225-230F. Penetration: 14-18 Specific Gravity: .97 - .98 Flash Point: Over 400F. Viscosity: At 260F. 20 cps Color: Tan Impregnating Temperature: 2604280F. Dipping Temperature: 250-270F. Pouring Temperature: 250-280F. Special Properties and Applications: Rapid setting high melting point dipping wax. Dipping small coils, tubular condensers. Dielectric constant: 2.38-2.42 Dissipation Factor: .0074 - .0078 Volume Resistivity (ohm-cm): 1 x 10 14
Encapsulating, Potting, Casting, Impregnating Compounds
BIWAX CORP.: Miscellaneous Impregnating Potting, Dipping Compounds (Continued): Compound H-7088: Softening Point: 193-198F. Penetration: 2-7 Specific Gravity: .95 - -98 Flash Point: Over 375F. Color: Lt. yellow to tan Dipping Temperature: 275-335F. Pouring Temperature: 275-335F. Special Properties and Applications: Wafer mounting adhesive. Protective dip for small parts. Compound A-7008: Softening Point: 275-285~. Pentration: 18-23 Specific Gravity: .93 - .99 Flash Point: Over 450F. Cold Flow: None at 260F. Color: Lt. yellow to tan Dipping Temperature: 340-370F. Pouring Temperature: 350-380F. Special Properties and Applications: Potting and dipping wax suitable for use at 13OC. Dielectric Constant: 2.42-2.46 Dissipation Factor: .0300 - .0500 Volume Resistivity (Ohm-cm): >1.5 x 10 13
467
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Adhesives, Sealants and Coatings for the Electronics Industry
BONDED PRODUCTS, INC.: EPI-SEAL Clear Epoxy PE-X001: Potting and Encapsulation Compound (Meets MIL Spec. I-16923B) Mixing Procedure: Add all of Part A to Part B and mix thoroughly. To minimize air entrapment, do not mix too vigorously. If a completely bubble-free casting is required, apply vacuum and heat gently. Properties: Pot Life, 1 lb mass--2 hrs at 75F (24C) Brookfield viscosity (mix)--10560 cps Cure Schedule: A. Gel at room temperature (approximately 3 hrs) plus 3 hrs at 248F (12OC) or B. 7 days at room temperature. 1. Slightly lower properties are obtained with cure schedule B. Typical Physical Properties: Ultimate Tensile Strength, psi: 6500 Ultimate Elongation, %: 5 Hardness, Shore D: 82 Compressive Strength, psi: 22600(9000) Flexural Strength, psi: 13700(12000) Gardner Impact, in/lb: 66 Moisture Vapor Permeability, g/hr/cm: 0.62 x 10 -5 Heat Resistance, wt loss, %: .03 Coefficient of linear expansion, in/in/F: 4.4 x 10 -5 Thermal Shock: Passed all cycles Mechanical Shock, in lbs: 227 Typical Electrical Properties: Volume Resistivity, ohms/CM: Initial: 1.8 x 10 14 After 24 hrs immersion in H20: 5.3 x 10 13 Dielectric Strength, volts per mil: 1860
Encapsulating, Potting, Casting, Impregnating Compounds
469
BONDED PRODUCTS, INC.: EPI-SEAL Clear Epoxy PE-X002: Potting and Encapsulation Compound Mixing Procedures: Add all of Part A to Part B and mix thoroughly. To minimize air entrapment, do not mix too vigorously. If a completely bubble-free casting is required apply vacuum and heat gently. Properties: Pot Life, 1 lb mass--2 hrs at 75F (24C) Brookfield viscosity (mix)--17920 cps Cure Schedule: A. Gel at room temperature (approximately 3 hrs) plus 3 hrs at 248~ (12OC) B. 7 days at room temperature. 1. Slightly lower properties are obtained with Cure Schedule B. Typical Physical Properties: Ultimate Tensile Strength, psi: 7300(7000) Ultimate Elongation, %I 8 Hardness Shore D: 81 Compressive Strength, psi: 8100(6100) Flexural Strenqth, psi: 12000(10000) Gardner Impact-injlb: 42 1. Values in parenthesis obtained with Cure Schedule B. Tvoical Electrical Prooerties: "Volume Resistivity,-ohm-cm: 1.1 x 10 14 Dielectric Strength, step-by-step v/mil: 430 ARC resistance, sec.: 82 Power factor: 60 cycles: 0.0085 IO 3 cycles: 0.0108 10 6 cycles: 0.0213 Dielectric Constant: 60 cycles: 3.37 10 3 cycles: 3.32 IO 6 cycles: 3.08 Loss Factor: 60 cycles: 0.0285 10 3 cycles: 0.0359 10 6 cycles: 0.0656 1. Electrical properties measured on specimens cured with Schedule A 2. l/8 inch sample thickness
470
Adhesives,
Sealants
and Coatings for the Electronics
Industry
BONDED PRODUCTS, INC.: EPI-SEAL Clear Epoxy PE-X003: Potting and Encapsulation Compound Mixing Procedures: Add all of Part A to Part B and mix thoroughly. To minimize air entrapment, do not mix too vigorously. If a completely bubble-free casting is required, apply vacuum and heat gently. Properties: Pot Life, 1 lb. mass--3.5 hrs at 75F (24C) Brookfield Viscosity (mix)--97920 cps Cure Schedule: A. Gel at room temperature (approximately 3 hrs) plus 3 hrs at 248~ (120c) B. 7 days at room temperature 1. Slightly lower properties are obtained with Cure Schedule B. Tvoical Physical Prooerties: -‘Ultimate Tensile Strength, psi: 5800(4800) Ultimate Elongation, %: 8(4) Hardness Shore D: 80(75) Compressive Strength, psi: 5900(4700) Flexural Strength, psi: 7200(7700) Gardner Impact in/lb: >80 Values in parenthesis obtained with Cure Schedule B. Typical Electrical Properties: Volume Resistivity, ohm-cm: 1.5 x 10 14 Dielectric Strength, step-by-step v/mil: 470 ARC resistance, sec.: 76 Power factor: 60 cycles: 0.0090 10 3 cycles: 0.0108 10 6 cycles: 0.0170 Dielectric Constant: 60 cycles: 3.20 10 3 cycles: 3.14 10 6 cycles: 3.01 Loss Factor: 60 cycles: 0.0357 10 3 cycles: 0.0339 IO 6 cycles: 0.0572 Electrical properties measured on specimens cured with Schedule A
Encapsulating, Potting, Casting, Impregnating Compounds
471
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation: Excellent electrical properties Low temperature environment/low mechanical stress systems (at temperatures down to -70C) Flame retardant systems Low viscosity systems for penetration and bubble release High viscosity systems for regulated flow and penetration Low, medium and high hardness systems Non-freezing systems High strength systems Re-enterable systems - if required The following properties have been designed into every QURE system. - Low vapor hazard - Room temperature cure - Low exotherm - Good heat stability - Excellent hydrolytic stability - Low shrinkage - Low moisture sensitivity - Excellent wetting - Low stress Suggested applications in general potting, encapsulating and sealing. Aeronautical Electronics Dead Topping Encapsulant Amplifiers Defense Electronics Automotive Electronics Electronic Control Modules Ballasts Formed in Place Gaskets Cable Connections Ignition Systems Cable Plugging Inductors Cable Reclamation Integrated Circuits Cable Splice Encapsulatilon - Load Coil/Cases Cable Stubbing Marine Electronics Circuit Embedment Meters, Modules Computer Control Modules Reed Relays, Power Supplies Cryogenic, Ferrite Cores Shock Absorbers Seal Conduit Ends Sonar Buoys Sealant Bushings, Molds Transformers Selenium Rectifiers Voltage Regulators The QURE System Components: QURE polyurethane casting systems are based on two proprietary CASCHEM Chemicals: VORITE prepolymers and POLYCIN polyols. VORITE: These non-TDI based liquid prepolymers exhibit low vapor pressure (calculated to be less than 1x10 -3 mm Hg at 25C). This feature greatly reduces vapor hazard, allowing less complicated, more comfortable procedures. POLYCIN: The POLYCIN family of room temperature curing polyols are functionally terminated hydrogen donor derivatives. They react with VORITE to form the cured polyurethane solid elastomer, coating, adhesive or sealant.
472
Adhesives, Sealants and Coatings for the Electronics Industry
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Enscapulation(Continued): 86M-1: Components: VORITE 683-M2 POLYCIN 876-M4 Mix Ratio (PBW): 44:56 Viscosity (cps) @ 25C: Components: 2,280 530 Mix: 800 Hardness (Shore): 85A Tensile (psi): 1,800 Elongation (%): 120 Tear (PLI): 200 Gel Time (Minutes): 45 Density (g/cc): l-17/0.98 System 86~-1 is a medium hardness, low viscosity polyurethane casting compound. The VORITE prepolymer does not contain TDI and has a low vapor pressure, thereby minimizing the potential vapor hazard. This system has been recommended for potting audio transformers, inductors, and capacitors. 88: Components: VORITE 689-M2 POLYCIN 876-M4 Mix Ratio (PBW): 50:50 Viscosity (cps) @ 25C: Components: 13,000 500 Mix: 1,500 Hardness (Shore): 50D Tensile (psi): 2,700 Elongation (%): 220 Tear (PLI): 500 Gel Time (Minutes): 85 Density (g/cc): 1.168 0.973 System 88 is a relatively hard, low viscosity, non-TDI based polyurethane for potting and encapsulating applications which require good mechanical properties. It is recommended for a diversity of applications, including potting transformers, coils, and transducers.
Encapsulating, Potting Casting Impregnating Compounds
473
CASCHEM, INC: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 90: Comoonents: VORITE 689-M2 POLYCIN 640-M2 Mix Ratio (PBW): 55:45 Viscosity (cps) @ 25C: Components: 13,000 560 Mix: 2,500 HardnesslShore): 70D Tensile iPSI):'3,000 Elongation (%): 130 Tear-(PLI): 900 Gel Time iMinutes): 95 Density (g/cc): 1.168 0.975 System 90 is a high hardness, low viscosity, non-TDI based polyurethane with excellent mechanical properties. It contains no fillers or plasticizers, and is recommended for applications requiring high strength and good elongation. 95:
Components: VORITE 719-Ml POLYCIN 935 Mix Ratio (PBW): 36:64 Viscosity (cps) @ 25C: Components: 5,000 800 Mix: 1,200 Hardness (Shore): 60A Tensile (PSI): 600 Elongation (%): 100 Tear (PLI): 110 Gel Time (Minutes): 40 Density (g/cc): 1.174 0.957 System 95 is a low hardness, low viscosity, non-TDI based polyurethane having outstanding hydrolytic stability and chemical resistance. It is designed to give 3% to 6% expansion upon curing thereby insuring an air and water tight seal. It is recommended for use in potting load coils, cable stubs, and terminal blocks.
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Adhesives, Sealants and Coatings for the Electronics Industry
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 96#-2: Components: VORITE 727-M3 POLYCIN 974-M2 Mix Ratio (PBW): 44:56 Viscosity (cps) @ 25C: Components: 750 625 Mix: 700 Hardness (Shore): 60A Tensile (PSI): 540 Elongation (%): 115 Tear (PLI): 40 Gel Time (Minutes): 50 Density (g/cc): 1.130:0960 System 96M-2 is a low hardness, low viscosity, non-TDI based polyurethane system which exhibits excellent adhesion, chemical resistance, and hydrolytic stability. It is recommended for use in potting load coils, cable stubs, and terminal blocks. 97
Components: VORITE 729 POLYCIN 989-Ml Mix Ratio (PBW): 40:60 Viscosity (cps) @ 25C: Components: 550 700 Mix: 600 Hardness (Shore): 60A Tensile (PSI): 600 Elongation (%): 200 Tear-(PLI): 129 Gel Time (Minutes): 60 Density (g/cc): 1.170:0.940 System 97 is a soft, very low viscosity, non-TDI based polyurethane. Its excellent low temperature properties and low mix viscosity make it ideal for potting stress sensitive components such as reed relays and ferrod sensors.
Encapsulating,
Potting, Casting, Impregnating Compounds
475
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 101:
Components: VORITE 762 POLYCIN 1538 Mix Ratio (PBW): 25:75 Viscosity (cps) @ 25C: Components: 210 1,325 Mix: 1,100 Hardness (Shore): 65A Tensile (PSI): 375 Elongation (%): 150 Tear (PLI): 70 Gel Time (Minutes): 60 Density (g/cc): 1.210:0.938 System 101 is a low hardness, low viscosity, non-TDI based polyurethane having excellent chemical resistance and hydrolytic stability. Its outstanding low temperature properties suggest its use in applications requiring low embedment stress and temperature cycling properties (-60F to 180F). 106M-1: Components: VORITE 719-Ml POLYCIN 1598-Ml Mix Ratio (PBW): 36:64 Viscosity (cps) @ 25C: Components: 5,000 700 Mix: 1,100 Hardness(Shore): 60A Tensile (PSI): 600 Elongation (%): 100 Tear (PLI): 110 Gel Time (Minutes): 20 Density (g/cc): 1.174:0.957 System 106M-1 is a low hardness, low viscosity, non-TDI based polyurethane having outstanding hydrolytic stability. It passes the Naval Avionics Test (28 days @ 95% R.H./lOOC) and is recommended for potting components requiring good outdoor weathering, such as in terminal blocks and pedestals.
476
Adhesives, Sealants and Coatings for the Electronics Industry
CASCBEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 108M-1: Components: VORITE 787 POLYCIN 1631-Ml Mix Ratio (PBW): 32:68 Viscosity (cps) @ 25C: Components: 2,280 465 Mix: 975 Hardness (Shore): 50A Tensile (PSI): 180 Elongation (%): 70 Tear (PLI): 31 Gel Time (Minutes): 80 Density (g/cc): 1.130:0.980 System 108M-1 is a soft, low viscosity, non-TDI based polyurethane having outstanding low temperature properties. It is recommended for applications requiring low embedment stress and excellent temperature cycling properties (-40 to 180F). 115: Components: VORITE 1729 POLYCIN 1821 Mix Ratio (PBW): 55:45 Viscosity (cps) 8 25C: Components: 25,000 2,000 Mix: 5,600 Hardness (Shore): 80D Tensile (PSI): 5,800 Elongation (%): 15 Tear (PLI): 1,250 Gel Time (Minutes): 15 Density (g/cc): 1.240:1.00 System 115 is a high hardness, non-TDI based polyurethane having excellent hydrolytic stability and outdoor aging properties. It contains no fillers or plasticizers and is recommended for potting terminal blocks, transformers, and coils.
Encapsulating, Potting, Casting, Impregnating Compounds
477
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 120M-1: Components: VORITE 1722 POLYCIN 1808-Ml Mix Ratio (PBW): 61:39 Viscosity (cps) @ 2X: Components: 100 350 Mix: 200 Hardness (Shore): 40D Tensile (PSI): i,OOO Elongation (%): 100 Tear (PLI): 160 Gel Time (Minutes): 30 Density (g/cc): 1;280:1.050 System 120M-1 is a non-filled, fire retardant polyurethane which meets the UL94 test reauirements for VO rating. Its low mix viscosity, excellent hydrolytic stability and mechanical properties make it ideal for potting electrical and electronic components where fire retardancy, chemical resistance, and good aging properties are required. 125M-1: Components: VORITE 1735 POLYCIN 1844-Ml Mix Ratio (PBW): 15:85 Viscosity (cps) @ 25C: Components: 60 10,000 Mix: 2,600 Hardness (Shore): 42D Tensile (PSI): 500 Elongation (%): 45 Tear (PLI): 150 Gel Time (Minutes): 75 Density (g/cc): 1.220:1.480 125-1 is a filled fire retardant polyurethane having a UL94 rating of VI. It is non-TDI based and is recommended for potting transformers, terminal blocks, and coils.
478
Adhesives, Sealants and Coatings for the Electronics Industry
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 126 Reenterable Encapsulant: Components: VORITE 1744 POLYCIN 1863 Mix Ratio (PBW): 17~83 Viscosity (cps) @ 25C: Components: 300 850 Mix: 800 Hardness (Shore): 55 "00" Tensile (PSI): i6 Elongation (%): 135 Tear (PLI): 5 Gel Time (Minutes): 55 Density (g/cc): I.040 0.950 126 Reenterable Encapsulant is a low viscosity, non-TDI based polyurethane having good hydrolytic stability and chemical resistance. Its unique combination of low tear and tensile strength with relatively high elongation, coupled with its ability to absorb cable greases make it an ideal reenterable splice encapsulant for all types of grease filled cable. 132: Components: VORITE 683-M2 POLYCIN 159% Mix Ratio (PBW): 36:64 Viscosity (cps) @ 25C: Components: 2,280 700 Mix: 1,100 Hardness (Shore): 70A Tensile (PSI): kO0 Elongation (%): 100 Tear (PLI): 100 Gel Time iMinutes): 25 Density (g/cc): 1.17:0.96 System 132 is a medium hardness, non-TDI based polyurethane having excellent hydrolytic stability and chemical resistance, and adhesion. It is recommended for applications requiring g00a flexibility and temperature cycling properties such as in cable stubs, load coils, and terminal blocks.
Encapsulating, Potting, Casting, Impregnating Compounds
479
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 133: Components: VORITE 683-M.2 POLYCIN 1923 Mix Ratio (PBW): 44:56 Viscosity (cps) @ 25C: Components: 2,280 530 Mix: 800 Hardness (Shore): 85A Tensile (PSI): 1,800 Elongation (%): 120 Tear (PLI): 200 Gel Time (Minutes): 5 Density (g/cc): 1.17:0.98 System 133 is a medium hardness, low viscosity, non-TDI based polyurethane having excellent chemical resistance and hydrolytic stability. It was developed for use in field applications such as service wire repair kits and cable capping kits where a very fast cure time is required. 140: Components: VORITE 1770 POLYCIN 1915 Mix Ratio (PBW): 52:48 Viscosity (cps) @ 25C: Components: 85 1,100 Mix: 500 Hardness (Shore): 55 "00" Tensile (PSI): 25 Elongation (%): 175 Tear (PLI): 4.5 Gel Time (Minutes): 15 Density (g/cc): 0.97:0.95 System 140 is a very soft, reenterable, non-TDI based polyurethane having good chemical resistance and hydrolytic stability. It was designed for potting computer control modules where temperature cycling properties and easy reenterability are required.
480
Adhesives, Sealants and Coatings for the Electronics Industy
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 142: Components: VORITE 1781 POLYCIN 1931 Mix Ratio (PBW): 52:48 Viscosity (cps) @ 25C: Components: 183 1,800 Mix: 600 Hardness (Shore): 75 "00" Tensile (PSI): 77 Elongation (%): 215 Tear (PLI): 16 Gel Time (Minutes): 60 Density (g/cc): 1.01 0.95 System 142 is a soft, low viscosity, non-TDI based polyurethane having good chemical resistance and hydrolytic stability. It was designed for potting computer control modules and automotive ignition coils where good penetration and temperature cycling properties are required. 144 Reenterable Encapsulant: Components: VORITE 1782 POLYCIN 1932 Mix Ratio (PBW): 17:83 Viscosity (cps) @ 25C: Components: 300 800 Mix: 700 Hardness (Shore): 52 "00" Tensile (PSI): i5 Elongation (%): 135 Tear (PLI): 2.2 Gel Time (Minutes): 55 Density (g/cc): 1.02:0.96 System 144 is a low viscosity, non-TDI based polyurethane having exceptionally good reenterability. It was developed for use in the very large cable splices where ease of reenterability and grease absorbency properties are required.
Encapsulating, Potting, Casting, Impregnating Compounds
481
CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): "D" Reenterable Encapsulant: Components: VORITE 715-Ml POLYCIN 934-M3 Mix Ratio (PBW): 17:83 Viscosity (cps) @ 25C: Components: 130 315 Mix: 300 Hardness (Shore): 50 "00" Tensile (PSI): 35 Elongation (%I: 130 Tear (PLI): 4.9 Gel Time (Minutes): 30 Density (g/cc): 1.019:0.894 "D" Reenterable Encapsulant is a very low viscosity, non-TDI based polyurethane having a unique combinbation of low tear and tensile strength with relatively high elongation. This unique set of physical properties, together with its low viscosity make it an ideal reenterable cable splice encapsulant.
482
Adhesives, Sealants and Coatings for the Electronics Industry
CONAP, INC.: CONATHANE High Technology Potting, Casting and Molding Compounds: CONATHANE EN-4 thru EN-12: Two component polybutadiene-based liquid urethane casting and potting systems. When reacted, these high technology systems produce tough, stable elastomers; superior in most respects to silicone elastomers. These CONATHANE elastomers have outstanding hydrolytic stability, outstanding electrical properties over a wide temperature range, excellent thermal shock resistance and low temperature elasticity, low exotherm with minimal shrinkage, and low toxicity. CONATHANE EN-4: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps @.25C: 6000 Workinq Life @ 25C (l/Z lb. mass) minutes: 30 Cure Schedule: Days @ 25C: 7 Hours @ 80C: 10 Color: Opaque Amber Swecific Gravitv: 0.98 Shore A Hardness: 90 Tensile Strength, psi: 1950 Tear Strength; plii 240 Elongation, %: 520 Water Absorption, %, 24 hr.130 days: 0.410.5 Linear Shrinkage, %: 1.22 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 HZ: .030 @ 1 MHz: .Oll Volume Resistivity, ohm-cm: 2.10x10 15 Insulation Resistance, ohm: ,2.5x10 13 Test Temperature: 130C: Dielectric Constant @ 100 HZ: 3.86 @ 1 MHz: 3.14 Dissipation Factor @ 100 Hz: .030 @ 1 MHz: .047 Volume Resistivity,.ohm-cm: 4.05x10 11 Insulation Resistance, ohms: 2.3x10 10
Encapsulating Potting, Casting Impregnating Compounds
483
COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds for Electronic Applications: DURAPOT 861 - Low Viscosity Impreqnant: A clear compound for use to 500F. 861's low viscosity and simple cure at room temp. provides excellent penetration and electrical properties. 861 has been used for many clear coating applications. DURAPOT 862 - High Temp - Low Viscosity: A clear compound for use to 600F. 862's low viscosity provides excellent penetration and electrical properties. Usable to temperatures in the 600F range after curing at 350F. DURAPOT 863 - Ultra Hish Temn Pottins: 863 is based on COTRONICS-unique cross-linked inorqanicorganic polymer system with excellent dielectric heat stability. moisture and solvent resistance. Usable to temperatures in the 600F range after curing at 350F. DURAPOT 864 - Flexible and Room Temp Cure: Similar in properties to type 863, usable to 450F range, but with the flexibility required for severe thermal shock applications. DURAPOT 865 - High Thermal Conductivity: Usable to 500F plus, for applications involving high heat flows and the need for thermal dissipation with a simple room temp cure. DURAPOT 866 - Thermally Insulating: A 500F Epoxy based compound, thermally and electrically insulating in a convenient two part room temperature curing system. A unique product for special applications requiring this unusual combination of properties.
484
Adhesives, Sealants and Coatings for the Electronics Industry
COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds For Electronic Applications (Continued): 861: 5OOF Low Vise. Impregnant Room Cure Base: Novalac Volume Resistivity: 10 14 Dielectric Strength: 525 Thermal Exp./F: 3.4x10 -5 Therm. Conductivity: 7.2 Dielectric Constant: 4.15 Dissipation Factor: .015 Hardness: 80-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 1000 Pot Life (hours): (l-2) Components: 2 Mix Ratio/Base: 100 Activator: 17 Cure Cycle Temp: RT* Time: 16 hours 862: 600F Low Vise. Hish Temn. Base: Novalac Volume Resistivity: 10 14 Dielectric Strenqth: 555 Thermal Exp./F: 3.4x10 -5 Therm. Conductivity: 7.2 Dielectric Constant: 4.15 Dissioation Factor: -015 Hardness: 80-D Chemical Resistivity: Excellent Solvent Resistance:-Excellent Viscosity, Mixed: 1500 Pot Life (hours): 4 hours Components: 2 Mix Ratio/Base: 100 Activator: 80 Cure Cycle Temp: 220 & 350F Time: 2 & 4 hours * or 30 min. @ 250F
Encapsulating, Potting, Casting, Impregnating Compounds
COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds For Electronic Applications (Continued): 863:
650~ Ultra High Temp. Base: Novalac Volume Resistivity: 10 14 Dielectric Strength: 555 Thermal Exp./F: 2.5x10 -5 Therm. Conductivity: 9.0 Dielectric Constant: 3.5 Dissipation Factor: -010 Hardness: 90-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 2000 Pot Life (hours): 8 hours Components: 2 Mix Ratio/Base: 100 Activator: 71 Cure Cycle Temp: 220 & 350F Time: 2 & 4 hours 864: 450F Flexible Thermal Shock Base: Novalac Volume Resistivity: 10 14 Dielectric Strength: 555 Thermal Exp./F: 3.4x10 -5 Therm. Conductivity: 7.0 Dielectric Constant: 3.5 Dissipation Factor: .OlO Hardness: 90-A Chemical Resistivity: Good Solvent Resistance: Good Viscosity, Mixed: 11200 Pot Life (hours): 1 hour Components: 2 Mix Ratio/Base: 100 Activator: 120 Cure Cycle Temp: RT* Time: 24 hours * or 30 min. a 250F
485
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Adhesives, Sealants and Coatings for the Electronics Industry
COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds For Electronic Applications (Continued): 865: 500F High Thermal Conductive Base: Novalac Volume Resistivity: 10 15 Dielectric Strength: 700 Thermal Exp./F: 2.5x10 -5 Therm. Conductivity: 20.0 Dielectric Constant: 3.5 Dissioation Factor: .OlO Hardness: 95-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 10,000 Pot Life (hours): 1 hour Components: 2 Mix Ratio/Base: 100 Activator: 8 Cure Cycle Temp: RT* Time: 24 hours 866: 500F Thermal Insulating Machinable Base: Novalac Volume Resistivity: 10 15 Dielectric Strength: 500 Thermal Exp./F: 2.5x10 -5 Therm. Conductivity: 1.5 Dielectric Constant: 3.5 Dissipation Factor: .015 Hardness: 60-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 10,000 Pot Life (hours): 1 hour Components: 2 Mix Ratio/Base: 100 Activator: 11 Cure Cycle Temp: RT* Time: 24 hours * or 30 min. @ 250F
Encapsulating, Potting, Casting, Impregnating Compounds
487
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins: DoLPHON Epoxy Resins vary from very flexible to rigid compounds. They are available in a range from very low viscosity to paste like, thixotropic adhesives. A series of reactors is available to tailor each system to specific needs. One Package Impregnant: DOLPHON CC-1090: One package, low viscosity epoxy for impregnating coils, transformers and electronic components wound with fine wire. Reactor or Catalyst: One Package Clear Filled or Unfilled: Unfilled Temparature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 2,300 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 85 Mixing Ratio (Parts by Weight): One Package Viscosity in Centipoises (Resin and Reactor): @ 80F: 1,200 cps @ F: 320 @ 120 Pot Life (100 Grams): 70F: 6 mos./Hrs. @ F.: 200 @ 120 Cure Time: 2 hrs. @ 300F. DOLPHON CC-1115: Excellent electrical properties and moisture resistance. Approved use on sealed units for MIL-M-17060E. Passes submergence tests. Reactor or Catalyst: One Package Clear Filled or Unfilled: Unfilled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 2,100 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 80 Mixing Ratio: One Package Viscosity in Centipoises: 1 RPM: 9500-13000/10 RPM: 4500-5500 Pot Life (100 Grams): 70F.: 1 Yr./Hrs. @ F.: 200 @ 130 Cure Time: 3-5 hrs. @ 325F. DOLPHON CC-1118-LV: Excellent high temperature electrical properties and moisture resistance. Approved use on sealed units for MIL-M-17060E. Passes submergence tests. Reactor or Catalyst: One Package Clear Filled or Unfilled: Unfilled Temperature Class: 180 Dielectric Strength: Volts/Mil l/8" Section: 2,400 Hardness Shore 'D' @ 70F: 24 hr.: 85/l wk.: 85 Mixing Ratio: One Package Viscosity in Centipoises: 1 RPM: 6000-9000/10 RPM: 2000-4000 Pot Life (100 Grams): 70F: 1 yr. Cure Time: 3-5 hrs. @ 325F.
488
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Dipping: DOLPHON CB-1067: One package, flexible, black, thixotropic epoxy dipping resin for transformers and conformal coating. Good thermal shock and noise reduction. Reactor or Catalyst: One Package Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/0" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 65 1 wk.: 65 Mixina Ratio: One Packaae Viscosity in Centipoises: @ 80F: 1 RPM: 4800 10 RPM: 17000 Pot Life (100 Grams): 70F: 1 yr. Cure Time: 4-5 hrs. @ 275F. DOLPHON CR-1098: Durable red epoxy dipping resin for conformal coatings. Can be used to replace coil taping. Suitable for conveyor processing. Reactor or Catalyst: One Package Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 350 Hardness Shore 'A' @ 70F: 24 hr.: 60 1 wk.: 60 Mixing Ratio: One Package Viscosity in Centipoises: @ 80F.: 5 RPM: 7,000-12,800 Pot Life (100 Grams): 70F: 6 mos. Cure Time: 30 min. @ 300F. Wet Winding: DOLPHON CN-1119: Especially recommended for wet winding, sealing and filling. Extraordinary bond strength and chemical resistance. Superior electrical properties. Reactor or Catalyst: One Package Color: Beige Filled or Unfilled: Filled Temperature Class: 180 Dielectric Strength: Volts/Mil l/8" Section: 420 Hardness Shore 'D' @ 70F: 24 hr.: 85 1 wk.: 85 Mixina Ratio: One Packaae Viscosity: Thixotropic Paste Pot Life (100 Grams): 70F.: 1 yr. Cure Time: 7-8 hrs. 8 300F.
Encapsulating, Potting, Casting, Impregnating Compounds
489
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Wet Winding(Continued): DOLPHON CG-1062-A: Thixotropic epoxy resin for wet winding and encapsulating coils, resistors and transformers. Also used to seal transformer margins. Reactor or Catalyst: CG-1062-B/RE-2000 Color: Gray/Gray Filled or Unfilled: Filled Temperature Class: 155/130 Dielectric Strength: Volts/Mil l/8" Section: 440/400 Hardness Shore 'D' @ 70F: 24 hr.: 80170 1 wk.: 80175 Mixing Ratio: 100:80/100:7 Viscosity in Centipoises: Thixotropic/Thixotropic Pot Life (100 Grams): 70F.: 7 days/30 min Cure Time: 4 hrs. @ 300F./2-4 hrs. @ 7OF./24 hrs. @ 70F. Impregnating, Casting and Potting: DOLPHON CC-1024-A: Clear, unfilled epoxy system where maximum penetration is desired. Low viscosity and flexibility permit use even on fine wires as a general purpose impregnant and encapsulant. Reactor or Catalyst: RE-2000 Color: Clear Filled or Unfilled: Unfilled Temoerature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 500 Hardness Shore D @ 70F: 24 hr.: 70/l wk.: 75 Shrinkage During Cure: 0.5 Mixing Ratio: Resin: lOO/Reactor: 10 Viscosity in Centipoises: @ 80F.: 1,500 Pot Life (100 Grams): 70F.: 30 min Cure Time: l-3 hrs. @ 70F./24 hrs @ 70F. Reactor or Catalyst: RE-2001 Color: Amber Filled or Unfilled: Unfilled Temperature Class: 130 Dielectric Strength: Volts/Mil 118" Section: 440 Hardness: Shore 'D' @ 70F: 24 hr.: 50/l wk.: 50 Shrinkage During Cure: 0.5 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 50 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 2,000 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F/24 hrs. @ 70F.
490
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C!. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CC-1024-A(Continued): Reactor or Catalyst: RE-2005 Color: Amber Filled or Unfilled: Unfilled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 500 Hardness Shore 'D' a 70F: 24 hr.: 75/l wk.: 75 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 16 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 1,600 cps @ F: 80 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 2251. Reactor or Catalyst: RE-2009 Color: Amber Filled or Unfilled: Unfilled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 500 Hardness: Shore iD' @ 70F: 24 hr.: 75/l wk.: 75 Shrinkage During Cure: 0.5 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 20 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 1,800 Pot Life (100 Grams): 70F.: 20 min. Cure Time: l-2 hrs. @ 701/24 hrs. @ 70F Reactor or Catalyst: RE-2010 Color: Amber Filled or Unfilled: Unfilled Temuerature Class: 130 Dieiectric Strength: Volts/Mil l/8" Section: 440 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 70 Shrinkage During Cure: 0.2 Mixing Ratio (Parts By Weight): Resin: IOOfReactor: 50 Viscosity in Centipoises (Resin and Reactor): @ 80F: 3,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 701./24 hrs. @ 70F.
Encapsulating, Potting, Casting, Impregnating Compounds
491
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): DOLPHON CR-1050: Red, machineable epoxy system for potting and encapsulation of sensors, thermostats, coils, motors, transformers, electronic assemblies. Cures to a high gloss finish. Low viscosity allows easy mix and pour without voids. Reactor or Catalyst: RE-2000 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil 118" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 70/l wk.: 75 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F: 3,300 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: l-3 hrs @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2001 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 430 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 30 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 3,680 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Red Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/S" Section: 450 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 80 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 11 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 6,500 cps @ F.: 700 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F. Reactor or Catalyst: RE-2009 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 420 Hardness Shore 'D' @ 70F: 24 hr.: 70/l wk.: 75 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 15 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 6,000 Pot Life (100 Grams): 70F.: 30 min. Cure Time: l-2 hrs. @ 70F./24 hrs @ 70F.
492
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CR-1050(Continued): Reactor or Catalyst: RE-2010 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 430 Hardness Shore 'D' @ 70F.: 24 hr.: 60 1 wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: 100 Reactor: 30 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 11,000 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 70F./24 hrs. @ 70F. DOLPHON CB-1054-A: Flexible, black, flame retardant epoxy system for all types of electronic and electrical assemblies, transformers, coils, and motors. Especially recommended for MIL-T-27 and other military uses. Meets MIL-I-16923-C. Reactor or Catalyst: CB-1054-B Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil 1/B" Section: 430 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 60 Shrinkage During Cure: 0.21 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 100 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 10,000 cps @ F.: 1760 @ 150 Pot Life (100 Grams): 70F.: 6 wks./Hrs. @ F.: 6 @ 150 Cure Time: 3-5 hrs @ 275F. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 70 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 3,200 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: 2-3 hrs. @ 701./24 hrs. @ 70F.
Encapsulating Potting, Casting Impregnating Compounds
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1054-A(Continued): Reactor or Catalyst: RE-2001 Color: Black Filled or Unfilled: Filled Temoerature Class: 130 Dieiectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 45/l wk.: 60 Shrinkage During Cure: 0.3 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 3,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts By Weight): Resin: lOO/Reactor: 10 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 5,500 cps @ F.: 1280 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F. Reactor or Catalyst: RE-2009 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 60 Shrinkage During Cure: 0.45 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 13 Viscositv in Centiooises (Resin and Reactor): a _ 80F.: 4.960 Pot Life-(100 Grams): 70F:: 30 min. Cure Time: l-2 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2010 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 40/l wk.: 55 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 7,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs @ 70F./24 hrs. @ 70F.
493
494
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued1: DOLPHON CB-1069: Black, machineable epoxy system for all types of electronic and electrical assemblies. Excellent thermal conductivity. This medium viscosity, filled epoxy cures to a fine, glossy finish. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/S" Section: 405 Hardness Shore 'D' @ 70F.: 24 hr.: 75/l wk.: 80 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ SOF.: 5,500 Pot Life (100 Grams): 70F.: 30 min. Cure Time: l-3 hrs. @ 70F.124 hrs. @ 70F. Reactor or Catalyst: RE-2001 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/S" Section: 430 Hardness Shore 'D' @ 70F.: 24 hr.: 60/l wk.: 65 Shrinkage During Cure: 0.25 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ SOF.: 2,880 Pot Life (100 Grams) @ 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/S" Section: 415 Hardness Shore 'D' B 70F: 24 hr.: SO/l wk.: 80 Shrinkage During Cure: 0.15 Mixinq Ratio (Parts by Weight): Resin: loo/Reactor: 10 Viscosity in Centipoises (Resin and Reactor): @ SOF.: 6,880 cps @ F.: 1250 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F.
Encapsulating
Potting Casting, Impregnating
Compounds
495
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1069(Continued): Reactor or Catalyst: RE-2009 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielecric Strength: Volts/Mil l/0" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 80 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 13 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 5,120 Pot Life (100 Grams): 70F.: 15 min. Cure Time: l-2 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2010 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 435 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 25 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 12,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 701./24 hrs. @ 70F. DOLPHON CB-1078: Versatile, black, epoxy system for potting and casting all varieties of coils, transformers, electronic modules, and power supplies. This very low cost compound offers low shrinkage, high thermal conductivity, plus excellent electrical and physical properties. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strenqth: Volts/Mil l/8" Section: 400 Hardness Shore '6' @ 70F: 24 hr.: 75/l wk.: 80 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 5 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 8,600 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: l-3 hrs. @ 70F./24 hrs. @ 70F.
496
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1078(Continued): Reactor or Catalyst: RE-2001 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 420 Hardness Shore 'D' @ 70F: 24 hr.: 55/l wk.: 75 Shrinkage During Cure: 0.1 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 20 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 3,840 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F.: 24 hr.: 80/l wk.: 80 Shrinkage During Cure: 0.05 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 14,000 cps @ F.: 3360 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F. Reactor or Catalyst: RE-2009 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' (a 70F: 24 hr.: 75/l wk.: 80 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 8 Viscositv in Centiooises (Resin and Reactor): (a _ 80F.: 10,800 Pot Life-(100 Grams): 70F;: 30 min. Cure Time: l-2 hrs. @ 70F.124 hrs. @ 70F. Reactor or Cure: RE-2010 Color: Black Filled or Unfilled: Filled Temuerature Class: 130 Dieiectric Strength: Volts/Mil l/8" Section: 415 Hardness Shore 'D' @ 70F: 24 hr.: 40/l wk.: 75 Shrinkase Durins Cure: 0.1 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 19 Viscosity in Centipoises (Resin and Reactor): 11,520 Pot Life-(100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 70F./24 hrs. @ 70F.
Encapsulating, Potting, Casting, Impregnating Compounds
497
JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1112-A: Flexible, black, flame retardant epoxy system for electrical and electronic parts in the office equipment, computer, appliance and home entertainment industries. Recognized under UL-94, V-O. Yellow cards available. Reactor or Catalyst: CB-1112-B Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil q/8" Section: 430 Hardness Shore 'D' @ 70F: 24 hr.: 55/l wk.: 55 Shrinkage During Cure: 0.21 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 100 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 17,000 cps @ F.: 1,200 @ 150 Pot Life (100 Grams): 70F.: 3 days/Hrs @ F.: 5 @ 150 Cure Time: 3-5 hrs. @ 275F or 2-3 hrs. @ 300F. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 70 Shrinkacre Durina Cure: 0.3 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 5,000 Pot Life (100 grams): 70F.: 1 hr. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Bonding: DOLPHON CR-1056-B: Epoxy adhesive for bonding applications - good thermal shock resistance - thixotropic paste. Reactor or Catalyst: CC-1056-A Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/nil l/8" Section: 390 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 70 Shrinkage During Cure: ---Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 100 Viscosity in Centipoises: Thixotropic paste Pot Life (100 Grams): 70F.: 2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F.
498
Adhesives,
Sealants
and Coatings for the Electronics
Industry
JOHN C. DOLPH CO.: DOLPHON Polybutadiene Resins: Potting, Casting and Coating: DOLPHON Polybutadiene Resins are flexible and elastomeric compounds with Shore A Hardness ranging from 35-60. They are especially formulated for encapsulating electric and electronic devices. Polybutadienes have excellent hydrolytic stability, good thermal conductivity, low embedment stress, and thermal shock ranging from -70 to +2OOC. They have extraordinary resistance to moisture and chemicals and excellent adhesion to a wide variety of substrates. Easy to repair. Excellent replacement for silicones and epoxies. DOLPHON CB-1109: General purpose, black, filled potting and casting resin for all types of electrical and electronic devices. Excellent for automotive products. Recommended for potting connectors and cable splices. Reactor or Catalyst: RE-2018 Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 665 Hardness Shore 'A' @ 70F: 24 hr.: 25 1 wk.: 40 Shrinkage During Cure: 0.09 Mixing Ratio (Parts by Weight): Resin: 100 Reactor: 15 Viscosity in Centipoises: @ 80F.: 3,800 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: 2-4 hrs. @ 701/24 hrs. @ 70F DOLPHON CC-1120-A: Low viscosity, clear amber compound for potting coils, transformers, printed circuit boards and electronics. Excellent for electromagnets. Easily repaired. Reactor or Catalyst: CC-1120-B Amber Filled or Unfilled: Unfilled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 620 Hardness Shore 'A' @ 70F: 24 hr.: 15 1 wk.: 35 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: 100 Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 1,500 Pot Life (100 Grams): 70F.: 3 hrs. Cure Time: 3-5 hrs. @ 70F/24 hrs @ 70F
Encapsulating, Potting, Casting, Impregnating Compounds
499
JOHN C. DOLPH CO.: DOLPHON Polybutadiene Resins: Potting, Casting and Coating (Continued): DOLPHON-CB-1128-A: Thixotriopic black filled compound for brushing, dipping and spraying where high build is required. Excellent adhesion to a wide variety of substrates. Its thixotropy makes it an excellent choice for "glob top". Reactor or Catalyst: CB-1128-B Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 665 Hardness Shore 'A' 8 70F: 24 hr.: 60/l wk.: 60 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 6 Viscosity in Centipoises (Resin and Reactor) @ 80F.: Thixotropic Pot Life (100 Grams): 70F.: 45 min. Cure Time: 2-4 hrs. @ 70F.124 hrs. @ 70F. DOLPHON CN-1130-A: Flame retardant general purpose elastomeric compound for potting and casting electrical and electronic devices. Meets UL 94, v-o. Reactor or Catalyst: CN-1130-B Cream Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 1000 Hardness Shore 'A' @ 70F: 24 hr.: 40/l wk.: 55 Shrinkage During Cure:
500
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: Solventless Polyester Resins: DOLPHON CC-1080: Low cost VP1 resin with long pot life. Low viscosity for maximum protection. Method of Application: Dip/VP1 Cure: Time: l-2 Hrs. Temp.: 300F. Gel Time: Min. @ 212F.: 30-50 Viscosity: #l Demmler Sets. @ 80F.: 20-30 #2 Zahn Sets. @ 80F.: 30-40 Brookfield cps. @ 77F.: 50-100 Catalyst: CA-2012 Pot Life 8 70F: Catalyzed: 3 MO. Flash Point: F: 88 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 8 DOLPHON CC-108OL: General purpose medium viscosity resin for either roll-thru or trickle applications. Method of Avvlication: Roll Thru/Trickle Cure: Time: -30 Min./Temp.: 300F. Gel Time: Min. @ 212F.: IO-15 Viscosity: #1 Demmler Sets. @ 80F.: 55-65 #2 Zahn Sets. 8 80F.: 70-90 Brookfield cps. @ 77F.: 170-250 Catalyst: CA-2011 Pot Life @ 70F: Catalyzed: l-2 Wks. Flash Point: F.: 88 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 13 DOLPHON CC-1082: Very fast curing, low viscosity resin developed specifically for trickle impregnation. Method of Application: Trickle Cure: Time: 3 Min./Temp.: 260F. Gel Time: Min. @ 212F.: 5-6 Viscosity: #I Demmler Sets. @ 80F.: 35-45 #2 Zahn Sets. @ 80F.: 45-55 Brookfield cps @ 77F.: 100-200 Catalyst: CA-2011 Pot Life @ 70F: Catalyzed: l-2 Wks. Flash Point: F: 88 Bond Strength: In Lbs. @ 155C; per ASTM 2519: 13
Encapsulating, Potting, Casting Impregnating Compounds
SO1
JOHN C. DOLPH CO.: Solventless Polyester Resins (Continued): DOLPHON CC-1096: Fast curing, low viscosity resin developed specifically for trickle impregnation. Method of Application: Trickle Cure: Time: 5 Min./Temp.: 260F. Gel Time: Min. @ 212F.: 8-13 Viscosity: #I Demmler Sets. @ 80F.: 35-45 #2 Zahn Sets. @ 80F.: 45-55 Brookfield cps. @ 77F.: 100-200 Catalyst: CA-2011 Pot Life @ 70F: Catalyzed: l-2 Wks. Flash Point: F: 88 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 14 DOLPHON CC-1099: Low viscosity resin, for either roll thru or trickle applications, where low build-up is desired. Method of Application: Roll Thru/Trickle Cure: Time: 30 Min./Temp.: 300F. Gel Time: Min. @ 212F.: lo-15 Viscositv: #I Demmler Sets. ia 80F.: IO-20 #2 Zahn Sets. @ 8OF.: 20-30 Brookfield cps @ 77F.: 30-90 Catalyst: CA-2011 Pot Life @ 70F: Catalyzed: l-2 Wks. Flash Point: F.: 88 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 7 DOLPHON CC-1105: One part - high flashpoint resin for use in vacuum pressure impregnation and dipping applications. (1 year pot life @ 70F.) Method of Application: Dip/VPI/Roll Thru Cure: Time: 1 Hr./Tema.: 300F. Gel Time: Min. 0 212F:: 110-160 Viscosity: #l Demmler Sets. @ 80F.: 130-190 #2 Zahn Sets. @ 80F.: 120-190 Brookfield cps. @ 77F.: 400-700 Catalyst: Pre-catalyzed Pot Life @ 70F: Catalyzed: 12 MO. Flash Point: F: ,200 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 20
502
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: Solventless Polyester Resins (Continued): DOLPHON CC-1105H: Higher build-up version of CC-1105. High flash point and long pot life. Method of Application: Dip/VPI/Roll Thru Cure: Time: -7 Hr./Temp.: jOOF. Gel Time: Min. 8 212F.: 100-120 Viscosity: Brookfield cps. @ 77F.: 1200-2000 @ 10 RPM Catalyst: CA-2012 Pot Life @ 70F: Catalyzed: 12 MO. Flash Point: F: ,200 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 20 DOLPHON CC-1106: High flashpoint resin formulated specifically for trickle impregnation. Method of Application: Trickle Cure: Time: 5 Min./Temo.: 320F. Gel Time: Min. @ 2i2F.i 8-12 Viscosity: Brookfield cps. @ 77F.: 500-900 Catalyst- CA-2011 Pot Life @ 70F: Catalyzed: l-2 Wks. Flash Point: F: >200 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 10 DOLPHON CC-1121: Flexible, thixotropic resin system. Excellent penetration, minimal oven drainage, and medium build (3-5 Mils). Flashpoint 127F. Method of Aoalication: VP1 Cure: Time: ‘i-3 Hrs./Temp.: 300F. Gel Time: Min. @ 212F.: loo-160 Viscosity: Brookfield cps. @ 77F.: 1200-3000 cps @ 10 RPM Catalyst: CA-2012 Pot Life @ 70F: Catalyzed: 3 MO. Flash Point: F: 127 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 9 DOLPHON CC-1122: Flexible, low viscosity system. Formulated as viscosity reducer for CC-1121, or alone for maximum penetration and low build. Method of Application: Dip/VP1 Cure: Time: 2-3 Hrs./Temp.: 300F. Gel Time: Min. @ 212F.: loo-160 Viscosity: Brookfield cps @ 77F: 600-1000 Catalyst: CA-2012 Pot Life @ 70F: Catalyzed: 3 MO. Flash Point: F: 127 Bond Strength: In Lbs. @ 155C. per ASTM 2519: 6
Encapsulating Potting, Casting, Impregnating Compounds
503
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Unfilled): One Component-Epoxy Based: A-312: Black Mix Ratio A:B: N/A Mixed Viscosity CPS @ 25C: 3,000 Specific Gravity @ 25C: 1.14 Cure Schedule: 30 min @ IOOC or 15 min @ 120C or 3 min @ 16OC Shore Hardness: 80D Temperature Range of Use: -40 to +13OC Unfilled, fast curing, low viscosity epoxy encapsulant. Excellent chemical, heat and moisture resistance. Recommended for small mass potting (t50 grams). D-272: Black Mix Ratio A:B: N/A Mixed Viscosity cps @ 25C: 10,500 Specific Gravity @ 25C: 1.19 Cure Schedule: 60 min @ IOOC or 20 min @ 120C or IO min @ 140C Shore Hardness: 62D Temperature Range of Use: -40 to +105C Unfilled, semi-flexible epoxy encapsulant. Bonds well to vinyl and other plastics. Fast curing at temperatures below IOOC. Recommended for small device potting. One Component Systems-UV Curable: uv-900: Clear Mix Ratio: A:B: N/A Mixed Viscosity cps @ 25C: 900 Specific Gravity @ 25C: 1.04 Cure Schedule: UV cure: 15 set @ 200/w in Heat cure: 10 min @ 12OC Shore Hardness: 75D Temperature Range of Use: -25 to +125C Clear, UV-curable encapsulant or dip coating. Excellent adhesion to glass, metals, and elastics. Excellent thermal shock resistance.. Good humidity-and solvent resistance. 125 mil cure deoth.
504
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Unfilled) (Continued): Two Component Systems-Epoxy Based: A-14: Amber Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 13,000 Specific Gravity @ 25C: 1.17 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 80D Temperature Range of Use: See Curing Agent Selector Chart Unfilled, general purpose epoxy encapsulating resin. Used with a variety of curatives. Used for surface coating, laminating, casting and potting of electrical devices. Various colors available. A-16: Amber Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 15,500 Specific Gravity @ 25C: 1.12 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 45D Temperature Range of Use: See Curing Agent Selector Chart Unfilled, semi-flexible, general purpose epoxy encapsulant. Excellent toughness and peel strength in adhesive applications. Used with a variety of curatives. A-17: Yellow Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 700 Specific Gravity @25C: 1.11 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 72D Temperature Range of Use: See Curing Agent Selector Chart Unfilled, transparent, very low viscosity, general purpose epoxy encapsulating and impregnating resin. Used with a variety of hardeners. Low viscosity version of AMICON A-14. T-640A/B: Clear Mix Ratio A:B: 100:35 Mixed Viscosity, cps @ 25C: 3,000 Specific Gravity @ 25C: 1.09 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 75D Temperature Range of Use: -40 to +105C Unfilled, low viscosity, transparent, general purpose epoxy encapsulant for biomedical applications. Long pot life. Room temperature cure.
Encapsulating, Potting, Casting, Impregnating Compounds
50.5
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Unfilled) (Continued): Two Component Systems-Urethane Based: CPC-18A/B: Amber Mix Ratio A:B: 100:12.5 Mixed Viscositv. CDS B 25C: 55.000 Specific Gravity @&25C: 1.03 . Cure Schedule: 24 hr @ 25C or 12 hr @ 65C or 4 hr @ IOOC Shore Hardness: 90A Temperature Range of Use: -70 to +13OC Unfilled, tough, flexible, MOCA free, urethane casting compound. Reversion resistant. Excellent tear strength and abrasion resistance. Used for connector potting or casting of mechanical wear pads, bumpers or rollers. CPC-19A/B: Amber Mix Ratio A:B: 100:38 Mixed Viscositv. cus @ 25C: 24,000 Specific Gravity @*25C: 1.03 Cure Schedule: 24 hr @ 25C or 12 hr @ 65C or 4 hr @ IOOC Shore Hardness: 70A Temperature Range of Use: -70 to +13OC Unfilled, lower viscosity, lower hardness version of ECCOTHANE CPC-18. MOCA free. Reversion resistant. CPC-IlA/B: Yellow Mix Ratio A:B: 100:120 Mixed Viscosity, cps @ 25C: 8,000 Specific Gravity @ 25C: 1.04 Cure Schedule @ 25C: 24 hr @ 25C or 8 hr @ 65C Shore Hardness: 53A Temperature Range of Use: -70 to +13OC Unfilled, room temperature curing urethane encapsulant. Excellent electrical performance over a wide temperature range. Good thermal shock resistance. Used for general purpose potting and encapsulation.
506
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Unfilled) (Continued): Two Component Systems-Urethane Based(Continued): TU-904 A/B: Dark Mix Ratio A:B: 24:lOO Mixed Viscosity, cps @ 25C: 2,000 Specific Gravity @ 25C: 1.00 Cure Schedule: 48 hr @ 25C or 2 hr @ 80C Shore Hardness: 62A Temperature Range of Use: -60 to +105C Unfilled, low viscosity, reversion resistant urethane encapsulant. Good low temperature performance and thermal shock resistance. Used for general purpose potting and encapsulation. TU-917 A/B: Amber Mix Ratio A:B: 25:lOO Mixed Viscosity, cps @ 25C: 2,500 Specific Gravity @ 25C: 0.96 Cure Schedule: 48 hr @ 25C or 2 hr @ 8OC Shore Hardness: 70A Temperature Range of Use: -60 to +105C Unfilled, low viscosity, urethane adhesive and encapsulant with good adhesion to vinyl and most plastic substrates. Good low temperature performance and thermal shock resistance.
Encapsulating,
Pot@,
Casting, Impregnating Compounds
507
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Filled): One Component Systems-Epoxy Based: 2651MM-1: Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 25,000 Specific Gravity @ 25C: 1.60 Cure Schedule: 9 hr @ 85C or 5 hr @ 120C Shore Hardness: 89D Temuerature Range of Use: -40 to +155C Filied, low viscosity, general purpose epoxy encapsulant. Good machineability. Properties similar to STYCAST 2651MM cured with Catalyst 11. Recommended for small device potting. 2651-I
:
Black Mix Ratio A:B: N/A Mixed Viscosity, CPS @ 25C: 52,000 Specific Gravity: 7.60 Cure Schedule: 8 hr @ 80C or 6 hr @ IOOC or 4 hr @ 120C Shore Hardness: 88D Temperature Range of Use: -40 to +155C Filled, medium viscosity, general purpose epoxy potting resin. Good thermal shock resistance. Properties similar to STYCAST 2651 cured with Catalyst 11. Recommended for small device potting. Two Component Systems-Epoxy Based: 1210A A/B: Black Mix Ratio A:B: 100:15 Mixed Viscosity, cps @ 25C: 17,000 Specific Gravity @ 25C: 1.68 Cure Schedule: 24 hr @ 75C or 8 hr @ IOOC or 4 hr @ 125C Shore Hardness: 78D Temperature Range of Use: -55 to +155C Filled, heat curing, semi-rigid epoxy potting compound. Good imI)act and thermal shock resistance. Excellent for general purpose Pot:ting of various electrical/electronic devices.
508
Adhesives, Sealants and Coatings for the Electronics Industy
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Filled) (Continued): Two Component Systems-Epoxy Based(Continued): 1495: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 40,000 Specific Gravity @ 25C: 1.90 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 94D Temperature Range of Use: See Curing Agent Selector Chart Highly filled, medium viscosity, general purpose epoxy encapsulating resin. Low cost. Good thermal conductivity. Used with a variety of hardeners. Good choice for transformer encapsulation. 2057: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 5,500 Specific Gravity @ 25C: 1.60 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 85D Temperature Range of Use: See Curing Agent Selector Chart Filled, low viscosity, vacuum grade epoxy encapsulating resin. Good air release. Used with a variety of curatives. Recommended for general purpose potting applications. 2058 A/B: Black Mix Ratio A:B: 12O:lO Mixed Viscosity, cps @ 25C: 6,000 Specific Gravity @ 25C: 1.66 Cure Schedule: 16 hr @ 25C or 4 hr @ 45C or 1 hr @ 65C Shore Hardness: 90D Temperature Range of Use: -55 to +13OC Filled, low viscosity, fiberglass reinforced epoxy casting and encapsulating resin system. Room temperature cure. Excellc impact and thermal shock resistance. Ideal for use in thin section potting applications.
Encapsulating, Potting Casting, Impregnating Compounds
SO9
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Filled) (Continued): Two Component Systems-Epoxy Based(Continued): 2651: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 225,000 Specific Gravity @ 25C: 1.65 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 88D Temperature Range of Use: See Curing Agent Selector Chart Filled, general purpose, dielectric grade epoxy encapsulating resin. Used with a variety of curatives. Meets MIL-I-16923 when cured with Catalyst 11. Available in colors. 2651MM: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 35,000 Specific Gravity @ 25C: 1.61 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 89D Temperature Range of Use: See Curing Agent Selector Chart Low viscosity, highly machineable version of STYCAST 2651. Used with a variety of curatives. Can be easily meter/mix dispensed. Available in colors. 2651-40: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 32,500 Specific Gravity @ 25C: 1.50 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 80D Temperature Range of Use: See Curing Agent Selector Chart Low viscosity version of STYCAST 2651. Used with a variety of curatives. Meets MIL-I-16923 when cured with Catalyst 11. Available in colors. 2741: Black Mix Ratio A:B: 100:50 to 100:150 (Cat 15) Mixed Viscositv. CDS @ 25C: 40,000 Specific Gravity @-25C: 1.31 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 60A-80D Temperature Range of Use: -40 to c9OC Filled, room temperature curing epoxy potting and sealing resin. Flexibility can be adjusted by amount of Catalyst 15 used. Excellent adhesion to a wide variety of substrates.
510
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Filled) (Continued): Two Component Systems-Epoxy Based(Continued): 2741LV: Black Mix Ratio A:B: 100:25 to 1OO:lOO (Cat 15LV) Mixed Viscosity, cps @ 25C: 15,000 Specific Gravity @ 25C: 1.41 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 50D-80D Temperature Range of Use: -40 to +9OC Low viscosity version of STYCAST 2741. 3180M A/B: Black Mix Ratio A:B: 1OO:lOO Mixed Viscosity, CPS 13 25C: 15,000 Specific Gravity @-25C: 1.62 Cure Schedule: 8 hr @ 25C or 20 min @ 65C Shore Hardness: 80D Temperature Range of Use: -40 to +13OC Filled, low cost, general purpose epoxy encapsulant. Convenient I:1 mix ratio by weight or volume. Room temperature cure. Excellent moisture resistance. A-24: Black Mix Ratio A:B: Varies with Curative Mixed Viscositv, CDS @ 25C: 92,500 Specific Gravity @-25C: 1.58 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 80D Temperature Range of Use: See Curing Agent Selector Chart Filled, general purpose, dielectric grade epoxy encapsulant. Used with a variety of curatives. Low coefficient of thermal expansion. Excellent all around potting compound. A-27: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 9,300 Specific Gravity @ 25C: 1.58 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 80D Temperature Range of Use: See Curing Agent Selector Chart Low viscosity version of AMICON A-24.
Encapsulating,
Potting,
Casting, Impregnating
Compounds
511
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Filled) (Continued): Two Component Systems-Epoxy Based(Continued): T-913 A/B: Black Mix Ratio A:B: 100:200 Mixed Viscosity, cps @ 25C: 9,000 Specific Gravity @ 25C: 1.40 Cure Schedule: 16 hr @ 75C or 4 hr @ IOOC or 2 hr @ 125C Shore Hardness: 70D Temperature Range of Use: -40 to +13OC Filled, semi-rigid, abrasion resistant epoxy encapsulant. Used for potting and impregnating of coils and motors. Casting of large masses possible. XT-1169 A/B: Tan Mix Ratio A:B: 100:80 Mixed Viscosity, cps @ 25C: 7,300 Specific Gravity @ 25C: 1.44 Cure Schedule: 4 hr @ IOOC or 2 hr @ 125C Shore Hardness: 80D Temperature Range of Use: -40 to +155C Filied, heat curing, low viscosity encapsulant with good abrasion, thermal shock and impact resistance. Excellent for impregnation of small coils. XT-2555-l A/B: Tan Mix Ratio A:B: 1OO:lOO Mixed Viscosity, cps @ 25C: 4,200 Specific Gravity @ 25C: 1.50 Cure Schedule: 16 hr @ 8OC or 4 hr @ IOOC or 2 hr @ 125C Shore Hardness: 90D Temperature Range of Use: -40 to +155C Filled, rigid epoxy encapsulant. Heat cure. Excellent thermal shock and impact resistance. Excellent impregnation in small tightly wound coils. Excellent chemical resistance.
512
Adhesives, Sealanfs and Coatings for the Electronics Industy
EMERSON & CUMING, INC.: Encapsulants: General Purpose (Filled) (Continued): Two Component Systems-Silicone Based: 4122: White Mix Ratio A:B: 100:0.25 Mixed Viscosity, cps @ 25C: 11,000 Specific Gravity @ 25C: 1.20 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 5OA Temperature Range of Use: -65 to +22OC Filled, low viscosity, general purpose, RTV condensation cure, silicone potting compound. Useful for moldmaking where low viscosity is necessary for penetration of thin sections. 4963 A/B: White Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 6,000 Specific Gravity @ 25C: 1.29 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 35A Temperature Range of Use: -65 to +2OOC Filled, low viscosity, RTV condensation cure, silicone rubber potting compound. Convenient mix ratio for meter/mix dispensing. Long pot life. Ideal for general purpose potting and encapsulation. 5446 A/B: Off-White Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 13,000 Specific Gravity @ 25C: 1.25 Cure Schedule: 1-4 hr @ 65C or 20 min @ 150C Shore Hardness: 50A Temperature Range of Use: -65 to +22OC Filled, general purpose, addition cure, silicone potting compound. Noncorrosive. Good flexibility. Excellent elongation. Good tear strength. Designed for the potting of relays, switches, transformers and coils.
Encapsulating Potting, Casting Impregnating Compounds
513
EMERSON & CUMING, INC.: Encapsulants: Low Viscosity: One Component System-Epoxy Based: 910-54: Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 1,850 Specific Gravity @ 25C: 1.07 Cure Schedule: 2 hr @ 125C or 15 min @ 160C Shore Hardness: 60D Temperature Range of Use: -40 to +13OC Unfilled, semi-flexible, low viscosity impregnant for motors,, coils and transformers. Low exotherm. Excellent thermal shock resistance. Ideal for large castings. E-151-3: Tan Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 2,000 Specific Gravity @ 25C: 1.06 Cure Schedule: 16 hr @ 80C or 4 hr @ 1OOC or 2 hr @ 125C Shore Hardness: 55D TemDeratUre Range of Use: -40 to +13OC Unfilled, low viscosity epoxy encapsulant and impregnant. Excellent thermal shock and impact resistance. Low exotherm. Various colors available. Excellent for impregnating tightly wound coils. E-152: Green Mix Ratio A:B: N/A Mixed Viscositv. CDS B 25C: 5,500 Specific Gravity @*25c: 1.44 Cure Schedule: 4 hr @ IOOC or 2 hr @ 125C or 30 min @ 150C Shore Hardness: 65D Temperature Range of Use: -40 to +13OC Filled, low viscosity epoxy encapsulant and impregnant. Excellent thermal shock resistance. Low exotherm and shrinkage. Excellent for large motor, coil and transformer potting.
514
Adhesives, Sealants and Coatings for the Electronics Zndusty
EMERSON & CUMING, INC.: Encapsulants: Low Viscosity
(Continued):
One Component Systems-Epoxy Based(Continued): E-565: Straw Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 1,600 Specific Gravity @ 25C: 1.10 Cure Schedule: 2 hr @ 125C Shore Hardness: 85D Temperature Range of Use: -40 to +13OC Clear, low viscosity epoxy encapsulant. Low exotherm. Produces tough castings with good moisture and thermal shock resistance. W28G: Red Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: Paste Specific Gravity @ 25C: 1.22 Cure Schedule: 10 hr @ 150C Shore Hardness: 85D Temperature Range of Use: -40 to +2OOC Unfilled, high temperature resistant epoxy impregnant for transformers, coils and capacitors. Low viscosity at elevated temperature. Two Component Systems-Epoxy Based: 1207: Clear Red Mix Ratio A:B: 100:1.5 (Cat 20) Mixed Viscosity, cps @ 25C: 1750 Specific Gravity @ 25C: 1.19 Cure Schedule: 4 hr @ 65C + 60 min @ 175C Shore Hardness: S5D Temperature Range of Use: -20 to +175C Unfilled, low viscosity epoxy encapsulant and impregnant. High temperature resistance. Long pot life (12 hours at 25C). Excellent vacuum stability. Used to impregnate coils and windings.
Encapsulating,
Potting,
Casting, Impregnating
EMERSON & CUMING, INC.: Encapsulants: Low Viscosity
Compounds
515
(Continued):
Two Component Systems-Epoxy Based(Continued): 1217: Amber Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 750 Specific Gravity @-25C: 1.17 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 86D Temperature Range of Use: See Curing Agent Seletor Chart Unfilled, low viscosity epoxy encapsulant and impregnant resin. Used with a variety of curatives. Excellent vacuum stability. Used to pot small coils and electrical devices. 2057: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 5,500 Specific Gravity a-25C: 1.60 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 85D Temperature Range of Use: See Curing Agent Selector Chart Filled, low viscosity, vacuum grade epoxy encapsulating resin. Good air release. Used with a variety of curatives. Recommended for general purpose potting applications. 2057FR: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 5,000 Specific Gravity: 1.62 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 85D Temperature Range of Use: See Curing Agent Selector Chart Filled, low viscosity, fire-resistant epoxy resin system. Meets UL94 V-O when cured with Catalyst 9 or 11. Good air release. Suitable for encapsulation or impregnation of closely packed devices. 3020: Maroon Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 4,000 Specific Gravity @ 25C: 1.68 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 90D Temperature Range of Use: See Curing Agent Selector Chart Highly filled, low viscosity, strippable epoxy encapsulating resin. Used with a variety of curatives. Good machineability. Good for general purpose potting and encapsulation.
516
Adhesives, Sealants and Coaiings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Low Viscosity
(Continued):
Two Component Systems-Epoxy Based(Continued): 3050: Maroon Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 2,000 Specific Gravity @ 25C: 1.61 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 88D Temperature Range of Use: See Curing Agent Selector Chart Filled, very low viscosity, epoxy encapsulating resin. Used with a variety of curatives. Recommended for potting or impregnating small devices. T-663 A/B: Black Mix Ratio A:B: 1OO:ll Mixed Viscosity, cps @ 25C: 1,100 Specific Gravity @ 25C: 1.48 Cure Schedule: 16 hr @ 25C + 2 hr @ 80C Shore Hardness: 90D Temperature Range of Use: -20 to +155C Filled, low viscosity, room temperature curing epoxy encapsulant. Excellent adhesion to PVC and phenolics. High temperatur-e performance for room cure system. w19: Clear Red Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 250 Specific Gravity @ 25C: 1.20 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 78D Temperature Range of Use: See Curing Agent Selector Chart Unfilled, very low viscosity, epoxy impregnant. Used with a variety of curatives. Recommended for impregnating transformers, coils and small electronic components. W19-FR: Clear Red Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 520 Specific Gravity @ 25C: 1.20 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 78D Temperature Range of Use: See Curing Agent Selector Chart Unfilled, very low viscosity, fire resistant epoxy impregnant. Meets UL94 V-l when cured with Catalyst 9, V-O when cured with Catalyst 11. Used to impregnate transformers, coils and motors.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: Low Viscosity
517
(Continued):
Two Component-Epoxy Based(Continued): W67 A/B: Amber Mix Ratio A:E: 100:85 Mixed Viscosity, cps @ 25C: 250 Specific Gravity @ 25C: 1.23 Cure Schedule: 2 hr @ 125C + 16 hr @ 175C Shore Hardness: 85D Temperature Range of Use: -20 to c23OC Unfilled, low viscosity, heat curing epoxy impregnant. Excellent high temperature performance. Excellent electrical properties. Used for impregnating coils, transformers, chokes and solenoids. XT-1122 A/B: Amber Mix Ratio A:B: 15O:lOO Mixed Viscosity, cps @ 25C: 1,000 Specific Gravity: 1.05 Cure Schedule: 16 hrs @ 85C or 8 hr @ 95C or 4 hr @ IIOC Shore Hardness: 45D Temperature Range of Use: -40 to c155C Unfilled, heat cured, flexible epoxy impregnant and encapsulant. Combination of heat resistance and toughness, shock and impact resistance. Low viscosity. Used for coil impregnation. Two Component Systems-Urethane Based: TU-904 A/B: Dark Amber Mix Ratio A:B: 24:lOO Mixed Viscosity, cps @ 25C: 2,000 Specific Gravity @ 25C: 1.00 Cure Schedule: 48 hr @ 25C or 2 hr @ 80C Shore Hardness: 62A Temperature Range of Use: -60 to +105C Unfilled, low viscosity, reversion resistant, urethane encapsulant. Good low temperature performance and thermal shock resistance. Used for general purpose potting and encapsulation. TU-917 A/B: Amber Mix Ratio A:B: 25:lOO Mixed Viscosity, cps @ 25C: 2,500 Specific Gravity @ 25C: 0.96 Cure Schedule: 48 hr @ 25C or 2 hr @ 80C Shore Hardness: 70A Temperature Range of Use: -60 to +105C Unfilled, low viscosity urethane adhesive and encapsulant with good adhesion to vinyl and most plastic substrates. Low exotherm. Reversion resistant. Good low temperature performance and thermal shock resistance.
518
Adhesives, Sealants and Coatings for the Electronics Zndusty
EMERSON & CUMING, INC.: Encapsulants: Low Temperature Performance: Two Component Systems-Epoxy Based: 1267 A/B: Clear Mix Ratio A:B: 100:30 Mixed Viscosity, cps @ 25C: 450 Specific Gravity @ 25C: 1.15 Cure Schedule: 24 hr @ 25C or 2 hr @ 65C Shore Hardness: 80D Temperature Range of Use: -65 to +105C Clear, low cost, room temperature curing, low viscosity epoxy casting compound. Excellent cyrogenic performance. Good impact and thermal shock resistance. Used for display embedments and bonding glass lenses. 2754DK A/B: Black Mix Ratio A:B: 100:50 Mixed Viscosity, cps @ 25C: 60,000 Specific Gravity @ 25C: 2.30 Cure Schedule: 48 hr @ 25C or 24 hr @ 45C or 4 hr @ 65C Shore Hardness: 85A Temperature Range of Use: -65 to +105C Filled, flexible, thermally conductive epoxy encapsulating resin system. Exerts low stress on delicate components. Good low temperature performance and impact resistance. Excellent thermal cycle/shock resistance. Two Component Systems-Silicone Based: 2CN: Clear Mix Ratio A:B: 100:0.3-0.5 (Cat 50) Mixed Viscosity, cps @ 25C: 1,700 Specific Gravity @ 25C: 0.99 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 22A Temperature Range of Use: -65 to +2OOC Crystal clear, flexible, RTV silicone potting compound. Excellent low and high temperature performance. Recommended for applications requiring indentification, repair or replacement of defective components.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: Low Temperature Performance (Continued): Two Component Systems-Silicone Based(Continued): 4122: White Mix Ratio A:B: 100:0.3 (Cat 50) Mixed Viscosity, cps @ 25C: 11,000 Specific Gravity 8 25C: 1.20 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 50A Temperature Range of Use: -65 to +22OC Filled, low viscosity, general purpose, RTV condensation cure, silicone potting compound. Useful for moldmaking where low viscosity is necessary for penetration of thin sections. 4640: White Mix Ratio A:B: 100:0.3 (Cat 50) Mixed Viscosity cps @ 25C: 45,000 Specific Gravity @ 25C: 0.75 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 55A Temperature Range of Use: -65 to +26OC Lightweight, flexible, RTV condensation cure, silicone syntactic foam casting compound. High temperature resistance. Low dielectric constant and dissipation factor. Used for potting, caulking and sealing. 4850: White Mix Ratio A:B: 100:0.2 (Cat 50) Mixed Viscosity, cps @ 25C: 38,000 Specific Gravity @ 25C: 1.70 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 60A Temperature Range of Use: -65 to +23OC Filled, general purpose, RTV condensation cure, silicone rubber potting compound. Good low and high temperature performance. Used for potting, sealing, caulking and flexible mold making.
519
520
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Low Temperature Performance (Continued): Two Component Systems-Silicone Based(Continued): 4952: Red Mix Ratio A:B: 100:0.2 (Cat 50) Mixed Viscosity, cps @ 25C: 35,000 Specific Gravity @ 25C: 2.20 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 70A Temperature Range of Use: -65 to c26OC Filled, thermally conductive, RTV condensation cure, silicone rubber potting compound. Outstand ing high temperature performawe. Recommended for potting dev ices, requiring heat transfer. 4954: Red Mix Ratio A:B: 1OO:O.l (Cat 50 ) Mixed Viscosity, cps @ 25C: 40,000 Specific Gravity @ 25C: 2.35 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 80A Temperature Range of Use: -65 to +26OC Higher thermal conductivity version of ECCOSIL 4952. Gritty consistency. 4963 A/B: White Mix Ratio A/B: 1OO:lO Mixed Viscosity, cps @ 25C: 6,000 Specific Gravity @ 25C: 1.29 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 35A Temperature Range of Use: -65 to +2OOC Filled, low viscosity, RTV condensation cure, silicone rubber potting compound. Convenient mix ratio for meter/mix dispensing. Long pot life. Ideal for general purpose potting and encapsulation.
Encapsulating, Potting, Casting, Impregnating Compounds
521
EMERSON & CUMING, INC.: Encapsulants: Low Temperature Performance (Continued): Two Component Systems-Silicone Based(Continued): 5019 A/B: Clear Mix Ratio A/B: 1OO:lO Mixed Viscosity, cos @ 25C: 4,000 Specific Gravity @-25C: 1.00 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 50A Temperature Range of Use: -65 to +2OOC Clear, soft, tough, low viscosity, addition cure silicone encapsulant. Noncorrosive. Good tensile strength and high elongation. Used for cladding of optical fibers or encapsulation of functional modules for visibility. 5089 A/B: Clear Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 5,000 Specific Gravity @ 25C: 1.02 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 12A Temperature Range of Use: -65 to +2OOC Clear, low viscosity, low durometer, addition cure, silicone encapsulant. Noncorrosive. Reversion resistant. Used to provide cushioning or stress passivation to sensitive hybrids, LEDs or crystals. 5446 A/B: Off-White Mix Ratio A:B: 1OO:lO Mixed Viscositv. cos P 25C: 13,000 Specific Gravity @‘25C: 1.25 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 50A Temperature Range of Use: -65 to +225C Filled, general purpose, addition cure, silicone potting compound. Noncorrosive. Good f.lexibility. Excellent elongation. Good tear strength. Designed for potting relays, switches, transformers and coils.
522
Adhesives, Sealants and Coatings for the Electronics Zndastry
EMERSON & CUMING, INC.: Encapsulants: Low Temperature Performance(Continued): Two Component Systems-Silicone Based(Continued): 5877 A/B: Red Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 10,000 Specific Gravity @ 25C: 1.40 Cnre Schedule: j-4 hr @ 65C or 20 min @ 150C Shore Hardness: 65A Temperature Range of Use: -65 to c25OC Filled, high strength, addition cure silicone for mold making and prototype tooling. Excellent high temperature performance. High tear resistance. i2 A/B: Red Mix Ratio A:B: 1OO:lOO Mixed Viscosity, cps @ 25C: 40,000 Specific Gravity @ 25C: 2.05 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 75A Temuerature Range of Use: -65 to +26OC Highly filled, thermally conductive, addition cure, silicone potting compound. Convenient mix ratio (1:l). Noncorrosive. Used for potting transformers, rectifiers, power supplies and other heat generating modules. 595
5954 A/B: Red Mix Ratio A:B: 1OO:lOO Mixed Viscosity, cps @ 25C: 35,000 Specific Gravity @ 25C: 2.45 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 85A Temperature Range of Use: -65 to +26OC Higher thermal conductivity version of ECCOSIL 5952. Gritty consistency.
Encapsulating, Potting, Casting, Impregnating Compounds
523
EMERSON & CUMING, INC.: Encapsulants: Low Temperature Performance(Continued): Two Component Systems-Urethane Based: CPC-10 A/B: Amber Mix Ratio A:B: 100:12.5 Mixed Viscositv. CDS @ 25C: 55,000 Specific Gravity @&25C: 1.03 ' Cure Schedule: 24 hr @ 25C or 12 hr @ 65C or 4 hr @ 1OOC Shore Hardness: 90A Temperature Range of Use: -70 to +13OC Unfilled, tough, flexible, MOCA free, urethane casting compound. Reversion resistant. Excellent tear strength and abrasion resistance. Used for connector potting or casting of mechanical wear pads, bumpers or rollers. CPC-19 A/B: Amber Mix Ratio A:B: 100:38 Mixed Viscositv, cos @ 25C: 24,000 Specific Gravity @-25C: 1.03 Cure Schedule: 24 hr @ 25C or 12 hr @ 65C or 4 hr @ IOOC Shore Hardness: 70A Temperature Range of Use: -70 to +13OC Unfilled, lower viscosity, lower hardness version of CPC-18. MOCA free. Reversion resistant. CPC-41 A/B: Yellow Mix Ratio A:B: 100:120 Mixed Viscosity, cps @ 25C: 8,000 Specific Gravity @ 25C: 1.04 Cure Schedule: 24 hr @ 25C or 8 hr @ 65C Shore Hardness: 53A Temperature Range of Use: -70 to t13OC Unfilled, room temverature curina urethane encaosulant. Excellent eiecrical performance over a wide temperature range. Good thermal shock resistance. Used for general purpose potting and encapsulation.
524
Adhesives, Sealants and Coatingsfor the ElectronicsIndustry
EMERSON & CUMING, INC.: Encapsulants: Low Temperature Performance (Continued): Two Component Systems-Urethane Based(Continued): TU-904 A/B: Dark Amber Mix Ratio A:B: 24:lOO Mixed Viscosity, cps @ 25C: 2,000 Specific Gravity @-25C: 1.00 Cure Schedule: 48 hr @ 25C or 2 hr @ 80C Shore Hardness: 62A Temperature Range of Use: -60 to +105C Unfilled, low viscosity, reversion resistant urethane encapsulant. Good low temperature performance and thermal shock resistance. Used for general purpose potting and encapsulation. TU-917 A/B: Amber Mix Ratio A:B: 25:lOO Mixed Viscosity, cps @ 25C: 2,500 Specific Gravity @ 25C: 0.96 Cure Schedule: 48 hr @ 25C or 2 hr @ 80C Shore Hardness: 70A Temperature Range of Use: -60 to +105C Unfilled, low viscosity urethane adhesive and encapsulant with good adhesion to vinyl and most plastic substrates. Low exotherm. Reversion resistant. Good low temperature performance and thermal shock resistance.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: High Temperature Performance: One Component Systems-Epoxy Based: 906-9: Grey Mix Ratio A:B: N/A Mixed Viscositv CDS P 25C: 215,000 Specific Gravity ‘@ 25C: 1.73 . Cure Schedule: 2 hr @ 125C or 15 min @ 160C or 8 min @ 175C Shore Hardness: 94D Temperature Range of Use: -40 to +18OC Filled, high temperature resistant epoxy encapsulant. Good chemical and thermal shock resistance. Excellent adhesion to stainless steel. High reliability and cap sealant. 925-12: Black Mix Ratio A:B: N/A Mixed Viscosity cps @ 25C: 350,000 Specific Gravity @ 25C: 1.65 Cure Schedule: 2.5 hr @ 125C or 30 min @ 160C or 12 min @ 175C Shore Hardness: 94D Temperature Range of Use: -55 to +155C Filled, high temperature resistant epoxy encapsulant. Excellent chemical resistance. Low coefficient of thermal expansion. Recommended for use in large castings requiring excellent thermal cycle resistance. 925-13: Black Mix Ratio A:B: N/A Mixed Viscosity cps @ 25C: 32,500 Specific Gravity @ 25C: 1.56 Cure Schedule: 2.5 hr @ 125C or 30 min @ 160C or 12 min @ 175C Shore Hardness: 85D Temperature Range of Use: -55 to +155C Filled, high temperature performance epoxy encapsulant. Good chemical and thermal shock resistance. Lower viscosity version of UNISET 925-12.
525
526
Adhesives, Sealants and Coatings for fhe Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: High Temperature Performance (Continued): One Component Systems-Epoxy Based(Continued): EFF-14: Yellow Mix Ratio A:B: N/A Mixed Viscosity cps @ 25C: Powder Specific Gravity @ 25C: 0.24 Cure Schedule: 16 hr @ 80C or 4 hr @ IlOC or 2 hr @ 14OC or 60 min @ 180C Shore Hardness: N/A Temperature Range of Use: -65 to +175C High temperature resistant, syntactic foam powder. Low outgassing. Low exotherm. Repairable. Used in aerospace applications for potting electronic modules. G-508-1: Black Mix Ratio A:B: N/A Mixed Viscositv CDS B 25C: 34.000 Specific Gravity '@ 25C: 1.56 Cure Schedule: 2 hr @ 125C or 30 min @ 160C or 12 min @ 18OC Shore Hardness: 89D Temperature Range of Use: -20 to +18OC Filled, heat curing, fire-resistant epoxy encapsulant. High gloss. Good chemical resistance. Good high temperature performance. Meets UL94 V-O. Recommended for small device potting. W28G: Red Mix Ratio A:B: N/A Mixed Viscosity cps @ 25C: Paste Specific Gravity @ 25C: 1.22 Cure Schedule: 10 hr 8 15OC Shore Hardness: 85D Temperature Ranqe of Use: -40 to +2OOC Unfilled, high temperature resistant epoxy impreqnant for transformers, coils and capacitors. Low viscosity at elevated temperature.
Encapsulating, Potting, Casting, Impregnating Compounds
527
EMERSON & CUMING, INC.: Encapsulants: High Temperature Performance (Continued): Two Component Systems-Epoxy Based: 1207: Clear Red Mix Ratio A:B: 100:1.5 (Cat 20) Mixed Viscositv CDS @ 25C: 1,750 Specific Gravity @ 25C: 1.19. Cure Schedule: 4 hr @ 65C + 1 hr @ 175C Shore Hardness: 85D Temperature Range of Use: -20 to +175C Unfilled, low viscosity epoxy encapsulant and impregnant. High temperature resistance. Long pot life (12 hours at 25C). Excellent vacuum stability. Used to impregnate coils and windings. 2662: Black Mix Ratio A:B: 100:35 (Cat 17) Mixed Viscosity cps @ 25C: 40,000 Specific Gravity @ 25C: 1.50 Cure Schedule: 3 hr @ 125C + 3 hr @ 175C Shore Hardness: 88D Temnerature Ranse of Use: -20 to +23OC Filied, high temperature resistant epoxy encapsulating L.esin. Heat cure. Outstanding chemical and moisture resistance. 2742 A/B: Black Mix Ratio A:B: 1OO:l Mixed Viscosity cps @ 25C: 200,000 Specific Gravity @ 25C: 2.37 Cure Schedule: 4 hr @ 60C + l-4 hr @ 15OC Shore Hardness: 94D Temperature Range of Use: -40 to +23OC Filled, thermally conductive, heat curing epoxy encapsulating resin system. Excellent high temperature resistance. Long pot life (24 hours at 25C). Used for potting power supplies or casting heat sinks.
528
Adhesives,
Sealants
and Coatings for the Electronics
Industry
EMERSON & CUMING, INC.: Encapsulants: High Temperature Performance (Continued): Two Component Systems-Epoxy Based(Continued): 2762FT: Black Mix Ratio A:B: 1OO:lO (Cat 17) Mixed Viscosity cps @ 25C: 150,000 Specific Gravity @ 25C: 2.10 Cure Schedule: 3 hr @ 125C + 3 hr @ 175C Shore Hardness: 94D Temperature Range of Use: -20 to +23OC Highly filled, high temperature resistant, thermally conductive epoxy encapsulating resin. Heat cure. Low shrinkage. Excellent chemical resistance. Used for high temperature, high voltage potting. w66:
Amber Mix Ratio A:B: 100:45 (Cat 17) Mixed Viscosity cps @ 25C: 15,000 Specific Gravity @ 25C: 1.20 Cure Schedule: 3 hr @ 1OOC + 3 hr @ 175C Shore Hardness: 85D Temperature Range of Use: -20 to +22OC Unfilled, medium viscosity epoxy impregnant and casting resin. Excellent high temperature resistance. Excellent chemical resistance. W67 A/B: Amber Mix Ratio A:B: 100:85 Mixed Viscosity cps @ 25C: 250 Specific Gravity @ 25C: 1.23 Cure Schedule: 2 hr @ 125C + 16 hr @ 175C Shore Hardness: 85D Temperature Range of Use: -20 to +23OC Unfilled, low viscosity, heat curing epoxy impregnant. Excellent high temperature performance. Excellent electrical properties. Used for impregnating coils, transformers, chokes and solenoids.
Encapsulating, Potting, Casting Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: High Temperature Performance (Continued): Two Component Systems-Silicone Based: 4122: White Mix Ratio A:B: 100:0.3 (Cat 50) Mixed Viscosity cps @ 25C: 11,000 Specific Gravity @ 25C: 1.20 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 50A Temperature Range of Use: -65 to +22OC Filled, low viscosity, general purpose, RTV condensation cure, silicone potting compound. Useful for moldmaking where low viscosity is necessary for penetration of thin sections. 4640: White Mix Ratio A:B: 100:0.3 (Cat 50) Mixed Viscosity cps @ 25C: 45,000 Specific Gravity @ 25C: 0.75 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 55A Temperature Range of Use: -65 to +26OC Lightweight, flexible, RTV condensation cure, silicone syntactic foam casting compound. High temperature resistance. Low dielectric constant and dissipation factor. Used for potting, caulking and sealing. 4850: White Mix Ratio A:B: 100:0.2 (Cat 50) Mixed Viscosity cps @ 25C: 38,000 Specific Gravity @ 25C: 1.70 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 60A Temperature Range of Use: -65 to +23OC Filled, general purpose, RTV condensation cure, silicone rubber potting compound. Good low and high temperature performance. Used for potting, sealing, caulking and flexible mold making.
529
530
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: High Temperature Performance (Continued): Two Component Systems-Silicone Based(Continued): 4952: Red Mix Ratio A:B: 100:0.2 (Cat 50) Mixed Viscosity cps @ 25C: 35,000 Specific Gravity @ 25C: 2.20 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 70A Temperature Range of Use: -65 to +26OC Filled, thermally conductive, RTV condensation cure, silicone rubber potting compound. Outstanding high temperature performance. Recommended for potting devices requiring heat transfer. 4954:
Red Mix Ratio A:B: 1OO:O.l (Cat 50) Mixed Viscosity cps @ 25C: 40,000 Specific Gravity @ 25C: 2.35 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: SOA Temperature Range of Use: -65 to +26OC Higher thermal conductivity version of ECCOSIL 4952. Gritty consistency. A/B: White Mix Ratio A:B: 1OO:lO Mixed Viscosity cps @ 25C: 6,000 Specific Gravity @ 25C: 1.29 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 35A Temperature Range of Use: -65 to +2OOC Filled, low viscosity, RTV condensation cure, silicone rubber potting compound. Convenient mix ratio for meter/mix dispensing. Long pot life. Ideal for general purpose potting and encapsulation. 4963
Encapsulating, Potting, Casting, Impregnating Compounds
531
EMERSON & CUMING, INC.: Enscapulants: High Temperature Performance (Continued): Two Component Systems-Silicone Based(Continued): 5019
A/B: Clear Mix Ratio A:B: 1OO:lO Mixed Viscosity cps @ 25C: 4,000 Specific Gravity @ 25C: 1.00 Cure Schedule: i-4 hr @ 65C or 20 min @ 150C Shore Hardness: 50A Temperature Range of Use: -65 to +2OOC Clear, soft, tough, low viscosity, addition cure, silicone encapsulant. Noncorrosive. Good tensile strength and high elongation. Used for cladding of optical fibers or encapsulation of functional modules for visibility. 5089 A/B: Clear Mix Ratio A:B: 1OO:lO Mixed Viscosity cps @ 25C: 5,000 Specific Gravity @ 25C: 1.02 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 12A Temperature Range of Use: -65 to +2OOC Clear, low viscosity, low durometer, addition cure, silicone encapsulant. Noncorrosive. Reversion resistant. Used to provide cushioning or stress passivation to sensitive hybrids, LEDs or crystals. 5446 A/B: Off-White Mix Ratio A:B: 1OO:lO Mixed Viscosity cps @ 25C: 13,000 Specific Gravity @ 25C: 1.25 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 50A Temperature Range of Use: -65 to c225C Filled, general purpose, addition cure, silicone potting compound. Noncorrosive. Good fl.exibility. Excellent elongation. Good tear strength. Designed for the potting of relays, switches, transformers and coils.
532
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: High Temperature Performance (Continued): Two Component Systems-Silicone Based(Continued): 5877 A/B: Red Mix Ratio A:B: 1OO:lO Mixed Viscosity cps @ 25C: 10,000 Specific Gravity @ 25C: 1.40 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 65A Temperature Range of Use: -65 to c25OC Filled, high strength, addition cure silicone for mold making and prototype tooling; Excellent high temperature performance. High tear resistance. A/B: Red Mix Ratio A:B: 100:100 Mixed Viscosity cps @ 25C: 40,000 Specific Gravity @ 25C: 2.05 Cure Schedule: l-4 hr @ 65C or 20 min B 150C Shore Hardness: 75A Temperature Range of Use: -65 to c26OC Hiqhly filled, thermally conductive, addition cure, silicone potting compound. Convenient mix ratio (1:l). Noncorrosive. Used for potting transformers, rectifiers, power supplies and other heat generating modules. 5952
5954 A/B: Red Mix Ratio A:B: 1OO:lOO Mixed Viscosity CPS @ 25C: 35,000 Specific Gravity @ 25C: 2.45 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 85A Temperature Range of Use: -65 to +26OC Higher thermal conductivity version of ECCOSIL 5952. Gritty consistency.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: Dispensable: One Component Systems-Epoxy Based: 2651MM-1: Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 25,000 Specific Gravity @ 25C: 1.60 Cure Schedule: 9 hr @ 85C or 5 hr @ 120C Shore Hardness: 89D Temperature Range of Use: -40 to +155C Filled, low viscosity, general purpose epoxy encapsulant. Good machineability. Properties similar to STYCAST 2651MM cured with Catalyst 11. Recommended for small device potting. 906-9:
Grey Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 215,000 Specific Gravity @ 25C: 1.73 Cure Schedule: 2 hr @ 125C or 15 min @ 160C or 8 min @ l75C Shore Hardness: 94D Temperature Range of Use: -40 to +18OC Filled, high temperature resistant epoxy encapsulant. Good chemical and thermal shock resistance. Excellent adhesion to stainless steel. High reliability end cap sealant. 925-12: Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 350,000 Specific Gravity @-25C: 1.65 Cure Schedule: 2.5 hr @ 125C or 30 min @ 160C or 12 min @ 175C Shore Hardness: 94D Temperature Range of Use: -55 to +18OC Filled, high temperature resistant epoxy encapsulant. Excellent chemical resistance. Low coefficient of thermal expansion. Recommended for use in large castings requiring excellent thermal cycle resistance.
533
534
Adhesives, Sealants and Coatings for the Electronics Industy
EMERSON & CUMING, INC.: Encapsulants: Dispensable(Continued): One Component Systems-Epoxy Based(Continued): 925-13: Black Mix Ratio A:B: N/A Mixed Viscositv. cos @ 25C: 32,500 Specific Gravity @-25C: 1.56 . Cure Schedule: 2.5 hr @ 125C or 30 min @ 160C or 12 min @ 175C Shore Hardness: 85D Temperature Range of Use: -55 to c18OC Filled, high temperature performance epoxy encapsulant. Good chemical and thermal shock resistance. Lower viscosity version of UNISET 925-12. E-131: Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 18,000 Specific Gravity @ 25C: 1.40 Cure Schedule: 8 hr @ 1OOC or 4 hr @ 120C or 2 hr @ 140C Shore Hardness: 45D Temperature Range of Use: -40 to c13OC Filled, semi-flexible epoxy encapsulant and impregnant. Good thermal shock resistance. Used for large motor, coil and transformer encapsulation. E-152: Green Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 5,500 Specific Gravity @ 25C: 1.44 Cure Schedule: 4 hr @ IOOC or 2 hr @ 125C or 30 min @ 150C Shore Hardness: 65D Temperature Range of Use: -40 to +13OC Filled, low viscosity, epoxy encapsulant and impregnant. Excellent thermal shock resistan.ce. Low exotherm and shrinkage. Excellent for large motor, coil and transformer potting.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: Dispensable
535
(Continued):
Two Component Systems-Epoxy Based: 2058 A/B: Black Mix Ratio A:B: 12O:lO Mixed Viscosity, cps @ 25C: 6,000 Specific Gravity 8 25C: 1.66 Cure Schedule: 16 hr 8 25C or 4 hr 8 45C or 60 min @ 65C Shore Hardness: 90D Temperature Range of Use: -55 to +13OC Filled, low viscosity, fiberglass reinforced, epoxy casting and encapsulating resin system. Room temperature cure. Excellent impact and thermal shock resistance. Ideal for use in thin section potting applications. 2072 A/B: Black Mix Ratio A:B: 100:50 Mixed Viscosity, cps 8 25C: 8,000 Specific Gravity @ 25C: 1.65 Cure Schedule: 48 hr @ 25C or 4 hr @ 65C Shore Hardness: 89D Temperature Range of Use: -40 to +13OC Filled, low viscosity, easily dispensable epoxy encapsulant. LOW cost. Convenient mix ratio. Used for general purpose potting applications. 2075 A/B: Black Mix Ratio A:B: 100:6.5 Mixed Viscosity, cps @ 25C: 6,800 Specific Gravity @ 25C: 1.70 Cure Schedule: 24 hr 8 25C or 2-4 hr 8 65C Shore Hardness: 81D Temperature Range of Use: -40 to +13OC Filled, high gloss potting and enscapulating resin system. Low viscosity. Low cost. Good air release properties. Designed for use in'meter/mix dispensing, equipment.
536
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Enscapulants: Dispensable
(Continued):
Two Component Systems-Epoxy Based(Continued): 2651MM: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 35,000 Specific Gravity @ 25C: 1.61 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 89D Temperature Range of Use: See Curing Agent Selector Chart Low viscosity, highly machineable version of STYCAST 2651. Used with a variety of curatives. Can be easily meter/mix dispensed. Available in colors. 2741LV: Black Mix Ratio A:B: 100:25 to 1OO:lOO (Cat 15LV) Mixed Viscosity, cps @ 25C: 15,000 Specific Gravity @ 25C: 1.41 Cure Schedule: 24 hr [a 25C or 2-4‘hr @ 65C Shore Hardness: 50D-80D' Temperature Range of Use: -40 to +9OC Filied, room temperature curing potting and sealing resin. Flexibility can be adjusted by amount of Catalyst 15LV used. Excellent adhesion to a wide variety of substrates. Low viscosity version of STYCAST 2741. 3180M A/B: Black Mix Ratio A:B: 1OO:lOO Mixed Viscositv. CDS C 25C: 15,000 Specific Gravity @&25C: 1.62 Cure Schedule: 8 hr @ 25C or 20 min @ 65C Shore Hardness: 80D Temperature Range of Use: -40 to +13OC Filled, low cost, general purpose encapsulant. Convenient I:1 mix ratio by weight or volume. Room temperature cure. Excellent moisture resistance.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: Dispensable
537
(Continued):
Two Component Systems-Epoxy Based(Continued): XT-1169 A/B: Tan Mix Ratio A:B: 100:80 Mixed Viscosity ens C 25C: 7,300 Specific Gravity @ 25C: 1.44. Cure Schedule: 4 hr @ IOOC or 2 hr @ 125C Shore Hardness: 80D Temperature Range of Use: -40 to +155C Filled, heat curing, low viscosity encapsulant with good abrasion, thermal shock and impact resistance. Excellent for impregnation of small coils. Two Component Systems-Silicone Based: 4963 A/B: White Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 6,000 Specific Gravity @ 25C: 1.29 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 35A Temperature Range of Use: -65 to +2OOC Filled, low viscosity, RTV condensation cure, silicone rubber potting compound. Convenient mix ratio for meter/mix dispensing. Long pot life. Ideal for general purpose potting and encapsulation. 5446 A/B: Off-White Mix Ratio A:B: 1OO:lO Mixed Viscosity cps @ 25C: 13,000 Specific Gravity @ 25C: 1.25 Cure Schedule: 1-4 hr @ 65C or 20 min @ 150C Shore Hardness: 50A Temwerature Range of Use: -65 to +225C Filied, general-purpose, addition cure, silicone potting compound. Noncorrosive. Good flexibility. Excellent elongation. Good tear strength. Designed for potting relays, switches, transformers and coils.
538
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Fire Resistant: One Component Systems-Epoxy Based: G-508-1: Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 34,000 Specific Gravity @ 25C: 1.56 Cure Schedule: 2 hr @ 125C or 30 min @ 160C or 12 min @ 18OC Shore Hardness: 89D Temperature Range of Use: -20 to +18OC Filled, heat curing, fire-resistant epoxy encapsulant. High gloss. Good chemical resistance. Good high temperature performance. Meets UL94 V-O. Recommended for small device potting. Two Component Systems-Epoxy Based: 2057FR: Black Mix Ratio A:B: 100:6.5 (Cat 9) Mixed Viscosity, cps @ 25C: 4,000 Specific Gravity @ 25C: 1.58 Cure Schedule: 24 hr @ 25C Shore Hardness: 85D Temperature Range of Use: -40 to +13OC Mix Ratio A:B: 100:8 (Cat 11) Mixed Viscosity, cps @ 25C: 3,400 Specific Gravity, 25C: 1.59 Cure Schedule: 2-4 hr @ IOOC Shore Hardness: 87D Temperature Range of Use: -55 to +155C Filled, low viscosity, fire-resistant epoxy resin system. Meets UL94 V-O when cured with Catalyst 9 or 11. Good air release. Suitable for enscapulation or impregnation of closely packed devices. 2630FR A/B: Black Mix Ratio A:B: 100:20 Mixed Viscosity, cps @ 25C: 8,000 Specific Gravity @ 25C: 1.53 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 86D Temperature Range of Use: -55 to +13OC Filled, low viscosity, high gloss, fire-resistant epoxy potting compound. Room temperature cure. Easily dispensable (5:l mix ratio). Meets UL94 V-O. Used for potting relays.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: Fire Resistant
539
(Continued):
Two Component Systems-Epoxy Based(Continued): 2651-40FR: Black Mix Ratio A:B: 100:8.5 (Cat 9) Mixed Viscosity, cps @ 25C: 8,000 Specific Gravity @ 25C: 1.49 Cure Schedule: 24 hr @ 25C Shore Hardness: 87D Temperature Range of Use: -40 to +13OC Mix Ratio A:B: 100:9.5 (Cat 11) Mixed Viscosity, cps @ 25C: 4,800 Specific Gravity @ 25C: 1.50 Cure Schedule: 2-4 hr @ IOOC Shore Hardness: 88D TemDeratUre Range Of Use: -55 t0 C155C Filied, fire-resistant version of STYCAST 2651-40. Meets UL-94 V-O when cured with Catalyst 9 or 11. Excellent dielectric properties. Good choice for general purpose potting of electrical devices. 2850FT-FR: Black Mix Ratio A:B: 100:3 (Cat 9) Mixed Viscositv. CDS @ 25C: 80,000 Specific Gravity @-25C: 2.33 Cure Schedule: 24 hr @ 25C Shore Hardness: 92D Temperature Range of Use: -40 to +13OC Black Mix Ratio A:B: 100:4.5 (Cat 11) Mixed Viscosity, cps @ 25C: 65,000 Specific Gravity @-25C: 2.33 Cure Schedule: 2-4 hr @ IOOC Shore Hardness: 94D Temperature Range of Use: -55 to +155C Filled, fire-resistant version of STYCAST 2850T. Good heat transfer. Meets UL94 V-O when cured with Catalyst 9 or 11. Low coefficient of thermal expansion and shrinkage. High voltage applications.
540
Adhesives,
Sealants
and Coatings for the Electronics
Industry
EMERSON & CUMING, INC.: Encapsulants: Fire Resistant
(Continued):
Two Component Systems-Epoxy Based(Continued): W19-FR: Clear Red Mix Ratio A:B: 1OO:ll (Cat 9) Mixed Viscosity, cps @ 25C: 420 Specific Gravity @ 25C: 1.19 Cure Schedule: 24 hr @ 25C Shore Hardness: 76D Temperature Range of Use: -40 to +105C Clear Red Mix Ratio A:B: 100:15 (Cat 11) Mixed Viscosity, cps @ 25C: 400 Specific Gravity @ 25C: 1.21 Cure Schedule: 2-4 hr @ IOOC Shore Hardness: 70D Temperature Range of Use: -55 to +155C Unfilled, very low viscosity, fire-resistant epoxy impregnant. Meets UL94 V-l when cured with Catalyst 9, V-O when cured with Catalyst 11. Used to impregnate transformers, coils and motors. XT-1168-1 A/B: Black Mix Ratio A:B: 100:6 (B-71) Mixed Viscosity, cps @ 25C: 144,000 Specific Gravity @ 25C: 1.80 Cure Schedule: 16 hr @ 65C or 5 hr @ IOOC or 3 hr @ 130C Shore Hardness: 94D Temperature Range of Use: -40 to +155C Highly filled, fire-resistant epoxy casting resin. Low exotherm, coefficient of thermal expansion and shrinkage. Meets UL94 V-O when cured with Hardener B-71. XT-4064-3A: Off-White Mix Ratio A:B: 1OO:ll (B-100) Mixed Viscosity, cps @ 25C: 8,900 Specific Gravity @ 25C: 1.59 Cure Schedule: 24 hr @ 25C or l-2 hr @ 65C Shore Hardness: 85D Temperature Range of Use: -40 to t13OC Filled, fast curing, fire-resistant epoxy encapsulant. Good resistance to moisture and organic solvents. Meets UL94 V-O when cured with Hardener B-100. Used for general purpose potting.
Encapsulating, Potting, Casting, Impregnating Compounds
541
EMERSON & CUMING, INC.: Encapsulants: Fire Resistant(Continued): Two Component Systems-Epoxy Based(Continued): XT-5038-6A: Black Mix Ratio A:B: 100:12 (B-100) Mixed Viscosity, cps @ 25C: 3,400 Specific Gravity @ 25C: 1:58 Cure Schedule: 24 hr @ 25C or l-2 hr @ 65C Shore Hardness: 85D Temperature Range of Use: -40 to +13OC Filled, low viscosity, fire-resistant epoxy encapsulant. Fast air release. Good dielectric properties. Meets UL94 V-O when cured with Hardener B-100. Used for potting capacitors and small devices.
542
Adhesives, Sealanfsand Coatingsfor the ElecfronicsIndustry
EMERSON & CUMING, INC.: Encapsulants: Lightweight: One Component Systems-Epoxy Based: EFF-14: Yellow Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: Powder Specific Gravity @ 25C: 0.24 Cure Schedule: 16 hr @ 80C or 4 hr @ IlOC or 2 hr @ 14OC or 1 hr @ 18OC Shore Hardness: N/A Temperature Range of Use: -65 to +175C High temperature resistant, syntactic foam powder. Low outgassing. Low exotherm. Repairable. Used in aerospace applications for potting electronic modules. Two Component Systems-Epoxy Based: 1090: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 135,000 Specific Gravity @ 25C: 0.88 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 82D Temperature Range of Use: See Curing Agent Selector Chart Epoxy, syntactic foam casting resin. Low shrinkage and coefficient of thermal expansion. Low dielectric constant for minimal effect on circuit operation. Used in airborne embedment applications. 1090 s1: Black Mix Ratio A:B: 100:23 (Cat 24LV) Mixed Viscosity, cps @ 25C: 40,000 Specific Gravity @ 25C: 0.70 Cure Schedule: 24hr @ 25C or 2 hr @ 65C Shore Hardness: 80D Temperature Range of Use: -65 to +105C Lower density, lower viscosity version of STYCAST 1090. Recommended for use with Catalyst 24LV. Excellent impact resistance. Low dielectric constant.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON & CUMING, INC.: Encapsulants: Lightweight
(Continued):
Two Component Systems-Silicone Based: 4640: White Mix Ratio A:B: 100:0.3 (Cat 50) Mixed Viscosity. CDS a 25C: 45,000 Specific Gravity @-25C: 0.75 . Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 55A Temperature Range of Use: -65 to +26OC Liqhtweiqht, flexible, RTV condensation cure, silicone svntactic foam-casting compound. High temperature resistance. Low dielectric constant and dissipation factor. Used for potting, caulking and sealing. Two Component Systems-Urethane Based: FPHZ Red Mix Ratio A:B: Varies with Curative Specific Gravity @ 25C: 0.03-0.22 Cure Schedule: 4-8 hr @ 25C + 4 hr @ 1OOC Shore Hardness: N/A Temperature Range of Use: -65 to +13OC Rigid, high temperature resistant, foam-in-place urethane resin system. Rapid cure. Very low dielectric constant and dissipation factor. Used for electronic embedments, radome cores, and void filling.
543
544
Adhesives, Sealants and Coatings for the Electronics Industy
EMERSON & CUMING, INC.: Encapsulants: Optically Clear: One Component Systems-Epoxy Based: E-565: Lt. Yellow Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 1,600 Specific Gravity @ 25C: 1.10 Cure Schedule: 2 hr @ 125C Shore Hardness: 85D Temperature Range of Use: -40 to +13OC Clear, low viscosity epoxy encapsulant. Low exotherm. Produces tough castings with good moisture and thermal shock resistance. One Component Systems-Silicone Based: SC-120-4: Clear Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 45,000 Specific Gravity @ 25C: 1.00 Cure Schedule: 30 min @ 150C Shore Hardness: cl OA Temperature Range of Use: -50 to +18OC Clear, high purity (4 ppm total ionic impurity), heat curing hybrid circuit coating (30-45 mil thickness) and encapsulant (3/4-l" max cure depth). Excellent unprimed adhesion to a variety of substrates. One Component Systems-UV Curable: LV-2649-70: Clear Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: Paste Specific Gravity @ 25C: 1.04 Cure Schedule: UV cure: 5 set @ 200 w/in Shore Hardness: 25D Temperature Range of Use: -20 to +125C Clear, colorless, thixotropic LED blob for ceramic substrates. No discoloration with heat, humidity, and/or thermal cycling. 80 mil cure depth.
Encapsulating, Potting, Casting, Impregnating Compounds
545
EMERSON & CUMING, INC.: Encapsulants: Optically Clear (Continued): One Component Systems-W
Curable(Continued):
w-900: Clear Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 900 Specific Gravity @ 25C: 1.04 Cure Schedule: UV cure: 15 set @ 200 w/in Heat cure: 10 min @ 120C Shore Hardness: 75D Temperature Range of Use: -25 to +125C Clear, UV-curable encapsulant or dip coating. Excellent adhesion to glass, metals, and plastics. Excellent thermal shock resistance. Good humidity and solvent resistance. 125 mil cure depth. Two Component Systems - Epoxy Based: 1264 A/B: Clear Mix Ratio A:B: 100:45 Mixed Viscosity, cps @ 25C: 600 Specific Gravity @ 25C: 1.10 Cure Schedule: 48 hr @ 25C or 8 hr @ 45C or 3 hr @ 65C Shore Hardness: 7SD Temperature Range of Use: -65 to +105C Transparent, high impact, low viscosity, room temperature curing, epoxy casting compound. Good thermal shock resistance. Low exotherm and embedment stress. Ideal for large mass castings requiring visibility. 1267 A/B: Clear Mix Ratio A:B: 100:30 Mixed Viscosity, cps @ 25C: 450 Specific Gravity @ 25C: 1.15 Cure Schedule: 24 hr @ 25C or 2 hr @ 65C Shore Hardness: 80D Temperature Range of Use: -65 to +105C Clear, low cost, low viscosity, room temperature curinq, casting compound. Excellent cryogenic performance. Good -impact and thermal shock resistance. Used for display embedments and bonding glass lenses.
546
Adhesives, Sealants and Coatings for the Electronics Industy
EMERSON & CUMING, INC.: Encapsulants: Optically Clear (Continued): Two Component Systems-Epoxy Based(Continued): 1269A A/B: Clear Mix Ratio A:B: 1OO:lOO Mixed Viscosity, cps @ 25C: 5,000 Specific Gravity @ 25C: 1.20 Cure Schedule: 16 hr @ 9OC Shore Hardness: 85D Temperature Range of Use: -40 to +13OC Crystal clear, heat curing epoxy casting compound. Well suited for optical applications. No discoloration at temperatures up to 120C. Used for encapsulation of LEDs or casting optical lenses and prisms. 1365 Series: Clear Mix Ratio A:B: 1OO:lOO Mixed Viscosity, cps @ 25C: 100-600 Specific Gravity @ 25C: 0.99-1.06 Cure Schedule: 24 hr @ 45C or 8 hr @ 65C or 2 hr @ IOOC Shore Hardness: O-90A Temperature Range of Use: -55 to +9OC Series of epoxy resins which cure into clear, transparent gels of varying hardnesses. Long pot life. Low exotherm. Excellent shock resistance and damping. Low embedment stress. Repairable. T-674 A/B: Clear Mix Ratio A:B: 100:43 Mixed Viscosity, cps @ 25C: 11,600 Specific Gravity @ 25C: 1.08 Cure Schedule: 16 hr @ 25C or 60 min @ 65C Shore Hardness: 60D Temperature Range of Use: -55 to +105C Clear, high strength, general purpose epoxy encapsulant. Long pot life (5 hr @ 25C). Semi-flexible. Designed for biomedical applications.
Encapsulating, Potting, Casting, Impregnating Compounds
547
EMERSON & CUMING, INC.: Encapsulants: Optically Clear (Continued): Two Component Systems-Epoxy Based(Continued): XT-5156-09 A/B: Amber Mix Ratio A:B: 100:50 Mixed Viscosity, cps @ 25C: 800 Specific Gravity @ 25C: 1.06 Cure Schedule: 24 hr @ 25C or 2 hr @ 65C Shore Hardness: 85D Temperature Range of Use: -40 to +105C Clear, low viscosity, high gloss epoxy encapsulant. Room temperature cure. Good scratch and wear resistance. Used for decorative inlay casting. Available in range of colors. Two Component Systems-Silicone Based: 2CN: Clear Mix Ratio A:B: 100:0.3-0.5 (Cat 50) Mixed Viscositv. CDS P 25C: 1,700 Specific Gravity @‘25C: 0.99 Cure Schedule: 24 hr @ 25C or 4 hr @ 65C Shore Hardness: 22A Temperature Range of Use: -65 to +2OOC Crystal clear, flexible, RTV silicone potting compound. Excellent low and high temperature performance. Recommended for applications requiring identification, repair or replacement of defective components. 5019 A/B: Clear Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 4,000 Specific Gravity @ 25C: 1.00 Cure Schedule: l-4 hr @ 65C or 20 min @ 120C Shore Hardness: 34A Temperature Range of Use: -65 to +2OOC Clear, soft, tough, low viscosity, addition cure, silicone encapsulant. Noncorrosive. Good tensile strength and high elongation. Used for cladding of optical fibers or encapsulation of functional modules for visibility.
548
Adhesives,
Sealants
and Coatings for the Electronics
Industry
EMERSON & CUMING, INC.: Encapsulants: Optically Clear (Continued): Two Component Systems-Silicone Based(Continued): 5089 A/B: Clear Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 5,000 Specific Gravity @ 25C: 1.02 Cure Schedule: l-4 hr @ 65C or 20 min @ 120C Shore Hardness: 12A Temperature Range of Use: -65 to +2OOC Clear, low viscositv, low durometer, addition cure, silicone encapsulant. Noncorrosive. Reversion resistant. Used to provide cushioning or stress passivation to sensitive hybrids, LEDs or crystals.
Encapsulating, Potting, Casting, Impregnating Compounds
549
EMERSON & CLJMING, INC.: Encapsulants: Thermally Conductive: One Component Systems-Epoxy Based: 285;lFT: Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 85,000 Specific Gravity @ 25C: 2.25 Cure Schedule: 5 hr @ 80C or 2 hr @ IOOC or 60 min @ 120C Shore Hardness: 94D Temperature Range of Use: -55 to +155C Highly filled, high thermal conductivity epoxy encapsulant. Good high temperature and pressure cooker resistance. Recommended for use in high voltage applications. 2851KT: Blue Mix Ratio A:B: N/A Mixed Viscositv. ens @ 25C: 160,000 Specific Gravity @'25C: 2.80 Cure Schedule: 5 hr @ 80C or 2 hr @ IOOC or 60 min @ 120C Shore Hardness: 94D Temperature Range of Use: -55 to +155C Very highly filled, highest thermal conductivity epoxy encapsulant. Very gritty consistency. Excellent for casting of simple shapes and heat sinks. 2851
MT:
Blue Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 140,000 Specific Gravity @ 25C: 2.60 Cure Schedule: 5 hr @ 80C or 2 hr @ IOOC or 60 min @ 120C Shore Hardness: 94D Temperature Range of Use: -55 to +155C Highly filled, very high thermal conductivity epoxy encapsulant. Gritty consistency. Used for potting rectifiers or casting heat sinks.
550
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Thermally Conductive (Continued): One Component Systems-Epoxy Based(C!ontinued): 906-9: Grey Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 215,000 Specific Gravity @ 25C: 1.73 Cure Schedule: 2 hr @ 125C or 15 min @ 160C or 8 min @ 175C Shore Hardness: 94D Temperature Range of Use: -40 to +18OC Filled, high temperature resistance epoxy encapsulant. Good chemical and thermal shock resistance. Excellent adhesion to stainless steel. High reliability end cap sealant. Two Component Systems-Epoxy Based: 1495: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 40,000 Specific Gravity @ 25C: 1.90 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 94D Temperature Range of Use: See Curing Agent Selector Chart Highly filled, medium viscosity, general purpose epoxy encapsulating resin. Low cost. Good thermal conductivity. Used with a variety of hardeners. Good choice for transformer encapsulation. 2742 A/B: Black Mix Ratio A:B: 1OO:l Mixed Viscosity, cps @ 25C: 200,000 Specific Gravity @ 25C: 2.37 Cure Schedule: 4 hr @ 60C + l-4 hr @ 150C Shore Hardness: 94D Temperature Range of Use: -20 to +2OOC Filled, thermally conductive; heat curing, epoxy encapsulating resin system. Excellent high temperature resistance. Long pot life (24 hours at 25C). Used for potting power supplies or casting heat sinks.
Encapsulating, Potting, Casting, Impregnating Compounds
EMERSON
& CUMING,
INC.:
551
Encapsulants: Thermally Conductive
(Continued): Two Component Systems-Epoxy Based(Continued): 2754DK A/B: Black Mix Ratio A:B: 100:50 Mixed Viscosity, cps @ 25C: 60,000 Specific Gravity @ 25C: 2.30 Cure Schedule: 48 hr @ 25C or 24 hr @ 45C or 4 hr @ 65C Shore Hardness: 85A Temperature Range of Use: -55 to c105C Filled, flexible, thermally conductive, epoxy encapsulating resin system. Exerts low stress on delicate components. Good low temperature and impact resistance. Excellent thermal cycle/ shock resistance. 2762FT:
Black Mix Ratio A:B: 1OO:lO (Cat 17) Mixed Viscosity, cps @ 25C: 150,000 Specific Gravity @ 25C: 2.10 Cure Schedule: 3 hr @ 125C + 3 hr @ 175C Shore Hardness: 94D Temperature Range of Use: -40 to +23OC Highly filled, high temperature resistant, thermally conductive, epoxy encapsulating resin. Heat cure. Low shrinkage. Excellent chemical resistance. Use for high temperature, high voltage device potting. 2850FT:
Black or Blue Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 250,000 Specific Gravity @ 25C: 2.40 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 94D Temperature Range of Use: See Curing Agent Selector Chart Highly filled, thermally conductive, epoxy encapsulating resin. Low shrinkage and coefficient of expansion. Used with a variety of curatives. Recommended for use in high voltage power supplies, bushings and transformers.
552
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Thermally Conductive (Continued): Two Component Systems-Epoxy Based: 2850FT-FR: Black Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 135,000 Specific Gravity @ 25C: 2.45 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 94D Temperature Range of Use: See Curing Agent Selector Chart Fire resistant version of STYCAST 2850FT. Good heat transfer. Meets UL94 V-O when cured with Catalyst 9 or 11. Low coefficient of thermal expansion and shrinkage. High voltage applications. 2850XT: Blue Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 225,000 Specific Gravity @ 25C: 2.75 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 97D Temperature Range of Use: See Curing Agent Selector Chart Very highly filled, highest thermal conductivity, epoxy encapsulating resin. Very gritty consistency. Used with a variety of curatives. Recommended for casting heat sinks. 2850MT: Blue Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 100,000 Specific Gravity @ 25C: 2.60 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 93D Temperature Range of Use: See Curing Agent Selector Chart Highly filled, very high thermal conductivity, epoxy encapsulating resin. Gritty consistency. Used with a variety of curatives. Recommended for potting electrical devices where temperature rise must be controlled. A-25: Black Mix Ratio A:B: Varies with Curative Mixed Viscositv, cas a 25C: 120,000 Specific Gravity @-25C: 1.80 . Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 80D Temperature Range of Use: See Curing Agent Selector Chart Higher filled version of AMICON A-24. Good thermal conductivity. Low shrinkage. Used with a variety of curatives.
Encapsulating, Potting, Casting, Impregnating Compounds
553
EMERSON & CUMING, INC.: Encapsulants: Thermally Conductive (Conductive): Two Component Systems-Silicone Based: 4850: White Mix Ratio A:B: 100:0.2 (Cat 50) Mixed Viscositv. CDS (a 25C: 38.000 Specific Gravity @&25C: 1.70 . Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 60A Temperature Range of Use: -65 to +23OC Filled, general purpose, RTV condensation cure, silicone rubber potting compound. Good low and high temperature performance. Used for potting, sealing, caulking and flexible mold making. 4952:
Red Mix Ratio A:B: 100:0.2 (Cat 50) Mixed Viscosity, cps 8 25C: 35,000 Specific Gravity 8.25C: 2.20 Cure Schedule: 24 hr @ 25C or 2-4 hr @ 65C Shore Hardness: 70A Temperature Range of Use: -65 to +26OC Filled, thermally conductive, RTV condensation cure, silicone rubber potting compound. Outstanding high temperature performance. Recommended for potting devices requiring heat transfer. 4954:
Red Mix Ratio A:B: 1OO:O.l (Cat 50) Mixed Viscosity, cps 8 25C: 40,000 Specific Gravity 8 25C: 2.35 Cure Schedule: 24 hr 8 25C or 2-4 hr @ 65C Shore Hardness: 80A Temperature Range of Use: -65 to +26OC Higher thermal conductivity version of ECCOSIL 4952. Gritty consistency.
554
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Thermally Conductive (Continued): Two Component Systems-Silicone Based(Continued): 5952 A/B: Red Mix Ratio A:B: 100:100 Mixed Viscosity, cps @ 25C: 40,000 Specific Gravity @ 25C: 2.05 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 75A Temperature Range of Use: -65 to +26OC Highly filled, thermally conductive, addition cure, silicone potting compound. Convenient mix ratio (1:l). Noncorrosive. Used for potting transformers, rectifiers, power supplies and other heat generating modules. 5954 A/B: Red Mix Ratio A:B: 100:100 Mixed Viscosity, cps @ 25C: 35,000 Specific Gravity @ 25C: 2.45 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 85A Temperature Range of Use: -65 to +26OC Higher thermal conductivity version of ECCOSIL 5952. Gritty consistency.
Encapsulating,
Potting,
Casting, Impregnating
Compounds
EMERSON & CUMING, INC.: Encapsulants: Specialty: One Component Systems-Silicone Based: SC-120-4: Clear Mix Ratio A/B: N/A Mixed Viscosity, cps @ 25C: 45,000 Specific Gravity @ 25C: 1.00 Cure Schedule: 30 min @ 150C Shore Hardness: ~1 OA TemDeratUre Rancfe of Use: -50 to +18OC Clear, high purity (~4 ppm total impurities), heat curing hybrid circuit coating (30-45 mil thickness) and encapsulant (3/4-l" max cure depth.) Excellent unprimed adhesion to a variety of substrates. SC-120-5: Red Tint Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 45,000 Specific Gravity @ 25C: 1.00 Cure Schedule: 30 min @ 150C Shore Hardness:
5:
Black Mix Ratio A:B: N/A Mixed Viscosity, cps @ 25C: 45,000 Specific Gravity @ 25C: 1.00 Cure Schedule: 30 min @ 150C Shore Hardness:
555
556
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Specialty (Continued): Two Component Systems-Epoxy Based: 1365 Series: Clear Mix Ratio A:B: 100:100 Mixed Viscosity, CDS @ 25C: 100-600 Specific Gravity @‘25C: 0.99-1.06 Cure Schedule: 24 hr @ 45C or 8 hr @ 65C or 2 hr @ 1OOC Shore Hardness: O-90A Temperature Range of Use: -55 to +9OC Series of epoxy resins which cure into clear, transparent gels of varying hardnesses. Long pot life. Low exotherm. Excellent shock resistance and damping. Low embedment stress. Repairable. 2760 A/B: Black Mix Ratio A:B: 100:50 Mixed Viscosity, cps @ 25C: 18,000 Specific Gravity @ 25C: 1.55 Cure Schedule: 48 hr @ 25C or 4 hr @ 65C or 2 hr @ 1OOC Shore Hardness: 80D Temperature Range of Use: -40 to +13OC Filled, room temperature curing, epoxy/urethane potting compound. Designed for exceLlent adhesion to vinyl substrates. Recommended for potting components containing vinyl insulated wire or cable. 302OSC: Maroon Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: Thixotropic Paste Specific Gravity @ 25C: 1.69 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 90D Temperature Range of Use: See Curing Agent Selector Chart Thixotropic version of STYCAST 3020. Used in silicon slicing applications or as a dip coat for electronic components. Used with a variety of curatives.
Encapsulating Potting, Casting, Impregnating Compounds
557
EMERSON & CUMING, INC.: Encapsulants: Specialty (Continued): Two Component Systems-Epoxy Based(Continued): Aluminum: Grey Mix Ratio A:B: Varies with Curative Mixed Viscosity, cps @ 25C: 105,000 Specific Gravity @ 25C: 1.69 Cure Schedule: See Curing Agent Selector Chart Shore Hardness: 82D Temperature Range of Use: See Curing Agent Selector Chart Aluminum filled, general purpose epoxy casting and tooling resin. Used with a variety of curatives. Recommended for casting rigid molds or for the repair of aluminum molds. Two Component Systems-Silicone Based: 2CN: Clear Mix Ratio A:B: 100:0.3-0.5 (Cat 50) Mixed Viscosity, cps @ 25C: 1,700 Specific Gravity @ 25C: 0.99 Cure Schedule: 24 hr @ 25C or 4 hr @ 65C Shore Hardness: 22A Temperature Range of Use: -65 to +2OOC Crystal clear, flexible, RTV silicone potting compound. Excelient low and high temperature performance.-Recommended for applications requiring identification, repair or replacement of defective components. 5089
A/B: Clear Mix Ratio A:B: 1OO:lO Mixed Viscosity, cps @ 25C: 5,000 Specific Gravity @ 25C: 1.02 Cure Schedule: 1-4 hr @ 65C or 20 min @ 15OC Shore Hardness: 12A Temperature Range of Use: -65 to +2OOC Clear, low viscosity, low durometer, addition cure silicone. Noncorrosive. Reversion resistant. Used to provide cushioning or stress passivation to sensitive hybrids, LEDs or crystals.
558
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Specialty (Continued): Two Component Systems-Silicone Based(Continued): 5877 A/B: Red Mix Ratio A:B: 1OO:lO Mixed Viscosity, CDS @ 25C: 10,000 Specific Gravity @-25C: 1.40 Cure Schedule: l-4 hr @ 65C or 20 min @ 150C Shore Hardness: 65A Temperature Range of Use: -65 to c2OOC Filled, high strenqth, addition cure silicone for mold making and prototype tooling. Excellent high temperature performance. High tear resistance. Two Component Systems-Urethane Based: FPH: Red Mix Ratio A:B: Varies with Curative Specific Gravity @ 25C: 0.03-0.22 Cure Schedule: 4-8 hr @ 25C + 4 hr @ IOOC Shore Hardness: N/A Temperature Range of Use: -65 to +13OC Rigid, high temperature resistant, foam-in-place urethane resin system. Rapid cure. Very low dielectric constant and dissipation factor. Used for electronic embedments, radome cores, and void filling.
Encapsulating, Potting, Casting, Zmpregnating Compounds
559
EMERSON & CUMING, INC.: Encapsulants: Curing Agents: 9: Amber Viscosity, cps @ 25C: 80-105 Specific Gravity @ 25C: 1.00 Working Life (100 Grams @ 25C): 45 min. Typical Cure Schedule: 16-24 hrs @ 25C or 2-4 hrs @ 65C Temperature Range of use: -40 to +13OC General purpose, low viscosity, room temperature curing epoxy hardener. Imparts good physical strength and chemical resistance to cured castings. Recommended for most general purpose applications. 11:
Dark Brown Viscosity, cps @ 25C: 35-60 (@35C) Specific Gravity @ 25C: 1.10 Working Life (100 Grams @ 25C): >4 hrs Typical Cure Schedule: 2-4 hrs @ IOOC + 4-16 hrs @ 150C Temperature Range of Use: -55 to +155C General purpose, low viscosity, elevated temperature curing epoxy hardener. Long working life. Yields cured castings with excellent chemical resistance. Subject to partial crystallization at temperatures below 65C (Crystals can be removed by warming gently to 65C and maintaining until all crystals have dissolved.) 15: Amber/Black Viscosity, cps @ 25C: 25,000 Specific Gravity @ 25C: 0.97 Working Life (100 Grams @ 25C): 2 hrs 15Lv: Amber/Black Viscosity, cps @ 25C: 15,000 Specific Gravity @ 25C: 0.97 Working Life (100 Grams @ 25C): 2 hrs Typical Cure Schedule: 16-24 hrs @ 25C or 2-4 hrs @ 65C Temperature Range of use: -40 to +9OC Easy-to-use, room temperature curing epoxy hardeners. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields cured castings adhesives having outstanding adhesion to a wide variety of substrates.
560
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Curing Agents (Continued): 17M-1: Tan Viscosity, cps @ 25C: Slurry @ 25C Specific Gravity @ 25C: 1.40 Working Life (100 Grams @ 25C): 24 hrs Typical Cure Schedule: 3 hrs @ 121C + 3 hrs @ 150C + 16 hrs @ 175C Temperature Range of Use: -20 to +23OC Very high temperature resistant, heat curing epoxy hardener. Non-crystallizing. Long working life. Imparts excellent chemical resistance to cured castings. Recommended for applications requiring the optimum in high temperature performance. 18: Amber Viscosity, cps @ 25C: 200-350 Specific Gravity @ 25C: 0.94 Working Life (100 Grams @ 25C): 2 hrs Tvnical Cure Schedule: 24-48 hrs @ 25C or 3-6 hrs-@ 65C Temperature Range of Use: -40 to +9OC Low-viscosity aiternative to 15 or 15LV. Wide mixing ratio with adjustable flexibility. Long working life. Yields cured castings or adhesives with excellent adhesion to a wide variety of substrates. 21: Dark Amber Viscosity, cps @ 25C: 65 Specific Gravity @ 25C: 1.03 Working Life (100 Grams @ 25C): 60 min. Typical Cure Schedule: 16-24 hrs @ 25C + 4-8 hrs @ 65-85C Temperature Range of Use: -65 to +13OC Non-crystallizing, low viscosity, large mass casting epoxy hardener. Elevated temperature cure. Imparts good thermal shock/cycle and impact resistance to cured castings. 23LV: Water-Clear to Slight Amber Viscositv. CDS B 25C: 20-30 Specific-Gra;ity @ 25C: 1.01 Working Life (100 Grams @ 25C): 60 min. Typicai Cure Schedule: 16-24 hrs @ 25C or 2-4 hrs @ 25C Temperature Range of Use: -65 to +105C Low color, low viscosity, room temperature curing epoxy hardener. Long pot life. Imparts excellent thermal shock and impact resistance to cured castings. Excellent adhesion to glass.
Encapsulating, Potting, Casting, Impregnating Compounds
561
EMERSON & CUMING, INC.: Encapsulants: Curing Agents (Continued): 24LV: Water-Clear to Slight Amber Viscosity, cps @ 25C: IO-25 Specific Gravity @ 25C: 1.01 Working Life (100 Grams @ 25C): 30 min. Typical Cure Schedule: 8-16 hrs @ 25C or l-2 hrs @ 65C Temperature Range of Use: -65 to +105C Low color, low viscosity, room temperature curing epoxy hardener. Faster curins version of 23LV. Imuarts excellent thermal shock and impact resistance to cured castings. Excellent adhesion to glass. Recommended for small mass castings. 18: Dark Red Viscosity, cps @ 25C: 200-275 Specific Gravity @ 25C: 1.17 Working Life (100 Grams @ 25C): >4 hrs Typical Cure Schedule: 4-5 hrs @ IOOC + 4 hrs @ 150C Temperature Range of Use: -40 to +175C Non-staining, non-crystallizing alternative to 11. Low viscosity. Long working life. Elevated cure. Yield castings having high temperature performance and excellent chemical resistance. 42: Reddish Brown Viscosity, cps @ 25C: 4000-8000 Specific Gravity @ 25C: 0.96 Working Life (100 Grams @ 25C): 24 hrs Typical Cure Schedule: 4 hrs @ 60C +I-4 hrs @ 150C Temperature Range of Use: -20 to +23OC Very high temperature resistant, heat curing epoxy curative. Can be used as sole curative or as accelerator for 17M-1. Long working life. Cured castings exhibit excellent retention of properties at elevated temperatures and outstanding chemical resistance. 43: Amber Viscosity, cps @ 25C: 45-65 Specific Gravity @ 25C: 1.03' Working Life (100 Grams @ 25C): 45 min. Typical Cure Schedule: 16-24 hrs @ 25C or l-2 hrs @ 65C + 2-4 hrs @ 150C Temperature Range of Use: -40 to +175C High temperature resistant, low viscosity, room temperature gelling epoxy hardener. Imparts excellent chemical resistance and physical properties to cured castings. Requires elevated temperature post cure to achieve ultimate high temperature performance.
562
Adhesives, Sealants and Coatings for the Electronics Industry
EMERSON & CUMING, INC.: Encapsulants: Curing Agents (Continued): 1309: Blue Viscosity, cps @ 25C: 75 Specific Gravity @ 25C: 1.01 Working Life (100 Grams @ 25C): 20 min. Typical Cure Schedule: 8-16 hrs @ 25C or l-2 hrs @ 65C Temperature Range of Use: -40 to +13OC Very fast room temperature curing, low viscosity, general purpose epoxy hardener. Short working life. Imparts excellent chemical resistance to cured castings. Basically, a faster curing version of 9. B-63: Amber Viscosity, cps @ 25C: 27 Specific Gravity @ 25C: 0.98 Working Life (100 Grams @ 25C): 30 min. Typical Cure Schedule: 16-24 hrs @ 25C or 2-4 hrs @ 65C Temperature Range of Use: -40 to +13OC General purpose, light color, low viscosity epoxy hardener. Room temperature cure. Imparts good balance of mechanical, electrical and chemical resistance to cured castings. Slightly better high temperature performance than 9. Good general purpose hardener for small electrical device potting. B-100: Amber Viscosity, cps @ 25C: 300-500 Specific Gravity @ 25C: 1.02 Working Life (100 Grams @ 25C): 25 min. Typical Cure Schedule: 16-24 hrs @ 25C or l-2 hrs @ 65C Temperature Range of Use: -40 to +105C Low shrinkage, low viscosity, room temperature curing epoxy hardener. Yields cured castings with outstanding electrical properties and excellent chemical resistance. Good choice for structural applications.
Encapsulating Potting, Casting, Impregnating Compounds
563
FENWAL INC.: TRU-CAST Potting and Casting Resins: TRU-CAST 101: Epoxy Potting and Casting Compound TRU-CAST 101 is a low cost, filled, potting and casting resin used extensively in the electronics industry and other industries requiring the use of an epoxy compound with excellent electrical and casting properties. This epoxy may be used as a UL 1446 Class B insulating compound when cured with Agent 901. Properties: Color: black Specific Gravity: 1.6 Adhesion: excellent Machining: must be ground Hardness, Shore D: 91 Tensile Strength, psi: 7,000 Compressive Strength, psi: 16,000 Flexural Strength, psi: 15,000 Coefficient of linear expansion, in/in/C: 35 x 10 -6 Dielectric Strength, vol'cs/mil: 450 Dielectric Constant, 10 4 Hz @ 25: 4.0 Dissipation Factor, 10 4 Hz @ 25: 0.008 Heat Distortion Temperature: with Curing Agent 901: 105C with Curing Agent 902: 150C TRU-CAST lOlf924: TRU-CAST 101 is a low cost, filled, potting and casting resin used extensively in the electronics industry. When cured with agent 924, the product is a low shrinkage, shock resistant polymer. The low viscosity of the mixture permits encapsulation with a minimum of air entrapment. Properties: Color: black Specific Gravity: 1.6 Heat Distortion Temperature, F: 140 Hardness, Shore D: 81 Hardness after 100 hrs @ 105F, Shore D: 83 Izod Impact Strength, ft lb/inch, notched: 1.5 Tensile Strength, psi: 7,000 Tensile Modulus, psi: 3.8 x 10 5 Tensile Elongation, %: 1.0 Flexural Strensth. asi: 12,000 Flexural Modul&,.psi: 6 x.10 5 Dielectric Strength, volts/mil: 450 Dielectric Constant, 10 6 Hz @ 25C: 3.4 Dissipation Factor, 10 6 Hz @ 25C: 0.05 Surface Resistivity, ohms @ 25C: 9 x 10 9 Arc Resistance, seconds: 120
564
Adhesives, Sealants and Coatings for the Electronics Industry
FENWAL INC.: TRU-CAST Potting and Casting Resins (Continued): TRU-CAST 102: Low Viscosity, Unfilled Epoxy Potting and Casting Resin TRU-CAST 102 is an unfilled, low viscosity epoxide potting and casting resin. It may be heavily loaded to obtain thermal expansion characteristics close to that of metals. Its low viscosity also makes it an excellent laminating resin. Properties: Color: light amber Adhesion: excellent Machining: readily machined Shore D, Hardness: 85-87 Compressive Strength, psi: 15,000 Flexural Strength, psi: 12,000 Specific Gravity: 1.13 Coefficient of Linear Expansion, in/in/C: 60 x 10 -6 Dielectric Strength, volts/mil: 450 Power Factor, 10 4 cps @ 25C.: .008 Dielectric Constant, 10 4 cps @ 25C: 3.6 Heat Distortion Temperature: Curing Agent 901: 8OC Curing Agent 902: 145C TRU-CAST 102/924: Low viscosity, unfilled epoxy potting and casting resin TRU-CAST 102 is an unfilled, low viscosity epoxide potting and casting resin. It may be heavily loaded to obtain thermal expansion characteristics close to that of metals. When cured with agent 924, the product is a resilient, shock resistant polymer. The low viscosity of the mixture permits encapsulation with a minimum of air entrapment. Properties: Color: light amber Specific Gravity: 1.18 Heat Distortion Temperature, F: 130 Hardness, Shore D: 70 Izod Impact Strength, ft lb/inch, notched: 2.10 Tensile Strength, psi: 6,500 Tensile Elonsation. %: 5 Flexural Str>h,.psi: 12,300 Dielectric Strength, volts/mil: 400 Dielectric Constant, IO 6 Hz @ 25C: 3.3 Dissipation Factor, 10 6 Hz @ 25C: 0.06 Surface Resistivity, ohms @ 25C: 9 x 10 9
Encapsulating, Potting, Casting, Impregnating Compounds
565
FENWAL INC.: TRU-CAST Potting and Casting Resins (Continued): TRU-CAST 103: Epoxy Potting and Casting Resin Unfilled TRU-CAST 103 is an unfilled epoxy potting and casting resin offering excellent electrical and mechanical properties. Its viscosity range is 10,000 to 16,000 cps and does not contain reactive diluents. When used with Curing Agent 902 this system meets all requirements set out by MIL-R-9300B for Type I, Form A, Grades 0 & C. Properties: Color: light amber Specific Gravity: 1.16 Adhesion: excellent, used in many cases as an adhesive Shore D: 87 Tensile Strength, psi: 10,500 Compressive Strength, psi: 14,000 Flexural Strength, psi: 18,000 Dielectric Strength, volts/mil: 400 Dielectric Constant, 10 4 Hz @ 25C: 3.5 Dissipation Factor, 10 4 Hz @ 25C: .Ol Heat Distortion Temperatures: With Curing Agent 901: 85C. With Curing Agent 902: 150C. TRU-CAST 103/907: Adhesive complying with Military Specification MIL-A-81236 (OS), Types I & II TRU-CAST 103/907 is a polyamide cured epoxy adhesive intended for use in rocket motors, but useful in a wide variety of bonding applications. It is a low viscosity, 100% solids thermosetting polymer which will react at room temperature in several hours or at elevated temperatures in minutes. Properties: Color: Light Amber % Nonvolatile: 100 Initial Mix Viscosity @ 77F, cps: 12,600 Hardness, Shore D: 75 Tensile Shear Strength, psi: 15,000 Heat Deflection Temperature, F: 185
566
Adhesives, Sealants and Coatings for the Electronics Industry
FENWAL
INC.: TRU-CAST Potting and Casting Resins (Continued):
TRU-CAST 103/924: Epoxy potting and casting resin unfilled TRU-CAST 103 is an unfilled epoxy potting and casting resin offering excellent electrical and mechanical properties. When cured with agent 924, the product is a resilient, shock resistant polymer. The low viscosity of the mixture permits encapsulation with a minimum of air entrapment. Properties: Color: light amber Specific Gravity: 1.18 Heat Distortion Temperature, F: 130 Hardness, Shore D: 78 Hardness after 100 hrs 0 105F, Shore D: 79 Izod Impact Strength, ft lb/inch, notched: 2.00 Tensile Shear Strength (cured 2 hrs @ 200F), psi: 5,400 Tensile Shear Strength (cured 7 days @ 77F), psi: 2,200 Tensile Strength, psi: 7,600 Tensile Modulus. osi: 3.6 x 10 5 Tensile Elongation, %: 2.8 Flexural Strength, psi: 12,300 Flexural Modulus, psi: 3.8 x 10 5 Dielectric Strength, volts/mil: 400 Dielectric Constant, 10 6 Hz @ 25C: 3.3 Dissipation Factor, 10 6 Hz @ 25C: 0.06 Surface Resistivity, ohms @ 25C: 9 x 10 9 Arc Resistance, seconds: 98 TRU-CAST 104: Low density - Syntactic foam epoxy potting compound TRU-CAST 104 is a low density potting and casting resin for use in air-borne or other applications where weight savings is a factor. It is also used as a structural material to embed fastenings, or as a filler in light-weight honeycomb panels. Prooerties: Color: normally red-brown Adhesion: excellent to metals, ceramics, cellulose products and most thermosetting plastics Machining: easily machinable Specific Gravity: .7 Coefficient of Linear Expansion, in/in/C: 22 x 10 -6 Thermal Conductivitv. BTiJ/Hr./sb.ft./F./in: 1.3 Water Absorption, 24.hours (901;: 0.4 Dielectric Strenqth, volts/mil: 325 Dielectric Constant; 10 4 cps 0 25C: 2.0 Dissipation Factor, 10 4 cps @ 25C: 0.016 Volume Resistivity: 10 13 Heat Distortion Temperature: With Curing Agent 901: 82C With Curing Agent 902: 140C
Encapsulating, Potting, Casting, Impregnating Compounds
567
FENNAL INC.: TRU-CAST Potting and Casting Resins (Continued): TRU-CAST 105: Epoxy Potting and Casting Resin--Flame Retardant TRU-CAST 105 is a low cost, self-extinguishing potting and casting resin with excellent electrical properties for electronic applications. It has been compounded to meet the requirements of MIL-I-16923C, Type B. Properties: Color: normally black Adhesion: exceilent Flammability: self-extinguishing Hardness, Shore D: 95 Tensile Strength, psi: 7,000 Compressive Strength, psi: 19,000 Specific Gravity: 1.6 Coef. Linear Exnansion. in/in/C: 30 x 10 -6 Dielectric Strength, voltsimil: 450 Dielelectric Constant, 10 4 cps @ 25C: 3.6 Dissipation Factor, 10 cps @ 25C: -015 Heat Distortion Temperature: Curing Agent 901: 85C Curing Agent 902: 150C TRU-CAST 106: Potting compound high temperature epoxide TRW-CAST 106 is compounded to produce modules or castings which perform effectively up to 500F. It is resistant to long periods of thermal aging, thermal cycling, and has a low shrinkage on cure. Its major use is in missile and aircraft components, subjected to extreme environmental conditions. Properties: Color: normally black Adhesion: excellent Machining: must be ground Coefficient Linear Expansion, in/in/C: 20 x 10 -6 Compressive Strength, psi: 20,000 Specific Gravity: 1.6 Dielectric Strength, volts/mil: 450 Dielectric Constant. 10 4 CDS B 25C: 3.9 Dissipation Factor,'10 4 cps'@-25C: .Ol Crack Resistance, MIL-I-16923C: min 10 cycles Pot Life at room-temperature: 2 to 3 days Initial Viscosity: 70,000 cps
568
Adhesives, Sealants and Coatings for the Electronics Industry
FENWAL INC.: TRU-CAST Potting and Casting Resins (Continued): TRU-CAST 107: Flexible potting compound TRU-CAST 107 is a flexible epoxide potting compound for potting and encapsulating electronic components where improved thermal and mechanical shock characteristics are important while maintaining the electrical and environmental characteristics of epoxy resins. TRU-CAST 107 is also used in potting high voltage electrical connectors and connectors requiring protective insulation against environmental conditions. Properties: Color: normally black Adhesion: excellent to metals, ceramics, cellulose and most thermosetting plastics Hardness, Shore D: 78 Izod Impact: .23 Coefficient Linear Expansion, in/in/C: 52 x 10 -6 Dielectric Strength, volts/mil: 525 Dielectric Constant, 10 4 cps @ 25C: 3.6 Dissipation Factor, 10 4 cps @ 25C: .036 Heat Distortion Temperature: With Curing Agent 901: 85C With Curing Agent 902: 150C TRU-CAST 109: Potting and Casting Resin--Low Coefficient of Expansion TRU-CAST 109 is a modified epoxide potting and casting compound and is highly resistant to thermal cycling and mechanical or heat shock. It has a low coefficent of thermal expansion and low shrinkage on cure. TRU-CAST 109 may be used for potting delicate components where excessive shrinkage would damage components. Properties: Color: Normally blue--other colors available Adhesion: Exceilent to metals, ceramics, cellulose products and thermosetting plastics Machining: must be ground Tensile strength, psi: 8,000 Compressive strength, psi: 15,,000 Flexural strength, psi: 13,000 Shear Tensile, psi (Aluminum to Aluminum): 700 Coef. Linear Expansion, in/in/C: 17 x 10 -6 Thermal Conductivity, BTU/sq.ft./hr./in/F.: 4.0 Specific Gravity: 1.58 Dielectric Strength, volts/mil: 450 Dielectric Constant, 10 4 cps @ 25C: 3.8 Dissipation Factor, 10 4 cps @ 25C: .013 Heat Distortion Temperature - With Curing Agent 901: 9OC With Curing Agent 902: 155C
Encapsulating, Potting, Casting, Impregnating Compounds
569
FENWAL INC.: TRU-CAST Potting and Casting Resins (Continued): TRU-CAST 11 OM: Clear Epoxy Resin: Potting-Casting-Bonding TRU-CAST 110M is used in applications where clear, waterwhite castings are required. It is also an excellent adhesive, and is used for bonding where clarity is required. This system is suitable for small castings not over l/Z" thick. Larger castings can be cured in several sections. Properties: Color: water-white U.V. Transmission @ 3500A, %: 86 Pot life, min.: 20 Specific gravity: 1.23 Initial mix viscosity, cps @ 77F: 1,900 Hardness, Shore D: 83 Machinina: readilv machined Tensile shear strength, psi: 1,900 Coeff. of linear expansion, in/in/C: 60 x 10 -6 Tensile strength, psi: 9,060 Compressive strength, psi: 15,200 Flexural strength, psi: 15,600 Dielectric strength, volts/nil: 450 Dielectric constant, IO 4 Hz @ 25C: 3.7 Dissipation factor, 10 4 Hz @ 25C: 0.029 TRU-CAST llOM/928: Water-White Epoxy Casting and Bonding Resin TRU-CAST llOM/928 is a clear, water-white epoxy which cures at room temperature without discoloration or striations, even in large masses. The low viscosity of the mix allows essentially void free castings, and the cured product has exceptional thermal shock resistance. The clarity of the cured product makes this material a perfect choice for fiber optic applications. Properties: U.V. Transmission @ 3500A, %: 91 Pot Life (for l/2 lb), hrs: 5 Initial mix viscosity, cps @ 77F: 750 Thin film set time, hrs: 7 l/2 Heat distortion ooint. F: 175 Hardness, Shore D: 84. Izod impact strenqth, ft lb/inch of notch: 0.48 Tensile-shear strength, psi: 5,000 T-peel strength, lbslinch: 8 Tensile strength, psi: 9,800 Tensile modulus. osi: 3.9 x 10 5 Elongation at break, %: 8 Flexural strength, psi: 16,500 Flexural modulus, psi: 4.6 x 10 5 24 hr water boil, % wt. gain: 2.1
570
Adhesives, Sealants and Coatings for the Electronics Industry
FENWAL, INC.: TRU-CAST Potting and Casting Resins (Continued): TRU-CAST 111M: Epoxide potting, casting and adhesive resin High Thermal Conductivity - High Temperature TRU-CAST IllM is a high density potting, casting and adhesive resin which can be cured at room temperature, or heat cured for high temperature properties. The cured resin is very stable with a low coefficient of thermal expansion, low shrinkage on cure and has excellent thermal conductivity. TRU-CAST IllM is used as a structural adhesive to produce thermally conductive lap joints. Properties: Color: Black Specific gravity: 2.3 Machining: must be ground Thermal Conductivity, BTU/ft Z/hr/in/F: 5.4 Tensile Strength, psi: 7,500 Compressive Strength, psi: 16,000 Coefficient of thermal expansion, in/in/F: 18 x 10 -6 Hardness, Shore D: 95 Heat Distortion Temperature: Curing Agent 901 (RT - Class 1): 120C Curing Agent 902 (heat cure - Class 2): 200C Dielectric Strength, Volts/mil: 450 Dielectric Constant, 10 4 Hz @ 25C: 4.8 Dissipation Factor, IO 4 Hz @ 25C: 0.008 TRU-CAST 113: Casting Resin Flexible TRU-CAST 113 is a flexible, resilient casting and potting compound used for protecting delicate circuitry against shock and vibration. This formulation has a very low viscosity and produces bubble-free castings without requiring vacuum techmiques. TRU-CAST 113 cures with a low exotherm requiring a long room temperature cure, or may be cured more rapidly with the application of moderate heat. Use with Curing Agent 910 Properties: Color: clear amber Mix ratio A/B, PBW: 10017.5 Initial mix viscosity, cps: 300 Pot life (1 lb), minutes: 60 Gel time (approx), minutes: 8'0 Hardness, Shore A: 80 Coefficient of thermal expansion, in/in/F: 48 x 10 -6 Tensile Strength, psi: 1,600 Volume Resistivity: 10 15 Ultimate Elongation, %: 35 Cure Schedule: Room temperature cure (77F): 7 days 125F: 4 hours lOOF: 24 hours Pot Life: Approximately 1 hour @ 75F in 1 lb. batch
Encapsulating, Potting, Casting Impregnating Compounds
571
FENWAL INC.: TRU-CAST Casting and Potting Compounds (Continued): TRU-CAST 115: Casting and Potting Compound-Low Viscosity TRU-CAST 115 is generally used as a good dielectric epoxide potting compound and is easy to handle because of its low viscosity. It is easy to pour and in most cases, vacuum is not necessary to make void-free castings. TRU-CAST 115 resin has excellent electrical characteristics and is easily machined. Prooerties: Color: normally black - may be colored Adhesion: excellent to most materials Machining: outstanding Tensile Strength, psi: 7,000 Flexural Strength, psi: 12,500 Compressive Strength, psi: 12,000 Soecific Gravitv: 1.55 Cbef. Linear Expansion, in/in/C: 32 x 10 -6 Dielectric Strenqth, volts/mil: 440 Dielectric Constant; IO 4 cps @ 25C: 4.2 Dissipation Factor: IO 4 cps @ 25C: .Ol Heat Distortion Temperature: With Curing Agent 917: 105C With Curing Agent 902: 150C With Curing Agent 924: 45c TRU-CAST 117: Electrical Adhesive and Potting Compound TRU-CAST 117 is a low viscosity, resilient, modified epoxy resin having excellent adhesion, good shock resistance and good physical/electrical properties. It can be used in small amounts with a minimum of "sweatout". This system is used for castings, potting and coating applications, also, as an excellent adhesive. Properties: Color: Light straw Specific Gravity: 1.15 Tensile Strength (psi): 8000 Compressive Strength (psi): 16,000 Flexural Strength: 15,000 Tensile Shear (Al/Al): 3500 Dielectric Strength,~volts/mil: 500 Dielectric Constant, IO 4 CPS @ 25C: 3.9 Dissioation Factor, 10 4 co& B 25C: 0.018 Volume Resistivity; 25C: 1‘0 16 Volume Resistivity, IOOC: 2 x 10 10 Initial Mix Viscosity (cps @ 25C): 900
572
Adhesives,
Sealants
and Coatings for the Electronics
Industry
FENWAL INC.: TRU-BOND Potting and Casting Compounds (Continued): TRU-CAST 118: Low viscosity potting resin-Low exotherm flexible TRU-CAST 118 is a flexible epoxy casting resin with a low viscosity in liquid form, making it very easy to pour and minimizing air entrapment. This is a two component system which mixes very easily and cures with a very low exotherm. Properties: Color: Natural (or colored on request) Adhesion: Excellent to most materials Shore A Range: 70 to 90 Specific Gravity: 1.25 Dielectric Constant: 60 Herz: 3.60 10 3 Herz: 3.55 10 6 Herz: 3.20 Dissipation Factor: 60 Herz: .OlO 10 3 Herz: .018 10 6 Herz: .024 Volume Resistivity: 10 15 Dielectric Strength, volts/mil: 460 Initial mix viscosity, cps: 200
Encapsulating, Potting, Casting, Impregnating Compounds
FURANE PRODUCTS: EPOCAST Glob Top Encapsulants: EPOCAST 7704-2: Color: black Specific Gravity (system): 1.8 System Viscosity (x 1000 cps): 200 Pot Life (hours): 24-48 Gel Time 150C (minutes): 5 Cure Schedule (minutes/C): 601165 Lap Shear Strength Al/Al at 25C (psi): >lOOO Ooeratins Temn (C) Continuous/Intermittent: 1751300 Thermal Conductivity: 18x10 -4 Weight Loss 300C (%): .04 Tg ITMA) (12): 155 CTE (in/in/C): Aloha 1: 15-18x10 -6 . Alpha 2: 62-10 -6 Volume Resistivity at 25C (ohm-cm): ,1x10 15 Shelf Life (months/C): 61-40 Flash Point (C): ,120 High Tg, low CTE and low flow material for wire bonded devices. EPOCAST 7704-3: Color: black Specific Gravity (system): 1.8 Svstem Viscositv (x 1000 cps): 100 Pot Life (hoursj: 24-48 _ Gel Time i5OC (minutes): 5 Cure Schedule (minutes/C): 60/165 Lao Shear Strength Al/Al at 25 (psi): >I000 Operating Temp TC) Continuous/Intermittent: 175/300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): .07 Tg (TMA) (C): 160 CTE (in/in/C): Alpha 1: 15-18x10 -6 Alpha 2: 64x10 -6 Volume Resistivity at 25C (ohm-cm): 9.9x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): >120 High Tg, low CTE material for applications requiring increased flow capability.
573
574
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: EPOCAST Glob Top Encapsulants
(Continued):
EPOCAST 7704-5: Color: black Specific Gravity (system): 1.7 System Viscosity (x 1000 cps): 70 Pot Life (hours): 24-48 Gel Time 150C (minutes): 5 Cure Schedule (minutesjO!): 601165 Lap Shear Strength Al/Al at 25 (psi): >lOOO Operating Temp (C) Continuous/Intermittent: 1751300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): .03 Tg (TMA) (C!):160 CTE (in/in/C): Aloha 1: 15-18x10 -6 Alpha 2: 62x10 -6 Volume Resistivity at 25C (ohm-cm): 9.6x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): ,120 High Tg, low CTE flowable system for use on flip chip or beam-leaded devices. EPOCAST X-89282: Color: black Specific Gravity (system): 1.7 System Viscosity (x 1000 cps): 50 Pot Life (hours): 24-48 Gel Time i5OC (minutes): 5 Cure Schedule (minutes/C): 60/165 Lap Shear Strength Al/Al at 25 (psi): >lOOO Operating Temp (C) Continuous/Intermittent: 175/300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): 0.11 Tg (TMA) (c): 120 CTE (in/in/C): Alpha 1: 26x10 -6 Alpha 2: 78x10 -6 Volume Resistivity at 25C (ohm-cm): ,1x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): >I20 Low stress, flowable encapsulant particularly designed for flip chip and beam-leaded devices.
Encapsulating, Potting, Casting, Impregnating Compounds
FURANE PRODUCTS: EPOCAST Glob Top Encapsulants
(Continued):
EPOCAST X-89284: Color: black Specific Gravity (system): 1.6 System Viscosity (x 1000 cps): 150 Pot Life (hours): 24-48 Gel Time 150C (minutes): 5 Cure Schedule (minutes/C): 60/165 Lap Shear Strength Al/Al at 25C (psi): >lOOO Operating Temp (C) Continuous/Intermittent: 175/300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): 0.11 Tg (TMA) (C): 135 CTE (in/in/C): Alpha 1: 27x10 -6 Alpha 2: 85x10 -6 Volume Resistivity at 25C (ohm-cm): ,1x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): ,120 Low stress, higher Tg material for wire bonded devices.
EPOCAST X-89282 Glob Top Encapsulant: Features/Benefits: * Low thermal expansion * High purity * 100% solids * Very low viscosity * Suitable for machine dispensing * Less than 20 ppm each of Na, K, Fe, Cl, Br EPOCAST X-89284 Glob Top Encapsulant: Features/Benefits: * Low thermal expansion * High purity * 100% solids * High viscosity version of X-89258 * Suitable for machine dispensing
575
576
Adhesives, Sealants and Castings far the Electronics Industry
FURANE PRODUCTS: Potting, Encapsulating & Impregnating Products for Conformal Coatings: Resin: URALANE 5750-A: Hardener: URALANE 5750-B(LV): Mixed Cured Color: clear to milky Application Method: dip/spray/brush Solids %: 83 Mix Ratio pbw: 18/100 Specific Gravity: 0.96 Viscosity CDS at 25C: 550 Pot Life-106 gms at 25C hours: 2 Shelf Life at 25C months: 6 Cure Schedule hours C: 9165 or 2/100 Hardness Shore A or D: 50A Operating Temperature C: 125 Tack Free Time at 50% RH hours C: 4/65 Tensile Strenath osi: 350 Elongation %:*150Dielectric Strength Volts/Mil: >I500 Solvent Resistance: excellent Fungus Resistance: pass URALANE 8267: Mixed Cured Color: clear to amber Application Method: dip/spray/brush Solids %: 50 Mix Ratio pbw: l-camp Specific Gravity: 0.90 Viscositv CDS at 25C: 250 Pot Life-lob gms at 25C hours: 2 Shelf Life at 25C months: 6 Cure Schedule hours C: 2165 or 24125 Hardness Shore A or D: 53A Operating Temperature C: 105 Tack Free Time at 50% RH hours C: 1.5125 Tensile Strength psi: 320 Elongation %: 100 Dielectric Strength Volts/Mil: 2500 Solvent Resistance: excellent Fungus Resistance: pass
Encapsulating, Potting, Casting, Impregnating Compounds
577
FURANE PRODUCTS: Potting, Encapsulating & Impregnating Products for Conformal Coatings (Continued): URALANE 5780: Mixed Cured Color: Clear to It. amber Application Method: dip/spray/brush Solids %: 50 Mix Ratio pbw: 1-camp Soecific Gravitv: 0.90 Viscosity cps at 25C: 250 Pot Life 100 qms at 25C hours: 1.5 Shelf Life at-25C months: 6 Cure Shedule hours C: 2/65 or 24/25 Hardness Shore A or D: 80A Ooeratins Temoerature C: 125 Tack Free Time at 50% RH hours C: l/25 Tensile Strength psi: 760 Elongation %: 12 Dielectric Strength Volts/Mil: 750 Solvent Resistance: good Fungus Resistance: pass ACRYLANE 5730: Mixed Cured Color: clear Application Method: dip/spray/brush Solids '8: 34 Mix Ratio pbw: 1-camp Specific Gravity: 0.90 Viscosity cps at 25C: 700 Pot Life 100 gms at 25C hours: 1.5 Shelf Life at 25C months: 12 Cure Schedule hours C: 24125 Hardness Shore A or D: 80A Operating Temperature C: 105 Tack Free Time at 50% RH hours C: 1.5125 Tensile Strength psi: 700 Elongation %: 255 Solvent Resistance: acids-good organic-poor Fungus Resistance: pass
578
Adhesives, Sealants and Coatings for the Electronics Industry
FURANE PRODUCTS: Potting, Encapsulating & Impregnating Products for Conformal Coatings (Continued): EPOCAST 8122-A31: EPOCAST 8122-B: Mixed Cured Color: Clear to amber Application Method: dip/spray/brush Solids %: 100 Mix Ratio pbw: 100/50 Specific Gravity: 1.08 Viscosity cps at 25C: 6000 Pot Life 100 gms at 25C hours: 3 Shelf Life at 25C months: 12 Cure Schedule hours C: 4165 to 2/65+2/155 Hardness Shore A or D: 85D Operating Temperature C: 155 Tack Free Time at 50% RH hours C: 4125 Dielectric Strength Volts/Mil: >I500 Solvent Resistance: excellent Fungus Resistance: pass SILFLEX SP6200-A: SILFLEX SP6200-B: Mixed Cured Color: clear Application Method: dip/spray/brush Solids %: 100 Mix Ratio pbw: lOO/lOO Specific Gravity: 1.02 Viscosity cps at 25C: 850 Pot Life 100 gms at 25C hours: 3 Shelf Life at 25C months: 6 Cure Schedule hours C: 4165 or l/100 Hardness Shore A or D: 25A Operating Temperature C: 200 Tack Free Time at 50% RH hours C: 4/25 Tensile Strength psi: 475 Elongation %: >50 Dielectric Strength Volts/Mil: 500 Solvent Resistance: good Fungus Resistance: pass
Encapsulating Potting, Casting, Impregnating Compounds
579
GE SILICONES: Addition-Cure RTV Silicone Encapsulants: RTV 615, RTV 627, RTV 655: This product line consists of two-part RTV silicone rubber compounds in pre-packaged, pre-measured kits. This assures uniform quality and simplifies inventory control. All grades offer reliable deep-section cure, even in closed assemblies. Cure occurs at room temperature without exotherm or may be accelerated by heat for shorter cycle time. Primers are recommended to assure adhesion to non-silcone materials. Key Performance Properties: * Non-corrosive, deep-section cure of unlimited depth * Room-temperature or heat cure * No cure by-products * Low linear shrinkage RTV 615: Transparent, general purpose encapsulant flows freely around complex parts providing excellent electrical insulation and shock resistance. Offers easy visual inspection for identification and repair of parts and assemblies. Temperature range: -65 to 400F (-54 to 204C). RTV 627: General purpose compound for production-line potting applications, with flame-retardant properties. UL Recognized. Temperature range: -65 to 400F (-54 to 204C). Color: Black. RTV 655: Transparent, high-strength potting material offers easy visual inspection for repair of potted components. Excellent low-temperature performance to -175F (-11 SC) for protection and mechanical support required by low-temperature applications. Temperature range: -175 to 400F (-115 to 204C). Condensation-Cure RTV Silicone Encapsulants: These easy-to-use silicone compounds cure at room temperature for potting and encapsulating applications. Each product line consists of base compounds ranging from liquid to paste consistency. These compounds may be mixed with one of several curing agents, in varying proportions, by hand or machine, to achieve required cure time. They contain no flammable or toxic solvents, cure in deep sections with appropriate curing agent and are compatible with most electrical insulating materials. These products are recommended for applications that are not completely sealed prior to full cure, because moisture and an escape path for cure by-products are required to complete the cure. Key Performance Properties: * Outstanding electrical properties * High/low-temperature capabilities * Adjustable cure rates * Deep-section cure with appropriate curing agent
580
Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: General Purpose Encapsulants: RTV 11, RTV 12, RTV 21, RTV 41: General purpose RTV silicone encapsulants cure, with the addition of a curing agent, to moderate-strength, durable silicone compounds capable of withstanding temperatures from -75F (-60F) to 400F (-204C) under continuous operation. Availble in a wide range of viscosities. RTV 11: Easily pourable, low viscosity, self-leveling product for general purpose electrical potting. Protects connectors, switches, components and coils from dust, moisture and shock. RTV 12: General purpose, primerless silicone encapsulant for protecting high- and low-voltage electronic assemblies and connectors. RTV 21: Pourable, low viscosity, general purpose product for thermal insulation in aerospace applications, thick section potting and as pour-in-place gaskets for appliances. RTV 41: Pourable, medium viscosity, general purpose encapsulant used as release coating on various substrates, metal panels, and fabrics. High-Temperature Encapsulants: RTV 31, RTV 60, RTV 88: Available in both pourable and paste consistencies, RTV high-temperature silicone encapsulants offer moderate strength for applications requiring continuous operating performance from -65 to 500F (-54 to 26OC) and intermittent performance up to 600F (316C). RTV 31: Pourable, low viscosity product for electrical potting and mechanical protection. RTV 60: Pourable, low viscosity product for aerospace applications requiring potting, encapsulating, coating or cushioning. RTV 88: Paste consistency aerospace sealant and gasket, especially effective on vertical surfaces for sealing, bonding and gasketing.
Encapsulating, Potting, Casting, Impregnating Compounds
581
GE SILICONES: Low-Temperature Encapsulants: RTV 511, RTV 560, RTV 577: These two-component RTV silicone encapsulants offer moderate strength for extended low temperature applications to -175F (-115C). Some grades provide thermal insulation and offer excellent performance properties for cryogenic and aerospace applications. RTV 511: Pourable, self-leveling product for potting, encapsulating and coating circuit assemblies and components encountering temperatures between -175 and 400F (-115 and 204C). RTV 560: Medium viscosity product offers both high- and low-temperature performance, between -175 and 500F (-115 and 26OC) for continuous operation and up to 600F (316C) for short periods. Suitable for aerospace, mechanical and insulation applications. RTV 577: Paste-consistency product for aerospace sealing and insulation applications. Offers a wide temperature performance range, from -175 to 400F (-115 to 204C).
582
Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: Encapsulants
(Room Temperature Cure):
RTV 11: General Purpose Typical Properties: Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (8 25C, 77F): 11,000 Specific Gravity: 1.19 Hardness, Shore A Durometer: 41 Tensile Strength, psi (kg/cm 2): 350 (25) Elongation, %: 150 Tear Resistance lb/in (kg/cm): 20 (3.5) Dielectric Strength, volts/mil: 500 (19.7) Dielectric Constant (1000 Hz): 3.4 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 9 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 12: Soft General Purpose Typical Properties: Color: Clear Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2O:l Silicone Content, %: 99 Solvent Type: Min. Spirits Viscosity, cps (8 25C, 77F): 1500 Specific Gravity: 1.00 Hardness, Shore A Durometer: 18 Tensile Strength, psi (kg/cm 2): 100 (7) Elongation, %: 200 Tear Resistance lb/in (kg/cm): 10 (2.0) Dielectric Strength, volts/mil (kV/mm): 400 (15.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 13 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)
Encapsulating, Potting, Casting, Impregnating Compounds
GE SILICONES: Encapsulants
583
(Room Temperature Cure) (Continued):
RTV 21: General Purpose Typical Properties: Color: Pink Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, 3: 100 Viscosity, cps (@ 25C, 77F): 26,000 Specific Gravity: 1.32 Hardness, Shore A Durometer: 45 Tensile Strength, psi (kg/cm 2): 400 (28) Elongation, 3: 180 Tear Resistance, lb/in (kg/cm): 25 (4.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.4 Dissipation Factor (1000 Hz): 0.01 Volume Resistivity, ohm-cm: 9.0 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 31: High Temp Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, 3: 100 Viscosity, cps (@ 25C, 77F): 25,000 Specific Gravity: 1.42 Hardness, Shore A Durometer: 54 Tensile Strength, psi (kg/cm '2): 500 (35) Elongation, %: 100 Tear Resistance, lb/in (kg/cm): 30 (5.0) Dielectric Strength. volts/mil (kV/mm): 500 (19.7) Dielectric Constant'(1000 Hz): 3.6 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2.9 x 10 15 Useful Temperature Range, F (Cl: -65 to 500 (-54 to 260)
584
Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: Encapsulants
(Room Temperature Cure) (Continued):
RTV 41: General Purpose Typical Properties: Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (a 25C, 77F): 39,000 Specific Gravity: 1.31 Hardness, Shore A Durometer: 47 Tensile Strength, psi (kg/cm 2): 350 (25) Elongation, %: 150 Tear Resistance, lb/in (kg/cm): 25 (4.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.4 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 9.0 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 60: High Temp Flowable Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 47,000 Specific Gravity: 1.48 Hardness, Shore A Durometer: 57 Tensile Strength, psi (kg/cm 2): 750 (53) Elongation, %: 120 Tear Resistance, lb/in (kg/cm): 40 (7.0) Dielectric Strength. volts/mil (kV/mm): 500 (19.7) Dielectric Constant.(lOOO Hz): 3.7 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 1.3 x 10 14 Useful Temperature Range, F(C): -65 to 500 (-54 to 260)
Encapsulating, Potting, Casting, Impregnating Compounds
GE SILICONES: Encapsulants
585
(Room Temperature Cure) (Continued):
RTV 88: High Temp Paste Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, 8: 100 Viscosity, cps (8 25C, 77F): 880,000 Specific Gravity: 1.47 Hardness, Shore A Durometer: 58 Tensile Strength, psi (kg/cm 2): 850 (60) Elongation, %: 110 Tear Resistance, lb/in (kg/cm): 40 (7.0) Dielectric Strength. volts/mil (kV/mm): 500 (19.7) Dielectric Constant'(1000 Hz): 3.7 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -65 to 500 (-54 to 260) RTV 511: Low Temp Flowable Typical Properties: Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100. _ Viscosity, cps (@ 25C, 77F): 16,000 Specific Gravity: 1.21 Hardness, Shore A Durometer: 42 Tensile Strength, psi (kg/cm 2): 380 (27) Elongation, %: 170 Tear Resistance, lb/in (kg/cm): 20 (3.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 4.1 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2 x 10 14 Useful Temperature Range, F (C): -175 to 400 (-115 to 204)
586
Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: Encapsulants
(Room Temperature Cure) (Continued):
RTV 560: High/Low Temp Flowable Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): ZOO:1 Silicone Content, 8: 100 Viscosity, cps (8 25C, 77F): 30,000 Specific Gravity: 1.42 Hardness, Shore A Durometer: 55 Tensile Strength, psi (kg/cm 2): 690 (48) Elongation, %: 120 Tear Resistance, lb/in (kg/cm): 20 (3.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 4.1 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2 x 10 14 Useful Temperature Range, F (C): -175 to 500 (-115 to 260) RTV 577: Low Temp Paste Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 700,000 Specific Gravity: 1.35 Hardness, Shore A Durometer: 48 Tensile Strength, psi (kg/cm 2): 440 (31) Elongation, %: 150 Tear Resistance, lb/in (kg/cm): 25 (4.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 4.1 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2 x 10 14 Useful Temperature Range, F (C): -175 to 400 (-115 to 204)
Encapsulating, Potting, Casting, Impregnating Compounds
GE SILICONES: Encapsulants
(RT or Heat Cure):
RTV 615: High Strength Typical Properties: Color: Clear Cure Conditions: RT/Heat Mix Ratio (Base to Curing Agent, by Weight): 10:1 Silicone Content, %: 100 Viscosity, cps (8 25C, 77F): 4000 Specific Gravity: 1.02 Hardness, Shore A Durometer: 45 Tensile Strength, psi (kg/cm 2): 900 (63) Elongation. %: 150 Tear-Resistance, lb/in (kg/cm): 25 (4.0) Dielectric Strenqth, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 15 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 627: Flame Retardant UL94 V-l/V-O General Purpose Typical Properties: Color: Black Cure Conditions: RTfHeat Mix Ratio (Base to Curing Agent, by Weight): 100 Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 1270 Specific Gravity: 1.38 Hardness, Shore A Durometer: 62 Tensile Strength, psi (kg/cm 2): 500 (35) Elongation, 8: 100 Tear Resistance, lb/in (kg/cm): 15 (3.0) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.006 Volume Resistivity, ohm-cm: 5.7 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204)
587
588
Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: Encapsulants
(RT or Heat Cure) (Continued):
RTV 655: High Strength Low Temp Typical Properties: Color: Clear Cure Conditions: RT/Heat Mix Ratio (Base to Curing Agent, by Weight): 1O:l Silicone Content, %: 100 Viscosity, cps (a 2X, 77F): 5000 Specific Gravity: 1.06 Hardness, Shore A Durometer: 45 Tensile Strength, psi (kg/cm 2): 900 (63) Elongation, %: 150 Tear Resistance, lb/in (kg/cm): 25 (4.0) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 15 Useful Temperature Range, F (C): -175 to 400 (-115 to 204)
Encapsulating, Potting, Casting, Impregnating Compounds
589
GENERAL POLYMERS CORP.: POLYCAST 25 Epoxy Resin Compound: POLYCAST 25 is a black, filled, epoxy resin compound that is specifically developed for potting and encapsulating electrical and electronic components. Its most distinguishing features include: ease of handling, ready cure at room temperature, minimum settling upon storage, and excellent physical and electrical properties. Constants: Color: Black Specific gravity @ 25C: 1.55 Viscosity, poises: 190 Cured Product: Typical properties of POLYCAST 25 as cured with tetraethylenepentamine are as follows: Dielectric Constant, 60 cycles: 4.64 1 megacycle: 4.10 Volume Resistivity, ohm-cm: 4.2 x 10 13 Dielectric Strength, S/T, V/M: 448.0 Dissipation Factor, 60 cycles: (1 % 1 megacycle: 2.329% Shrinkage upon cure: 0.29% Coefficient of linear thermal expansion, -30 to +3OC., in./in./C.: 3.8 x 10 -5 Flammability: non-burning POLYCAST 62 Epoxy Resin System: A two component, filled, room temperature curing epoxy resin system specifically developed for potting and encapsulating electrical and electronic components. POLYCAST 62A Resin: Color: Cream Viscosity, 25C. poises: Specific gravity: 1.56 Mix ratio, by weight: 6 by volume: 4
90
POLYCAST 62B Hardener: Color: Clear, Amber Viscosity, 25C. poises: 4.5 Specific gravity: 0.98 Mix ratio, by weight: 1 by volume: 1 Pot life, 100 gm. mass @ RT: 30 minutes Exotherm, C: 80 Cure: Room temperature Hardness, Shore D: 75
590
Adhesives, Sealants and. Coatings for the Electronics Industry
GENERAL POLYMERS CORP.: POLYCAST XP-242 Epoxy Resin System: POLYCAST XP-242 is a two component, quick room temperature curing, self extinguishing, filled epoxy resin system that has been specifically developed for potting and encapsulating electrical and electronic components. It consists of XP-242A Resin and XP-242B Hardener that are used at a resin to hardener ratio of 5:l by weight or 3:l by volume. Mixed at the above ratio, the system sets at room temperature into a hard self extinguishing plastic with excellent insulating qualities. Constants: XP-242A Resin: Color: Yellow, Black or Red Viscosity, 25C, poises: 100-140 Specific gravity, 25C.: 1.66 Mix Ratio, by weight: 5 by volume: 3 Pot Life, 100 gm. mass @ RT: 15-20 minutes XP-242B Hardener: Color: Clear, amber Viscosity, 25C, poises: 8-12 Specific gravity, 25C.: 0.98 Mix Ratio, by weight: 1 by volume: 1 Cured Product: Hardness, Shore D: 85 Tensile strength, psi: 6500 Elongation %: 1 Tensile Modulus, psi x 10 -5: 9.25 Dielectric Constant @ 60 cycles: 4.3 @ 1 megacycle: 3.8 Dissioation Factor: 0.037 Volume Resistivity, ohm-cm.: 3.27 x 10 14 Dielectric Strenqth, volts/mil: 475 Arc Resistance, seconds: 146 Flammability: Self Extinguishing
Encapsulating, Potting, Casting, Impregnating Compounds
591
KEY POLYMER CORP.: Epoxy Products: Potting Compounds: C6-192A/B: Two component, flame retardant potting compound Type: Black, two part room temp. cure Cure Schedule: 7 days @ 22C or 2 hrs. @ IOOC Consistency: Low Viscosity Liquid Specific Gravity: 1.50 Storage Information: Store 25C or below for one year in sealed containers Comments: Good chemical resistance. Low shrinkage. Flame retardant. C4-228A/B: Two component, flexible, epoxy potting or casting compound Type: Two part heat cure Cure Schedule: 3 hrs. @ 121C plus 1 l/2 hrs. @ 15OC, plus 1 hr. @ 175C Consistency: Low Viscosity Liquid Specific Gravity: 1.06 Storage Information: Store 25C or below for up to one year in sealed containers Comments: Recommended for electrical coil and printed circuit board encapsulation. c4-177: One component, epoxy adhesive and potting compound Type: Black, one part heat cure Cure Schedule: 2 hrs. @ 121C, or 1 hr. @ 150~, or l/2 hour @ 176C Consistency: Low Viscosity Liquid Specific Gravity: 1.50 Storage Information: Store OC for up to one year in sealed containers Comments: Exceptional thermal shock properties. Class F service temperature rating. C4-243: One component, epoxy adhesive and potting compound Type: Black, one part, heat cure Cure Schedule: 4 hrs. @ 121C, or 2 hrs. @ 150~ Consistency: Medium Viscosity Liquid Specific Gravity: 1.49 Storage Inforamation: Store OC for up to one year in sealed containers Comments: Class F service temperature rating. High thermal conductivity C6-176: One component, low temperatuee cure adhesive and potting compound Type: Tan, one part, heat cure Cure Schedule: 1/2 hr. @ 121C, or 5 min. @ 16OC, or 2 min. @ 175c Consistency: Low Viscosity Liquid Specific Gravity: 1.49 Storage Information: Store OC for up to one year Comments: Fast cure at moderaate temperature. High heat & chemical resistance.
592
Adhesives, Sealants and Coatings for the Electronics Industry
MAGNOLIA PLASTICS INC.: Electrical Systems: MAGNOLIA 3068 Potting and Casting Resin: MAGNOLIA 3068 is a two component epoxy resin based compound designed for potting and casting applications where a high degree of electrical insulation is required over a wide range of temperatures. Although this product will cure at temperatures as low as 95C, it gives good properties to temperatures in excess of 200C. Special Features: This inert-filled svstem is surorisinqlv fluid. When heated to only 54C, it can be-evacuated (29 inches of Mercury vacuum) to produce a bubble-free casting. It is suitable for use in Class H insulation areas. Physical Properties: Color: Black Specific Gravity (mix): 1.7 Mix Ratio: 100:8 by weight, A:B Viscosity @ 25C (mix): 40,000 Pot Life 8 25C (3 oz): Greater than 5 hours @ 54C (3 oz): 1 hour Cure Schedule: Gel @ 25C (30 hours) plus 1 hour @ 121C Alternate Cure Schedule: Gel @ 75C (l-l l/2 hours) plus 1 hour @ 121C MAGNOLIA 3071: MAGNOLIA 3071 is a two part room temperature curing epoxy compound designed for use on all types of film capacitors. This product does not attack polycarbonate film. Electrical properties are excellent even at temperatures in excess of 125C. Special Features: 1. Electrical properties hold up extremely well at high temperatures. The good properties of polycarbonate capacitors are matched by those of 3071. 2. MAGNOLIA 3071 does not contain 4'4 methylene dianiline. 3. MAGNOLIA 3071 can be made in a wide variety of colors. Properties of Uncured Material: Part A: Specific Gravity: 1.16 Viscosity @ 25C: 1,900 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.00 Viscosity @ 25C: 1,100 cps SPI Classification: 4 Flash Point: >lOOC
Encapsulating, Potting, Casting, Impregnating Compounds
593
MAGNOLIA PLASTICS INC.: Electrical Systems (Continued): MAGNOLIA 3075: MAGNOLIA 3075 is a two component epoxy compound developed specifically for the electrical capacitor industry as an endseal. This system is also used widely for potting coils, circuitry involving a wide range of electrical components and other systems manufactured for the telecommunications industry. Special Features: 1. Low surface tension combined with low viscosity gives excellent "bubble breaking" properties, thus insuring a glossy surface free of imperfections. 2. 3075 is available in a wide range of colors. Some examples are light and medium yellow, green, black, white and blue. 3. MAGNOLIA 3075 can be used with several curing agents depending on the specific application. For example: 3075-B: Mix Ratio: 100114 Pot Life: 14 minutes Special Feature: Fast cure. 3085-B: Mix Ratio: 100/23 Pot Life: 30 minutes Special Feature: Longer pot life and lower viscosity 3087-B: Mix Ratio: 100/23 Pot Life: 20 minutes Special Feature: High impact strength. Good moisture resistance. 384-B: Mix Ratio: 100/36 Pot Life: 30 minutes Special Feature: For polycarbonate capacitors. Good color stability especially in light yellows. 3096-B: Mix Ratio: 100/30 Pot Life: 9 minutes Special Feature: Fast cure. Good thermal shock. 3094-B: Mix Ratio: 100/30 Pot Life: 48 minutes Special Feature: Does not attack polycarbonate film. Good color stability.
594
Adhesives, Sealants and Coatings for the Electronics Industry
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3106: MAGNOLIA 3106 is a two part epoxy compound used for sealing capacitors in automated production facilities. This product has excellent electrical properties, flame retardance, moisture resistance and a good combination of long pot life and fast cure. Special Features: 1. Fast cure. Five to ten minutes at IOOC does the job even in large box capacitors. 2. Does not hard settle. There is no caking or packing in lines and pumps of automatic dispensing equipment. 3. Low in skin irritation potential. Properties of Uncured Material: Viscosity: Part A: 4,000 cps Part B: 178 cps Mix: 1,300 cps Cure Schedule: 8-12 hr. at 25C or 5 to 10 minutes at IOOC or 10 to 20 minutes at 85C Pot Life @ 25C: 50 minutes SPI Classification: Part A: 4/Part B: 4 MAGNOLIA 3128: MAGNOLIA 3128 is a two part epoxy compound having low exotherm, outstanding electrical characteristics and flame retardancy. 3128 has been used for sealing capacitors, transformers, EM1 filters, RC networks, and ballasts. Special Features: 1. Flame retardancy meeting UL method 94V0. 2. Peak exotherm of 116C (100 grams in 3 oz. mass). 3. Volume resistivity exceeds 20,000,000,000 ohm-cm at 155C. Properties of Uncured Material: Color: Part A: Blue Part B: Clear Mix: Blue Viscosity 25C: Part A: 20,000 cps Part B: 100 cps Mix: 4,000 cps Specific Gravity: Part A: 1.5 Part B: .9 Mix: 1.4 SPI Classification: Part A: 2 Part B: 4 Mixing Instructions: Mix Ratio: Parts by weight A:B: 100/8 Parts by volume A:B: 100/14
Encapsulating, Potting, Casting Impregnating Compounds
595
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOBOND 3227 A & B: MAGNOBOND 3227 is a two part epoxy resin compound used for potting of transformers and coils. Special Features: This reliable, low cost epoxy has been formulated as a low viscosity, non-abrasive potting compound to produce bubble-free castings. Properties of Uncured Material: Color: A: Black B: Clear Mix: Black Viscosity: A: 9,000 cps 200 cps B: Mix: 5,200 cps Specific Gravity: A: 1.61 B: -96 Mix: 1.58 SPI Classification: A: 2 B: 4 Mixing Instructions: Mix Ratio: Parts by Weight A & B: 100:5 Pot Life: 31 minutes Cure Schedule: 2-4 hours set 24-40 hours full cure Cured Properties: Shore D Hardness: 85
Compound 3241 Black: Compound 3241 is a single component epoxy material designed for the potting and encapsulation of solenoids and coils. Special Features: 1. Compound 3241 has a low viscosity for fast processing and good penetration of coils. 2. Compound 3241 cures quickly: 12 minutes at 300F. Properties of Uncured Material: Color: Black Viscosity: 7,000 cps Specific Gravity: 1.55 SPI Classification: 2 Flash Point: 200F Cure Schedule: 12 minutes @ 300F or l-2 hours @ 250F. Cured Properties: Dielectric Strength, volts per mil: Short time test: 655
596
Adhesives, Sealants and Coatings for the Electronics Industry
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): Epoxy Potting Compound 3265: Compound 3265 is an epoxy resin casting and potting compound. It is designed to protect electrical devices from extremes in humidity and temperatures. The convenient I:1 by volume mix ratio makes this product an excellent choice for automatic production. Its low shrinkage eliminates excessive stress on the encapsulated unit. Physical Properties: Part A: Color: Off-White Specific Gravity: 1.57+-.07 Mix Ratio (by weight): l.OO+--05 Mix Ratio (by volume): l.OO+-.05 Viscosity: 6500+-1500 cps Part B: Color: Black Soecific Gravitv: 1.64+-.07 Mix Ratio (by weight): 1.05+--05 Mix Ratio (by volume): l.OO+--05 Viscosity: 3000+-1000 cps Mix: Color: Black Specific Gravity: 1.63+-.07 Viscosity: 3500+-1500 cps Cure Schedule (700 Grams @ 77 deg F): 3-5 Days Gel Time (3 fluid oz. @ 150 deg F): 28+-5 Minutes Compound 3292-3 A & B: Compound 3292-3 is a lightweight, electrical potting compound. Special Features: Compound 3292-3 gives a minimum separation of the glass beads during cure. The cured mass is uniform in density. Properties of Uncured Material: Color: Mix: Off-White Viscosity: A: 10,000 i3: 4,000 Mix: 10,000 SPI Classification: A: 4 B: 4 Mixing Instructions: Mix Ratio: Parts by weight A/B: 713 Pot Life: 1 hour Cure Schedule: 24 hours @ 77F: Set 7 days: Full Cure
Encapsulating, Potting, Casting, Impregnating Compounds
597
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3347: MAGNOLIA 3347 is a single component, low ViSCOSity, epoxy material with excellent electrical properties at elevated temperatures. Special Features: MAGNOLIA 3347 is especially formulated for the impregnation of electrical and electronic units such as coils, capacitors, transformers, and solenoids. Properties of Uncured Material: Color: Amber Viscosity: 500 cps Specific Gravity: 1.15 SPI Classification: 2 Flash Point: >lOOC Mixing Instructions: Pot Life: 22 minutes @ 125C Cure Schedule: 2 to 4 hours @ 125-135C MAGNOLIA 3360, A & B: MAGNOLIA 3360, Parts A & B, is an unfilled epoxy system for encapsulating electronic circuitry in a sand-filled aluminum container. At 85C, this system is extremely fluid and will replace the air from the unit. For 6 to 8 minutes at 85C, this fluid condition will prevail, wetting the walls of the housing and allowing trapped air to migrate to the surface. The low surface tension of MAGNOLIA 3360 promotes easy bubble breaking and generally provides a slick appearance to the top surface of the fully cured unit. Special Features: This system will stretch under thermal or mechanical stress so that repeated thermal shocks (from +125C to -40C) do no harm to either the electrical functionality or the mechanical integrity of properly potted products. Properties: Specific Gravity: Part A: 1.1 Part B: 1.0 Mix: I, .1 Color: Part A: Clear Amber Part B: Clear Orange Mix: Clear Orange Mix Ratio, A:B by weight: 100:86 A:B by volume: I:1 Viscosity @ 25C: Part A: 6000 cps Part B: 500 cps Mix: 1700 cps Viscosity @ 85C: Mix: 70 cps
598
Adhesives, Sealants and Coatings for the Electronics Industry
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3376, A & B: MAGNOLIA 3376 is a special black epoxy material that meets or exceeds the requirements of MIL-I-16923. Special Features: 1. MAGNOLIA 3376 is QPL .isted to MIL-I-16923G. 2. MAGNOLIA 3376 has a long pot life for ease of handling, but it will set over night and cure fully in seven days at room temperature. 3. MAGNOLIA 3376 can be heat cured as follows: 2-4 hours @ 25C Set; followed by 2 hours @ 80C plus 2 hours @ 130-150C. 4. MAGNOLIA 3376 has a heat deflection temperature (ASTM D648) of 13oc. 5. MAGNOLIA 3376 has excellent thermal cycling resistance from -55C to +13OC. 6. MAGNOLIA 3376 is available in pre-measured 5 gallon kit form or in regular packaging. Uncured Properties: Specific Gravity: Part A: 1.65 Part B: 1.09 Mix: 1.54 Viscosity @ 25C: Part A: 16,800 cps Part B: 2,300 cps Mix: 16,000 cps Mix Ratio: A:B by weight: 100:14 A:B by volume: 5:l Pot Life @ 25C 3 oz. mass: 2-I/2-3 hrs Compound 3377: Compound 3377 is a general purpose potting compound which exhibits excellent electrical and hydrolytic stability characteristics. It meets or exceeds the requirements of MIL-I-16923G and does not contain MDA. Physical Properties: Part A: Color: White Specific Gravity: 1.55 Mix Ratio: (parts by weight): Viscosity: 10,080 cps Part B: Color: Amber Specific Gravity: 1.03 Mix Ratio: (parts by weight): Viscosity: 2,230 cps Mix: Color: Light Tan Specific Gravity: 1.47 Viscosity: 5,740 cps
100
11
Encapsulating,
Potting, Casting, Impregnating
Compounds
599
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3378, A & B: MAGNOLIA 3378 is a two part epoxy potting system having good physical, electrical, and thermal properties. Special Features: 1. This system is designed to be compatible with automatic mixing and dispensing equipment. 2. Low coefficient of linear thermal expansion. 3. Safe system - No MDA or VCHD Uncured Properties: Part A: Specific Gravity: 1.5 Viscosity: 10,000 Part B: Specific Gravity: 1.6 Viscosity: 8,000 Mix: Specific Gravity: 1.5 Viscosity: 14,000 Mix Ratio: 100:38 parts by weight or 2.75:1 by volume Cure Schedule: Overnight at R.T. followed by 2 hours @ 150-200F MAGNOLIA 3390: MAGNOLIA 3390 is a two part dielectric gel designed to protect electronic circuits from moisture. This two part epoxy compound features good resistance to moisture and a high degree of flexibility. 3390 is very soft yet tough. Special Features: 1. Very good adhesion to both metal and plastic cases. 2. Reoairs are easilv made to electronics bv cutting throush 3390 then retaping 3. Even after 100 hours in a pressure cooker at 122C and 15 pounds per square inch pressure, there is no evidence of reversion. Properties: Part A: Specific Gravity: 1.1 Viscosity: 400 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.0 Viscosity: 400 cps SPI Classification: 4 Flash Point: >lOOC Mix: Specific Gravity: 1.1 Viscosity: 400 cps
600
Adhesives, Sealants and Coatings for the Electronics Industy
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3445: MAGNOLIA 3445 is a two part oven curing semi-rigid epoxy resin system used for encapsulating and potting electronic and electrical components of all kinds. MAGNOLIA 3445 resists temperatures to 16OC, offers resistance to thermal shock and has low shrinkage and thermal expansion. Special Features: 1. This system is tough. Stress caused by extremes of hot and cold, potted inserts and shrinkage are withstood without cracking. 2. Class F insulation. Electrical properties are maintained to temperatures of 180C. 3. A lower viscosity version (unfilled) is available called MAGNOLIA 3035. Physical Properties: Specific Gravity: Part A: 1.6 Part B: 1.6 Mix: 1.6 Viscosity @ 25C: Part A: 56,000 cps Part B: 21,000 cps Mix: 42,000 cps SPI Class: Part A: 2 Part B: 2 MAGNOLIA 3481: MAGNOLIA 3481 is a two component self extinguishing epoxy potting compound for box capacitors. This product has low viscosity for ease of application in small size cases and excellent bubble breaking characteristics. Special Features: 1. Good moisture resistance. 2. Extra long oat life vet cures at 80-9OC. 3. Flame retardant to pass UL 94 VO and UL 1414. 4. 3481 contains fine particle fillers which go through small orifices without clogging. 5. A thinner version called MAGNOLIA 3482 is available. Physical Properties: Specific Gravity: Part A: 1.5 Part B: I.'0 Mix: 1.4 Color: Part A: Blue Part B: Green Mix: Blue Gel Time 15 gram: 70C: 120 min. 80C: 50 min. 85C: 40 min. SPI Class: Part A: 4 Part B: 4
Encapsulating,
Potting,
Casting, Impregnating
Compounds
601
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3500: MAGNOLIA 3500 is a two part cycloaliphatic epoxy system featuring low viscosity for good penetration, good thermal cycling properties and outstanding electricals especially after outdoor exposure. Properties of Uncured Material: Part A: Specific Gravity: 1.36 Viscosity @ 25C: 1,500 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.17 Viscosity @ 25C: 100 cps SPI Classification: 4 Flash Point: >lOOC Mix: Specific Gravity: 1.29 Viscosity @ 25C: 580 cps Mixing Instructions: Mix Ratio, parts by weight, A:B: 100:45 Pot Life @ 25C: >8 hours Cure Schedule: 2 hours @ 120C MAGNOLIA 3503: MAGNOLIA 3503 is a two part cycloaliphatic epoxy resin casting compound designed for encapsulating high performance electrical products. Special Features: 1. Thermal shock properties on 3503 are outstanding, especially for a rigid epoxy. Large capacitors encapsulated with 3503 have passed thermal cycling tests to -60C. Compressive strength and rigidity are high enough to support structural loading. 2. Electrical properties with 3503 are excellent over an extremely wide temperature range. 3. Working life after mixing A & B is very long. Even when preheated to 6OC, material can be used for several hours. Properties: Specific Gravity: Compound (Part A): 1.8 Curina Asent (Part B): 1.5 Mix (A &-B): i.6 Viscosity: Mix (A & B): 40,000 cps Mix Ratio: 100 parts by weight Part A 102 parts by weight Part B Pot Life: >6 hours at 25C Cure Schedule: Gel at 125C for 2 to 3 hours followed by 3 to 5 hours at 150C for full cure.
602
Adhesives,
Sealants
and Coatings for the Electronics
Industry
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3913: MAGNOLIA 3913 is a two part epoxy system specially formulated as a dip coating for toroidal transformers and other electrical components requiring a tough, semi-flexible insulating material. Special Features: This two component epoxy has a 3 to 3-l/2 hour pot life in a one pound mass and produces a coating thickness of 15 to 20 mils per dip with agitation or vibration. It will cure to a tough semi-flexible coating providing good electrical insulation when the optimum cure schedule is used. Properties of Uncured Material: Part A: Color: Black Viscosity: 22,000 cps Specific Gravity: 1.1 SPI Classification: 4 Part B: Color: Tan Viscosity: 16,000 cps Specific Gravity: 1.0 SPI Classification: 4 Mix: Color: Black Viscosity: 15,000 cps Specific Gravity: 1.1 MAGNOLIA 3974: MAGNOLIA 3974 is a two part epoxy dip coat for capacitors. Special Features: MAGNOLIA 3974 is a 100% solids system possessing a pot life of 6-8 hours when used in dipping trays of approximately 1 inch depth. Part. A:
Color: Green Viscosity: 164,000 Specific Gravity: 1.24 SPI Classification: 2 Part B: Color: Natural Viscosity: 17,500 Specific Gravity: 1.03 SPI Classification: 4 Mix: Color: Green Viscosity: 33,000 Specific Gravity: 1.20 Thixotropic Index: 4.5
Encapsulating, Potting, Casting, Impregnating Compounds
603
MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3997: MAGNOLIA 3997 is a two part epoxy compound designed for use in a wide variety of electrical potting, encapsulating and impregnating applications. MAGNOLIA 3997 will provide a broad range of temperature extremes. Special Features: 1. The good thermal shock resistance of MAGNOLIA 3997 is demonstrated by its ability to pass 10 cycles using the difficult Olyphant washer test. 2. The combination of good tensile strength and high elongation demonstrates the toughness of 3997. 3. For large castings, the unit can be filled with coarse particle size sand prior to adding the epoxy mixture. Because 3997 remains fluid prior to gelling, it will penetrate completely through the sand. This procedure is helpful in reducing overall part cost without hurting physical and electrical properties. Properties of Uncured Material: Part A: Specific Gravity: 1.1 Viscosity @ 20C: 4,300 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.0 Viscosity @ 20C: 2,200 cps SPI Classification: 4 Flash Point: >lOOC Mix: Specific Gravity: 1.1 Viscosity @ 25C: 2,400 cps Mixing Instructions: Pot Life: >a hours @ 25c Gel Time: ia minutes @ 120C Cure Schedule: IS hours @ 75C or 2-4 hours @ 125C Mix Ratio: 1:l parts by volume
604
Adhesives, Sealants and Coatings for the Electronics Industry
MAGNOLIA
PLASTICS,
INC.:
Electrical Systems (Continued):
MAGNOLIA 9001: MAGNOLIA 9001 is a two part urethane potting compound designed to protect delicate electronic components over a wide range of temperatures. Special Features: 1. Good chemical resistance. MAGNOLIA 9001 keeps harsh chemicals away from extremely sensitive electronics assemblies. 2. MAGNOLIA 9001 is easily removed from the potted unit for repair of defective components. After the-repair is complete, the 9001 patch will bond fully to the rest of the potting compound. 3. MAGNOLIA 9001 will withstand extremes in temperature. It will not stress components even at very low temperatures. Extended periods at 140C show no tendency toward age hardening or embrittlement. Properties: Specific Gravity: Resin - .99 Curing Agent - .91 Mix - .95 Viscosity, cps: Resin - 100 Curing Agent - 1000 Mix - 480 Mix Ratio: 1 to 1 by weight Pot Life, minutes at 7lF: 15 MAGNOLIA 9002: MAGNOLIA 9002
is a two part urethane compound having a Shore A hardness of 90. The product is used to encapsulate electronic components having a service temperature range of -40C to +125C.
Properties: Specific Gravity: A: 1.2 B:’
1.0
Mix: 1.1 Viscosity: A: 60 cps B: 450 cps Mix: 265 cps Mix Ratio: 48 parts by weight A 100 parts by weight B 3 oz. Pot Life: >2 hours Cure Schedule: 2-4 hours at 65C-85C
Encapsulating, Potting, Casting, Impregnating Compounds
MAVIDON CORP.: Encapsulants: 6135 Semiconductor Encapsulant: MAVIDON 6135 is a thixotropic, high purity, two-part epoxy glob top encapsulant. 6135 is heavily filled to reduce the shrinkaae _ durina cure and to reduce the coefficient of expansion of the cured resin. Since 6135 is an epoxy, it has _ excellent solvent resistance to chlorinated and fluorinated defluxing systems normally used by the electronic industry. Physical Characteristics: 6135 A: Aonearance: Black Paste Viscosity @ 25C (77F): 200,000 Shelf Life @ 25C (77F): 6 nos. Specific Gravity: 1.6 Density (Lb/gal): 13.3 6135 B: Appearance: Beige Liquid Viscosity @ 25C (77F): 50,000 cps Shelf Life @ 25C (77F): 6 mos. Specific Gravity: 1.6 Density (Lb/gal): 13.3 Mix Ratio: 100 parts 6135 A to 90 parts 6135 B by weight. Cure Schedule: Gel: 1 hour at 1OOC Cure: 1 hour at 150C Cured Properties: Appearance: Black Coefficient of Thermal Expansion: 20-30 ppm/C Heat Distortion Temperature: 15OC Hardness (Shore D): 93 Hydrolyzable Chloride: t25 ppm Dielectric Constant (1 kHz): 3.5 Dissipation Factor (1 kHz): 0.005 Opearating Class: F (155C)
605
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Adhesives, Sealants and Coatings for the Electronics Industry
MAVIDON CORP.: Encapsulants
(Continued):
9213-I Epoxy Casting Compound: MAVIDON LS 9213-1 is a one component epoxy coating and impregnating compound featuring low viscosity, good moisture resistance and excellent dielectric properties. Typical applications include transformer impregnation and casting and electrical laminations. Physical Characteristics: Appearance: Black Liquid Viscosity @ 25C (77F): 1200 cps Snecific Gravitv: 1 .I Solids Content:-100% Shelf Life @ 25C (77F): 4 months @ OC (32F): 1 year Cure Schedule: Cure schedules are dependent upon mass and temperature. Typical cure schedules when used as a coating compound are as follows: 1 hour at 121C (250F) 4 hours at 105C (22lF) 8 hours at 93C (200F) Tvoical Cured Characteristics: *-AIEE Operating Class: 155C Class F Dielectric Constant (IO 3 Hz): 340 Dissination Factor (IO Hz): .022 Dielectric Strength (VoltjMil): 480 Volume Resistivity (ohm-cm): 2 x 10 15 Shore Hardness: 70D Percent Elongation: 5% 619-4 Casting Compound: MAVIDON System LD 619-4 is a low viscosity, two component casting compound. LD 619-4 meets the requirements for UL94VO.
LD
Physical Characteristics: A: LD 619-4 Appearance: Grey Liquid Viscosity @ 25C (77F): 3500 cps Density (lb/gal): 11.0 Shelf Life @ 25C (77F): 6 months LD 619-4 B: Appearance: Clear Liquid Viscositv @ 25C (77F): 40 cus Density ilb/gal)I 8.6 L Shelf Life @ 25C (77F): 6 months
Encapsulating, Potting, Carting, Impregnating Compounds
MAVIDON CORP.: Encapsulants
(Continued):
LD 619-4 Casting Compound (Continued): Mix Ratio: By Weight: 100 parts LD 619-4 A to 14 parts LD 619-4 B By Volume: 10 parts LD 619-4 A to 1 part LD 619-4 B Pot Life: 90 minutes in a 100 gram mass @ 25C (77F) Cure Schedule: 8 hours at room temperature for handling strength, 24 hours at room temperature for full cure. Cure can be accelerated by allowing system to gel at room temperature followed by a post cure of 1 hour at 60C (140F). Typical Cured Characteristics: Hardness: 72D Flexural Strength: 12,000 psi Compressive Strength: 15,000 psi Dielectric Strength: 430 volts Flammability Index: VO Service Temp: 250F continuous LV 7836 Potting Compound: MAVIDON LV 7836 is a one part potting compound featuring very low viscosity, long pot life, low temperature cure, and good thermal stability upon curing. Physical Characteristics: Color: Black % Filler: 0 Snecific Gravitv @ 25C (77F): 1.1 Viscosity @ 25C-(77F): 500-700 cps Flash Point, C (F): 73C Weight per Gal.: 9.5 Shelf Life @ 25C (77F): 3 months at OC Pot Life: 5 days at 25C (771")in a 50 gram mass. Cure Schedule: 2 hours at 80C or 1 l/2 hours at 9OC Typical Cured Characteristics: Volume Resistivity @ 25C (77F): 26 x 10 15 ohm-cm Dielectric Constant @ 25C (77F): 3.9 Dissipation Factor @ 25C (77F): 0.009 Dielectric Strength: 580 V/mil Hardness, Shore: D84 Heat Deflection Temperature: IOOC Linear Shrinkage, %: 0.76
607
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Adhesives, Sealants and Coatings for the Electronics Industry
MAVIDON CORP.: Encapsulants
(Continued):
LV 1832 A/B Potting Compound: MAVIDON LV 1832 is a two part, unfilled potting compound featuring very low viscosity, low cure temperature, and good thermal stability upon curing. Physical Characteristics: LV 1832 A: Color: Black % Filler: 0 Specific Gravity @ 25C (77F): 1.1 Viscosity 8 25C (77F): 500-700 cps Weight per Gal.: 9.5 Shelf Life @ 25C (77F): 12 months LV 1832 B: Color: Yellow % Filler: 0 Specific Gravity @ 25C (77F): 1.0 Viscosity @ 25C (77F): waxy solid t25C Weight per Gal.: 8.0 Shelf Life @ 25C (77F): 12 months Mix Ratio: 100 parts LV 1832 A to 4 parts LV 1832 B by weight. Pot Life: 1 day at 25C (77F) in a 50 gram mass. Cure Schedule: 1 l/2 hours at 75C or l/2 hour at IOOC Typical Cured Characteristics: Volume Resistivity @ 25C (77F): 2.6 x 10 15 Dielectric Constant @ 25C (77F): 3.7 Dissipation Factor @ 25C (77F): 0.008 Dielectric Breakdown: 500 V/mil Hardness, Shore: D84 Heat Deflection Temperature: 1OOC Linear Shrinkage, %: 0.76
Encapsulating, Potting, Casting, Impregnating Compounds
MAVIDON CORP.: Encapsulants
(Continued):
LE 626 Casting Compound: MAVIDON LE 626 is an economical, low viscosity, black, two component epoxy encapsulating compound which-features a convenient mix ratio by volume. LE 626 cures to yield a very flexible casting. Physical Characteristics: LE 626 A: Appearance: Black Liquid Viscosity @ 25C (77F): 900 cps Density (lb/gal): 8.7 Shelf Life @ 25C (77F): 1 year LE 626 B: Appearance: Amber Liquid Viscosity @ 25C (77F): 500 cps Density (lb/gal): 8.2 Shelf Life @ 25C (77F): 1 year Mix Ratio: By volume: 1 part LE 626 A to 1 part LE 626 B. By weight: 100 parts LE 626 A to 83 parts LE 626 B. Pot Life: 45 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: Overnight at room temperature of 1 hour at 60C (140F) Tvaical Cured Characteristics: -*Hardness: 25D Thermal Expansion Coefficient (in/in F): 60 x 10 -6 Dissipation Factor (10 3 Hz): .039 Thermal Conductivity (BTU/hr Ft 2 f/in): 1.5 Dielectric Constant (IO 3 Hz): 3.9 KE 62602L: Softer, longer potlife modification of LE 626
609
610
Adhesives, Sealants and Coatings for the Electronics Industry
PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds: For: Potting, Casting, Encapasulating, Adhering. 135: Features: Low Cost Good Flow Machineable Cat & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Vise. Cps.: 6,000 Pot Life Min.: 30 Shrinkage Cm/Cm: 0.002 SP- Gr.: 1.55 Hardness - Shore D: 88 Compressive Strength psi: 16,500 Service Temp. C: 175 Thermal Conductivity: 4.25 Thermal Expansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm. Cm.: 10 15 Dielectric Constant: 60 HZ: 4.5 1 KHZ: 4.4 1 MHZ: 3.7 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 450 136: Feature: Low cost Versatile Cat & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Vise. Cps.: 23,000 Pot Life Min.: 30 Shrinkage Cm/Cm: 0.002 SP. Gr.: 1.55 Hardness - Shore D: 88 Comwressive Strength wsi: 16,500 Service Temp. C: 175 _ Thermal Conductivity: 4.7 Thermal Expansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm. Cm.: IO 15 Dielectric Constant: 60 HZ: 4.8 1 KHZ: 4.5 1 MHZ: 3.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 450
Impregnating, Dipping,
Encapsulating, Potting, Casting, Impregnating Compounds
PBRMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 100-M: Feature: Lowest Cost 1 to 1 Ratio Cat & Ratio: Part B 1 to 1 (Vol.) Mixed Vise. Cps.: 17,000 Pot Life Min.; 80 Shrinkage Cm/Cm: 0.002 Se. Gr.: 1.55 Hardness - Shore D: 75 Compressive Strength psi: 6,800 Service Temp. C: 125 Thermal Conductivity: 3.5 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 14 Dielectric Constant: 60 HZ: 4.7 1 KHZ: 4.5 1 MHz: 4.4 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 400 125: Feature: Lowest Viscosity LOW cost Cat & Ratio: INSULCURE 9 & 11 6-7 PHR 8-9 Mixed Vise. CDS.: 1.000 Pot Life Min.; 30 ’ Shrinkage Cm/Cm: 0.002 SD. Gr.f 1.55 Hardness - Shore D: 88 Compressive Strength psi: 12,000 Service Temp. C: 155 Thermal Conductivity: 4.0 Thermal Expansion Cm/Cm/C: 40 x 10 -6 Vol. Resistivitv Ohm. Cm.: IO 14 Dielectric Constant: 60 HZ: 4.4 1 KHZ: 4.2 1 MHZ: 3.9 Dissipation Factor: 60 HZ: 0.01 1 KHZ: 0.02 1 MHZ: 0.04 Dielectric Strength Volts/Mil: 435
611
612
Adhesives, Sealants and Coatings for the Electronics Industry
Epoxy Selector Guide INDUSTRIES INC.: INSULCAST for Electrical and Electronic Compounds (Continued):
PERMAGILE
141: Feature: High Thermal Conductivity Good Thermal Shock Cat & Ratio: INSULCURE 9 or 11 3-4 PHR 4-5 Mixed Vise. Cps.: 90,000 Pot Life Min.: 5 hr. Shrinkase Cm/Cm: 0.001 Sp. Gr.; 2.3. Hardness - Shore D: 95 Compresssive Strength psi: 17,000 Service Temo. C: 180 Thermal Conductivity: 10.4 Thermal Expansion Cm/Cm/C: 24 X 10 -6 Vol. Resistivitv Ohm. Cm.: 10 16 Dielectric Constant: 60 HZ: 6.4 1 KHZ: 6.2 1 MHZ: 5.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 500 70-C.C.: Feature: Semi Flexible Low Stress Cat & Ratio: Part B Mixed Vise. Cps.: 7,000 Pot Life Min.: 40 Shrinkage Cm/Cm: 0.001 SD. Gr.: 1.45 Hardness - Shore D: 65 Compressive Strength psi: 5,000 Service Temp. C: i3OC. Thermal Conductivity: 6.0 Thermal Expansion Cm/Cm/C: 7 x 10 -6 Vol. Resistivity Ohm. Cm.: 10 12 Dielectric Constant: 60 HZ: 4.3 1 KHZ: 4.2 1 MHZ: 3.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.01 Dielectric Strength Volts/Mil: 390
Encapsulating, Potting, Casting, Impregnating Compounds
PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 70-C.C.: Feature: Semi Flexible Low Stress Cat & Ratio: Part B Mixed Vise. Cps.: 7,000 Pot Life Min.: 40 Shrinkage Cm/Cm: 0.001 SP- Gr.: 1.45 Hardness - Shore D: 65 Compressive Strength psi: 5,000 Service Temp. C: 13OC Thermal Conductivity: 6.0 Thermal Expansion Cm/Cm/C: 7x10 -6 Vol. Resistivity Ohm. Cm.: 10 12 Dielectric Constant: 60 HZ: 4.3 1 KHZ: 4.2 1 KHZ: 3.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.01 Dielectric Strength Volts/Mil: 390 333: Feature: Fire Retardant Conforms to U.L. 94V0 Cat & Ratio: INSULCURE 9 or 11 5-6 PHR 7-8 Mixed Vise. Cps.: 2,000 Pot Life Min.: 45 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.50 Hardness - Shore D: 85 Compressive Strength psi: 14,000 Service Temp. C: 155 Thermal Conductivity: 4.5 Thermal Expansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm. Cm.: 10 15 Dielectric Constant: 60HZ: 4.5 IKHZ:
4.4
IMHZ: 3.8 Dissipation Factor: 60HZ: 0.02 ~KHZ: 0.01 IMHZ: 0.02 Dielectric Strength Volts/Mil: 430
613
614
Adhesives, Sealants and Coatings for the Electronics Industry
PERMAGILE INDUSTRIES INC.: Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 981: Feature: Semi Flexible Superior Hot I.R. Cat & Ratio: Mix A & B 1:l Mixed Vise. Cps.: 40,000 Pot Life Min.: 8 hr. Shrinkage Cm/Cm: 0.003 Sp. Gr.: 1.45 Hardness - Shore D: 65 Compressive Strength psi: N.A. Service Temp. C: 180 Thermal Conductivity: 4.0 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 14 Dielectric Constant: 60HZ: 4.6 IKHZ: 4.5 1MHZ: 4.4 Dissipation Factor: 60HZ: 0.05 ~KHZ: 0.04 1MHZ: 0.05 Dielectric Strength Volts/Mil: 420 612: Feature: Electra-Conductive Cat & Ratio: INSULCURE 9 2 l/2% Mixed Vise. Cps.: Smooth Paste Pot Life Min.: 60 Shrinkage Cm/Cm: 0.001 Se. Gr.: 3.0 Hardness - Shore D: 95 Compressive Strength psi: Tensile 7,000 Service Temp. C: 175 Thermal Conductivity: 60 Thermal Expansion Cm/Cm/C: 15x10 -6 Vol. Resistivity Ohm. Cm.: 2x10 -4
Encapsulating, Potting, Casting, Impregnating Compounds
PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 166: Feature: Castable Aluminum Cat & Ratio: INSULCURE 9 or 11 4-5 PHR 7-8 Mixed Vise. CPS.: 15,000 Pot Life Min.; 45 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.6 Hardness - Shore D: 85 Compressive Strength psi: 13,000 Service Temp. C: 155 Thermal Conductivity: 8.0 Thermal Expansion Cm/Cm/C: 40x10 -6 174: Feature: Adjustable Flexibility Cat & Ratio: INSULCURE 22 Variable Mixed Vise. Cps.: 40,000 Pot Life Min.: 60 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.4 Hardness - Shore D: Adjustable Comoressive Strensth usi: 600 to 8,000 Se&ice Temp. C: i25 _ Thermal Conductivity: 2.4 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 13 Dielectric Constant: 60HZ: 4.5 1KHZ: 4.1 IMHZ: 3.5 Dissipation Factor: 60HZ: 0.05 ~KHZ: 0.04 IMHZ: 0.03 Dielectric Strength Volts/Mil: 400
61.5
616
Adhesives, Sealants and Coatings for the Electronics Zndustry
PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 30: Feature: Soft Gel Repairable R.T. Cure Cat & Ratio: Mix A & B 100-25 Mixed Vise. Cps.: 750 Pot Life Min.: 40 Shrinkage Cm/Cm: 0.007 SP. Gr.: 1.15 Hardness - Shore D: 30 (A) Compressive Strength psi: N.A. Service Temp. C: 130 Thermal Conductivity: 1.9 Thermal Expansion Cm/Cm/C: 200x10 -6 Vol. Resistivity Ohm. Cm.: 10 13 Dielectric Constant: 60H.Z: 3.8 IKHZ: 3.6 IMHZ: 3.3 Dissipation Factor: 60HZ: 0.03 IKHz: 0.02 IMHZ: 0.02 Dielectric Strength Volts/Mil: 385 275: Feature: Thixotropic Dip No Run Off Cat. & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Vise. Cps. Thixotropic Pot Life Min.: 30 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.55 Hardness - Shore D: 88 Compressive Strength psi: 16,000 Service Temp. C: 175 Thermal Conductivity: 4.3 Thermal Exvansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm; Cm.: 10 15 Dielectric Constant: 60HZ: 4.5 ~KHZ: 4.4 IMHZ: 3.7 Dissipation Factor: 60HZ: 0.02 IKHZ: 0.01 IMHZ: 0.02 Dielectric Strength Volts/Mil: 450
Encapsulating, Potting, Casting, Impregnating Compounds
PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 510: Feature: Water White Cat & Ratio: Mix A & B 100-20 Mixed Vise. Cps.: 2,000 Pot Life Min.: 90 Shrinkage Cm/Cm: 0.007 Sp. Gr.: 1.20 Hardness - Shore D: 80 Compressive Strength psi: 15,000 Service Temp. C: 180 Thermal Conductivity: 1.8 Thermal Expansion Cm/Cm/C: 150x10 -6 Vol. Resistivity Ohm. Cm: 10 16 Dielectric Constant: 60HZ: 3.7 IKHZ: 3.7 IMHZ: 3.3 Dissipation Factor: 60HZ: 0.007 1KHZ: 0.005 IMHZ: 0.005 Dielectric Strength Volts/Mil: 475 961:
Feature: Low Density Cat & Ratio: INSULCURE 14 23-24 PHR Mixed Vise. Cvs.: 2,500 Pot Life Min.: 40 . Shrinkage Cm/Cm: 0.003 Sv. Gr.: 0.80 Hardness - Shore D: 80 Compressive Strength psi: 10,000 Service Temp. C: 125 Thermal Conductivity: 1.2 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 13 Dielectric Constant: 60HZ: 3.7 IKHZ: 3.2 1MHZ: 3.0 Dissipation Factor: 60HZ: 0.02 ~KHZ: 0.01 IMHZ: 0.01 Dielectric Strength Volts/Mil: 385
617
618
Adhesives,
Sealants
and Coatings for the Electronics
Industry
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1201-Q Potting and Molding Compound: Use: Especially formulated for use in potting and sealing of electrical connectors and components. Description: PR-1201-Q is a two-part, polysulfide, liquid polymer compound. Upon the mixing of the accelerator with the base compound, the material cures at room temperature, without the addition of heat, to a firm, solid rubber. The cure of PR-1201-Q is entirely chemical in nature and does not depend on exposure to air. This feature permits its application in any desired thickness. PR-1201-Q is designed to flow around wires and connections in electrical connectors to provide complete insulation. This method of sealing the terminals and wires by completely filling the receptacle end bell is called potting and results in the followina advantaaes: 1. Positive sealing against dirt, foreign matter and moisture. 2. Prevention of wire fatigue under extreme vibration. 3. Improved electrical characteristics. 4. Weight saved by elimination of end bell and cable clamp. 5. Space saving due to shorter overall length. 6. Better production handling characteristics. 7. Reduction of lateral fatigue at the solder cup. Specifications: Meets the requirements of MIL-S-8516E(2), 1, 2 and 3
Type II, Class
Application Properties: Color: Base: White Accelerator: Red-Brown Nonvolatile Content: 94% Mixing Ratio: 10:1 by weight (base compound: accelerator) Viscosity: Brookfield Spindle #7 @ 4 rpm: 550 poises Performance Properties: Color: Light Brown Specific Gravity: 1.68 Hardness, Shore A (Cure B): 40 Adhesion, Peel, lbs./in. of width (Cure B): Adhesion Alloy: 20 Cadmium Plate: 20 El.ectrical Properties: Resistance to Arc, seconds: Cure A: 50 Cure B: 100 Dielectric Constant: Cure A 1 kilocycle at 77F 9.5 Power Factor: 1 kilocycle at 77F .005 Resistivity: Volume at 77F, ohm-cm 1.9x10 11
Cure B 9.5 .005 7.1x10
11
Encapsulating, Potting Casting Impregnating Compounds
619
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-I201-RLS Potting and Sealing: Use: Especially formulated for use in potting and sealing of electrical connectors and components where a viscosity lower than that of PR-1201-Q is desired. Description: PR-1201-RLS is a two-part, polysulfide, liquid polymer compound. Upon the mixing of the accelerator with the base compound, the material cures at room temperature, without the addition of heat, to a firm, solid rubber. The cure of PR-12OI-RLS is entirely chemical in nature and does not depend on exposure to air. This feature permits its application in any desired thickness. PR-1201-RLS is designed to flow around wires and connections in electrical connectors to provide complete insulation. This method of sealing the terminals and wires by completely filling the receptacle end bell is called potting and results in the following advantages: I. Positive sealing against dirt, foreign matter, and moisture. 2. Prevention of wire fatigue under extreme vibration. 3. Improved electrical characteristics. 4. Weight saved by elimination of end bell and cable clamp. 5. Space saving due to shorter overall length. 6. Better production handling characteristics. 7. Reduction of lateral fatigue at the solder cup. Specifications: Meets the requirements of MIL-S-8516E(2), 2, and 3.
Type I, Class 1,
Application Properties: Color: Base: White Accelerator: Red-brown Nonvolatile Content, Minimum: 96% Mixing Ratio: IO:1 by weight (base compound: accelerator) Viscosity: Brookfield: 220 poise Performance Properties: Color: Light Brown Hardness, Shore A (Cure B): 35 Specific Gravity: I.63 Electrical Properties: Resistance to Arc, seconds Dielectric Strength, volts/mil Dielectric Constant: I kilocycle at 77F Power Factor: I kilocycle at 77F
Cure A 65 230
Cure B 75 270
8.1
8.5
0.008
0.007
620
Adhesives, Sealants and Coatings for the Electronics Industry
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1520 Potting and Molding Compound: Use: Especially formulated for use as an electrical cable molding compound where flexibility, excellent resistance to cold flow, and exposure to temperatures as high as 300F for prolonged periods are required. Description: PR-1520 is a chemically curing compound which is available premixed and frozen in plastic cartridges only. It cures rapidly at high temperatures. Properly cured PR-1520 is designed to withstand temperatures as high as 300F for prolonged periods without blowing, deterioration or loss in electrical properties. PR-1520 is readily applied by extrusion gun and provides a firm, resilient, and vibration resistant material. PR-1520 must be used with a primer on most surfaces. Application Properties: Color: Black Nonvolatile Content: 99% Viscosity (Brookfield Spindle #5 @ 10 rpm): Thawed at 75F: 1700 poises Thawed in a 100F water bath: 650 poises Application Life: 1 l/2 hrs. @ 75F Mold Release Time: 72 hrs. a 75F or 3 hrs. @ 180F or 2 hrs. @ 200F or 1 l/2 hrs. @ 220F Cure Time (To 40 Shore A Hardness): 120 hrs. @ 75F or 6 hrs. @ 180F Ultimate Cure: 16 hrs @ 180F Performance Properties: (Cured 16 hours at 180F) Color: Black Specific Gravity: 1.7 Hardness, Shore A: 68 Tensile Strength: 750 psi Ultimate Elongation: 200% Modulus at 100% Elongation: 500 psi Volume Shrinkage: 2.5% Compression Set: 9% @ 77F 32% @ 158F Temperature Range: -65F to +300F Fungus Resistance: Non-nutrient Adhesion, lbs./in. of width: Aluminum Alloy: 28 Cadmium Plate: 28 Neoprene: 20 Polyvinyl Chloride: 18
Encapsulating, Potting, Casting, Impregnating Compounds
621
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1527 Potting and Molding Compound: Use: Especially formulated as a molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, high tensile strength, and exposure from -80 to 300F for prolonged periods are required. Description: PR-1527 is a chemically curing polyurethane which may be supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1527 cures at room temperature to a firm, flexible, cold flow-resistant rubber with a high tensile strength. The cure may be accelerated by the application of heat. Properly cured PR-1527 is designed to withstand temperatures as high as 300F for prolonged periods without blowing, deterioration or loss in electrical properties and has excellent flexibility at -8OF. It will also withstand 400F for short periods. PR-1527 is readily applied by extrusion or injection gun. PR-1527 must be used with a primer on most surfaces. Application Properties: Color Part A: Amber or Black Part B: Straw Mixing Ratio: Part A:Part B Weight or Volume: 26:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #3 @ 10 rpm) Two-Part Unit: 250 poises Premixed, frozen: 600 poises ADDliCatiOn Life: Time to 2500 noises: *LTwo-Part Unit: 4 hrs @ 75F _ Premixed, frozen: 3 hrs @ 75F Tack Free Time: 18 hrs. @ 75F or 1 hr. @ 180F Mold Release Time: 24 hrs. @ 75F or 4 hrs. @ 180F Cure Time: To 80 Shore A hardness: 5 days @ 75F or 6 hrs @ 180F Performance Properties (Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.06 Hardness. Shore A: 80 Volume Shrinkage: 4% Tensile Strength: 2500 psi El.ectrical Properties (Cured 16 hours at 180F): Dielectric Constant: IKHz @ 75F: 8.3 IMHz @ 75F: 6.2 Power Factor: 1KHz @ 75F: 0.02 IMHz @ 75F: 1.0
622
Adhesives, Sealants and Coatings for the Electronics Industry
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1535 Potting and Molding Compound: Especially formulated for use as a potting or molding compound for applications where high abrasion resistance, extra high tensile strength, and excellent electrical properties are required over a temperature range of -80 to 300F. PR-1535 is a chemically curing polyurethane which may be supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1535 cures at room temperature to a tough, semiflexible, cold flow-resistant rubber with a high Shore A hardness, extra high tensile strength, and excellent electrical properties. The cure may be accelerated by the application of heat. Properly cured PR-1535 is designed to withstand temperatures as high as 300F for prolonged periods and has flexibility at -8OF. It will also withstand 400F for short periods. PR-1535 is also resistant to contact with water, oils, and fuels. PR-1535 must be used with a primer on most surfaces. Application Properties: Color Part A: Amber or Black Part B: Straw Mixing Ratio: Part A: Part B: Weight or volume: 32:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #7 @ 10 rpm): Two-part unit: 250 poises Premixed, frozen: 750 poises Application Life: Time to 2500 poises: Two-Part unit: 2 hrs. @ 75F Premixed, frozen: 1 hr. @ 75F Performance Properties (Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.07 Hardness, Shore A: 90 Volume Shrinkage: 2% Tensile Strength: 4500 psi Ultimate Elongation: 500% Tear Strength (Die C): 375 lbs./in. Compression Set: 32% Temperature Range: -8OF to 300F Fungus Resistance: Non-Nutrient Electrical Properties (Cured 16 hours at 180F): Dielectric Constant: 1 KHz @ 75F: 6.4 Power Factor: 1 KHz @ 75F: 0.03 Volume Resistivity: At 75F: 3x10 12 ohm-cm Surface Resistivity: At 75F: 4x10 12 ohms Insulation Resistance: At 75F: 500,000 megohms
Encapsulating, Potting, Casting, Impregnating Compounds
623
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1538 Potting and Molding Compound: Use: As a potting compound for electrical connectors, as a molding compound for electrical cables and mechanical parts, as a circuit board coating and/or as an electrical embedding compound. Description: PR-1538 is a low viscosity, chemically curing polyurethane compound which may be supplied in two-part units or premixed and frozen in plastic cartridges. PR-1538 cures at room temperature to a tough, flexible, and cold flow-resistant rubber. The cure may be accelerated by the application of heat. Properly cured PR-1538 is designed to withstand temperatures up to 300F without deterioration or loss in electrical properties. The low viscosity of PR-1538 allows the material to be degassed easily when supplied in two-part units and provides for excellent flow characteristics in encapsulating, molding and potting applications. PR-1538 Amber can be seen through easily so that inspection of connections and components coated, encapsulated, embedded or potted in the material can be made readily. PR-1538 has very good electrical properties, especially dielectric strength in thin films and volume resistivity. PR-1538 must be used with a primer on metal, neoprene and polyvinyl chloride surfaces. Application Properties: Color: Part A: Amber or Black Part B: Straw Mixing Ratio: Part A:Part B: weight or volume: 32:lOO Nonvolatile Content: 99% Viscosity(Brookfield Spindle #3 8 10 rpm): Two-part unit: 100 poises Premixed, frozen: 300 poises Performance Properties (Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.05 Hardness, Shore A: 80 Volume Shrinkage: 1.4% Tensile Strength: 3000 psi Ultimate Elongation: 600% Electrical Properties (Tested in accordance with MIL-S-8516C): Dielectric Constant: 1KHz 8 75F: 6.8 Power Factor: 1~~2 8 75~: 0.05 Volume Resistivity: At 75F: 1x10 13 ohm-cm Surface Resistivity: At 75F: 5 x 12 12 ohms
624
Adhesives, Sealants and Coatings for the Electronics Industry
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1546 Potting, Embedding and Encapsulating Compound: Use: Especially formulated as a reenterable urethane for use as a potting, embedding and encapsulating compound for applications where ease of repairing components and excellent electrical properties are essential. Description: PR-1546 is a chemically curing, polyurethane compound which is supplied in a two-part unit package. PR-1546 is a clear liquid that flows easily around intricate components and cures at room temperature to form a flexible rubber with a Shore A hardness of 50. Cured PR-1546 is transparent so that potted, embedded, or encapsulated components can be inspected readily. When it is necessary to remove or replace components, PR-1546, because of its specially formulated physical properties, can be removed easily, the component replaced, and freshly mixed PR-1546 applied in the repair area to reform a complete seal. PR-1546 and hydrolytic stability also has excellent electrical properties over the temperature range of -65F to 300F. Application Properties: Color: Part A: Straw Part B: Colorless Mixing Ratio: Part A:Part B 2O:lOO by weight Nonvolatile Content: 99% Viscosity: 150 poises Application Life: Time to 2500 poises: 2 hrs. @ 75F Tack Free Time: 24 hrs. @ 75F Mold Release Time: 2 hrs. @ 75F Cure Time: To 50 Shore A hardness: 5 days @ 75F Performance Properties(Cured 16 hours at 180~): Color: Transparent-Light Straw Specific Gravity: 1.04 Hardness, Shore A: 50 Tensile Strength: 100 psi Ultimate Elongation: 100% Tear Strength, Die C: 15 lbs./inch Hydrolytic Stability: Conforms Temperature Range: -65F to +300F Electrical Properties(Cured 16 hrs. @ 180F): Insulation Resistance At 75F: 150,000 megohms Volume Resistivity: At 75F: 1 x 10 12 ohm-cm At 300F: 1 x 10 10 ohm-cm Surface Resistivity At 75F: 1 x 10 13 ohms Dielectric Constant: 1 KHz @ 75F: 7.0 Power Factor: 1 KHz @ 75F: 0.03 Dielectric Strength: 330 volts/mil
Encapsulating, Potting, Casting, Impregnating Compounds
625
PRODUCTS RESEARCH & CHEMICAL CORP.: PRC-1547 Potting and Molding Compound: Use: Especially formulated as a molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, flexibility, high tensile strength, and exposure from -7OF to +300F for prolonged periods are required. Description: PR-1547 is a chemically curing polyurethane compound which may be supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1547 cures at 180F to a tough, flexible, cold flow-resistant, high tensile strength rubber with a Shore A hardness of 80. PR-1547 will cure at 75F, but the resultant physical properties will be lower than when heat cured. Properly cured PR-1547 is designed to withstand temperatures as high as 300F for prolonged periods without blowing, deterioration or loss in electrical orooerties and has excellent flexibility at -7OF. The viscosity of PR-1547 allows the material to be degassed easily when supplied in two-part units and provides for excellent flow characteristics in encapsulating, molding and potting applications. PR-1547 must be used with a primer on metal, neoprene, and polyvinyl chloride surfaces. Specifications: PR-1547 meets the requirements of MIL-M-24041C Category A. Application Properties: Color: Part A: Amber or Black Part B: Straw Mixing Ratio: Part A: Part B 32:lOO by weight or volume Nonvolatile Content: 89% Viscosity (Brookfield Spindle #3 @ 10 rpm): Two-part unit: 250 poises Premixed, frozen: 450 poises Performance Properties(Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.05 Hardness, Shore A: 80 Volume Shrinkage: 2.5% Tensile Strength: 3000 psi Ultimate Elongation: 600% Electrical Properties(Cured 16 hours at 180F): Dielectric Constant: 1 KHz @ 75F: 5.8 Power Factor: 1 MHz @ 75F: 0.065 Volume Resistivity: At 75F: 1 x 10 13 ohm-cm Surface Resistivity: At 75F: 1 x 10 13 ohms Insulation Resistance: At 75F: 200,000 megohms
626
Adhesives,
Sealants
and Coatings for the Electronics
Industry
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1564 Molding Compound: Use: Formulated as a low viscosity molding compound for electrical cables and/or as a potting compound for electrical connectors where moderate Shore A hardness, resistance to cold flow, extra flexibility, and exposure from -8OF to 275F for prolonged periods are required. Description: PR-1564 is a chemically curing polyurethane compound which is supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1564 cures at room temperature to a flexible, cold flow-resistant rubber. Properly cured PR-1564 is designed to withstand temperatures as high as 2751 for prolonged periods without blowing, deterioration or loss in electrical properties and has excellent flexibility at -80~. PR-1564 is readily applied by extrusion or injection gun. PR-1564 must be used with a primer on metal. However, on neoprene and poly vinyl chloride surfaces, only certain formulations may require the use of a primer. Application Properties: Color: Part A: Light straw or black Part B: Colorless Mixing Ratio: Part A:Part B 7.7:100 by weight 7.7:100 by volume Nonvolatile Content: 99% Viscosity: Brookfield Spindle #7 @ 10 rpm: 80 poises Application Life: Time to 1000 poises: 1 l/2 hr. @ 75F Time to 2500 poises: 2 hrs. 8 75F Tack Free Time: 12 hrs. @ 75F Mold Release Time: 1 l/2 hrs. 8 180F Cure Time: To 30 Shore A hardness: 1 day 8 75F or 1 hr. 8 180F Performance Properties(Cured 7 days at 75F or 16 hours at 180F): Color: Amber or black Specific Gravity: 1.06 Hardness, Shore A: 65 Volume Shrinkage: 4% Tensile Strenath: 1000 osi Ultimate Elongation: 30'0% Tear Strength (Die C): 80 lbs./in. Moisture Absorption: 3.3% weight gain Fungus Resistance: Non-nutrient Electrical Properties(Cured for 16 hours at 180F): Dielectric Constant: 1 megacycle @ 75F: 4.3 Power Factor: 1 megacycle @ 75F: 0.08 Volume Resistivity: At 75F: 1 x 10 12 ohm-cm Surface Resistivity: At 75F: 3 x 10 13 ohms Insulation Resistance: 250,000 megohms Dielectric Strength: 335 volts/mil
Encapsulating, Potting, Casting, Impregnating Compounds
627
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1570 Potting and Molding Compound: Use: Formulated as a low-viscosity medium hardness potting and/or molding compound where high retention of electrical properties after exposure to high humidity and temperature is desired. Description: PR-1570 is a non-crystallized, low viscosity, chemically curing polyurethane compound which may be supplied in Amber or Black and in two-part units or premixed frozen in cartridges. PR-1570 cures to a tough, flexible, cold flow-resistant elastomer with outstanding retention of electrical properties after subjection to high humidity and temperature. PR-1570 must be used with a primer on metal and polyvinyl chloride surfaces. However, on neoprene, the use of a primer may be necessary only with some formulations of neoprene. Application Properties: Color: Part A: Colorless or Black Part B: Straw Mixing Ratio: Part A: Part B weight or volume: 25:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #7 @ 10 rpm): Two-part unit: 120 poises Premixed, frozen: 400 poises Application Life: Time to 2500 poise: Two-part unit: 75 minutes @ 75F Premixed, frozen: 30 minutes @ 75F Mold Release Time: 4 hrs. @ 180F Cure Time: To 70 Shore A: 8 hrs. @ 180F Performance Properties(Cured 16 hours at 180F): Specific Gravity: 0.98 Hardness, Shore A: 75 Volume Shrinkase: 4% Tensile Strength: 1000 psi Ultimate Elongation: 350% Tear Strength-(Die C): 100 lbs./in. Compression Set: 28% Adhesion, peel, lbs./in. of width: Aluminum: 50 Stainless Steel: 50 Neoprene: 20 Polyvinyl Chloride: 20 Electrical Properties(Cured 16 hours at 180F): Dielectric Constant: 1 KHz: 3.2 Power Factor: IKHz: 0.02 Volume Resistivity: At 75F: 1 x 10 15 ohm-cm Surface Resistivity: At 75F: 1 x IO 16 ohms Insulation Resistance: 1 x 10 8 megohms Dielectric Strength: 335 volts/mil
628
Adhesives, Sealants and Coatings for the Electronics Zndustry
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1574 Potting and Molding Compound: Use: Formulated as a low-viscosity high-hardness potting and/or molding compound where high retention of electrical properties after exposure to high humidity and temperature is desired. Description: PR-1574 is a low-viscosity chemically curing polyurethane compound which is supplied in Amber or Black and in two-part units or premixed and frozen in cartridges. PR-1574 cures to a tough, flexible, cold flow-resistant elastomer with outstanding retention of electrical properties after subjection to high humidity and temperature. PR-1574 requires elevated temperature for cure to obtain optimum performance properties. PR-1574 must be used with a primer on metal and polyvinyl chloride surfaces. However, on neoprene, the use of a primer may be necessary only with some formulations of neoprene. Specifications: PR-1574 meets the requirements of MIL-M-24041C Category B. Application Properties: Color Part A: Colorless or black Part B: Straw Mixing Ratio: Part A: Part B Weight or volume: 18:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #7 @ 10 rpm): Two-part unit: 120 poises Premixed, frozen: 400 poises Application Life: Time to 2500 poise: Two part unit: 75 minutes Premixed, frozen: 30 minutes Mold Release Time: 5 hrs. @ 180F Cure Time To 70 Shore A: 8 hrs. @ 180F Performance Properties(Cured 16 hours at 180F): Specific Gravity: 0.98 Volume Shrinkage: 3.5% Hardness, Shore A: 90 Tensile Strength: 2,500 psi Ultimate Elongation: 425% Tear Strength (Die Cl: 300 lbs./in. Adhesion, peel, lbs./in. of width: Aluminum: 50 Electrical Properties(Cured 16 hours at 18OF): Dielectric Constant: 1KHz @ 75F: 2.8 Power Factor: 1 KHZ @ 75F: 0.02 Volume Resistivity: At 75F: 1x10 15 ohm-cm Surface Resistivity: At 75F: 1x10 16 ohms Insulation Resistance: 1x10 8 megohms Dielectric Strength: 330 volts/mil
Encapsulating, Potting, Casting, Impregnating Compounds
629
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1590 Molding Compound: Use: Especially formulated as a medium hardness, molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, flexibility, and exposure from -7OF to 300F for extended periods are required. Description: PR-1590 is a non-cracking, chemically curing, polyurethane compound which may be supplied in two-part quantities or premixed and frozen in elastic cartridaes. PR-1590 cures at 180F to a tough, flexible', cold flow-resistant, medium tensile strength rubber with a Shore A hardness of 75. PR-1590 will cure at 75F, but the resultant physical properties will be lower than when heat cured. Properly cured PR-1590 is designed to withstand temperatures as high as 300F for extended periods without blowina. deterioration or loss in electrical properties _ _ and has excellent flexibility at -70. The viscosity of PR-1590 allows the material to be degassed easily when supplied in two-part units and provides for excellent flow characteristics in encapsulating, molding, and potting applications. PR-1590 must be used with a primer on metal, neoprene, and polyvinyl chloride surfaces. Application Properties: Color: Part A: Dark amber or Black Part B: Straw Mixing Ratio: Part A: Part B: 47:lOO by weight Nonvolatile Content: 99% Viscosity (Brookfield Spindle #3 @ 10 rpm): Two-part unit: 120 poises Premixed, frozen: 400 poises Performance Properties(Cured 16 hours at 180F): Color: Dark amber or Black Specific Gravity: 1.08 Hardness, Shore A: 75 Volume Shrinkage: 4% Tensile Strength: 2200 psi Electrical Properties(Cured 16 hrs. @ 180F): Arc Resistance: 150 seconds. Dielectric Strength: 300 volts/mil Dielectric Constant: At 1 KHz @ 75F: 7.4 Power Factor: At 1 KHz @ 75F: 0.08 Insulation Resistance: At 75F: 5 x 10 5 megohms Resistivity: At 75F: At 250F Volume, ohm-cm: 1 x 10 12 1x10 9 Surface, ohms: 1 x 10 13 9 x 10 10
630
Adhesives, Sealants and Coatings for the Electronics Industy
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1592 Potting and Molding Compound: Use: Especially formulated as a high hardness molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, flexibility, high tensile strength, and exposure from -7OF to 275F for extended periods are required. Description: PR-1592 is a noncracking, chemically curing, polyurethane compound which is supplied in Amber or Black and in two-part quantities or premixed and frozen in plastic cartridges. PR-1592 cures at 180F to a tough, flexible, cold flow-resistant, high tensile strength rubber with a Shore A hardness of 85. PR-1592 will cure at 75F, but the resultant physical properties will be lower than when heat cured. Properly cured PR-1592 is designed to withstand temperatures as high as 275F for extended periods without blowing, deterioration or loss in electrical properties, and has excellent flexibility at -7OF. The viscosity of PR-1592 allows the material to be degassed easily when supplied in two part units and provides for excellent flow of characteristics in encapsulating, molding and potting applications. PR-1592 must be used with a primer on metal, neoprene and polyvinyl chloride surfaces. Specifications: PR-1592 meets the requirements of MIL-M-24041C Category B Application Properties: Color: Part A: Dark Amber or Black Part B: Straw Mixing Ratio: Part A:Part B 53:lOO by weight Nonvolatile Content: 99% Viscosity (Brookfield Spindle #3 @ 10 rpm): Two-part unit: 200 poises Premixed, frozen: 700 poises Performance Properties(Cured 16 hours at 180F): Color: Dark Amber or Black Specific Gravity: 1.08 Hardness, Shore A: 85 Volume Shrinkage: 4% Tensile Strength: 6000 psi Ultimate Elongation: 425% Electrical Properties(Cured 16 hrs. @ 180F): Arc Resistance: 150 seconds Dielectric Strength: 300 volts/mil Dielectric Constant: At 1 KHz @ 75F: 6.5 Power Factor: At 1 KHz @ 75F: 0.08 Insulation Resistance: At 75F: 5 x 10 5 megohms
Encapsulating, Potting, Casting, Impregnating Compounds
PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1660 Compound:
631
Potting and Molding
PR-1660 is a two-part, TDI free, non-cracking polyurethane potting and molding compound. The product is especially formulated to provide a flexible elastomer, possessing high hardness and tensile strength with good moisture and ozone resistance. Application Properties: Amber Black Tan solid Tan solid Color: Part A Clear liquid Clear liquid Part B ----Black paste Part C Part A: Part B: Part C Mixing Ratio: Part A: Part B 11.5: 100: 0.56 11.5:100 Viscosity (Mixed): At IZOF - 140F: lo-80 poise Nonvolatile Content: 99% Application Life: To 2500 poise: At 120F: 30 min. At 140F: 30 min. Tack Free Time: At 75F: 3 hrs. Mold Release Time: 2 hrs. @ 180F or 3 hrs. @ 160F or 8 hrs. @ 75F Cure Time: To 90 Shore A: 3 hrs. @ 212F or 12 hrs. @ 180F or 16 hrs. @ 160F or 14 days @ 75F Physical Properties: Color: Light amber Specific Gravity: 1.03 Hardness, Shore A: 90 Tensile Strength: 4000 psi Volume shrinkage: 3.3% Ultimate Elongation: 400% Ozone Resistance: Non-cracking Tear Strensth: 400 lbs./in. Adhesion, Peel Strength: Aluminum (Primed with PR-420): 40 piw Neoprene (Primed with PR-1523-M): 25 piw PVC (MEK tackified): 27 piw Hydrolytic Stability, Hardness Change after 120 days: -12% Abrasion Resistance: 3 mg. loss Flame Resistance: Self extinguishing Fungus Resistance: Non-nutrient El ectrical Properties: Dielectric Strength: 400 volts/mil Insulation Resistance: At 75F: 3 x 10 7 megohms Volume Resistivity: At 75F: 8 x 10 13 ohm-cm Surface Resistivity: At 75F: 1 x 10 15 ohms Dielectric Constant: 1 KHz @ 75F: 5.3 Power Factor: 1 KHz @ 75F: 0.04
632
Adhesives, Sealants and Coatings for the Electronics Industry
PRODUCTS RESEARCH & CHEMICAL CORP.: P/S 727 Potting and Sealing Compound: Use: P/S 727 is especially formulated for use in potting and sealing of electrical connectors and components for service use from -65F to +200F. Description: P/S 727 is a two-part, polysulfide, liquid polymer compound. Upon the mixing of the accelerator with the base compound, the material cures at room temperature, without the addition of heat, to a firm, solid rubber. The cure of P/S 727 is entirely chemical in nature and does not depend on exposure to air. This feature permits its application to any desired thickness. P/S 727 is designed to flow around wires and connections in electrical connectors to provide complete insulation. This method of sealing the terminals and wires by completely filling the receptacle end bell is called potting and results in the following advantages: 1. Positive sealing against dirt, foreign matter, and moisture 2. Preventuion of wire fatigue under extreme vibration. 3. Improved electrical characteristics. 4. Weight saved by elimination of end bell and cable clamp. 5. Space saving due to shorter overall length. 6. Better production handling characretistics. 7. Reduction of lateral fatigue at the solder cup. Specifications: Meets the requirements of and is qualified to MIL-S-8516E(2), Type II, Class 1, 2, and 3. Application Properties: Color: Base: White Accelerator: Red-brown Nonvolatile Content: 94% Mixing Ratio: 1OO:lO by weight (base compound: accelerator) Viscosity: Brookfield: 550 poises Performance Properties: Color: Light Brown Specific gravity: 1.8 Hardness, Shore A (Cure B): 40 Electrical Properties: Resistance to Arc, seconds Dielectric Strength, volts/mil Dielectric Constant: 1 kilocycle at 77F Power Factor: 1 kilocycle at 77F Resistivity: Volume at 77F, ohm-cm
Cure A 25 min 220
Cure B 50 min 230
9.5 .Ol
9.5 .Ol
1.0x10 11
2x10 11
Encapsulating, Potting, Casting, Impregnating Compounds
633
PRODUCTS RESEARCH & CHEMICAL CORP.: P/S 799 Potting and Molding Compound: Use: Formulated as a high-hardness molding compound for electrical cables and/or as a potting compound for electrical connectors. The product is intended for applications requiring flexibility and high tensile strength, resistance to cold flow, and exposure to temperatures from -7OF to 275F for extended periods. Description: P/S 799 is a chemically-curing, polyurethane compound which is supplied in Amber or Black and in two-part units. P/S 799 cures at 180F to a tough, flexible, cold flow-resistant, medium tensile strength elastomer. Properly cured P/S 799 is designed to withstand temperatures as high as 275F for extended periods without blowing, deterioration or loss in electrical properties, and has excellent flexibility at -7OF. The viscosity of P/S 799 allows the material to be degassed easily and provides for excellent flow characteristics in encapsulating, molding and potting applications. Specification: P/S 799 meets the requirements of MIL-M-24041C Category B. Application Properties: Color: Part A: Amber or Black Part B: Straw Mixing Ratio: Part A:Part B 41:lOO bv weisht Nonvolatile Content: 99% Viscosity Brookfield: 160 poise Application Life: Time to 2500 poises: 1 hr. @ 75F Mold Release Time: 2 hrs. @ 180F Performance Pronerties(Cured 16 hours at 180F): Color: Amber-or Black Specific Gravity: 1.07 Hardness, Shore A: 80 Volume Shrinkage: 3% Tensile Strength: 2500 psi Ultimate Elongation: 450% Tear Strength: (Die C) 300 lbs./in. 100% Modulus: 600 psi Compression Set: 25% Ozone Resistance: Conforms Electrical Properties(Cured 16 hrs. @ 180F): Dielectric Strensth: 300 volts/mil Dielectric Constant At IOKHz @ 75F: 4.8 Power Factor: At 10KHz @ 75F: 0.04 Insulation Resistance @ 75F: 5x10 5 megohms Resistivity @ 75F: Volume: 1x10 12 ohm-cm Surface: 1x10 13 ohms
634
Adhesives, Sealants and Coatings for the Electronics Industry
QUADRANT
CHEMICAL
CORP.:
A-2191F/B-2912F Encapsulating Resin:
This two component system cures to an electrically stable, tough, impact resistant epoxy for vacuum potting high energy ignition coils. This material exhibits good heat resistance without cracking or excess shrinkage. This system has proven its use for automotive applications. Cure Schedule: 4-6 Hours at 85'C plus 2 Hours at 120°C or equal Typical Physical Properties: Reaction ratio (by weight): 100:30 Resin to Hardener Reaction ratio (by volume): 100:39 Resin Color: Grey/Brown Hardener Color: Amber Resin Wt/Gal @ 25'C: 13.2+-.2 Hardener Wt/Gal @ 25'C: IO-l+-.2 Resin Viscosity @ 25'C Cps.: lO,OOO-30,000 Hardener Viscosity @ 25'C Cps.: 80-180 Resin percent inorganic: 50 Hardener percent inorganic: 0 Working Life @ 80°C: 20-30 Minutes Sunshine Gel Time @ 12O'C: 24-32 Minutes Service Temperature: 155'C Weight Loss @ 155'C: t0.5% Shore D @ 25'C: >90 Tensile Strength: 690 kg/cm2 Dielectric Strength @ 25'C: More than 16,000 volts/mm Volume Resistivity @ 25'C: 1 x El5 ohm cm Arch Resistance: More than 100 seconds Thermal Conductivity: .OOll cal/(sec)(sqcm)('C)(cm) Elongation: 2.5% Elastic Modulus: 0.8 x E6 Coefficient of Thermal Expansion: 40 x E-6 in/in/'C Dielectric Constant @ 1: 5O'C: 3.50/75'C: 4.00/100'c: 4.40/ 125'C: 4.75 Dissipation Factor @ Khz: 5O'C: O.O120/75'C: 0.0300/ 100°C: O.O650/125'C: 0.0600
Encapsulating, Potting, Casting, Impregnating Compounds
635
QUADRANT CHEMICAL CORP.: A-2238 VO/B-2250 Enscapulating Resin: This two component system cures to an electrically stable, tough, impact resistant Epoxy for potting Television components. This material exhibits good heat resistance without cracking or excess shrinkage. A-2238/B-2250 is supplied as a vacuum stable grade. (UL E 69407 94 V-O @ .25") Cure Schedule: Cures to rigid dielectric in 30-50 Minutes at 85'C. Cure will depend on air circulation and mass. Other cure schedules may be developed for your needs. Typical Physical Properties: Reaction ratio (by weight): 100:9.4 Resin to Hardener Reaction ratio (by volume): 100:17 Resin % Solids: 100 Hardener % Solids: 100 Resin Color: Grey Hardener Color: Blue Resin Wt/Gal @ 25'C: 14.6t.2 Hardener Wt/Gal @ 25'C: 8.02.2 Resin Viscosity @ 25'C: Cps: 150,000-400,000 Hardener Viscosity @ 25'C Cps: 20-50 Resin percent inorganic: 60 Hardener percent inorganic: 0 Working Life @ 25'C: lo-15 Minutes Sunshine Gel Time @ 75'C: 9-13 Minutes Service Temperature: 155'C Weight Loss @ 155'C: (0.5% Mixed viscosity @ 45'C Cps.: (3,500
636
Adhesives, Sealants and Coatings for the Electronics Industry
QUADRANT
CHEMICAL
CORP.:
A-2249
VO/B-2250 Encapsulating Resin:
This two component system cures to an electricaly stable, tough, impact resistant epoxy for potting Television components. This material exhibits good heat resistance without cracking or excess shrinkage. A-2249/B-2250 is supplied as a vacuum stable grade. (UL E 69407 94 V-O @ -1875") Cure Schedule: Cures to rigid dielectric in 30-50 Minutes at 85'C. Cure will depend on air circulation and mass. Other cure schedules may be developed for your needs. Typical Physical Properties: Reaction ratio (by weight): 100:12.5 Resin to Hardener Reaction ratio (by volume): 100:20 Resin % Solids: 100 Hardener % Solids: 100 Resin Color: Cream Hardener Color: Blue Resin Wt/Gal @ 25'C: 13.2+-.2 Hardener Wt/Gal 8 25'C: 8.0+-.2 Resin Viscosity @ 25°C Cps: 30,000-60,000 Hardener Viscosity @ 25'C Cps: 20-50 Resin oercent inorsanic: 50 Hardener percent inorganic: 0 Working Life @ 45'C: 12-16 Minutes Sunshine Gel Time @ 75'C: 12-16 Minutes Service Temperature: 13O'C Weight Loss @ 13O'C: ~0.5% Mixed viscosity @ 45°C: 90
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: Araldite*506/SYMPOXY
637
CA-803:
Very low viscosity, unfilled, high impact strength epoxy potting/casting/impregnating system Araldite 506/SYMPOXY CA-803 is a diluted, two part, unfilled 100% epoxy system designed for maximum impregnation or flow. Curing Agent 803 develops high impact strength and thermal shock in castings, relief of internal stress and providing excellent adhesion to lead materials. Small microscopic cracks around leads are eliminated. For a more rigid system see 1006-35 or when higher heat distortion and better electricals are desired, refer to 1006-561 or 1006-56. wical Prowerties: -Mixing ratios, pbw, Part A/Part B: 100/30 Shelf life, mos., Part A/Part B: 1216 Pot life, min., 100 grams mass: 30-40 Viscosity, cps @ 25C Part A/Part B: 500/50 Mixed: 300 Specific gravity, Part A/Part B: 1.15/.99 Mixed: 1.03 Hardness, Shore D: 75 Standard color: Black Thermal expansion coef., 10 -6, C: 62 Moisture absorption, 24 hrs. @ 25C: 0.25 Heat distortion temperature, C: 65 Tensile strength, psi: 8,300 Flexural strength, psi: 16,000 Compressive strength, psi: 17,200 Dielectric strength, Volt/miP: 420 Dielectric constant, 10 6 cps: 4.5 Dissipation factor, 10 6 cps: 0.03 Volume resistivity, ohm-cm @ 25C: 10 14 @ IOOC: 10 11 Refractive index: 1.5185
*Araldite isa registered trademark ofCiba-Geigy Corp.
638
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1002-31 & 1010-31 A & B: Fast hard gellation, low viscosity to medium viscosity epoxy system. For small potting/casting or adhesive/sealant applications. SYMPOXY 1002-31 (low viscosity) or 1010-31 (medium viscosity) may be used in up to l/4 inch thick potting/casting applications or in glue line adhesive applications. Both systems are almost identical in electrical and physical properties and cure speed is approximately the same. Usually, the lower viscosity system is used in small potting applications or in thin film adhesives or coatinas. Both systems have excellent electricals up to 130C and have high impact strength, low water absorption, high dielectric strength and maintain good dissipation factor through 1OOC. Both systems have an easy two to one mixing ratio, by weight. For a more flexible system see 1002-32 and 1010-32. 1002-31: Viscosity, cps. Part A/Part B: 600/250 Mixed: 400 Mixing Ratio, Part A/Part B, By Weight: 100/50 Pot Life, 100 grams, minutes: 8-10 Hard Gellation, l/8 inch thickness, hrs.: 2-2 l/2 Soecific Gravitv. Part A/Part B: 1.16/.98 Hardness, Shore-D: 85 Moisture Absorption, 24 Hrs. @ 25C: 0.30 Tensile Strenath. osi: 9500 Tensile Elongation; 8: 3 Dielectric Strength, volt/mil: 600 Dielectric Constant, 1 MHz: 3.1 Dissipation Factor, 1 MHz: .015 Volume Resistivity, ohm-cm @ 25C: 10 14 @ IOOC: 10 10 1010-31: Viscosity, cps, Part A/Part B: 12000/250 Mixed: 6500 Mixing Ratio, Part A/Part B, By Weight: 100/50 Pot Life. 100 Grams. Minutes: 6-8 Hard Geliation, l/8_inch thickness, hrs.: 1 l/2-2 Specific Gravity, Part A/Part B: 1.16l.98 Hardness, Shore-D: 89 Moisture Absorption, 24 Hrs. @ 25C: 0.30 Tensile Strength, psi: 10,500 Tensile Elongation, %: 3 Dielectric Strength, volt/mil: 600 Dielectric Constant, 1 MHz: 3.2 Dissipation Factor, 1 MHz: .015 Volume Resistivity, ohm-cm @ 25C: 10 14 @ 1ooc: 10 10
Encapsulating
Potting,
SYMPLASTICS INC.: SYMPOXY 1002-32
Casting
Impregnating
& 101 O-32
A&B:
Compounds
639
Fast hard gellation, medium viscosity to high viscosity flexible epoxy systems for small potting/casting or adhesive/ sealant applications. SYMPOXY 1002-32 (medium viscosity) or 1010-32 (high viscosity) may be used in up to l/4 inch thick potting/casting applications or-in glue line adhesive applications. Both systems are almost identical in electrical and physical properties and cure speed is approximately the same. Usually, the lower viscosity system, is used in small potting applications or in thin film adhesives or coatings. Both systems have excellent electricals to 1OOC and have high elongation, low water absorption, high dielectric strength and maintain good dissipation factor through 1OOC. Both systems have an easy one of one mixing ratio, by weight. These systems may also be used at one to one mixing ratio, by volume. For a more rigid system, see 1002-31 or 1010-31 A&B. 1002-32: Viscosity, cps. Part A/Part B: 600/7500 Mixed: 4100 Mixing Ratio, Part A/Part B, by Weight: 100/100 Shelf Life, Mos. Part A/Part B: 12/12 Pot Life, 100 Grams, Minutes: 8-10 Hard Gellation, l/8 inch thickness, hrs.: 1 l/2-2 Specific Gravity, Part A/Part B: 1.16/.98 Hardness, Shore D: 72 Moisture Absorption, 24 Hrs. @ 25C: 0.30 Tensile Strength, psi: 2000 Tensile Elonsation. %: 100 Dielectric Strength, volt/mil: 600 Dielectric Constant, 1 MHz: 3.0 Dissioation Factor, 1 MHz: 0.15 Volume Resistivity; ohm-cm @ 25C: IO 13 @ 1ooc: 10 9 1010-32: Viscosity, cps. Part A/Part B: 12000/7500 Mixed: 10000 Mixing Ratio, Part A/Part B, by Weight: 100/100 Shelf Life, Mos. Part A/Part B: 12112 Pot Life, 100 Grams, Minutes: 6-8 Hard Gellation, l/8 inch thickness, hrs.: l-l 1/2 Specific Gravity, Part A/Part B: 1.161.98 Hardness, Shore D: 76 Moisture Absorption, 24 Hrs. @ 25C: 0.30 Tensile Strength, psi: 2800 Tensile Elongation, %: 85 Dielectric Strength, volt/mil: 600 Dielectric Constant, 1 MHz: 2.9 Dissipation Factor, 1 MHz: .015 Volume Resistivity, ohm-cm @ 25C: IO 13 @ IOOC: 10 9
640
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1003-3A&B: Low viscosity, long pot life, low heat curing, ultra clear, rigid epoxy potting/casting/impregnating system SYMPOXY 1003-3A&B is ultra clear, water white system designed for thin films to one inch castings. The system is rigid, has good dust resistance due to its high gloss, has excellent color stability and although hard, has excellent impact resistance. SYMPOXY 1003-3A&B has a long pot life and cures under low heat or 3-4 days at room temperature (78F). For a similar system but where flexibility is required, see SYMPOXY 2202A&B. Typical Characteristics: Shelf life, mos. Part A/Part B: 12112 Mixed Viscosity, cps @ 25C: 850 Mixing ratio, by weight Part A/Part B: 311 Specific gravity, mixed: 1.11 Pot life, hrs. 100 gram mass @ 25C: >8 Exotherm'at gellation, 100 grams @ 25C - 1 inch thick: 85C Operating temperature, C: 100-120 Color (Gardner):
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: SYMPOXY 1004-201 A&B, 1007-201 A&B & 1010-201 A&B: Semi-rigid to semi-flexible system for potting or adhesive application requiring good adhesion to nylon, PVC, Ryton, etc. SYMPOXY 1004-201 A&B, 1007-201 A&B and 1010-201 A&B epoxy systems all have excellent adhesion to nylon or Ryton cups, have good adhesion to PVC or other plastic coated lead wires and differ only in their mixed viscosities. All three systems have a good long pot life along with a relative short room temperature hard gellation time. Mixing ratios are either a 2 to 1 or 1 to 1, by volume depending upon the system chosen. These systems have very low or medium viscosities allowing good impregnation, good air release and a hard glossy cured surface. 1007-201: Mixins ratios, bv volume: Part A to Part B - rigid: 2A/lB semi-flexible: lA/lB Mixed viscosities, cps: rigid: 800 semi-flexible: 1200 Pot life, min., 100 grams: 35-40 Gellation of 1/8th in thickness, hrs.: 3 Hardness. Shore D: ricrid: 80 semi-flexible: 69 _ Moisture absorption, 24 hrs @ 25C, %: risid: .I4 semi-flexible: .22 Tensile strength, psi: rigid: 9400 semi-flexible: 6500 1004-201: Mixing ratios, by volume: Part A to Part B - rigid: 2A/lB semi-flexible: lA/lB Mixed viscosities, cps: rigid: 4300 semi-flexible: 3800 Pot life, min., 100 grams: 30 Gellation of 1/8th in thickness, hrs.: 2 Hardness, Shore D: rigid: 82 semi-flexible: 70 Tensile strength, psi rigid: 9500 semi-flexible: 6500 1010-201: Mixing ratios, by volume: Part A to Part B - rigid: 2A/lB semi-flexible: lA/lB Mixed viscosities. CDS: riaid: 9400 semi-flexible:-82bO _ Pot life, min., 100 grams: 27 Gellation of 118th in thickness, hrs.: 1.5 Hardness, Shore D: rigid: 83 semi-flexible: 72
641
642
Adhesives, Sealants and Coatingsfor the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1005 A-B-C: Low viscosity, high temperature, impregnating resin SYMPOXY 1005 is similar to 1010 except it has a lower viscosity designed for filament and coil winding. Easy mixing measurements, very high electricals with excellent insulation resistance at elevated temperatures, clear golden color and a short cure schedule. Being similar to 1010, it also has excellent heat stability, very high surface and volume resistivities at elevated temperatures and a very long pot life. Typical Properties: Mixing Ratio, Part A/Part B pbw: lOO/lOO Accelerator, 8, pbw: 1 Standard Color: Golden Viscosity, Part A/Part B, cps: 8,000/250 Mixed, cps: 850 Specific Gravity, Part A/Part B: 1.15/1.23 Mixed: 1.19 Shelf Life, mos., Part A/Part B: 12/12 Pot Life, hrs., 1/2 Gallon: 1441168 Recommended Cure, hrs. @ 150C: 16 or accelerated - hrs. @ 125C: 4 or accelerated - hrs. @ 150C: 3 Hardness, Shore D: 93 Heat Distortion TemDeratUre. C: 160 Weight Loss, 500 hrs. @ 21OC: .80% Thermal Expansion, in-/in. per C: 65 x 10 -6 Izod Impact, in./in. of Notch: .30 Tensile Shear Strength, psi: 3.175 Moisture Absorption, %: 168 hrs. 8 25C: -49 Tensile Strength, psi: 11,650 Flexural Strength, psi: 24,800 Compressive Strength, psi: 20,600 Dielectric Strength, Volt/Mil: 450 Dielectric Constant. 10 6 CDS B 25C: 2.91 Dissipation Factor,.10 cps i 25C: .015 Volume Resistivity, ohm-cm: @ 25C: 5.84 x 10 15 @ 150C: 6.4 x 10 13 Insulation Resistance, ohms: @ 25C: 3.93 x 10 15 @ 150C: 2.4 x 10 13 Machinability: Excellent
Encapsulating, Potting, Casting, Impregnating Compounds
SYNPLASTICS INC.: SYMPOXY
1006-35:
Low viscosity, unfilled, rigid, epoxy potting/casting/ impregnating system for small castings. SYMPOXY 1006-35 is a diluted, two part, unfilled 100% eooxv svstem formulated for ease of imoreanatina tiaht cbmpone;try and wire wound devices. It-is-quite-similar to 1010-35 but being much lower in viscosity. 1006-35 has excellent electrical and physical properties combined with years of service as a general potting and impregnating system. For a higher temperature resistance see 1010-35. Available in clear, black or colors. Typical Properties: Viscosity, cps, Part A/Part B: 500/25 mixed: 400 Shelf life, mos. Part A/Part B: 12/12 Specific gravity, Part A/Part B: 1.15/0.99 Pot life,-mins., 100 grams mass: 30 Mixing ratios, pbw, Part A/Part B: lOO/lO Hardness, Shore D: 78 Thermal expansion, C, 10 6: 60 Moisture absorption, 24 hrs. @ 25C, %: 0.20 Heat distortion temperature, C: 05 Tensile strength, psi: 9,200 Flexural strensth. osi: 12,000 Compressive strength, psi:.15,500 Dielectric strength (Volt/mil): 380 Dielectric constant, 10 6 cps: 4.0 Dissipation factor, 10 6 cps: 0.027 Volume resistivity, ohm-cm: @ 25C: 10 14 @ IOOC: 10 10
643
644
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1006-72 A&B & 1010-72 A&B: High & low viscosity, adjustable flexibility epoxy adhesive/ sealant systems SYMPOXY 1006-72 and 1010-72 are low to high viscosity systems with adjustable flexibility, are unfilled and are room temperature curing systems. Both systems are technically very basic systems but show excellent adhesion to metals and plastics, have good resistance to solvents and chemicals and are easily adjusted to attain more or less flexibility for adhesion to rigid or flexible materials. Both systems have a long pot life but may be cured quickly under low heat (ie 65C).
1006-72 A&B: Mixing ratios, A/B, grams: Flexible: l/l Semi-flexible: 3/2 Rigid: 2/l Mixed viscositv. cps-rigid: 6,500 Pot life, 200 grams-rigid, rain: 200 Cure time, hrs. @ 25C (78F): 16 @ 65C (149F): 3 @ 85C (185F): 1 l/2 Hardness, Shore D-rigid: 78 Semi-rigid: 65 Tensile shear strength, psi, general: 4800 Peel strength, lbs/in. (flexible): 30.2 Thermal shock resistance, C: -55 to 200 Moisture resistance, % (24 hrs @ 25C): .06 1010-725 A&B: Mixing Ratios, A/B, grams: Flexible: l/l Semi-flexible: 312 Riaid: 2/l Mixed-viscosity, cps-rigid: 18,000 Pot life, 200 grams-rigid, min: 100 Cure time, hrs; @ 25C (78P): 16 @ 65C (149F): 3 @ 85C (185F): 1 l/2 Hardness, Shore D-rigid: 80 Semi-rigid: 69 Tensile shear strength, psi, general: 4600 Peel strength, lbs./in. (flexible): 28.5 Thermal shock resistance, C: -55 to 150 Moisture resistance, % (24 hrs @ 25C): -02
Encapsulating, Potting, Casting, Impregnating Compounds
645
SYMPLASTICS INC.: SYMPOXY 1006-284 and 1006-74: Two Component, Low Viscosity, High Temperature Resistant Epoxy System for Impregnating or Small Mass Potting SYMPOXY 1006-284 A&B is a two component, room temperature curing system designed for impregnating small wire wound coils and the potting of small cups where a fast hard gellation and cure schedule is reauired. This system has sood resistance to 130C and excellent Iri. SYMPOXY 1006-74 A&B is a two component, heat curing system designed for operational temperatures up to 180C. Due to its low viscosity and short cure schedule, this system is excellent for impregnating fine wire coils, transformers and small potting cups where excellent high heat resistance, IR and low dissipation factor are required. 1006-284: Mixins ratios. nbw. Part A/Part B: 100/25 Shelf-life, m&s.: Part A/Part B: 12112 Pot life @ 25C, 100 grams: 15-20 mins Specific gravity, mixed: 1.14 Viscosity, cps. @ 25C: 950 Curing schedule, hrs. @ 25C: 16-24 Hardness, Shore D: 90 Moisture absorntion. %. 24 hrs. @ 25C: 0.15 Operating temp&atu;e,.C: 130 _ Tensile strength, psi: 9,500 Tensile elonqation; %: 2.5 Dielectric sfreng&, Volt/mil, S/T: 503 Dielectric constant, 1 MHZ @ 25C: 3.50 Dissipation factor, 1 MHZ @ 25C: 0.02 Volume resistivity, ohm-cm @ 25C: 3.1 x 10 15 @ IOOC: 1.1 x 10 10 @ 150C: 5.0 x 10 8 1006-74: Mixing ratios, pbw, Part A/Part B: 100/100 Shelf life, mos, Part A/Part B: 12112 Pot life 4.25C..100 crrams: 24-48 hrs Specific gravity, mixed: 1.18 Viscosity, cps. @ 25C: 750 Curing s&he&le, hrs. @ IOOC: 6 @ 125C: 4 or or @ 15oc: 3 Hardness, Shore D: 92 Moisture absorption, %, 24 hrs. @ 25C: 0.12 Operating temperature, C: 180 Tensile strength, psi: 11,000 Tensile elongation, %: 2.7 Dielectric strength, Volt/mil, S/T: 380 Dielectric constant, 1 MHZ @ 25C: 3.30 Dissipation factor, 1 MHZ @ 25C: 0.01 Volume resitivity, ohm-cm @ 25C: 3.0 x IO 16 @ 1OOC: 8.1 x 10 14 @ 15oc: 1.0 x 10 11
646
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYNPOXY 1006-803: Very low viscosity, unfilled, high impact strength epoxy potting/casting/impregnating system SYMPOXY 1006-803 is a diluted, two part, unfilled 100% epoxy system designed for maximum impregnation of flow. Hardener 803 develops high impact strength and thermal shock in castings, relief of internal stresses and providing excellent adhesion to lead materials. Small microscopic cracks around leads eliminated. For a more rigid system see 1006-35 or when higher heat distortion and better electricals are desired refer to 1006-561 or 1006-56. Typical Properties: Mixing Ratios, pbw, Part A/Part B: 100/30 Shelf Life. mos.. Part A/Part B: l2/6 Pot life, min., ioo gram.mass: 30-48 Viscosity, cps, 8 25C Part A/Part B: 500/50 Mixed: 300 Specific gravity, Part A/Part B: 1.15/.99 Mixed: 1.03 Hardness, Shore D: 75 Standard color: Black Thermal expansion coef., 10 -6, C: 62 Moisture absorption, 24 hrs. @ 25C: 0.25 Heat distortion temperature, C: 65 Tensile strength, psi: 8,300 Flexural strength, psi: 16,000 Compressive strength, psi: 17,200 Dielectric strength, volt/mil: 420 Dielectric constant, 10 6 cps: 4.5 Dissiaation factor. 10 6 CDS: 0.03 Volume resistivity; ohm-cm: @ 25C: 10 14 8 1ooc: 10 11
Encapsulating, Potting, Casting, Impregnating Compounds
647
SYMPLASTICS INC.: SYMPOXY 1007-213A&B: Low viscosity, fast room temperature curing, very low toxicity epoxy system for potting/impregnation application SYMPOXY 1007-213 A&B is a two component, low viscosity system designed for the impregnation of wire wound devices, the potting of very small devices in potting cups, tubes, etc., the casting or encapsulation of small components or the impregnation of glass cloth. SYMPOXY 1007-213 A&B has the following advantages: Long pot life with fast cure Good thermal shock resistance Viscosity under 500 cps. High IR at 130C Low exothermic rise High operating temperature High gloss finish Almost non-toxic Excellent air release Good vacuum qualities Excellent chemical resistance Good substitute for aromatic Easy mixing ratio Amine based systems Typical Properties: Viscosity, mixed, cps (Clear): 480 Specific gravity, Part A/Part B: 1.16/1.10 Shelf life, mos. Part A/Part B: 12112 Mixing ratio, pbw, Part A/Part B: 100/45 Recommended Cure Schedule, hrs. @ 25C: 16-24 8 65C: 2 Hardness, Shore D: 84 Weight loss, 7 days 8 IOOC, %: 0.50 Thermal expansion, in/in, C: 30 x 10 -5 Water absorption, 24 hrs. @ 25C, %: 0.05 Tensile strength, psi @ 25C: 10,000 Dielectric strensth IVolt/mil): 420 Dielectric constant:‘1 MHZ 8 25C: 4.20 Dissipation factor: 1 MHZ 8 25C: 0.005 Volume Resistivity, ohm-cm: @ 25C: 2.5 x 10 15 @ 1OOC: 1.8 x 10 11
648
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1007-728 and 1350-728: Highly flexible epoxy systems for potting/casting/impregnating applications SYMPOXY 1007-728: This highly flexible system is excellent for the impregnation of wire wound devices or the potting of small potting cups. Excellent moisture and chemical resistance. Has excellent thermal shock resistance. Room temperature cured or by applying low heat. SYMPOXY 1350-728: This system is an undiluted hiqhlv filled system for the potting or casting of large parts and may be used in conjunction with 1007-728 as in the impregnation and potting of transformers, etc. Good thermal shock resistance. Both systems may be used as a thin or thick adhesive for metal/metal, metal/plastic, etc. 1007-728 A&B: Viscositv. _. CDS.. . . Part A/Part B: 500/12.000 Mixed: 3708 ’ Mixinq Ratio, parts by weight: lOO/lOO Pot Life, 100 grams, minutes: 100-120 Cure schedule, hrs. @ 25C (78F): 24 hrs. @ 65C (149F): 3 Heat distortion temperature, C: 110 Hardness, Shore A: 70/65 Tensile shear strength, psi @ 25C: 3885 Shrinkage, in/in.: 0.0025 Thermal expansion, cm/cm/C: 65 x 10 -6 Dielectric strength (Volt/mill: 470 Dielectric constant, IMHz @ 25C: 4.25 Dissipation factor, 1MHz @ 25C: 0.015 Volume resistivity, ohms-cm 8 25C: 4.0 x IO 12 1350-728 A&B: Viscosity, cps., Part A/Part B: 52,000/12,000 Mixed: 38,000 Mixing Ratio, parts by weight: 100/50 Pot life, 100 grams, minutes: 60-75 Cure schedule, hrs. 8 25C (78F): 24 hrs. @ 65C (149F): 3 Heat distortion temperature, C: 130 Hardness, Shore D: 50 Tensile shear strenath. ~si a 25C: 2890 Shrinkage, in/in: O:OOiSb Thermal expansion, cm/cm/C: 42 x 10 -6 Dielectric-strength (Volt/mill: 450 Dielectric constant, IMHz @ 25C: 4.20 Dissipation factor, IMHz @ 25C: 0.02 Volume resistivity, ohms-cm @ 25C: 2.8 x 10 12
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: SYMPOXY 1010 ABC: Low viscosity, high temperature resistant, impregnating/ laminating resin SYMPOXY 1010 ABC is a three component system for a shorter pot life and accelerated short cure schedule or it can be used as a two component system as a long pot life with longer cure schedule for impregnation tanks. SYMPOXY 1010 ABC is excellent for imwresnatins cawacitors. wire wound devices. transformers, fiberglass laminating etc. This system is ’ rigid with very high electricals to 200C. It has passed lO,OOO,OOO cycles of vibration testing from 10 to-15OG forces. Its adhesive qualities to metals are excellent. Typical Cured Properties: Viscosity, cps, mixed: 1,850 Specific gravity, mixed: 1.20 Shelf life, mos., Part A/Part B: 12/12 Mixing ratio, Part A to Part B, pbw: lOO/lOO Recommended cure schedule, hrs. Unaccelerated @ 125C to 15OC: 16 Accelerated @ IOOC: 6 @ 125C: 4 @ 15oc: 3 Hardness, Shore D: 93 Heat distortion temperature: 160 Weight loss, 500 hrs. @ 200C: .75 Thermal expansion, in./in. per C: 65 x 10 -6 Izod impact, in./in, of notch: .30 Moisture absorption: 168 hrs. @ 25C: .40 Tensile strength, psi: 10,500 Flexural strencth. wsi: 16.000 Compressive st;en&h, psi:'l8,000 Dielectric strength, (Volt/mil): 490 Dielectric constant, 10 6 cps: @ 25C: 3.20 @ 15oc: 4.50 Dissipation factor, 10 6 cps: @ 25C: -013 @ 15OC: -048 Volume resistivity, ohm-cm: @ 25C: 5.75 x IO 15 @ 15oc: 2.0 x 10 13 Insulation resistance, ohms: 8 25C: 3.9 x 10 15 @ 15oc: 1.0 x 10 13
649
650
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1OlOFR ABC: LOW viscosity, high temperature resistant, impregnating/ laminating resin SYMPOXY IOlOFR, ABC is a three component epoxy system similar to 1010 ABC except formulated for non-burn flame retardancy. Parts A & B, when mixed, have a long pot life and may be used for impregnation of transformers and other units which require large dipping tanks. When the accelerator is used, the system may be cured in a rather short time and can be used for applications such as pottinglcastingletc. This system has excellent adhesive qualities. Typical Cured Properties: Viscosity, cps, mixed: 3500 Shelf life, mos Part A/Part B: 12/12 Mixina ratio. obw. Part A/Part B: 100/50 Recommended Cure Schedule; hrs.: Unaccelerated @ 125C to 15OC: 24 Accelerated @ IOOC or 8 @ 125C or 6 @ 15oc 4 Hardness, Shore D: 83 Heat Distortion Temperature, C: 150 Weight loss, 500 hrs. @ 150C: 1.0 Thermal Expansion, in./in. per C: 85 x 10 -6 Moisture Absorption 168 hrs. @ 25C: -85 Flame Retardancy, ASTM D-635: Non-burn Tensile Strength, psi: 9500 Flexural Strenath. osi: 15.200 Compressive Strength, psi:.16,800 Dielectric Strength (Volt/mil): 470 Dielectric Constant, 10 6 cps. @ 25C: 3.30 8 ISOC: 4.80 Volume Resistivity, ohm-cm: @ 25C: 3.0 x 10 16 @ 15OC: 8.7 x 10 11 Insulation Resistance, ohms: @ 25C: 5.0 x 10 16 @ 150C: 6.4 x 10 11 Dissipation Factor, 10 6 cps.: @ 25C: -015 @ 125C: .062
Encapsulating, Potting, Casting, Impregnating Compounds
651
SYMPLASTICS INC.: SYMPOXY 1010-6 and 1010-803: Low viscosity, high impact, room temperature curing potting/ casting/impregnating systems SYMPOXY 1010-6 and 1010-803 are undiluted two Dart eooxv systems that are of a low viscosity, has excellent high‘glbss finish, CA-803 has low-boiling tendencies in a 200 gram mass, lons oot life with sood air release. The svstems were built for resistance to impact and thermal shock. There is improvement in microscopic cracking around leads of metal or plastic material extending from the casting. Both systems have good overall electrical and physical properties. CA-803 has lower exothermic temperatures in 200 masses and its cost is less than CA-6. For a more rigid material see 1010-28, higher heat resistance refer to 1010-56 or 1010-58 and if higher impact or flexibility is required refer to 1010-8. For a lower viscosity system with some sacrifice in properties refer to 1006-6 and 1006-803. CA-6: Components: 2 Shelf life, Part A/Part B, mos.: 12/6 Mixing ratios, Part A/Part B: 100/30 Viscosity, cps, Part A/Part B @ 25C: 12,000/20 I, Mixed: 600 11 Pot Life, min. 8 25C: 30 Shrinkage, %: .60 Heat distortion temperature, C: 65 Moisture absorption, %: 0.38 Hardness, Shore D: 78 Tensile strength, psi: 8,400 Flexural strensth. osi: 14.000 Compressive stren&th, psi:.l3,000 Izod Impact, ft. lb/in: 1.40 Dissipation factor, 10 6 cps: 0.052 Dielectric constant, 10 6 cps: 4.50 Dielectric strength: 450 CA-803: Comoonents: 2 Sheif life, Part A/Part B, mos.: 12/6 Mixing ratios, Part A/Part B: 100/30 Viscosity, cps, Part A/Part B @ 25C: 12,000/50 I, Mixed: 880 Pot life, min. 8 25C: 30 Shrinkase. %: .27 Heat distortion temperature, C: 80 Moisture absorption, %: 0.45 Hardness, Shore D: 72 Tensile strength, psi: 9,500 Flexural strength, psi: 15,000 Compressive strength, psi: 13,500 Izod Imoact. ft. lb/in.: 1.20 Dissipa&.on.factor,.lO 6 cps: 0.029 Dielectric constant, 10 6 cps: 4.10 Dielectric strength: 520
652
Adhesives, Sealants and Coatingsfor the Electronics Industy
SYMPLASTICS INC.: SYMPOXY 1010-35: Medium viscosity, rigid room temperature cured potting/ casting impregnation system with high temperature resistance SYMPOXY 1010-35 is a two component, 100% solids, rigid epoxy in clear or opaque, to be used for general potting/casting/ impregnating application requiring higher than normal temperature resistance and excellent chemical resistance. This system exhibits high rigidity and in cases of one inch or more in thickness a more flexible system should be used due to internal stress. Refer to 1010-804. Typical Properties: Components: 2 Pot life, min., 100 grams: 30 Specific gravity, Part A/Part B: 1.09 Mixing ratios, pbw, Part A/Part B: lOO/lO to 11 Viscosity, cps, Part A/Part B: 11,000/25 Mixed: 3,000 Hardness, Shore D: 80 Heat Distortion Temperature, C: 110 Linear shrinkage, %: 1.1 Moisture absorption, 24 hrs. @ 25C: 0.1 SYMPOXY 1010-809 A&B: Low viscosity, low cost, room temperature curing unfilled epoxy potting and casting system SYMPOXY 1010-809 A&B is a clear or colored low viscosity, 100% solids, long pot life system, designed for clear castings of l/8 inch to 3 inch thickness. These systems may be used in potting/casting/impregnating/etc. applications. 1010-809 cures to a high gloss finish and has good electrical properties. It has excellent physical characteristics such as hiah imnact resistance and aood thermal shock resistance. It may be colored as desired. SYMPOXY 1010-809 cures in 16-48 hours depending upon the thickness of the cast piece. Typical Properties: Mixing ratio, Part A/Part B: bv volume: 2 to 1 b; weight: 100 to 242 Mixed viscosity, cps.: 1400 to 1800 Hardness, Shore: D-82 Pot life, min., 100 grams: 45-50 Exotherm at gellation, 100 grams: 9OC Operating temperature, C: 90-125 Tensile strength, psi: 7600 Flexural strength, psi: 16300 Compressive strength, psi: 18500
Encapsulating, Potting, Casting, Impregnating Compounds
6.53
SYMPLASTICS INC.: SYMPOXY 1010-50 A&B, 4235-50 A&B and 4440-250 A&B: Heat cured, medium viscosity, semi-thixotropic and non-sag, rigid with thermal resistance to 15OC epoxy adhesive/sealant systems Three SYMPOXY systems designed for three different areas of application. All three have excellent adhesion, excellent thermal shock and ease of application. SYMPOXY 1010-50 A&B is for thin adhesive films where heavy run-off is not desirable. SYMPOXY 4335-50 A&B is semi-thixotropic and will have some run on vertical surfaces. This system can be used where metal slip fit type of application is used and some inter-flow is desirable. SYMPOXY 4440-50 A&B can be used where the adhesive is to be used on vertical surfaces and requires noflow whatsoever. This system is also good for mounting componentry within a container prior to potting or where good thermal conductance is required. These systems have a low toxicity curing agent. Typical Properties:
(Cured 2 hours @ 85C plus 1 hour @ 16OC):
1010-50: Viscosity, cps, part A/B: 12-13000/20 Mixed: 4,200 Mixing ratios, part A/B: 100/13 Pot life 100 grams, hrs. @ 25C: 2+ Specific gravities, Part A/B: 1.16/1.01 Cured color: white Hardness, Shore D: 88 Heat distortion temperature, C: 148 Thermal expansion coef, 10 -6, C: 42 4235-50: Viscosity, cps, Part A/B: Thixo/ZO Mixed: semi-thixotropic Mixina ratios. Part A/B: 100113 Pot life 100 grams, hrs. @ 25C: 2+ Specific gravities, Part A/B: 1.20/1.01 &red color: white Hardness, Shore D: 86 Heat distortion temperature, C: 148 Thermal expansion coef, 10 -6, C: 42 4440-50: Viscosity, cps, part A/B: Thixo/ZO Mixed: thixotrooic Mixing ratios, Part A/B: 100/S Pot life 100 grams, hrs. @ 25C: 1-2 Specific gravities, Part A/B: 1.75/1.01 cured color: tan Hardness, Shore D: 82 Heat distortion temperature, C: 535 Thermal expansion coef, 10 -6, C: 30
654
Adhesives, Sealants and Coatings for the Electronics Indmtty
SYMPLASTICS INC.: SYMPOXY 1010-74 A&B: Low viscosity, high temperature resistant, impregnating/ laminating resin SYMPOXY 1010-74 A&B is a two component, low viscosity, high temperature resistant epoxy system like SYMPOXY 1010 A,B,C except that Part B and (accelerator) Part C have been mixed together for the customer's convenience. This system is excellent for the impregnation of capacitors, transformers, fiberglass, etc. SYMPOXY 1010-74 A&B is rigid and has very high electricals to 200C. It's an excellent adhesive for metal to metal bonding. Typical Cured Properties: Viscosity, cps. mixed: 1,850 Specific gravity, mixed: 1.20 Mixing Ratio: Part A to Part B pbw: lOO/lOO Recommended cure schedule, hrs.: @ 1OOC: 6 or @ 125C: 4 or 8 15OC: 3 Hardness, Shore D: 93 Heat distortion temperature: 160 Weight loss, 500 hrs. @ 200C: .75 Thermal expansion, in./in. per C: 65 x 10 -6 Izod impact, in-/in. of notch: .30 Moisture absorption: 168 hrs @ 25C: -40 Tensile strength, psi: 10,500 Flexural strength, psi: 16,000 Compressive strength, psi: 18,000 Dielectric Strength (Volt/mil): 490 Dielectric constant, 10 6 cps: @ 25C: 3.20 @ 15oc: 4.50 Dissipation factor, 10 6 cps: @ 25C: .013 @ 150C: .048 Volume resistivity, ohm-cm: @ 25C: 5.75 x 10 15 @ 15oc: 2.0 x 10 13 Insulation resistance, ohms: @ 25C: 3.9 x 10 15 @
15oc:
1.0
x
10
13
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: SYMPOXY 1010-802 A&B: Low viscosity, room temperature curing, potting/casting/ impregnating/coating system SYMPOXY 1010-802 A&B is a two component system formulated for applications requiring low viscosity, good air release, good peel strength, excellent tensile shear strength and fast curing. This system is clear when mixed to observe penetration and air release, but becomes nearly opaque (milky white) when cured. Excellent svstem for adhering metals and riqid plastics, potting/casting small modules and the impregnation-of wire wound devices. SYMPOXY 1010-802 A&B has good thermal shock resistance and moderately high operating temperature. Typical Properties: Mixing ratio Part A/Part B: by volume: 2 to 1 by weight: 100 to 42 Mixed viscosity, cps @ 25C: 1700-2000 Hardness. Shore D: 80 Shelf life, mos. Part A/Part B: 12112 Pot life, min., 100 grams: 30-35 Operating temperature, C: 125 Tensile strength, psi: 7600 Flexural strength, psi: 18,200 Compressive strength, psi: 19,200 Tensile shear strensth. osi: Thin film after 24 hrs. @ 25C: 2800 after 48 hrs. @ 25C: 4000 after 30 day water immersion: 4250 Thermal shock resistance, C: -55 to 125 Izod impact: 1.01 Shrinkage in./in./C: .0009 Moisture resistance, %, 24 hrs. @ 25C: .08 Dielectric strength (Volt/mil): 475 Dielectric constant, 10 6 cps: 3.5 Dissipation factor, 10 6 cps: .020 Volume resistivity, ohm-cm: 3 x 10 14 Insulation resistance, ohms: @ 25C: 1.5 x 10 @ @
IOOC: 125C:
2.6 2.3
x x
10 10
14 11 9
655
656
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1010-807
A&B:
Low viscosity, low cost, room temperature curing, one to one mix ratio, unfilled, epoxy potting/casting system SYMPOXY 1010-807 A&B is a clear or colored low viscosity, 100% solid system, of low cost and has an easy one to one mixing ratio, by volume, designed for potting/casting and impregnating applications. This system develops hardness fast and cures to a high gloss finish in 16 to 48 hours depending on the mass cast. No blushing under high humidity. The system has good electrical and physical characteristics including high impact and thermal shock resistance. SYMPOXY 1010-807 A&B may be colored as desired. Typical Properties: Mixing ratio, Part A/Part B: by volume: 1 to 1 by weight: 100 to 83 Mixed viscosity, cps.: 2700-3000 Hardness, Shore: D-76 Pot life, min., 100 grams: 20-30 Exotherm at gellation, 100 grams, C: 65 Operating temperature, C: 90-125 Tensile strength, psi: 6,300 SYMPOXY
1010-812
A&B:
Medium viscosity, clear, high hardness, epoxy potting/casting/ impregnation/coating system SYMPOXY 1010-812 A&B is a two component, 100% solids, medium viscosity system specifically designed for decoupage applications including boxes, pictures, etc. using the float process. This system can also be used in impregnation of coils, transformers, capacitors (except polycarbonate dielectric), etc. and may be used to Dot or cast same. Its dielectric strensth is hioh. with good insulation resistance and dissipation facfor at 10&J: SYMPOXY 1010-812 A&B may be colored, has excellent air release, good fast hard gellation time in thin films, excellent flow characteristics and remains clear and hard under low heat. rpical Properties: Mixing ratios, Part A/Part B: by volume: lOO/lOO by weight: 100/83 Mixed viscosity, cps.: 6,500 Pot life, min., 100 gram mass @ 72F: 25-28 8 80F: 22-25 Gellation time (handable strength) hrs.: 4-6 hard gellation: 16-24 Hardness, Shore D: 90 Operating temperature, C: 100 Tensile strength, psi: 8,600
Encapsulating, Potting, Casting, Impregnating Compounds
657
SYMPLASTICS INC.: SYMPOXY IO15 A&B: Very low viscosity high temperature impregnate for coils, transformers, etc. SYMPOXY 1015 A&B is a very low viscosity, two part 100% solids, resin system designed for maximum impregnation of all windings or tight circuitry casting. SYMPOXY 1015 has long pot life coupled with a short curing schedule for faster production. Excellent thermal shock resistance with low shrinkage, very high electricals make SYMPOXY 1015 an all purpose low viscosity system for small castings or windings. Typical Properties: Components: 2 Viscosity, cps. Part A/Part B: 4,000/200 Mixed: 200 Color: Clear Mixing Ratios by weight, Part A/Part B: 4 to 3 Cure Schedule, hrs. @ IOOC or 8-10 @ 125C or 6-8 (a 15oc 3 Hardness, Shore D: 82 Weight loss, 24 hrs. 8 200C %: 0.5 1,000 hrs. 8 200C %: 1.3 SYMPOXY 1064-561 A&B: Low viscosity, high temperature resistant epoxy system SYMPOXY 1064-561 A&B is a low viscosity epoxy resin system for small potting/casting or impregnation applications where initial gellation can be made at room temperature or low heat (ie. 65C) and then oost cured for higher heat resistance. This allows for lower shrinkage due to the-lower exotherm of the system. The low viscosity of A&B makes mixing easy. This system has excellent thermal resistance, water and chemical resistance. An excellent all around system for small applications. Typical Properties: Viscosities, cps. Part A/Part B: 1700/1100 Mixed: 1500 Pot life, 100 grams @ 25C, min.: 30 Hardness, Shore D: 88 Heat distortion temperature, C: 130 Water absorption, 24 hrs/25C, %: 0.08 Tensile strength, psi: 11,000 Tensile elongation, %: 3 Flexural strength, Volt/mil: 16,000 Dielectric strength, I MHZ: 425 Dielectric constant, 1 MHZ: 3.8 Dissipation factor, I MHZ: 0.015 Volume resistivities, ohm-cm @ 25C: 10 15 @ 13oc: IO II
658
Adhesives, Sealants and Coatingsfor the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1064-809A&B Low viscosity, low cost, room temperature curing unfilled epoxy potting and casting system SYMPOXY 1064-809A&B is a clear or colored low viscosity, 100% solids, long pot life system, designed for clear castings of l/8 inch to 3 inch thickness. These systems may be used in potting/casting/impregnating/etc. applications. 1064-809 cures to a high gloss finish and has good electrical properties. It has excellent physical characteristics such as high impact resistance and good thermal shock resistance. It may also be colored as desired. SYMPOXY 1064-809 cures in 16-48 hours depending upon the thickness of the cast piece. Typical Properties: Mixing ratio, Part A/Part B: by volume: 2 to 1 by weight: 100 to 42 Mixed viscosity, cps: 600 to 800 Hardness, Shore: D-82 Pot life, min., 100 grams: 45-50 Exotherm at gellation, 100 grams: 9OC Operating temperature, C: 90-125 Tensile strength, psi: 7600 Flexural strength, psi: 16300 Compressive strength, psi: 18500 SYMPOXY 1225-35: Two component, potting and casting system SYMPOXY 1225-35 is a two component, filled, rigid, room temperature curing potting and casting system. This system has a very low viscosity for excellent penetration of componetry and air release. SYMPOXY 1225-35 is designed for small castings under 100 grams where long pot life and fast cure are desirable. Adhesion to most metals and plastics are good, moisture and chemical resistance is excellent and this system has good heat resistance to 125C. Typical Characteristics: Components: 2 Specific gravity, Part A: 1.60 Part B: 0.99 Viscosity (unmixed), cps: 4,300 Pot life, minutes, 100 grams: 30 Hardness, Shore D: 85 Elonsation. %: 2.5 Heat-distortion temperature, C: 91 Water absorption, 24 hours @ 25C: 0.04 2 hours @ IOOC: 0.30 Tensile strength, psi: 9,100 Flexural strength, psi: 21,000
Encapsulating, Potting, Casting, Impregnating Compounds
659
SYMPLASTICS INC.: SYMPOXY 1225-20: A two component, filled, thermal shock resistant casting system SYMPOXY 1225-20 is a filled, medium viscosity system for positive curing within a short period at room temperature to maximum hardness. Volumetric measuring is possible with this system as it is less critical than most other systems. SYMPOXY 1225-20 exhibits good thermal shock properties along with low shrinkage, high tensile and flexural strengths. This system is excellent for small to medium size potting or castings. This system has passed thermal shock tests from -70C to 200C after a post cure of 2 hours @ 15OC. For unfilled version refer to SYMPOXY 2810. Typical Characteristics (cured 24 hours @ 25C plus 2 hours @ 15ocj: Components: 2 Viscosity, mixed, cps: 2,500 Dielectric constant, 10 10 cps: 4.50 Dissipation factor, 10 10 cps: 0.01 Dielectric strength, volts/mil: 440 Volume resistivity (ohm-cm) @ 25C: 1.0 x 10 14 Compressive yield, psi: 12,800 Tensile ultimate, psi: 9,000 Flexural modulus, psi: 2.9 x 10 5 SYMPOXY 1225/85: Two component, low viscosity, resilient casting system SYMPOXY 1225/85 is a two component, low viscosity, long working life casting compound. This system affords easy, non-critical, mixing with good resiliency for large castings. It is a filled system for low shrinkage and good thermal shock qualities of IOOC. The exotherm of SYMPOXY 1225185 in a 100 gram mass is less than 40C (104F). SYMPOXY 1225185 is a minimum irritation system. This system is excellent for castings of 4,000 grams or more with very little shrinkage and internal stress protecting delicate embedded componentry. Typical Characteristics (Cured 16 hours @ 25C plus 2 hours @ loot): Components: 2 Mixed viscosity, cps: 1875 Dissipation factor, to 10 10 cps: 0.025 Dielectric constant, to 10 10 cps: 3.80 Volume resistivity (ohm-cm) @ 25C: 7.0 x IO 14 @ 70C: 2.3 x IO 11 @ 1ooc: 1.9 x 10 9 Hardness, Shore D: 75 Ultimate tensile strength, psi: 7,500 Tensile elongation, %: 6.0 Izod impact (ft/lb/in. of notch): 0.60
660
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1225FR-284: Room temperature cured, flame retardant, filled, epoxy potting/casting system SYMPOXY 1225FR-284 is a filled epoxy system designed for the potting or casting of small modules such as capacitors, transformers, filters, etc. requiring fast room temperature cure or gellation in thin films of 1/8th inch up to 2 inches. High gloss gellation is attained in 2 to 3 hours to a hardness where further handling or post curing is required. Fast turn over on racked wrap and fill capacitors speeds up production over 2 fold from commonly used hardeners. This system has superior electricals, especially IR. Exceptionally good impact strength and thermal shock is attained from this high heat distortion, rigid, system. Tvoical Prooerties: --Mixed viscosity, cps: 5200 Pot life, 100 grams, min. @ 25C: 25 Specific gravity, mixed: 1.38 Mixing ratio, Part A/Part B: 100/14 Gellation, hrs., in 118th thickness: 2-3 Hardness, Shore D: 82 Tensile strength, psi: 10,500 Tensile elongation, %: 4.5 Heat distortion temperatures, C: 105 Thermal conductivity: 3.7 SYMPOXY 1225FR-803: Low viscosity, small mass, high gloss, flame retardant epoxy potting/casting system SYMPOXY 1225FR-803 is a filled, two component, low viscosity, room temperature curing system that was designed for maximum penetration of componentry in small potting cups or capacitor end filling. Excellent air release in small masses, low exotherm (non-boiling in 100 gram mass), high gloss assurance when potting in high humidity conditions, good resistance to mechanical or thermal shock at moderate temperature, excellent adhesion to mylar and metal and above average dielectric strength are the primary formulated qualities of this system. Typical Properties: Components: 2 Specific Gravity, Part A/Part B: 1.48/.96 Mixed: 1.42 Viscosity, cps. - Part A/Part B: 6,500/50 Mixed: 1,750 Exotherm, 100 gram mass, C, at gellation: 80 Pot Life, 100 grams 8 25C, min.: 45-60 Hardness, Shore D: 81 Water Absorption, 24 hrs. @ 25C, %: 0.20 Heat Distortion Temperature, C: 75
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: SYMPOXY 1230-56 Small Potting Applications:
A&B and
1282-56
661
A&B for
Low viscosity, general and flame retardant, high temperature resistant, epoxy resin system for small potting applications SYMPOXY 1230-56 A&B and 1282-56 A&B are low viscosity systems capable of operating at 15OC after a short post cure. The main application requirements that these two systems meet are high heat resistance, excellent moisture and chemical resistance, high electrical properties to 15OC and excellent adhesion to plastic or metal containers. SYMPOXY 1230-56 A&B is for general usage and 1282-56 A&B is for applications requiring flame retardancy to meet UL94-VO. 1230-56 A&B: Mixing ratios, pbw, Part A/Part B: 100/12 Pot life, 100 grams @ 25C, hrs.: 8+ Specific gravity, Part A/Part B: 1.45/1.08 Viscosity, cps., Part A/Part B: 3,600/900 Mixed: 1,850 Hardness, Shore D 8 25C: 92 Moisture absorption, 24 hrs. @ 25C: 0.20 Tensile strength, psi: 11,500 Tensile elongation, %: 7.2 Flexural strength, psi: 19,000 Weight loss, 24 hrs. @ 15OC, %: 0.18 Dielectric constant, 1 MHZ @ 25C: 4.37 Dissipation factor, IMHZ 8 25C: 0.033 Volume resistivity, ohm-cm @ 25C: 2.6 x 10 15 @ 150C: 3.8 x 10 10 1282-56
A&B: Mixing ratios, pbw, Part A/Part B: 100/18 Pot life, 100 grams @ 25C, hrs.: 8+ Specific gravity, Part A/Part B: 1.20/1.08 Viscosity, cps., Part A/Part B: 1,900/900 Mixed: 1,200 Hardness, Shore D 8 25C: 91 Moisture absorption, 24 hrs. @ 25C: 0.24 Tensile strength, psi: 11,200 Tensile elonsation. %: 7.1 Flexural strength,.psi: 19,500 Weight loss, 24 hrs. @ 15OC, %: 0.23 Dielectric constant, 1 MHZ @ 25C: 4.20 Dissipation factor, 1 MHZ 8 25C: 0.033 Volume resistivity, ohm-cm 8 25C: 1.4 x 10 15 @ 15OC: 6.0 x 10 9
662
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 12301284 Potting/Casting High gloss electrical potting/casting
System:
system
SYMPOXY 1230/284 is a two component, room temperature cure, potting/casting resin system that is specifically designed for capacitor end filling and small mass potting or casting applications where high gloss must be retained even under application of heat after cure. This system has withstood 1,000 hours @ 125C without loss of gloss. After 1,500 hours @ 125C the IR has improved almost two fold. SYMPOXY 1230/284 has excellent air release with no boiling tendencies in a 100 gram mass. Immediate compatibility and low alkalinity (non-carbonate) features insure high gloss, sweat-out free surfaces even when cured under 96% R.H. Gel times to handling strength in l/8 inch section is less than three hours. This system has excellent electrical and physical characteristics. Typical Characteristics: Components: 2 Pot life, 100 crams 8 25C. min.: 25 Specific.gravify, A: 1.48. Specific gravity, B: 1.10 Viscosity-(mixed), cps: 3,900 Dielectric strength (Volt/Mil): 445 Dielectric constant to 10 6 cps: 3.22 Dissipation factor to 10 6 cps: 0.025 SYMPOXY 1230-561 Potting/Casting
System:
Room temperature gelling, heat resistant, epoxy potting/ casting system SYMPOXY 1230-561 is a two component, filled, room temperature curing epoxy system designed for good thermal shock resistance, excellent adhesion to metals and long term heat stability at operating temperatures of 325F with short term or intermittently exposure to 450F. SYMPOXY 1230-561 should be allowed to gel overnight at room temperature. In many cases this is sufficient if allowed to cure overnight. Longer cure times should be allowed if applied in small masses. For higher heat distortion temperatures and maximum heat resistance, post cures as stated below, should be used. Excellent dimensional stability is maintained, after gellation, during elevated temperature post curing. A low temperature initial cure of 1 hour at 167F may be used in small masses rather than the room temperature cure. Typical Characteristics: Viscosity, mixed, 25C, cps: 4,200 Mixing ratio, by weight, A/B: 100/12 Standard color: Black Specific gravity, A/B: 1.54/1.15 Pot life, 100 grams to 450 grams, min.: 35/20
Encapsulating, Potting, Casting, Impregrdng
SYMPLASTICS INC.: SYMPOXY 1230-803 Low viscosity, small mass,high
Compounds
663
Potting System: gloss potting system
SYMPOXY 1230-803 is a filled, two component, low viscosity, room temperature curing system that was designed for maximum penetration of componentry in small potting cups or capacitor end filling. Excellent air release in small masses, low exotherm, non-boiling in 100 grams mass, high gloss assurance when potting in high humidity conditions, good resistance to mechanical or thermal shock at moderate temperature, excellent adhesion to mylar and metal and above average dielectric strength are the primary formulated qualities of this system. This system is not good for polycarbonate films. Typical Properties: Components: 2 Specific gravity, mixed, Part A/Part B: 1.42/.96 Viscosity, cps, Part A/Part B: 6,500/50 Mixed: 1,750 Exotherm, 100 grams mass, C, at gellation: 80 Pot life. 100 crams a 25C. min.: 45-60 Hardness; Shore D: 8i . Water absorption, 24 hrs. @ 25C, %: 0.20 Heat distortion temperature, C: 75 SYMPOXY 1230-201 A&B Potting/Casting System: Low viscosity, fast curing, thermal shock resistant epoxy potting/casting system for small cups and capacitor end filling. SYMPOXY 1230-201 A&B is a two component system designed for thermal shock resistance and fast gellation/curing when used in small potting cups or wrap and fill capacitor end filling. This system will not work on polycarbonate films. [Refer to SYMPOXY 1010-6 A&B (unfilled) or SYMPOXY 1250-6 (filled) for thermal shock resistant system for polycarbonate films.1 SYMPOXY 1230-201 A&B has excellent thermal shock from -70C to 15OC. The system cures to a hard high gloss finish and has excellent adhesion to plastics and metals. Typical Properties: Mixing ratio, pbw part A/Part B: 100/30 Specific gravity, mixed: 1.28 Viscosity, cps. Part A/Part B: 6,500/2,200 Mixed: 4,800 Pot life, 100 grams, min. 8 25C: 20-30 Gellation. hrs. @ 25C. l/8 in. tk.: 1 l/2-2 Hardness,.Shore D: 88. Thermal shock resistance, C: -70 to 150 Moisture absorption, %, 24 hours 8 25C: .20 Tensile strength, psi: 9,600 Flexural strength, psi: 14,800 Dielectric strength-(Volt/mil): 390 Dielectric constant, 1 MHZ @ 25C: 3.0
664
Adhesives, Sealants and Coatings for the Electronics Irzdzutry
SYMPLASTICS INC.: SYMPOXY 1250 Potting/Casting Low viscosity, filled, epoxy potting/casting
Resin: resin
SYMPOXY 1250 series when used with the following curing agents, displays excellent electricals, selection of operating temperatures, pot lives and curing schedules and when cast may easily be machined. SYMPOXY 1250-6: This is a room temperature curing system that displays excellent resistance to impact and thermal shock. Its low viscosity makes 1250-6 a natural for potting or casting requirements. The system has good flow and air release and good adhesion to vinyl or neoprene lead materials. Microscopic cracking around leads is largely eliminated. SYMPOXY 1250-803: 1250-83 is similar to 1250-6 above but has slightly better electricals at temperatures to 13OC and far better air release. Its pot life is shorter and in a 114" thickness displays much faster qellation. Same high impact strength and good adhesion. Lower cost than 1250-6. SYMPOXY 1250-561: Room temperature/heat cured combination for high operating temperatures to 15OC. Pot life of 35 minutes allows room temperature gellation of cast parts then step cured under heat for very low shrinkage and high heat stability. Good thermal shock in small castings and low exotherm. SYMPOXY 1250-56: Heat cured system for high heat stability to 18OC operational temperatures. Short step cu;e for larger masses with a-long pot life. This system displays excellent electricals at 15OC. Excellent moisture resistance. This system is used to encapsulate resistors and coils that require high heat distortion tempereratures. Large masses over 2" thick should be gelled at room temperature then post cured. 1250-6: Mixing Ratio, Part A/Part B: By Weight: 100/15 Standard color: Tan/Black Viscosity, cps, Part A/Part B: 38,400/20 Mixed: 6,000 Soecific Gravitv. Part A/Part B: 1.55/1.01 Pot Life, Min.,-iO0 Grams: 80 Gellation, Hrs., 118th Film: 6 Recommended Cure, Hrs. @ 25C: 16 or Hrs. @ 65C: 2 Hardness, Shore: D-82 Heat Distortion Temp., C: 70 Thermal Expansion, Per C x IO -6: 40 x 10 -6 Thermal Conductivity: 3.2
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS, INC.: SYMPOXY 1250 Potting/Casting Resin (Continued): 1250-803: Mixing Ratio, Part A/Part B: By Weight: 100/15 Standard Color: Tan/Black Viscosity, cps, Part A/Part B: 38,400/50 Mixed: 6;700 Specific Gravity, Part A/Part B: l-55/1.01 Pot Life, Min., 100 Grams: 30 Gellation, Hrs., 1/8th Film: 4 Recommended Cure, Hrs. @ 25C: 16 or Hrs. 8 65C: 2 Hardness, Shore: D-85 Heat Distortion Temp., C: 95 Thermal Expansion, Per C x 10 -6: 38 x 10 -6 Thermal Conductivity: 3.2 Izod Impact, Ft. Lb/In of Notch: 0.46 Moisture Absorption, %: Hrs. @ 25C: 0.22 1250-561: Mixing Ratio, Part A/Part B: By Weight: lOO/lO Standard Color: Tan/Black Viscosity, cps, Part A/Part B: 38,400/100 Mixed: 8,000 Specific Gravity, Part A/Part B: 1.55/1.02 Pot Life, Min., 100 Grams: 35 Gellation, Hrs., 1/8th Film: 8 Recommended Cure, Hrs. @ 25C: 16+ Hrs. @ 65C: l+ Hrs. 8 150C: 2 Hardness, Shore: D-89 Heat Distortion Temp., C: 122 Thermal Expansion, per C X 10 -6: 37 x 10 -6 Thermal Conductivity: 3.5 Izod Impact, Ft. Lb./In. of Notch: 0.35 Moisture Absorption, %: Hrs. @ 25C: 0.15 1250-56: Mixing Ratio, Part A/Part B: By Weight: lOO/ll Standard Color: Tan/Black Viscosity, cps, Part A/Part B: 34,800/150 Mixed: 6,200 Specific Gravity, Part A/Part B: 1.55/1.01 Pot Life, Min., 100 Grams: 8 hrs. Recommended Cure, Hrs. @ 25C: 1 hr. @ 85C+ Hrs. @ 65C: 3 hrs. @ 150C Hardness, Shore: D-88 Heat Distortion Temp., C: 150 Thermal Expansion, Per C x 10 -6: 38 x 10 -6
665
666
Adhesives, Sealants and Coatings for the Electronics Industy
SYMPLASTICS INC.: SYMPOXY 1250-50 A&B and 1350-50 A&B: General purpose, medium viscosity, low toxicity, high temperature resistant epoxy potting/casting systems SYMPOXY 1250-50 and 1350-50 are almost identical systems. SYMPOXY 1250-50 is silica filled while 1350-50 is a machinable version. Both are high heat resistant, heat cured systems. CA-SO, curing agent, does not contain MDA, MPDA or cycloaliphatic materials therefore they have a low toxicity rating being non-carcinogenic and have low corrosiveness to the eyes and skin. When cured 2 hours at 85C plus 1 hour at 16OC, these systems develop glass transition temperatures of 146C. It has superior moisture and chemical resistance to MDA, MPDA and cycloaliphatic curing agents. It takes less curing agent to cure therefore increasing the systems thermal conductance and lowering the thermal expansion properties. Curing Agent 50 does not stain the hands, does not carbonate and cures to a high gloss finish. Mixing ratio, Part A/Part B, pbw: 10017 Viscosity, cps., Part A/Part B: 50-60,000/20 Mixed: 12,000 Pot life, hrs. @ 25C: 2-3 Recommended cure, hrs. @ 85C: 2 plus hrs. 9 16OC: 1 Hardness, Shore D: 92 Coef. of thermal expansion (IO -6): 34 SYMPOXY 1250-213 A&B Potting/Casting
System:
Low viscosity, low toxicity, filled, room temperature curing, epoxy potting/casting system with high heat resistance for small potting applications. SYMPOXY 1250-213 A&B is a two component system formulated for excellent heat resistance to 13OC via room temperature curing. This system has high rigidity, develops a high gloss finish, has excellent air release and should be used in masses below one inch in thickness. Its pot life is rather short (i.e. 15 minutes) but it hard gels in a 118th inch thickness in 1 to 1 l/2 hours. May be used in potting/casting small modules where heat resistance is required but thermal shock resistance is not an application requirement. Mixing ratios, pbw, Part A/Part B: 100/22 Pot life, mins., 100 grams: 12-15 Specific gravity, Part A/Part B: 1.60/1.08 1.44 Viscosity, cps. @ 25C Part A/Part B: 65,000/400 Mixed: 14,500
Encapsulating, Potting, Casting, Impregnating Compounds
667
SYMPLASTICS INC.: SYMPOXY 1273-72 A&B Adhesive/Sealant: Pourable epoxy adhesive/sealant for sealing ill fitting container terminals. Filled, two component, room temperature curing, adhesive/sealant for sealing ill fitting terminals in container before potting same. This system has excellent thermal conductivity, pourable with excellent self leveling qualities. SYMPOXY 1273-72 has excellent moisture resistance, low exothermic reaction, excellent adhesion, and meets the thermal shock requirements of Mil I-169236. Typical Properties: Comnonents: 2 Viscosity, mixed, cps.: 27,000 Specific gravity, mixed: 1.48 Pot life,.quart; hrs.: 2 l/2 Hardness, Shore D: 02 Heat Class: A Standard color: grey Gellation temp., l/2 gallon, F: 180 Linear shrinkage @ 25C: in/in/F: 0.001 Thermal Shock, -55C to 155C: Passed SYMPOXY 1273-20 Epoxy Sealant and Potting Compound: SYMPOXY 1273-20 is a two component, filled, sealant and potting system with excellent thermal conductivity. This system has a medium pot life with an overnisht cure at room temperature or a fast cure at moderate temperatures. 1273-20 A&B will meet Mil-1-16923-B thermal shock tests. Typical Characteristics: Components: 2 Viscosity (mixed), Brookfield, cps: 27,000 Leveling- Excellent Specific gravity: 1.48 Pot life, 1 quart, hrs.: 2 l/2 Pourability: Excellent Color: Black Dielectric strength, (Volt/mil): 450 Dielectric constant to 10 6: 3.0 Dissipation factor to 10 6: .057 Volume resistivity, ohm-cm: 1.3 x 10 14 Hardness, Shore D: 82 Thermal shock. Mil-I-16923-B: Passed Heat class: A' Linear shrinkage @ 75F: in-/in. F: 0.001 Temperature at gellation, F: l/2 gallon (6#): 180
668
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1281-284
A&B and
1281-9
A&B:
Low viscosity, low toxicity, rigid, clear flame retardant epoxy resin system for potting/coating applications SYMPOXY 1281-284 A&B and 1281-9 A&B are temperature resistant systems to 13OC, have good air release in thin films, cure at room temperatures to good high gloss finishes and have a slight amber tone to a clear coat. Both are of low viscosity and meet or exceed UL 94-VO flame retardancy requirements. Both are used for circuit board encapsulation or small CUD wottins awwlications. SYMPOXY 1281-284-A&B is a fast gellation system in thin films (i.e. l-l l/2 hrs.) and has excellent IR while SYMPOXY 1281-9 A&B has a longer pot life and corresponding longer gellation in thin films. This system develops lower exotherm and very low shrinkage. 1281-284 A&B: Mixing ratios: Part A/Part B: 100/22 Pot life, min., @ 25C, 100 grams: 12-15 Viscosity, cps; Part A/Part-B, @ 25C: 3600/4200 Mixed: 3800 Hard gellation, hrs. 8 25C, 1/8th in. tk.: l-l l/2 Hardness. Shore D: 90 Operational temperatures, C: 130 Moisture absorption, 24 hrs. 8 25C, %: 0.10 Tensile strencth. wsi: 10,500 Flexural strength,‘psi: 18,400 Dielectric strength, Volt/mil: 400 Dielectric constant, IMHZ: 3.5 Dissipation factor, IMHZ: 0.021 Volume resistivity, ohm-cm 8 25C: 4.8 x 10 15 1281-9
A&B: Mixing ratios: Part A/Part B: 100/22 Pot life, min., 8 25C, 100 grams: 30-35 Viscosity, cps, Part A/Part B, 8 25C: 3600/400 Mixed: 1800 Hard gellation, hrs. @ 25C, 18th in. tk.: 2-3 Hardness, Shore D: 88 Operational temperatures, C: 130 Moisture absorption, 24 hrs. 8 25C, %: 0.12 Tensile strength, psi: 9,800 Flexural strength, psi: 16,200 Dielectric strength, Volt/mil: 380 Dielectric constant, IMHZ: 3.7 Dissipation factor, 1MHZ: 0.037 Volume resistivity, ohm-cm @ 25C: 6.1x10 15
Encapsulating, Potting, Casting, Impregnating Compounds
669
SYMPLASTICS INC.: SYMPOXY 1282-201 Potting/Casting/Impregnating Applications: LOW cost, two component, low viscosity, non-burn flame retardant epoxy system for potting/casting/impregnating applications SYMPOXY 1282-201 is a two component, 100% solid flame retardant system that meets or exceeds the flame retardant requirements of Mil I-16923E, ASTM-84E, ASTM D-635 and UL 723. System 1282-201 is of low cost, low mixed viscosity and when cured, exhibits low smoke density, no burn through, no surface spalling and is nonburning. Although 1282-201 is a rigid system, it has good thermal shock qualities, excellent chemical and moisture resistance and good electricals. Mixed viscosity, cps.: 1400 Pot life, 100 grams, min.: 45 Standard color: Black Specific gravity, mixed: 1.15 Recommended cure @ 25C, hrs.: 24 @ 65C, hrs.: 2 Hardness, Shore D: 82 Heat distortion temp., C: 110 Thermal expansion, per C, 10 6: 56 Moisture resistance, hrs. @ 25C/%: 24/0.2 SYMPOXY 1279FR-284 A&B Potting/Casting Applications: Low viscosity, excellent flow and air release, flame retardancy to UL 94-VO fast curing epoxy system for small to medium potting/casting applications. SYMPOXY 1279FR-284 was formulated for excellent air release, excellent flow in and around tight componentry in potting cup applications, capacitor end fill, etc., where maximum air release and flow are required. This system contributes the following properties: Excellent flow Excellent filler suspension Excellent air release Excellent electricals to 13OC Low viscosity Fast hard gellation and cure Excellent resistance to gasohol and Skydrol High gloss finish Tg's of 105C Excellent moisture resistance Flame retardancy to UL94-VO This system is excellent for obtaining hard gellation in 15-20 minutes in a thin film under heat. For a similar system that does not require flame retardancy, refer to SYMPOXY 1235-284 A&B. Viscosity, cps, Part A: 3600-4000/Part B: 1200-1400/ Mixed: 2400-2800 Mixing ratio, Part A/Part B: 100/17 Pot life, 100 grams, minutes: 14-15 Hard gellation, thin film @ 25C: 2-3 hrs. Specific gravity, A/B: 1.36/1.10 Hardness, Shore D: 86 Color stability @ 13OC: Excellent Moisture absorption, 24 hrs 25C: .032
670
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1282-284 End Fill Epoxy System: Fast, flame retardant, capacitor end fill epoxy system SYMPOXY 1282-284 is a two component, filled, 100% solids epoxy system that is non-burning to ASTM D-635 and qualifies to the UL Flame Tunnel Test with a flame spread rating of 35 and no afterburn. This svstem has a low heisht of flame, is non driDDing, cracking and-has shown no surface spalling or burn thro;gh. SYMPOXY 1282-284 also has a very low smoke density. This has excellent filler suspension with excellent air release on room curing. SYMPOXY 1282-284 is rigid and has excellent electricals and physicals to 150C. Its IR, measured over 1,000 hrs. at 13OC, increases rather than showing a drop. Excellent all around flame retardant system for small potting and casting applications. Typical Properties: Viscosity, mixed, cps.: 2300 Pot life, 100 gram mass @ 25C, min.: 15 Gellation in 1/4th inch thickness, min.: 60-90 Hardness, Shore D: 92 Water absorption, 24 hrs. @ 25C, %: 0.10 Tensile strength, psi: 13,500 Tensile elongation, %: 5 Flexural strength, psi: 22,000 Heat distortion temperature, C: 110 SYMPOXY 1282-561 Potting/Casting
System:
Low viscosity, flame retardant, high temperature resistant, epoxy potting/casting system SYMPOXY 1282-561 is a two component, 100% solid epoxy system that gels at 25C and has a short post cure for maximum properties. 1282-561 is non-burning to UL-94, ASTM-D635, and meets MIL I-16923 requirements. Its low viscosity enables good penetration around componentry and very low shrinkage. With step post curing, heat resistance to 150C can be obtained. Its low cost, low viscosity, flame retardancy and heat resistance makes 1282-561 a prime candidate for most potting and casting applications. Typical Properties: Mixed viscosity, cps: 3,000 Pot life, 100 crams B 25C. min.: 35 Hardness; Shore D: 88 . Water absorption, 24 hrs./25C, %: 0.08 Tensile strensth. osi: 10.800 Tensile elongation; %: 3 . Flexural strength, psi: 16,000 Comnressive strensth. osi: 18,000 Heat distortion temperature Cl 130 Flame retardancy, ASTM-D-635: passed MIL-I-16923: passed UL-94: vo Dielectric strength, Volt/mil: 425
Encapsulating, Potting, Casting, Impregnating Compounds
671
SYMPLASTICS INC.: SYMPOXY 1282-803 Potting/Casting/Impregnating system: Non-burning to UL94, low viscosity, high impact strength epoxy potting/casting/impregnating system SYMPOXY 1282-803 is a two component, room temperature curing, filled, low viscosity, 100% solids system that has a non-burn rating when tested under ASTM D-635, ASTM D-229 and will pass UL94-VO testing. Being low in viscosity, it may be used as an impregating resin for coils, windings, etc. Very good impact strength is attained with this resin, although it is a rigid system. SYMPOXY 1282-803 exhibits the lowest ratings in smoke density, no burn through, surface spalling, cracking or dripping so it may be used in compenentry designed UL approval. For higher heat distortion and higher thermal limits, refer to SYMPOXY 1282-56 or 1282-561. Components: 2 Viscositv. mixed CDS.: 800 Specific-gravity, mixed: 1.20 Pot life, 100 gram mix @ 25C, min.: 25-30 Hardness, Shore D: 88 Water Absorption 24 hrs. 8 25C: 0.15 Chemical Resistance: excellent Tensile Strength, psi: 10,500 SYMPOXY 1282-2213
A&B Potting/Casting
System:
Low viscosity, thermal shock resistant, R.T. curing, flame retardant epoxy potting/casting system for small applications SYMPOXY 1282-2213 A&B is a very low viscosity system designed for small potting cups, where good penetration in and around tight componentry is required. This meets the rigid requirements of UL 94-VO where low smoke generation and non dripping is required. SYMPOXY 1282-2213 A&B has excellent thermal shock resistance and has good air release with a room temperature cure. Along with good moisture resistance this system has excellent chemical resistance. Mixing Ratios, pbw, Part A/Part B: 100/40 Pot life, min., 100 grams mass: 45-60 Viscosity, cps, @ 25C Part A/Part B: 1900/800 Mixed: 1500 Specific gravity, Part A/Part B: 1.20/1.01 Mixed: 1.12 Hardness. Shore D: 86 Standard.color: Black Thermal shock resistance, C: -55 to 125 Flame retardancy, UL94: V-O
672
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1287-809 A&B Potting/Casting
System:
LOW viscosity, flame retardant, room temperature curing epoxy potting/casting system SYMPOXY 1287-809 A&B is a flame retardant offset to SYMPOXY 1010-809 A&B. The system is of low viscosity, colored, 100% solids and has a long pot life. The electrical and physical properties of the two systems are almost identical. These systems may be used in potting/casting/impregnating applications giving high gloss finishes, good electrical properties, high impact and thermal shock resistance. Easy two to one, by volume, mixing ratios, low viscosity and superior moisture resistance along with excellent adhesive strength, makes these systems excellent choices for most small to medium potting applications. Mixing Ratio, Part A/Part B: By volume: 2 to 1 By weight: 100 to 42 Mixed viscosity, cps.: 1600 to 2000 Hardness, Shore: D-82 Pot Life; Min., 100 grams: 45-50 Exotherm at gellation, 100 grams, C: 90 Operating temperature, C: 90-125 Tensile strength, psi: 7800 Flexural strength, psi: 16500 Compressive strength, psi: 18500 SYMPOXY 1350-6 Potting/Casting
System:
High impact, low viscosity, room temperature curing potting/ casting system SYMPOXY 1350-6 is an undiluted, filled, two component, low viscosity system designed for excellent impact and shock resistance. SYMPOXY 1350-6 shows almost no drop within 90 days. 1350-6 adheres extremely well to lead materials and eliminates microscopic cracking on the flexing of protruding leads. Viscosity, cps. Part A/Part B: 55,000/25 Mixed: 6,000 Soecific sravitv. Part A/Part B: 1.6Ol1.00 Filler content,-%: 50 Suggested cure, hrs. @ 25C: 24 or @ 65C: 2 Hardness, Shore D @ 25C: 82 @ 13oc: 70 Standard color: Black Thermal conductivity: 4.5
Encapsulating, Potting, Casting, Impregnating Compomds
SYMPLASTICS INC.: SYMPOXY 1350-8 Potting/Casting
673
System:
Machinable, low cost, low viscosity, high impact strength, epoxy potting/casting system for small to large castings. SYMPOXY 1350-8 is a two component, filled epoxy, formulated for high impact strength yet very machinable. Low shrinkage makes 1350-8 an excellent tooling and pattern making system also. as it shows verv little wear on machinins tools. Excellent air release, high gloss and good electricals also makes 1350-8 a candidate for most potting applications to 12OC. The filler shows no settlement in 6 months storase at 78F (25C). Its low cost also is a factor in large castings. SYMPOXY 1350-8 adheres extremely well to lead materials and eliminates microscopic cracking on the flexing of protruding leads. For smaller castings requiring maximum impact strength and faster curing refer to 1350-803, for high temperature resistance see 1350-56, for medium high temperature see 1350-58 or for operational temperatures to 200C see 1365-58. Mixing ratios, Pt. AjPt. B, by weight: 100/18 Pot life hrs., 100 grams 8 25C: 8 Gellation in l/8 inch thick mass, hrs.: 48 Viscosity, cps. Pt. A/Pt. B: 53,000/9 mixed: 2,000 Specific gravity, Pt. A/et. B: 1.58/1.01 mixed: 1.45 SYMPOXY 1350-803 Potting/Casting
System:
Machinable, low cost, low viscosity, high impact strength, epoxy potting/casting system for small to large castings SYMPOXY 1350-803 is a two component, filled epoxy, formulated for high impact strength yet very machinable. Low shrinkage makes 1350-803 an excellent tooling and pattern making system also, as it shows very little wear on machining tools. Excellent air release, high gloss and good electricals also makes 1350-803 a candidate for most potting applications to 130C. The filler shows no settlement in 6 months storage at 78F (25C). Its low cost also is a factor in large castings. SYMPOXY 1350-803 adheres extremely well to lead materials and elimates microscopic cracking on the flexing of protruding leads. For large castings requiring maximum impact strength refer to 1350-8, for high temperature resistance refer to 1350-56, for medium high temperature, see 1350-58 or for operational temperatures to 200C refer to 1365-58. Mixing ratios, Part A/B, by weight: 100/15 Pot life min. 100 grams 8 25C: 35 Gellation in l/8" thick mass, hrs.: 3 Viscosity, cps. Part A/B: 53,600/50 Mixed: 4,200 Specific gravity, Part A/B: 1.60/1.01 Mixed: 1.50 Suggested cure, hrs. @ 25C: 16 or @ 65C: 2
674
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYNPOXY 1350-2218 A&B Epoxy System for Potting/Casting: Medium viscosity, filled, flexible, machinable, epoxy system for potting/casting applications SYMPOXY 1350-2218 A&B is an opaque, filled, epoxy system that is flexible and retains its flexibility under 1OOC operational temperatures. SYMPOXY 1350-2218 A&B has excellent machinability and is good for usage in mixing/dispensing equipment due to the softness of its filler. For the equivalent of 1350-2218 A&B, in a low viscosity systern, refer to SYMPOXY 2218 A&B or 2221FR for flame retardancy. Components: 2 Mixing ratio, by volume, A/B: 2/l Viscosity, cps, Part A/Part B: 63,000/880 Mixed: 3,900 Specific gravity, Part A/Part B: 1.60/.96 Mixed: 1.29 Pot life, hrs., 100 grams 8 25C: l-l l/2 Gellation, i/8th inch thick, hrs., @ 25C: 6-8 Hardness, Shore: A-90 Operating temperature, C: 130 SYMPOXY 1425/56 Potting System: Low viscosity, high thermal conductivity potting system SYMPOXY 1425/56 is a two part, epoxy, filled, low viscosity system designed for maximum thermal conductivity. This system has excellent flow and penetration, good air release, low shrinkase and excellent heat stability. SYMPOXY l425/56 was designed for the potting of components with large metal inserts of dissimilar metals, such as, silver and aluminum. Along with its low coefficient of expansion it has very low weight loss at 15oc. Mixed viscosity 8 25C, cps: 3,200 Filler settlement, 60 davs. %: 1.0 Pot life, l/2 galion, hrs..@ 25C: 4 Dielectric strength, Volt/Mil: 550 Dielectric constant to 10 10 cps: 4.35 Dissipation factor to 10 10 cps: 0.03 Volume resistivity, ohm-cm, @ 25C: 2.6 x 10 15 Thermal shock resistance: -55C to 150C Thermal expansion coefficient, per C: 18 x 10 -6 Hardness, Shore D, 8 25C: 88 Water absorption, 24 hrs. @ 25C, %: 0.08 Tensile strength, psi: 12,000 Compressive strength, psi: 18,000 Flexural strength, psi: 18,500 Thermal conductivity: 8.6
Encapsulating, Potting, Casting, Impregnating Compomds
675
SYMPLASTICS INC.: SYMPOXY 1425-204 Potting/Casting/Adhesive/ Sealant Applications: Fast curing, high thermal conductivity, thick, epoxy system for small potting/casting/adhesive/sealant applications SYMPOXY 1425-284 is a two component epoxy system designed for fast curing in thin films or small CUD applications. The system has excellent thermal conductivity; qbbd spreadability for adhesive joints, fast qellation and curing in thin films and excellent heat stability to 130-140C. SYMPOXY 1425-284 may be gelled at room temperature or 15 minutes at 125F. Mixing ratio, Part A/Part B: by weight: 100/9 Standard color: Black Mixed viscosity, cps: Semi-thixotropic Specific gravity, Part A/Part B: 1.75/1.01 Pot life. min.. 100 grams: 15/20 Gellation, l/8il, hrs: @ 25C: i l/2-2 Recommended cure: @ 25C (77F): 16 @ 51C (125F): 4 @ 1OOC (212F): 1 Hardness, Shore D: 90 Heat distortion temp., C: 95 Thermal expansion, C x IO -6: 39 SYMPOXY 1425-213 A&B Shock Resistant System: Low viscosity, filled, room temperature curing, thermal shock resistant system with low thermal expansion and high thermal conductance SYMPOXY 1425-213 A&B is a filled epoxy system formulated for the potting or casting of small to medium size cavities requiring good thermal shock, thermal conductance and thermal resistance. The thermal expansion rate of SYMPOXY 1425-213 A&B is low enough to use in the potting between dissimilar materials or between metals such as brass; copper, nickel, steel, etc. or in the potting of ceramic chips in metal housings. SYMPOXY 1425-213 A&B may be mixed, deaired and frozen in hand or pressure type syringes. For flame retardancy to UL94-VO, please refer to SYMPOXY 1288-213 A&B. Specific gravity, Part A/B: 1.75/1.10 Mixing ratios, by wt. Part A/B: 100/15 Viscositv. _. CPS . Part A/B: 21600/400 Mixed: 8,500. Pot life, 100 grams, min.: 45-60 Cure schedule,-hrs. @ 25C (78F): 16-24 @ 65C (149F): 3 Gellation, 118th inch, hrs. @ 25C: 3-4 Operating temperature, C: 130 Hardness, Shore D: 85
676
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1426-596 A&B Potting/Casting
System:
Low viscosity, filled, thermal shock resistant heat cured epoxy potting/casting system SYMPOXY 1426-596 A&B is a two component epoxy system formulated for excellent thermal shock resistance and a low thermal expansion rate when used in potting applications requiring a large mass between dissimilar materials or in very-very small masses where ceramic chip integrity must be maintained. This system attains the following advantages: Thermal Shock -65C to 150C Low Shrinkase High Insulation Resistance to 15OC Good Potting Viscosity High Impact Strength High Tensile Strength Long Pot Life Short Cure Cycles For a similar system with flame retardancy to UL 94-VO see SYMPOXY 1454-596 A&B. Viscosity, cps, Part A/Part B: 21,600/5,200 Mixed: 7,800 100 crams after 4 hrs. @ 25C Pot iife, 100 grams, hours: 8 Cure Schedule, hrs @ 85C: 2 to 3 plus 15oc: 3 Operating temperature, C: 140 Hardness, Shore D: 86 Tensile Strength, psi: 8,200
SYMPOXY 1454-596 Potting/Casting
System:
Two component, thermal shock, heat curing, flame retardant epoxy potting/casting system SYMPOXY 1454-596 is a two component system designed for the following requirements in potting/casting of large masses between two dissimilar materials or where large masses are to be potted or cast between two large metal leads: Thermal Shock -65C to 140C Low Shrinkage Flame Retardancy to UL94-VO High Insulation Resistance to 150C Good Potting Viscosity High Tensile Strength High Izod Impact of 1.24 Short Cure Cycles Long Pot Life Components: 2 Viscosity, cps Part A/Part B: 36,000/40,000/5,200 Mixed: 18,500 Pot Life, 100 grams, hrs.: 8 Curing Schedules hrs. @ 85C: 2 to 3 +125 to 150C: 2 to 3 Hardness, Shore D: 88 Tensile Strength, psi: 10,500 Izod Impact: 1.24
Encapsulating, Potting, Casting, Impregnating Compounds
677
SYMPLASTICS INC.: SYMPOXY 1515-591 Epoxy Tooling Resin: Low viscosity, aluminum filled, ultra high impact strength, epoxy tooling resin SYMPOXY 1515-591 was formulated to replace machined aluminum parts by the casting method. 1515-591 has very low shrinkage, very low viscosity, similar physical properties to that of aluminum with added lubricity for long wearing abilities when used as a wiper blade, base, or where low friction between parts is desirable. Although very hard, for excellent machinability, the inherent high impact strength makes the castings almost indestructible by hammer, dropping or through rough usage. Large castings may be made using room temperature gellation overnight plus post curing or gelling under low heat (i.e. 85-9OC) and post cured at 140-150C. Due to its excellent adhesive qualities, this system may be used as a non paste adhesive, especially where some electrical conductance is required or desired. Mixing Ratios, pbw, Part A/Part B: 100/20 Pot Life, min., 100 gram mass @ 25C: >8 hrs. @ 85C: ~1 hr. Viscosity, cps, 8 25C (Mixed-approx.): 8600 Hardness, Shore D @ 25C: 88 @ 150C: 82 Standard Color: Grey Thermal Expansion coef., 10 -6, C: 55 Thermal Conductivity: 7.5
678
Adhesives, Sealants and Coatings for the Electronics Industry
SYNPWSTICS
INC.: SYNPOXY 1610-74 Potting/Casting Resin:
High heat and abrasion resistant potting/casting
resin
SYMPOXY 1610-74 is a two component, heat cured, filled epoxy system that has a long pot life, short curing schedule and low viscosity. This system is excellent for potting or casting applications where high heat resistance coupled with good thermal shock resistance is required. SYMPOXY 1610-74 exhibits abrasion resistance similar to aluminum. SYMPOXY 1610-74 is excellent in metal patchwork or in potting/casting applications where good external wear or hardness is required. This system has very good resistance to solvents and epoxy dissolving agents. Mixed viscosity @ 25C, cps: 4,500 Pot life @ 25C, hrs.: 8 Cure schedule @ lOOC, hrs.: 6 @ 125C, hrs.: 4 @ 15OC, hrs.: 3 Hardness, Shore D, @ 25C: 94 Flexural strenath. osi: 24.000 Tensile streng
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: SYNPOXY 1870 Tooling/Casting Volume measurement, system
679
System:
low weight, white, tooling/casting
SYMPOXY 1870 is a one to one, by weight or volume, tooling/ casting resin system which is white, but may be colored to specifications. It has low weight to volume ratio of 13# to the gallon, low viscosity, excellent machinability, good impact strength and cures overnight at room temperature. It has very low shrinkage making it applicable for prototypes, models, dies and cast production parts. There is almost no settlement of filler over a 30 day period. Any filler settlement may be easily stirred back into suspension. Components: 2 Standard color: White Mixing by weight or volume A/B: l/l Viscosity, cps (Brookfield) A/B: 16,400/3,600 Mixed: 7,300 Filler, %, mixed: 68 Soecific aravitv A/B: 1.75/1.75 Working life, hgs.; 6 pounds: 2 Hardness, Shore D (16 hrs. @ 25C): 70 Machinability: Excellent Shrinkage, in-/in.: .0006 Izod Impact: 0.95 SYMPOXY 1871 Potting and Casting System: Large mass, low cost, low viscosity, epoxy potting and casting system SYMPOXY 1871 is a two component, equal parts by weight or volume, semi-rigid, large mass casting resin exhibiting excellent thermal shock resistance when room temperature cured. This system was designed for large masses being mixed at one time; i.e., gallon, good air release through low viscosity and full cure in a maximum of 16 hours, for larger castings, cure is accomplished in 4-8 hours. Thin film encapsulating will cure in 24-48 hours. SYMPOXY 1871 has very good filler suspension qualities even in 5 gallon containers and will not drop out appreciably in 30 days. Components: Two Mixed viscosity, cps: 6,750 Mixed specific gravity, A/B: 1.48 Pot life, min., 150 grams: 120 1 gallon: 30 Exotherm, at gellation, 1 qt., F: 180 Max. reached during cure: 190 Hardness, Shore D, 6 hrs. 8 25C: 1,400 grams: 80 l/8" casting: 35
680
Adhesives, Sealants and Coatings for the Electronics Indust~
SYMPLASTICS INC.: SYMPOXY 1873 Potting/Casting Resin: Resilient, low cost epoxy potting/casting
resin
SYMPOXY 1873 is a two component, epoxy, production type potting/casting resin system designed for high volume production. This system has an easy 1 to 1 mixing ratio, by volume. Part A and Part B are different in color so that thorough mixing can be visually detected. The main characteristics of this system is its low viscosity, good flow and penetration, long pot life with an overnight cure, high gloss finish with excellent gloss retention upon application of heat and easy mixing ratios. Good electricals up to 125C makes this system adaptable to most any potting/casting application. Thin films of this material may be bent double before cracking. Filler content is 54% by weight. Components: 2 Viscosity, cps, Part A/Part B: 3,200/3,600 Mixed: 3,450 Standard Color: Black Pot Life, 200 grams, hrs.: 5 Specific Gravity, Part A/Part B: l-4211.75 Mixed: 1.607 Mixing Ratio, by volume: 1 to 1 by weight: 80 to 100
Encapsulating, Potting, Casting, Impregnating Compounds
681
SYMPLASTICS INC.: SYMPOXY 1874: SYMPOXY 1874 Potting/Casting Resin: Low cost, non-burning, low viscosity potting/casting resin to be used with several curing agents to meet Mil-I-16923 E, ASTM-635, Fed-Std. 406 (Method 2021) and would meet UL reauirements in.many applications. The following shows curing agents cured with SYMPOXY 1874 to give good properties for specific applications. Although the standard color is black, other colors are available, such as, white, yellow, green, blue, orange and grey. SYMPOXY 1874 A&B Epoxy System: SYMPOXY 1874 A&B is a high production type epoxy system with a 1 to 1, by weight or volume,- mixing ratios to-give the advantage of easy mixing with or without a scale. This system has very low viscosity, excellent thermal shock resistance, hard but resilient with a high gloss surface. Excellent system for filters, transformers (operating to 13OC), delicate componentry, such as, reed relays, etc., and wound coil units. Very low exotherm. Variable flexibility. SYMPOXY 1874-284 Capacitor End Fill: Low viscosity system of short pot life, but verv fast aellation in thin films of l/8 to l/4-inch. Designed for capacitor end fill and small potting cup applications where fast turn over or processing is demanded. High gloss finish. 1874-284 does not boil in l-1/2 inch thick mass. Excellent electricals with its IR increasing up to 1500 hrs. when operated at 130C. SYMPOXY 1874-803 Capacitor End Filling: This system was designed for high impact strength and to eliminate crackina around inserts. Also desianed for caoacitor end filling and small potting cups. The very-low viscosity of 1874-803 lends itself to maximum penetration of wire wound devices. Excellent high gloss finish. SYMPOXY 1874-561: 1874-561 was designed to give excellent electrical properties up to 150C operation. Three step cure gives excellent low shrinkage and stress relief to delicate componentry. Although one step cure is permissable. Excellent moisture and chemical resistance.
682
Adhesives, Sealants and Coatingsfor the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1874: Physical and Electrical Properties: 1874 A&B: Mixing Ratio, Part A/Part B: By Weight: l/l By Volume: l/l Standard Color: Black Viscosity, Part A/Part B: 5200/4200 Mixed: 4700 Specific Gravity, Part A/Part B: 1.50/1.54 Mixed: 1.52 Pot Life, Min., 100 Grams: 60 Hrs., l/2 Gallon: l/2 Gellation, Hrs., 118th Film: 5-7 Recommended Cure, Hrs. @ 25C: 24 or Hrs. @ 65C: 2 Hardness. Shore: D80 Heat Distortion Temp., C: 95 Thermal Expansion, per C x 10 -6: 28 Thermal Shock Resistance: -55C to 150C Thermal Conductivity: 4.4 Moisture Absorption, %: 24 Hrs. @ 25C: .2 Flammability: Non-Burn Tensile Strength, psi: 7,200 Flexural Strength, psi: 18,000 Compressive Strength, psi: 21,000 Machinability: Good 1874-284: Mixins Ratio, Part A/Part B: By-Weight: 100/12Standard Color: Black Viscosity, Part A/Part B: 5200/4000 Mixed: 4800 Specific Gravity, Part A/Part B: 1.50/1.08 Mixed: 1.36 Pot Life, Min., 100 Grams: 20 Hrs., l/2 Gallon: NA Gellation, Hrs., 1/8th Film: 2 Recommended Cure, Hrs. @ 25C: 24 Hardness, Shore: D89 Heat Distortion Temp., C: 110 Thermal Expansion, per C x 10 -6: 35 Thermal Conductivity: 3.5 Moisture Absorption, %: 24 Hrs. @ 25C: .l Flammability: Non-Burn Tensile Strength, psi: 9,000 Flexural Strength, psi: 16,500 Compressive Strength, psi: 17,000 Machinability: Excellent
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: SYMPOXY 1874: Physical and Electrical Properties: 1874-803: Mixing Ratio, Part A/Part B: By Weight: 100/15 Standard Color: Black Viscosity, Part A/Part B: 5200/50 Mixed: 1500 Specific Gravity, Part A/Part B: 1.50/1.10 Mixed: 1.38 Pot Life, Min., 100 Grams: 50 Hrs.. l/2 Gallon: NA Gellatibn, Hrs., 1/8th Film: 4 Recommended Cure, Hrs. @ 25C: 24 Hardness, Shore: D82 Heat Distortion Temp., C: 85 Thermal Expansion, per C x 10 -6: 40 Thermal Shock Resistance: -55C to 125C Thermal Conductivity: 3.2 Moisture Absorption, %: 24 Hrs. @ 25C: .15 Flammability: Non-burn Tensile Strensth. usi: 8.500 Flexural Strength,‘psi: i5,500 Compressive Strength, psi: 22,500 Machinability: Good 1874-561: Mixing Ratio, Part A/Part B: By Weight: lOO/lO standard Color: Black Viscosity, Part A/Part B: 5200/100 Mixed: 1800 Specific Gravity, Part A/Part B: 1.50/1.05 Mixed: 1.35 Pot Life, Min., 100 Grams: 60 Hi-s., l/2 Gallon: NA Gellation, Hrs., 1/8th Film: 6-7 Recommended Cure, Hrs. @ 25C: 6+ Hrs. @ 65C: l+ Hrs. @ IOOC: 1 Hardness, Shore: D90 Heat Distortion Temp., C: 125 Thermal Expansion, per C x IO -6: 38 Thermal Conductivity: 3.5 Moisture Absorption, %: 24 Hrs. @ 25C: .I Flammability: Non-Burn Tensile Strensth. rxi: 11,000 Flexural Strength,-psi: l?',OOO Compressive Strength, psi: 35,000 Machinability: Excellent
683
684
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.:
SYMPOXY
1949
Fluidised Bed Coating Powder:
One component, low heat curing, flame retardant, fluidized bed coating powder SYMPOXY 1949 is a filled one component powder designed for fluidized bed applications. SYMPOXY 1949 is a free flowing powder and may also be used as an adhesive/sealant and as a potting compound for very small componentry by tapping the container when filling. Recommended applications include Mylar, tantalum and ceramic capacitors; varistors, thermistors and wire-wound resistors; thick film devices: IC's; coils; motor protectors, transformers and other delicate or heat sensitive devices where fast cure (ie: 4 hours @ 85C) and low temperatures are required. One to two minutes at 85-1OOC preheat plus full cure at 85C suggests this syetem for capacitor encapsulation where 85C is maximum tolerable temperature for cure. Color: Blue Specific gravity, g/cc: 1.5 Moisture absorption (boiling water/24 hours): cl.0 Edse coveraqe cNBrlbar @ 20 mils): 20% Fl&mability UL94: V-O Oxygen Index, %: 32 Heat Class: H (18OC) SYMPOXY 2100-810 A&B Potting and Casting System: Very low viscosity, room temperature curing, unfilled epoxy potting and casting system SYMPOXY 2100-810 A&B is a two component, room temperature curing system with convenient one to one, by volume, mixing ratio. 2100-810 A&B is excellent for small castings up to a two inch cube and also for the potting and impregnation of transformers, solenoids, coils and other intricate componentry. Good air release, fast gellation to pot life ratio, hard high gloss finish, good water and chemical resistance and very low viscosity. This system has excellent clarity in clear castings or may be colored as desired. Mixing ratios, Part A/Part B: by volume: 1 to 1 by weight: 100 to 83 Viscosity, cps. Part A/Part B: 12,000 to 200 Mixed: 1500 Hardness, Shore, after 16 hrs. @ 25C: D-65 after 72 hrs. @ 25C: D-75 Pot life, min., 100 gram mass: 45-50 Exotherm at gellation, 100 grams: 120C Operating temperature class: B Tensile strength, psi: 7,200 Compressive strength, psi: 15,400
Encapsulating, Potting, Casting Impregnating Compounds
SYMPLASTICS INC.: SYMPOXY 1950, Potting/Casting/Encapsulation
1951,
1954,
1955
685
Epoxy for
Applications:
Low heat curing, one component, low density, flame retardant (to UL 94-V) epoxy for potting/casting/encapsulation applications The lightweight powder series are one component, lightweight powders curing at 85-9OC and havinq the followinq outstanding :operties: Specific gravity of .26 to .65 Flame retardancy to DL94 V-O Low shrinkage when cured at 85-9OC Excellent moisture resistance Thermal shock resistant One component - no mixing Excellent filler suspension Excellent penetration of componentry Low heat cure - from 85C Lower cost than most liquid systems The powder has excellent versatility in that units to be Dotted need onlv to be filled to the desired level with vibration to assure complete filling of voids. If the cured powder is to be an exterior surface, SYMPOXY 1950, 1951 and 1954 may be coated with a liquid flame retardant system to improve-its low compressive strength. Although not-an extremely smooth surface, 1955 is very hard and would not have to be coated. The chemical and moisture resistance of these cured powders is excellent and is preferred over many liquid systems. These systems are directed at applications where low density, exothermic or curing temperatures above 85C cannot be tolerated and where thermal expansion problems should not harm delicate componentry. 1950: Specific gravity: .26 to -30 Viscosity, cps.: Fine Powder Recommended Cure, hrs. @ 85C: 2 to 4 @ 95c: 2 to 4 @ 125C: 2 @ 15oc: 1 Weight loss, 168 hrs. @ 150C: .lO Flammability, UL94: V-O Dielectric strength, Volt/mil: 460 to 480 Dielectric constant, 1 MHz: 3.0 to 3.2 Dissipation factor, 1 MHz: .02 Comwressive strenqth. wsi: 500 Thermal shock resistance, -55 to 150C: passed Volume resistivity, ohm-cm: 4.0 x 10 10 Moisture resistance, 168 hrs. @ 25C: 0.03
686
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 1950, Potting/Casting/Encapsulation
1951,
1954,
1955
Applications
Epoxy for (Continued):
1951:
Specific gravity: -30 to .34 Viscosity, cps.: Fine Powder Recommended Cure, hrs. @ 85C: 2 to 4 @ 95c: 2 to 4 @ 125C: 2 @ 15oc: 1 Weight loss, 168 hrs. @ 15OC: .I0 Flammability, UL94: V-O Dielectric strength, Volt/mil: 460 to 480 Dielectric constant, 1 MHz: 3.0 to 3.2 Dissipation factor, 1 MHz: -02 Compressive strength, psi: 1200 Thermal shock resistance, -55 to 150C: passed Volume resistivity, ohm-cm: 8.3 x 10 10 Moisture resistance, 168 hrs. @ 25C: 0.03 1954:
Specific gravity: .34 to .38 Viscosity, cps: Fine Powder Recommended Cure, hrs. @ 85C: 2 to 4 @ 95c: 2 to 4 @ 125C: 2 @ 15oc: 1 Weisht loss. 168 hrs. P 15OC: .lO Flammability, UL94: V-C Dielectric strength, Volt/mil: 460 to 480 Dielectric constant; 1 MHz: 3.0 to 3.2 Dissipation factor, 1 MHz: .03 Compressive strength, psi: 1400 Thermal shock resistance, -55 to 150C: passed Volume resistivity, ohm-cm: 6.0 x 10 11 Moisture resistance, 168 hrs. @ 25C: 0.06 1955:
Specific gravity: .60 to .64 Viscosity, cps.: Fine Powder Recommended Cure, hrs. @ 85C: 2 to 4 @ 95c: 2 to 4 @ 125C: 2 @ 15oc: 1 Weight loss, 168 hrs. @ 15OC: .25 Flammability, UL94: V-O Dielectric strength, Volt/mil: 460 to 480 Dielectric constant, 1 MHz: 3.0 to 3.2 Dissipation factor, 1 MHz: .03 Compressive strength, psi: 5600 Thermal shock resistance, -55 to 150C: passed Volume resistivity, ohm-cm: 2.0 x 10 13 Moisture resistance, 168 hrs. @ 25C: 0.12
Encapsulating, Potting, Casting, Impregnating Compounds
687
SYNPLASTICS INC.: SYMPOXY 2202 A&B Potting/Casting/Coating system: Low viscosity, water clear, highly flexible, epoxy potting/ casting/coating system SYMPOXY 2202 A&B is a two component, 100% solids, low viscosity water white system that is highly flexible and retains its flexibility under long periods at 130C. Due to its low Shore A hardness, it may be dug out and repaired in potting/casting applications. It has a high gloss and surface hardness that does not attract dirt as does urethane and silicones. SYMPOXY 2202 A&B has a rather long pot life and corresponding soft gel time in thin films. Ideally it should be cured 3 hours at 85C or 1 hour at 85C plus 48 hours at 25C or 4-5 days at 25C. Mixing ratio: Part A/Part B: by weight: by volume: Pot life, 500 grams, hours: 3-4 Viscosity, mixed cps.: 1200 Gellation: 118th inch thickness, @ 25C: @ 85C: Cure schedule, hours @ 85C: 3 @ 25C: 48-72 Hardness, Shore: A60-70 Tensile strength, psi: 2500 SYMPOXY 2205 A&B Potting/Casting
100/42 2/l 16-24 1
System:
High clarity, large mass, resilient potting/casting
system
SYMPOXY 2205 is a two component, non-filled epoxy system used for casting, potting, impregnation or any application requiring a low viscosity system with good penetration, thermal shock, high clarity and long pot life. SYMPOXY 2205 is similar to 2203 but with higher rigidity and shorter cure time. Large castings of up to 4 inches can be successfully cast. Electricals are generally good to excellent. Components: Two Viscosity, cps., Part A/Part B: 12,000/50 Mixed: 800 Specific gravity, mixed: 1.10 Pot life, hrs. I# @ 25C: 3 5# 8 25C: 2 Mixing ratio, Part A/Part B, by weight: 100/35 Curing schedule, hrs. @ 25C: 24 @ 65C: 4 Thermal shock resistance: -55C to 130C Moisture absorption, 24 hrs. @ 25C: 0.27 Tensile strength, psi: 7,400 Tensile shear strength, psi, @ 25C, Al/Al: 1,900 Tensile elongation, %, @ 25C: 7.1
688
Adhesives, Sealants and Coatings for the Electronics Zndzut~
SYMPLASTICS INC.: SYMPOXY 2218 and 2221 FR A&B for Potting/ Casting Applications: Low viscosity, flexible, epoxy system in a clear or an opaque flame retardant version for potting/casting applications. SYMPOXY 2218 A&B is a low viscosity clear or colored flexible svstem that cures at room temoerature or low heat to a Shore A-hardness of 80. SYMPOXY 222iFR A&B is a low viscosity opaque flexible system that is flame retardant to UL 94-VO. Both systems have an easy one to one, by weight, mixing ratios and low exothermic reaction which makes them an ideal system for small to large potting applications. Both systems maintain their flexibility under 1OOC operational temperatures. SYMPOXY 2218: Components: 2 Mixing ratio, Part A/Part B: lOO/lOO Viscosity, mixed, cps: 3500 Specific gravity, part A/part B: 1.16/1.03 Pot life, hrs. 100 qrams, @ 25C: 2-3 Gellation, 1/8th inch tk; hrs. @ 25C: 6-8 Hardness, Shore: A-80 Operating temperature: Class B Thermal shock resistance, C: -65 to 85 Cure schedule, hrs. @ 25C: 24-48 8 65C: 3 Water absorption, %, 24 hrs.: 0.20 Tensile strength, psi: 1500 Izod impact: 1.37 Shrinkage, in/in: .0002 Dielectric strength (Volt/mil): 600 Dielectric constant, 1 MHZ: 3.2 SYMPOXY 2221FR: Components: 2 Mixins ratio. Part A/Part B: lOO/lOO Viscosity, mixed, cps: 4600 Specific gravity, Part A/Part B: l-21/1.03 Pot life,.hrs. 700 grams, @ 25C: 2-3 Gellation, 118th tk, hrs. @ 25C: 7-9 Hardness, Shore: A-82 Operating temperature: Class B Thermal shock resistance, C: -65 to 85 Flame retardancy, UL94: VO Cure schedule, hrs. @ 25C: 24-48 @ 65C: 3 Water absorption, %, 24 hrs.: -22 Tensile strength, psi: 1800 Izod imoact: 1.25 Shrinkage, in/in: .0002 Dielectric strength (Volt/mil): 600 Dielectric constant, 1 MHZ: 3.2
Encapsulating, Potting, Casting, Impregnating Compounds
689
SYMPLASTICS INC.: SYMPOXY 2205 A&B Epoxy Potting/Casting/ Impregnating System: Semi-flexible, thermal shock resistant, low viscosity, heat cured epoxy potting/casting/impregnating system SYMPOXY 2285 A&B is a two part, low viscosity epoxy system that is thermal shock resistant to Mil I-16923G Type D and Mil T-27A for transformer insulation. SYMPOXY 2285's permanent flexibility and good electrical properties are retained after prolonged heating that is needed for motors, transformers, coils, etc. SYMPOXY 2285 A&B was formulated as a semi-flexible stress relieving potting/casting/impregnating system. It has good moisture resistance and excellent electrical properties at elevated temperatures. Its low viscosity and ion, pot life allows excellent penetration of wire wound devices. SYMPOXY 2285 A&B has neslisible exotherm. Components: ?. Mixing ratio, Part A/Part B: by weight: 213 Viscositv, CDS. Part A/Part B: 12000/1250 mixed-6 3sC: 1800 @ 65C: 1000 Specific gravity, Part A/Part B: 1.16/1.01 mixed: 1.09 Pot life, days @ 25C: l-2 Gellation, thin film (l/8" thick): @ 93C, min: 35-40 @ 125C, min: 15 SYMPOXY
2650
ABC Epoxy System for Impregnations:
Heat resistance, low viscosity, fast curing epoxy system for impregnations of fiberglass, transformers, wire wound devices, etc. SYMPOXY 2650A,B,C is a low viscosity epoxy system designed for impregnation of devices requiring Class F (155C) operation. It has faat hard qellation in fiberglass (ie. 8-10") at 1OOC. Post curing can then be done at higher temperatures without the distortion of the impregnated glass. SYMPOXY 2650A,B,C is very light in color and in fiberglass will cure with little visible brown or dark amber coloring. SYMPOXY A,B,C is a three part system allowing maximum pot life. When properly stored 2650 A,B,C will not tend to crystallize over a long period of time. SYMPOXY 2655 A,B is the same as 2650 A,B,C except that the B and C have been mixed together for the customer's convenience. For a flame retardant version of SYMPOXY 2650 refer to SYMPOXY 2660 A,B,C. Mixing ratios, pbw Part A/Part B: l/l Pot life, hrs., 1 gallon mass, @ 25C NO Part C (accelerator added): 72-96 Part C (accelerator) added @ 1%: 24-48 Specific gravity, mixed: 1.10 Viscosity, cps, @ 25C Part A/Part B: 12,000/150
690
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS INC.: SYMPOXY 2660A,B,C Epoxy System for Impregnation: Low viscosity, light cured colored, rigid, fast yelling and curing, flame retardant epoxy system for impregnation of fiberglass, transformers, wire wound devices, etc. SYMPOXY 2660A,B,C is a low viscosity, flame retardant epoxy system formulated for the impregnation of fiberglass and wire wound devices requiring Class B-F (130-155C) operation. It has a fast gellation in impregnated fiberglass of 9-12 minutes at 1OOC when accelerated. Post curing can then be done at higher temperatures without the distortion of the impregnated glass. SYMPOXY 2660A,B,C is the flame retardant version of SYMPOXY 2650 A,B,C and comes in a three part system for maximum pot life or in a pre-accelerated version SYMPOXY 2665A&B (Part B & C have been mixed together prior to shipment). When properly stored, SYMPOXY 2665A&B or SYMPOXY 2660 A,B,C will not tend to crystallize over a long period of time. Either the accelerated or unaccelerated system will cure to a light color. Mixing ratios, pbw Part A/Part B: 2/l Pot life, hrs, 1 gallon mass 8 25C (78F): No part C (unaccelerated) 72-96 Part C added @ 1% (accelerated): 8 Specific gravity, Part A/Part B: 1.40/1.20 mixed: 1.28 Viscosity, cps @ 25C Part A/Part B: 16,800/150 mixed-@ 25C: 720 Gellation in thin film @ IOOC, min.: 9-12 Hardness, Shore: D-88 Standard Color: Clear Amber Moisture absorption, %, 24 hrs, @ 25C: 0.12 Arc resistance, sets.: 52 Weight Loss, 168 hrs @ 15OC, %: 2.5 Heat Class: B-F Flame Retardancy ASTM-635: non-burn UL 94 V (l/16-cs): -0 Mil I 16923: passed Tensile strength, psi: 10,800 Flexural strength, psi: 18,400 Comuressive strenath. osi: 16.200 Dieiectric strenyfh,.sjt V/m:.380 Dielectric constant, 8 25C, 10 6 CPS: 3.20 Dissipation factor,.25C, 10 6 cps:.0.022 Volume resistivity, ohm-cm: 8 25C: 8.0 x 10 15 @ 1ooc: 4.0 x 10 13 @ 150C: 6.4 x 10 10
Encapsulating, Potting, Casting, Impregnating Compounds
691
SYMPLASTICS INC.: SYNPOXY 2660FR A,B,C Epoxy System for Impregnation: Heat resistance, low viscosity, flame retardant, fast curing epoxy system for impregnation of fiberglass, transformers, wire wound devices, etc. SYMPOXY 2660FR A,B,C is a low viscosity, flame retardant, epoxy system designkd.for impregnation of-devices requiringClass F (155C) operation. It has fast hard gellation in fiberclass tie. IO"-15") at 1OOC. Post curinq can then be done at higher temperatures without the distortion of the impregnated glass. SYMPOXY 2660FR A,B,C is light in color and in fiberglass will cure with some brown or amber colorins. SYMPOXY 2660FR A,B,C is a three part system allowing maximum pot life. When properly stored 2660FR A,B,C will not tend to crystallize over a lons oeriod of time. SYMPOXY 2665FR A,B is the same as 2660FR A,B,C-except that B and C have been mixed together for the customer's convenience. SYMPOXY 2660FR A,B should be used for impregnation tanks where the longer pot life is required and SYMPOXY 2660FR A,B,C or 2665 A&B should be used for the potting or wet winding coils, transformers, etc. where the Part C is already mixed into Part B by Symplastics. Mixing ratios, pbw Part A/Part B: 2/l Pot life, hrs. 1 gallon mass, @ 25C: No Part C (accelerator) added: 72-96 Part C (accelerator) added @ 1%: 24-48 Specific gravity, mixed: 1.35 Viscosity, cps @ 25C Part A/Part B: 16,000/150 Mixed: 2,100 Hardness, Shore: D-87 Standard Color: Amber Moisture absorption, % 24 hrs. @ 25C: 0.06 Arc resistance, sets.: 68 Flame retardancy, UL94: V-O Weight Loss, 500 hrs 15OC, %: 1.5 Tensile strength, psi: 9,500 Tensile elongation, %: 3.2 Flexural strensth. osi: 18.000 Compressive strength, psi:.l5,000 Dielectric strength, S/T, V/M: 430 Dielectric constant, 25C 10 6 cps: 3.00 60 cps: 3.30 Dissipation factor, 25C 10 6 cps: 0.013 60 cps: 0.006 Volume resistivity, ohm-cm, @ 25C: 5.2x10 16 8 IOOC: 6.8x10 14 @ 15oc: 4.0x10 12
692
Adhesives, Sealants and Coatings for the Electronics Industry
SYMPLASTICS
INC.:
SYMPOXY
18752
Potting and Casting Resin:
LOW cost potting and casting resin SYMPOXY 18752 is a two component, filled, semi-flexible, room temperature curing, potting and casting resin. It has the convenience of volume or weight measurement and each component is of a different color so that a more complete mixing may be attained visually. Large castings may be made from 18752 due to its low exothermic temperatures and low shrinkage. This system is excellent for casting applications where operating temperatures will not exceed 125C. Long pot life and relatively fast cure (6 to 12 hours) speeds production in casting applications. SYMPOXY 18752 is also excellent for many potting requirements.
Components: Two Mixed viscosity, cps: 6,200 Non-reactive extender resin content, %: 5 Pot life, min., 150 grams: 120 400 grams: 100 l/2 gallon: 90 Exotherm, at gellation, 1 quart, F: 150 Maximum reached during cure: 170 Hardness, Shore D after 6 hrs.: 1,400 grams: 64/58 after 12 hrs.: 1,400 grams: 66 Compressive yield, psi: 8,200
Encapsulating, Potting, Casting, Impregnating Compounds
SYMPLASTICS INC.: SYMPOXY I8755 A&B Potting/Casting
693
System:
Low cost, thermal conductive, thermal shock resistant, semiflexible potting/casting system SYMPOXY I8755 is a two component, room temperature curing 100% solids, low cost, semi-flexible high production type epoxy potting/casting system. I8755 has low viscosity, very minor settlement of filler in 60-90 days, good air release, good deaeration under vacuum and long pot life. One gallon of mixed material has a pot life exceeding 60 minutes. SYMPOXY I8755 cures overnight at 25C (78F) or 3 hrs. at 65C. The different colors of Part A and Part B plus easy mix ratios of 2 to assure hish oroduction castins. Exotherm in I sallon mass is under I70F assuring low shrinkage in large masses. Although SYMPOXY I8755 is heavily filled (65%) it has excellent thermal shock from -60C to 2OOC. Operating temperatures to 150C can be met. Typical Properties: (Cured 3 hours @ 65C): Viscosity, cps., mixed: 9,500 Pot life, min. 100 grams: 180 1 gallon: 60 Filler content, %: 65 Exotherm at gellation, I gal., F: 165 Hardness, Shore D, after 24 hrs. @ 25C: 78 after 48 hrs. @ 25C: 82 Moisture resistance, %, 24 hrs. @ 25C: -01 SYMPOXY 1877 Potting/Casting Resin: Lowest cost, flexible epoxy potting/casting
resin
SYMPOXY I077 is a two component, flexible, room temperature curing, potting/casting system. 1877 was designed primarily for maximum flexibility and moisture resistance where large flexible plastic covered wires are protruding from the casting. Its low shrinkage and minimal exotherm makes large castings of I to 5 gallons permissable. Full cure is attained in 24-48 hours depending upon the mass cast. I877 has excellent thermal shock resistance. Components: 2 Specific gravity, A: I.55 B: I.55 Mixed viscosity, cps: 5,800 Shelf life, months, unmixed (A/B): 12/12 Pot life. 400 crams. hrs.: 3 5400 grams; hrs.: 2 Exotherm, at gellation, 1350 grams, F: 140 Hardness, Shore D, 1350 grams, after 24 hrs. @ 25C: 25120 after 120 hrs. @ 25C: 30 after 2 hrs. 8 IOOC: 30 Thermal shock resistance, l/4" washer -65 to 155C
694
Adhesives, Sealants and Coatings for the Electronics Industy
3H co.: SCOTCH-WELD EPX Applicator System: Noncorrosive two-part structural adhesives designed for high reliability potting and bonding applications. SCOTCH-WELD DP-260 Translucent Epoxy Adhesive: Physical Properties: Approx. viscosity: Base: 90,000 cps Accelerator: 50,000 cps Mixed: 65,000 cps Specific Gravity: Base: 1.15 Accelerator: .97 Worklife @ 23C (73F): 60 minutes Handling Strength: 4-6 hours Full Cure: 2 Days @ 23C 1 Hour @ 8OC Shore D Hardness: 83 Elongation: Z-3% Shear Strength on Aluminum: 2800 psi 180 Peel Strength on Aluminum: <2 piw Thermal Properties: Glass Transition Temperature: 40C Thermal Conductivity (btu-ft./sq.ft.-hr.F): .lOl @ 44C Outgassing (5% wt. loss by TGA): 166C Thermal Coefficient of Expansion (in./in./C): 103x10 -6 Below Tg 167x10 -6 Above Tg Electrical Properties: Dielectric Constant (1 KHZ @ 23C): 3.5 Dielectric Strenath (volts/mil): 840 Dissipation Factor (i KHZ 6 23C): .021 Volume Resistivity (ohm/cm @ 23C): 4.2x10 15 Electrolytic Corrosion to Copper: Excellent Chemical Resistance: Isopropyl Alcohol 1 Hr./l MO.: No attack/Slight attack FREON TF 1 Hr./l MO.: No attack/No attack FREON TMC 1 Hr,/l MO.: Slight attack/Severe attack l,l,l-trichloroethane 1 Hr./l MO.: No attack/Severe attack Acetone 1 Hr./l MO.: Slight attack/Severe attack Flux 1 Hr./l MO.: No attack/Slight attack
Encapsulating, Potting, Casting, Imprqating
3n
co.:
Compounds
SCOTCH-WELD EPX Applicator System(Continued):
SCOTCH-WELD DP-270 Clear Epoxy Potting Compound/Adhesive: Physical Properties: Approx. viscosity: Base: 22,000 cps Accelerator: 18,000 cps Mixed: 19,000 cps _ Specific Gravity: Base: 1.15 Accelerator: .98 Worklife @ 23C (73F): 60-70 minutes Handling Strength: 4-6 hours Full Cure: 2 days 13 23C 1 Hour @ 80C Shore D Hardness: 82 Elongation: 2-32 Shear Strength on Aluminum: 2500 psi 180 Peel Strength on Aluminum: (2 piw Thermal Properties: Glass Transition Temperature: 49C Thermal Conductivity (btu-ft./sq.ft.-hr.F): .I01 @ 49C Outgassing (5% wt. loss by TGA): 175C Thermal Coefficient of Expansion: 101x10 -6 Below Tg Electrical Properties: Dielectric Constant (I KHZ @ 23C): 3.4 Dielectric Strength (volts/mil) (30 mil substrate): 870 Dissipation Factor (I KHZ @ 23C): .018 Volume Resistivity (ohm/cm @ 23C): 4.1 x 10 14 Electrolytic Corrosion to Copper: Excellent Chemical Resistance: Isourouvl Alcohol 1 Hr./l MO.: No attack/Slisht attack FREbN ?!F 1 Hr./l MO.: No attack/No attack FREON TMC 1 Hr./l MO.: Slight attack/Severe attack l,l,l-trichloroethane 1 Hr;/l MO.: No attack/Severe attack Acetone 1 Hr./l MO.: Slight atttack/Severe attack Flux 1 Hr./l MO.: No attack/Slight attack
695
696
Adhesives, Sealants and Coatings for the Electronics Industry
3M CO.: SCOTCH-WELD EPX Applicator System(Continued): SCOTCH-WELD DP-270 Black Potting Compound/Adhesive: Phvsical Prooerties: -Approx. viscosity: Base: 22,000 cps Accelerator: 18,000 cps Mixed: 19,000 cps Specific Gravity: Base: 1.15 Accelerator: -98 Worklife 8 23C (73F): 60-70 minutes Handling Strength: 4-6 hours Full Cure: 2 Davs a 23C 1 Hour @ 80C Shore D Hardness: 82 Elongation: 2-3% Shear Strength on Aluminum: 2500 psi 180 Peel Strength on Aluminum: ~2 piw Thermal Prooerties: Glass Transition Temperature: 48C Thermal Conductivity (btu-ft./sq.ft.-hr. F): .105 8 45C Outgassing (5% wt. loss by TGA): 175C Thermal Coefficient of Expansion: 78x10 -16 Below Tg Electrical Properties: Dielectric Constant (1 KHZ @ 23C): 3.6 Dielectric Strength (volts/mil) (30 mil substrate): 700 Dissipation Factor (1 KHZ @ 23C): .018 Volume Resistivity (ohm/cm @ 23C): 4.1 x 10 14 Electrolytic Corrosion to Copper: Excellent Chemical Resistance: Isopropyl Alcohol 1 Hr./l MO.: No attack/Slight attack FREON TF 1 Hr./l MO.: No attack/No attack FREON TMC 1 Hr./l MO.: Slight attack/Severe attack l,l,l-trichloroethane 1 Hr./l MO.: No attack/Severe attack Acetone 1 Hr./l MO.: Slight attack/Severe attack Flux 1 Hr./l MO.: No attack/Slight attack
Encapsulating, Potting, Casting, Impregnating Compounds
697
TACC INTERNATIONAL CORP.: Casting, Potting, Encapsulating Resins: 700-82: Type: Epoxy One component, self leveling, heat cured epoxy potting/sealing compound. Features rapid cure at moderate temperatures to give high heat and chemical resistance. For filter media sealing or bonding ceramics or metals. 700-82-I is lower vise. (20,000) Catalyst Number: No catalyst required Mixed Viscosity 8 25C cps: 60,000 Recommended Cure Time: 2 hrs. at IOOC 5 min at 160C 15 min. at 121C 2 min at 175C Hardness Shore: 80-D Color: Beige 16-100: Type: Epoxy LOW viscosity, high temperature resistant system for box stack capacitors. Will not attack polycarbonate, polyester, polypropylene or metalized films. Meets UL-94 V-O requirements. Catalyst Number: 61 Mix Ratio Parts of Catalyst to 100 Parts Resin By Weight: 18 Workable Pot Life 100 gm. Mass @ 25C: >8 hrs. Mixed Viscosity @ 25C cps: 4800 Recommended Cure Time: l-2 hours at 1OOC Hardness Shore: 83-D Color: White ER-2042: Type: Epoxy Low viscosity, rigid, general purpose system designed for ease in handling with low shrinkage and high strength. Catalyst Number: 90 Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 7 Workable Pot Life 100 gm. Mass 8 25C: 30 min. Mixed Viscosity @ 25C cps: 6,000 Recommended Cure Time: Room Temp. 8 hrs. Hardness Shore: 80-D Color: Black ER-2050: Type: Epoxy Low viscosity, filled system with excellent dimensional stability, low shrinkage, exceptional resistance to impact, vibration and thermal shock. Machinable with excellent resistance to chemicals, moisture and solvents. Catalyst Number: ER-2048-B Mix Ratio Parts of Catalyst to 100 Parts Resin bv Weisht: 100 Workable Pot Life 100 gm: Mass @ 25C: 80 min. _ _ Mixed Viscosity @ 25C cps: 10,000 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 82-D Color: Black
698
Adhesives, Sealants and Coatings for the Electronics Industry
TACC
INTERNATIONAL
CORP.:
Casting, Potting, Encapsulating Resins
(Continued): ER-2060: Type: Epoxy Medium viscosity, non-critical mix ratio, general purpose designed for ease of use. Outstanding physical, thermal and electrical insulation properties. Catalyst Number: ER-2060-B Mix Ratio of Catalyst to 100 Parts Resin by Weight: 100 Workable Pot Life @ 100 gm. Mass 8 25C: 75 min. Mixed Viscosity @ 25C cps: 35,000 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 75-D Color: Black 700-88: Type: Epoxy Low cost, 2 component, 100% solids, fast cure designed for automotive electronics. Can withstand short exposures to 350F. Will not discolor. Catalyst Number: 700-88B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 75 Workable Pot Life 100 gm. Mass @ 25C: 6 min. Mixed Viscosity @ 25C cps: 1200 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 38-D Color: Black or Green 0476: Type: Epoxy Two component, semi-thixotropic liquid epoxy adhesive for potting applications. Very tough at both high and low temperature with good impact strength. Catalyst Number: 0476-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 25 Workable Pot Life 100 gm. Mass 8 25C: 60 min. Mixed Viscosity @ 25C cps: 150,000 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 80-D Color: Black or Green ER-2112: Type: Epoxy Flame retardant system meets UL-94 requirements. Premium grade which cures to a glossy, bubble free casting with excellent moisture, chemical and solvent resistance. Catalyst Number: 63 Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 15 Workable Pot Life 100 gm. Mass 8 25C: 60 min. Mixed Viscosity @ 25C cps: 14,000 Recommended Cure Time: Room Temp.: 24 hrs. Hardness Shore: 85-D Color: Black
Encapsulating, Potting, Casting, Impregnating Compounds
699
TACC INTERNATIONAL CORP.: Casting, Potting, Encapsulating Resins (Continued): ER-2300: Type: Epoxy Anhydride cure for excellent high temperature, thermal shock and arc track resistance. Catalyst Number: ER-2300-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 100 Workable Pot Life @ 100 gm. Mass @ 25C: 48 hrs. Mixed Viscosity @ 25C cps: 12,000 Recommended Cure Time: 2 Hrs. at 145C Hardness Shore: 87-D Color: Brown ER-2900: Type: Epoxy Light weight syntactic foam with toughness, impact resistance and excellent adhesion to metals , plastics and most other substrates. Catalyst Number: ER-2900-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 50 Workable Pot Life 100 gm. Mass @ 25C: 60 min. Mixed Viscosity @ 25C cps: 5,000 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 78-D Color: Amber 3125: Type: Epoxy One component, potting compound, highly filled for excellent heat resistance. (Class H-180C). Excellent resistance to strong solvents, gasoline, Freon, saltwater and mild acids. Catalyst Number: No catalyst required Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: NA Workable Pot Life 100 sm. Mass @ 25C: 6 mos. Mixed Viscosity 8 25C cps: 60,000 Recommended Cure Time: 10 min. - 180C 2 l/2 hrs. - 12OC Hardness Shore: 95-D Color: Black ER-2028: Type: Urethane Two component, closed cell foam system. Low viscosity and convenient 1:l mix. 10 minute demold time. Final density of about 20 lbs/cu. ft. Catalyst Number: ER-2028-B Mix Ratio Parts of Catalvst to 100 Parts Resin bv Weicrht: 100 Workable Pot Life 100 gm_ Mass @ 25C: 1 min. _ _ Mixed Viscosity @ 25C cps: 1000 Recommended Cure Time: Room Temp. 10 min. Hardness Shore: Foam Color: Pink
700
Adhesives, Sealants and Coatings for the Electronics Industv
TRA-CON,
INC.: Casting Systems:
TRA-CAST 3010: Flexible clear casting epoxy compound TRA-CAST 3010 is recommended for industrial embedding and casting applications where its combination of superior properties--good clarity, long pot-life, near-zero shrinkage, very low residual stress, improved high flexibility, and excellent impact strength--are required. It readily bonds to ceramics, glass, most metals, and many plastics, and it is therefore especially useful for aerospace and electronic applications where its flexibility, consistency and self-sealing properties are needed (i.e. repottable electronic assemblies). Fully cured TRA-CAST 3010 is a clear electrical insulator which is mechanically strong and tougher than comparable silicone gels, and it is further resistant to water, weather, gases and vapors, petroleum products (fuels, solvents and lubricants), mild acids and alkalis, salt solutions and many other organic and inorganic compounds. Color: Clear Specific gravity: 1.12 Viscosity (after mixing) cps @ 25C: 500 Operating temperature range, C: -70 to 105 Mix ratio, parts by weight Hardener/Resin: 35H/lOOR Elongation, %: 66 Hardness, Shore D: 20 Shore A: 65 Coefficient of expansion, cm/cm/C: 60-10 -6 Dielectric strength, Volts/mil: 305 Dielectric constant, 1 KHz @ 25C: 3.9 Dissipation factor, 1 KHz @ 2X: 0.019 Volume resistivity, ohm-cm @ 25C: l-10 12 Reactive solids content, %: 100
TRA-CAST 3011: Flexible clear epoxy casting compound TRA-CAST 3011 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties--good clarity, long pot-life, near-zero shrinkage, low residual stress, improved flexibility, and excellent impact strength--are required. It readily bonds to ceramics, glass, most metals, and many plastics, and it is therefore especially useful for aerospace and electronic applications where its flexibility, conistency and self-sealing properties are needed (i.e. repottable electronic assemblies). Fully cured TRA-CAST 3011 is a clear electrical insulator which is mechanically strong and tougher than comparable silicone gels, and it is further resistant to water, weather, gases and vapors, petroleum products (fuels, solvents and lubricants), mild acids and alkalis, salt solutions and many other organic and inorganic compounds.
Encapsulating, Potting, Casting, Impregnating Compounds
701
TRA-CON, INC.: Casting Systems (Continued): TRA-CAST 3011 (Continued): Color: Clear Specific gravity: 1.15 Viscosity, (after mixing) cps @ 25C: 870 Operating temperature range, C: -70 to 115 Mix ratio, parts by weight Hardener/Resin: 35H/lOOR Elongation, %: 66 Hardness, Shore D: 30 Shore A: 85 Coefficient of expansion, cm/cm/C: 61-10 -6 Dielectric strength, Volts/mil: 390 Dielectric constant, 1 KHz @ 25C: 3.9 Dissipation factor, 1 KHz @ 25C: 0.019 Volume resistivity, ohm-cm @ 25C: l-10 14 Reactive solids content, %: 100 TRA-CAST 3012: Flexible clear epoxy casting compound TRA-CAST 3012 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties--good clarity, long pot-life, near-zero shrinkage, low residual stress, improved flexibility, and excellent impact strength--are required. It readily bonds to ceramics, glass, most metals and many plastics, and it is therefore especially useful for aerospace and electronic applications where its flexibility, consistency and self-sealing properties are needed (i.e. repottable electronic assemblies). Fully cured TRA-CAST 3012 is a clear electrical insulator which is mechanically strong and tougher than comparable silicone gels, and it is further resistant to water, weather, gases and vapors, petroleum products (fuels, solvents and lubricants), mild acids and alkalis, salt solutions and many other organic and inorganic compounds. Color: Clear Specific gravity: 1.18 Viscosity, (after mixing) cps @ 25C: 2,100 Operating temperature range, C: -70 to 125 Mix ratio, parts by weight Hardener/Resin: 35H/lOOR Elongation, %: 3 Hardness, Shore D: 79 Coefficient of exoansion. cm/cm/C: 62-10 -6 Dielectric strength, Volts/mil: 390 Dielectric constant, 1 KHz @ 25C: 3.9 Dissipation factor, 1 KHz @ 2X: 0.016 Volume resistivity, ohm-cm @ 25C: 4-10 15 Reactive solids content, %: 100
702
Adhesives, Sealants and Coatings for the Electronics Industry
TRA-coft,
WC.:
Casting Systems (Continued):
TRA-CAST 3033: Communications
epoxy compound (Cable Cast "B1()
TIM-CAST 3033 (Cable Cast B) is a low viscosity solvent-free epoxy compound especially formulated for high reliability, airtight communication indoor/outdoor electric and telephone cable terminations and cable splicing, potting and plugging. This easyto-pour semi-rigid compound adheres to a wide variety of materials, and is compatible with all common wires, cable insulators, and sheaths. Amber-colored, tough, resilient TM-CAST 3033 cures at room temperature and has high impact and thermal-shock resistance, low permeability to oxygen, ozone and other gases, and is resistant to water, weather, most petroleum solvents and fuels, salt and salt solutions, and numerous chemical compounds. Fully cured TM-CAST 3033 is a thermoset with good electrical and structural properties at both high and low temperatures, does not melt or run, and offers permanent protection against moisture, electrolysis, leakage, corrosion and many other electronically difficult insulation environments in the electrical and communications industries. Color: Amber Specific gravity: 1.21 Viscosity (after mixing) cps: 2,000 Operating temperature range, C: -60 to 120 Tensile strength, psi @ 25C: 3,200 Elongation, 5: 23 Hardness, Shore D: 67 Coefficient of expansion, cm/cm/C: 50-10 -6 Dielectric strensth. volts/mil: 300 Dielectric constant; 1 KHz-@ 27C: 5.4 Dissipation factor, 1 KHz @ 27C: 0.010 Volume resistivity, ohm-cm @ 27C: 1.2-10 12 ohm-cm @ 70C: 1.0-10 11 TRA-CAST 3101: Low viscosity epoxy encapsulating
system
TRA-CAST 3101 is an easy-to-use, room-temperature-cure, rigid, low viscosity, 100% solids (no solvents) epoxy resin and hardener system with excellent mechanical and electrical properties. It is recommended for structural and electronic casting and encapsulating applications that require its excellent wetting and fluidity, good thermal expansion coefficients, and improved thermal shock resistance properties. TRA-CAST 3101 is readily mixed, handled and cured at room temperatures, and it adheres to a wide range of materials including most metals, glass, ceramics and many plastics. Fully cured TRA-CAST 3101 is a strong, tough, durable electrical insulator which is also highly resistant to weather, water, gases and vapors, petroleum lubricants and fuels and many mild acids and alkalis.
Encapsulating, Potting, Casting, Impregnating Compounds
TRA-CON, INC.: Casting Systene (Continued): TRA-CAST 3101 (Continued): Color: Tan Specific gravity: 1.5 Viscosity (after mixing) @ 25C, cps: 3,000 Heat distortion temperature, C: 85 Operating temperature range, C: -70 to 125 Tensile strenath. usi: 7.300 Compressive sfrength, psi: 12,000 Coefficient of expansion, cm/cm/C: 30-10 -6 Dielectric constant, 1 KHz @ 25C: 4.2 1 MHz @ 25C: 3.9 Dissipation factor, 1 KHz @ 25C: 0.02 1 MHz 8 25C: 0.02 Dielectric strength, volts/mil: 425 Volume resistivity, ohm-cm @ 25C: 1.4-10 14 8 1OOC: 8.5-10 10 TRA-CAST 3103: General purpose epoxy casting compound TRA-CAST 3103 is a room-temperature-cure, low viscosity two-Dart enoxv casting compound with superior adhesion to glass, ceramics, most-metais, many plastics (includes potting shells), and other electronic materials. It is specially formulated for general purpose electrical potting and encapsulating applications where good mechanical, thermal and electrical properties are required. TRA-CAST 3103 is an all liquid system with excellent flow and wetting characteristics, contains no solvents and is easily mixed, handled and cured with minimum shrinkage at room temperatures. The fully cured epoxy system is an electrical insulator with aocd imnact and thermal shock resistance. It is further resistant to water, weather, gases, galvanic action, petroleum fuels and solvents, alcohol, salts, and many mild acids and al.kalis. Color: Black Specific gravity: 1.58 Viscosity (after mixing) cps @ 25C: 8,000 Heat distortion temperature, C: 102 Operating temperature range, C: -60 to 145 Mix ratio, parts by weight Hardener/Resin: 10.5H/lOOR Hardness, Shore D: 85 Coefficient of expansion, cm/cm/C: 3.5-10 -6 Dielectric constant, 1 KHz @ 25C: 4.1 100 KHz @ 25C: 3.8 Dissipation factor, 1 KHz 8 25C: 0.01 100 KHz @ 25C: 0.01 Dielectric strength, volts/mil: 510 Volume resistivity, ohm-cm @ 25C: 4-10 16 Reactive solids content, %: 100
703
704
Adhesives, Sealants and Coatings for the Electronics Industry
TRA-CON, INC.: Casting Systems (Continued): TRA-CAST 3104: Low viscosity epoxy casting compound TRA-CAST 3104 is a low viscosity room-temperature cure epoxy casting system developed for high performance production encapsulation and impregnating applications where filling fine intricate free soace is reauired. This medium exotherm. low shrinkage system exhibits excellent flow and wetting characteristics. Its low viscosity allows for void-free filling and self-leveling in casting use, and excellent impregnation of fine wire transformers and coils. Fully cured TRA-CAST 3104 is a durable electrical insulator, dimensionally stable over a wide temperature range, and is resistant to moisture, gases, petroleum lubricants and fuels, salts, many mild acids and alkalis, and other organic and inorganic compounds. Color: Black Specific gravity: 1.54 Viscosity, (after mixing) cps @ 25C: 2,000 Operating temperature range, C: -60 to 125 Heat distortion temperature: 105 Mix ratio, parts by weight Hardener/Resin: 7H/lOOR Hardness, Shore D: 90 Coefficient of expansion, cm/cm/C: 40-10 -6 Dielectric strenath. Volts/mil: 450 Dielectric constant; 1 KHz-@ 25C: 4.6 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 2-10 14 Reactive solids content, %: 100 TRA-CAST 3107: Low shrinkage epoxy casting system TRA-CAST 3107 is a versatile epoxy casting system developed for high performance production potting, encapsulating, casting and tooling applications where low shrinkage, easy handling and flowability, and excellent mechanical and electrical properties are required. This formulation has good pot-life and low exotherm properties, and cures at room temperature to a tough, rigid, solid with very low shrinkage characteristics and excellent dimensional stability over a wide temperature range. TRA-CAST 3107 adheres to rigid plastics and laminates, metals, and ceramics, has a low coefficient of thermal expansion, and is readily machined and shaped with ordinary shop tools. The fully cured epoxy system is an excellent electrical insulator which provides good resistance to electrolysis, leakage, and corrosion from water, weather, gases and vapors, and from chemical compounds including mild acids and alkalis, many corrosive salts and salt solutions, petroleum products and lubricants, and many other organic and inorganic materials.
Encapsulating, Potting Casting, Impregnating Compounds
TRA-CON,
705
INC.: Casting Systems (Continued):
TRA-CAST 3107 (Continued): Color: Black Specific gravity: 1.67 Viscosity (afer mixing) at 25C, poise: 400 Ooeratins temperature ranqe, C: -70 to 125 Tensile strength, psi: 8,206 Compression strength, psi: 10,800 Elongation, %: 2.1 Hardness. Shore D: 89 Coefficient of expansion, cm/cm/C: 2.9-10 -6 Dielectric strength, volts/mil: 410 Dielectric constant, 1 KHz @ 25C: 4.2 Dissipation factor, 1 KHz @ 25C: 0.01 Volume Resistivity, ohm-cm @ 25C: 4.8 x 10 15 TRA-CAST
3109: Low cost epoxy casting system (Color coded for easy mixing)
TRA-CAST 3109 is a versatile epoxy resin system developed for solvent-free production casting, potting, encapsulating and coating applications where low cost, easy handling, good flowability, and superior mechanical and electrical properties are required. Color coded for easy mixing and pouring, this epoxy formulation cures to a tough, rigid, low-shrinkage solid in a matter of hours at room temperature, and is dimensionally stable over a wide temperature range. TRA-CAST 3109, with its good exotherm, pot life and pouring characteristics, is especially suited for larse mass (un to 1 sallon) castinss as well as for-other industrial and electronic iarge-pour appiications. It develops excellent adhesion to rigid plastics, laminates, ceramics and metals, has a low coefficient of thermal expansion, and can be readily machined with ordinary shop tools. The fully cured epoxy system is a good electrical insulator and is compatible with electrical components, has good resistance to water, weather, gases and vapors, and to many commercial organic and inorganic compounds including mild acids and alkalis, many corrosive salts, jet fuels, and petroleum products and lubricants. Color: Black Specific gravity: 1.57 Viscosity (after mixing) @ 25C, poise: 930 Operating temperature range, C: -60 to 140 Tensile strength, psi: 9,300 Compressive strength, psi: 12,700 Hardness. Shore D: 79 Coefficient of thermal expansion, cm/cm/C: 48-10 -6 Dielectic strength, volts/mil: 370 Dielectric constant, 1 KHz @ 25C: 4.77 Dissipation factor, 1 KHz @ 25C: 0.003 Volume resistivity, ohm-cm @ 25C: 7.5-10 14
706
Adhesives, Sealants and Coatings for the Electronics Industry
TRA-CON, INC.: Casting Systems (Continued): TRA-CAST 3110: Low-density epoxy casting system TRA-CAST 3110 is a unicellular, low-density, syntactic-foam epoxy resin casting system of medium viscosity that easily handles, mixes and cures at room temperature. Developed for industrial encapsulating, embedding and casting applications, it is suitable for aerospace honeycomb edge filling and for electronic potting jobs requiring a light-weight, low-shrinkage, and low-expansion resin system. Other important properties include a low exotherm while curing, a low-dielectric constant coupled with high-dielectric strength, a high strength-to-weight ratio, and a low thermal expansion coefficient over an operating temperature range from -50 to 150C. Fully-cured TRA-CAST 3110 is a grey, rigid, durable solid material that can be easily machined, cut, drilled, and shaped with ordinary shop tools. In addition, this excellent electrical insulator resists water, weather, gases, vapors, salts and salt solutions, alcohol, mild acids and alkalis, jet fuels, many petroleum products, salt water, and numerous other organic and inorganic compounds. Color: Grey Specific gravity: 0.68 Operating temperature range, C: -50 to 150 Compressive strength, psi: 13,000 Hardness. Shore D: 75 Impact, Izod, ft-lb/inch of notch: 0.2 Coefficient of thermal expansion, cm/cm/C: 22 x 10 -6 Thermal conductivity, gm Cal-cm/cm Z/set/C: 3 x 10 -4 Dielectric strength, volts/mil: 375 Dielectric constant, 1 KHz @ 25C: 2.9 Dissipation factor, 1 KHz 0 25C: 0.01 Volume resistivity, ohm-cm @ 25C: 2.4 x 10 14 TRA-CAST 3140: Fire Retardant Epoxy Casting Compound TRA-CAST 3140 meets the self-extinguishing requirements of MIL-I-16923E, Type C, insulating compound, and it also passes UL 94 V-O. It is recommended for rigid potting, laminating, transformer encapsulating, filament winding and coil embedding applications where a desirable combination of superior mechanical and electrical properties plus fire retardancy and room temperature curing is required. This easy-to-use low viscosity epoxy system has a low coefficient of thermal expansion, and exhibits excellent wetting and adhesion to most electronic and aerospace-industry materials (metals, glass products, ceramics, industrial laminates and many rigid plastics). Fully cured TRACAST 3140 is a durable electrical insulator, dimensionally stable over a wide temperature range, and is resistant to moisture, gases, petroleum lubricants and fuels, salts, many mild acids and alkalis, and other organic and inorganic compounds.
Encapsulating, Potting, Casting, Impregnating Compounds
707
TRA-CON, INC.: Casting Systems (Continued): TRA-CAST 3140 (Continued): Color: Ivory Specific gravity: 1.65 Viscosity (after mixing) cps @ 25C: 2,750 Operating temperature range, C: -60 to 145 Heat distortion temperature: 06 Mix ratio, parts by weight Hardener/Resin: 7H/lOOR Hardness, Shore D: 90 Coefficient of expansion, cm/cm/C: 48-10 -6 Thermal conductivity, Cal-cm/cm Z/set C: 7-10 -4 Dielectric strength, Volts/mil: 370 Dielectric constant. 1 KHz @ 25C: 4.77 Dissipation factor,.1 KHz: 0.003 Volume resistivity, ohm-cm @ 25C: 7-10 14 Heat resistance, weight loss @ 13OC, %: 0.04 Flammability: Self-extinguishing Reactive solids content, %: 100 TRA-CAST 3156: General purpose epoxy casting system TRA-CAST 3156 is an easy-to-use, low cost, verastile epoxy resin and hardener system developed for general purpose casting applications. It develops excellent adhesion to most metals, plastics, and ceramics, and is recommended for electrical and structural potting and encapsulating applications where the combination of good mechanical, thermal, electrical and room temperature cure properties are required. Fully cured TRA-CAST 3156 is a strong, tough, electrical insulator with high heat stability and a low thermal coefficient of expansion that provides successful performance over a wide temperature range. It is resistant to industrial environments that include water, weather, galvanic action, petroleum fuels, lubricants and solvents, gases and vapors, many mild acids and alkalis. Color: Black Specific gravity: 1.59 Viscosity (after mixing) @ 25C, poise: 8.50 Heat distortion temperature, C: 105 Operating temperature range, C: -60 to 155 Tensile strength, psi: 12,300 Hardness, Shore D: 89 Compressive strength, psi: 16,200 Coefficient of expansion, cm/cm/C: 35-10 -6 Dielectric Constant, 1 KHz @ 25C: 4.6 1 MHz @ 25C: 3.9 Dissipation factor, 1 KHz @ 25C: 0.01 1 MHz @ 25C: 0.02 Dielectric strength, volts/mil: 450 Volume resistivity, ohm-cm @ 25C: 6.5-10 15
708
Adhesives, Sealants and Coatings for the Electronics Industy
TRA-CON,
INC.:
Casting Systems (Continued):
TRA-CAST 3251: Water-white epoxy casting system (high impact) TRA-CAST 3251 is a transparent, low viscosity, solvent-free epoxy resin system developed for industrial casting, embedding, impregnating and laminating applications where its water-white claritv. aood wettina and suoerior structural. electrical and mechan'lcai properties are required. This easy:to-use casting system has a three day pot-life at 25C--however a final 115C cure step is required for complete cure and optimum physical properties. Fully cured TRA-CAST 3251 is an excellent electrical insulator, maintains good volume resistivity and has good mechanical orooerties over a wide temperature ranqe. Fairly larse embedded displays, coils, and transformers, and cast optic parts and lenses of TRA-CAST 3251 are water-white, strong and tough, and resistant to water, weathering, gases and vapors, petroleum lubricants and fuels, solvents, salt solutions and salts, many mild acids and alkalis, and many other organic and inorganic compounds. Color: Transparent, clear Index of Refraction: 1.56 Viscosity cps @ 25C: 2,750 Operating temperature range, C: 160 to 150 Specific gravity: 1.17 Tensile strength, psi: 7,400 Compressive strength, psi: 9,900 Elonaation. %: 11 Hardness, Shore D: 85 Coefficient of thermal expansion, cm/cm/C: 62-10 -6 Dielectric strenath. Volts/mil: 435 Dielectric constant; 1 KHz.@ 25C: 3.5 Dissipation factor, 1 KHz @ 25C: 0.006 Volume resistivity, @ 25C, ohm-cm: 8.2-10 14 TRA-CAST 3354: Low viscosity high temperature epoxy system TRA-CAST 3354 is a low viscosity, solvent-free epoxy resin castina system recommended for risid industrial laminatins, electrrcai potting and transformer and coil embedding appiications that require the effective combination of superior flow, good adhesion and excellent mechanical and electrical properties over a wide temperature range. This easy-to-use epoxy system develops good wetting and adhesion to glass and glass products, metals, ceramics, laminates, and many other high temperature-resistant products, is readily mixed and handled at room temperature--however a final 9OC cure step is required for a complete cure. The fully cured casting system, a most effective and durable electrical insulator, maintains a high volume resistivity, a low thermal expansion coefficient and good dimensional stability over a wide temperature range.
Encapsulating, Potting, Casting, Impregnating Compounds
TRA-CON,
709
INC.: Casting Systems (Continued):
TRA-CAST 3354 (Continued): In addition, it is resistant to electrolysis, galvanic action and leakage, and offers protection against water, weather, gases and vapors, petroleum lubricants and fuels, salt solutions, and salts, mild acids and alkalis, and many other organic and inorganic materials. Color: Black Specific gravity: 1.60 Viscosity (after mixing) @ 25C, cps: 4,000 Operating temperature range, Cf -60 to 195 Tensile strength, psi: 12,400 Compressive strength, psi: 16,800 Hardness. Shore D: 93 Coefficient of expansion, cm/cm/C: 30-10 -6 Dielectric strength, Volts/mil: 490 Dielectric constant, 1 KHz @ 25C: 4.3 Dissipation factor, 1 KHz @ 25C: 0.012 1 KHz @ 1OOC: 0.023 Volume resistivity @ 25C, ohm-cm: 5.6-10 16 @ IOOC, ohm-cm: 6.0-10 15 TRA-CAST 3357: High temp epoxy casting resin system (rigid) (Color coded for easy mixing) TRA-CAST 3357 is a smooth-pouring, low viscosity casting resin system recommended for rigid, large mass potting, encapsulating, laminating, filament-winding and coil embedment applications where the combination of superior mechanical and electrical properties plus good heat resistance is required. This colorcoded (light brown and blue) epoxy system is easy to mix and handle at room temperature--however, a final high-temperature step is required for its complete cure. TRA-CAST 3357 has a long pot-life, and exhibits excellent wetting and adhesion to metals, ceramics, glass and glass products, industrial laminates, most rigid plastics and other high-temperature-resistant products. This durable electrical insulator maintains its high volume resistivity at elevated temperatures, has a low coefficient of thermal expansion, and is stable over a wide temperature range. In addition, it provides excellent resistance to moisture, gases, petroleum products, salt solutions, mild acids and alkalis, and many other chemical materials. Color: Blue Specific gravity: 1.7 Viscosity (after mixing), cps @ 25C: 4,100 Operating temperature range C: -60 to 205 Heat distortion temperature, C: 155 Tensile strength, psi: 8,900 Hardness, Shore D: 91 Impact, Izod ft. lbs/inch of notch: 0.65 Dielectric strength, Volts/mil: 395 Dielectric constant, 1 KHz 8 25C: 3.4 Dissipation factor, 1 KHz @ 25C: 0.01 Volume resistivity, ohm-cm 8 25C: 8.5-10 15
Section VIII Films and Tapes
710
Films and Tapes
ABLESTIK: Hybrid Adhesive Films: Electrically Conductive: ABLEFILM ECF550: Work Life @ RT: 6 months Cure Schedule(s): l/2 hour @ 150C or 2 hours @ 125C Lap Shear Strength (Au to Au): 3500 psi Volume Resistivity: 0.001 ohms Storage Life: 9 months @ 5C or 1 year @ -40C Meets 5011: No Silver filled, epoxy adhesive film for substrate attach. Provides exceptional adhesion to gold and moisture resistance. Also available in a low temperature cure version. ABLEFILM ECF550X: Work Life @ RT: 3 days Cure Schedule(s): 1 hour @ 150C or 2 hours @ 125C Lap Shear Strength (Au to Au): 2100 psi Volume Resistivity: 0.008 ohm-cm Storage Life: 1 year @ -40C Meets 5011: No Silver filled adhesive film designed for micro-electronic applications which require conductivity in the X, Y, and Z axes. Also available in a low temperature cure version. ABLEFILM ECF561: Work Life @ RT: 3 months Cure Schedule(s): l/2 hour @ 150C or 2 hours @ 125C Lap Shear Strength (Au to Au): 1600 psi Volume Resistivity: 0.005 ohms Storage Life: 1 year @ -40C Meets 5011: No Silver filled, flexible adhesive film designed for bonding materials with severely mismatched coefficients of thermal expansion. ABLEFILM ECF561E: Work Life @ RT: 4 days Lap Shear Strength (Au to Au): 2100 psi Volume Resistivity: 0.001 ohm-cm Storage Life: 6 months @ -40C Meets 5011: No Rubber modified version of ECF561 designed for substrate attach with severe mismatch. Conductive in X, Y and Z axes.
711
712
Adhesives, Sealants and Coatings for the Electronics Industry
ABLESTIK: Hybrid Adhesive Films (Continued): Electrically Conductive (Continued): ABLEFILM ECF563: Work Life @ RT: 3 months Cure Schedule(s): l/2 hour @ 150C or 2 hours @ 125C Lap Shear Strength (Au to Au): 3000 psi Volume Resistivity: 0.004 ohm-cm Storage Life: 6 months @ SC Meets 5011: No Unsupported, silver filled adhesive film designed to provide very thin, uniform bondlines. Good thermal conductivity (1.1 BTU ft-1 hr-1 F-l). ABLEFILM ECF546AHF: Work Life @ RT: 3 days Cure Schedule: 2 hours @ 15OC Lap Shear Strength (Au to Au): 2900 psi Volume Resistivity: 0.0004 ohm-cm Weight Loss @ 300C: 0.15% Storage Life: 1 year @ -40C Meets 5011: Yes High purity, low outgassing, silver filled adhesive film for hybrid substrate attach. Provides isotropic conductivity similar to paste adhesives. ABLEFILM ECF571: Work Life @ RT: 2 days Cure Schedule(s): 314 hour @ 175C or 1 minute @ 250C Lap Shear Strength (Au to Au): 1750 psi Volume Resistivity: 0.0002 ohm-cm Weight Loss @ 300C: 0.16% Storage Life: 6 months @ -lOC or 1 year @ -40C Meets 5011: Yes Unsupported, silver filled adhesive film for hybrid substrate attach. Excellent thermal conductivity (3.9 BTU ft-1 hr-1 F-1).
Film and Tapes
ABLBSTIK: Hybrid Adhesive Films (Continued): Electrically Insulative: ABLEFILM 550: Work Life @ RT: 6 months Cure Schedule(s): l/2 hour @ 150C or 2 hours @ 125C Lap Shear Strength (Au to Au): 5500 psi Volume Resistivity: 1 x 10 14 ohm-cm Storage Life: 9 months @ 5C or 1 year @ -40C Meets 5011: No Moisture resistant adhesive film for substrate attach and commercial lid sealing. Excellent adhesiion to gold. Also available in a low temperature cure version. ABLEFILM 561: Work Life @ RT: 3 months Cure Schedule(s): l/2 hour @ 150C or 2 hours @ 125C Lap Shear Strength (Au to Au): 1600 psi Volume Resistivity: 5 x 10 12 ohm-cm Storage Life: 1 year @ -40C Meets 5011: No Flexible, repairable adhesive film for bonding materials with severely mismatched coefficients of thermal-expansion. Also available in a low temperature cure version. ABLEFILM 570: Work Life @ RT: 2 weeks Cure Schedule(s): l-1/2 hours @ 170C or 3 hours @ 150C Lap Shear Strength (Au to Au): 3600 psi Volume Resistivity: 8 x 10 14 ohm-cm Weight Loss @ 300C: 0.30% Storage Life: 3 months @ 5C or 6 months @ -lOC or 1 year @ -40C Meets 5011: Yes High purity, low outgassing adhesive film for military hybrid substrate attach.
713
714
Adhesives, Sealants and Coatings for the Electronics Industry
ABLESTIK: Hybrid Adhesive Films (Continued): Thermally Conductive: Thermal Wafer: Work Life @ RT: 6 months Cure Schedule(s): N/A Volume Resistivity: 1 x 10 14 ohm-cm Storage Life: 1 year @ 25C Meets 5011: No Flat, flexible preforms for use as thermally conductive interfaces between heat sinks, transistors, or dual-in-line packages. ABLEFILM 550K: Work Life B RT: 6 months Cure Schedule(s): l/2 hour @ 15OC or 2 hours @ 125C Lap Shear Strength (Au to Au): 3100 psi Volume Resistivity: 7 x 10 12 ohm-cmStorage Life: 9 months @ SC or 1 year @ -40C Meets 5011: No Thermally conductive version of 550. Also available in a low temperature cure version. ABLEFILM 561K: Work Life @ RT: 3 months Cure Schedule(s): l/2 hour @ 150C or 2 hours @ 125C Lap Shear Strength (Au to Au): 2050 psi Volume Resistivity: 1 x 10 13 ohm-cm Storage Life: 1 year @ -40C Meets 5011: No Thermally conductive version of 561. Designed for bonding heat sinks to PC boards. Also available in a low temperature cure version. ABLEFILM 570K: Work Life @ RT: 2 weeks Cure Schedule(s): l-112 hours @ 17OC or 3 hours @ 150C Lap Shear Strength (Au to Au): 2000 psi Volume Resistivity: 5.8 x 10 14 ohm-cm Weight Loss @ 300C: 0.27% Storage Life: 6 months @ -1OC or 1 year @ -40C Meets 5011: Yes Thermally conductive version of 570 for military hybrid substrate attach.
Films and Tapes
715
ADHESIVES RESEARCH, INC.: Conductive Pressure Sensitive Adhesives*: ARCLAD 8001: High tack, double coated conductive bonding tape, thin consistent adhesive film for bonding, assembly and lamination. "XYZ" dimensional conductivity. Potential Applications: shielding, interconnection, splicing and laminating. ARCLAD 8002: High tack, double coated conductive bonding tape, thin consistent adhesive system for bonding, assembly and lamination. "2" only dimensional conductivity. Potential Applications: grounding, multi-lead interconnection, static control and laminating. ARCLAD 8003: Conformable annealed single coated copper foil with high tack adhesive system; "XYZ" dimensional conductivity. Potential Applications: EMI/RFI shielding and cable splicing. ARCLAD 8004: Conformable closed cell semi-conductive foam with moderate tack adhesive; WXYZ" dimensional conductivity. Potential Applications: vibration and sound damping; static control, gasketing and sealing. ARCLAD 8005: Flexible single coated elastomeric film with moderate tack adhesive system; "XYZ" dimensional conductivity. Potential Applications: gasketing and sealing, flexible lamination. * Patent Pending ARCLAD PSAs are: instantly bonding conformable safe to use solvent free never messy uniformly thick/thin applied without any special equipment compliant under stress and temperature changes bondable to virtually any surface available in a wide range of adhesive properties die-cuttable
716
Adhesives,
Sealants
and Coatings for the Electronics
Industry
ADHESIVES RESEARCH, INC.: Conductive Pressure Sensitive Adhesive Tapes (Continued): ARCLAD 8001: Supported PSA bonding film coated two sides with electrically conductive adhesive; "XYZ" dimensional conductivity. Caliper: 5-mil Adhesive System: EC-2 Pressure Sensitive Dimensional Conductivity: 'X': Yes 'Y': Yes '2': Yes Volume Resistance: 10 1 Surface Resistance: 10 1 Peel Adhesion: 40 oz./inch Temp. Range: -2OF to 175F ARCLAD 8002: Supported PSA bonding film coated two sides with electrically conductive adhesive, 'Z' dimensional conductivity. Caliper: 5-mil Adhesive System: EC-2 Pressure Sensitive Dimensional Conductivity: 'X': No 'Y': No 'Z': Yes Volume Resistance: 10 1 Surface Resistance: >lO 4 Peel Adhesion: 40 oz./inch Temp. Range: -2OF to 175F ARCLAD 8003: 1 oz. copper foil coated one side with electrically conductive adhesive. Caliper: 3-mil Adhesive System: EC-2 Pressure Sensitive Dimensional Conductivity: 'X': Yes 'Y': Yes 'Z': Yes Volume Resistance: 10 1 Surface Resistance: 10 2 Peel Adhesion: 40 oz. finch Temp. Range: -2OF to 175F
Films and Tapes
717
ADHESIVES RESEARCH, INC.: Conductive Pressure Sensitive Adhesive Tapes (Continued): ARCLAD 8004: l/8" semi-conductive foam coated one side with electrically conductive adhesive. Caliper: .125" Adhesive System: EC-4 Pressure Sensitive Dimensional Conductivity: 'X': Static Dissipative 'y': Static Dissipative 'X': Yes Volume Resistance: 10 2 Surface Resistance: 10 3 Peel Adhesion: 30 oz./inch Temp. Range: -2OF to 175F ARCLAD 8005: Elastomeric film coated one side with electrically conductive adhesive. Caliper: 5-mil Adhesive System: EC-3 Pressure Sensitive Dimensional Conductivity: 'X': Yes 'Y': Yes '2': Yes Volume Resistance: 10 1 Surface Resistance: 10 2 Peel Adhesion: 30 oz./inch Temp. Range: -2OF to 250F
718
Adhesives, Sealants and Coatings for the Electronics Industry
A.I. TECHNOLOGY, INC.: Flexible ESP Series: "Tack-Free", Flexible, Room Temperature Storable Epoxy Film Adhesives -
Non-tacky film for easy handling Flexible with ability to bond mismatched TCE's Low ionic content of Chlorides, Sodium and Potassium Excellent adhesion to metals, ceramics and plastic substrates - Available in sheet sizes or custom preforms
Description: "Tack-free", flexible epoxy film adhesives are designed to meet the hybrid adhesive specification MIL STD 883C,. Method 5011.2. All of these are designed to meet NASA outgassing requirements as well. They possess excellent electrical (8000 series) and thermal conductivity (8000 & 7000 series) with the ability to be reworked at low temperatures (80-1OOC). The low Tg adhesives impose minimum thermal stress on bonded parts durinq thermal cycling and are ideal for bonding such mismatched TCE materials as-Aluminum to Alumina and Silicon to Aluminum. ESP7355: Filler: Alumina Cure Schedule: 15OC/30 min./l psi; or 2500/60 sec./l psi; or 35oc/ 5 sec./l psi Tg (C): -25 ESP7358: Filler: Al. Nitride Cure Schedule: 15OC/30 min./l psi; or 25OC/60 sec./l psi; or 35oc/ 5 sec./l psi Tg (C): -25 ESP7359: Filler: Diamond Cure Schedule: 15oc/30 min./l psi;or 25OC/60 sec./l psi or 35oc/ 5 sec./l psi Tg (C): -25 ESP8350: Filler: Silver Cure Schedule: 15OCl30 min./l psi: or 25OC/60 sec./l psi or 35oc/ 5 sec./l psi Tg (C): -25
Films and Tapes
719
A.I. TECHNOLOGY, INC.: Flexible ZSP Series: Z-Axis Conductive, Flexible, Zero Stress Film Adhesives Conductive in Z-Axis direction only. Ideal for fine pitch circuitry LOW ionic content of Chlorides, Sodium and Potassium Flexible with ability to bond materials with mismatched TCE's Available in sheet sizes or custom preforms Description: Z-Axis conductive flexible film adhesives are designed as an ideal solution for solder replacement in applications such as connector bonding, flex-circuit attach, die attach and component attach. They only conduct in one direction, the Z-axis, so there is no threat of bridging or shorting, problems commonly associated with traditional bonding materials. ZSP 8150: Filler: Silver Adhesive Base: Epoxy Cure Schedule: 15OC/30 min./l psi; or 25OC/60 sec./l psi; or 35oc/ 5 sec./l psi Tg (C): -25 ZSP 8550: Filler: Proprietary Adhesive Base: Epoxy Cure Schedule: 15oc/30 min./l psi; or 25OC/60 sec./l psi; or 35oc/ 5 sec./l psi Tg (C): -25 ZSP 8855: Filler: Silver Adhesive Base: Thermoplastic Cure Schedule: lSOC/S sec.13 psi Tg (C): -45 ZSP 8559: Filler: Diamond Adhesive Base: EPOXV Cure Schedule: 15OCi30 min./l psi; or 2500/60 sec./l psi; or 35OCl 5 sec./l psi Tg (C): -25
720
Adhesives, Sealants and Coatings for the Electronics Industry
A.I. TECHNOLOGY, INC.: Flexible TACK FILM: "No-Stress" Epoxy Film Adhesives with High Thermal or Electrical Conductivity. - B-Staged film adhesive with improved flow and adhesion. - Excellent Adhesion to Metals, Ceramics, and Plastic Substrates. - Low Ionic Content of Chlorides, Sodium and Potassium ((10 ppm). Description: TACK-FILM is a "flexible" epoxy film adhesive offering excellent reworkability at 80-150C. Designed to meet hybrid adhesive specificaction MIL-STD-883C/ Type 5011 except for high temperature bond strength. TACK FILM passes NASA outgassing requirements. It has excellent thermal conductivity. The low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling. TK7755: Filler: Alumina Curing schedule: 2h/l25C 30m/150C 1Omi175C Strength: Lap shear:. at 25C: (psi): 1200 (N/mm 2): 8.5 TK7758: Filler: Aluminum Nitride Curing schedule: 2h/l25C 30m/150C 1 Om/175C
Strength: Lap shear: at 25C: (psi): 1200 (N/mm 2): 8.5 TK7759: Filler: Diamond Curing schedule: 2h/l25C 30m/150C 1 Om/175C
Strength: Lap shear: at 25C: (psi): 1200 (N/mm 2): 8.5 TC8750: Filler: Silver Curing schedule: 2h/l25C 30m/150C 1 Om/175C
Strength: Lap shear: at 25C: (psi): 1200 (N/mm 2): 8.5
Films and Tapes
AMERICAN BILTRITE INC.: Printed Circuit Board Products: No. 9144: Protective Masking Printed Circuit Tapes Polyester film, transparent, clear, pressure sensitive silicone adhesive system, total thickness 2 mils. A strong thick tape designed for use in most masking oaerations durins Drinted circuit board prOdUCtiOn. Ideal fbr protection f;om splashes and fumes of chemicals used in tin/lead stripping and gold tab plating when applied in conjunction with 9180 platers tape...use for some silk screen applications, too. Physical Properties: Backing: Polyester Color: Clear, Transparent Total Thickness: 2 mils Elongation: 100% min. Adhesive: Silicone system Adhesion to Steel: 20 oz./in. width Tensile: 23 lbs./in. width No.
9145:
Low/Tat Protective Printed Circuit Tapes Polyester film, .OOl" THK, orange, with a .0005 mil cured rubber adhesive system. Replaces dry film resists at a lower cost, with reduced solvent contamination. Also protects copper from finger prints and chemical attack. Can be stripped from the board with no adhesive residue after one (1) week at 158F. Physical Properties: Backing: Polyester Color: Orange Total Thickness: 1.5 mils Elongation: 100% min. Adhesive: cured Rubber Adhesion: 4 oz./in. width Tensile: 20 lbs./in. width No.
9148: Protective Printed Circuit Tapes Polyester film, transparent, blue, pressure sensitive silicone adhesive system. total thickness 2.5 mils. Designed to p&form in all phases of the masking operations during printed circuit board production. Physical Properties: Backing: Polyester Color: Blue, Transparent Total Thickness: 2.5 mils Eloncration: 100% min. Adhesive: Silicone system/.0015 mils Adhesion to Steel: 25 oz./in. width Tensile: 23 lbs./in. width
721
722
Adhesives, Sealants and Coatings for the Electronics Indast~
AMERICAN BILTRITE INC.: Printed Circuit Board Products (Continued): No. 9150: Protective Printed Circuit Tapes Polyester film, transparent, yellow, pressure sensitive silicone adhesive system, total thickness 3.5 mils. Designed to perform in all phases of the masking operations during printed circuit board production. Physical Properties: Backing: Polyester Color: Yellow, Transparent Total Thickness: 3.5 mils Adhesive: Silicone system/.0025 mils Adhesion to Steel: 25 oz./in. width Tensile: 23 lbs./in. width No.
9180:
Platers Tape Printed Circuit Tapes Polyester film, transparent, red, pressure sensitive silicone adhesive system, total thickness 4 mils. Used for stop-off applications in the production of printed circuit boards particularly for use in tin/lead stripping and "gold-finger" plating operations. Physical Properties: Backing: Polyester Color: Red, Transparent Total Thickness: 4 mils Elongation: 100% min. Adhesive: Silicone system Adhesion to Steel: 20 oz./in. width Tensile: 23 lbs./in. width No.
9185:
Plating/Protective Printed Circuit Tapes Polyester film, transparent, green, pressure sensitive silicone adhesive system, total thickness 4 mils. Designed to perform in all phases of the masking operations for printed circuit board production. Physical Properties: Backing: Polyester Color: Green, Transparent Total Thickness: 4 mils Elongation/Break: 100% min. Adhesive: Silicone system Adhesion to Steel: 25 oz./in. width Tensile: 23 lbs./in. width
Films and Tapes
723
AMERICAN BILTRITE INC.: Printed Circuit Board Products (Continued): No. 9190: Protective Tape Printed Circuit Tapes Polyester film, transparent, blue, pressure sensitive silicone adhesive system, total thickness 3 mils. Designed to perform in all phases of the masking operations during printed circuit board production. When used in conjunction with 9180 "stop-off" tape it protects the circuitry from splashes and fumes of chemicals used in tin/lead stripping and gold tab plating. Physical Properties: Backing: Polyester Color: Blue, Transparent Thickness: 3 mils Elongation/Break: 100% min. Adhesive: Silicone system Adhesion to steel: 20 oz./in. width Tensile: 23 lbs./in. width No.
9321:
KAPTON* Printed Circuit Tapes A transparent amber colored polyimide film with a pressure sensitive silicone adhesive system. Protects gold contacts from molten solder during hot air wave solder leveling process. Physical Properties: Backing: Polyimide (KAPTON*) Total Thickness: 2.5 mils Color: Amber, Transparent Elongation: 60% min. Adhesive: Silicone svstem Adhesion to Steel: 20 oz./in. width Tensile: 23 lbs./in. width No.
9322:
KAPTON* Printed Circuit Tapes A transparent amber colored polyimide film with a pressure sensitive silicone adhesive system. Protects gold contacts from molten solder during hot air wave solder leveling process. Physical Properties: Backing: Polyimide (KAPTON*) Total Thickness: 3.5 mils Color: Amber, Transparent Elongation: 60% min. Adhesive: Silicone system Adhesion to Steel: 20 oz./in. width Tensile: 41 lbs./in. width * KAPTON is a registered TM of DuPont
724
Adhesives, Sealants and Coatings for the Electronics Industry
AMERICAN BILTRITE INC.: THERM-X Electrical Tapes: No. *730: No. *7300: No. *7307: THERM-X Electrical Tapes Glass Cloth IDEAL Glass Cloth THERM-X Electrical Tapes are designed for efficient application during production and provide superior performance in use. Ideal has combined glass cloth with its new THERM-X adhesives and razor slit fray-free edge to satisy industry and user specifications. All THERM-X adhesives are "pre-cured" to maximize resistance to flagging and resistance to varnish solvents. Ideal suoalied Rubber Thermosettinq (RTS) #730, Acrylic Thermosetting (ATS) #7307, and Silicone Thermosetting (STS) #7300 Glass Cloth THERM-X for your insulation class and economic needs. All three glass tapes are U.L. recognized with 7300 also rated for fire retardancy. 730
(RTS): Insulation Class: 130C Thickness, mils: 7.0 Tensile Strenqth, lbs./in.: 170 Elonaation. %I 0 Adhesion, oz./in.: 45 Dielectric Strength, volts: 3,300 Insulation Resistance, megohms: 350 Thickness Backing, mils: 5.0 Backing Type: Glass
7307 (ATS): Insulation Class: 155C Thickness, mils: 7.0 Tensile Strength, lbs./in.: 170 Elongation, %: 8 Adhesion, oz./in.: 30 Dielectric Strength, volts: 3,300 Insulation Resistance, megohms: 250 Thickness Backing, mils: 5.0 Backing Type: Glass 7300 (STS): Insulation Class: 180C Thickness, mils: 7.0 Tensile Strength, lbs./in.: 170 Elongation, %: 8 Adhesion, oz./in.: 35 Dielectric Strength, volts: 3,300 Insulation Resistance, megohms: 500 Thickness Backing, mils: 5.0 Backing Type: Glass * U.L. Recognized
Films and Tapes
725
AMERICAN BILTRITE CO.: THERM-X Electrical Tapes (Continued): No. *720: No. *724: THERM-X Electrical Tapes Polyester 724 - Black Polyester Woven Fabric Adhesive. 720 - White Polyester Woven Fabric Adhesive. Hish tensile, high tear resistant, coil outer wrap or insulation layer.. Insulation Class: 130C Total Thickness (Mils): 7.0 Elongation at Break (%): 35 Adhesion/Steel (oz./in.): 35 Tensile Strength (lbs./in.): 115 Dielectric Strength (Volts): 2,500 Insulation Resistance (Megohms): 1 * U.L. Recognized
Thermosetting Rubber Thermosetting Rubber conformable, printable,
x 10 3
No. 721: THERM-X Electrical Tapes Cotton A white cotton cloth with THERM-X rubber based thermosetting pressure sensitive adhesive system. Cotton Tape is noted for its conformable wrap as a Class 105C product in electrical applications. Abrasion resistant, number 721's backing is absorbent for extra impregnation. Insulation Class: 105C Total Thickness (Mils): 9.5 Backing Thickness (Mils): 7.5 Elongation rtt Break ($1: 7 Adhesion (oz./in.): 45. Insulation Strength (Volts): 2,500 Insulation Resistance (Megohms): 50 Tensile Strength (lbs./in.): 55 No.
*725: THERM-X Electrical Tapes Polyester Polyester Knitlthermosetting pressure sensitive rubber adhesive. Flexible, compatible polyester knit, coil wrapping and holding transformer construction, bundling and binding for electrical applications. Insulation Class: 130C Total Thickness (Mils): 13 Eloncation at Break (%): 20 Adhesion/Steel (oz./in;): 35 Tensile Strength (lb./in.): 35 Dielectric Strength (Volts): 2,500 * U.L. Recognized
726
Adhesives, Sealants and Coatings for the Electronics Industry
AMERICAN BILTRITE CO.: THERM-X Electrical Tapes (Continued): No. 7417: THERM-X Electrical Tapes Copper 1 mil copper foil with THERM-X acrylic based pressure sensitive adhesive. Flexible conductive copper foil tape that is used for electromagnetic shielding. Acrylic adhesive system gives good performance up to 155C. Insulation Class: 155C Total Thickness (Mils): 2 Backing Thickness (Mils): 1 Tensile Strength (lbs./in.): 15 Adhesion (oz./in.): 25 No.
*764: THERM-X Electrical Tapes Crepe
Saturated Crepe/thermosetting pressure sensitive rubber adhesive. Heavy dutv. puncture resistant - hold down application in __ coils and shaded pole motors. Insulation Class: 105C Total Thickneess (Mils): 22 Elongation at Break (%): 25 Adhesion/Steel (oz./in.): 40 Tensile Strength (lb./in.): 50 Dielectric Strength (Volts): 3,000 Insulation Resistance (Megohms): 15 * U.L. Recognized No. 765: THERM-X Electrical Tapes Crepe 3 mil paper crepe (tan) with THERM-X rubber based pressure sensitive thermosetting adhesive system. This product features a thin tough paper product with good tensile strength for electrical application. Insulation Class: 105C Total Thickness (Mils): 5.0 Paper Thickness (Mils): 3.0 Tensile Strength (lb./in.): 35 Elongation at Break (%): IO Adhesion (oz./in.): 35 Insulation Strength (Volts): 2,000 Insulation Resistance (Megohms): 10
Films and Tapes
727
?ihlBRIC!AN BILTRITE INC.: THERM-X Electrical Tapes (Continued): No. 702: THERM-X Electrical Tapes Polyester Polyester film clear with THERM-X rubber based pressure sensitive thermosetting adhesive system. A thicker version of 701, this tough, abrasion resistant tape is used for electrical applications requiring temperature performance to 130C and non-corrosive adhesive systems. Conformable to many irregular surfaces. Insulation Class: 130C Substrate (Polyester Film): 2 mil Total Thickness (Mils): 3.5 Adhesion (oz./in.): 45 Tensile Strength: 50 lbs./in. Elongation (%): 100 Insulation Strength (Volts): 7,000 Insulation Resistance (Megohms): 1 x 6 6 No. 7177: THERM-X Electrical Tapes ICAPTON* 1 Mil XAPTON film (Amber) with THERM-X acrylic based pressure sensitive thermosetting adhesive system. This product features toughness, puncture resistance, conformablity and Class 150C performance for electrical application. Insulation Class: 155C Total Thickness (Mils): 2.5 Film Thickness (Mils): 1.0 Elongation at Break (%): 50 Adhesion (oz./in.): 40 Insulation Strength (Volts): 7,000 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in.): 30 * XAPTON is a registered trademark of DuPont No.
*750: THERM-X Electrical Tapes Polyester Polyester film/polyester non-woven/thermosetting pressure sensitive rubber adhesive. Coil wrapping and holding transformer construction. Excellent edge tear resistance, solvent resistance. Insulation Class: 130C Total Thickness (Mils): 5 Adhesion/Steel (oz./in.): 35 Elonsation at Break (%): 50 Tensile Strength (lb;/&.): 40 Dielectric Strength (Volts): 5,000 * U.L. Recognized
728
Adhesives, Sealants and Coatings for the Electronics Industry
AMERICAN BILTRITE INC.: THERM-X Electrical Tapes (Continued): No. *700: No. *701: THERM-X Electrical Tapes Polyester 700 - Polyester film yellow with THERM-X rubber based pressure sensitive thermosetting adhesive system. 701 - Polyester film clear with THERM-X rubber based pressure sensitive thermosetting adhesive system. These thin, tough, abrasion resistant tapes are used for electrical applications requiring temperature performance to 130C and non-corrosive adhesive systems. Conformable to many irregular surfaces. 700: Insulation Class: 130C Total Thickness (Mils): 2.5 Elongation at Break (%I: 100 Adhesion (oz./in.): 50 Insulation Strength (Volts): 5,500 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in.): 23 701: Insulation Class: 130C Total Thickness (Mils): 2.5 Elongation at Break (%): 100 Adhesion (oz./in.): 50 Insulation Strength (Volts): 5,500 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in;): 23 * U.L. Recognized No. *7007: No. *7017: THERM-X Electrical Tapes Polyester 7007 - Polyester film yellow with THERM-X acrylic based pressure sensitive adhesive system. 7017 - Polyester film clear with THERM-X acrylic based pressure sensitive adhesive system. Tough, conformable and thin. The performance of these products is used in electrical applications where solvent resistance is required.
Films and Tapes
729
AMERICAN BILTRITE INC.: THERM-X Electrical Tapes (Continued): No. *7007 (Continued): No. *7017 (Continued): 7007: Insulation Class: 130C Total Thickness (Mils): 2.5 Film Thickness (Mils): 1 Eloncation at Break (%): 100 Adhesion (oz./in.): 45. Insulation Strength (Volts): 5,500 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in.): 23 7017: Insulation Class: 130C Total Thickness (Mils): 2.5 Film Thickness (Mils): 1 Elongation at Break (%): 100 Adhesion (oz./in.): 45 Insulation Strencth (Volts): 5.500 Insulation Resisfance (Megohmsi: 1 x 10 6 Tensile Strength (lbs./in.): 23 * U.L. Recognized No. 7170: No. 7270: THERM-X Electrical Tapes XAPTON** 7170 - 1 mil KAPTON** film (amber) with THERM-X silicone based adhesive pressure sensitive thermosetting adhesive system. 7270 - 2 mil XAPTON** film (amber) with THERM-X silicone based pressure sensitive thermosetting adhesive system. These oroducts feature toushness. ouncture resistance. conformability and class 18OC-performance for electrical. applications. 7270 being the thicker film has higher dielectric strength with greater tensile strength and puncture resistance. ** XAPTON is a registered trademark of DuPont
730
Adhesives, Sealants and Coatings for the Electronics Industry
AMERICAN BILTRITE INC.: THERM-X Electrical Tapes (Continued): No. 7170 (Continued): No. 7270 (Continued): 7170: Insulation Class: 180C Total Thickness (Mils): 2.5 Film Thickness (Mils): 1 Elongation at Break (%): 60 Adhesion (oz./in.): 22 Insulation Strength (Volts): 7,500 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in.): 31 7270: Insulation Class: 180C Total Thickness (Mils): 3.5 Film Thickness (Mils): 2 Elongation at Break (%): 60 Adhesion (oz./in.): 22 Insulation Strength (Volts); 8,500 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in.): 55 * XAPTQN is a registered trademark of DuPont.
Film and Tapes
731
AMERICAN BILTRITE INC.: THERM-X Electrical Tapes (Continued): No. 7180: No.
7190:
THERM-X Electrical Tapes Polyester 7180 - A one mil polyester with a red THERM-X silicone based thermosetting pressure sensitive adhesive system. Total thickness 4 mils. 7190 - A one mil polyester with a blue THERM-X silicone based thermosetting pressure sensitive adhesive system. Total thickness 3 mils. The primary feature of these polyester tapes is the silicone adhesive system which provides the highest solvent resistance. The other features of conformability, abrasion resistance, and strength supplied by the film backing are retained. 7180: Insulation Class: 130C Total Thickness (Mils): 4 Film Thickness (Mils); 1 Elongation at Break (%): 100 Adhesion (oz./in.): 20 Insulation Strength (Volts): 5,500 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in.): 23 7190: Insulation Class: 130C Total Thickness (Mils): 3 Film Thickness (Mils): 1 Elongation at Break (pi):100 Adhesion (oz./in.): 20 Insulation Strength (Volts): 5,500 Insulation Resistance (Megohms): 1 x 10 6 Tensile Strength (lbs./in.): 23
732
Adhesives, Sealants and Coatings for the Electronics Industy
ARLON: Circuit Materials: High Performance Adhesive Coated Dielectrics: Flame Retardant Acrylic Coated Aramid Paper: A thermoplastic flame retardant acrylic adhesive coated on aramid paper. Features: * Flame retardant * Excellent thermal and electrical properties * Consistent high bonds * Excellent solderability * Low adhesive flow * Excellent flexibility Applicatons: * Bus bars * Flat jumper cable * Transformer insulation Processing Conditions: Recommended cycle for laminating--Temperature: Cure time: 30 min. Cool time: 15 min. Pressure: 70-75 psi
380-385F
Availability: * 2 mil, 3 mil, 5 mil 410 NOMEX* * Up to 2 mils acrylic adhesive thickness Peel Strength min. lb/in.-width: 5.0 Dimensional Stability max. percent: 3.0 Flow, Max. mils./mil: 5.0 Volatile Content max. percent: 1.0 Solder Float: Pass _ Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 500 Insulation Resistance min. megohms: lOE04 Moisture & Insulation Resistance min. megohms: lOE03 Moisture Absorption max. percent: 15 Flammability UL94VTM-0: Pass *NOMEX is a registered
trademark ofDuPont.
Films and Tapes
ARLON: Circuit Materials
733
(Continued):
High Performance Adhesive Coated Dielectrics (Continued): Phenolic Coated Aramid Dielectric: NOMEX 410 coated on one or both sides with a dry "B" stage phenolic adhesive. Features: * Self extinguishing * Excellent solvent and chemical resistance * Solderability * Consistent high bonds * Controllable flow * Heat sealable in uncured state * Excellent electrical properties Applications: * Bus bar insulation * Circuitry * Transformer insulation * Jumper cables Processing Conditions: Recommended pressing conditions--Press cure to clean surface * Temperature: 340F * Pressure: 100 psi (must be balanced with resin flow requirements) * Dwell time: 20 min. Availability: * 2 mil, 3 mil, 5 mil 410 NOMEX * Up to 2 mil coating per side Peel Strength min. lb/in--width: 5.0 Dimensional Stability max. percent: 3.0 Flow, Max. mils/mil: 5.0 Volatile Content max. percent: 1.0 Solder Float: Pass Volume Resistivitv min. mesohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 500 Insulation Resistance min. megohms: lOE04 Moisture & Insulation Resistance min. megohms: lOE03 Moisture Absorption max. percent: 15 Flammability UL94VTM-0: Pass
734
Adhesives, Sealants and Coatings for the Electronics Industry
ARLON: Circuit Materials
(Continued):
High Performance Adhesive Coated Dielectrics (Continued): Flame Retardant Acrylic Coated Polyimide Film: Polyimide film coated on one or both sides with a high temperature acrylic resin. Features: * High performance solderable * Excellent electrical/mechanical properties * High adhesion to copper/polyimide film * Excellent dimensional stability * UL approved (VO Flame Rating) for commercial applications Applications: * Overlay for flexible circuits * Dielectric for flexible circuits * Bonding film for multilayer, rigid flex circuits Processing Conditions: Recommended parameters are 310-350F at 150-200 psi for 45 minutes. However, each user should determine processing conditions suited to his equipment. Availability: * Film thickness: commercial gauges 1.0-5-O mils * Coating thickness: 0.5-2.0 mils per side Peel Strensth min. lb/in-width: 10.0 Dimensional Stability max. percent: 0.20 Flow, Max. mils/mil: 5.0 Volatile Content max. percent: 2.0 Solder Float: Pass Volume Resistivity: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 2,000 Insulation Resistance min. megohms: lOE04 Moisture & Insulation Resistance min. megohms: lOE03 Moisture Absorption max. percent: 6.0 Flammability UL94VTM-0: Pass
Films and Tapes
AFILON:
Circuit Materials
(Continued):
High Performance Adhesive Coated Dielectrics
(Continued):
Acrylic Coated Polyimide Film: Polyimide film coated on one or both sides with a thermoplastic high temperature acrylic resin. Features: * High temperature solderable * Excellent electrical strength * Excellent mechanical properties * Resistant to alkalies, alcohols, ketones, diluted acids and water * Available in a high flow or low flow system to meet your process needs * High adhesion to copper/Kapton * Good dimensional stability Applications: * Overlay for flexible circuits * Dielectric for flexible circuits * Bonding film for multilayer, rigid/flex circuits * Solder masks for multilayer packages Processing Conditions: Recommended parameters are 310-350F at 150-200 psi for 45 minutes. However, each user should determine processing conditions suited to his equipment. Availability: * Film thickness: commercial gauges 1.0-5 mils * Coating thickness: 0.5-2.0 mils per side Peel Strength min. lb/in.-width: 8.0 Dimensional Stability max. percent: 0.20 Flow, Max mils/mil: 5.0 Volatile Content max. percent: 2.0 Solder Float: Pass Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strensth min. volts/mil: 2,000 Insulation Resistance min. megohms: 18E04 Moisture & Insulation Resistance min. megohms: lOE03 Moisture Absorption max. percent: 6.0 Flammability LJL94VTM-0: N/A
735
736
Adhesives, Sealants and Coatings for the Electronics Industry
ARLON: Circuit Materials
(Continued):
High Performance Adhesive Coated Dielectrics (Continued): Epoxy Coated Polyimide Film: An epoxy coated adhesive coated on one or two sided polyimide film. Features: * High temperature solderable * Excellent electrical strength * High adhesion to copper/polyimide * Compatible with most epoxy/glass prepegs Applications: * Overlay for flexible circuits * Dielectric for flexible circuits * Bonding film for multilayer, right/flex circuits Processing Conditions: Recommended parameters are 350-360F at 220-240 psi for 45 minutes. However, each user should determine processing conditions suited to their equipment. Availability: * Film thickness: commercial gauges 1.0-S mils * Coating thickness: 0.5-2.0 mils per side Peel Strength min. lb/in.-width: 10.0 Dimensional Stability max. percent: 0.20 Flow, Max. mils/mil:-5.0 _ Volatile Content max. percent: 2.0 Solder Float: Pass Volume Resistivity: min. megohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/nil: 2,000 Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 6.0 Flammability UL94VTM-0: N/A
Films and Tapes
ARLON: Circuit Materials
(Continued):
High Performance Adhesive Coated Dielectrics (Continued): Flame Retardant Epoxy Coated Polyimide Film: A flame retardant epoxy adhesive coated on one or two sided polyimide film. Features: * High temperature solderable * Excellent electrical strength * High adhesion to copper/polyimide * Compatible with most epoxy/glass prepegs * Will meet UL94VTM-0 flammability requirements Applications: * Overlay for flexible circuits * Dielectric for flexible circuits * Bonding film for multilayer, rigid/flex circuits * UL approved for commercial applications Processing Conditions: Recommended parameters are 350-360F at 220-240 psi for 45 minutes. However, each user should determine processing conditions suited to their equipment. Availability: * Film thickness: Commercial gauges 1.0-5 mils. * Coating thickness 0.5-2-O mils per side Peel Strength min. lb/in.-width: 10.0 Dimensional Stability max. percent: 0.20 Flow, Max. mils/mil: 5.0 Volatile Content, max. percent: 2.0 Solder Float: Pass Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 2,000 Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 6.0 Flammability UL94VTM-0: Pass
737
738
Adhesives, Sealants and Coatings for the Electronics Zndastry
ARLON: Circuit Materials
(Continued) :
Adhesive Cast Films: Acrylic Cast Film: A high temperature acrylic resin coated on a paper based release liner. Features: * High adhesion to metals/films * LOW flow * Excellent mechanical/electrical properties * Can be die stamped and tact laminated * Ease in handling Applications: * Used to bond circuit packages in multilayer * Bonding heat sinks to circuit boards * Adhesive for polyimide film/copper laminate Processing Conditions: Recommended pressure--Temperature: 310-350F Pressure: 200 psi Dwell Time: 1 hour Each user should determine processing conditions suited to their equipment. Availability: Available in 1,2 and 3 mil adhesive thickness Peel Strength min. lb/in.-width: 8.0 Dimensional Stability max. percent: N/A Flow, Max. mils/mil: 5.0 Volatile Content max. percent: 2.0 Solder Float: Pass Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 1,000 Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 6.0 Flammability UL94VTM-0: N/A
Films and Tapes
ARLON: Circuit Materials
(Continued):
Adhesive Cast Films (Continued): Flame Retardant Acrylic Cast Film: A flame retardant acrylic resin coated on a paper based release liner. Features: * Will pass UL-94VTM-0 flame test * High adhesion to metals/film * LOW flow * Excellent mechanical/electrical properties * Can be die stamped and tact laminated * Ease in handling Applications: * Used to bond circuit packages in multilayer * Bonding heat sinks to circuit boards * Adhesive for polyimide film/copper laminates Proceesing Conditions: Recommended Press Cure--Temperature: 310-350F Pressure: 200 psi Dwell time: 1 hour Each user should determine processing conditions suited to their equipment. Availability: Available in 1,2 and 3 mil adhesive thickness Peel Strength min. lb/in.-width: 10.0 Dimensional Stability max. percent: N/A Flow, Max. mils/mil: 5.0 Volatile Content max. percent: 2.0 Solder Float: Pass Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 1,000 Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 6.0 Flammability UL94VTM-0: N/A
739
740
Adhesives, Sealants and Coatings for the Electronics Industry
ARLON: Circuit Materials
(Continued):
Adhesive Cast Films (Continued): Epoxy Cast Film: A modified epoxy adhesive coated on a paper based release liner. Features: * High temperature solderable * Excellent adhesion to metals/films * Will suroass conventional acrylic resins in multilayer circuit application * Can be die stamped and tact laminated * Low flow Applications: * Used to bond circuit packages in multilayer * Bonding heat sinks to circuit boards * Compatible with most epoxy multilayer material Processing Conditions: Recommended parameters are 350-360F at 220-240 psi for 45 minutes. However, each user should determine processing conditions suited to their equipment. Availability: Adhesive thickness - 1.0 and 2.0 mils Peel Strength min. lb./in-width: 10.0 Dimensional Stability max. percent: N/A Flow, Max. mils/mil: 5.0 Volatile Content max. percent: 2.0 Solder Float: Pass Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 1,000 Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 6.0 Flammability UL94VTM-0: N/A
Films and Tapes
ARLON: Circuit Materials
(Continued):
Adhesive Cast Films (Continued): Flame Retardant Epoxy Cast Film: A modified flame retardant epoxy adhesive coated on a paper based release liner. Features: * Will oass UL94VTM-0 flammability requirements * High temperature solderable * Will surpass conventional acrylic resins in multilayer circuit applications * Can be die stamped and tact laminated * Low flow Applications: * Commercial flexible circuitry * Used to bond circuit pkgs. in multilayer * Bonding heat sinks to circuit brds. * Compatible with most epoxy multilayer materials Processing Conditions: Recommended parameters are 350-360F at 220-240 psi for 45 minutes. However, each user should determine processing conditions suited to their equipment. Availability: Adhesive thickness - 1.0 and 2.0 mils Peel Strength min. lb/in. width: 10.0 Dimensional Stability max. percent: N/A Flow, Max. mils/mil: 5.0 Volatile Content max. percent: 2.0 Solder Float: Pass Volume Resistivitv min. meaohms: lOE06 Surface Resistance min. megohms: lOE05 Dielectric Strength min. volts/mil: 1,000 Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 6.0 Flammability UL94VTM-0: Pass
741
742
Adhesives, Sealants and Coatings for the Electronics Industry
ARLON: Circuit Materials
(Continued):
Adhesive Coated Polyester Films: Flame Retardant Acrylic Coated Polyester Film: A thermoplastic flame retardant acrylic adhesive coated on polyester film. Features: * Flame retardant * Excellent thermal and electrical properties * Consistent high peel bonds * Low adhesive flow * Excellent flexibility * Excellent mechanical properties Applications: * Bus bar insulation * Flex circuitry * Alternative to polyimide in low temperature solder process * Transformer insulation Processing Conditions: Recommended cycle for laminating--Temperature: 260-300F Cure time: 30 min. Cool time: 15 min. Pressure: 70-75 osi Availability: * 1 mil, 2 mil, 3 mil, 5 mil circuitry grade polyester film (other grades and-thicknesses available)- _ * UP to 2 mils acrylic adhesive thickness Peel Strength min. lb/in.-width: 6.0 Dimensional stability max. percent: 1.5 Flow Max. mils/mil: 5.0 Volatile Content max. oercent: 2.0 Solder Float: Fail Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE04 Dielectric Strength min. volts/mil: 2,000 Insulation Resistance min. megohms: lOE05 Moisture & Insulation Resistance min. megohms: lOE04 Moisture Absorption max. percent: 5.0 Flammability UL94VTM-0: Pass
Films and Tapes
ARLON: Circuit Materials
(Continued):
Adhesive Coated Polyester Films (Continued): Heat Seal Coated Polyester Film Overlay: Circuitry grade dielectric polyester film coated with heat sealable polyester adhesive. Features: * Excellent adhesion to untreated (shiny side) ED or RA copper foil and untreated polyester film * Wide width capability * Tack free surface - no release sheet needed * Die stampable and punchable * Available in custom colors * Stabilized film available upon request Applications: * Used for protective overlay in flexible circuitry * Flat cable * Electrical insulation Processing Conditions: Recommended conditions for roll-to-roll sealing of flexible circuits--Temperature: 280F Pressure: 60 psi Roll speed: 10 fpm Availability: * 1 mil, 2 mil, 3 mil, 5 mil, 7.5 mil, and 10 mil circuitry grade polyester film * Up to 2 mils of heat seal coating * Custom colors * Slit widths to customer specifications Peel Strength min. lb/in. width: 5.5 Dimensional Stability max. percent: 1.3 Flow, Max. mils/mil: N/A Volatile Content max. percent: 1.0 Solder Float: Fail Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE04 Dielectric Strength min. volts/mil: 2,000 Insulation Resistance min. megohms: lOE04 Moisture & Insulation Resistance min. megohms: lOE04 Moisture Absorption max. percent: 2.0 Flammability UL94VTM-0: N/A
743
744
Adhesives, Sealants and Coatings for the Electronics Industry
ARLON: Circuit Materials
(Continued):
Adhesive Coated Polyester Films (Continued): Heat Seal Coated Polyester Film Overlay Flame Retardant: Circuitry grade dielectric polyester film with flame retardant heat sealable polyester adhesive. Features: * Meets UL specifications 94VTM-0 * Excellent adhesion to untreated ED or RA copper foil & untreated polyester foil * Wide width capability * Tack-free surface--no release sheet needed * Die stampable & punchable * Stabilized film available upon request Applications: * Used as protective overlay for flexible circuitry * Flat cable * Electrical insulation Processing Conditions: Recommended conditions for roll-to-roll sealing of flexible circuits--Temperature: 280F Pressure: 60 psi Roll speed: 10 fpm Availability: * 1 mil, 2 mil and 3 mil circuitry grade polyester film * Up to 2 mils of FR heat seal coating * Colors available * Slit widths to customer specifications Peel Strength min. lb/in.-width: 5.5 Dimensional Stability max. percent: 1.3 Flow, Max. mils/mil: N/A Volatile Content max. percent: 1.0 Solder Float: Fail Volume Resistivity min. megohms: lOE06 Surface Resistance min. mesohms: lOE05 Dielectric Strength min. volts/mil: 2,000 Insulation Resistance min. megohms: lOE05 Moisture & Insulation Resistance min. megohms: lOE04 Moisture Absorption max. percent: 2.0 Flammability UL94VTM-0: Pass
Films and Tapes
ARLON: Circuit Materials
745
(Continued):
Copper Laminates: Copper Foil/Polyester Film Laminate: One side or both sides, copper clad, polyester film dielectric with thermoset polyester adhesive Features: * Excellent oeel strensth * Flexibility * Wide width capability * Compatible with standard, continuous roll etching techniques * Stabilized film available upon request Applications: * Continuous etched flexible printed circuits * Flexible shielding Processing Conditions: * Can be processed through screen printing, post bake & cupric chloride (or compatible) etch * Cover film dielectric can be applied by silk screening or roll lamination of heat seal coated polyester film * Interconnecting can be acheived through crimping or low temperature soldering methods Avai lability: * l/2 oz., 1 oz., 2 oz. or 3 oz. high duct ED or RA foil. * 0.001" thermoset polyester adhesive * 1 mil, 2 mil, 3 mil or 5 mil circuitry grade polyester film (Lighter or higher gaugs also available) Peel Strength min. lb/in.-width: 5.5 Dimensional Stability max. percent: 1.3 Flow, Max. mils/mil: N/A Volatile Content max. percent: 1.0 Solder Float: Fail Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE04 Dielectric Strength min. volts/mil: 2,000 Insulation Resistance min. megohms: lOE04 Moisture & Insulation Resistance min. megohms: lOE04 Moisture Absorption max. percent: 2.0 Flammability UL94VTM-0: N/A
746
Adhesives, Sealants and Coatings for the Electronics Industry
ARLON: Circuit Materials
(Continued):
Copper Laminates (Continued): Copper Foil/Polyester Film Laminate Flame Retardant: One side or both sides, copper clad, polyester film dielectric with flame retardant, thermoset polyester adhesive. Features: * Passes Federal Motor Vehicle Safety Standard No. 302 for flammability * Excellent peel strength * Compatible with standard, continuous roll etching techniques * Wide width capability * Stabilized film available upon request Applications: * For use in circuitry which must meet automotive safety standards * Continuous etched flexible printed circuits Processing Conditions: * Can be orocessed throush screen orintins, post bake, and cupric chloride (or compatible) etch -. * Cover film dielectric can be applied by silk screen or roll lamination of heat seal coated polyester film * Interconnecting can be achieved through crimping or low temperature soldering methods Availability: * l/2 oz., 1 oz., 2 oz., or 3 oz. high duct ED or RA foil. * 0.001" flame retardant, thermoset polyester adhesive * 1 mil, 2 mil, 3 mil, or 5 mil circuitry grade polyester film (Lighter or higher gauges also available) Peel Strength min. lb/in. width: 5.5 Dimensional Stability max. percent: 1.3 Flow, Max. mils/mil: N/A Volatile Content max. oercent: 1.0 Solder Float: Fail Volume Resistivity min. megohms: lOE06 Surface Resistance min. mesohms: lOE04 Dielectric Strength min. volts/mil: 2,000 Insulation Resistance min. megohms: lOE04 Moisture & Insulation Resistance min. megohms: lOE04 Moisture Absorption max. percent: 2.0 Flammability: UL94VTM-0: Pass
Films and Tapes
ARLON: Circuit Materials
747
(Continued):
Adhesive Coated Copper Foils: Epoxy Coated Copper Foil: A high performance tetrafunctional/epoxy resin coated on l/2 oz. and 1 oz. and 1 oz. ED copper foil. Features: * High adhesion to standard FR4 prepreg * Reduces micro voids, eliminates weave expose * Improves surface electricals * Increased chemical resistance to chlorinated solvents * Improves handling of l/2 oz. copper * Available in l/2 oz. and 1 oz. high temperature elongation (HTE) copper Applications: * For use as a cap layer in multilayer rigid laminates Processing Conditions: * Cool entry * Bump pressure to 200 psi * Ramp heat to lOC/min. * Hold at 175C for forty minutes * Cool at 1OC for forty minutes Availability: * Slit width to customer specifications Peel Strength min. lb/in. width: 10.0 Dimensional Stability max. percent: N/A Flow, Max. mils/mil: 5.0 Volatile Content max. percent: .75 Solder Float: Pass Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE04 Dielectric Strength min. volts/mil: N/A Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 0.2 Flammability UL94VTM-0: N/A
748
Adhesives, Sealants and Coatings for the Electronics Industry
ARLON: Circuit Materials
(Continued):
Adhesive Coated Copper Foils (Continued): Phenolic Coated Copper Foil: A controlled flow phenolic resin coated on 1 oz. ED copper foil. Features: * High adhesion to phenolic XP board * Provides a controlled uniform flow which eliminates bleedout of the resin * Phenolic resin provides excellent tack properties when subjected to heat (180F) * Non-blocking, tack free surface Applications: * Used in the production of high volume die stamped hard board circuits Processing Conditions: * Recommended press cycle--Cool entry * Bump pressure to 250 psi * Ramp heat 1OC per minute to 1OOC * Hold for 10 minutes * Bump pressure to 400 psi * Increase heat to 140C * Cool at IOC per minute under pressure Availability: * l/2 oz., 1 oz., 2 oz., 3 oz. ED or RA foil available Peel Strength min. lb/in.-width: 10.0 Dimensional Stability max. percent: N/A Flow, Max. mils/mil: 1.0 Volatile Content max. percent: 1.0 Solder Float: Pass Volume Resistivity min. megohms: lOE06 Surface Resistance min. megohms: lOE04 Insulation Resistance min. megohms: N/A Moisture & Insulation Resistance min. megohms: N/A Moisture Absorption max. percent: 0.2 Flammability UL94VTM-0: N/A
Films and Tapes
CHR INDUSTRIES: KAPTON*TEMP-R-TAPE
749
Protection Tape:
Primary applications incude protecting printed circuit board connector fingers during wave soldering and hot air leveling and electrically insulating capacitors, coils and other devices. The tapes also are used for numerous other applications including general insulation, lead holding and component masking. Application Advantages: - High conformability and resistance to solvents and high temperatures assure full protection during wave soldering and hot air leveling. - Retention of electrical and mechanical properties up to 500F (26OC) permits use of thin wall sections to save weight and space. - Extra aggressive silicone adhesive allows use under more demanding conditions. - Adhesives can be thermoset to enhance adhesion and solvent resistance. - Outstanding resistance to cut-through, impact and abrasion. Toughness and flexibility at low temperatures provide extra protection under adverse conditions. Product Description: Each tape has its own set of distinguishing features, including various thicknesses of Kapton film and a choice of pressure sensitive silicone or acrylic adhesives. KlOO: Silicone adhesive on two sides with high temperature resistance and high dielectric strength for insulating. K102: High adhesion acrylic adhesive has excellent oil and solvent resistance for protecting connectors during wave soldering with solvent-based flux. K103: High quick stick and high adhesion acrylic adhesive for electrical insulation and wrapping. K104: Extremely thin, .0005" (0.0125mm) film and .OOl" (0.025mm) silicone adhesive with high conformability and dielectric strength for general insulating and wrapping. K245: Silicone adhesive with low adhesion and high dielectric strength for high speed wire and cable wrapping. K250: Silicone adhesive, flame retardant (UL510), with high dielectric strength and good solvent resistance for holding, insulating, wrapping and protecting during wave soldering with water based flux. K250X: Extra aggressive silicone adhesive for protecting connectors during hot air leveling. K350: Silicone adhesive, fire retardant (UL510) with highest dielectric and tensile strength for insulating and wrapping. *KAPTON isa registered trademark of DuPont.
750
Adhesives, Sealants and Coatings for the Electronics Industy
CHR INDUSTRIES: STRIP-N-STICK Silicone Rubber Tapes: Pressure-sensitive STRIP-N-STICK tapes are produced in a variety of widths and thicknesses for gasketing, cushioning, thermal insulation, electrical isolation and vibration damping. Other uses include: noise reduction, clamping of hot plates; and electrolysis reduction between dissimilar metals. The material has a uniaue chemical structure which aives it high temperature stability and general inertness unavailable in any other elastomer. From -1OOF (-73C) to 500F (26OC1, silicone out-performs all other elastomers in service life, compression set resistance, electrical strength and clean release. Aoolication Advantases: __ - Superior service life. - Compressible and flexible. Conforms to irregular shapes-even right angles. - Eliminates expensive die cutting. - High adhesion to stainless steel, plastics, aluminum and composites. - Non-corrosive. - Odorless. - Excellent weatherability. - Non-toxic. - Low compression set. 100s: A silicone sponge with a high temperature silicone adhesive. 200A: A silicone sponge with aggressive acrylic adhesive. 3ooAR: A reinforced silicone sponge with aggressive acrylic adhesive. Its unique construction provides the compressibility of sponge and dimensional stability of fiberglass reinforcement. Stretch is eliminated, which contributes to the consistent size and shape of cut parts and inhibits outward extrusion under high pressure. It further permits close tolerance slitting. 220A: Makes use of flame retardant ~10460 sponge and an acrylic adhesive. It offers instant gasketing and flame retardancy. 440s: A silicone solid with a high temperature silicone adhesive. 440A: Combines 30 durometer solid rubber with acrylic adhesive for an excellent gasket material. It provides high elongation and good conformability. 512AF: Uses CHR's new silicone fireblocking foam along with a film supported acrylic pressure sensitive adhesive.
Films and Tapes
751
CHR INDUSTRIES: TENP-R-TAPE D926 Wave Solder Protection Tape: Provides all of the required properties and performance at savings of up to 25% over the leading polyimide tapes for this application. Application Advantages: - High conformability to gold fingers; excellent adhesion to board; and resistance to flux chemicals and high temperatures assure full protection during wave solder. - Easily handled and applied. Strips hot or cold. Leaves no residue. - Up to 25% savings over leading polyimide tapes CHR INDUSTRIES: TEMP-R-TAPE
M797
Conformal Coating Protection
Tape: Because M797 was developed in cooperation with a military equipment manufacturer and was field tested in this application, the product offers several advantages over substitute masks used. - Lower unit cost - decreased labor and rework cost. - Lower rejection rate - no silicone or chemical release coat to flake off and cause cosmetic problems. - High temperature and solvent resistant adhesive - clean mask line, doesn't inhibit coating cure. - Removes cleanly, easily--no adhesive residue. CHR INDUSTRIES: TENP-R-TAPE C-665: C-665 is an electrically conductive tape made up of E.D. Copper Foil with an electrically conductive acrylic pressure sensitive adhesive. Typical devices that need shielding are:
I.C. Chips Electrical Cabinets Cables Motors Typical materials that need electrical contacts via conductive tapes are: PCB Circuitry Conductive: Glasses Plastics Paper Adhesive Properties: Thickness: 2.75 mils Liner: Blue Polypropylene Adhesion (20 minutes): 40 ozs/in. Tack: 590 g/sq.cm.
752
Adhesives, Sealants and Coatings for the Electronics Industy
CUSTOM COATING 8 LAMINATING CORP.: Silicone Printed Circuit Board Masking Tapes: UT-150: PC Board Masking Tape A new high temperature pressure sensitive printed circuit board masking tape that protects gold finger edge connectors during wave soldering. UT-150 is a high performance thermoplastic polyetherimide film featuring high temperature properties, solvent resistance and excellent dielectric strength. The silicone pressure sensitive adhesive resists chemicals and flux and strips hot or cold leaving no residue. Features: * Conforms well to goldfingers; excellent adhesion. * Resistance to corrosive chemicals (acids, alkalis, ketones, hydrocarbons, alcohol and water). * High temperature resistance assuring full protection. * Removes without adhesive transfer or residue. * Significant cost savings over polyimide tapes. * Stable electrical and dimensional characteristics over a wide range of temperatures and humidity. * High tensile strength, modulus and tear resistance. Physical Properties: Carrier: .OOl" Polyetherimide Color: Transaarent-Brown Total thickness: .0025" Adhesion to S/S: 25 oz/in width Tensile strength: 15,000 psi Elongation: 30-80% Dielectric strength: 4300 volts Adhesive: Silicone Roll length: 36 yds.
Films and Tapes
753
CUSTOM COATING AND LAMINATING CORP.: Silicone Printed Circuit Board Masking Tape (Continued): KT-150: PC Board Masking Tape KT-150 is a high performance polyimide film that provides the ultimate in printed circuit board protection. Thin and conformable, with outstanding puncture, tear and abrasion resistance at elevated temperatures. Gold fingers are safe from solder defects and costly reworks are eliminated. Featuring a specially formulated silicone adhesive that provides high temperature resistance and leaves no adhesive residue upon removal. Optimal product for gold finger protection during wave solder. Features: * Thin and conformable. * Outstanding puncture, tear and abrasion resistance. * Excellent high temperature adhesion. * Clean removal - No adhesive residue. * Resistant to corrosive chemicals. Physical Properties: Carrier: -001" Polyimide Color: Amber Total thickness: -0025" Adhesion to S/S: 25 oz/in width Tensile strength: 30 lbs/in @ 73F Elongation: 60% Dielectric strength: 7000 volts Adhesive: Silicone Roll length: 36 yds.
754
Adhesives, Sealants and Coatings for the Electronics Industry
DIELECTRIC POLYMERS, INC.: NELTAPE Specialty Tapes: NT-581 Fume Mask: NELTAPE 581 is a blue polyester tape with controlled adhesion and good conformability. The controlled level of crosslinking assures a proper balance of adhesion to substrates and chemical resistance. Surface Applications: Protection of circuit boards during plating process. Construction: Backing: Polyester Adhesive: Blue Crosslinked Silicone Gauge: 1 mil Polyester Film 1 mil Silicone Adhesive Performance Properties: Breaking Strength: 35 lb./inch Elongation: 130% Adhesion to Steel: 24 oz./inch Dielectric Strength: 5,400 volts Temperature Range: -4OF to 200F Bonding Information: Conformance to circuit board requires application of firm pressure with rubber covered rollers by hand or machine. A heat assist may be employed in laminating. Components requiring critical alignment can be machine laminated after hand alignment. NT-580 Platers Tape: NELTAPE 580 is a red polyester tape with controlled adhesion and good conformability for sharp line definition in etching and plating operations. The controlled level of crosslinking assures a proper balance of adhesion to substrates and chemical resistance and clean removal with no residue. Surface Applications: Solder strip bath and precious metal plating tank mask on printed circuit boards. Electrical insulation. Splicing of silicone release coated papers and textiles. Construction: Backing: Polyester Adhesive: Crosslinked Silicone Color: Red Gauge: 1 mil Polyester Film 3 mils Silicone Adhesive Performance Properties: Breaking Strength: 35 lb./inch Elongation: 130% Adhesion to Steel: 35 oz./inch Dielectric Strength: 5,400 volts Bonding Information: Conformance to circuit board requires application of firm pressure with rubber covered rollers by hand or machine. A heat assist may be employed in laminating. Components requiring critical alignment can be machine laminated after hand alignment.
Films and Tapes
755
DIELECTRIC POLYMERS, INC.: NELTAPE Specialty Tapes (Continued): NT-583 Printed Circuit Board Tape: NELTAPE 583 is a white polyester film tape with a thick silicone adhesive which is specifically compounded to resist plating bath chemicals in solder stripping and precious metal plating of finger contacts. The tape will conform with high circuit density patterns to provide clean line definition and resist undercutting. The adhesive can be removed without leaving residue, thereby eliminating the need for subsequent solvent scrubbing. Surface Applications: Solder strip bath and precious metal plating tank mask on printed circuit boards. Electrical insulation. Splicing of silicone release coated papers and textiles. Construction: Backing: Polyester Adhesive: Pressure sensitive silicone Color: White Gauge: 1 mil Polyester Film 3 mils Silicone Adhesive Performance Properties: Breaking Strength: 35 lb./inch Elongation: 130% Adhesion to Steel: 24 oz./inch Dielectric Strength: 5,400 volts Bonding Information: Conformance to circuit board requires application of firm pressure with rubber covered rollers by hand or machine. A heat assist may be employed in laminating. Components requiring critical alignment can be machine laminated after hand alignment. NT-590 Polyimide Film Tape: NELTAPE 590 offers optimum performance in electrical and thermal insulation with a continuous service temperature range of -1OOF to 500F (-73C to 26OC) with short term, intermittent service to 600F (315C). The highly crosslinked adhesive is well anchored to the polyimide film to eliminate squeeze-out/legging and provide clean removal on high temperature masking application. Surface Applications: Flame resistant electrical insulation, wire and cable wrap, wire bundle termination, splicing of high temperature reflective thermal insulating film. Solder mask for circuit boards. Release surface for heated platens in heat sealing/lamination. Construction: Backing: Polyimide Film 1 mil (0.025mm) Adhesive: Crosslinked Silicone 1.5 mil (0.038mm) Performance Properties: Breaking Strength: 30 lb./inch Elongation: 60% Adhesion to Steel: 36 oz./inch Dielectric Strength: 6,500 volts Insulation Class: 180C Bonding Information: Conformance to circuit board requires application of firm pressure with rubber coated rollers.
756
Adhesives, Sealants and Coatingsfor the Electronics Industry
DIELECTRIC POLYMERS, INC.: NELTAPE Polyester Protective Films (Continued): NT-4500 Series Protective Film: The NELTAPE 4500 series consist of a clear, premium grade, controlled low tack acrylic adhesive permanently bonded to a transparent polyester film. These protective films remove cleanly with no residue even after exposure to high and low temperatures. Resistance to moisture, solvent, mild acid and alkali, oil and grease is excellent. Surface Applications: Used to protect aluminum, stainless steel, nameplates, copper, instrument panels, P.C. boards, specialty metals and plastics. Also used in automotive and aerospace production during machining, bending, forming, handling, shipping and storage. NT-4500: Construction: Adhesive: Acrylate: 0.5 mils (.Olmm) Backing: Polyester: 1.5 mils (0.375mm) Performance Properties: Adhesion to Steel: 2 oz./inch Breaking Strength: 42 lb./inch Elongation: 110% NT-4502: Construction: Adhesive: Acrylate: .75 mils (.02mm) Backing: Polyester: 1.5 mils (.0375mm) Performance Properties: Adhesion to Steel: 6 oz./inch Breaking Strength: 42 lb./inch Elongation: 110% Bonding Information: Bonding surfaces should be clean, dry and free from grease and oils. Sharp tooling must be used in die cutting to avoid edge nicks which would tear upon removal. Adhesion level is consistent on a given material, but will vary on different substrates and surface finishes. NELTAPE 4500 is usually employed on bright, smooth metals and plastics, while NELTAPE 4502 is used on matte metals and textured plastics/finishes.
Films and Tapes
757
DIELECTRIC POLYMERS, INC.: NELTAPE Protective Films (Continued): NT-5000 Series Protective Film: The NELTAPE 5000 series consist of a clear, premium grade, controlled low tack acrylic adhesive permanently bonded to a transparent polyester film. These protective films remove cleanly with no residue even after exposure to high and low temperatures. Resistance to moisture, solvent, mild acid and alkali, oil and grease is excellent. Surface Applications: Used to protect aluminum, stainless steel, nameplates, copper, instrument panels, P.C. boards, specialty metals and plastics. Also used in automotive and aerospace production during machining, bending, forming, handling, shipping and storage. NT-5000: Construction: Adhesive: Acrylate: 0.5 mils (.Olmm) Backing: Polyester: 2 mils (.05mm) Performance Properties: Adhesion to Steel: 2 oz./inch Breaking Strength: 50 lb./inch Elongation: 90% NT-5002: Construction: Adhesive: Acrylate: .75 mils (.02mm) Backing: Polyester: 2 mils (.05mm) Performance Properties: Adhesion to Steel: 6 oz./inch Breaking Strength: 50 lb./inch Elongation: 90% Bonding Information: Bonding surfaces should be clean, dry and free from grease and oils. Sharp tooling must be used in die cutting to avoid edge nicks which would tear upon removal. Adhesion level is consistent on a given material, but will vary on different substrates and surface finishes. NELTAPE 5000 is usually employed on bright, smooth metals and plastics, while NELTAPE 5002 is used on matte metals and textured plastics/finishes.
758
Adhesives, Sealants and Coatings for the Electronics Industry
FINITE INDUSTRIES INC.: Electrical Tapes: 520 FINITE: Electrical Tape - 2 Mils A solvent-resistant tape with thermosetting adhesives. Has excellent chemical and thermal stability. For winding capacitors, coils, transformers and other critical components. Specifications: Backing: 1 mil polyester Adhesive: Acrylic Color: Clear Dielectric Strength: 5,000 volts Total thickness: 2 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion to Steel: 20 oz./in. width Temperature Class C: 130 521 FINITE: Electrical Tape--2.5 mils A solvent-resistant tape that is non-flagging, and has excellent chemical and thermal stability. Can be used "as is" or may be thermoset for maximum properties. The backing is free of all release agents either internal or applied, and is easily printable via standard flexographic methods. Use for winding capacitors, transformers, coils, other critical components. Specifications: Backing: 1 mil polyester Adhesive: Thermosetting rubber Color: Yellow Dielectric Strength: 5,000 volts Total thickness: 2.5 mils Tensile Strength: 25 lbs./in. width Elongation: 100% Adhesion to Steel: 45 oz./in. width Temperature Class C: 130
Films and Tapes
759
FINITE INDUSTRIES INC.: Electrical Tapes (Continued): 522 FINITE: Electrical Tape--3.5 Mils FINITE's thickest film backing with thermosetting adhesives-highly solvent-resistant, non flagging with excellent chemical and thermal stability. It can be used "as is" or may be thermoset for maximum properties. Backing is free of all release agents - internal or applied - and is easily printable by all standard flexographic methods. Use it for winding capacitors, coils, transformers, other critical components. Specifications: Backing: 2 mil polyester Adhesive: Thermosetting rubber Color: Yellow Dielectric Strength: 10,000 volts Total thickness: 3.5 mils Tensile Strength: 50 lbs./in. width Elongation: 100% Adhesion to Steel: 45 oz./in. width Temperature Class C: 130 590 FINITE: Hi-Temp Masking Tape A superb quality tape for general high temperature masking. Mav also be used as masking for the metallizinq of lead frames. Specifications: Backing: 1.42 mil polyester Adhesive: Rubber/resin Color: Translucent Total thickness: 3 mils Tensile Strength: 33 lbs./in. width Elongation: 160% Adhesion to Steel: 40 oz./in. width
760
Adhesives, Sealants and Coatings for the Electronics Industry
FINITE INDUSTRIES INC.: Printed Circuit Board Tapes: 510 FINITE: Multi-Layer Board Protection Replaces costly photo resists on the outer copper surfaces, while etching and oxidizing the inner layers. No. 510 replaces one of the rolls on a dry film laminator and is applied using same heat and pressure as the dry film resists--at l/3 the cost. Great for use with thick laminates. Also used for general masking. Specifications: Backing: 1 mil polyester Adhesive: Rubber/resin Color: Clear Total thickness: 1.5 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion to Steel: 22 oz./in. width 513 FINITE: Multi-Layer Board Protection FINITE 513 is a lower-tack multi-layer protection tape that does everything FINITE 510 does, but is recommended for use on thinner laminates and easier removal. Can be used effectively as a fume/splash protection tape during plating processes. Specifications: Backing: 1 mil polyester Adhesive: Rubber/resin Color: Translucent Total thickness: 1.5 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion to Steel: 20 oz./in. width 555 FINITE: Hot Air Levelling Tape This is a high performance film for prptection of gold finger contacts from molten solder during the hot air levelling process. It is thin, tough and leaves no residue after easy removal. For use with all H.A.L. machines. May also be used for other high-temp applications including coils, capacitors, harness and transformers, and wave soldering applications. Specifications: Backing: Polyimide film Adhesive: Silicone Color: Amber Total thickness: 2.5 mils Tensile Strength: 23 lbs./in. width Elongation: 60% Adhesion to Steel: 30 oz./in. width Temperature: Up to 600F
Films and Tapes
761
FINITE INDUSTRIES INC.: Printed Circuit Board Tapes (Continued): 556 FINITE: Hot Air Levelling Tape This is a high-temp KAPTON polyimide tape that fully protects gold finger contacts from molten solder during hot air levelling. It is thin, tough and leaves no residue. May be used for other hi-temp applications including coils, capacitors, and transformers. For use with Gyrex, Electrovert, Argus and other H.A.L. machines. Specifications: Backing: KAPTON polyimide film Adhesive: Silicone Color: Amber Total thickness: 2.5 mils Tensile Strength: 30 lbs./in. width Elongation: 60% Adhesion to steel: 30 oz./in. width Temperature: Up to 600F 574 FINITE: Fume/Splash Protection Tape This excellent quality tape has unparalleled conformability and fully protects larger areas of printed circuit boards from fumes and splashes during solder stripping and plating. It is highly recommended when superior adhesion is required. Specifications: Backing: 1 mil polyester Adhesive: Organicslsilicone Color: Blue Total thickness: 2 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion to Steel: 20 oz./in. width 574NS FINITE: Non-Silicone Masking Tape This is a superior quality non-silicone tape that protects larger areas of printed circuit boards from fumes and splashes during solder stripping and plating. It is a highly conformable tape that eliminates silicone contamination and the need for PCB cleaning solvents. Specifications: Backing: 1 mil polyester Adhesive: 1 mil Rubber/resin Color: Blue Total thickness: 2 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion to Steel: 16 oz./in. width
762
Adhesives,
Sealants
and Coatings for the Electronics
Industy
FINITE INDUSTRIES INC.: Printed Circuit Board Tapes (Continued): 575 FINITE: PCB Plating Tape--3 mils/SMOBC A pressure-sensitive plating tape for all masking operations during PC board production where slightly less adhesive thickness is acceptable. Protects circuitry from all chemicals and chemical fumes, leaving no residue. Also use as a solder mask over bare copper boards. Specifications: Backing: 1 mil polyester Adhesive: 2 mils Organics/silicone Color: Yellow Total thickness: 3 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion: 20 oz./in. width 576 FINITE: All-Silicone Plating Tape This highly conformable silicone adhesive formulation offers superior gold finger protection. It seals firmly above the finger area; prevents "leakers" and solution undercutting. Great PCB protection for batch processing. The tough polyester backing ensures clean, easy removal leaving no residue, or "cleaning-up" afterwards. Specifications: Backing: 1 mil polyester Adhesive: Silicone PSA type Color: Red Total thickness: 4.0 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion to Steel: 35 oz./in. width 578 FINITE: PCB Plating Tape--4.1 mils FINITE 578 taue has a softer, more conformable adhesive that eliminates leakage on normal and problem printed-circuit boards. It provides full protection from all chemicals and fumes during solder stripping and nickel and gold plating of tabs, without bath contamination. Provides superior stopoff line for finger tabs, with positive sealing, and leaves no residue. Specifications: Backing: 1 mil polyester Adhesive: 3.1 mils Organics/silicone Color: Red Total thickness: 4.1 mils Tensile Strength: 25 lbs./in. width Elongation: 90% Adhesion to Steel: 30 oz./in. width
Films and Tapes
FINITE
INDUSTRIES
INC.:
763
Printed Circuit Board Tapes (Continued):
579 FINITE: Non-silicone Plating Tape This unique product can be used cold on "SMOBC" boards, and with mild heat 579 will perform as a regular plater's tape on all printed circuit boards. The addition of heat makes the adhesive more conformable under all conditions, yet will not produce any visible or invisible residue, thereby eliminating the need for any cleaning prior to "solder flow" or the application of "solder reflow." Specifications: Backing: 1 mil polyester Adhesive: 3 mils Rubber/resin Color: Blue Total thickness: 4 mils Tensile Strength: 25 lbs./in. width Elonqation: 90% Adhesion to Steel: 22 oz./in. width 580 FINITE: Non-silicone Plating Tape 580 can be applied under normal procedures and will perform as a regular plater's tape on all printed circuit boards. It is formulated so the addition of mild heat makes the adhesive more conformable for boards that are "dirty" or have a tendency to create "leakers." Either way--with or without heat--580 will not produce any visible or invisible residue, eliminating the need for any cleaning prior to "solder reflow" or the application of "solder mask .? Specifications: Backing: 3.2 mils Extruded Plastic Adhesive: 3 mils Rubber/resin Color: Green Total thickness: 6.2 mils Tensile Strensth: 10.5 lbs./in. width Elongation: 360%+ Adhesion to Steel: 35 oz./in. width 650 FINITE: Hi Temp Wave Soldering Tape A high strength, high performance tape with a specially treated paper base, and a heat and chemical resistant coating. Designed to fully protect gold or rhodium plated printed circuit board finger tabs, assembly holes and components thru the flux, pre-heat and solder temperatures. Easily and cleanly removed; leaves no residue. Specifications: Backing: 4 mil Rope paper Adhesive: Silicone Color: Tan Total thickness: 6.5-7.2 mils Tensile Strength: 40 lbs./in. width Elongation: 3.5% Adhesion to Steel: 50 oz./in. width Temperature: Up to 500F
764
Adhesives, Sealants and Coatings for the Electronics Industy
FINITE INDUSTRIES INC.: Printed Circuit Board Tapes (Continued): 651 FINITE: Hot Air Levelling Tape A thick base consisting of specially treated paper and polyester film with silicone adhesive, forming a tough tape for hot air levelling--and in some instances for hi temp wave soldering as well. Protects gold or rhodium PCB finger contacts, assembly holes and components. Removes easily leaving no residue. For Gyrex, Argus and other H.A.L. machines. Specifications: Backing: Paper/film Adhesive: Silicone Color: Tan Total thickness: 7.5 mils Tensile Strength: 40 lbs./in. width Elongation: 3.5% Adhesion to Steel: 46 oz./in. width
Films and Tapes
SHELDAEL: SHELDAHL FLEXCONNECT Materials Flame Retardant Adhesive on Polyester Film T-1694: T-1694 is a family of SHELDAHL engineered flame retardant adhesives on polyester films for manufacture of flat conductor cables. These tapes can be provided with various combinations of adhesive thickness and polyester film thickness. Features: These self-extinguishing tapes have been specially formulated for fabricating flexible flat conductor cables, or a coverlay for flexible circuitry. T-1694 cables can be designed as a roll up cable or accordion folded. Flat conductor cables are a lightweight, cost effective interconnection for circuitry applications. The hish temnerature adhesive system allows solder coating of cable leads without delamination. T-1694 products can be heat sealed with a hot nip roll at 350F;-lOF, 80-100 pli or platen pressed at 275-300F, 100-200 psi for 10 minutes and cooled under pressure to lOOF. Flame Retardant Adhesive on Polyester Film: Class 1: Peel strength, min., lb/in. As received: 3.0 After solder float: N/A After temp. cycling: 3.0 Tensile strenqth, min. lb/in 2: 20,000 Elongation, minimum percent: 90 Initiation tear strength, min. gms: 800 Propagation tear strength, min. gms: 0.0015 to co.004 inch thick: 20 >0.004 inch thick: 50 Flow, max. (squeeze out in mils): 10 Volatile content (max. percent): 2 Flammability, min. percent 02: 28 Chemical resistance percentage: 60 Dielectric strength, min. volts/mil: 2500 Insulation resistance, min., megohms: 10 2
765
766
Adhesives, Sealants and Coatings for the Electronics Industry
SHELDAHL: SHELDAHL FLEXCONNECT Materials Polyester Resin on Polyimide Film: T-320: T-320, a heat activated thermoplastic polyimide coverlay tape, has been designed to complement ~-7510, a copper x polyimide laminate, in flexible circuitry. The tape provides reliable insulation and protection for the circuit and is readily soldered. Easy to Apply: Thermoplastic tapes are not tacky or sticky. High Speed Production: Offers economical continuous roll processing. High Bond Strength: With 90 peel at 68F, the peel strength for 3 mil polyimide bonded to itself is 4 pounds per inch. Various Thicknesses: Available with adhesive thicknesses from 0.5 to 2.0 mil and film thicknesses from 1 to 5 mil. Wide Range of Roll Sizes: l/2 inch--24 inches wide; standard roll length of 300 feet. Five Year Shelf Life Polyester Resin on Polyimide Film: 1 mil film x 1 mil adhesive: Physical: Ultimate Tensile Strength, psi: (MD): 25,000 % Elongation (MD): 70 Tensile Modulus psi (MD): 430,000 Propagating Tear Strength gm/mil: 8 Folding Endurance (MIT) (cycles): 10,000 Chemical: Moisture Absorption % 50% RH at 23.5C: 3.0 Hydrogen Permeability: 220 Water Vapor Permeability: 5.4 Funcus Resistance: Inert Functional: Shelf Life (years): >5 Bond Strength lb/in: 4 Density g/cc: 1.34 Dimensional: Area Factor ft 2/lb: 72 Thickness Tolerance %: +-IO Coefficient of Linear Expansion inch/inch/C: 2.0 x 10 -5 Coefficient of Hygroscopic Expansion inch/inch/% RH: 2.2 x 10 -5 Thermal: Sealing Temperature Range F Adhesive: 250-320 Service Temperature F: 200 Thermal Shock 300F: 0.2 Electrical (1 x 2 mill: Dissipation Factor: .014 Dielectric Strength: 13,000 Dielectric Constant: 4.0 Volume Resistivity: 1.8 x 10 17 Surface Resistivity: 9 x 10 13
Films and Tapes
767
SHHLDAHL: SHELDAHL FLEXCONNECT Materials Self-Extinguishing Adhesive Coated Polyester T-340: T-340, a heat activated thermoplastic polyester fiim tape, has been developed as a coverlay material to complement ~-5575 (self-extinguishing copper clad) laminate in flexible circuit applications. It has also been accepted in the construction of collated flat cable and wire wraps. The tape is self-extinguishing within seconds after ignited in a horizontal or vertical position in tape and flat cable configurations. The tape is supplied translucent white in color. Easy to Handle: Thermoplastic tapes are not tacky or sticky. High Speed Production: Offers economical continuous roll processing. High Bond Strength: With 90 peel at 68F, the peel strength for 3 mil polyester bonded to itself is 4 pounds per inch. Self-Extinguishing: Oxygen Index is greater than 28 for polyester film thickness less than 5 mils. Wide Range of Roll Sizes: l/2 inch - 24 inches wide; standard roll length of 300 feet. Five Year Shelf Life T-340 relies on the ability of a proprietary self-extinguishing thermoplastic adhesive to keep the adhesive/polyester composite from burning. Thus, the Oxygen Index value will vary depending on the ratio of adhesive to film. The table below shows this effect listing several combinations. 1 l/2 mil adhesive x 2 mil polyester film: 30% 1 l/2 mil adhesive x 3 mil polyester film: 30% 2 mil adhesive x 2 mil polyester film: 32% (1 l/2 mil adhesive x 7 mil polyester film: 22%) Physical (1 mil film): Ultimate Tensile - psi: 20,000 Ultimate Elongation - 8: 120% Tensile Modulus - psi: 500,000 Shelf Life - Years: >5 Bond Strength - lb/in: 4 Thermal: Service Temp. Intermittent: 125C Service Temp. Continuous: 85C Thermal Shrink Maximum %: 2.0 MD: l/2 hour at 300F 1.0 TD Electrical: (Based on 2 mil Adhesive x 3 mil Polyester Film): Dielectric Strength - Volt/l/l in. Electrode: 8,000 Dielectric Constant: 2.9 min. Volume Resistivity - ohm/cm : 1.2x10 16 Surface Resistivity - ohm/q: 2.0x10 16 Flammability: Oxygen Index Minimum: 28
768
Adhesives, Sealants and Coatings for the Electronics Industry
SHELDAHL: SHELDAHL FLEXCONNECT Materials 1 Mil Adhesive x 2 Mil Polyester Film x 1 Mil Adhesive T-1502: T-1502 is a polyester film coated on both sides with a thermoplastic adhesive. When subjected to appropriate conditions of heat and pressure, it bonds to a wide variety of substrates such as aluminum, copper, MYLAR, KAPTON, DACRON, Nylon fiberglass and glass-epoxy. T-1502 is offered as an alternate to T-400 when a lower sealing temperature or a faster cycle time is desired. Excellent Adhesion 4 lb. to Mylar; 4 lb. to treated Mylar Excellent Electrical Properties Volume resistivity greater than 10 16 ohm/cm Excellent Stability No significant change in color or bond strength after six weeks at 70C or six months exposure in the field. Less than 50% change in bond strength after six months sealed in a jar over or under water Property: Physical: Ultimate tensile strength, psi: 22,200 Elongation %: 130 Tensile modulus. usi: 550.000 Propagating tear strength'gmlmil: 70 Initial tear strength gm/mil: 250 Folding endurance l/2 kg loading: 50,000 Moisture Absorption %: 0.8 Water Vapor Permeability qm/lOO in 2/24 hr.: 1.0 Fungus Resistance: Inert Shelf Life, Yrs.: >5 Bond Strength lb/in: 4 Density: 1.33 Dimensional: Area Factor ft Z/lb/mil: 146 Thickness Tolerance, %: +-lo max. Coefficient of linear expansion, inch/F: 0.6x10 -5 Coefficient of hygroscopic expansion inches/inch/% R-H.: 1.0 x 10 -6 Thermal: Melting Service Service Thermal
Temp. Range F: 240-270 Temp. Intermittent, F: 200 Temp. Continuous, F: 170 Shrink l/2 hr at 300F, %: 2.0
Electrical: Dielectric Strength, volts/mil: 3500 Dielectric Constant: 3.3 Dissipation Factor: 0.005 Volume Resistivity ohm/cm: 1x10 17 Surface Resistivity, ohms: 3x10 9
Films and Tapes
769
SHELDAHL: Thermosetting Structural Adhesive T-1401: T-1401 is a film adhesive designed for bonding dissimilar materials (and metal-to-metal bonding) where high strength and good creep resistance are required. T-1401 has excellent solvent, oil, and moisture resistance. T-1401 adhesive is available coated on release paper, KAPTON, or various foils. The adhesive can be reinforced using spun bond, woven, or non-woven fabrics. * Dry Film Adhesive * Heat Activated * High Bond Strengths
* 100% Solids * Flexible * Solvent and Moisture Resistance
* High Bond Strengths In excess of 5000 lbs/in 2 shear. * High Mechanical Strength Tough and flexible. * Versatility Effective on a variety of dissimilar substrates. * Handling Ease Tack-free dry film allows easy positioning, no glue pot, no solvent. * Solvent and Oil Resistant Useful in oil exposed parts, gaskets, etc. * Long Shelf Life Completely reactive at elevated temperatures, but does not cure at ambient temperatures T-1401 has been specifically designed for heat activated metal;;;,";;a1 bonding. It can also be used in bonding dissimilar mat, e.g., copper-polyimide, copper-ceramic, and fabric-polyimide. Typical Applications: 1. Mounting Operations 2. Electrical Components 3. Lap Splicing 4. Miscellaneous High Strength Bonding Technical Data: Thickness: 0.001 inches Peel Alumimum to Aluminum: 20 lbs/in. Shear Aluminum to Aluminum: 5,000 lbs/in. 2 Shear Aluminum to Aluminum: (after 14 days 95% RH, 35C): 5,000 lb/in. 2 Color: Green
770
Adhesives, Sealants and Coatings for the Electronics Industry
TESA TUCK INC.: Electronic Tapes: Electronic Packaging (Bandoliering) Tapes: TESABELT 7418 Creped Paper Tape: This hishlv flexible creoed oaoer taoe offers suoerior adhesion and ;'wrap around" of axial lead wires compared to that of a flatback paper. At the end of each roll there is a length of colored tape that"'warns" the operator to add/ splice in a new roll of tape. Blue, cream. Used for sequencing/bandoliering axial leaded electronic components. Thickness: 7.2 mils Adhesive: Natural Rubber Carrier: Creped Paper Tensile Strength: 25 lbs/in Adhesion: 36 oz/in Elongation: 12% TESABELT 51330 Creped Paper Tape: Creped paper tape recommended for bandoliering of axial components. At the end of each roll there is a length of colored tape that "warns" the operator to add/splice in a new roll of tape. Cream. Used for bandoliering/reeling axial leaded electronic components. Thickness: 6.3 mils Adhesive: Natural Rubber Carrier: Creped Paper Tensile Strength: 25 lbs/in Adhesion: 36 &/in Elongation: 12% Temperature Resistance: 350F TESABELT 4382 Creped Paper Tape: Creped paper tape with heat activated adhesive. Tightly affixes components to cardboard carrier so that they stay in place for storage and automatic insertion. Adhesive will not re-activate during 300F de-aging process. Ideal for bandoliering/reeling radial leaded components. Thickness: 7.1 mils Adhesive: Heat Activated Acrylic Carrier: Creped Paper Elongation: 12% Temperature Resistance: Maximum Sealing at 250F. Begins to activate at 175F
Films and Tapes
TESA TUCK INC.: Electronic Tapes (Continued): Hot-Air Levelling Tape: TESAFILM 4164 Soft PVC Tape: Soft PVC with silicone-free adhesive. Conforms securely to gold fingers providing sharp stop-off lines. Removes cleanly without residue. Black. For masking of printed circuit boards during hot air (or oil) levelling. Thickness: 7.9 mils Adhesive: Silicone-free cross-linked rubber Carrier: Soft PVC Tensile Strength: 28 lbs/in Adhesion: 32 ozfin Elongation: 400% Temperature Resistance: 485F up to Ten Seconds Wave Solder Tape: TESAFILM 7066 Soft PVC Tape: Soft PVC that readily conforms to all irregular surfaces of printed circuit board. Ideal for both water and solvent based systems. Designed for masking printed circuit boards during wave solder. Thickness: 7.9 mils Adhesive: Silicone free rubber Carrier: Soft PVC Tensile Strength: 28 lbs/in Adhesion: 32 oz/in Elongation: 400% Temperature Resistance: 525F
771
Section IX Insulating Products
772
Insulating Products
773
ABLESTIK: Hybrid Adhesive Pastes: Electrically Insulative: ABLEBOND 77-15: Work Life @ RT: 3 months Cure Schedule(s): 3 minutes @ 15OC or 10 seconds @ 200C Volume Resistivity: 1.3 x IO 12 ohm-cm Storage Life: 6 months @ 5C or 1 year @ -1OC Meets 5011: No One component, solvent-free epoxy designed for attaching SMDs to PCBs prior to wave solder. ABLEBOND 77-2LTC: Work Life @ RT: 3 months Cure Schedule(s): I/2 hour @ 80C or I/4 hour @ IOOC Volume Resistivity: 2.5 x 10 I4 ohm-cm Storage Life: 6 months @ 5C or 1 year @ -1oc Meets 5011: No Low temperature cure version of 77-1s. ABLEBOND 84-3: Work Life @ RT: 2 weeks Cure Schedule(s): I hour @ 15OC or 2 hours @ 125C Die Shear Strength: 6800 psi Volume Resistivity: 3.5 x IO I5 ohm-cm Weight Loss @ 3OOC: 0.17% Storage Life: 3 weeks @ 5C or 3 months @ -lOC or I year @ -40C Meets 5011: Yes Thermally conductive, solvent-free chip adhesive. Apply by automatic dispensing, screen printing, or hand. ABLEBOND 789-3: Work Life @ RT: 6 months Cure Schedule(s): I/2 hour @ 15OC or I hour @ 125C Volume Resistivity: 2 x 10 14 ohm-cm Storage Life: 1 year @ 5C Meets 5011: No Moisture resistant, one component, solvent-free epoxy designed for substrate attach and package sealing. Ideal for applications where ABLEFILM 550 preforms are not suitable. Also available in a thermally conductive version.
774
Adhesives, Sealants and Coatings for the Electronics Industry
ABLHSTIK LABORATORIES: Hybrid Adhesive Pastes (Continued): Electrically Insulative (Continued): ABLEBOND 958-11: Work Life @ RT: 2 weeks Cure Schedule(s): 1 hour 8 125C or 1 hour @ 15OC Die Shear Strength: 5000 psi Volume Resistivity: 5 x 10 14 ohm-cm Weight Loss @ 300C: 0.34% Storage Life: 1 year 8 -40C Meets 5011: Yes Insulating version of 958-7 stress-absorbing adhesive designed for bonding large ICs. ABLEBOND 967-3: Work Life 8 RT: 2 days Cure Schedule(s): 6 hours @ 65C or 5 minutes @ 150C Die Shear Strength: 3850 psi Volume Resistivity: 2 x 10 13 ohm-cm Storage Life: Premixed/Frozen 1 year 8 -40C Kits 6 months @ 25C or 1 year @ 5C Meets 5011: No Insulating version of 967-l. Two component, solvent-free epoxy designed for applications which require low cure temperatures. ABLEBOND 968-2: Work Life @ RT: 2 weeks Cure Schedule(s): 1 hour @ 15OC or 2 hours @ 125C Die Shear Strength: 5400 psi Volume Resistivity: 4 x 10 14 ohm-cm Weight Loss 8 300C: 0.12% Storage Life: 3 months @ 5C or 6 months @ -lOC or 1 year @ -4oc Meets 5011: Yes High purity, low bleed version of 84-3. Apply by automatic dispensing or screen printing.
Insulating Products
775
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications: CASTALL El00 Series: Unmodified medium viscosity epoxy resins used for making high strength laminates and transparent castings. CASTALL E-105 and El06 are low viscosity versions of ElOO. CASTALL E124A&B and E126A&B: Low and medium viscosity semi-flexible two-part systems that lend themselves to coatings as well as potting applications. El24 is a clear unfilled material while El26 is the filled version of E124. CASTALL E169A&B: A two-part potting compound with excellent electrical properties at elevated temperatures. It is particularly resistant to thermal and mechanical shock and to conditions of high moisture. CASTALL E250 Series: High viscosity potting resins with low shrinkage and thermal expansion meeting MIL-I-16923 types C and D. CASTALL E251 is a low viscosity version of E250. CASTALL E300 Series: High viscosity potting resins offering high thermal conductivity and low shrinkage during cure. Also have a very low coefficient of thermal expansion. CASTALL E301, E301AD, E301FR are lower viscosity versions and a flame retardant version of E300. CASTALL E301KT has the highest thermal conductivity rating and El520 and El530 are good adhesives as well as excellent thermal conductors. E1530FR is similar to E301FR but lower in viscosity. CASTALL E340 Series: Medium viscosity compound that offers excellent adhesion, high electrical insulation and high thermal conductivity. CASTALL E341FR is a lower viscosity and flame retardant version of E341. CASTALL E344FR A&B is a special flame retardant, thermally conductive, difficult to remove material, that has been found useful in protecting proprietary circuits or designs from mechanical or x-ray intrusions. CASTALL E400 Series: Medium viscosity, readily machineable, casting resin. Properties are similar to E251. CASTALL E401 and E403 are low viscosity versions, while E409 is a higher viscosity version offering high impact resistance and low shrinkage. CASTALL E414FR A&B is a low viscosity, easy to use, flame retardant system.
776
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): CASTALL EIlBA&B: Low viscosity two-part potting and casting compound with mix ratio of 1:l. E418 has low moisture absorption characteristics and excellent thermal shock properties. CASTALL E435A&B Series: Low viscosity two-part semi-flexible epoxy systems, E435A&B has a long pot life and outstanding high temperature properties. CASTALL E441 and E453 are higher viscosity versions of E435 and CASTALL E437 is a clear version of E435. CASTALL E463 Series: Medium viscositv electrical embeddins comoound aooroximatelv half the weight of-conventional fill resins.‘E464A&B; E465 andE466FR A&B are variations of E463. All have a very low dielectric constant. CASTALL E480A&B Series: A two-part, semi-flexible unfilled low viscosity epoxy with excellent high temperature properties. CASTALL E482 and E483 are filled versions of E480 and have higher viscosities with E482 being a paste-like material. CASTALL E490A&B: Medium viscosity, filled, two-component casting epoxy compound. E490 is especially suited for very large castings and high voltage transformers. CASTALL E491A&B Series: A two-component, low viscosity heat curing unfilled epoxy compound designed to be used with low cost fillers to produce an epoxy/sand system. CASTALL E493 is a fast curing version of E491. CASTALL E492FRA&B: Medium viscosity, two-component semi-rigid flame retardant compound. E492FR has low shrinkage and bonds well to plastic and metal cases. E492FR also has excellent thermal shock resistance and high thermal conductivity.
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): CASTALL E4876A&B and CASTALL 4877A&B: Two-Dart. electrically conductive, silver filled epoxy systems: Both materials are thixotropic pastes with exceilent adhesion to metal, glass, ceramic and various plastics. E4876 is ideal for cold soldering of heat sensitive materials and E4877 is specifically designed for chip bonding applications especially where high temperature characteristics are required. The following products are UL Yellow Card approved: E-414FR: 94V0 E-301FR: 94V0 E-1530FR: 94V0 E-341FR: 94V0 E-492FR: 94V0 E-344FR: 94V0 General Purpose: ElOO: Medium viscosity, unfilled Color: Amber Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity 8 2X: 1.16 Viscosity 8 25C (cps): 12200 Shore Hardness: D89 Temperature Range C: -55 to 145 Izod Impact ft-lbs/in: 0.5 Linear Shrinkage in/in: 0.010 Tensile Elongation %: 2.2 Tensile Strength 8 25C psi: 12800 Water Absorption 10 days @ 25C, %: 0.25 Thermal: COEF-TH-E in/in/C 10 -6: 51 Thermal Conductivity: 5.1 (1.5) Thermal Resistance C in/Watt: 182 Electrical: Dielectric Constant 8 25C, 1OOKC: 4.2 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, IOOKC: 0.035 Volume Resistivity @ 25C, ohm-cm: 10 15
777
778
Adhesives, Sealants and Coatings for the Electronics Indust~
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): General Purpose (Continued): E105: Low viscosity, unfilled Color: Amber Shelf Life (MO.): I2 Typical Physical Properties: Snecific Gravity @ 25C: 1.13 Viscosity @ 25C-(cps): 600 Shore Hardness: DS7 Temperature Range C: -55 to 120 Izod Impact ft-lbs/in: 0.6 Linear Shrinkage in/in: 0.013 Tensile Elongation %: 2.8 Tensile Strength @ 25C psi: 12000 Water Absorption 10 days @ 25C, %: 0.22 Thermal: COEF-TH-E in/in/CxlO -6: 53 Thermal Conductivity: 5-I (I -5) Thermal Resistance C in/Watt: 182 Electrical: Dielectric Constant @ 25C, 100KC: 4.2 Dielectric Strength Volts/Mil: 450 Dissipation Factor @ 25C, IOOKC: 0.035 Volume Resistivity @ 25C, ohm-cm: IO 15 E106: Low viscosity, unfilled Color: Amber Shelf Life (MO): I2 Typical Physical Properties: Specific Gravity @ 25C: 1.13 Viscosity @ 25C(cps): 600 Shore Hardness: D87 Temperature Range C: -55 to 120 Izod Impact ft-lbs/in: 0.5 Linear Shrinkaae in/in: 0.013 Tensile Elongation %: 2.5 Tensile Strength @ 25C. psi: 10500 Water Absorption IO days-@ 25C, %: 0.25 Thermal: COEF-TH-E in/in/C x IO -6: 54 Thermal Conductivity: 5.1 (1.5) Thermal Resistance C in/Watt: 180 Electrical: Dielectric Constant @ 25C, 100KC: 4.3 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, 100KC: 0.030 Volume Resistivity @ 25C, ohm-cm: IO 15
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): General Purpose (Continued): El24A&B: Low viscosity, unfilled two-part system Color: Amber Shelf Life (MO.): 12 Typical Physical Properties: Snecific Gravity @ 25C: 1.06 Viscosity @ 25C- (CPS): 7100 Shore Hardness: D73 Temperature Range C: -55 to 135 Izod Impact ft-lbs/in: 0.9 Linear Shrinkage in/in: 0.006 Tensile Elongation %: 30.0 Tensile Strength @ 25C, psi: 7500 Water Absorption 10 days @ 25C, %: 0.75 Thermal: COEF-TH-E in/in/C x 10 6: 51 Thermal Conductivity: 4.4 (1.3) Thermal Resistance C in/Watt: 223 Electrical: Dielectric Constant B 25C. IOOKC: 4.4 Dielectric Strength VoltsiMil.: 350 Dissipation Factor 8 25C, IOOKC: 0.040 Volume Resistivity @ 25C, ohm-cm: 10 14 El26A&B: Medium viscosity, filled two-part system Color: Beige Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.40 Viscosity @ 25C (cps): 25000 Shore Hardness: D73 Temperature Range C: -55 to 135 Izod Impact ft-lbs/in: 0.9 Linear Shrinkage in/in: 0.004 Tensile Elongation 8: 20.0 Tensile Strength @ 25C, psi: 12000 Water Absorprtion 10 days @ 25C, %: 0.60 Thermal: COEF-TH-E in/in/C x 10 -6: 46 Thermal Conductivity: 8.0 (2.4) Thermal Resistance C in/Watt: 116 Electrical: Dielectric Constant @ 25C, IOOKC: 4.6 Dielectric Strength VoltsjMil.: 350 Dissipation Factor @ 25C, IOOKC: 0.060 Volume Resistivity @ 25C, ohm-cm: IO 14
779
780
Adhesives,
Sealants
and Coatings for the Electronics
Industry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): General Purpose (Continued): E401: Low viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.55 Viscosity @ 25C-(cps): 3200 Shore Hardness: D87 Temperature Range C: -55 to 155 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.004 Tensile Elongation %: 1.9 Tensile Strength @ 25C, psi: 8100 Water Absorption 10 days @ 25C, %: 0.25 Thermal: COEF-TH-E in/in/C x 10 -6: 38 Thermal Conductivity: 7.8 (2.3) Thermal Resistance C in/Watt: 120 Electrical: Dielectric Constant B 25C. 100KC: 4.1 Dielectric Strength VoltsiMil.: 450 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 15 E403: Low viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.55 Viscosity @ 25C. (cps): 6000 Shore Hardness: D05 Temperature Range C: -55 to 155 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.004 Tensile Elongation %: 1.9 Tensile Strength @ 25C psi: 7200 Water Absorption 10 days @ 25C, %: 0.35 Thermal: COEF-TH-E in/in/C x 10 -6: 40 Thermal Conductivity: 7.8 (2.3) Thermal Resistance C in/Watt: 120 Electrical: Dielectric Constant @ 25C, 100KC: 4.0 Dielectric Strength VoltsjMil.: 450 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm.: 10 16
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): General Purpose (Continued): E409: Medium viscosity, filled Color: Grev Shelf Life-(MO.): 12 Typical Physical Properties: --Specific Gravity @ 25C: 1.75 Viscosity @ 25C (cps): 40000 Shore Hardness: D91 Temperature Range C: -65 to 150 Izod Impact ft-lbs/in: 0.4 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.6 Tensile Strength @ 25C, psi: 8400 Water Absorption 10 days @ 25C, %: 0.25 Thermal: COEF-TH-E in/in/C x 10 -6: 30 Thermal Conductivity: 8.5 (2.5) Thermal Resistance C in/Watt: 109 Electrical: Dielectric Constant @ 25C, 100KC: 3.8 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm.: IO 15 Military
Grade:
E250: High viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.55 Viscosity @ 25C (cps): 175000 Shore Hardness: D88 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.4 Linear Shrinkage in/in: 0.003 Tensile Elongation %: 1.9 Tensile Strength @ 25C psi: 7800 Water Absorption 10 days @ 25C, %: 0.31 Thermal: COEF-TH-E in/in/C x 10 -6: 35 Thermal Conductivity: 7.8 (2.3) Thermal Resistance C in/Watt: 120 Electrical: Dielectric Constant @ 25C, 100KC: 4.4 Dielectric Strength Volts/nil.: 450 Dissipation Factor @ 25C, IOOKC: 0.041 Volume Resistivity @ 25C, ohm-cm.: 10 16
781
782
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Military Grade (Continued): E251: Medium viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.45 Viscosity @ 25C(cps): 35000 Shore Hardness: D88 Temperature Range C: -65 to 150 Izod Impact ft-lbs/in: 0.2 Linear Shrinkage in/in: 0.003 Tensile Elongation %: 1.9 Tensile Strength @ 25C, psi: 8000 Water Absorption 10 days @ 25C, %: 0.30 Thermal: COEF-TH-E in/in/C x 10 -6: 50 Thermal Conductivity: 6.8 (2.0) Thermal Reistance C in/Watt: 136 Electrical: Dielectric Constant @ 25C, 100KC: 4.5 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, IOOKC: 0.040 Volume Resistivity @ 25C, ohm-cm.: 10 16 E480A&B: Low viscositv. unfilled Color: Amber-. Shelf Life (MO.): 12 Tvwical Phvsical Prowerties: __ Specific Gravity @ 25C: 1.08 Viscosity @ 25C (cps): 4200 Shore Hardness: D65 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 1.3 Linear Shrinkage in/in: 0.015 Tensile Elonsation %: 92.0 Tensile Strength @ 25C, psi: 7000 Water Absorption 10 days @ 25C, %: 0.45 Thermal: COEF-TH-E in/in/C x 10 -6: 53 Thermal Conductivity: 5.4 (1.6) Thermal Resistance C in/Watt: 171 Electrical: Dielectric Constant @ 25C, 100KC: 4.0 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, 100KC: 0.010 Volume Resistivity @ 25C, ohm-cm.: 10 16
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Military Grade (Continued): E482A&B: Paste, filled Color: Cream Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.50 Viscositv C 25C-(CDS): Paste Shore Hardness: D65 Temperature Range C: -65 to 155 Izod Impact ft-Ibs/in: 0.9 Linear Shrinkage in/in: 0.010 Tensile Elongation %: 45.0 Tensile Strength @ 25C, psi: 7000 Water Absorption 10 days @ 25C, %: 0.30 Thermal: COEF-TH-E in/in/C x 10 -6: 40 Thermal Conductivity: 12.5 (3.7) Thermal Resistance C in/Watt: 74 El.ectrical: Dielectric Constant @ 25C, 100KC: 4.0 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 16 E403A&B: Medium viscosity, filled Color: Cream Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.45 Viscosity @ 25C (cps): 30000 Shore Hardness: D65 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.9 Linear Shrinkage in/in: 0.010 Tensile Elongation %: 45.0 Tensile Strength @ 25C, psi: 7000 Water Absorption 10 days @ 25C, %: 0.28 Thermal: COEF-TH-E in/in/C x 10 -6: 40 Thermal Conductivity: 14.0 (4.1) Thermal Resistance C in/Watt: 66 Electrical: Dielectric Constant @ 25C, 100KC: 4.1 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, 100KC: 0.025 Volume Resistivity @ 25C, ohm-cm: 10 16
783
784
Adhesives, Sealants and Coatings for the Electronics Indwty
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Thermally Conductive: E300: High viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Soecific Gravity @ 25C: 2.35 Viscosity @ 25C-(cps): 75000 Shore Hardness: D93 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.4 Tensile Strength @ 25C psi: 10500 Water Absorption 10 days @ 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 22 Thermal Conductivity: 33.0 (9.7) Thermal Resistance C in/Watt: 28 Electrical: Dielectric Constant @ 25C, 100KC: 6.0 Dielectric Strength Volts/Mil.: 3980 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 16 E301: High viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 2.05 Viscosity @ 25C (cps): 90000 Shore Hardness: D93 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.7 Tensile Strength @ 25C, psi: 9980 Water Absorption 10 days @ 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 25 Thermal Conductivity: 31.3 (9.1) Thermal Resistance C in/Watt: 30 Electrical: Dielectric Constant @ 25, 100KC: 5.8 Dielectric Strength Volts/Mil.: 3760 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm.: 10 16
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): E301AD: Low viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 2.00 Viscosity @ 25C, cps: 10000 Shore Hardness: D93 Temoerature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.7 Tensile Strength @ 25C, psi: 9890 Water Absorption 10 days @ 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 26 Thermal Conductivity: 31.0 (9.0) Thermal Resistance C in/Watt: 30 Electrical: Dielectric Constant @ 25C, 100KC: 5.6 Dielectric Strength Volts/Mil.: 3740 Dissipation Factor @ ZSC, 1OOKC: 0.020 Volume Resistivity @ 25C, ohm-cm.: 10 16 E301KT: Paste, filled, highest thermal conductivity Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 2.80 Viscosity @ 25C (cps): Paste Shore Hardness: D95 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.2 Linear Shrinkage in/in: 0.001 Tensile Elongation %: 1.6 Tensile Strength @ 25C, psi: 9300 Water Absorption 10 days @ 25C, %: 0.18 Thermal: COEF-TH-E in/in/C x 10 -6: 25 Thermal Conductivity: 39.3 (11.4) Thermal Resistance C in/Watt: 24 Electrical: Dielectric Constant a 25C. 100KC: 6.9 Dielectric Strength,-Volts/Mil.: 500 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resitivity @ 25C, ohm-cm.: 10 15
785
786
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Thermally Conductive (Continued): E341: Medium viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.90 Viscosity @ 25C (aps): 13000 Shore Hardness: D89 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.4 Linear Shrinkage in/in: 0.003 Tensile Elongation %: 1.9 Tensile Strength @ 25C, psi: 8340 Water Absorption 10 days 8 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 25 Thermal Conductivity: 26.2 (7.7) Thermal Resistance C in/Watt: 36 Electrical: Dielectric Constant @ 25C, 100KC: 5.7 Dielectric Strength Volts/Mil.: 500 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohms-cm: 10 16 E1520: Paste, filled, adhesive Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 2.35 Viscosity 8 25C (cps): Paste Shore Hardness: D93 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.5 Tensile Strength 8 25C, psi: 10500 Water Absorption 10 days @ 25C, %: 0.15 Thermal: COEF-TH-E in/in/C x 10 -6: 22 Thermal Conductivity: 33.0 (9.7) Thermal Resistance C in/Watt: 28 Electrical: Dielectric Constant @ 25C, 100KC: 6.1 Dielectric Strength Volts/Mil.: 500 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 16
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Thermally Conductive (Continued): E1530: Medium viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Snecific Gravity 13 25C: 2.25 Viscosity @ 25C-(cps): 70000 Shore Hardness: D93 Temperature Range C: -65 to 150 Izod Impact ft-lbs/in: 0.4 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.5 Tensile Strength @ 25C, psi: 11500 Water Absorption 10 days 8 25C, %: 0.15 Thermal: COEF-TH-E in/in/C x 10 -6: 22 Thermal Conductivity: 33.4 (9.7) Thermal Resistance C in/Watt: 29 Electrical: Dielectric Constant @ 25C, IOOKC: 6.1 Dielectric Strength Volts/Mil.: 3980 Dissipation Factor @ 25C, IOOKC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 16 Flame Retardant: E30lFR: Hish viscositv. filled Color: Black _. Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 2.00 Viscosity @ 25C (cps): 100000 Shore Hardness: D91 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.002 Tensile Eloncation %: 1.7 Tensile Strength 8 25C, psi: 9800 Water Absorption 10 days @ 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 25 Thermal Conductivity: 31.0 (9.0) Thermal Resistance C in/Watt: 30 El.ectrical: Dielectric Constant 8 25C, IOOKC: 5.6 Dielectric Strength, Volts/Mil.: 3740 Dissipation Factor @ 25C, IOOKC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 16
787
788
Adhesives, Sealants and Coatings for the Electronics Industy
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Flame Retardant (Continued): E341FR: LOW viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.61 Viscosity @ 25C (cps): 15000 Shore Hardness: D91 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.4 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.9 Tensile Strength @ 25C, psi: 8400 Water Absorption 10 days @ 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 25 Thermal Conductivity: 26.8 (7.9) Thermal Resistance C in/Watt: 35 Electrical: Dielectric Constant @ 25C, 100KC: 5.6 Dielectric Strength Volts/Mil.: 500 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 16 E344FR A&B: Medium viscosity, filled Color: Green Shelf Life (MO.): 12 Tvwical Phvsical Prowerties: *-Specific Gravity ‘@ 25C: 1.94 Viscosity @ 25C (cps): 30000 Shore Hakdness: D9b Temperature Range C: -65 to 130 Izod Impact ft-lbs/in: 0.3 Linear Shrinkage in/in: 0.002 Tensile Elongation %: 1.7 Tensile Strength @ 25C, psi: 9800 Water Absorption 10 days @ 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 25 Thermal Conductivity: 31.0 (9.0) Thermal Resistance C in/Watt: 30 Electrical: Dielectric Constant @ 25C, 10OKC: 5.6 Dielectric Strength Volts/Mil.: 450 Dissipation Factor @ 25C, 100KC: 0.020 Volume Resistivity @ 25C, ohm-cm: 10 15
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Flame Retardant
(Continued):
E414FR A&B: Low viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.57 Viscosity @ 25Cy (cps): 10000 Shore Hardness: D75 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.5 Linear Shrinkage in/in: 0.010 Tensile Elongation %: 5.0 Tensile Strength @ 25C, psi: 5000 Water Absorption 10 days @ 25C, %: 0.40 Thermal: COEF-TH-E in/in/C x 10 -6: 35 Thermal Conductivity: 22.8 (6.7) Thermal Resistance C in/Watt: 41 Electrical: Dielectric Constant I 25C. 100KC: 4.1 Dielectric Strength VoltsjMil.: 475 Dissipation Factor @ 25C, IOOKC: 0.025 Volume Resistivity @ 25C, ohm-cm.: 10 16 E466FR A&B: Low viscosity, very low dielectric Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 0.82 Viscosity @ 25C, (cps): 5000 Shore Hardness: D80 Temperature Range C: -65 to 130 Izod Impact ft-lbs/in: 0.2 Linear Shrinkage in/in: 0.005 Tensile Elongation %: 2.0 Tensile Strength @ 25C, psi: 4100 Water Absorption 10 days 8 25C, %: 0.25 Thermal: COEF-TH-E in/in/C x 10 -6: 39 Thermal Conductivity: 3.3 (1.0) Thermal Resistance C in/Watt: 275 Electrical: Dielectric Constant 8 25C, 100KC: 2.4 Dielectric Strength Volts/Mil: 425 Dissipation Factor 8 25C, IOOKC: 0.020 Volume Resistivity @ 25C, ohm-cm.: 10 14
789
790
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Flame Retardant (Continued): E492FR A&B: Medium viscosity, filled Color: Blue Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.68 Viscosity @ 25C (cps): 19000 Shore Hardness: D82 Temperature Range C: -65 to 130 Izod Impact ft-lbs/in: 0.4 Linear Shrinkaae in/in: 0.002 Tensile Elongation %: 10.0 Tensile Strenqth @ 25C, psi: 7200 Water Absorption 10 days-@ 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 26 Thermal Conductivity: 27.2 (7.8) Thermal Resistance C in/Watt: 34 Electrical: Dielectric Constant 8 25C, 100KC: 5.4 Dielectric Strength Volts/Mil.: 475 Dissipation Factor 8 25C, 100KC: 0.020 Volume Resistivity 8 25C, ohm-cm: 10 14 Specialty Materials: E169A&B: Medium viscosity, filled Color: Beige Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C (cps): 1.45 Viscosity @ 25C (cps): 13000 Shore Hardness: D65 Temperature Range C: -55 to 155 Izod Imoact ft-lbs/in: 1.3 Linear Shrinkage in/in: 0.003 Tensile Elongation %: 120.0 Tensile Strength 8 25C, psi: 2000 Water Absorption 10 days 8 25C, %: 0.20 Thermal: COEF-TH-E in/in/C x 10 -6: 45 Thermal Conductivity: 8.5 (2.5) Thermal Resistance C in/Watt: 110 Electrical: Dielectric Constant @ 25C. 100KC: 3.8 Dielectric Strength VoltsjMil.: 475 Dissipation Factor @ 25C, 100KC: 0.012 Volume Resistivity @ 25C, ohm-cm.: 10 14
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Specialty Materials (Continued): E418A&B: Low viscosity, unfilled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.10 Viscosity @ 25C-(cps): 2500 Shore Hardness: D70 Temperature Range C: -50 to 130 Izod Impact ft-lbs/in: 0.4 Linear Shrinkage in/in: 0.005 Tensile Elongation %: 3.8 Tensile Strength @ 25C, psi: 6500 Water Absorption 10 days @ 25C, %: 0.02 Thermal: COEF-TH-E in/in/C x 10 -6: 65 Thermal Conductivity: 5.1 (1.5) Thermal Resistance C in/Watt: 182 Electrical: Dielectric Constant @ 25C. 100KC: 4.0 Dielectric Strength VoltsjMil.: 450 Dissipation Factor @ 25C, 100KC: 0.050 Volume Resistivity @ 25C, ohm-cm.: 10 12 E435A&B: Low viscosity, unfilled Color: Brown Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 1.10 Viscosity @ 25C (cps): 2000 Shore Hardness: D55 Temperature Range C: -50 to 130 Izod Impact ft-lbs/in: 0.6 Linear Shrinkase in/in: 0.005 Tensile Elongation %: 4.0 Tensile Strength @ 25C, psi: 5200 Water Absorption 10 days-@ 25C, %: 0.90 Thermal: COEF-TH-E in/in/C x 10 -6: 65 Thermal Conductivity: 4.5 (1.3) Thermal Resistance C in/Watt: 208 Electrical: Dielectric Constant @ 25C, 100KC: 4.1 Dielectric Strength Volts/Mil.: 400 Dissipation Factor @ 25C, 100KC: 0.060 Volume Resistivity @ 25C, ohm-cm.: 10 15
791
792
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Specialty Materials (Continued): E463: Medium viscosity, filled Color: Black Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity @ 25C: 0.80 Viscosity @ 25C (cps): 5000 Shore Hardness: D83 Temperature Range C: -65 to 130 Izod Impact ft-lbs/in: 0.2 Linear Shrinkage in/in: 0.005 Tensile Elongation %: 2.5 Tensile Strength @ 25C, psi: 4660 Water Absorption 10 days @ 25C, %: 0.25 Thermal: COEF-TH-E in/in/C x 10 -6: 39 Thermal Conductivity: 3.7 (1.1) Thermal Resistance C in/Watt: 248 Electrical: Dielectric Constant @ 25C, 100KC: 2.9 Dielectric Strength Volts/Mil.: 425 Dissipation Factor @ 25C, 100KC: 0.003 Volume Resistivity @ 25C, ohm-cm.: 10 14 E464A&B: Medium viscosity, filled Color: White Shelf Life (MO.): 6 Typical Physical Properties: Specific Gravity @ 25C: 0.87 Viscosity @ 25C (cps): 18000 Shore Hardness: D80 Temperature Range C: -55 to 130 Izod Impact ft-lbs/in: 0.2 Linear Shrinkage in/in: 0.005 Tensile Elongation %: 2.5 Tensile Strength @ 25C, psi: 5300 Water Absorption 10 days @ 25C, %: 0.30 Thermal: COEF-TH-E in/in/C x 10 -6: 38 Thermal Conductivity: 3.7 (1.1) Thermal Resistance C in/Watt: 248 Electrical: Dielectric Constant @ 25C, 100KC: 3.0 Dielectric Strength Volts/Mil.: 425 Dissipation Factor @ 25C, 100KC: 0.004 Volume Resistivity @ 25C, ohm-cm.: 10 13
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): E490: Medium viscosity, filled Color: Blue Shelf Life (MO.): 12 Typical Physical Properties: Specific Gravity a 25C: 1.60 Viscosity @ 25C (cps): 34000 Shore Hardness: D90 TemDeratUre Ranse C: -55 to 155 Izod Impact ft-lbs/in: 0.5 Linear Shrinkage in/in: 0.005 Tensile Elonsation %: 5.4 Tensile Strength @ 25C, psi: 7200 Water Absorption 10 days @ 25C, %: 0.15 Thermal: COEF-TH-E in/in/C x 10 -6: 32 Thermal Conductivity: 10.5 (3.1) Thermal Resistance C in/Watt: SS Electrical: Dielectric Constant @ 25C, IOOKC: 4.5 Dielectric Strenqth Volts/Mil.: 450 Dissipation Factor a 25C, IOOKC: 0.013 Volume Resistivity @ 25C, ohm-cm.: 10 15 E491A&B: Low viscosity, unfilled Color: Amber Shelf Life (MO.): 12 rpical Physical Properties: Specific Gravity @ 25C: 1.06 Viscosity @ 25C (cps): 2000 Shore Hardness: A53 Temperature Range C: -65 to 155 Izod Impact ft-lbs/in: 0.8 Linear Shrinkage in/in: 0.004 Tensile Elongation %: 140.0 Tensile Strength @ 25C, psi: 450 Water Absorption 10 days @ 25C, %: 0.30 Thermal: COEF-TH-E in/in/C x 10 -6: 45 (4) Thermal Conductivity: 5.1 (1.5) Thermal Resistance C in/Watt: 182 Electrical: Dielectric Constant a 25C. IOOKC: 4.3 Dielectric Strength VoltsjMil.: 425 Dissipation Factor @ 25C. 100KC: 0.010 Volume Resistivity @ 25C; ohm-cm: 10 14
793
794
Adhesives, Sealants and Coatingsfor the Electronics Indzutry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Epoxy Hardeners: RT-1: RT-1AX: Modified aliphatic polyamine Color: Light Straw Viscosity @ 25C, cps: 80-105 Specific Gravity @ 25C: 1.00 Normal Cure Schedule (Hours): Pot Life @ 25C: l-2 0.5-l Cure Temperatures: 25C: 12-24 6-12 65C: 2-3 l-l.5 Characteristics: Room temperature cure, rigid system, suitable for castings up to 2oog. RT-1AX similar to RT-1 but twice as fast. HDT 125C RT-7: RT-7LC: Modified aliohatic diamine Color: Light-Straw Viscosity @ 25C, cps: lo-30 Specific-Gravity @-25C: 1.01 Normal Cure Schedule (Hours): Pot Life @ 25C: l-2 Cure Temperatures: 25C: 12-24 65C: 2-3 Characteristics: Room temperature cure, excellent air release, very low viscosity, HDT 7OC, excellent impact resistance, semi-rigid. RT-7LC higher viscosity version. RT-8: Modified tertiary amine Color: Light Straw Viscosity @ 25C, cps: 900 Specific Gravity @ 25C: 0.99 Normal Cure Schedule (Hours): Pot Life @ 25C: 4-6 Cure Temperatures: 25C: 16-32 Characteristics: Meets MIL-1-16923E, very low exotherm, semi-rigid system, excellent impact resistance, excellent for large castings. HDT 85C.
Insulating Products
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Epoxy Hardeners (Continued): RT-10: RT-1OLV: Polyamine Color: Amber Viscosity @ 25C, cps: 25000 14000 Specific Gravity @ 25C: 0.97 Normal Cure Schedule (Hours): Pot Life @ 25C: l-3 Cure Temperatures: 25C: 16-32 Characteristics: Room temperature cure, for very large castings, very low exotherm, ratio may be varied to produce flexible system. RT-IOLV low viscosity, HDT 95C. RT-13: Modified polyamine Color: Amber Viscosity @ 25C, cps: 450 Specific Gravity @ 25C: 0.94 Normal Cure Schedule (Hours): Pot Life @ 25C: l-3 Cure Temperatures: 25C: 12-24 Characteristics: Room temperature cure, good for large castings, semi-rigid system, excellent impact resistance, good adhesion, HDT 1OOC RT-1355: RT-1355AX: Modified polyamine Color: Amber Viscosity @ 25C, cps: 125 Specific Gravity @ 25C: 0.97 Normal Cure Schedule (Hours): Pot Life @ 25C: 2-4 l-3 Cure Temperatures: 25C: 12-32 12-24 Characteristics: Room temperature cure, medium size castings, low exotherm, excellent impact resistance. RT-1355AX faster version, HDT 75C
795
796
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Epoxies Specially Designed for Electronic Insulating Applications (Continued): Epoxy Hardeners (Continued): RT-55: Modified aliphatic polyamine Color: Tan Viscosity @ 25C, cps: 60-80 Specific Gravity @ 25C: 0.98 Normal Cure Schedule (Hours): Pot Life @ 25C: 2-4 Cure Temperatures: 25C: 16-32 Characteristics: Room temperature cure, properties close to RT-7, medium size castings not for thin film. HDT 65C E-20: Blend of aromatic diamines Color: Tan Viscosity @ 25C, cps: 8000 Specific Gravity @ 25C: 1.08 Normal Cure Schedule (Hours): Pot Life @ 25C: 4-6 Cure Temperatures: 65C: 16 1ooc: 3 Characteristics: Elevated temperature cure, very rigid system, HDT 155C E-34: E-34LR: Modified aromatic diamine Color: Tan Viscosity @ 25C, cps: 3000 Specific Gravity @ 25C: 1.08 Normal Cure Schedule (Hours): Cure Temperatures: 25C: 3-8 65C: 24 1ooc: 3-5 Characteristics: Elevated temperature cure, very rigid system, E-34LR slower cure and for larger castings, HDT 155C HT-75: Anhydride Color: Tan Viscosity @ 25C, cps: Wax Specific Gravity @ 25C: 1.30 Normal Cure Schedule (Hours): Cure Temperatures: 1OOC: 2-4 Characteristics: High temperature cure, excellent electrical properties at high temperature. HDT 200C.
hulating
Products
797
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications: CASTALL G-800: White, thermally conductive silicone heat sink grease. Ideal product for shock-resistance and as a heat-transfer media between semiconductor devices and heat sinks. Has a continuous service temperature range of -55C to 205C. CASTALL G-801: High heat transfer silicone grease. Used in similar applications to CASTALL G-800. Product has 65% higher thermal1 conductivity than CASTALL G-800. Can be used in areas where paintability is a factor. CASTALL G-802: Highest heat transfer silicone grease. Product is white spreadable paste and it can be used in areas where paintability is a factor. CASTALL G-832M: LOW cost, non-silicone thermally conductive grease. Equivalent heat-transfer properties to silicone greases and it does not exhibit any fluid separation or fluid migration which is typical of all silicone based greases. (MJ low viscosity) CASTALL G-848: Non-silicone, very high thermally conductive grease. Higher transfer properties than silicone grease. This product designed for heat sink and electrical insulating purposes. CASTALL S-1200: Thermally conductive, two-part, RTV silicone rubber. Used in applications where a stress-free, rapid heat transfer, high temperature service and repairability is required. CASTALL S-1200 HTC: Latest addition to the thermally conductive RTV silicone line. Product is low cost, has high thermal1 conductivity and low viscosity. Meets UL94V-2 for flame retardency. CASTALL S-1200 HTC: Red - Higher operating temperature than S-1200HTC. Continuous service temperature of -70C to 260C. Meets UL94V-2 for flame retardency.
798
Adhesives, Sealants and Coatings for the Electronics Industy
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): CASTALL S-1202: Most versatile and popular low viscosity RTV silicone. Useful in potting, encapsulating and mold making applications. CASTALL S-1203: Water-clear, low viscosity, low durometer encapsulating silicone rubber. Perfect for potting electronic components where repairability and transparency is important. CASTALL S-1205 FR: Flame retardant, UL listed under UL94V-0. Two component, thermally conductive silicone elastomer. CASTALL S-1207 A&B: Low density, pourable, two-part, syntactic foam, RTV silicone rubber. Excellent for embedding electronic components where shock, vibration and low weight is a factor. Mix ratio is 100/7. Cure @ 25C for 8 to 16 hrs. CASTALL S-1231: High operating temperature, general purpose silicone compound. May be used in applications where continuous service temperature of -70C to 260C is required. CASTALL S-1241: Medium viscosity, general purpose silicone RTV. Higher physical properties than CASTALL S-1202. Excellent for potting and mold making applications. CASTALL S-1251: Methyl-Phenvl room temperature curing silicone rubber. Twopart, low viscosity. Exceilent for potting and encapsulating where extremely low temperature conditions are experienced. CASTALL S-1260: Higher viscosity version of CASTALL S-1231. High operating temperature, general purpose potting compound. Also recommended for sealing, and flexible molds.
Insulating Products
799
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): CASTALL S-1262 A&B: Very soft, clear, two-component silicone rubber. Very low viscosity, gel type consistency. Ideal product for potting electronics assemblies where shock, vibration and repairability is a factor. Suggested mix ratio is 100 parts A to 0.5 parts B. CASTALL S-1277: A white spreadable thixotropic paste, ideal for sealing and bonding. Use CASTALL Primer 1291 or 1293 for bonding applications. Thermally Conductive Grease Compounds: G-800: Typical Uncured Properties: Color: white Consistency: paste Shelf Life, months: 12 Typical Physical Properties: Specific Gravity: 2.20 Service Temperature, C: -55 to 205 Typical Thermal Properties: Thermal Conductivity: 5.2 Typical Electrical Properties: Dielectric Strength, volts/mil: 300 Dielectric Constant @ 25C, 100KC: 4.1 Dissipation Factor @ 25C, 100KC: 0.006 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Heat Transfer G-801: Typical Uncured Properties: Color: off white Consistency: paste Shelf Life, months: 12 Typical Physical Properties: Specific Gravity: 2.50 Service Temperature, C: -50 to 170 Typical Thermal Properties: Thermal Conductivity: 8.6 Typical Electrical Properties: Dielectric Strength, volts/mil: 300 Dielectric Constant @ 25C, 1OOKC: 5.2 Dissipation Factor @ 25C, 100KC: 0.01 Volume Resistivity, ohm-cm: 10 14 Typical Applications: Heat Transfer
800
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): Thermally Conductive Grease Compounds (Continued): G-802: Typical Uncured Properties: Color: white Consistency: paste Shelf Life, months: 12 Typical Physical Properties: Specific Gravity: 2.8 Service Temperature, C: -50 to 170 Typical Thermal Properties: Thermal Conductivity: 11.0 Typical Electrical Properties: Dielectric Strength, volts/mil: 320 Dielectric Constant @ 25C, IOOKC: 4.9 Dissipation Factor @ 25C. IOOKC: 0.02 Volume Resistivity, ohm-cm: 10 14 Typical Applications: Heat Transfer G-832MJ: Typical Uncured Properties: Color: white Consistency: paste Shelf Life, months: 12 Typical Physical Properties: Specific Gravity: 1.74 Service Temperature, C: -50 to 170 Typical Thermal Properties: Thermal Conductivity: 5.2 Typical Electrical Properties: Dielectric Strength, volts/mil: 325 Dielectric Constant @ 25C, 100KC: 3.6 Dissipation Factor @ 25C, IOOKC: 0.001 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Heat Transfer G-832M: Typical Uncured Properties: Color: pink Consistency: paste Shelf Life, months: 12 Typical Physical Properties: Specific Gravity: 1.82 Service Temperature, C: -50 to 170 Typical Thermal Properties: Thermal Conductivitv: 5.2 Typical Electrical Properties: Dielectric Strength, volts/mil: 325 Dielectric Constant @ 25C, IOOKC: 3.6 Dissipation Factor @ 25C, 100KC: 0.001 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Heat Transfer
Insulating Products
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): Thermally Conductive Grease Compounds (Continued): G-048: Typical Uncured Properties: Color: off white Consistency: paste Shelf Life, months: 12 Typical Physical Properties: Specific Gravity: 2.70 Service TemDeratUre. C: -50 to 170 Typical Thermai Properties: Thermal Conductivity: 15 Typical Electrical Properties: Dielectric Strength, volts/mil: 250 Dielectric Constant @ 25C, 100KC: 4.4 Dissipation Factor @ 25C, 100KC: 0.004 Volume Resistivityl ohm-cm: 10 14 Typical Applications: Heat Transfer Two Component RTV Compounds: s-1200: Typical Uncured Properties: Color: white or black Consistency: pourable Viscosity @ 25C, cps: 30,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 1.67 Hardness, Shore A: 60 Tensile Strength, psi: 350 Elongation, %: 150 Tear Resistance, dieB, lbs/in: 40 Service Temperature, C: -70 to 205 Linear Shrinkage, in/in: .003 Typical Thermal Properties: Thermal Conductivity: 5.8 Coefficient of Thermal Expansion: 12 Typical Electrical Properties: Dielectric Strength, volts/mil: 600 Dielectric Constant @ 25C, 100KC: 4.9 Dissipation Factor @ 25C, 100KC: 0.014 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating Flexible Molds Heat Transfer
801
802
Adhesives, Sealants and Coatings for the Electronics In&sty
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): Two Component RTV Compounds: s-12ooHTc: Typical Uncured Properties: Color: white Consistency: pourable Viscosity @ 25C, cps: 30,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 2.20 Hardness, Shore A: 60 Tensile Strength, psi: 800 Elongation, %: 70 Tear Resistance, dieB, lbs/in: 70 Service Temperature, C: -70 to 205 Linear Shrinkage, in/in: .002 Typical Thermal Properties: Thermal Conductivity: 10.1 Coefficient of Thermal Expansion: 8 Typical Electrical Properties: Dielectric Strength, volts/mil: 500 Dielectric Constant 8 25C, 100KC: 5.2 Dissipation Factor @ 25C, 100KC: 0.02 Volume Resistivity, ohm-cm: 10 14 Typical Applications: Potting/Encapsulating/Flexible Heat Transfer/Flame Retardancy s-12ooHTc: Typical Uncured Properties: Color: red Consistencv: oourable Viscosity @ 2‘5C, cps: 20,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 2.15 Hardness, Shore A: 65 Tensile Strength, psi: 800 Elongation, %: 100 Tear Resistance, dieB, lbs/in: 75 Service Temperature, C: -70 to 260 Linear Shrinkase. in/in: .002 Typical Thermal Properties: Thermal Conductivity: 10.1 Coefficient of Thermal Expansion: 8 Typical Electrical Properties: Dielectric Strength, volts/mil: 500 Dielectric Constant @ 25C, 100KC: 5.3 Dissioation Factor Ca 25C. 100KC: 0.02 Volume Resistivity,Wohm-cm: 10 14 Typical Applications: Potting/Encapsulating/Flexible High Temperature/Heat Transfer/Flame Retardancy
Molds
Molds/
Insulating Products
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): Two Component RTV Compounds (Continued): s-1202: Typical Uncured Properties: Color: white Consistency: easily pourable Viscosity @ 25C, cps: 7,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 1.16 Hardness, Shore A: 30 Tensile Strength, psi: 340 Elongation, %: 180 Tear Resistance, dieB, lbs/in: 15 Service Temperature, C: -70 to 205 Linear Shrinkage, in/in: -002 Typical Thermal Properties: Thermal Conductivity: 2.4 Coefficient of Thermal Expansion: 14 Typical Electrical Properties: Dielectric Strength, volts/mil: 500 Dielectric Constant @ 25C, IOOKC: 3.5 Dissipation Factor @ 25C, IOOKC: 0.018 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating/Flexible Molds/Coating S-1203: Typical Uncured Properties: Color: clear or black Consistency: very easily pourable Viscosity @ 25C, cps: 3,500 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 1.00 Hardness, Shore A: 25 Tensile Strength, psi: 230 Elongation, %: 75 Tear Resistance, dieB, lbs/in: 5 Service Temperature, C: -70 to 205 Linear Shrinkage, in/in: .003 Typical Thermal Properties: Thermal Conductivity: 1.2 Coefficient of Thermal Expansion: 16 Typical Electrical Properties: Dielectric Strength, volts/mil: 550 Dielectric Constant @ 25C, 100KC: 3.0 Dissipation Factor @ 25C, IOOKC: 0.001 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating/Coating
803
804
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): Two Component RTV Compounds (Continued): S-1205FR: Typical Uncured Properties: Color: white Consistency: easily pourable Viscosity @ 25C, cps: 15,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 1.36 Hardness, Shore A: 40 Tensile Strength, psi: 700 Elonsation. %: 130 Tear-Resistance, dieB, lbs/in: 30 Service Temperature, C: -70 to 205 Linear Shrinkace. in/in: .003 Typical Thermal Properties: Thermal Conductivity: 4.7 Coefficient of Thermal Expansion: 15 Typical Electrical Properties: Dielectric Strength, volts/mil: 450 Dielectric Constant @ 25C, 100KC: 5.0 Dissipation Factor @ 25C, 100KC: 0.015 Volume Resistivity, ohm-cm: 10 14 Typical Applications: Potting/Encapsulating/Heat Flame Retardency S-1207: Typical Uncured Properties: Color: white Consistency: easilv oourable Viscosity @ 25C, cps: 13,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 0.68 Hardness, Shore A: 50 Tensile Strength, psi: 400 Elongation. %: 150 Tear-Resistance, dieB, lbs/in: 20 Service Temperature, C: -70 to 205 Linear Shrinkase, in/in: 0.005 Typical Thermal Properties: Thermal Conductivity: 1.2 Coefficient of Thermal Expansion: 18 Typical Electrical Properties: Dielectric Strength, volts/mil: 250 Dielectric Constant @ 25C, 1OOKC: 2.2 Dissipation Factor @ 25C, 100KC: 0.004 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating
Transfer/
Insulating Products
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): S-1231: Typical Uncured Properties: Color: red Consistency: pourable Viscosity 8 25C, cps: 25,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 1.40 Hardness, Shore A: 60 Tensile Strength, psi: 700 Elongation, %: 140 Tear Resistance, dieB, lbs/in: 40 Service Temperature, C: -70 to 260 Linear Shrinkage, in/in: -004 Tvoical Thermal Prooerties: *-Thermal ConductiGity: 2.4 Coefficient of Thermal Expansion: 11 Typical Electrical Properties: Dielectric Strength, volts/mil: 500 Dielectric Constant 8 25C, 100KC: 4.0 Dissipation Factor @ 25C, 100KC: 0.02 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating/Flexible High Temperature/Coating S-1241: Typical Uncured Properties: Color: white Consistency: pourable Viscosity 8 25C, cps: 33,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 1.33 Hardness, Shore A: 45 Tensile Strength, psi: 500 Elongation, %: 200 Tear Resistance, dieB, lbs/in: 35 Service Temperature, C: -70 to 205 Linear Shrinkage, in/in: .002 Typical Thermal Properties: Thermal Conductivity: 2.8 Coefficient of Thermal Expansion: 11 Typical Electrical Properties: Dielectric Strenath. volts/mil: 550 Dielectric Constant.8 25C,.lOOKC: 3.7 Dissipation Factor @ 25C, 100KC: 0.02 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating/Flexible Coating
Molds/
Molds/
805
806
Adhesives,
Sealants
and Coatings for the Electronics
Industry
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): Two Component RTV Compounds (Continued): S-1251: Typical Uncured Properties: Color: gray Consistency: easily pourable Viscosity @ 25C, cps: 17,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity: 1.26 Hardness, Shore A: 45 Tensile Strength, psi: 325 Elongation, %: 200 Tear Resistance, dieB, lbs/in: 20 Service Temperature, C: -115 to 205 Linear Shrinkage, in/in: .003 Tvoical Thermal Prouerties: -‘Thermal ConductiGity: 2.4 Coefficient of Thermal Expansion: 12 Typical Electrical Properties: Dielectric Strength, volts/mil: 500 Dielectric Constant @ 25C, 100KC: 4.0 Dissipation Factor @ 25C, 100KC: .005 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating/Flexible Coating S-1260: Typical Uncured Properties: Color: red Consistency: pourable Viscositv @ 25C. CDS: 50.000 Shelf Life, months- 6 . Typical Physical Properties: Specific Gravity:.1.49 Hardness, Shore A: 65 Tensile Strength, psi: 750 Elongation, %: 130 Tear Resistance, dieB, lbs/in: 45 Service Temperature, C: -70 to 260 Linear Shrinkage, in/in: .002 TVDiCal Thermal Prooerties: -‘Thermal ConductiGity: 2.4 Coefficient of Thermal Expansion: 11 Typical Electrical Properties: Dielectric Strength, volts/mil: 500 Dielectric Constant @ 25C, 100KC: 3.8 Dissipation Factor @ 25C, 100KC: 0.02 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating/Flexible High Temperature/Coating
Molds/
Molds/
Insulating Products
CASTALL, INC.: Silicones Specially Designed for Electronic Insulating Applications (Continued): Two Component RTV Compounds (Continued): S-1262: Typical Uncured Properties: Color: clear Consistency: very easily pourable Viscositv @ 25C. CDS: 1,000 Shelf Life, months: 6 Typical Physical Properties: Specific Gravity:.0.99 Hardness, Shore A: 15 Tensile Strength, psi: 100 Elongation, %: 100 Tear Resistance, dieB, lbs/in: 10 Service Temperature, C: -70 to 205 Linear Shrinkage, in/in: 0.002 Typical Thermal Properties: Thermal Conductivity: 1.2 Coefficient of Thermal Expansion: 17 Typical Electrical Properties: Dielectric Strength, volts/mil: 500 Dielectric Constant @ 25C, 1OOKC: 3.0 Dissipation Factor @ 25C, 100KC: 0.001 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating S-1277: Typical Uncured Properties: Color: white Consistency: Thixotropic paste Viscositv @ 25C. CDS: >300.000 Shelf Life; months- 6 Typical Physical Properties: Specific Gravity: 1.33 Hardness, Shore A: 50 Tensile Strength, psi: 500 Elongation, %: 150 Tear Resistance, dieB, lbs/in: 20 Service Temperature, C: -70 to 205 Linear Shrinkage, in/in: .003 TVDiCal Thermal Prooerties: __ Thermal Conductibity: 2.4 Coefficient of Thermal Expansion: 12 Typical Electrical Properties: Dielectric Strength, volts/mil: 450 Dielectric Constant @ 25C, 100KC: 3.9 Dissipation Factor @ 25C, 100KC: 0.015 Volume Resistivity, ohm-cm: 10 15 Typical Applications: Potting/Encapsulating
807
808
Adhesives,
Sealants
and Coatings for the Electronics
Industry
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications: CASTALL U-2001 Series: This series of products are solvent free, two part polyetherl polyalkyene MD1 based, urethane elastomers, adhesives and sealing compounds. They have remarkable hydrolytic stability and are excellent electrical insulators. This series lends itself to encapsulation, potting and general insulation applications. U-2001, U-2002, U-2003, U-2004, U-2006, U-2008, U-2015, U-2017 & U-2018 are unfilled materials of.varying hardnesses with the lower numbered materials being easily re-enterable. U-2007, u-2010 and u-2012 are filled materials that have been developed for some degree of fire retardancy. CASTALL U-2020 Series: This series of products are solvent free two part, polyether, polyester, MD1 based urethane elastomers, adhesives and sealing compounds. They have excellent hydrolytic stability and electrical insulation. This series also lends itself to encapsulation and potting of electronic and electrical devices. u-2020, U-2028, U-2032, U-2036 and U-2044 are unfilled materials of varying hardnesses. While U-2020FR, U-2024, U-2040, U-2048 and U-2052 are filled materials to accomplish either flame retardancy or other special desired properties. CASTALL U-2270 Series: These products are used in conjunction with the other urethane products as primers. U-2273 is a primer recommended for stainless steel, U-2274 is a primer recommended for most metals. U-2275 is a primer recommended for rubber and synthetic fabrics. U-2276 is a primer recommended for hard to bond substrates, such as glass, plastics and metals. CASTALL U-2520 R&I Series: These are a series of two part, light stable, solvent free, clear casting and laminating urethane resins. They are suitable for outdoor windows, transparent adhesives and sealing compounds.
Insulating Products
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): u-2001: Very soft, repairable material Color: Amber Mix Ratio R/l pbw: lo/10 Specific Gravity @ 25C: 1.02 Mixed Viscosity @ 25C cps: 1500 Shore Hardness: Al5 Pot-Life SOG-Min.: 6 Demold Time Hours @ 25C: 2 65C: 0.5 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 380 Tear Strength Split, pi: 8 Elongation %: 450 Dielectric Constant @ 25C: 100Hz: 3.01 10KHz: 2.97 Volts/Mil Dielectric Strength: 550 Dissipation Factor @ 25C: 1OOHz: 0.0260 1OKHz: 0.0280 Volume Resistivity @ 25C ohm/cm: 10 14 u-2002: Soft, repairable, high temp. use Color: Clear Mix Ratio R/i pbw: lO/lO Specific Gravity @ 25C: 1.05 Mixed Viscosity-@ 25C cps: 1400 Shore Hardness: A25 Pot Life 50G-Min.: 30 Demold Time Hours @ 25C: 4-5 65C: 0.75 Linear Shrinkage in./in.: 0.002 Tensile Strength psi: 142 Tear Strength Split, pi: 3 Elongation %: 200 Dielectric Constant @ 25C: 100 Hz: 4.08 10 KHz: 3.79 Volts/Mil Dielectric Strength: 550 Dissipation Factor @ 25C: 100 Hz: 0.0191 10 KHz: 0.0322 Volume Resistivity @ 25C ohm/cm: 10 14
809
810
Adhesives, Sealants and Coatings for the Electronics Industty
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2003: Soft, repairable, high temp. use Color: Amber Mix Ratio R/1 pbw: 9.3/10 Specific Gravity @ 25C: 1.04 Mixed Viscosity @ 25C cps: 800 Shore Hardness: A40 Pot-Life 50G-Min.: 30 Demold Time Hours @ 25C: 6 65C: 1.25 T,inear Shrinkage in./in.: 0.001 Tensile Strength psi: 275 Tear Strength Split, pi: 4 Elongation %: 100 Dielectric Constant @ 25C: 100 Hz: 3.05 10 KHz: 3.01 Volts/Mil Dielectric Strength: 540 Dissipation Factor a 25C: 100 HZ: 0.0122 10 KHz: 0.0125 Volume Resistivity @ 25C ohm/cm: 10 14 U-2004: Flexible, repairable material Color: Amber Mix Ratio R/l obw: 20/10 Specific Gravity @ 25C: 1.00 Mixed Viscosity @ 25C cps: 6100 Shore Hardness: A50 Pot-Life 50G-Min.: 60 Demold Time Hours @ 25C: 8 65C: 2 T,inear Shrinkage in./in.: 0.001 Tensile Strength psi: 600 Tear Strength Split, pi: 8 Elongation %: 200 Dielectric Constant @ 25C: 100 Hz: 3.16 10 KHz: 3.05 Volts/Mil Dielectric Strength: 590 Dissipation Factor @ 25C: 100 Hz: 0.0124 10 KHz: 0.0136 Volume Resistivity @ 25C ohm/cm: 10 15
Insulating Products
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2006: Tougher version of U-2004 Color: Amber Mix Ratio R/l pbw: 15/10 Specific Gravity @ 25C: 1.01 Mixed Viscosity @ 25C cps: 2000 Shore Hardness: A60 Pot-Life 50G-Min.: 15 Demold Time Hours @ 25C: 4 65C: 0.5 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 900 Tear Strength Split, pi: 24 Elongation %: 170 Dielectric Constant @ 25C: 100 Hz: 3.25 10 KHz: 3.14 Volts/Mil Dielectric Strength: 560 Dissipation Factor a 25C: 100 Hz: 0.0151 10 KHz: 0.0137 Volume Resistivity @ 25C ohm/cm: 10 15 U-2007: Reoairable. thermally conductive Color: Cream Mix Ratio R/1 pbw: 45/10 Specific Gravity @ 25C: 1.93 Mixed Viscosity @ 25C cps: 2500 Shore Hardness: A60 Pot-Life 50G-Min.: 30 Demold Time Hours @ 25C: 8 65C: 2 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 288 Tear Strength Split, pi: 8 Elongation %: 200 Dielectric Constant (a25C: 100Hz: 5.70 10 KHz: 5.42 Volts/Mil Dielectric Strenqth: 510 Dissipation Factor @ 25C: iO0 HZ: 0.0152 10 KHz: 0.0196 Volume Resistivity @ 25C ohm/cm: 10 14
811
812
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2008: Lower viscosity version of 2009 Color: Amber Mix Ratio R/l pbw: 20/10 Specific Gravity @ 25C: 1.0 Mixed Viscosity @ 25C cps: 4000 Shore Hardness: A70 Pot-Life SOG-Min.: 60 Demold Time Hours @ 25C: 7 65C: 2 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 825 Tear Strength-Split, pi: 23 Elongation %: 300 Dielectric Constant @ 25C: 100 Hz: 4.10 10 KHz: 3.81 Volts/Mil Dielectric Strength: 590 Dissipation Factor @ 25C: 100 HZ: 0.0150 10 KHz: 0.0183 Volume Resistivity @ 25C ohm/cm: 10 14 u-2009:
Special for marine electronics Color: Amber Mix Ratio R/l obw: 22/10 Specific Gravity @ 25C: 1.06 Mixed Viscosity @ 25C cps: 5000 Shore Hardness: A70 Pot-Life 50G-Min.: 5 Demold Time Hours @ 25C: 4 65C: 0.5 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 1290 Tear Strength Split, pi: 24 Elongation %: 220 Dielectric Constant @ 25C: 100 Hz: 3.00 10 KHz: 2.86 Volts/Mil Dielectric Strength: 650 Dissipation Factor @ 25C: 100 HZ: 0.0189 10 KHz: 0.0199 Volume Resistivity @ 25C ohm/cm: 10 15
Insulating Products
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): u-2010: Fire retardant version of U-2008 Color: Black Mix Ratio R/l obw: 20/10 Specific Gravity @ 25C: 1.14 Mixed Viscosity @ 25C cps: 10000 Shore Hardness: A70 Pot-Life 50G-Min.: 2-3 Demold Time Hours 8 25C: 0.10 65C: 0.05 Linear Shrinkage in./in.: 0.002 Tensile Strength psi: 525 Tear Strength Split, pi: 28 Elongation %: 330 Dielectric Constant @ 25C: 100 Hz: 4.08 IO KHz: 3.76 Volts/Mil Dielectric Strength: 560 Dissipation Factor @ 25C: iO0 Hz: 0.0119 10 KHz: 0.0286 Volume Resistivity @ 25C ohm/cm: 10 14 u-2012: Thixotrooic version of U-2010 Color: Biack Mix Ratio R/1 pbw: 20/10 Specific Gravity @ 25C: 1.12 Mixed Viscosity @ 25C cps: 10000 Shore Hardness: A70 Pot-Life 50G-Min.: 2-3 Demold Time Hours @ 25C: 0.10 65C: 0.07 Linear Shrinkaqe in./in.: 0.001 Tensile Strength psi: 500 Tear Strength Split, pi: 23 Elongation %: 300 Dielectric Constant 8 25C: 100 Hz: 3.95 IO KHz: 3.52 Volts/Mil Dielectric Strength: 560 Dissipation Factor 8 25C: 100 Hz: 0.0105 10 KHz: 0.0251 Volume Resistivity @ 25C ohm/cm: 10 15
813
814
Adhesives,
Sealants
and Coatings for the Electronics
Industry
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2015: Special for high temp. and moisture Color: Amber Mix Ratio R/l obw: 32110 Specific Gravity @ 25C: 1.06 Mixed Viscosity @ 25C cps: 4500 Shore Hardness: A80 Pot-Life SOG-Min.: 2 Demold Time Hours @ 25C: 0.10 65C: 0.05 Linear Shrinkage in./in.: 0.010 Tensile Strength psi: 1330 Tear Strength Split, pi: 32 Elongation %: 200 Dielectric Constant @ 25C: 100 Hz: 3.05 10 KHz: 2.71 Volts/Mil Dielectric Strength: 520 Dissipation Factor @ 25C: 100 Hz: 0.0101 10 KHz: 0.0113 Volume Resistivity @ 25C ohm/cm: 10 15 U-2017: Non-crystallizing U-2018 type Color: Amber Mix Ratio R/l obw: 30/10 Specific Gravity @ 25C cps: 1.06 Mixed Viscosity @ 25C cps: 5000 Shore Hardness: A85 Pot-Life 50G-Min.: 13 Demold Time Hours @ 25C: 6 65C: 1 Linear Shrinkage in./in.: 0.002 Tensile Strength psi: 1250 Tear Strength Split, pi: 42 Elongation %: 250 Dielectric Constant @ 25C: 100 Hz: 2.80 10 KHz: 2.80 Volts/Mil Dielectric Strength: ,600 Dissipation Factor @ 25C: 100 HZ: 0.004 10 KHz: 0.008 Volume Resistivity @ 25C ohm/cm: 10 15
Insulating Products
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2018: Harder version of U-2009 Color: Amber Mix Ratio R/l ubw: 35flO Specific Gravity @ 25C: 1.06 Mixed Viscosity @ 25C cps: 5000 Shore Hardness: AS5 Pot-Life 50G-Min.: 4 Demold Time Hours @ 25C: 4 65C: 0.5 Linear Shrinkage in./in.: 0.002 Tensile Strength psi: 1330 Tear Strength Split, pi: 24 Elongation %: 200 Dielectric Constant @ 25C: 100 HZ: 3.95 10 KHz: 3.16 Volts/Mil Dielectric Strength: 580 Dissipation Factor @ 25C: 100 HZ: 0.0301 10 KHz: 0.0296 Volume Resistivity @ 25C ohm/cm: 10 15 u-2020: Tough, easily processed Color: Amber Mix Ratio R/l pbw: 22110 Specific Gravity @ 25C: 1.04 Mixed Viscosity @ 25C cps: 900 Shore Hardness: A80 Pot-Life 50G-Min.: lo-15 Demold Time Hours @ 25C: 1 65C: 0.5 Linear Shrinkage in./in.: 0.003 Tensile Strength psi: 1935 Tear Strength Split, pi: 31 Elongation %: 200 Dielectric Constant @ 25C: 100 Hz: 3.1 10 KHz: 3.03 Volts/Mil Dielectric Strength: ,600 Dissipation Factor @ 25C: 100 HZ: 0.009 10 KHz: 0.010 Volume Resistivity @ 25C ohm/cm: 10 15
81.5
816
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2020FR: UL-94-VO version of U-2020 Color: Black Mix Ratio R/l pbw: 45.5/10 Specific Gravity @ 25C: 1.40 Mixed Viscosity @ 25C cps: 4000 Shore Hardness: A85 Pot-Life 50G-Min.: 45 Demold Time Hours @ 25C: 5 @ 65C: 0.5 Linear Shrinkage in./in.: 0.006 Tensile Strength psi: 900 Tear Strenath Snlit. oi: 23 Elongation-%: 100 ’ _ Dielectric Constant @ 25C: 100 Hz: 3.8 10 KHz: 3.79 Volts/Mil Dielectric Strength: >600 Dissipation Factor @ 25C: 100 HZ: 0.014 10 KHz: 0.012 Volume Resistivity @ 25C ohm/cm: 10 14 U-2024: Softer version of U-2020, Low viscosity Color: Black Mix Ratio R/l nbw: 23.3/10 Specific Gravity @ 25C: 1.05 Mixed Viscosity @ 25C cps: 420 Shore Hardness: A65 Pot-Life SOG-Min.: 30-45 Demold Time Hours @ 25C: 14 65C: 0 Linear Shrinkage in-/in.: 0.002 Tensile Strength psi: 520 Tear Strength Split, pi: 4 Elongation %: 100 Dielectric Constant @ 25C: 100 Hz: 3.20 10 KHz: 3.10 Volts/Mil Dielectric Strength: 580 Dissipation Factor @ 25C: 100 HZ: 0.0156 10 KHz: 0.0192 Volume Resistivity @ 25C ohm/cm: 10 15
Insulating Products
CASTALL, INC. : Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2028: Softer version of U-2020 Color: Amber Mix Ratio R/1 obw: 26/10 Specific Gravity @ 25C: 1.04 Mixed Viscosity @ 25C cps: 1000 Shore Hardness- A70 Pot Life 50G-Min.: 15 Demold Time Hours @ 25C: 1 65c: 0.25 Linear Shrinkage in./in.: 0.010 Tensile Strength psi: 380 Tear Strength Split, pi: 8 Elongation %: 170 Dielectric Constant @ 25C: 100 HZ: 3.85 10 KHz: 3.80 Volts/Mil Dielectric Strength: 580 Dissipation Factor @ 25C: 100 HZ: 0.0193 10 KHz: 0.0215 Volume Resistivity @ 25C ohm/cm: 10 15 U-2032: Clear fire retardant version U-2028 Color: Amber Mix Ratio R/1 pbw: 16/10 Specific Gravity @ 25C: 1.10 Mixed Viscosity @ 25C cps: 1200 Shore Hardness: A70 Pot-Life SOG-Min.: 20-25 Demold Time Hours @ 25C: 4 65C: 0.33 Linear Shrinkage in./in.: 0.003 Tensile Strength psi: 600 Tear Strength Split, pi: 12 Elongation-%: 200 Dielectric Constant @ 25C: 100 Hz: 5.21 10 KHz: 4.99 Volts/Mil Dielectric Strength: 525 Dissipation Factor @ 25C: 100 Hz: 0.0163 10 KHz: 0.0301 Volume Resistivity @ 25C ohm/cm: 10 14
817
818
Adhesives, Sealants and Coatingsfor the ElectronicsIndustry
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2036: Modified version of U-2028 Color: Yellow Mix Ratio R/i pbw: 12/10 Specific Gravity @ 25C: 1.07 Mixed Viscosity @ 25C cps: 1000 Shore Hardness: A70 Pot-Life 50G-Min.: 45 Demold Time Hours B 25C: 4 65C: 0.5 Linear Shrinkage in./in.: 0.003 Tensile Strength psi: 512 Tear Strength, pi: 8 Elongation %: 120 Dielectric Constant @ 25C: 100 Hz: 3.56 IO KHz: 3.40 Volts/Mil Dielectric Strength: 520 Dissipation Factor @ 25C: 100 HZ: 0.0186 10 KHz: 0.0165 Volume Resistivity @ 25C ohm/cm: 10 14 U-2040: Fire retardant version of U-2024 Color: White Mix Ratio R/1 pbw: 15/10 Specific Gravity @ 25C: 1.30 Mixed Viscosity-@ 25C cps: 3000 Shore Hardness: A75 Pot-Life 50G-Min.: 60 Demold Time Hours @ 25C: 12-16 65C: l-2 Linear Shrinkage in./in.: 0.002 Tensile Strength psi: 250 Tear Strenath Salit. oi: 4 Elongation-%: 150 ’ _ Dielectric Constant @ 25C: 100 Hz: 5.98 10 KHz: 5.53 Volts/Mil Dielectric Strength: 430 Dissipation Factor @ 25C: 100 Hz: 0.0521 10 KHz: 0.0618 Volume Resistivity @ 25C ohm/cm: 10 14
Insulating Products
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2044: Harder version of U-2020 Color: Amber Mix Ratio R/l pbw: 12/10 Specific Gravity @ 25C: 1.04 Mixed Viscosity @ 25C cps: 2000 Shore Hardness: A85 Pot-Life 50G-Min.: 20 Demold Time Hours @ 25C: 1 65C: 0.5 Linear Shrinkage in-/in.: 0.002 Tensile Strength psi: 1220 Tear Strength Split, pi: 16 Elongation-%: 100 Dielectric Constant @ 25C: 100 Hz: 3.16 10 KHz: 3.41 Volts/Mil Dielectric Strength: 550 Dissipation Factor @ 25C: 100 HZ: 0.0146 10 KHz: 0.0193 Volume Resistivity @ 25C ohm/cm: 10 15 U-2048: Lower viscosity version of U-2044 Color: Black Mix Ratio R/l pbw: 11.2/10 Specific Gravity @ 25C: 1.05 Mixed Viscosity @ 25C cps: 250 Shore Hardness: A85 Pot-Life SOG-Min.: 20 Demold Time Hours R 25C: 12-16 65C: l-2 Linear Shrinkaqe in./in.: 0.003 Tensile Strensth osi: 920 Tear Strength-Split, pi: 19 Elongation %: 105 Dielectric Constant @ 25C: 100 HZ: 3.65 10 KHz: 3.21 Volts/Mil Dielectric Strength: 580 Dissipation Factor @ 25C: 100 HZ: 0.0162 10 KHz: 0.0397 Volume Resistivity @ 25C ohm/cm: 10 15
819
820
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2052: Filled version of U-2020 Color: Brown Mix Ratio R/l pbw: 52110 Specific Gravity @ 25C: 1.30 Mixed Viscosity @ 25C cps: 1000 Shore Hardness: D40 Pot-Life 50G-Min.: 45 Demold Time Hours @ 25C: 5 65C: 0.5 Linear Shrinkage in-/in.: 0.003 Tensile Strength psi: 830 Tear Strength Split, pi: 10 Elongation %: 60 Dielectric Constant @ 25C: 100 HZ: 4.89 10 KHz: 4.43 Volts/Mil Dielectric Strength: 520 Dissipation Factor @ 25C: 100 HZ: 0.0174 10 KHz: 0.0278 Volume Resistivity 8 25C: 10 14 U-2518: Optically clear, light stable Color: Clear Mix Ratio R/l pbw: 31/10 Specific Gravity @ 25C: 1.03 Mixed Viscosity-8 25C cps: 300 Shore Hardness: A45 Pot-Life SOG-Min.: 20 Demold Time Hours @ 25C: 24 65C: 8 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 2500 Tear Strencth Solit. oi: 20 Elongation-%: 6bO ’ _ Dielectric Constant @ 25C: 100 Hz: 4.57 10 KHz: 4.51 Volts/Mil Dielectric Strength: 600 Dissipation Factor 8 25C: 100 HZ: 0.010 10 KHz: 0.010 Volume Resistivity @ 25C ohm/cm: 10 14
Insulating Products
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2520: Optically clear, light stable Color: Clear Mix Ratio R/l pbw: 14/10 Specific Gravity @ 25C: 1.03 Mixed Viscosity @ 25C cps: 300 Shore Hardness: A70 Pot-Life SOG-Min.: 10 Demold Time Hours @ 25C: 8 65C: 3 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 2100 Tear Strength Split, pi: 48 Elongation %: 280 Dielectric Constant @ 25C: 100 Hz: 3.82 10 KHz: 4.67 Volts/Mil Dielectric Strength: 620 Dissipation Factor @ 25C: 100 HZ: 0.011 10 KHz: 0.012 Volume Resistivity @ 25C ohm/cm: 10 14 U-2521: Optically clear, light stable Color: Clear Mix Ratio R/l nbw: 15/10 Specific Gravity @ 25C: 1.04 Mixed Viscosity @ 25C cps: 400 Shore Hardness: D40 Pot Life 50G-Min.: 5 Demold Time Hours @ 25C: 0.5 65C: 0.16 Linear Shrinkaae in-/in.: 0.001 Tensile Strength psi: 2900 Tear Strength Split, pi: 32 Elongation-%: 200 Dielectric Constant @ 25C: 100 Hz: 4.01 10 KHz: 4.03 Volts/Mil Dielectric Strength: 630 Dissipation Factor @ 25C: 100 HZ: 0.007 10 KHz: 0.009 Volume Resistivity @ 25C ohm/cm: 10 14
821
822
Adhesives, Sealants and Coatings for the Electronics Industry
CASTALL, INC.: Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2523: Optically clear, light stable Color: Clear Mix Ratio R/l pbw: lO/lO Snecific Gravitv @ 25C: 1.05 Mixed Viscosity-@ 25C cps: 550 Shore Hardness: D55 Pot-Life 50G-Min.: 7 Demold Time Hours @ 25C: 0.5 65C: 0.16 Linear Shrinkage in-/in.: 0.001 Tensile Strength psi: 2900 Tear Strength Split, pi: 55 Elongation %: 200 Dielectric Constant @ 25C: 100 Hz: 3.70 10 KHz: 3.92 Volts/Mil Dielectric Strength: 610 Dissipation Factor @ 25C: 100 HZ: 0.009 10 KHz: 0.008 Volume Resistivity @ 25C ohm/cm: 10 15 U-2524: Optically clear, light stable Color: Clear Mix Ratio R/l pbw: lO/lO Specific Gravity @ 25C: 1.05 Mixed Viscosity @ 25C cps: 550 Shore Hardness: D65 Pot-Life SOG-Min.: 5 Demold Time Hours @ 25C: 0.5 65C: 0.16 Linear Shrinkage in./in.: 0.001 Tensile Strength psi: 3400 Tear Strenath Solit. oi: 100 Elongation*%: 1‘00 ~' Dielectric Constant @ 25C: 100 Hz: 3.51 10 KHz: 4.01 Volts/Mil Dielectric Strength: 615 Dissipation Factor @ 25C: 100 HZ: 0.011 IO KHz: 0.011 Volume Resistivity @ 25C ohm/cm: 10 15
Insulating Products
CASTALL, INC. : Urethanes Specially Designed for Electronic Insulating Applications (Continued): U-2527: Optically clear, light stable Color: Clear Mix Ratio R/l obw: lo/15 Specific Gravity @ 25C: 1.06 Mixed Viscosity @ 25C cps: 900 Shore Hardness: D80 Pot-Life SOG-Min.: 5 Demold Time Hours @ 25C: 0.5 65C: 0.1 Linear Shrinkage in./in.: 0.003 Tensile Strength psi: 8000 Tear Strength Split, pi: NA Elongation %: 10 Dielectric Constant @ 25C: 100 HZ: 3.26 10 KHz: 3.27 Volts/Mil Dielectric Strength: 670 Dissipation Factor @ 25C: 100 HZ: 0.010 10 KHz: 0.010 Volume Resistivity @ 25C ohm/cm: 10 15
823
824
Adhesives, Sealants and Coatings for the Electronics Industy
JOHN C. DOLPH CO.: Insulating Varnishes: Baking Varnishes: HI-THERM BC-325: High bond strength, fast cure, rigid, mar-proof film. Clear Thinner: T-100 (VM&P) Type: Thermosetting Thermal Index: 200 Curins_ Cycle: Time Hours: l/2 - 4 _ Temp. F: 250-325 Dielectric Strength: Dry: 3400 Wet: 2800 Bond Strength: 23C: 35 155c: 4.5 HI-THERM BC-340: Flexible, tough film, high bond, especially qood for form wound coils. Clear Thinner: T-50 (Mineral Spirits) Type: Thermosetting Thermal Index: 195 Curing Cycle: Time Hours: l/2 - 4 Temp. F.: 275-325 Dielectric Strength: Dry: 4100 Wet: 2900 Bond Strength: 23C: 35 155c: 5.0 Military Specification: MIL-I-24092B Underwriters Laboratories Recognition: 18OC HI-THERM BB-346-A: UL recognized, high temperature, black baking varnish. Same tough, flexible resin as BC-346-A. Black Thinner: T-100 or T-200X Type: Thermosetting Thermal Index: 215 Curing Cycle: Time Hours: 1-5 Temp. F.: 275-325 Dielectric Strength: Dry: 3000 Wet: 2200 Bond Strength: 23C: 28 155C: 2.5 Underwriters Laboratories Recognition: 13OC/155C/18OC/22OC
Insulating Products
JOHN C. DOLPH CO.: Insulating Varnishes
(Continued):
HI-THERM BC-346-A: High temperature (220) varnish. Tough, flexible; MIL Spec use & UL Recognized varnish. Clear Thinner: T-100 (VM&P) Type: Thermosetting Thermal Index: 215 Curing Cycle: Time Hours: l-5 Temp. F.: 275-325 Dielectric Strength: Dry: 4000 Wet: 2900 Bond Strength: 23C: 28 155C: 2.5 Military Specification: Meets MIL-I-24092B Underwriters Laboratories Recognition: 13OC/155C/lSOC/22OC HI-THERM BC-346-AN: Same as BC-346-A with Rule 66 solvent. Clear Thinner: T-230 Type: Thermosettinq Thermal Index: 215 Curing Cycle: Time Hours: l-5 Temp. F.: 275-325 Dielectric Strength: Dry: 4000 Wet: 2900 Bond Strength: 23C: 28 155C: 2.5 Military Specification: MIL-I-24092B Underwriters Laboratories Recognition: 13OC/155C/18OC/22OC HI-THERM BC-346-B: Same as BC-346-A with Xylol solvent. Clear Thinner: T-200X (Xylol) Type: Thermosettinq Thermal Index: 215 Curing Cycle: Time Hours: l-5 Temp. F.: 275-325 Dielectric Strength: Dry: 4000 Wet: 2900 Bond Strength: 23C: 28 155C: 2.5 Military Specification: MIL-I-24092B Underwriters Laboratories Recognition: 13OC/155C/lSOC/22OC
825
826
Adhesives,
Sealants
and Coatings for the Electronics
JOHN C. DOLPH CO.: Insulating Varnishes
Industy
(Continued):
Baking Varnishes(Continued): DOLPHON BC-352: Class H epoxy varnish for hermetics, high bond, outstand i -ng moisture & chemical resistance. Clear Thinner: T-352 Type: Thermosetting Thermal Index: 180 Curing Cycle: Time Hours: 2-4 Temp. F.: 325 Dielectric Strength: Dry: 4600 Wet: 3600 Bond Strength: 23C: 55 155C: 18 Underwriters Laboratories Recognition: 180C HI-THERM BB-353: High temperature, jet black version of BC-346-A. Jet Black Thinner: T-100 (VM&P) Type: Thermosetting Thermal Index: 200 Curing Cycle: Time Hours: 1-5 Temp. F.: 275-325 Dielectric Strength: Dry: 2600 Wet: 2400 Bond Strength: 23C: 28 155C: 2.5 Underwriters Laboratories Recognition: 155C/18OC HI:-THERM BC-354: Flexible, Class H varnish, MIL-I-24092, Class 180 QPL. Clear Thinner: T-200X (Xylol) Type: Thermosetting Thermal Index: 185 Curing Cycle: Time Hours: 2-8 Temp. F.: 275-350 Dielectric Strength: Dry: 4100 Wet: 3000 Bond Strength: 23C: 15 155C: 2.5 Military Specification: MIL-I-24092B
Insulating Products
JOHN C. DOLPH CO.: Insulating Varnishes
827
(Continued):
Baking Varnishes(Continued): HI-THERM BC-359: Energy saving. Fast cure/low temperature cure. Superior moisture, chemical & abrasion resistance. Rule 66 solvent. Clear Thinner: T-100 (VM&P) Type: Thermosetting Thermal Index: 180 Curing Cycle: Time Hours: l/2 - 10 Temp. F.: 230-325 Dielectric Strength: Dry: 3000 Wet: 3000 Bond Strength: 23C: 26 155c: 3.5 Underwriters Laboratories Recognition: 13OC/l55C/18OC HI-THERM BC-363: New, high bond, fast curing general purpose varnish. UL recognized. Low cost. Clear Thinner: T-200X or VR-3009 Type: Thermosetting Thermal Index: 180 Curing Cycle: Time Hours: l/2 - 10 Temp. F.: 230 Dielectric Strength: Dry: 4500 Wet: 3500 Bond Strenath: 23C: 38 . 155C: 6.0 Underwriters Laboratories Recognition: 13OC/l55C/ 180C AQUA-THERM BC-362: Water soluble, Class H varnish meets most polluti on & safety regulations. Clear Thinner: Water Type: Thermosetting Thermal Index: 180 Curing Cycle: Time Hours: 1 l/2 - 6 Temp. F.: 275-325 Dielectric Strength: Dry: 4000 Wet: 3200 Bond Strength: 23C: 30 155c: 5 Underwriters Laboratories Recognition: 18OC/22OC
828
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: Insulating Varnishes
(Continued):
Solventless Varnishes: DOLPHON CC-1080: LOW cost, solventless varnish, low viscosity, fast curing. Clear Thinner: None Type: Unsaturated Polyester Thermal Index: 180 Curing Cycle: Time Hours: 2-6 Temp. F.: 200-300 Dielectric Strength: Dry: 3500 Bond Strength: 23C: 30 155c: 7 DOLPHON CC-1105: One part solventless varnish. Nonflammable, low emissions. Extra high bond, fast cure. Minimum clean-up. Clear Thinner: None Type: Unsaturated Polyester Thermal Index: 205 Curing Cycle: Time Hours: l/4 - 12 Temo. F.: 230-350 Dielectric Strength: Dry: 4000 Bond Strength: 23C: 42 155c: 20 Underwriters Laboratories Recognition: 13OC/155C/18OC/22OC Air Drying Varnishes: SYNTHITE AC-29-7s: Moisture resistant, fungicidal, "tropicalizing" varnish. Clear Thinner: T-200X (Xylol) Type: Oxidizing Thermal Index: 105 Curing Cycle: Time Hours: 3 l/2 Temp. F.: 73 Dielectric Strength: Dry: 2000 Net: 1100 Military Specification: MIL-V-173C-2
Insulating Products
JOHN C. DOLPH CO.: Insulating Varnishes
(Continued):
Air Drying Varnishes(Continued): SYNTHITE AC-41: Fast dry, moisture & chemical resistant. Excellent protective varnish, good for PC boards. Solderable. Clear Thinner: T-200X (Xylol) Type: Oxidizing Thermal Index: 160 Curing Cycle: Time Hours: 15 min. Temp. F.: 73 Dielectric Strength: Dry: 2000 Wet: 1200 Military Specification: MIL-I-24092B SYNTHITE AC-43: High temperature air dry/bake, fast processing. Solderable. Clear Thinner: T-200X (Xylol) Type: Oxidizing Thermal Index: 175 Curing Cycle: Time Hours: 1 Temp. F.: 73 Dielectric Strength: Dry: 2000 Wet: 1200 Underwriters Laboratories Recognition: 13OC/l55C SYNTHITE AC-43-66: Same as AC-43 with Rule 66 solvent. Clear Thinner: T-100 (VM&P) Type: Oxidizing Thermal Index: 175 Curing Cycle: Time Hours: 1 Temp. F.: 73 Dielectric Strength: Dry: 2000 Wet: 1200 Underwriters Laboratories Recognition: 13OC/155C
829
830
Adhesives,
Sealants
and Coatings for the Electronics
JOHN C. DOLPH CO.: Insulating Varnishes
Industry
(Continued):
Insulating Lacquers: LC-705: Excellent protective & waterproof coating for deflection yokes, RF coils, PC boards, etc. Clear Thinner: T-220 Type: Air Dry Thermal Index: 105 Curing Cycle: Time Hours: 15 min. Temp. F.: 73 Dielectric Strength: Dry: 1500 Wet: 800 LV-742: Tough, flexible, high build, green conformal coating. Can replace tape wrap. Green Thinner: T-200X (Xylol) Type: Air Dry Thermal Index: 105 Curing Cycle: Time Hours: 10 min. Temp. F.: 73 Dielectric Strength: Dry: 3800 Insulating Enamels: SYNTHITE ER-41: Class F insulator. Tough, flexible, fast air drying. Abrasion, chemical & moisture resistant film. Solderable. Red Thinner: T-200X (Xylol) Type: Oxidizing Thermal Index: 160 Curing Cycle: Time Hours: l/2 Temp. F.: 73 Dielectric Strength: Dry: 2000 Wet: 1200 SYNTHITE EB-41: Same as ER-41. Satin black finish. Black Thinner: T-200X (Xylol) Type: Oxidizing Thermal Index: 160 Curing Cycle: Time Hours: l/2 Temp. F.: 73 Dielectric Strength: Dry: 1800 Wet: 1200
Insulating Products
JOHN C. DOLPH CO.: Insulating Varnishes
(Continued):
Insulating Enamels(Continued): SYNTHITE EB-43-FB: High temperature, flat black, air dry for transformers, coils, power supplies. Flat Black Thinner: T-200X (Xylol) Type: Oxidizing Thermal Index: 160 Curing Cycle: Time Hours: 1 Temp. F.: 73 Dielectric Strength: Dry: 1500 Wet: 900 Machinery Enamels: EG-43-D: Fast dry, gray enamel for motor frames, machinery, transformer cases, etc. Solderable. Dark Gray Thinner: T-200X (Xylol) Type: Oxidizing Curing Cycle: Time Hours: 3/4 - 1 Temp. F.: '73 EG-43-X: Same as EG-43-D but blue gray. Solderable. Blue Gray Thinner: T-200X (Xylol) Type: Oxidizing Curing Cycle: Time Hours: 314 - 1 Temp. F.: 73 Masking Compounds: MV-726: Tough, flexible film for masking parts. Green Thinner: Methyl Ethyl Ketone Type: Air Dry Curing Cycle: Time Hours: l/2 Temp. F.: 73
83I
832
Adhesives,
Sealants
and Coatings for the Electronics
JOHN C. DOLPH CO.: Insulating Varnishes
Industry
(Continued):
Masking Compounds (Continued): MY-739:
Masking compound for longer and hotter cycles. Yellow
Thinner: T-25 (Methyl Acetone) Type: Air Dry Curing Cycle: Time Hours: l/2 Temp. F.: 73 DOLFLEX CC-1022: Paste-like masking compound for vert ical surfaces, irregula.r parts. Clear Thinner: None Type: Thermosetting Curing Cycle: Time Hours: l/2 Temp. F.: 275 Sealing Compounds: cw-340-l: Putty like compound to protect end turns, fill commutators, etc. Amber Type: Thermosetting Thermal Index: 155 Curing Cycle: Time Hours: 2-4 Temp. F.: 285
Insulating Products
833
THE P.D. GEORGE CO.: PEDIGREE No. 1000-70 Water Borne Insulating Varnish: PEDIGREE No. 1000-70 Water Borne insulating varnish is an excellent all purpose water borne varnish that has been formulated to yield a high temperature rating. It also meets most state, local and federal clean air standards. Relative Advantages: - Low voc - Water reducible from 70% to 15% solids. - Thermal ratings up to 220C Electrical - Class - Class - Class - Class - Class
Insulation Systems (UL file E 87039) 130 Svstems: PDG 1 PDG 2 PDG 4A PDG 4B PDG 101 PDG 106 155 S;stems: PDG 102 PDG 108 180 Systems: PDG H PDG 103 PDG 109 200 Systems: PDG 7 PDG 104 220 Systems: PDG 8 PDG 220
Phvsical Prooerties: Specific Gravity 8 25C: 1.0587 Weight per Gallon @ 25C: 8.8 (approx) Color: Light Amber Solids Content: 67% - 70% Viscosity 8 25C: Brookfield: 8000-13000 cps #3 Zahn Cup: NA Flash Point (PMCC): 119F minimum Cure Time: Cup-10 gr. 8 149C: 45 min. Glass panel @ 149C: 4-8 min. pH: 8.0-9-O Flexibility: Copper panel, double dip, cured 2 hrs at 15OC, thickness 2.0 mils Mandrel Size: l/8": As Made: No Crackina 24 Hrs @ 15OC: No Cracking Mandrel Size: l/4": As Made: No Crackins 24 Hrs @ 15OC: No Cracking Mandrel Size: l/2": As Made: No Cracking 24 Hrs @ 15OC: No Cracking pH Control: The pH of PEDIGREE No. 1000-70 should be maintained between 7.5-8.0. The pH may be adjusted by small additions of DMEA. Military Approval: PEDIGREE No. 1000-70 meets and surpasses all the requirements of the MIL-I-24092 specification. Thermally approved Grades C,B,H-Composition II-Class 18OC.
834
Adhesives,
HEXCEL
Sealants
CHEMICAL
and Coatings for the Electronics
PRODUCTS:
EPOLITE
Industry
Brand Electrical Insulating
Products: Heat Cure Epoxies - One Component: 6400: Heat sink bonding and general purpose adhesive. Thixotropic - Thermally conductive. Excellent adhesion to metals and ceramics. Shelf Life Months 25C: 6 Color: Gray Viscosity 25C: Paste Cure Cycle Hrs/C: l/150 Hardness Shore D @ 75F: 88 Tg C: 132 Dielectric Constant 10 3 HZ, 75F: 4.5 Dissipation Factor 10 3 Hz, 75F: -008 Volume Resistivity IKV, 75F Ohms/Cm: 3 x 10 14 Surface Resistivity IKV, 75F Ohms: 4 x IO 14 6402: Heat sink bonding and general purpose adhesive for passive applications. Same as above plus higher heat resistance, lower CTE and higher thermal conductivity. Shelf Life Months 25C: 6 Color: Gray Viscosity 25C: Paste Cure Cycle Hrs/C: l/l75 Hardness Shore D @ 75F: 89 Tg C: 165 Dielectric Constant 10 3 HZ, 75F: TBD Dissipation Factor 10 3 HZ, 75F: TBD Volume Resistivity IKV, 75F Ohms/Cm: TBD Surface Resistivity lKV, 75F Ohms: 1.5 x 10 14 6501: Potting microelectronic devices. Low viscosity. Flame retardant. Meets UL-9401. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 7,500 Cure Cycle Hrs/C: l/150 Hardness Shore D @ 75F: 88 Tg C: 140 Dielectric Constant 10 3 HZ, 75F: 4.1 Dissipation Factor 10 3 HZ, 75F: -007 Volume Resistivity lKV, 75F Ohms/cm: 2 x 10 15 Surface Resistivity lKV, 75F Ohms: 3 x 10 15
Insulating Products
835
HEXCEL CORP.: EPOLITE Brand Electrical Insulating Products (Continued): Heat Cure Epoxies - One Component (Continued): 6502: Potting and sealing trimmers, switches Low A TCR. Excellent adhesion (esp. to ant - UL 94 HB. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 62,000 Cure Cycle Hrs/C: l/150 Hardness Shore D @ 75F: 88 Tg C: 135 Dielectric Constant 10 3 Hz. 75F: 4.2 Dissipation Factor 10 3 Hz,'75F: -009 Volume Resistivity lKV, 75F Ohms/cm: 4 Surface Resistivity IKV, 75F Ohms: 5 x
and other devices. Valox). Flame retard-
x 10 15 10 15
6504: Potting and sealing transistors and thermisters. Low CTE. Excellent bubble release. Low viscosity at elevated temperature. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 250,000 Cure Cycle Hrs/C: l/l50 Hardness Shore D @ 75F: 90 Tg C: 138 Dielectric Constant 10 3 HZ, 75F: 4.4 Dissipation Factor 10 3 HZ,.75F: .007 Volume Resistivity lKV, 75F Ohms/cm: 2 x 10 15 Surface Resistivity 1 KV, 75F Ohms: 3 x 10 15 6507: Potting and encapsulation where flow control is desirable. Low A TCR. Meets UL 94HB and UL 1414. Meets MIL-I-16923 C1.D. Shelf Life Months 25C: 4 Color: Red Viscosity 25C: 80,000 Cure Cycle Hrs/C: l/l50 Hardness Shore D @ 75F: 88 Tg C: 118 Dielectric Constant 10 3 HZ, 75F: 4.1 Dissipation Factor 10 3 Hz, 75F: -007 Volume Resistivity lKV, 75F Ohms/cm: 2 x 10 15 Surface Resistivity IKV, 75F Ohms: 3 x 10 15
836
Adhesives, Sealants and Coatings for the Electronics Industry
HEXCEL
CORP.:
EPOLITE
Brand Electrical Insulating Products
(Continued): Heat Cure Epoxies - One Component
(Continued):
6509: Back filling pin grid arrays and wire bonding. Potting. Excellent adhesion to PCB's, leads and ceramics/silicon. Thermally conductive. Low CTE. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 95,000 Cure Cycle Hrs/C: l/150 Hardness Shore D @ 75F: 91 Tg C: 132 Dielectric Constant 10 3 HZ, 75F: 3.3 Dissipation Factor 10 3 HZ, 75F: -005 Volume Resistivity IKV, 75F Ohms/cm: 1.5 x 10 16 Surface Resistivity IKV, 75F Ohms: 2.3 x 10 16 6517: Potting and encapsulation where thermal shock resistance is critical. Low A TCR. Thixotropic control. Flame retardant. Meets UL 94 HB and UL 1414. Shelf Life Months 25C: 4 Color: Gray Viscosity 25C: 90,000 Cure Cycle Hrs/C: l/l50 Hardness Shore D @ 75F: 85 Tg C: 220 Dielectric Constant 10 3 HZ. 75F: 4.2 Dissipation Factor 10 3 HZ,'75F: .006 Volume Resistivity IKV, 75F Ohms/cm: 2 x 10 15 Surface Resistivity IKV, 75F Ohms: 3 x 10 15 6521: Repair of PCB's, IC's. Thixotropic - Excellent adhesion to metals, ceramics and most plastics. Low CTE. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 170,000 Cure Cycie Hrs/C: l/150 Hardness Shore D @ 75F: 88 Tg c: 138 Dielectric Constant 10 3 HZ, 75F: 3.5 Dissipation Factor 10 3 HZ, 75F: .006 Volume Resistivity IKV, 75F Ohms/cm: 1.5 x 10 16 Surface Resistivity IKV, 75F Ohms: 2.3 x 10 16
Insulating Products
HEXCEL CORP.: EPOLITE Brand Electrical Insulating Products (Continued): Heat Cure Epoxies - One Component (Continued): 6522: Back filling (self levelling). PGA's wire bonding. Potting. Glob top. Same as above. Thermally conductive. Low CI. Low CTE. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 170,000 Cure Cycle Hrs/C: l/l50 Hardness Shore D @ 75F: 80 Tg C: 140 Dielectric Constant 10 3 HZ, 75F: 3.1 Dissipation Factor 10 3 HZ, 75F: -005 Volume Resistivity 1 KV, 75F Ohms/cm: 2 x 10 165 Surface Resistivity 1 KV, 75F Ohms: 2.6 x 10 16 6523: Same as 6522 except not self levelling. Glob top. Features: Same as 6522 Shelf Life Months 25C: 6 Color: Black Viscosity 25C: Paste Cure Cycle Hrs/C: l/150 Hardness Shore D @ 75F: 88 Tg C: 141 Dielectric Constant 10 3 HZ, 75F: 3.1 Dissipation Factor 10 3 HZ, 75F: .006 Volume Resistivity lKV, 75F Ohms/cm: 1.9 x 10 16 Surface Resistivity 1 KV, 75F Ohms: 2.4 x 10 16 6524: Back filling optoelectronic devices. No polycarbonate attack. Low CI. Translucent. Excellent adhesion. Shelf Life Months 25C: 2 Color: Lt Tan Viscosity 25C: 4,000 Cure Cycle Hrs/C: l/l25 Hardness Shore D @ 75F: 82 Tg C: 107 Dielectric Constant 10 3 HZ, 75F: 4.3 Dissipation Factor 10 3 HZ, 75F: .012 Volume Resistivity 1 KV, 75F Ohms/cm: 4 x 10 15 Surface Resistivity lKV, 75F Ohms: 5.1 x IO 15
837
838
Adhesives, Sealants and Coatings for the Electronics Industry
HEXCEL CORP.: EPOLITE Brand Electrical Insulating Products (Continued): Heat Cure Epoxies - One Component (Continued): 6525: Back filling. PGA's, wire bonding and potting. Glob top. Excellent adhesion to metals, ceramics and most plastics. LOW CI. Shelf Life Months 25C: 6 Color: Black Viscositv 25C: 400,000 Cure Cycle Hrs/C: i/l50 Hardness Shore D @ 75F: OS Tg C: 145 Dielectric Constant 10 3 HZ, 75F: 4.0 Dissipation Factor 10 3 Hz, 75F: .006 Volume Resistivity IKV, 75F Ohms/cm: 1.5 x 10 16 Surface Resistivity IKV, 75F Ohms: 2.3 x 10 16 6534: Vacuum impregnating coils, capacitors, Low viscosity. Unfilled. Low exotherm. Shelf Life Months 25C: 2 Color: Black Viscosity 25C: 1,200 Cure Cycle Hrs/C: l/l25 Hardness Shore D @ 75F: 80 Tg C: 104 Dielectric Constant 10 3 HZ, 75F: 4.4 Dissipation Factor 10 3 HZ, 75F: .021 Volume Resistivity IKV, 75F Ohms/cm: 1 Surface Resistivity IKV, 75F Ohms: 2 x
etc. Potting solenoids. Semi-rigid.
x 10 15 10 15
6600: Vacuum impregnating/dipcoating transformers. Thixotropic. Low CTE. Thermally conductive. High heat resistance. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 650,000 Cure Cycle Hrs/C: l/175 Hardness Shore D @ 75F: 91 Tg C: 175 Dielectric Constant 10 3 HZ, 75F: 4.0 Dissipation Factor 10 3 HZ, 75F: .007 Volume Resistivity IKV, 75F Ohms/cm: 1 x 10 16 Surface Resistivity IKV, 75F Ohms: 2.2 x IO 16
Insulating Products
HEXCEL
CORP.:
EPOLITE
Brand
Electrical Insulating Products
(Continued): Heat Cure Epoxies - One Component
(Continued):
6602: Same as 6600 except flame retardant. Same as 6600. Meets UL 94 vo. Shelf Life Months 25C: 6 Color: Black Viscosity 25C: 500,000 Cure Cycle Hrs/C: 11175 Hardness Shore D @ 75F: 90 Tg C: 175 Dielectric Constant 10 3 HZ, 75F: 4.3 Dissipation Factor 10 3 HZ, 75F: -009 Volume Resistivity lKV, 75F Ohms/cm: 8 x 10 15 Surface Resistivity lKV, 75F Ohms: 1 x 10 16 Room Temperature Cure Epoxies - Two Component: 4002: General purpose potting requiring flame retardance. R.T. cure. Low water absorption. Meets UL 94HB. Long pot life. Low exotherm. Ratio PBW R:H: 100:5 Shelf Life Months 25C: 12 Color: Black Viscosity 25C: 7,000 Cure/Cycle Hrs/C: l/50 Hardness Shore D @ 75F: 88 Tg C: 75 Dielectric Constant 10 3 HZ, 75F: 5.4 Dissipation Factor 10 3 HZ, 75F: .016 Volume Resistivity lKV, 75F Ohms/cm: 2.9 x 10 15 Surface Resistivity IKV, 75F Ohms: 4.5 x 10 15 4003: Capacitor and vacuum impregnating. RT cure. Low viscosity. Low surface tension. Flame retardant - UL 94 vo & UL 1414. Ratio PBW R:H: 100:12 Shelf Life Months 25C: 12 Color: White Viscosity 25C: 3,300 Cure Cycle Hrs/C: 3/100 Hardness Shore D @ 75F: 90 Tg C: 99 Dielectric Constant 10 3 HZ, 75F: 4.5 Dissipation Factor 10 3 HZ, 75F: .008 Volume Resistivity lKV, 75F Ohms/cm: 2.3 x 10 15 Surface Resistivity IKV, 75F Ohms: 3.1 x IO 15
839
840
Adhesives, Sealants and Coatings for the Electronics Industry
HEXCEL CORP.: EPOLITE Brand Electrical Insulating Products (Continued): Room Temperature Cure Epoxies - Two Component(Continued1: 4005: General purpose potting. R.T. cure. Economical. Long pot life. Low CTE. Low water absorption. Ratio PBW R:H: 100:6 Shelf Life Months 25C: 12 Color: Black Viscositv 25C: 12,000 Cure Cycle Hrs/C:'5/60 Hardness Shore D @ 75F: 85 Tg C: 70 Dielectric Constant 10 3 HZ, 75F: 4.8 Dissipation Factor 10 3 HZ, 75F: .008 Volume Resistivity lKV, 75F Ohms/cm: 2.9 x 10 15 Surface Resistivity lKV, 75F Ohms: 4.5 x IO 15 4007: Heat cured potting compound. Vacuum impregnating coils. Low viscosity. Low CTE. Ratio PBW R:H: 1OO:ll Shelf Life Months 25C: 12 Color: Black Viscosity 25C: 3,500 Cure Cycle Hrs/C: 2/100 Hardness Shore D @ 75F: 89 Tg C: 98 Dielectric Constant 10 3 HZ, 75F: 4.7 Dissipation Factor 10 3 HZ,.75F: .008 Volume Resistivity IKV, 75F Ohms/cm: 2.9 x 10 15 Surface Resistivity lKV, 75F Ohms: 4.5 xl0 15 4011: Same as 4007 except more resilient. RT cure. Low viscosity. Excellent impact and shock resistance. Excel lent adhesion. Ratio PBW R:H: 100:37 Shelf Life Months 25C: 12 Color: Black Viscositv 25C: 4,000 Cure Cycie Hrs/Ci 2166 Hardness Shore D @ 75F: 70 Tg C: 63 Dielectric Constant 10 3 HZ, 75F: 4.9 Dissipation Factor 10 3 HZ, 75F: -012 Volume Resistivity IKV, 75F, Ohms/cm: 2 x 10 14 Surface Resistivity lKV, 75F Ohms: 3 x 10 14
Insulating Products
841
HEXCEL CORP.: EPOLITE Brand Electrical Insulating Products (Continued): Room Temperature Cure Epoxies - Two Component(Continued): 4021: Sealing dip relays, trimmers, etc., where flow control required. RT cure. Thixotrooic for flow control. Flame retardant. UL 94 VO. Ratio PBW R:H: 100:5 Shelf Life Months 25C: 12 Color: Black Viscosity 25C: 20,000 Cure Cycle Hrs/C: l/100 Hardness Shore D @ 75F: 85 Tg C: 96 Dielectric Constant 10 3 HZ, 75F: 4.6 Dissipation Factor 10 3 HZ, 75F: .007 Volume Resistivity lKV, 75F Ohms/cm: 2.9 x 10 15 Surface Resistivity lKV, 75F Ohms: 4.5 x 10 15 4025: Solenoid potting. Vacuum impregnating. Dip coating. RT cure. Verv low viscositv. Unfilled. Shock resistant. Low exotherm. 1:l ratio by volume.Ratio PBW R:H: 100:83 Shelf Life Months 25C: 12 Color: Black Viscosity 25C: 1,000 Cure Cycle Hrs/C: l/66 Hardness Shore D @ 75F: 70 Tg C: 64 Dielectric Constant 10 3 HZ, 75F: 5.2 Dissipation Factor 10 3 HZ, 75F: .023 Volume Resistivity lKV, 75F Ohms/cm: 2 x 10 14 Surface Resistivity IKV, 75F Ohms: 3 x 10 14 1425: Potting load coils. Vacuum impregnating. RT cure. Flexible. Very low viscosity. Excellent impact and shock resistance. Unfilled. Ratio PBW R:H: 1:l Shelf Life Months 25C: 12 Color: Black Viscosity 25C: 1,600 Cure Cycle Hrs/C: 2/77 Hardness Shore D @ 75F: 60 Tg C: 46 Dielectric Constant 10 3 HZ, 75F: 3.7 Dissipation Factor 10 3 HZ, 75F: .0063 Volume Resistivity lKV, 75F Ohms/cm: 1 x 10 15 Surface Resistivity lKV, 75F Ohms: 6.3 x 10 13
842
Adhesives, Sealants and Coatings for the Electronics Industry
THERMOSET PLASTICS, INC.: Electrical/Electronic Resins: Epoxy:
Insulating
Oven Curing: 300: No. 67 Hardener - Oven cure. Easy pouring system. Low coefficient of expansion. Thermally stable. Ratins Guide: 155C TemD. Viscosity @-25C: 8,000 cps Mix Ratio by Weight: 100:12 Working Life @ 25C: 90 min. Typical Cure: 2 hrs. @ 1OOC Black Specific Gravity @ 25C: 1.49 Thermal Shock Resistance: 15OC to -55C 24 Hrs. Water Absorption: 0.15% Weight Loss 168 Hrs. @ Temp.: 0.25% @ 155C Shore Hardness: D96 Izod Impact: 0.32 Tensile Strength & Elongation: 8,600 psi 4.0% Dielectric Constant 1 MHz @ 25C: 4.5 Dissipation Factor 1 MHz @ 25C: 0.040 Volume Resistivity ohm-cm: @ 25C: 3 x 10 16 @ 105c: 2 x 10 14 @ 13oc: 4 x 10 13
310: Semirigid, tough, heat cure. Very good shock resistance. Unfilled. Temp. Rating Guide: 155C Viscosity @ 25C: 2,700 cps Mix Ratio by Weight: I:1 Working Life @ 25C: 2-3 days Typical Cure: 2 hrs. @ 12OC Black Specific Gravity @ 25C: 1.07 Thermal Shock Resistance: 155C to -55C 24 Hrs. Water Absorption: 0.30% Weight Loss 168 Hrs. @ Temp.: 0.70% @ 155C Shore Hardness: D65 Izod Impact: 2.50 Tensile Strength & Elongation: 2,500 psi 82% Dielectric Constant 1 MHz @ 25C: 3.8 Dissipation Factor 1 MHz @ 25C: 0.018 Volume Resistivity: ohm-cm: @ 25C: 6 x 10 15 @ @
105c: 13oc:
4 x 5 x
10 10
11 10
Insulating Products
TAERMOSET PLASTICS, INC.: Electrical/Electronic Resins: Epoxy (Continued):
Insulating
Oven Curing(Continued): 311: Semirigid, heat cure, excellent shock resistance, filled version of 310. Temp. Rating Guide: 155C Viscosity @ 25C: 20,000 cps Mix Ratio by Weight: 1:1 Working Life @ 25C: 2-3 days Typical Cure: 2 hrs. @ 12OC Black Specific Gravity @ 2X: 1.41 Thermal Shock Resistance: 155C to -55C 24 Hrs. Water Absorption: 0.26% Weight Loss 168 Hrs. @ Temp.: 0.50% @ 155C Shore Hardness: D77 Izod Impact: 2.00 Tensile Strength & Elongation: 2,300 psi 65% Dielectric Constant 1 MHz @ 25C: 4.2 Dissipation Factor 1 MHz @ 25C: 0.017 Volume Resistivity ohm-cm: @ 25C: 8 x 10 15 @ 105c: 2 x 10 11 @
340: No.
13oc:
4 x
10
10
67 Hardener - Oven cure, high thermal conductivity, filled system with excellent electrical and mechanical properties. Temp. Rating Guide: 155C Viscosity @ 25C: 70,000 cps Mix Ratio by Weight: 100:6 Working Life @ 25C: l-2 hrs. Typical Cure: 2 hrs. @ IOOC Biack Specific Gravity @ 25C: 2.17 Thermal Shock Resistance: 155C to -55C 24 Hrs. Water Absorption: 0.08% Weight Loss 168 Hrs. @ Temp.: 0.37% @ 155C Shore Hardness: D95 Izod Impact: 0.25 Tensile Strength & Elongation: 7,300 psi 2.7% Dielectric Constant 1 MHz @ 25C: 4.4 Dissipation Factor 1 MHz @ 25C: 0.031 Volume Resistivity ohm-cm: @ 25C: 5 x 10 16 @ 105C: 6 x 10 14 @ 13oc: 2 x IO 11
843
844
Adhesives, Sealants and Coatings for the Electronics Industry
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Epoxy (Continued): Oven Curing(Continued): 350: Unfilled, semi-flexible, good thermal shock resistance. 2:3 mix ratio. Temp. Rating Guide: 155C Viscosity @ 25C: 4,000 cps Mix Ratio by Weight: 2:3 Working Life @ 25C: 2-3 days Typical Cure: 2 hrs. @ 120C Clear Specific Gravity @ 25C: 1.07 Thermal Shock Resistance: 155C to -55C 24 Hrs. Water Absorption: 0.48% Weight Loss 168 Hrs. @ Temp.: 1.10% @ 155C Shore Hardness: D65 Izod Impact: 2.35 Tensile Strength & Elongation: 2,000 psi 85% Dielectric Constant 1 MHz @ 25C: 3.9 _ Dissipation Factor 1MHz @ 25C: 0.019 Volume Resistivity ohm-cm: @ 25C: 8 x 10 15 @ 105c: 7 x 10 11 @
13oc:
3 x
10
10
351:
Filled version of 350. Improved thermal properties. 2:3 mix ratio. Ratinq Guide: 155C TemD. Viscosity @-25C: 45,000 cps Mix Ratio by Weight: 2:3 Working Life @ 25C: 2-3 days Typical Cure: 2 hrs. @ 12OC Cream Specific Gravity @ 25C: 1.41 Thermal Shock Resistance: 155C to -55C Water Absorption: 0.30% 24 Hrs. Weiqht Loss 168 Hrs. @ Temp.: 0.65% @ 155C Shore Hardness: D65 Izod Impact: 2.02 Tensile Strength & Elongation: 2,200 psi 45% Dielectric Constant 1 MHz @ 25C: 4.3 Dissipation Factor 1 MHz @ 25C: 0.028 Volume Resistivity ohm-cm: @ 25C: 2 x 10 15 @ 105c: 5 x 10 11 @
13oc:
2 x
10
10
InsulatingProducts
TAERMOSRT PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Epoxy (Continued): Oven Curing(Continued): DC-232: One part impregnating system. Long shelf life for a single component system. Temp. Rating Guide: 155C Viscosity @ 25C: 1,500 cps Mix Ratio by Weight: 1 part Working Life @ 25C: Shelf life 3 mos. Typical Cure: 2-3 hrs. @ 135C Amber Specific Gravity @ 25C: 1.07 Thermal Shock Resistance: 155C to -55C 24 Hrs. Water Absorption: 0.32% Weight Loss 168 Hrs. @ Temp.: 0.62% @ 15OC Shore Hardness: D80 Izod Impact: 0.41 Tensile Strength & Elongation: 6,850 psi 4.8% Dielectric Constant 1 MHz @ 25C: 3.0 Dissipation Factor 1 MHz @ 25C: 0.002 @ 1OOHz Volume Resistivity ohm-cm: @ 25C: 3 x 10 16 @ 105c: 1 x 10 12 @ 13oc: 5 x 10 11 EP-236: Underwriters Laboratries 94V-0 recognized for non-flammability. Suitable for vacuum impregnation. Temp. Rating Guide: 155C Viscosity @ 25C: 16,000 cps Mix Ratio by Weight: 1:l Working Life @ 25C: l-2 days Typical Cure: 3-6 hrs. @ 1OOC Cream Specific Gravity @ 25C: 1.60 Thermal Shock Resistance: 155C to -55C 24 Hrs. Water Absorption: 0.03% Weight Loss 168 Hrs. @ Temp.: 0.36% @ 155C Shore Hardness: D93 Izod Impact: 0.38 Tensile Strength & Elongation: 9,200 psi 3.6% Dielectric Constant 1 MHz @ 25C: 3.7 Dissipation Factor 1 MHz @ 25C: 0.010 Volume Resistivity ohm-cm: @ 25C: 4 x 10 15 @ 105c: 5 x 10 13 @ 13oc: 7 x 10 12
845
846
Adhesives, Sealants and Coatingsfor the Electronics Industry
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Epoxy (Continued): Room Temperature Curing: 300: No. 18 Hardener - Easy pouring system. Low coefficient of expansion. Thermally stable. TemD. Ratina Guide: 130C Viscosity @-25C: 12,000 cps Mix Ratio by Weight: 100:7 Working Life @ 25C: 25 min. Typical Cure: 24 hrs. @ 25C. Black Specific Gravity @ 25C: 1.55 Thermal Shock Resistance: 13OC to -55C 24 Hrs. Water Absorption: 0.15% Weight Loss 168 Hrs. @ Temp.: 0.42% 8 13OC Shore Hardness: D90 Izod Impact: 0.35 Tensile Strength & Elongation: 8,600 psi 2.4% Dielectric Constant 1 MHz @ 25C: 4.1 Dissipation Factor 1 MHz @ 25C: 0.022 Volume Resistivity ohm-cm: 8 25C: 2 x 10 16 8 105c: 2 x 10 13 8 13oc: 7 x 10 10 300: No. 65 Hardener--Low viscosity, high gloss. Moisture insensitive during cure. Temp Rating Guide: 105C Viscosity 8 25C: 7,000 cps Mix Ratio by Weight: 100:20 Working Life @ 25C: 60 min. Typical Cure: 24 hrs. 8 25C Black Specific Gravity @ 25C: 1.44 Thermal Shock Resistance: 105C to -55C 24 Hrs. Water Absorption: 0.12% Weight Loss 168 Hrs. @ Temp.: 0.67% 8 105C Shore Hardness: D90 Izod Impact: 0.40 Tensile Strength & Elongation: 7,500 psi 3.2% Dielectric Constant 1 MHz @ 25C: 4.0 Dissipation Factor 1 MHz 8 25C: 0.025 Volume Resistivity ohm-cm: @ 25C: 3 x 10 15 8 105c: 7 x 10 12 @ 13oc: 2 x 10 10
InsulatingProducts
TRERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Epoxy (Continued): Room Temperature Curing(Continued1: 340: No. 70 Hardener--High thermal conductivity. Highly filled svstem with verv low viscositv. -* Temp. Rating-Guide: 130C Viscosity @ 25C: 4,000 cps Mix Ratio bv Weight: 100:7 Working Life @ 25C: 100 min. Typical Cure: 24 hrs. @ 25C Biack Specific Gravity @ 25C: 2.17 Thermal Shock Resistance: 13OC to -55C 24 Hrs. Water Absorption: 0.17% Weight Loss 168 Hrs. @ Temp.: 0.66% @ 13OC Shore Hardness: D90 Izod Impact: 0.48 Tensile Strength & Elongation: 9,400 psi 4.1% Dielectric Constant 1 MHz @ 25C: 3.4 Dissipation Factor 1 MHz @ 25C: 0.034 Volume Resistivity ohm-cm: @ 25C: 6 x 10 15 @ 105c: 4 x 10 11 @ 13oc: 3 x 10 10 DC-805: No. 25 Hardener--Low cost, flexible, filled system. Temp Rating Guide: 95C Viscosity @ 25C: 5,500 cps Mix Ratio by Weight: 100:25 Working Life @ 25C: 20 min. Typical Cure: 24 hrs. 8 25C Black Specific Gravity @ 25C: 1.40 Thermal Shock Resistance: 105C to -55C 24 Hrs. Water Absorption: 0.18% Weight Loss 168 Hrs. @ Temp.: 0.16% @ 95C Shore Hardness: D30 Izod Impact: 0.58 Tensile Strength & Elongation: 2,800 psi 6.5% Dielectric Constant 1 MHz @ 25C: 3.6 Dissipation Factor 1 MHz @ 25C: 0.026 Volume Resistivity ohm-cm: 8 25C: 4 x 10 15
847
848
Adhesives,
Sealants
and Coatings for the Electronics
Industy
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Epoxy (Continued): Room Temperature Curing(Continued): 300: No. 70 Hardener--High impact strength, good thermal conductivity and thermal shock resistance. Temo. Ratins Guide: 13OC Viscosity @-25C: 2,000 cps Mix Ratio by Weight: 100:15 Working Life @ 25C: 35 min. Typical Cure: 24 hrs. @ 25C. Black Specific Gravity @ 25C: 1.50 Thermal Shock Resistance: 130C to -55C 24 Hrs. Water Absorption: 0.21% Weight Loss 168 Hrs. 8 Temp.: 0.67% 8 13OC Shore Hardness: D88 Izod Impact: 0.54 Tensile Strength & Elongation: 9,800 psi 4.4% Dielectric Constant 1 MHz 8 25C: 3.9 Dissipation Factor 1 MHz @ 25C: 0.032 Volume Resistivity ohm-cm: @ 25C: 7 x 10 15 8 105c: 2 x 10 11 @
13oc:
1 x
10
10
302: No.
18 Hardener--Low viscosity casting system. Low coeffi.cient of expansion. Thermally stable. Temo. Ratins Guide: 105C Viscosity @-25C: 3,500 cps Mix Ratio by Weight: 100:7 Working Life @ 25C: 30 min. Typical Cure: 24 hrs. @ 25C Black Specific Gravity @ 25C: 1.52 Thermal Shock Resistance: 13OC to -55C 24 Hrs. Water Absorption: 0.16% Weight Loss 168 Hrs. @ Temp.: 0.84% @ 130C Shore Hardness: D90 Izod Impact: 0.38 Tensile Strength & Elongation: 6,500 psi 3.0% Dielectric Constant 1 MHz 8 25C: 4.2 Dissipation Factor 1 MHz @ 25C: 0.024 Volume Resistivity ohm-cm: 8 25C: 3 x 10 15 @ @
105c: 13oc:
5 x 2 x
10 10
12 9
Insulating Products
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Epoxy (Continued): Room Temperature Curing (Continued): 321: Semirigid, room temperature cure. Low exotherm. Black version available as EP-22. Temp. Rating Guide: 130C Viscosity @ 25C: 3,000 cps Mix Ratio by Weight: I:1 Working Life @ 25C: 60 min. Typical Cure: 24 hrs. @ 25C Clear Suecific Gravity a 25C: 1.08 Thermal Shock Resistance: 130C to -55C 24 Hrs. Water Absorption: 0.85% Weight Loss 168 Hrs; 8 Temp.: 2.30% @ 130C Shore Hardness: D60 Izod Impact: 2.50 Tensile Strength & Elongation: 2,300 psi 55% Dielectric Constant 1 MHz @ 25C: 4.2 Dissipation Factor 1 MHz @ 25C: 0.021 Volume Resistivity ohm-cm: @ 25C: 1 x 10 14 @ 105c: 3 x 10 10 @ 13oc: 2 x IO 9 322:
Semirigid, room temperature cure. Low exotherm. Excellent shock resistance. Filled version of 321. Temp. Rating Guide: 130C Viscosity @ 25C: 11,000 cps Mix Ratio by Weight: 1:l Working Life 8 25C: 75 min. Typical Cure: 24 hrs. @ 25C Black Snecific Gravity 8 25C: 1.33 Thermal Shock Resistance: 130C to -55C 24 Hrs. Water Absorption: 0.47% Weight Loss 168 Hrs. @ Temp.: 1.10% @ 130C Shore Hardness: D65 Izod Impact: 1.80 Tensile Strength & Elongation: 2,020 psi 27% Dielectric Constant 1 MHz @ 25C: 4.5 Dissipation Factor 1 MHz @ 25C: 0.029 Volume Resis'civity ohm-cm: @ 25C: 1 x 10 14 @ 105c: 3 x 10 10 @ 13oc: 1 x 10 9
849
850
Adhesives, Sealants and Coatings for the Electronics Industry
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Epoxy (Continued): EP-356: Underwriters Laboratories 94V-0 recognized for non-flammability. THUD. Ratins Guide: 130C Viscosity @-25C: 14,000 cps Mix Ratio by Weight: 1OO:lO Working Life @ 25C: 60-90 min. Typical Cure: 24 hrs. @ 25C Dark Gray Specific Gravity @ 25C: 1.60 Thermal Shock Resistance: 130C to -55C 24 Hrs. Water Absorption: 0.14% Weight Loss 168 Hrs. @ Temp.: 0.62% @ 130C Shore Hardness: D90 Izod Impact: 0.35 Tensile Strength & Elongation: 4,700 psi 3.0% Dielectric Constant 1 MHz @ 25C: 4.2 Dissipation Factor 1 MHz @ 25C: 0.028 Volume Resistivity ohm-cm: @ 25C: 7 x 10 15 @ @
105c: 13oc:
7 x 2 x
10 10
10 9
EP-521: Low-cost, semirigid, 1:l mix ratio, nonabrasive filler. Temp. Rating Guide: 105C Viscosity @ 25C: 5,000 cps Mix Ratio by Weight: 100:90 Working Life @ 25C: 1.5-2 hrs. Typical Cure: 24 hrs. @ 25C Black Specific Gravity @ 25C: 1.52 Thermal Shock Resistance: 105C to -55C 24 Hrs. Water Absorption: 0.84% Weight Loss 168 Hrs. @ Temp.: 1.02% @ 105C Shore Hardness: D60 Izod Impact: 1.78 Tensile Strength & Elongation: 1,640 psi 39% Dielectric Constant 1 MHz @ 25C: 4.2 Dissipation Factor 1 MHz @ 25C: 0.029 Volume Resistivity ohm-cm: @ 25C: 8 x 10 13 @ 105c: 9 x 10 9
Insulating Products
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Polyurethane: Room Temperature Curing: UR-101: Tough potting system. Good abrasion resistance. Excellent low temnerature flexibility. Temp: Rating Guide: 13OC Viscosity @ 25C: 4,000 cps Mix Ratio by Weight: 100-25 Working Life @ 25C: 45 min. Typical Cure: Initial 24 hrs. @ 25C Black Specific Gravity @ 25C: 0.97 Thermal Shock Resistance: 130C to -55C 24 Hrs. Water Absorption: 0.12% Weight Loss 168 Hrs. @ Temp.: 0.42% @ 130C Shore Hardness: A60 Izod Impact: >32.0 Tensile Strength & Elongation: 770 psi 225% Dielectric Constant 1 MHz @ 25C: 2.9 Dissipation Factor 1 MHz @ 25C: 0.028 Volume Resistivity ohm-cm: @ 25C: 3 x 10 15 @ 105c: 2 x 10 13 @ 130C: 8 x 10 12 UR-105: Softer version of UR-101. Excellent low temperature flexibility. Repairable. Temp. Rating Guide: 130C Viscosity @ 25C: 1,500 cps Mix Ratio by Weight: 30 min. Typical Cure: Initial: 24 hrs. @ 25C Black Specific Gravity @ 25C: 0.94 Thermal Shock Resistance: 130C to -55C 24 Hrs. Water Absorption: 0.18% Weight Loss 168 Hrs. @ Temp.: 0.48% @ 130C Shore Hardness: A25 Izod Impact: >32.0 Tensile Strength & Elongation: 120 psi 130% Dielectric Constant 1 MHz @ 25C: 3.2 Dissipation Factor @ 25C: 0.029 Volume Resistivity ohm-cm: @ 25C: 3 x IO 16 @ 105c: 5 x 10 14 @ 130C: 6 x 10 13
851
852
Adhesives, Sealants and Coatings for the Electronics Industry
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Polyurethane (Continued): Room Temperature Curing (Continued): UR-124: One part, P.C. board coating. Tough, one mil build up. Fast tack-free time. Temp. Rating Guide: 105C Viscosity @ 25C: 100 cps Mix Ratio by Weight: 1 part Typical Cure: 2 hrs. 25C + 30% RH Clear Specific Gravity @ 25C: 1.03 Shore Hardness: H-HB (pencil) Tensile Strength & Elongation: 4,800 psi 110% Dielectric Constant 1 MHz @ 25C: 3.5 Dissipation Factor 1 MHz @ 25C: 0.014 Volume Resistivity ohm-cm: @ 25C: 2 x 10 13 UR-156: Flexible, very low viscosity, unfilled potting system. Clear version available. Temp. Rating Guide: 105C Viscosity @ 25C: 400 cps Mix Ratio by Weight: 100:42 Working Life @ 25C: 45 min. Typical Cure: Initial: 24 hrs. @ 25C Black Specific Gravity @ 25C: 1.03 Thermal Shock Resistance: 105C to -55C Shore Hardness: A60 Tensile Strensth & Elongation: 900 Dsi 65% Dielectric Constant 1 MHz @ 25C: 3.j Dissipation Factor 1 MHz @ 25C: 0.014 Volume Resistivity ohm-cm: @ 25C: 2 x 10 13 @ 105c: 1 x 10 9
Insulating Products
853
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Silicone: Room Temperature Curing: SC-1 02: Water-white clarity dielectric gel. Repairable. No surface tack. Temp. Rating Guide: 200C Viscosity @ 25C: 340 cps Mix Ratio by Weight: 1:l Working Life @ 25C: 30-40 min. Typical Initial Cure: 8-12 hrs. @ 25C Clear Specific Gravity @ 25C: 0.97 Volume Coefficient of Thermal Exnansion cc/cc/C: 1.44 x 10 -3 Shore Hardness: ~26 Dielectric Constant: 100 Hz: 2.98 100 KHz: 2.96 Dissipation Factor: 100 Hz: 0.0028 100 KHz: 0.0002 Volume Resistivity ohm-cm @ 25C: 2.5 x 10 15 SC-104: Thermally conductive, color coded. UL 94V-0 recognized for non-flammability. Temp. Rating Guide: 200C Viscositv a 25C: 7,000 CDS Mix Ratio by Weight: 1:l‘ Working Life @ 25C: 50 min. Typicai Initial Cure: 24 hrs. @ 25C Gray Specific Gravity @ 25C: 2.10 Thermal Conductivity: 20.4 x 10 -4 Shore Hardness: A67 Tensile Strength & Elongation: 480 psi 120% Dielectric Constant: 100 Hz: 3.10 100 KHz: 3.06 Dissipation Factor: 100 Hz: 0.0075 100 KHz: 0.0018 Volume Resistivity ohm-cm @ 25C: 2.2 x 10 15
854
Adhesives, Sealants and Coatings for the Electronics Industr),
TAERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Silicone (Continued): Room Temperature Curing(Continued): SC-113: One part protective sealer. May be brush, dip or spray applied. Excellent thick-section dip coat. Temp. Rating Guide: 200C Viscosity @ 25C: 35,000 cps Mix Ratio by Weight: 1 part Working Life @ 25C: Shelf life 6 months Typical Initial Cure: 24 hrs. @ 25C Gray Soecific Gravitv a 25C: 0.91 Shore Hardness:-A27 Average Build mils/dip: 40-50 Tensile Strength & Elongation: 340 psi 520% Dielectric Constant: 100 Hz: 2.84 100 KHz: 2.91 Dissipation Factor: 100 Hz: 0.0016 100 KHz: 0.0021 Volume Resistivity ohm-cm @ 25C: 1.6 x 10 15 SC-114: Low viscosity, filled, color coded. Repairable. UL 94V-0 recognized for non-flammability. Temp. Rating Guide: 200C Viscosity @ 25C: 2,500 cps Mix Ratio bv Weisht: 1:l Working Life @ 25C: 30-40 min. Typical Initial Cure: 8-12 hrs. @ 25C G;iy Specific Gravity @ 25C: 1.33 Volume Coefficient of Thermal Expansion cc/cc/C: 7.8 x 10 -4 (0 to IOOC) Thermal Conductivitv: 8.2 x IO -4 Shore Hardness: A48Tensile Strenqth & Elonqation: 500 psi 150% Dielectric Constant: 100 Hz: 3.12 100 KHz: 3.10 Dissipation Factor: 100 Hz: 0.0084 100 KHz: 0.0018 Volume Resistivity ohm-cm 8 25C: 1.2 x IO 15
Insulating Products
8.55
THERMOSET PLASTICS, INC.: THERMOSET Electrical/Electronic Insulating Resins: Silicone (Continued): Room Temperature Curing (Continued): SC-134: High tear strength, self-releasing. RTV moldmaking resin. Viscosity @ 25C: 80,000 cps Mix Ratio by Weight: 1OO:lO Working Life @ 25C: 2 hrs. Typical Initial Cure: 24-48 hrs. @ 25C Green Specific Gravity @ 25C: 1.28 Shore Hardness: A50 Tensile Strength & Elongation: 740 psi 180% SC-139: Soft, self-healing gel for delicate electronic circuits. Low ionic impurities. Temp. Rating Guide: 200C Viscosity @ 25C: 900 cps Mix Ratio by Weight: 1:l Working Life @ 25C: 20-40 min. Typical Initial Cure: 10 min. @ 8OC Color: Clear Specific Gravity @ 25C: 0.98 Volume Coefficient of Thermal Exwansion cc/cc/C: 1.44 x 10 -3 Shore Hardness: Gel Dielectric Constant: 100 Hz: 2.95 100 KHz: 2.95 Dissipation Factor: 100 Hz: 0.0026 100 KHz: 0.0002 Volume Resistivity ohm-cm @ 25C: 2.3 x 10 15 SC-148: Clear, high tear strength encapsulant. Temp. Rating Guide: 200C Viscosity @ 25C: 50,000 cps Mix Ratio bv Weisht: 1OO:lO Working Life @ 25C: 60 min. Typical Initial Cure: 24 hrs. @ 25C ciear Specific Gravity @ 25C: 1.00 Volume Coefficient of Thermal Expansion cc/cc/C: 0.9 x 10 -3 Shore Hardness: A22 Tensile Strength & Elongation: 690 psi 430% Dielectric Constant: 100 Hz: 2.98 100 KHz: 2.98 Dissipation Factor: 100 Hz: 0.0015 100 KHz: 0.0002 Volume Resistivity ohm-cm @ 25C: 2.7 x 10 15
Section X Silicones
856
Silicones
DUCEY CHEMICAL, INC.: 2-Part Silicone RTVs (Room Temperature Silicone Rubbers): DUSIL RTV-141: Transparent 1O:l ratio, heat-accelerated or encapsulating.
curing for potting
DUSIL RTV-189: Self-priming, flame retardant for general potting encapsulating: Diodes, rectifiers, transistors, etc. DUSIL RTV-601: Low-temperature
potting applications
(-175F to +400F).
DUSIL RTV-811: Potting and encapsulating electrical coils and connectors, for making cast in place gaskets and molds. Available in black or white. DUSIL RTV-821: Higher viscosity version of RTV-811. Color-pink. DUSIL RTV-828: Low cost, black. 1:l ratio potting and/or encapsulating. DUSIL RTV-832 (red): High temperature potting applications
(+SOOF).
DUSIL RTV-919: Soft, low modulus, clear gel, 1:l ratio; can be heat accelerated to cure more quickly. DUSIL RTV-XECI: 1O:l ratio for prototype mold making.
857
858
Adhesives, Sealants and Coatings for the Electronics Industy
GE SILICONES: Semiconductor Packaging Materials: GE Silicones offers a broad range of semiconductor packaging materials designed to optimize the performance capability of discrete components, integrated circuits, and hybrid assemblies. These silicone-based semiconductor materials are manufactured to ensure low-ionic content levels for outstanding reliability even under harsh operating conditions. Silicones preserve dielectric integrity over a wide range of temperatures and frequencies. In addition, these unique materials offer: * Thermal stress relief properties * Alpha particle protection * Excellent moisture resistance * Solventless formulations * Outstanding compatibility with silicon substrates Junction Coatings: GE Silicones junction coatings are soft, elestomeric materials designed to preserve the dielectric integrity of semiconductor P/N junctions and bond sites. These materials protect against the negative effects of moisture and mechanical stress, and are capable of operating at continuous temperatures ranging from -05C to 200C. Gels: High-purity silicone gels combine the stress-relief and self-healing characteristics of a liquid, with the non-flowing and dimensional stability of an elastomer. The soft nature of these materials achieves a cushioning effect for sensitive electronic assemblies from external vibration and mechanical shock. This "semi-solid" characteristic is not significantly affected by either high or low temperature extremes. Adhesives: GE Silicones heat-curing adhesives provide strong, elastomeric bonds to many different types of substrtates. Their capability of surviving temperature extremes means reliable use under severe operating conditions, while low-modulus characteristics allow the absorption of Coefficient of Thermal Expansion (CTE) related energy. Molding Compounds: MC550 silicone moldinc comoounds are resin-based materials designed for encapsulation of-semiconductor devices. With thermal stability even at continuous exposure to 275F, these GE materials are also widely used in electro-mechanical applications where both electrical and physical integrity is needed.
Silicones
GE SILICONES: Semiconductor Packaging Materials
8.59
(Continued):
Key Performance Properties: Junction Coatings: EJc301: A low-viscosity, one-component, transparent elastomeric coating which heat cures to a medium firmness. Used extensively on discrete semiconductors and hybrid circuits. Also wellsuited for optoelectronic applications. EJC261: Very similar to EJC301 coating, but a two-component product which allows for room temperature curing or accelerated curing with the addition of heat. EJC3151: A low-viscosity, one-component, white elastomeric coating which heat cures to a very soft durometer (Shore A IO). Used on discrete semiconductors, hybrids, and integrated circuits where an opaque coating is required. EJC3138: A low-viscosity, two-component black elastomeric coating which cures to a medium firmness. Processing may be done at room temperature or may be accelerated with the addition of heat. Used on discrete semiconductors and hybrids where an opaque coating is required. EJc3101: A low-viscosity, two-component, white elastomeric coating which cures to a light firmness. EJC3101 coating cures at room temperature and may not be accelerated with heat. Because it is not subject to cure inhibition, this material is used in applications where cure inhibition problems caused by other materials are encountered. EJC5844: A low-viscosity, two-component, transparent elastomeric coating which cures to a very soft durometer (Shore A 12). It possesses refractive index of 1.507 and is used extensively in optoelectronic applications. EJC5128: Very similar to EJC5844 coating, but offers a higher refractive index value of 1.520 and is slightly softer (Shore AIO). EUV303: A one-component, low viscosity, translucent elastomeric coating which is cured to a light firmness by using ultraviolet radiation.
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Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: Semiconductor Packaging Materials Key Performance Properties
(Continued):
(Continued):
Gels: EJG185: A one-component, heat-curing, translucent product which cures to an extremely soft elastomeric material. Used extensively in integrated circuit and hybrid applications as an encapsulant in pre-molded chip carriers and as a coating/ passivant on TAB and COB designs. EJG3186: Very similar to EJG185 gel, except that this material offers extended low-temperature performance down to -65C. EJG3175: A high-viscosity, two-component, black product which cures at room temperature or with heat to an extremely soft gel. Used extensively as a globtop material for stress-sensitive devices requring an opaque passivation. Adhesives: RTV6424: An extremely-high-viscosity, one-component, white paste adhesive which cures to a soft durometer with the addition of heat. Offers excellent primerless adhesion to a wide range of materials, including many engineered thermoplastics. Used for die-attach applications and for other assembly and sealing operations on hybrids. TSE322: Verv similar to RTV6424 adhesive, but with a flowable viscosity and blue color. TSE322B: Identical to TSE322 adhesive, except black instead of blue in color. Molding Compounds: MC550: A rigid silicone-based thermosetting compound designed for packaging of discrete semiconductors and integrated circuits. Can be either injection or transfer molded over a broad range of process conditions. Outstanding performance in high-temperature applications up to 300C. Available in black or white/ gray.
Silicones
GE SILICONES: Semiconductor Packaging Materials
(Continued):
Junction Coatings: RJC 301: Appearance: Transparent Viscosity, CPS (25C): 4000 Storage Conditions (mths/C): 615 Curing Method Conditions (C/hrs): heat 150/l Specific Gravity: 1.02 Hardness (Shore A): 25 Linear Exoansion (in/cl: 2.5 x 10 -4 Thermal Conductivity: 4.1 x 10 -4 (0.17) Volume Resistivity (ohm-cm): 1 x 10 15 Dielectric Strength (kV/mm): 20 Dielectric Constant (60 Hz): 2.8 Dielectric Loss (60 Hz): -0004 Refractive Index: 1.405 Na+K+ (ppm): t2 Useful Temp Range (Cl: -65 to +200 SJc3151: Appearance: White Viscosity, CPS (25Cl: 2300 Storage Conditions (mths/C): 3/5 Curing Method Conditions (C/hrs): Heat 15014 Specific Gravity: 1.00 Hardness (Shore A): 10 Linear Expansion (in/C): 2.3 x 10 -4 Thermal Conductivity: 4.3 x 10 -4 (0.18) Volume Resistivity (ohm-cm): 1 x 10 15 Dielectric Strensth (kV/mml: 20 Dielectric Constant i6O.Hzj: 2.8 Dielectric Loss (60 Hz): -0004 Na+K+ (ppm): (2 Useful Temp Range (C): -65 to +200 HJC261: Appearance: Transparent Viscosity, cps (25C): 4000 Mix Ratio (base to curing agent by weight): IO:1 Pot Life, hours (25C): 8 hrs Storage Conditions (mths/C): 6/25 Curing Method Conditions (C/hrs): Heat/RT 150/l Specific Gravity: 1.02 Hardness (Shore A): 25 Linear Expansion (in/C): 2.5 x 10 -4 Thermal Conductivity: 4.1 x IO -4 Volume Resistivity (ohm-cm): 1 x 10 15 Dielectric Strength (kV/mm): 20 Dielectric Constant (60 Hz): 2.8 Dielectric Loss (60 Hz): -0004 Refractive Index: 1.405 Na+K+ (ppm): <2 Useful Temp Range (C): -65 to +200
25/24
861
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Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES:
Semiconductor Packaging Materials
(Continued):
Junction Coatings (Continued): EJC3138: Appearance: Black Viscosity, cps (2X): 3000 Mix Ratio (base to curins acent bv weiahtl: I:1 Pot Life, hours (25C): 48 hrs _ _ Storage Conditions (mths/C): 6125 Curinc Method Conditions (C/hrs): Heat 15014 Specific Gravity: 1.02 Hardness (Shore A): 25 Linear Expansion (in/C): 2.3 x 10 -4 Thermal Conductivity: 4.3 x 10 -4 (0.18) Volume Resistivity (ohm-cm): 1 x 10 15 Dielectric Strength (kV/mm): 20 Dielectric Constant (60 Hz): 2.8 Dielectric Loss (60 Hz): -0004 Na+K+ (ppm): (2 Useful Temp Range (C): -65 to +200
25196
EJC3101: Appearance: White Viscosity, cps (25C): 4000 Mix Ratio (base to curing agent by weight): 500:1 Pot Life, hours (25C): 3 hrs Storage Conditions (mths/C): 6/25 Curing Method Conditions (C/hrs): RT 251168 Specific Gravity: 1.14 Hardness (Shore Al: 18 Linear Expansion iin/C): 2.0 x 10 -4 Thermal Conductivity: 5.5 x 10 -4 (0.23) Volume Resistivity (ohm-cm): 2 x 10 15 Dielectric Strength (kV/mm): 22 Dielectric Constant (60 Hz): 3.2 Dielectric Loss (60 Hz): .0006 Na+K+ (ppm): (2 Useful Temp Range (C): -65 to +200 EJC5844: Appearance: Transparent Viscosity, cps (25C): 2000 Mix Ratio (base to curing agent by weight): 1:l Pot Life, hours (25C): 8 hrs Storage Conditions (mths/C): 6/25 Curing Method Conditions (C/hrsl: Heat/RT 1501.5 Specific Gravity: 1.07 Hardness (Shore A): 12 Elongation (% minimum): >I00 Tensile Strength: 29 (2) Refractive Index: 1.507 Na+K+ (ppm): <2 Useful Temp Range (C): -125 to +235
Silicones
GE SILICONES: Semiconductor Packaging Materials Junction Coatings
(Continued):
(Continued):
EJC5128: Appearance: Transparent Viscosity, cps (25C): 5000 Mix Ratio (base to curing agent by weight): 1:l Pot Life. hours (25C): 8 hrs Storage Conditions (mths/C): 6/25 Curinq Method Conditions (C/hrs): heat/RT 150/.5 Soecific Gravitv: 1.03 Hardness (Shore-A): 10 Elongation (% minimum): ,100 Tensile Strength: 15 (1) Refractive Index: 1.520 Na+K+ (ppm): t2 Useful Temp Range (C): -125 to +235 EUV303: Aooearance: Translucent Viscosity, cps (25C): 4000 Storage Conditions (mths/C): 3/5 Curing Method Conditions (C/hrs): UV Specific Gravity: 0.99 Hardness (Shore A): 17 Volume Resistivity (ohm-cm): 4 x 10 15 Dielectric Strength (kV/mm): 25 Dielectric Constant (60 Hz): 3.2 Dielectric Loss (60 Hz): .OOOl Na+K+ (ppm): (2 Useful Temp Range (C): -125 to +235
863
864
Adhesives, Sealants and Coatings for the Electronics Industry
GE SILICONES: Semiconductor Packaging Materials
(Continued):
Gels: EJG185: Appearance: Translucent Viscosity, cps (25C): 5000 Storage Conditions (mths/C): 315 Curing Method Conduitions (C/hrs): Heat Specific Gravity: 1.01 Hardness (Shore A): Gel Linear Expansion (in/C): 1 x 10 -3 Thermal Conductivity: 4.3 x 10 -4 (0.18) Volume Resistivity (ohm-cm): 1 x 10 15 Dielectric Strength (kV/mm): 15 Dielectric Constant (60 Hz): 2.8 Refractive Index: 1.405 Na+K+ (ppm): <2 Useful Temp Range (C): -40 to +200 BJG3186: Appearance: Translucent Viscosity, cps (25C): 4000 Storage Conditions (mths/C): 3/5 Curing Method Conditions (C/hrs): Heat Specific Gravity: 1.05 Hardness (Shore A): Gel Linear Expansion (in/C): 1 x 10 -3 Thermal Conductivity: 4.3 x 10 -4 (0.18) Volume Resistivity (ohm-cm): 1 x 10 15 Dielectric Strength (kV/mm): 15 Dielectric Constant (60 Hz): 2.8 Dielectric Loss (60 Hz): -0004 Refractive Index: 1.405 Na+K+ (ppm): (2 Useful Temp Range (C): -65 to +200
150/4
150/6
EJG3175: Appearance: Black Viscositv. CDS f25C): 17000 Mix Ratio.(base‘to curing agent by weight): 1:l Curinq Method Conditions (C/hrs): Heat/RT 12512 Specific Gravity: 1.00 Hardness (Shore A): Gel Linear Expansion (in/C): 1 x 10 -3 Thermal Conductivitv: 4.3 x 10 -4 (0.18) Volume Resistivity iohm-cm): 1 x 18 15 Dielectric Strength (kV/mm): 15 Dielectric Constant (60 Hz): .0004 Na+K+ (ppm): (2 Useful Temp Range (C): -65 to +200
25124
Silicones
GE SILICONES: Semiconductor Packaging Materials
(Continued):
Adhesives: TSE322: Annearance: Blue Viscosity, cps (25C): 110,000 Storage Conditions (mths/C): 615 Curing Method Conditions (C/hrs): Heat Specific Gravity: 1.27 Hardness (Shore A): 45 Elongation (% minimum): 230 Tensile Strength: 500 (35) Linear Expansion (in/C): 1.9 x 10 -4 Thermal Conductivity: 6.9 x 10 -4 (0.29) Volume Resistivitv (ohm-cm): 2 x 10 15 Dielectric Strength‘(kV/mm): 20 Dielectric Constant (60 Hz): 3.1 Dielectric Loss (60 Hz): -006 Na+K+ (ppm): (20 Useful Temp Range (C): -65 to +200 TSE 322B: Appearance: Black Viscosity, cps (25C): 110,000 Storage Conditions (mths/C): 615 Curing Method Conditions (C/hrs): Heat Specific Gravity: 1.27 Hardness (Shore A): 45 Elonsation (% minimum): 230 Tensile Strength: 500 (35) Linear Expansion (in/C): 1.9 x 10 -4 Thermal Cbnductivity: 6.9 x 10 -4 (0.29) Volume Resistivity (ohm-cm): 2 x 10 15 Dielectric Strength (kV/mm): 20 Dielectric Constant (60 Hz): 3.1 Dielectric Loss (60 Hz): .006 Na+K+ (ppm): (20 Useful Temp Range (C): -65 to +200 RTV6424: Appearance: White Viscosity, cps (25C): 880,000 Storage Conditions (C/hrs): 6125 Curing Method Conditions (C/hrs): Heat Specific Gravity: 1.17 Hardness (Shore A): 25 Eloncation (% minimum): 400 Tensile Strength: 500.(35) Linear Expansion (in/C): 1.9 x 10 -4 Thermal Cbnductivity: 6.9 x 10 -4 (0.29) Volume Resistivity (ohm-cm): 1 x 10 15 Dielectric Strength (kV/mm): 20 Dielectric Constant (60 Hz): 2.8 Dielectric Loss (60 Hz): -002 Na+K+ (ppm): <20 Useful Temp Range (C): -65 to +200
150/l
150/l
150/l
865
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Adhesives, Sealants and Coatingsfor the Electronics Industry
GE SILICONES: Semiconductor Packaging Materials
(Continued):
Typical Properties: MC550 Molding Compounds: Form: Powder or Preforms Storage Stability (months/C): 614 Processing Properties: Spiral Flow (inches): 29-45 Flow Duration (seconds): 17-35 Molding Temperatures (C): 177-193 Transfer Pressures (psi): 300-1000 Cure Time (seconds): 50-90 Mold Shrinkage (inch/inch): .004 Post-Baked Properties (2 hrs. @ 177C): Appearance: Black or White/Gray Specific Gravity: 1.08 Coefficient of Thermal Expansion (in/in/C): 2.0 x 10 -6 Flexural Modulus (psi x 10 6): 1.6 Flexural Strength (psi): 13,000 Heat Distortion Temperature (C): 265 Thermal Conductivity (cal/sec-C-cm): 1.0 x 10 -3 Moisture Absorption (pressure cooker, 4 hrs @ 15 psi): 0.2% Volume Resistivity (ohm-cm): 4.7 x 10 16 Dielectric Strength (V/mil, 75 mil): 425 Dielectric Constant: 3.94 @ 10 5 Hz Dissipation Factor: 0.0011 @ 10 5 Hz Flammability - 02 Index, TDLOI: 100 - uL94: v-o
Silicones
867
GE SILICONES: Solventless Silicone Dielectric Gels: RTV 6156, RTV 6166, RTV 6186, RTV 6196: Dielectric gels are low viscosity liquid silicones which cure to form very soft, gel-like elastomers. They are specifically designed to preserve dielectric integrity and provide outstanding protection for delicate electronic circuit assembies operating in harsh environments. These clear, solventless, two-component materials are supplied with curing agent in matched kits which are designed for use at a convenient 1:l ratio by weight. When cured, silicone gels possess unique physical properties, combining the self-healing characteristics of a liquid with the non-flowing, dimensional stability of an elastomer. The soft consistency and cushioning benefits of these materials can provide excellent protection of electronic assemblies from external vibration and mechanical shock. These critical properties are not significantly affected by either high or low temperature extremes, including extended aging at very high 400F (204C) temperatures. This property makes silicone gels one of the most effective means of managing thermal-stress-related failures in hybrids and other circuitry utilizing surface-mounted devices (SMD'S) and other stresssensitive conponents. Key Performance Properties: * Primerless adhesion to many substrates * Extended high/low-temperature performance * Mechanical shock/vibration dampening * Outstanding stress-relief properties * Excellent moisture protection properties * Low viscosity for complete coverage * Accelerated heat-cure capability * Low shrinkage, non-exothermic cure * Optical clarity allows visual inspections * Excellent dielectric properties * Low toxicity, solventless composition RTV 6156: High-performance methyl-phenyl silicone gel offers extended low-temperature performance, down to -175F (-115C). RTV 6166: General purpose silicone gel. RTV 6186: "High-strength," tough silicone gel offers much greater tear resistance than conventional gels. Also offers extended roomtemperature pot-life (8 hours minimum) for effective use on non-automated production lines. RTV 6196: Extremely fast curing silicone gel offers complete cure at room temperature in under two hours. Requires automated mixing equipment.
868
Adhesives,
Sealants
and Coatings for the Electronics
Zndumy
GE SILICONES: Gels (Continued): RTV 6156: Low Temp Tvoical Prooerties: -*Color: Ciear Cure Conditions: RT/Heat Mix Ratio (Base to Curing Agent, by Weight): 1:l Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 750 Soecific Gravitv: 0.98 Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 2.8 Dissipation Factor (1000 Hz): 0.001 Useful Temperature Range, F (C): -175 to 455 (-115 to 235) RTV 6166: General Purpose Typical Properties: Color: Clear Cure Conditions: RT/Heat Mix Ratio (Base to Curing Agent, by Weight): 1:l Silicone Content, %: 100 Viscosity, cps (8 25C, 77F): 750 Specific Gravity: 0.98 Dielectric Strength, volts/mil ((kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 2.8 Dissipation Factor (1000 Hz): 0.001 Useful Temperature Range, F (C): -58 to 40 (-50 to 204) RTV 6186: High Strength Typical Properties: Color: Clear Cure Conditions: Heat Mix Ratio (Base to Curing Agent, by Weight): 1:l Silicone Content, %: 100. _ Viscosity, cps (8 25C, 77F): 750 Specific Gravity: 0.97 Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 2.8 Dissipation Factor (1000 Hz): 0.001 Useful Temperature Range, F (C): -58 to 400 (-50 to 204) RTV 6196: Fast Cure Typical Properties: Color: Clear Cure Conditions: RT/Heat Mix Ratio (Base to Curing Agent, by Weight): 1:l Silicone Content, %: 100 Viscosity, cps (6 25C, 77F): 750 Specific Gravity: 0.97 Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 2.8 Dissipation Factor (1000 Hz): 0.001 Useful Temperature Range, F (C!): -58 to 400 (-50 to 204)
Silicones
GENERAL ELECTRIC CO.: Condensation Cure RTV Silicone Rubber Products: General Purpose Products: RTV
11:
White Easilv oourable oroduct for general purpose electrical potting. -Has also been used to cast rubber release rolls. May be colored by the addition of pigments. Typical Physical Properties: Viscosity, cps: 12,000 Specific Gravity: 1.18 Hardness, Shore A Durometer: 45 Tensile Strength, kg/cm 2 (psi): 25(350) Elongation, %: 150 Typical Thermal Properties: Tear Resistance, kg/cm(lb/in): 3.5(20) Useful Temperature Range C(F): -54 to 204 (-65 to 400) Linear Shrinkage, %: 0.6 Thermal Conductivity (gm cal/sec, cm 2, C/cm)(Btu-ft/hr, ft 2, F): 0.00070(0.17) Coefficient of Thermal Expansion, cm/cm/C(in/in, F): 25 X 10 -5(14 X 10 -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volt.s/mil): 19.7(500) Dielectric Constant @ IOOHz: 3.4 Dissipation Factor @ 100Hz: 0.02 Volume Resistivity, ohm-cm: 9 x 10 14 RTV 21: Pink Pourable product used as thermal insulation in aerosoace applications and as pour-in-place gasket for appliances: Typical Physical Properties: Viscosity, cps: 30,000 Soecific Gravitv: 1.31 Hardness, Shore-A Durometer: 45 Tensile Strength, kg/cm 2 (psi): 28(400) Elongation, %: 180 Typical Thermal Properties: Tear Resistance, kq/cm(lb/in): 4.5(25) Useful Temperature-Range C(F): -54 to 204(-65 to 400) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm/C(in/in, F): 20 x 10 -5 (II x IO -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7(500) Dielectric Constant @ 100 Hz: 3.4 Dissipation Factor @ IOOHz: 0.02 Volume Resistivity, ohm-cm: 9 x 10 14
869
870
Adhesives, Sealants and Coatings for the Electronics Industry
GENERAL ELECTRIC CO.: Condensation Cure RTV Silicone Rubber Products(Continued): General Purpose Products(Continued): RTV 41: White Pourable product used as a release coating on various substrates, metal panels, fabrics, and also to cast rubber release rolls. May be colored by the addition of pigments. Typical Physical Properties: Viscosity, cps: 40,000 Specific Gravity: 1.31 Hardness, Shore A Durometer: 45 Tensile Strength, kg/cm 2 (psi): 25(350) Elongation, %: 150 Typical Thermal Properties: Tear Resistance, kg/cm (lb/in): 4.5(25) Useful Temperature Range, C(F): -54 to 204(-65 to 400) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 20 x 10 -5 (11 x 10 -5) Tvoical Electrical Prooerties: --Dielectric Strength; kv/mm (volts/mil): Dielectric Constant @ 100 Hz: 3.4 Dissipation Factor @ 100 Hz: 0.02 Volume Resistivity, ohm-cm: 9 x 10 14 High Temperature Products: RTV 31: Red . Pourable product used for electrical potting and mechanical applications where use temperature is in the 260C (50F) range and low viscosity is required for processing ease. Typical Physical Properties: Viscosity, cps: 20,000 Specific Gravity: 1.42 Hardness, Shore A Durometer: 55 Tensile Strength, kg/cm 2 (psi): 35(500) Elongation, %: 100 Typical Thermal Properties: Tear Resistance, kg/cm (lb/in): 5(30) Useful Temperature Range, C(F): -54 to 260 (-65 to 500) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (BTU-ft/hr, ft 2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 20 x 10 -5 (11 x 10-5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7(500) Dielectric Constant @ 100Hz: 3.6 Dissipation Factor @ 100Hz: 0.02 Volume Resistivity, ohm-cm: 1 x 10 14
Silicones
871
GENERAL ELECTRIC CO.: Condensation Cure RTV Silicone Rubber Products(Continued): High Temperature Products(Continued): RTV 60: Red Pourable product used widely for high temperature 260C(SOOF) range mechanical and electrical requirements especially in the aerospace industry. Typical Physical Properties: Viscosity, cps: 40,000 Specific Gravity: 1.47 Hardness, Shore A Durometer: 55 Tensile Strength, kg/cm 2 (psi): 53(750) Elongation, %: 120 Typical Thermal Properties: Tear Resistance, kg/cm (lb/in): 7(40) Useful Temperature Range, C(F): -54 to 260(-65 to 500) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (18) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 20 x 10 -5 (11 x IO -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7(500) Dielectric Constant @ IOOHz: 3.7 Dissipation Factor @ IOOHz: 0.02 Volume Resistivity, ohm-cm: 1 x 10 14 RTV 88: Red Paste-like product used as an aerospace sealant and gasket for high temperatures in the 260C (500F) range. May also be used as a sealant on vertical surfaces. Typical Physical Properties: Viscosity, cps: 700,000 Specific Gravity: 1.48 Hardness, Shore A Durometer: 55 Tensile Strength, kg/cm 2 (psi): 60(850) Elonaation. %: 110 Typical Thermal Properties: Tear Resistance, kg/cm (lb/in): 7(40) Useful Temperature Range, C(F): -54 to 260 (-65 to 500) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (0.1s) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 20 x 10 -5 (II x IO -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7 (500) Dielectric Constant @ IOOHz: 3.7 Dissipation Factor @ IOOHz: 0.02 Volume Resistivity, ohm-cm: 1 x 10 14
872
Adhesives, Sealants and Coatings for the Electronics Industry
GENERAL ELECTRIC CO.: Condensation Cure RTV Silicone Rubber Products(Continued): Special Purpose Products: RTV 511: White Easily pourable methyl-phenyl product for extreme low temperature -115C (-175F) range potting applications. Because elastomeric properties are retained at very low temperatures, has been used primarily for potting airborne electronic assemblies. Also useful as thermal insulation for ablative applications. Typical Physical Properties: Viscosity, cps: 15,000 Saecific Gravitv: 1.20 Hardness, Shore-A Durometer: 40 Tensile Strength, kg/cm 2 (psi): 25(350) Elongation, %: 150 Typical Thermal Properties: Tear Resistance, kq/cm (lb/in): 3.5(20) Useful Temoerature-Range C (F): -115 to 204 (-175 to 400) Linear Shrinkage, %: 016 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00062 (0.15) Coefficient of Thermal Expansion, cm/cm, C (in/in, F): 22 x 10 5 (12 x 10 -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7(500) Dielectric Constant @ 100Hz: 4.1 Dissipation Factor @ 100Hz: 0.02 Volume Resistivity, ohm-cm: 2 x 10 14 RTV 560: Red Pourable methyl-phenyl product for extreme low temperatures -115C(-175F) and high temperature 260C (SOOF) range applications. Primarily used as aerospace material for mechanical applications and as thermal insulation ablative material. Typical Physical Properties: Viscosity, cps: 30,000 Specific Gravity: 1.40 Hardness, Shore A Durometer: 55 Tensile Strength, kg/cm 2 (psi): 46(650) Elongation, %: 120 TVDiCal Thermal Prooerties: __ Tear Resistance,-kg/cm(lb/in): 3.5(20) Useful Temperature Range, C(F): -115 to 260(-175 to 500) Linear Shrinkage, %: 0;6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 20 x 10 -5 (11 x 10 -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mill: 19.7(5001 Dielectric Constant @ 100Hz: 4.4 Dissipation Factor 8 100Hz: 0.02 Volume Resistivity, ohm-cm: 2 x 10 14
Silicones
873
GENERAL ELECTRIC CO.: Condensation Cure RTV Silicone Rubber Products(Continued): RTV 577: White Paste-like methyl-phenyl product for extreme low temperature -115C (-175F) range applications. Primarily used as aerospace sealant and as thermal insulation ablative material. Typical Physical Properties: Viscosity, cps: 700,000 Specific Gravity: 1.35 Hardness, Shore A Durometer: 50 Tensile Strength, g/cm 2 (psi): 32(450) Elongation, %: 150 Tvoical Thermal Prooerties: --Tear Resistance,*kg/cm (lb/in): 4.5(25) Useful Temperature Range, C(F): -115 to 204 (-175 to 400) Linear Shrinkage, %: 0;6 Thermal Conductivity, gm/cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm, C (in/in, F): 20 x 10 -5 (11 x 10 -5) Typical Electrical Properties: Dielectric Strenqth, kv/mm (volts/mil): 19.7(500) Dielectric Constant @ 100Hz: 4.1 Dissipation Factor @ 100Hz: 0.02 Volume Resisivity, ohm-cm: 2 x 10 14 RTV 8111: White Easily pourable, fast-cure product that meets MIL S-23506D Type I, Class 1, Grade B requirements. Used for aerospace and military potting applications. Typical Physical Properties: Viscosity, cps: 12,000 Specific Gravity: 1.18 Hardness, Shore A Durometer: 45 Tensile Strength, kg/cm 2 (psi): 25(350) Elongation, %: 150 Typical Thermal Properties: Tear Resistance, kg/cm (lb/in): 3.5(20) Useful Temperature Range, C(F): -54 to 204 (-65 to 400) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00070 (0.17) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7 (500 Dielectric Constant @ 100Hz: 3.4 Dissipation Factor @ 100Hz: 0.02 Volume Resistivity, ohm-cm: 9 x 10 14
874
Adhesives, Sealants and Coatings for the Electronics Industy
GENERAL ELECTRIC CO.: Condensation Cure RTV Silicone Rubber Products(Continued): RTV 8112: White Easily pourable, medium cure product that meets MIL-S-23586D Class 2. Grade A reauirements. Used for aerosoace and TVDf2 I. military potting applications where longer working time is needed than available with RTV 8111. Typical Physical Properties: Viscosity, cps: 12,000 Specific Gravity: 1.18 Hardness, Shore A Durometer: 45 Tensile Strength, kg/cm 2 (psi): 25(350) Elongation, %: 150 Typical Thermal Properties: Tear Resistance, kg/cm (lb/in): 3.5(20) Useful Temperature Range, C(F): -54 to 204 (-65 to 400) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr. ft 2, F): 0.00070 (0.17) Coefficient of Thermal Expansion, cm/cm, C (in/in, F): 25 x 10 -5 (14 x 10 -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7 (500) Dielectric Constant @ 100Hz: 3.4 Dissipation Factor @ 100Hz: 0.02 Volume Resistivity, ohm-cm: 9 x 10 14 RTV 8262: Red Pourable. medium cure oroduct that meets MIL S-23586~ Type II, Class 2, Grade A-requirements. Used for aerospace and military electrical requirements and mechanical applications. Typical Physical Properties: Viscosity, cps: 50,000 Specific Gravity: 1.47 Hardness, Shore A Durometer: 55 Tensile Strength, kg/cm 2 (psi): 53(750) Elongation, %: 120 Typical Thermal Properties: Tear Resistance, kg/cm (lb/in): 7(40) Useful Temperature Range, C(F): -54 to 260 (-65 to 500) Linear Shrinkage, %: 0.6 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 20 x 10 -5 (11 x 10 -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7 (500) Dielectric Constant 8 100Hz: 3.6 Dissipation Factor 8 100Hz: 0.02 Volume Resistivity, ohm-cm: 1 x 10 14
Silicones
87.5
GENERAL ELECTRIC CO.: Addition Cure RTV Silicone Rubber Products (Continued): General Purpose Products: RTV615: Clear, Colorless Easily pourable product that cures to a tough transparent rubber. Product is used for electronic potting where seethrough feature is desired for easy component identification and repair. Also useful where clear rubber is required, such as solar cell potting, optical instrument applications. Typical Physical Properties: Viscosity, cps: 3,500 Soecific Gravitv: 1.02 Hardness, Shore-A Durometer: 45 Tensile Strength, kg/cm 2 (psi): 56(800) Elonsation. %: 120 Typical-Thermal Properties: Tear Resistance, kg/cm (lb./in.): 2.5(15) Useful Temperature-Range C(F): -60 to 204 (-75 to 400) Linear Shrinkage, %: 0.2 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00045 (0.11) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 27 x IO -5 (15.3 x IO -5) Typical Electrical Properties: Dielectric Strensth. kv/mm (volts/mill: 19.7(500) Dielectric Constant.8 IOOHz: 3.0 Dissipation Factor @ 100Hz: 0.001 Volume Resistivity, ohm-cm: 1 x 10 I5 RTV616: Black Easily pourable product that cures to a tough opaque rubber. Product is used for electronic potting. Contains non-halogenated flame retardant additive for improved resistance to burning. Typical Physical Properties: Viscosity, cps: 7,000 Specific Gravity: 1.19 Hardness, Shore A Durometer: 50 Tensile Strength, kg/cm 2 (psi): 61(850) Elongation, %: 125 TvDical Thermal Prooerties: __ Tear Resistance,-kg/cm (lb./in.): 4.5 (25) Useful Temperature Range, C(F): -60 to 204 (-75 to 400) Linear Shrinkase. %: 0.2 Thermal Conductivity, qm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00066(0.16) Coefficient of Thermal Expansion, cm/cm, C (in/in, F): 27 x 10 -5 (I5 x IO -5) Typical Electrical Properties: Dielectric Strenqth, kv/mm (volts/mil): 19.7 (500) Dielectric Constant-@ 1OOHz: 3.0 Dissipation Factor @ IOOHz: 0.001 Volume Resistivity, ohm-cm: I x IO I5
876
Adhesives, Sealants and Coatings for the Electronics Industry
GENERAL ELECTRIC CO.: Addition Cure RTV Silicone Rubber Products (Continued): General Purpose Products(Continued): RTV 630: Blue Pourable product that cures to an extra-tough high tear strength rubber. Product is used to cast rubber parts, to make flexible molds and rubber tooling for production applications. Typical Physical Properties: Viscosity, cps: 150,000 Specific Gravity: 1.28 Hardness, Shore A Durometer: 65 Tensile Strength, kg/cm 2 (psi): 56(800) Elongation: 250 Typical Thermal Properties: Tear Resistance, kc/cm (lb./in.): 18(100) Useful Temperature-Range, C(F): -60 to 204 (-75 to 400) Linear Shrinkage, %: 0.2 Thermal Conductivity, gm cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm, C (in/in, F): 20.5 x 10 -5 (11.4 x 10 -5) TvDiCal __
Electrical
Properties:
Dielectric Strength; kv/mm (volts/mil): 17.7(450) Dielectric Constant @ 100Hz: 3.2 Dissipation Factor @ 100Hz: 0.019 Volume Resistivity, ohm-cm: 6 x 10 14
Special Purpose Products: RTV 6157: Clear, Colorless Easily pourable product that cures to a soft transparent gel. Features simple 1 to 10 mix ratio. Product is used to pot delicate electronic assemblies and for electrical and mechanical cushioning applications. Typical Physical Properties: Viscosity, cps: 600 Specific Gravity: 0.98 Hardness. Shore A Durometer: Penetration 8 mm. (69.5 cm shaft) Typical Thermal Properties: Useful Temperature Range, C(F): -37 to 180(-35 to 356) Thermal Conductivity, &n cal/sec, cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00041 (0.11) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 30 x 10 -5 (17 x 10 -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7(500) Dielectric Constant @ 100Hz: 2.8 Dissipation Factor @ 100Hz: 0.0001 Volume Resistivitv, ohm-cm: 1 x 10 15
Silicones
877
GENERAL ELECTRIC CO.: Addition Cure RTV Silicone Rubber Products(Continued): Special Purpose Products(Continued): RTV 627: Black Easily pourable, low cost electrical potting compound. Features 1 to 1 mix ratio, room temperature or fast cure with heat and contains non-halogenated flame retardant additive for improved resistance to burning. Typical Physical Properties: Viscosity, cps: 2,000 Suecific Gravitv: 1.37 Hardness, Shore-A Durometer: 65 Tensile Strength, kg/cm 2 (psi): 35(500) Elonsation, %: 100 Typical-Thermal Properties: Tear Resistance, kg/cm (lb./in.): 2.7(15) Useful Temperature Range, C(F): -60 to 204(-75 to 400) Linear Shrinkage, %: 0;2Thermal Conductivity, gm calfsec, cm 2, C/cm (Btu-ft/hr, ft.2, F): 0.00074 (0.18) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 21.6 x 10 -5 (12 x 10 -5) Typical Electrical Properties: Dielectric Strensth, kv/mm (volts/mil): 19.7(500) Dielectric Constant-@ 100Hz: 3.4 Dissipation Factor @ 100Hz: 0.006 Volume Resistivity, ohm-cm: 3 x 10 14 RTV 655: Clear, Colorless Easily pourable product that cures to a tough transparent rubber which maintains its rubber-like properties at low temperatures in the -115C(-175F) range. Product is used for aerospace applications where a clear product is required for low temperature service, including electronic potting, windshield interlayers and optical instrument applications. Typical Physical Properties: Viscosity, cps: 4,500 Specific Gravity: 1.03 Hardness, Shore A Durometer: 50 Tensile Strength, kg/cm 2 (psi): 63(900) Elonoation. %: 120 Typical-Thermal Properties: Tear Resistance, kq/cm(lb./in.): 4.5(25) Useful Temoerature-Ranse. C(F): -110 to 204 (-166 to 400) Linear Shrinkage, %: 012. Thermal Conductivity, gm cal/sec,cm 2, C/cm (Btu-ft/hr, ft 2, F): 0.00045 (0.11) Coefficient of Thermal Expansion, cm/cm, C(in/in, F): 33 x 10 -5 (18.3 x 10 -5) Typical Electrical Properties: Dielectric Strength, kv/mm (volts/mil): 19.7 (500) Dielectric Constant 8 100Hz: 3.0 Dissipation Factor 8 IOOHz: 0.001 Volume Resistivity, ohm-cm: 1 x IO 15
878
Adhesives, Sealants and Coatings for the Electronics Industry
GENERAL ELECTRIC CO.: Silicone General Purpose and Dielectric Compounds: Product Features: - Performance at wide temperature range -73 to 26OC(-100 to SOOF) - No reactive extreme pressure additives - Oxidation resistance - Excellent dielectrics - Excellent viscosity characteristics - Radiation resistance - Non-corrosive - Good adherence - Hydrolytically stable - Release properties Potential Benefits: - Will not harden at low temperatures or liquify at high temperatures - Hydrolytic stability and water repellency - Long term integrity and stability at temperatures from 177 to 260C (350 to 500F) - Low dissipation factor in extreme electrical environments - Withstand solidifying, smoking, melting, charring at wide temperature range - No penetration change or deterioration on exposure to radiation up to 10 6 rads at pressures down to 10 -5 mm - Useful on many non-painted metals - Adhere under conditions that cause other fluids to drip or spin off - Good performance despite environmental conditions - Useful on rubber and plastic GE compounds are silicone fluids thickened with inorganic fillers--most often silica--and can be used as dielectric, release, or protective coating materials. GE dielectric compounds have been found useful for applications where good electrical properties are needed. Non corrosive, water-resistant and non-solidifying, they offer insulating, thermal conductivity, and weatherability qualities that make them ideally suited for protective coatings in applications ranging from large high-voltage insulators to the smallest of semiconductor components. GE general purpose compounds have been found useful for void filling, sealing, release, corrosion protection, and for use as a heat sink. They have also been found to be useful lubricants for rubber and plastic parts.
Silicones
GENERAL ELECTRIC CO.: Silicone General Purpose and Dielectric Compounds(Continued): GE Dielectric Compounds: G 624 dielectric compound is useful for a wide variety of applications within a temperature range of -54 to 204C (-65 to 400F) and meets requirements for Specification MILS-8660C, Insulating and Sealing Compound, Electrical Temp. Range: -54 to 204C(-65 to 400F) Consistency Worked Penetration: 200-260 Bleed: 8% max Evaporation: 2% max Appearance: white-semi-translucent Swec. Grav.: 1.03 Thermal Conductivity: 0.11 Dielectric Strength: 740 Dielectric Const.: 2.7 Dissioation Factor: 0.006 Water&Washout, wt., %: .86 Dielectric compound/Meets MIL S-8660B G 635 dielectric compound performs at the extreme of -73C (-lOOF), yet shows good oxidation resistance at 232C (450F). It makes an outstanding water-repellent seal and electrical insulation for terminals, high-voltage insulators, connectors, ignition systems and electronic gear. Temp. Range: -73 to 232C (-100 to 450F) Consistency Worked Penetration: 200-300 Bleed: 10% max Evaporation: 3% max Appearance: white-semi-translucent Spec. Grav.: 1.02 Thermal Conductivity: 0.10 Dielectric Strength: 784 Dielectric Const.: 2.9 Dissipation Factor: 0.002 Water Washout, % wt., %: 41 Low temperature dielectric compound insulator protector G 641 compound is a good heat transfer rnateriai. It is a metal oxide and dimethyl silicone fluid blend possessing good dielectric properties. Its temperature range is -54 to 204C (-65 to 400F). Temp. Range: -54 to 204C (-65 to 400F) Consistency Worked Penetration: 240-320 Bleed: 2% max Evaporation: 2% max Appearance: white opaque Spec. Grav.: 2.55 Thermal Conductivity: 0.58 Dielectric Strength: 500 Dielectric Const.: 4.0 Dissipation Factor: 0.010 Water Washout, wt., %: .29 Thermal conductive compound
879
880
Adhesives, Sealants and Coatings for the Electronics Industry
GENERAL ELECTRIC CO.: Silicone General Purpose and Dielectric Compounds(Continued): GE Dielectric Compounds(Continued): G661 compound is a tacky dielectric compound for use as a seal and joining material on underground cable and electrical connectors. Its operating range is -40 to 204C (-40 to 400F). FDA compliance. Temp. Range: -40 to 204C (-40 to 400F) Consistency Worked Penetration: 200-300 Bleed: 1% max Evaporation: 3% max Appearance: white-semi-translucent Spec. Grav.: 1.02 Thermal Conductivity: 0.11 Dielectric Strength: 774 Dielectric Const.: 2.7 Dissipation Factor: 0.001 Water Washout, wt., %: 1.3 Tacky dielectric and general-purpose compound G687 compound is a dielectric compound found useful on high voltage insulators to prevent flashover. G 607 compound provides a water-resistant coating and has the ability to engulf particulate contaminants to provide long flashover-free insulator li ie. Temp. Range: -54 to 204C (-65 to 400F) Consistency Worked Penetration: 250-310 Bleed: 10% max. Evaporation: 3% max Appearance: white-semi-translucent Spec. Grav.: 1.02 Thermal Conductivitv: 0.11 Dielectric Strength; 709 Dielectric Const.: 3.2 Dissipation Factor: 0.001 Water Washout, wt., %: .38 Insulator protective compound
Silicones
881
GENERAL ELECTRIC CO.: Silicone General Purpose and Dielectric Compounds(Continued): General Purpose Compounds: G 623 compound is a soft dielectric compound which exhibits outstanding corrosion protection when extremely low temperatures are not involved (not below -4OF and a maximum of 400F is encountered). Temp. Range: -40 to 204C (-40 to 400F) Consistency Worked Penetration: 200-300 Bleed: 5% max Evaporation: 3% max Appearance: white-semi-translucent Spec. Grav.: 1.04 Thermal Conductivity: 0.10 Dielectric Const.: 2.73 Dissipation Factor: .002 Water Washout, wt., %: 3.8 Low bleed general-purpose compound G 697 compound meets MIL C-21567 requirements and is an excellent corrosion preventative and lubricant for use on unpainted threaded or non-threaded ferrous metal surfaces. Chemically inert, as are all silicone compounds, it performs from -57 to 150C (-70 to 300F). It is also suggested as a rubber lubricant for low to medium swelling rubber components. Temp. Range: -57 to 150C (-70 to 30OF) Consistency Worked Penetration: 260-320 Bleed: 4% max Evaporation: 2% max Appearance: light cream to white Spec. Grav.: 1.04 Thermal Conductivity: 0.11 Dielectric Const.: 2.77 Dissipation Factor: .008 Water Washout, wt., %: 3.0 Corrosion preventive compound for ferrous parts Meets MIL C-21567
882
Adhesives,
Sealants
and Coatings for the Electronics
Industty
ITW DEVCON: DEVCON SILITE RTV Silicone: * Adhesive/sealant for maintenance, construction. * Forms gaskets; electrically insulates; seals, caulks, bonds. * Available in clear, white, high temperature red. DEVCON SILITE is a single component silicone material that begins to cure as soon as it is dispensed. It "skins over" in about IO minutes and will be tack-free and resilient in about 60 minutes. SILITE forms a true elastic with good bounce and recovery. It will stretch to many times its original length before breaking. SILITE also resists shock and peeling. Excellent adhesion. SILITE adheres well to both porous and non-porous surfaces, from metal and ceramics to wood, fabric, and glass. Available in 3 colors. SILITE is available in clear, white and high temperature red. Temperature stability. Cured SILITE remains flexible at temperatures from -75F to 450F. Moisture and weatherproof. Highly resistant to weathering, sunlight, ozone, and effects of aging. Outstanding electrical characteristics. Provides excellent insulation. Good chemical resistance. SILITE has outstanding resistance to water, oxygen, sea fog, ultraviolet, and mold. Coverage. A cartridge of SILITE will seal about 100 linear feet if the seal is l/8" deep and l/8" wide. SILITE meets the following qualifications: * Authorized by USDA for use in federally inspected meat and poultry plants. Meets FDA regulation No. 2lCFR 177.2600. * Certified to Federal Spec. TT-s-001543A Class A (COM-NBSO), TT-S-00230 Class A (COM-NBS0 for silicone building sealants and MIL-A-46106A, AMEND 2, type 2 * SILITE is recognized by Underwriters Laboratories for service to 302F where elongation is not essential. Physical properties of SILITE after 7 days @ 70F: Color: White, Clear Physical Form: Non-slumping paste Cured Density g/cm 3: 1.05 Tensile Strength psi: 425 Hardness - Shore A durometer: 25 Elongation %: 600 Color: Red Physical Form: Non-slumping paste Cured Density g/cm 3: 1.05 Tensile Strength psi: 350 Hardness - Shore A durometer: 32 Elongation %: 500
Silicones
PERMAGILE ature
INDUSTRIES Vulcanizing
INC.:
INSULCAST
R.T.V.S.
883
(Room Tempera-
Silicone):
For: Electronic Embedment, Circuit Board Coating, Production and Prototype Molds, Gaskets 11:
Uncured Properties: Color: White Viscosity (cps.): 11,000 Cured Properties: Specific Gravity: 1.2 Hardness - Shore A: 45 Elongation %: 180 Tensile Strength psi: 350 Tear Strensth-Die B-lbs./in.: 15 Thermal Conductivity: 2.0 Thermal Expansion - in./in./C: 25x10 -5 Dielectric-Strength volts/mil: 500 Dielectric Constant - 60 Hz: 3.6 Dissipation Factor - 60 Hz: -02 Volume Resistivity ohm. cm. 10 15 Service Temperature - F Continuous: 400 Short Time: 500 12:
Uncured Properties: Color: Pink Viscosity (cps.): 25,000 Cured Properties: Specific Gravity: 1.3 Hardness - Shore A: 50 Elongation %: 190 Tensile Strength psi: 550 Tear Strensth-Die B - lbs./in.: 30 Thermal Conductivity: 2.0 Thermal Expansion - in-/in-/C: 25x10 -5 Dielectric-Strength volts/mil: 500 Dielectric Constant - 60 Hz: 3.4 Dissipation Factor - 60 Hz: .Ol Volume Resistivity ohm. cm.: 1x10 15 Service Temperature - F Continuous: 400 Short Time: 500
884
Adhesives, Sealants and Coatings for the Electronics Industy
PERMAGILE
INDUSTRIES
INC.:
Vulcanizing Silicone)
INSULCAST
R.T.V.S.
(Continued):
13: Uncured Properties: Color: Red Viscositv (CDS.): 25,000 Cured Properties: Specific Gravity: 1.45 Hardness - Shore A: 60 Elongation %: 140 Tensile Strength psi: 750 Tear Strength-Die B - lbs./in.: 40 Thermal Conductivitv: 2.5 Thermal Expansion --in./in./C: 22x10 -5 Dielectric Strength volts/mil: 500 Dielectric Constant - 60 Hz: 4.0 Dissipation Factor - 60 Hz: -02 Volume Resistivity ohm. cm.: 10 15 Service Temperature - F Continuous: 500 Short Time: 600 16: Uncured Properties: Color: Red Viscosity (cps.): 50,000 Cured Properties: Specific Gravity: 1.47 Hardness - Shore A: 60 Elongation %: 130 Tensile Strength psi: 800 Tear Strength-Die B - lbs./in.: 40 Thermal Conductivitv: 2.5 Thermal Expansion --in./in./C: 22x10 -5 Dielectric Strength volts/mil: 500 Dielectric Constant - 60 Hz: 4.0 Dissipation Factor - 60 Hz: .02 Volume Resistivity ohm. cm.: 10 15 Service Temperature - F Continuous: 500 Short Time: 600
(Room Temperature
Silicones
PERMAGILE INDUSTRIES INC.: INSULCAST R.T.V.S. Vulcanizing Silicone) (Continued): 19: Uncured Properties: Color: Red Viscosity (cps.): Paste Cured Properties: Specific Gravity: 1.5 Hardness - Shore A: 60 Elongation %: 135 Tensile Strength psi: 800 Tear Strength-Die B - lbs./in.: 70 Thermal Conductivity: 2.0 Thermal Expansion - in-/in-/C: 22 x 10 -5 Dielectric Strength volts/mil: 500 Dielectric Constant - 60 Hz: 4.0 Dissioation Factor - 60 Hz: .02 Volume Resistivity ohm. cm.: 10 15 Service Temperature - F Continuous: 500 Short Time: 600 27: Uncured Properties: Color: Black Viscosity (cps.): 1,500 Cured Prowerties: Specific Gravity: 1.4 Hardness - Shore A: 55 Elongation %: 135 Tensile Strength psi: 400 Tear Strength-Die B - lbs./in.: 18 Thermal Conductivity: 2.5 Thermal Expansion - in./in./C: 22x10 -5 Dielectric Strength volts/mil: 500 Dielectric Constant - 60 Hz: 3.4 Dissipation Factor - 60 Hz: 0.005 Volume Resistivity ohm. cm.: 4x10 14 Service Temperature - F Continuous: 400 Short Time: 500
885
(Room Temperature
886
Adhesives, Sealants and Coatings for the Electronics Industry
PERMAGILE
INDUSTRIES
INC.:
INSULCAST
R.T.V.S.
Vulcanizing Silicone) (Continued): 42: Uncured Properties: Color: White Viscosity (cps.): 10,000 Cured Properties: Specific Gravity: 1.45 Hardness - Shore A: 60 Elongation %: 140 Tensile Strength psi: 550 Tear Strength-Die B - lbs./in.: 40 Thermal Conductivity: 2.5 Thermal Expansion - in./in./C: 20x10 -5 Dielectric Strenath volts/mil: 500 Dielectric Constant - 60 Bz: 4.0 Dissipation Factor - 60 Hz: .OOB Volume Resistivity ohm. cm.: 1 x 10 15 Service Temperature - F Continuous: 400 Short Time: 500 46: Uncured Properties: Color: White Viscosity (cps.): 45,000 Cured Properties: Soecific Gravity: 0.75 Hardness - Shore A: 55 Elongation %: 135 Tensile Strength psi: 725 Tear Strength-Die B - lbs./in.: 55 Thermal Conductivity: 0.5 Thermal Expansion --in./in./C: 15x10 -5 Dielectric Strength volts/mil: 300 Dielectric Constant - 60 Hz: 2.0 Dissipation Factor - 60 Hz: .005 Volume Resistivity ohm. cm.: 5 x 10 14 Service Temperature - F Continuous: 400 Short Time: 500
(Room Temperature
Silicones
PBRMAGILE
INDUSTRIES
INC.:
INSULCAST
R.T.V.S.
Vulcanizing Silicone) (Continued): 49: Uncured Properties: Color: Red Viscosity (cps.): 30,000 Cured Properties: Specific Gravity: 2.3 Hardness - Shore A: 70 Elongation %: 110 Tensile Strength psi: 700 Tear Strength-Die B - lbs./in.: 35 Thermal Conductivity: 7.5 Thermal EXD.SnSiOn in./in./C: 17x10 -5 Dielectric-Strength volts/mil: 525 Dielectric Constant - 60 Hz: 5.0 Dissipation Factor - 60 Hz: .Ol Volume Resistivity ohm. cm.: 1x10 15 Service Temperature - F Continuous: 500 Short Time: 600 51: Uncured Properties: Color: Buff Viscosity (cps.): 20,000 Cured Properties: Specific Gravity: 1.18 Hardness - Shore A: 45 Elongation %: 180 Tensile Strength psi: 350 Tear Strength-Die B - lbs./in.: 25 Thermal Conductivity: 2.5 Thermal Expansion - in./in./C: 25x10 -5 Dielectric Strength volts/mil: 550 Dielectric Constant - 60 Hz: 4.0 Dissipation Factor - 60 Hz: 0.005 Volume Resistivity ohm. cm.: 1x10 15 Service Temperature - F Continuous: 450 Short Time: 550
(Room Temperature
887
888
Adhesives, Sealants and Contings for the Electronics Industry
PERMAGILE INDUSTRIES INC.: INSULCAST R.T.V.S. Vulcanizing Silicone) (Continued): 56: Uncured Properties: Color: Red Viscosity (cps.): 40,000 Cured Properties: Specific Gravity: 1.40 Hardness - Shore A: 60 Elongation %: 150 Tensile Strength psi: 750 Tear Strength-Die B - lbs./in.: 45 Thermal Conductivity: 3.5 Thermal Expansion - in./in./C: 22x10 -5 Dielectric Strenath volts/mil: 550 Dielectric Constant - 60 Bz: 4.3 Dissipation Factor - 60 Hz: .006 Volume Resistivity ohm. cm.: 1x10 15 Service Temperature - F Continuous: 550 Short Time: 650 64: Uncured Properties: Color: Clear Viscosity (cps.): 30,000 Cured Properties: Specific Gravity: 1.0 Hardness - Shore A: 35 Elongation %: 225 Tensile Strength psi: 750 Tear Strength-Die B - lbs./in.: 70 Thermal Conductivity: 1.0 Thermal Expansion - in./in./C: 28x10 -5 Dielectric Strength volts/mil: 500 Dielectric Constant - 60 Hz: 3.0 Dissipation Factor - 60 Hz: -001 Volume Resistivity ohm. cm.: 10 15 Service Temperature - F Continuous: 400 Short Time: 500
(Room Temperature
Silicones
PERMAGILE
INDUSTRIES
INC.:
Vulcanizing Silicone)
INSULCAST
R.T.V.S.
(Continued):
60: Uncured Properties: Color: Clear Viscosity (cps.): 3,500 Cured Properties: Specific Gravity: 1.02 Hardness - Shore A: 30 Elongation %: 150 Tensile Strength psi: 550 Tear Strength-Die B - lbs./in.: 20 Thermal Conductivity: 1.0 Thermal Expansion - in/in/C: 28x10 -5 Dielectric Strength volts/mil: 500 Dielectric Constant - 60 Hz: 3.0 Dissipation Factor - 60 Hz: .OOl Volume Resistivity ohm. cm.: 10 15 Service Temperature - F Continuous: 400 Short Time: 500 91: Uncured Properties: Color: Silver Viscosity (cps.): Paste Cured Properties: Soecific Gravitv: 2.5 Hardness - Shore A: 40 Elongation %: 150 Tensile Strensth osi: 200 Tear Strength~Die‘B - lbs./in.: 25 Thermal Conductivity: 30 Thermal Expansion --in/in/C: 90x10 -6 Volume Resistivity ohm. cm.: 10 -3 Service Temperature - F Continuous: 400 Short Time: 500
889
(Room Temperature
890
Adhesives, Sealants and Coatings for the Electronics Industry
PERMAGILE INDUSTRIES INC.: INSULCAST R.T.V.S. Vulcanizing Silicone) (Continued):
(Room Temperature
R.T.V.S. 11 features very low viscosity and low durometer. R.T.V.S. 12 is a pink low viscosity rubber well suited to mold making as well as electronic embedment. R.T.V.S. 13, 16, & 19 are red compounds, specially stabilized for high temperature operation; to 500F (26OC) continuous, 600F (315C) short time and, where elastomeric properties are not essential, at and above 600F for extended periods. R.T.V.S. 27 is a low viscosity rubber designed for ease of use in production line potting and coating. Poor tear. R.T.V.S. 42 is a low viscosity flame retardant rubber tested and recognized UL 94, Flame Class V-O. syntactic desR.T.V.S. 46 is a low density, pourable _. _.. foam, _. igned for air-borne, flotation and thermal insulation applications. Lowest dielectric constant. R.T.V.S. 49 is a high temperature resistance and highest thermal conductivity, for efficient heat transfer. R.T.V.S. 51 & 56 are Methyl-Phenyl rubbers for extremely low temperature flexibility. R.T.V.S. 56 is specially stabilized for high temperature service as well. R.T.V.S. 64 is a clear, high tear silicone. R.T.V.S. 60 is a clear, low viscosity rubber where optical clarity is necessary for easy repair and has lowest available viscosity. R.T.V.S. 91 is electrically conductive.
Silicones
PERMAGILE INDUSTRIES INC.: INSULCAST R.T.V.S. (Room Temperature Vulcanizing Silicone): R.T.V.S. Catalysts: 2: Color: Clear, Slight Amber Recommended Ratio: 0.1 - 0.5% Drops/100 gms R.T.V.S.: 5-25 Activity: low to moderate Feature: standard Pot Life Hours--lowest level: 2-6 9: Color: Clear, Slight Amber Recommended Ratio: 0.1 - 0.5% Drops/100 gms. R.T.V.S.: 4-20 Activity: very fast Feature: fastest cure Pot Life Hours--lowest level: l/2 250: Color: Blue Recommended Ratio: 8 - 12% Activity: moderate Feature: ease of measurement Pot Life Hours--Lowest level: 2-4 350: Color: Brown Recommended Ratio: 8 - 12% Activity: fast Feature: ease of measurement Pot Life Hours--lowest level: 3/4
891
Section XI Miscellaneous
892
Miscellaneous
893
ABLBSTIK LABORATORIES: P3300 Series Polymer Resistor Ink: ~3300 series resistor system is designed to replace discrete carbon composition/metal film resistors for flexible circuit applications. The P3300 series can be terminated to P2609 polymer silver conductor and can be used in most applications requiring resistor tolerances of +-20%. The P3300 series should not be encapsulated. Resistivity: Resistivity on Polyester p3311: 10 ohm P3312: 100 ohm p3313: IK ohm P3314: 10K ohm p3315: 1OOK ohm P3316: 1 Meg ohm
(5 mil):
Viscosity: 30 Kcps+-10 Kcps at 25C. Printing: 200 mesh stainless steel screen with 1.0 mil emulsion. Cure Schedule: 125C for 60 minutes using a circulating air oven or belt furnace. Wet Thickness: 32+-2 microns. Cured Thickness: 12+-2 microns. Thinner: EMCA-REMEX EMFLOW 525. Clean Up: EMCA-REMEX EMFLOW 525. Coverage: 350 cm 2/gm at 30 microns wet. P3500 Series Polymer Resistor System for Keypads and Contacts: P3500 series resistors are a premium carbon-filled system designed to provide outstanding reliability and durability for PCB keypad construction. The P3500 series can effectively replace gold plated edge contacts, increasing wear resistance and decreasing material/process costs. Proven applications for P3500 series are in telephones, switches, automotive dashboards, high density PCB's for computers and connectors/keypads for industrial controls. Resistivity: Resistivity on FR-4: P3503: 30 ohm P3505: 50 ohm P3512: 100 ohm Viscosity: 35+-15 KcPs at 25C. Cure Schedule: 1) 210-220C for 15-20 minutes in a circulating air convection oven or belt furnace. 2) 165C for 90 minutes in a circulating air convection oven or belt furnace. Printing Technique: 250 mesh stainless steel screen with 1.0 mil emulsion. For fine line definition a 305 polyester with 1.0 emulsion. Wet Thickness: 37+-2 microns----Cured Thickness: 20+-2 microns. Adhesion: 5A to FR4 and copper using ASTM method A. Power Rating: 5 watts/sq. in.
894
Adhesives, Sealants and Coatings for the Electronics Industry
ABLBSTIK LABORATORIES: P3900 Series Polymer Resistor Ink: P3900 series materials are designed to replace discrete carbon composition/metal film resistors for PCB applications. The P3900 series requires termination to polymer silver conductor P2422, on rigid boards, and can be used in most applications where resistor tolerances are +-20%. Resistivity: Resistivity on FR-4: *P3911: 10 ohm p3912: 100 ohm P3913: 1K ohm P3914: 10K ohm P3915: 100K ohm * P3911 contains silver in the formulation. TCR: -700 to -1000 ppm/C (+25C to +125C). Viscosity: 35+-15 KcPs at 25C. Cure Schedule: 210-220C for 15-20 minutes. Wet Thickness: 37+-2 microns. Cured Thickness: 20+-2 microns. Power Rating: 5 watts/sq. in. Thinner: EMCA-REMEX EMFLOW 540. Clean Up: Butyl Carbitol Acetate.
Miscellaneous
895
ABLESTIK LABORATORIES: P7110-XP Flexible Polymer Multilayer Dielectric: P7110-XP polymer dielectric is designed for use on flexible substrate films. Other applications include the use of P7110-XP as a screen printable spacer for membrane keyboards, simplifying the circuit production process. P7110-XP is comparable with P2609 polymer silver on polyester and P2313-XP on polyimide. Color: Blue Viscosity: 9.0 Kcps+-1.5 Kcps at 25C. Voltage Breakdown: Greater than 1000 volts per mil. Adhesion: Passes ASTM D3359, method B, cross hatch with a 5B rating. Dielectric Constant: 5-6 at 1 KHz. Dissipation Factor: tO.lO% Printing Technique: 250 mesh stainless steel screen with a 1.0 mil emulsion. Wet Thickness: 37+-2 microns. Cured Thickness: 21+-3 microns. Cure Schedule: 145C for 35 minutes in a circulating air oven or belt furnace. Two layers are recommended. First and second layers may be dried and cured together. Coverage: 210 cm 2/g at 35 microns wet thickness. P7130 Polymer Multilayer Dielectric Series: P7130 Series is an ideal material for multilaver work. It is compatible with all rigid substrates with Tg above 11OC and EMCA-REMEX P2422, P2436 and P2136 Polymer conductors. Color: Blue P7134----Red P7135 Viscosity: 45+-15 Kcps at 25C. Voltage Breakdown: Greater than 750 volts per mil. Dielectric Constant: 4-7 at 1 KHz. Printing: Screen Type: Stainless steel Emulsion: .OOl" Maximum Wire/Thread Dia.: .0016" Maximum Mesh-Opening: .0034" Cure Schedule: 165C for 35 minutes in a circulating air convection oven or belt furnace. Wet Thickness: 32+-4 microns. Cured Thickness: 17+-3 microns. Coverage: 225 cm 2/g at 30 microns wet thickness. Compatibility: P7130 is compatible with P2422, P2436 and P2136 conductors and P3900 series resistors, on rigid P.C.B.'s.
896
Adhesives, Sealants and Coatings for the Electronics Industry
ABLESTIK LABORATORIES: P7552 Polymer Multilayer Dielectric: P7522 is an ideal material for multilayer work. It is compatible with all rigid substrates with Tg above 1lOC and EMCARZMZX P2422, P2134 and P2136 Polymer conductors. Color: White P7552A----Red P7552R Viscosity: 50 Kcps+-10 Kcps at 25C. Voltage Breakdown: Greater than 750 volts per mil. Dielectric Constant: 4-7 at 1 KHz. Printing: Screen Type: Stainless Steel Emulsion: .OOl" Maximum Wire/Thread Dia.: .0016" Maximum Mesh Opening: .0034" Cure Schedule: 165C for 35 minutes in a circulating air convection oven or belt furnace. Wet Thickness: 34+-2 microns. Cured Thickness: 17+-3 microns. Coverage: 200 cm 2/g at 34 microns wet thickness.
Miscellaneous
AREMCO PRODUCTS, INC.: AREMCO
897
High Temperature Coatings/Tape:
AREMCO's coatings include a broad range of ceramic and orsanic comoounds desisned to offer oxidation protection and insulation for electronic, instrument, metallurgical and industrial applications at temperatures between 400F and 3200F. These includei CERAMACOAT: These are a group of ceramic materials based on alumina, magnesium oxide and silica whose thermal expansion matches steel closely to offer excellent adherence, thermal shock resistance, and oxidation resistance. Applications for these coatings include chemical process ducts, fume hoods, stacks, tank linings, gas scrubbers, waste lines, plating tanks, vats, sumps, racks, gas transmission lines, wall casings, reaction vats, electronic enclosures, marine structures, and automotive parts. AREMCO-COAT: These are a group of organic base coatings which offer dense, water resistant surfaces with excellent acid and alkali resistance. They are brushed or sprayed on like paint and can be applied on-site. Applications are similar to CERAMACOAT but with lower temperature resistance. CERAMA-DIP: This is an alumina ceramic which is applied as a thixotropic coating to insulate electrical and electronic components such as heating coils or resistors. The material can also be used as an end seal for feed-thrus and connectors. PYRO-PAINT: These are refractory paints used as "one shot" coatings to provide temporary protection, lubrication, stop-off or corrosion resistance for graphite, ceramic and metal molds, crucibles and fixtures used in reactive metal melting. PYRO-TAPE: This is a unique high temperature glass-plastic tape combining high tensile strength with high dielectric properties. The material comes with an adhesive backing and adheres well to metals, plastics, ceramics and glass.
898
Adhesives, Sealants and Coatings for the Electronics Industy
AREMCO PRODUCTS, INC.: (Continued):
AREMCO
High Temperature Coatings/Tape
CERAMACOAT Hi-Temp Ceramic Coatings: CERAMACOAT 512: Temperature Limit: 2500F Intermittent Temperature Limit: 2800F Major Constituent: Silica Thermal Expansion: 6.2 Volume Resistivity (ohm-cm @ RT): 10 9 Compressive Strength (psi): 3500 CERAMACOAT 592: Temperature Limit: 2800F Intermittent Temperature Limit: 3000F Major Constituent: MgO Thermal Expansion: 7.0 Volume Resistivity (ohm-cm @ RT): 10 9 Compressive Strength (psi): 4400 CERAMACOAT 593: Temperature Limit: 2500F Intermittent Temperature Limit: 2800F Major Constituent: Silica Thermal Expansion: 6.0 Volume Resistivity (ohm-cm @ RT): 10 9 Compressive Strength (psi): 4000 CERAMACOAT 595: Temperature Limit: 2800F Intermittent Temperature Limit: 3000F Major Constituent: MgO Thermal Expansion: 6.5 Volume Resistivity (ohm-cm @ RT): 10 9 Compressive Strength (psi): 5000 CERAMACOAT 596: Temperature Limit: 2500F Intermittent Temperature Limit: 2800F Major Constituent: Silica Thermal Expansion: 5.8 Volume Resistivity (ohm-cm @ RT): 10 9 Compressive Strength (psi): 4800 CERAMA-DIP 538 Hi-Temp Dip Coating Specifications: Temperature limit: 3200F Major constituent: Alumina Densitv: .092 lbs./cubic inch Compressive strength: 3400 psi Dielectric strength: approx. 50 v/mil @ R.T. approx. 12 v/mil @ lOOOF Dielectric constant: 4.0 Max. Shrinkage: 3%
Miscellaneous
AREMCO PRODUCTS, INC.: AREMCO (Continued):
High Temperature Coatings/Tape
AREMCO-COAT Hi-Temp Organic Coatings Specifications: AREMCO-COAT 567: Temperature Limit: 1400F Intermittent Temp. Limit: 1500F Major Constituent: Silicone/Glass/Ceramic Thermal Expansion: 6.0 Volume Resistivitv ohm-cm @ R.T.: 10 8 Moisture Resistance: Excellent Oxidation Resistance: Excellent Alkali Resistance: Excellent Solvent Resistance (Organic): Excellent Weight (Lbs. per Gallon): 11 Approx. Coverage per Gallon (sq. ft.): 92 Surface Finish: Smooth Thermal Shock: Excellent No. of Components: 1 AREMCO-COAT 591: Temperature Limit: 400F Intermittent Temp. Limit: 500F Maior Constituent: Phenolic Thermal Expansion: 6.8 Volume Resistivity ohm-cm @ R.T.: 5.8 X 10 12 Moisture Resistance: Excellent Oxidation Resistance: Excellent Alkali Resistance: Excellent Solvent Resistance (Orsanic): Excellent Weight (Lbs. per Gallon): 1; Approx. Coverage per Gallon (sq. ft.): 86 Surface Finishi Smooth Thermal Shock: Good No. of Components: 1 AREMCO-COAT 594: Temperature Limit: 400F Intermittent Temp. Limit: 500F Major Constituent: Phenolic Thermal Expansion: 6.0 Volume Resistivity ohm-cm @ R.T.: 5.7 X 10 12 Moisture Resistance: Excellent Oxidation Resistance: Excellent Alkali Resistance: Excellent Solvent Resistance (Orsanic): Excellent Weight (Lbs. per Gallon): li Aoprox. Coverage per Gallon (sq. ft.): 86 Surface Finish: Coarse Thermal Shock: Good No. of Components: 1
899
900
Adhesives, Sealants and Coatings for the Electronics Industry
BACON INDUSTRIES INC.: Epoxy Resin Finishing Compounds: Bacon Industries offers gyro-grade finishing compounds for repairing scratches or other minor flaws in the surface of parts made using BACON potting compounds. The finishing compounds are individually packaged in two parts, one containing the resin portion and the other the activator. All finishing compounds use Activator BA-9. Complete mixing and curing instructions are supplied on the container label. After mixing. the activated compound will remain usable for approximately 45 minutes at Room Temperature. This usable life can be extended up to 8 hours by placing the tightly covered compound in a freezer when not in use. Recommended Cure: 2 hours at 212F To Make Repairs on Any of the Following Bacon Industries' Potting Compounds
Order Finishing Compound No.
P-11, P-14, P-23, P-38, XM Compounds
FC-1 (Clear)
P-19, P-20B Blue
FC-2 (Blue)
P-20, P-20A, P-2OC, P-SOC, P-SO-F, P-82C, P-82F FC-3 (Red) P-24, P-24C, P-24F
FC-4 (Maroon)
P-83, P-84, P-85, P-86, p-175, P-178
FC-5 (Black)*
* Not gyro-grade
Miscellaneous
901
DOCK RESINS CORP.: Acrylics for Electronics Industry: TA22-20: Acrylic, Adhesion-Promoted Thermosetting 4 NV: 30 Solvents: Ethanol, Acetone Adhesion-promoted low temperature self-crosslinking vehicle AA53-16: Acrylic, Thermoplastic % NV: 40 Solvents: Methvl Ethvl Ketone Blended with phenolics and/or epoxies and/or melamines to bond copper to Kapton (DuPont). The bond resists soldering temperatures. AC209-4: Acrylic, Thermoplastic % NV: 50 Solvents: Toluol Ideal as a low cost, removable conformal coating AC92-9: Acrylic, Thermoplastic % NV: 51 Solvents: Toluol General purpose economical acrylic solution; conformal coating removable for repairs; nitrocellulose compatible; seals roofing tiles; used in textile edge binding. L91-1: Acrylic, Thermoplastic % NV: 51 Solvents: Toluol General purpose acrylic solution; used in textile edge binding; conformal coating removable for repairs; nitrocellulose compatible; seals roofing tiles. L91-17: Acrylic, Thermoplastic % NV: 40 Solvents: Methyl Ethyl Ketone Hard resistant film; blended with VYHH to coat vinyls; conformal coating removable for repairs; used to coat backside of tracing film. AQUAHYDE 100: Acrylic, Thermoplastic, Water-Based % NV: 30 Solvents: Water, Alcohol Computer ribbon vehicle; binder for insecticides, fungicides, etc., for seed coating; water-based soft transfer printing vehicle; conformal coating; leveling additive. TA22-27: Acrylic, Thermosetting % NV: 38 Solvents: Isopropanol, methyl ethyl ketone Low crosslink density, low temperature curing, self-crosslinking vehicle, solvent cleanable and-or removable conformal coating.
902
Adhesives, Sealants and Coatings for the Electronics Industy
JOHN C. DOLPH CO.: DOLPH-SPRAY Aerosol Products (Contain no Fluorocarbons): Insulators: DOLPH SPRAY AC-29-7s: Moisture & Fungus resistant varnish for printed circuit boa .ds & electronic components. Conforms to MIL V-173. Clear Thermal Class IEEE 57: 105C Dielectric Strength ASTM Dll5: Dry: 2000 Wet: 1100 Dry Time @ 73F: Set to Touch: 30 min./Tack Free: 3 112 hrs. Conforms to MIL V-173 DOLPH SPRAY ER-41: Extremely flexible fast drying, excellent adhesion and outstanding moisture and chemical resistant varnish for reinsulating electric motors. Red Thermal Class IEEE 57: 155C Dielectric Strength ASTM D115: Dry: 2OOO/Wet: 1200 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. DOLPH SPRAY EB-41: Satin Black version of ER-41. Satin Black Thermal Class IEEE 57: 155C Dielectric Strength ASTM D115: Dry: 1800/Wet: 1200 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. DOLPH SPRAY EO-42: Bright orange insulator for repairing, mining & farming equipment. Close match to original equipment color. Bright Orange Thermal Class IEEE 57: 105C Dielectric Strength ASTM Dl15: Dry: 17OO/Wet: 1200 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. DOLPH SPRAY LC-705: Clear color allows you to conveniently touch up or insulate any electrical apparatus. Good corona resistance. Clear Thermal Class IEEE 57: 105C Dielectric Strength ASTM D115: Dry: 1500/Wet: 800 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. Conforms to MIL I 17384 A Type C
Miscellaneous 903
JOHN C. DOLPH CO.: DOLPH-SPRAY Aerosol Products (Contain no Fluorocarbons) (Continued): Machinery Lacquers: DOLPH SPRAY Blue-Gray: Fast drying high gloss lacquer for electric motor frames, meter boards, control panels, transformer cases and shop machinery. Blue-Gray Thermal Class IEEE 57: 105C Dielectric Strength ASTM Dll5: Dry: 1800/Wet: 1600 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. DOLPH SPRAY Light-Gray: Fast drying high gloss lacquer for electric motor frames, meter boards, control panels, transformer cases and shop machinery. Light-Gray Thermal Class IEEE 57: 105C Dielectric Strength ASTM Dll5: Dry: 1800/Wet: 1600 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. DOLPH SPRAY Dark-Gray: Fast drying high gloss lacquer for electric motor frames, meter boards, control panels, transformer cases and shop machinery. Dark-Gray Thermal Class IEEE 57: 105C Dielectric Strength ASTM D115: Dry: 1500/Wet: 1400 Dry Time @ 73F: Set to Touch: IO min./Tack Free: 30 min. DOLPH SPRAY Gloss-Black: Fast drying high gloss lacquer for meter boards, control panels and motor frames. Gloss-Black Thermal Class IEEE 57: 105C Dielectric Strength ASTM D115: Dry: 1800lWet: 1400 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. DOLPH SPRAY White: Fast drying high gloss lacquer for hospital and dairy motors. White Thermal Class IEEE 57: 105C Dielectric Strength ASTM D115: Dry: 2000/Wet: 1000 Dry Time @ 73F: Set to Touch: 10 min./Tack Free: 30 min. Anti-Corrosion: DOLPH Spray Lamination and Metal Coater: Prevents rust and corrosion on all metal surfaces. Its low build assures no problems with air gaps. Its light orange tint verifies coverage. Light Orange Tint Dielectric Strength ASTM D115: Dry: ZOOO/Wet: 1200 Dry Time @ 73F.: Set to Touch: 10 min./Tack Free: 30 min.
904
Adhesives, Sealants and Coatings for the Electronics Industry
JOHN C. DOLPH CO.: High Technology Electronic Resins: DOLPHON CB-1078 and DOLPHON CB-1109: DOLPHON CB-1078 Epoxy Resin: DOLPHON CB-1078 is a black, filled, casting and potting epoxy resin which provides excellent thermal conductivity... good electrical properties...low shrinkage...flame retardancy... and water resistance. It is available with six different reactors to achieve a variety of properties: - Low to high viscosity - Flexible to rigid - Short to long pot life - Room or heat cure DOLPHON CB-1109: DOLPHON CB-1109 is a flexible black polybutadiene resin which exhibits superior electrical and physical properties as compared to silicone and epoxies. CB-1109 is more than a match for silicones at half the price! Further, CB-1109 provides the following additional advantages: - Low temperature flexibility to a frigid -72C. - Low embedment stress. - Excellent high-temperature electrical properties. - Outstanding thermal shock resistance. - Hydrolytic stability. - Excellent adhesion without primers. These are but a few of the applications for DOLPHON electronic resins: Reed relays Integrated circuits Power supplies Circuit boards RC networks Discrete devices Transducers Hybrid circuits Capacitors Diodes Resistors
Flyback transformers Relays Voltage regulators Ferrite cores Triplers Thermostats Sensors Modules
Miscellaneous
DYNALOY, INC.: Solvent Selection Guide: Ethylene Glycol Ether Base: URESOLVE HF: Stronger than URESOLVE Blue or 411. Heat for faster Epoxy: Cast: Anhydride Urethane: Coatings Foam Polyester Silicone: Oils
action.
URESOLVE PLUS: URESOLVE PLUS SG: URESOLVE PLUS 500: Use hot (150-225F) for silicones and anhydride epoxies. Depotting, decapsulation, deinking. For surface preparation of silicone and silicone-modified epoxy transfer molded devices prior to printing. PLUS 500 stronger than PLUS SG (Semi-conductor Grade). Epoxy: Cast: Anhydride Urethane: Coatings Foam Polyether Polyester Hybrids Silicone: Tranfer Molded RTV Varnish Oils Photo Resist (Positive) DYNASOLVE MP-AL GR: DYNASOLVE MP-500: Maintenance grade. Use hot (150-225F) for silicones, anhydride epoxies and some urethanes. Cleaning mixing and metering equipment. MP-500 is a stronger version of MP-AL GR (Aluminum Grade) Epoxy: Cast: Anhydride Urethane: Coatings Foam Polyether Polyester Hybrids Silicone: Transfer Molded RTV Varnish Oils Photo Resist (Positive)
905
906
Adhesives, Sealants and Coatings for the Electronics Industry
DYNALOY,
INC.:
Solvent
Selection
URESOLVE Blue: Flammable. RT use only. Most repair cable assemblies removal; Urethane: Coatings Polyester Silicone: Oils
Guide:
Methanol
Base:
Conformal coating selective. and electrical connectors.
URESOLVE 411: than URESOLVE Blue RT use only. Stronger Flammable. UV cured conformal coating removal. less selective. Urethane: Coatings Polyester Silicone: RTV Oils
DYNASOLVE 190: Flammable. RT use only. Epoxy: Cast: Anhydride Urethane: Coatings Polyester Silicone: RTV Oils
DYNASOLVE 170: DYNASOLVE 170-15: Flammable. RT use Urethane: Foam
only.
Conformal
Very
coating
selective.
removal.
but
Miscellaneous
907
DYNALOY, INC.: Solvent Selection Guide: Methylene Chloride Base: DYNASOLVE 160: RT use only. Least selective. Depotting, deflashing, decapsulation. Epoxy: Transfer Molded Cast: Amine Anhydride Polysulfide DYNASOLVE 200: RT use only. Selective. Cable assemblies, connectors, aircraft fuel tanks. Polysulfide DYNASOLVE 210: RT use only. Removal of conformal coatings and RTV's from CRT tubes. Silicone: RTV Varnish Oils Polysulfide
908
Adhesives, Sealants and Coatings for the Electronics Industry
DYNALOY, INC.: Solvent Selection Guide: Propylene Glycol Ether Base: DYNASOLVE 700: Flammable. RT use only. Epoxy: Cast: Anhydride Urethane: Coatings Foam Polyester Silicone: Oils DYNASOLVE 710: DYNASOLVE 711: DYNASOLVE 750: Use hot (150-240F) for silicones and anhydride epoxies. Depotting, decapsulation, deinking. 750 stronger than 710 or 711. Use 711 in contact with aluminum. Epoxy: Cast: Anhydride Urethane: Coatings Foam Polyether Polyester Hybrids Silicone: Transfer Molded RTV Varnish Oils Photo Resist (Positive) DYNASOLVE MP-710: DYNASOLVE MP-750: Maintenance grade. Use hot (150-240F) for silicones, anhydride epoxies and some urethanes. Cleaning mixing and metering equipment. MP-750 stronger version of MP-710. Epoxy: Cast: Anhydride Urethane: Coatings Foam Polyether Polyester Hybrids Silicone: Transfer Molded RTV Varnish Oils Photo Resist (Positive) DYNASOLVE 8710: Flammable. Use hot (75C) for positive photo resist removal. 100% organic. RT use conformal coating stripper. Urethane: Coatings Silicone: RTV Photo Resist (Positive)
Miscellaneous
909
DYNALOY, INC.: Solvent Selection Guide: Special Solvents: DECAP: Use hot (15OC). Not selective. Depotting, deflashing, decapsulation. Epoxy: Transfer Molded Cast: Amine Anhydride NMP (N-Methyl Pyrrolidone): Use hot (220-35OF). Not selective. Decapsulation, deflashing. Safe, easy disposal. Epoxy: Transfer Molded Cast: Amine Anhydride Photo Resist (Positive) DYNASOLVE 180: Use hot (220F). Not selective. Decapsulation, deflashing. Least hazardous. Epoxy: Transfer Molded Cast: Amine Anhydride Photo Resist (Positive) DYNASOLVE DYNASOLVE 185 is 185 SG is Epoxy:
185: 185 SG: a stronger version of 180. Use hot (220F). Deinkinq. electronic grade. Safe, easy disposal. Transfer Molded Cast: Amine Anhydride Photo Resist (Positive)
DYNASOLVE 215: Use hot (150-160F). Recommended when 210 cannot be used. Silicone: RTV Varnish Oils Polysulfide DYNASOLVE M-10: Removal of silicone oils and parting agents from plastic or metallic parts. Silicone: Oils
910
Adhesives, Sealants and Coatings for the Electronics Industry
DYNAMOLD, INC.: Moldable Shim Material: Dynamold, Inc. 's Moldable Shim Materials are high compression strength gap fillers that are widely used in assembly of both metal and composite structures. Dynamold, Inc. offers a range of catalyst systems for the DMS-4-828 and MS-26 Moldable Shim Material lines. DMS-4-828: Application Time at 75F: 1 Hr. Assembly Time at 75F: 2 Hr. Drill Time: 4-5 Hr. at 75F+-5 Cure Time: 8-9 Hr. at 75F+-5 Viscosity cps (Base & Catalyst) at 75F: 55,000 Forms Available: 1 Shelf Life and Storage: 3 Years at Room Temp. DMS-4-828B: Application Time at 75F: 2 Hr. Assembly Time at 75F: 4 Hr. Drill Time: 9-10 Hr. at 75F+-5 or 7 Hr. at lOOFtCure Time: 36 Hr. at 75F+-5 or 2-3 Hr. at 120F+-5 Viscosity cps (Base & Catalyst) at 75F: 55,000 Forms Available: 1,2 Shelf Life and Storage: 3 years at Room Temp. DMS-4-828L: Application Time at 75F: 3-4 Hr. Assembly Time at 75F: 7-8 Hr. Drill Time: 36 Hr. at 75F+-5 or 14 Hr. at lOOFtCure Time: 75 Hr. at 75Ft-5 or 1 Hr. at 180F Viscosity cps (Base & Catalyst) at 75F: 55,000 Forms Available: 1,2,3 MS-26A: Application Time at 75Ft-5: 40 Min. Assembly Time at 75F: 2 Hr. Drill Time: 7 Hr. at 75Ft-5 or 5 Hr. at lOOF+Cure Time: 9 Hr. at 75F+-5 Viscosity cps (Base & Catalyst) at 75F: 220,000 Forms Available: 1 Forms Available: 1: Two Part System 2: Precatalized/Frozen 3: Precatalized/Frozen
Sheets and Strips Cartridge (2OOg.)
Miscellaneous
DYNAMOLD, INC.: Moldable Shim Material(Continued): MS-26B: Application Time at 75F: 1.5 Hr. Assembly Time at 75F: 4 Hr. Drill Time: 20 Hr. at 75Fk5 or 9 Hr. at lOOFt Cure Time: 65 Hr. at 75Flt5 or 1 Hr. at 180F Viscosity cps (Base & Catalyst): 220,000 Forms Available: I,2 MS-26: Awwlication Time at 75Fk5: 5-6 Hr. Assembly Time at 75F: 7-8 Hr. Drill Time: 80 Hr. at 75F+5 or 20 Hr. at lOOFk5 Cure Time: 100 Hr. at 75F+5 or 2 Hr. at 180F+5 Viscosity cps (Base & Catalyst) at 75F: 220,000 Forms Available: 1,2,3 Forms Available: 1: Two Part System 2: Precatalized/Frozen Sheets and Strips 3: Precatalized/Frozen Cartridge(200 g.)
911
912
Adhesives, Sealants and Coatings for the Electronics Industry
DYNAMOLD,
INC.: Moldable Shim Materials MS-26 and DMS-4-828:
Moldable Shims, ~~-26 and DMS-4-828, are filled epoxy resin compounds used to shim gaps between metal parts and between metal structural members and composites such as graphite. Properties of DYNAMOLD Moldable Shims When Fully Cured in Place: Low coefficient of thermal expansion. Good adhesion to Aluminum, Titanium, Steel, Boron and Graphite Composite. May be considered a structural member. Is resistant to cold and heat from -65F to +400F. May be machined, drilled and riveted. IS resistant to lubricants, fuels, paints, salt, solvents, acids, and Skyarol. Hiah resistance to imlsact and vibration. May be drilled when &red without supportive backing. Capable of carrying compressive loads of high torque bolts and bucked rivets. May be cured at room temperature or by applying heat. Applications of DYNAMOLD Moldable Shims: - Shimming gaps and offsets at the assembly level. - Cast in place shim, forming complex contours on parts machined undersize at the detail level. - As a layer, over rough machined parts, eliminating finish machining. - Close tolerance molding to produce accurate and identical parts at the detail level. - Repair of parts where structurally allowable. - Economical correction of tooling. - Shimming of heavy machine or motor parts. MS-26 Covered by Mil. Spec. MIL-S-83474 USAF 27 Feb. 1976. Block Compression: Temp.: -65F Ultimate (PSI): 37,000 Modulus (%I): 606 Yield (PSI): 20,000 Tem0.: 75F Ultimate (PSI): 27,000 Modulus (KSI): 508.3 Yield (PSI): 14,000 Temp.: 250F Ultimate (PSI): 16,000 Modulus (KSI): 206.1 Yield (PSI): 6,000
Miscellaneous
DYNAMOLD, INC.: Moldable Shim Materials MS-26 and DMS-4-828 (Continued): MS-26 Covered by Mil. Spec. MIL-S-83474 USAF 27 Feb. 1976 (Continued): Block Compression(Continued): Temp.: 350F Ultimate (PSI): 9,000 Modulus (KSI): 97.1 Yield (PSI): 8,000 Temp.: 420F Ultimate (PSI): 7,000 Modulus (KSI): 86.7 Yield (PSI): 6,000 Flatwise Compression: Temp.: 75F Ultimate (PSI): 103,797 Modulus (KSI): 946.6 Yield (PSI): 101,902 Temp.: 250F Ultimate (PSI): 52,870 Modulus (KSI): 324.1 Yield (PSI): 35,549 Temp.: 350F Ultimate (PSI): 45,716 Modulus (KSI): 337.5 Yield (PSI): 33,285 Temp.: 420F Ultimate (PSI): 22,224 Modulus (KSI): 253.2 Yield (PSI): 15,510 (Significant compression strength is gained when MS-26 is adhered to a substrate) Adhesion: Temp.: 75F Adhesive Shear PSI (.030 shim thick): 2,000 Temp.: 250F Adhesive Shear PSI (.030 shim thick): 2,000 Temp.: 350F Adhesive Shear PSI t-030 shim thick): 1,800 Temp.: 420F Adhesive Shear PSI (.030 shim thick): 1,100
913
914
Adhesives, Sealants and Coatings for the Electronics Industry
DYNAMOLD, INC.: Moldable Shim Materials MS-26 and DMS-4-028 (Continued): MS-26 Covered by Mil. Spec. Mil-S-83474 USAF 27 Feb. 1976 (Continued): Long Time Exposuure at Temp: 240 hrs. at temp.: 250F wt. LOSS %: 0 Shrinkage %: 0 Shore "D" Hardness: 96 240 hrs. at temp.: 350F wt. LOSS %: .057 Shrinkage, %: .02 Shore "D" Hardness: 96 240 hrs. at temp.: 420F Wt. Loss %: -462 Shrinkage 8: .12 Shore "D" Hardness: 96 Density: -06 lb/in 3 or about 1.6 the specific gravity of water DMS-4-828 Covered by Aerospace Material Specification AMS 3726/l/2/3 Oct. 1, 1983: Working Life (70-80F, 200 grams): Min. 40 min., Max.: 60 min. Density: 94 lbs/cu.ft. Color: Gray Hardness: Cured Shore llDfl: 92 Specific Gravity: 1.60 Volatile Content: Not to exceed 0.5% Viscosity: Workable Paste Coefficient of Linear Thermal Expansion: 3.0X10 -5 in/in/F Lap Shear Strength: 2,000 psi Residual Lap Shear Strength Salt Spray, 30 days @ 120F: 1,500 psi Residual Lap Shear Strength Humidity, 30 days @ 140F: 1,700 psi Residual Lap Shear Strength JP-4 7 days 140F: 1,800 psi Strain Compatability Aluminum: 20 cycles without failure -54C Strain Compatability Graphite Composite: 20 load cycles between 350 lbs. and 3500 lbs. without failure C -40C Flatwise Compression Strength (Adhered to Substrate): 30,000 psi without failure Shim Torque Panel: 50% of Initial Applied Torque
Miscellaneous
ELECTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systems: High Reliability System: Conductive: 8836 (Au) 8884 (Au) 8835 Via Fill 5837 (Pt/Au) Resistive: 3900 Series Dielectric: 4905-c Solder: 3601-G (80Au/2OSn) ~-3702-J (Sn 63) Protection: 4775 242-SB Consumer Products System: Conductive: 9633-B (Pd/Ag) 9695 (Pd/Ag) 9912 (Ag) Resistive: 3900 Series 2900 Series Dielectric: 4905-CH Solder: 3701-J (Sn 62) Protection: 4771-G 240-SB
915
916
Adhesives,
Sealants
and Coatings for the Electronics
Industry
ELECTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systems(Continued): Nitrogen Firing System: Conductive: 2312 (Cu) Resistive: Developmental Dielectric: 4906 solder: 3702-J (Sn 63) Protection: D-4780 High Voltage System: Conductive: 8884 (Au) 5837 (Pt/Au) 9633-B (Pd/Ag) Resistive: 3980 Series 2700 Series Dielectric: 4903 Solder: 3701-J Protection: 4770-BCG Microwave/High Frequency System: Conductive: 8880 (Au) 8884 9912F (Ag) Dielectric: D-4910-B Protection: 4904
Miscellaneous
917
ELECTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systems(Continued): Aluminum Nitride Substrate System: Conductive: 8835-IA (Au) D-8835-1D (Au) D-9633-D (Pd/Ag) D-9913 (Ag) Resistive: D-3200 Series Dielectric: D-4907 Solder: 3701-J Protection: 4771-G 240-SB Beryllia Substrate System: Conductive: 8884-A (Au) 9562 (Pt/Pd/Ag) Resistive: 3980 Series Dielectric: 4905-c Solder: 3701-J Protection: 4770-BCG Polymer Thick Film Systems: Thermoplastic (<12OC): Conductive: 1112-S (Ag) Resistive: RS-16100 Series Dielectric: 500 Thermosetting (t200C): Conductive: 1107-S (Ag) Resistive: D-RS-12100 Series Dielectric: 241-15 Protection: 242-SB
918
Adhesives, Sealants and Coarings for the Electronics Industry
ELECTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systems(Continued): Polymer Thick Film Systems(Continued): Thermosetting (>3OOC): Conductive: 19910 (Ag) Resistive: RS-15500 Series Dielectric: 14410 625C Porcelain Enameled Steel (PES) System: Conductive: 8835-IB (Au) 9996-B (Ag) Resistive: 3100 Series Dielectric: M4032 Solder: 3701-J Protection: 242-SB 850C Porcelain Enameled Steel (PES) System: Conductive: 8835-1~ (AU) 9635-C (Pd/Ag) Resistive: 3900 Series Dielectric: 4905-c Solder: 3701-J Protection: 242-SB Surface Mounting Materials: Conductive: 1900 (Epoxy Ag) Solder: 3701-J (Sn 62) 3702-J (Sn 63)
Miscellaneous
919
ELECTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systems(Continued): Cerdip Dotting Metallizations: Conductive: 9601-N (Pd/Ag) 9501-N (Pt/Ag) D-8835-ID (Au) Solar Cell System: Conductive: 590 Series (Au and As/Al) D-2592 (Al)‘ 590-G (Ag for amorphous cells) 1109-S (Polymer Ag-for amorphous cells) a.
Thick Film Cermet Capicator System: Conductive: 8836 (Au) 9638 (Pd/Ag) Dielectric: 4608-H (Low K) 4113 Series (Middle K) 4510 Series (High K) Protection: 4612 4903-H Potentiometer System: Conductive: 9635-P (Pd/Ag) Resistive: 3900-P/3980-P Series Thermal Printhead System: Conductive: D-8084 (Au Organometallic) D-9903 (Ag with D-8084) Resistive: TP-3900 Series Dielectric: 4608-H Code 129 (High Temp) Protection: D-4909
920
Adhesives,
Sealants
and Coatings for the Electronics
Industry
ELRCTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systens(Continued): Sensor Systems: Oxygen Sensors: Conductive: 5542 (Pt) 5545 (Pt) Capacitive Pressure Sensors: Conductive: 8081 (Au Organometallic) Other: 4026 Strain Gauges: Conductive: 8836 (Au) 9635-A (Pd/Ag) Resistive: D-3414-A D-3414-B Resistance Thermometers: Conductive: 5544 (Pt) 2557 (Ni) Protection: 4904 (on Pt) 4770-BCG (on Ni) Thermistors: Conductive: 9633-B (Pd/Ag) Resistive: NTC-2400 Series Gas Sensors: Conductive: 590 (Ag) Resistive: D3030 Series (Sn02 Organometallic)
Miscellaneous
92I
ELECTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systems(Continued): Display Systems: DC Gas Discharge: Conductive: D-2558 (Nil 590 (Ag) D-2592 (Al) Resistive: 3100 Series Dielectric: D-M4023-C D-4118 Other: 4022-C AC Gas Discharge: Conductive: 590 (Ag) Dielectric: 4014-c Other: 4022-C Through-Hole Printing System: Ceramic or PC boards: Conductive: 5837-THP (Pt/Au) 9694-THP (Pd/Ag) 1107-S (Ag Polymer) Other: 401 402
922
Adhesives, Sealants and Coatings for the Electronics Industy
ELRCTRO-SCIENCE LABORATORIES, INC.: ESL High Technology Materials Systems(Continued): Dielectric Tape Systems: Cofire: Conductive: D-800-CT Series (Au) Resistive: 3900 Series Dielectric: D-lOl-CT (Tape) Dimensionally Stable: Conductive: D-800-TT Series (Au) Resistive: 3900 Series Dielectric: D-IOI-TT (Tape): Chip Resistor System: Conductive: 9693-S (Pd/Ag) D-9915 (Ag for edge) 1107-S (Polymer Ag for edge) Resistive: 2900/2980 Series Protection: 4027-G 4027-B
Miscellaneous
H.B. FULLER CO.: Electrical/Electronic
Products: Hot Melts:
HM-0652: Viscosity: 6,000 cps @ 204C 9,500 cps @ 19oc Ring & Ball Softening Point C: 174 Typical Application Temperature C: 204 Color: Amber Specific Gravity: 0.978 Hardness: 53 Shore D Tensile Properties: Strength, PSI: 1,650 Tensile Properties: Elongation, %: 608 Maximum Operating Temperature, C: 130 Thermal Conductivity Cal/cm-see-C: 6.8x10 -4 Thermal Coefficient of Expansion: urn/m/C: Alpha 1: 179 Thermal Coefficient of Exwansion: urn/m/C: Alwha 2: 334 Glass Transition Temperatke (TG) C:.-42 & 84 Dielectric Constant @ 23C: 60HZ: 2.66 Dielectric Constant @ 23C: 100KHZ: 2.57 Dissipation Factor @ 23C: 60HZ: 0.0171 Dissipation Factor @ 23C: IOOKHZ: 0.00905 Volume Resistivity @ 23C (ohm-cm): 8.0x10 15 Good wetting, fast setting, oil resistant, high heat resistance. HM-0904: Viscosity: 2,500 cps @ 204C 3,900 CDS @ 19oc Ring & Ball Softening Point C: 145 Typical Application Temperature C: 204 Color: Amber Specific Gravity: 1.006 Hardness: 76 Shore A Tensile Properties: Strength, PSI: 351 Tensile Properties: Elongation, %: 212 Maximum Operating Temperature, C: 105 Thermal Conductivity Cal/cm-set-C: 6.5x10 -4 Thermal Coefficient of Expansion: urn/m/C: Alpha 1: N/A Thermal Coefficient of Expansion: urn/m/C: Alpha 2: 261 Glass Transition Temperature (TG) C: -45 Dielectric Constant @ 23C: 60HZ: 7.95 Dielectric Constant @ 23C: IOOHZ: 4.71 Dissipation Factor @ 23C: 60HZ: 0.0876 Dissipation Factor @ 23C: 100HZ: 0.190 Volume Resistivitv R 23C (ohm-cm): 4.1x10 11 Versatile, tough,- flexible. Bonds plastics, most metals, wood, etc. Excellent low temperature flexibility. Good for copper/brass.
923
924
Adhesives, Sealants and Coatings for the Electronics Industry
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Hot Melts
HM-1476: Viscosity: 14,000 cps @ 204C 58,000 cps @ 177C Ring & Ball Softening Point C: 138 Typical Application Temperature C: 204 Color: Amber Specific Gravity: 0.980 Hardness: 90 Shore A Tensile Properties: Strength, PSI: 1,017 Tensile Prooerties: Elonaation. %: 1.130 Maximum Operating Temperature,'C: 95. Thermal Conductivity Cal/cm-see-C: 6.2x10 -4 Thermal Coefficient-of Expansion: urn/m/C: Alpha 1: 128 Thermal Coefficient of Expansion: urn/m/C: Alpha 2: 235 Glass Transition Temperature (TG) C: -10 Dielectric Constant B 23C: 60HZ: 4.07 Dielectric Constant @ 23C: IOOHZ: 3.90 Dissipation Factor @ 23C: 60HZ: 0.138 Dissipation Factor @ 23C: IOOHZ: 0.129 Volume Resistivity @ 23C: (ohm-cm): 3.2x10 13 Excellent adhesion to primed and unprimed PVC. Not suggested for copper/brass. HM-1504: Viscosity: 6,500 cps @ 204C 11,500 cps @ 19oc Ring & Ball Softening Point C: 144 Typical Application Temperature C: 204 Color: Amber Specific Gravity: 0.997 Hardness: 77 Shore A Tensile Properties: Strength, PSI: 340 Tensile Properties: Elongation, %: 456 Maximum Operating Temperature, C: 105 Thermal Conductivitv Cal/cm-see-C: 6.6x10 -4 Thermal Coefficient-of Expansion: urn/m/C: Alpha 1: N/A Thermal Coefficient of Expansion: urn/m/C: Alpha 2: 278 Glass Transition Temperature (TG) C: -57 Dielectric Constant @ 23C: 60HZ: 6.25 Dielectric Constant @ 23C: IOOHZ: 4.40 Dissipation Factor @ 23C: 60HZ: 0.0494 Dissipation Factor @ 23C: IOOKHZ: 0.148 Volume Resistivity @ 23C (ohm-cm): 4.0x10 11 Fast set. For woods, vinyls and plastics. Outstanding low temperature flexibility. Not suggested for copper/brass.
Miscellaneous
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Hot Melts
EL-6129: Viscosity: 825 cps @ 19OC 1,200 cps @ 177c Ring & Ball Softening Point C: 138 Typical Application Temperature C: 190 Color: Bone White Specific Gravity: 1.032 Hardness: 73 Shore A Tensile Properties: Strength, PSI: 250 Tensile Properties: Elongation, %: 320 Maximum Operating Temperature, C: 95 Thermal Conductivity Cal/cm-see-C: 6.7x10 -4 Thermal Coefficient of Expansion: urn/m/C: Alpha 1: 130 Thermal Coefficient of Expansion: urn/m/C: Alpha 2: 220 Glass Transition Temperature (TG) C: -22 Dielectric Constant @ 23C: 60HZ: 9.93 Dielectric Constant @ 23C: IOOKHZ: 3.34 Dissipation Factor @ 23C: 60HZ: 0.442 Dissipation Factor @ 23C: IOOKHZ: 0.150 Volume Resistivity @ 23C (ohm-cm): 7.3x10 11 Versatile adhesive properties with flame retardancy.
925
926
Adhesives, Sealants and Coatings for the Electronics Industry
H.B. FULLER CO.: Electrical/Electronic
Products: Urethanes:
UR-1100: Viscosity of Blend @ 25C, cps: 120,000 Mix Ratio By Weight (A/B): One Component Pot Life @ 25C: N/A Max Exotherm C: N/A Typical Cure Schedule: 2 Min. @ 127C Color: Pale Blue Specific Gravity: 1.14 Hardness: 74 Shore D Tensile Properties: Strength, PSI: 2,325 Tensile Properties: Elongation, %: 26.5 Maximum Operating Temperature C: 95 Thermal Conductivity CAL/CM-SEC-C: 7.4x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 121 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 180 Glass Transition Temperature (TG) C: 20 Dielectric Constant @ 23C: 60HZ: 5.02 Dielectric Constant @ 23C: 100KHZ: 4.28 Dissipation Factor @ 23C: 60HZ: 0.0383 Dissipation Factor @ 23C: 10OKHZ: 0.0471 Volume Resistivity @ 23C (ohm-cm): 6.2x10 14 Exhibits the best overall heat resistance of Fuller's current available urethanes. Product meets FDA 175.105. UR-1140: Viscosity of Blend @ 25C, cps: 20,000 Mix Ratio by Weight (A/B): One Component Pot Life @ 25C: N/A Max Exotherm C: N/A Typical Cure Schedule: 2 Min. @ 127C Color: Opaque Specific Gravity: 1.15 Hardness: 70 Shore D Tensile Properties: Strength, PSI: 2,155 Tensile Properties: Elongation, %: 25.2 Maximum Ooeratina Temoerature C: 95 Thermal ConductiGity CAL/CM-SEC-C: 6.7x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 99.8 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 192 Glass Transition Temperature (TG) C: 1 Dielectric Constant @ 23C: 60HZ: 4.62 Dielectric Constant @ 23C: IOOKHZ: 4.18 Dissipation Factor @ 23C: 60 HZ: 0.545 Dissipation Factor @ 23C: 100 KHZ: 0.0488 Volume Resistivity @ 23C (ohm-cm): 8.5x10 14 A low-viscosity, non-thixotropic version of UR-1100.
Miscellaneous
H.B. FULLER CO.: Electrical/Electronic (Continued):
927
Products: Urethanes
UR-2139: Viscosity of Blend @ 25C. cps: 25,000 Mix Ratio by Weight(A/B)t 100/62.5 Pot Life @ 25C: 35-65 Min. Max Exotherm C: 49 Typical Cure Schedule: 12 Hrs. @ 25C Color: Translucent Specific Gravity: 1.05 Hardness: 90 Shore A Tensile Properties: Strength, PSI: 1,750 Tensile Properties: Elongation, %: 339 Maximum Operating Temperature, C: 80 Thermal Conductivity CAL/CM-SEC-C: 6.9x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 113 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 222 Glass Transition Temnerature (TG) C: 12 Dielectric Constant ‘@ 23C: 60B~:.3.14 Dielectric Constant @ 23C: 100KHZ: 2.97 Dissipation Factor @ 23C: 60HZ: 0.0246 Dissipation Factor @ 23C: IOOKHZ: 0.0116 Volume Resistivity @ 23C (ohm-cm): 1.5x10 15 An excellent choice where flexible, general-purpose material is called for. This thixotropic-natured urethane provides excellent adhesion to most plastics and rubbers. Product meets FDA 175.105. UR-2183: Viscosity of Blend @ 25C, cps: 8,500 Mix Ratio By Weight(A/B): 100/55 Pot Life @ 25C: 8-15 Min. Max Exotherm C: 83 Typical Cure Schedule: 4 Hrs. @ 25C Color: Off White Specific Gravity: 1.12 Hardness: 92 Shore A Tensile Properties: Strength, PSI: 3,280 Tensile Properties: Elongation, 8: 127 Maximum Operating Temperature, C: 80 Thermal Conductivity CAL/CM-SEC-C: 7.3x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 80.6 Thermal Coefficient of Exaansion urn/m/C: Aloha 2: 197 Glass Transition Temperature'(TG) C: 26 L Dielectric Constant @ 23C: 60HZ: 3.90 Dielectric Constant @ 23C: 100HZ: 3.66 Dissipation Factor @ 23C: 60HZ: 0.0298 Dissipation Factor @ 23C: 100KHZ: 0.0127 Volume Resistivity @ 23C (ohm-cm): 3.3x10 15 Polyester-based urethane exhibiting moderate viscosity, fast cur 'e and excellent adhesion to most plastics and rubbers.
!?28
Adhesives, Sealants and Coatings for the Electronics Industry
H.B. FULLER CO.: Electrical/Electronic (Continued):
Products: Urethanes
UR-2187: Viscositv of BIend a 25C. CDS: 900 Mix Ratio By Weight-(A/Bj: iSO/ Pot Life @ 25C: 40-75 Min. Max Exotherm C: 56 Typical Cure Schedule: 12 Hrs. @ 25C Color: Cl. Yellow Specific Gravity: 1.05 Hardness: 62 Shore D Tensile Properties: Strength, PSI: 1.350 Tensile Properties: Elongation, %: 364 Maximum Ooeratins Temoerature. C: 80 Thermal CbnductiGity CAL/CM-SEC-C: 6.8x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 119 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 216 Glass Transition Temperature (TG) C: 216 Dielectric Constant @ 23C: 60HZ: 13 Dielectric Constant @ 23C: lOOHZ: 2.97 Dissipation Factor @ 23C: 60HZ: 0.0990 Dissipation Factor @ 23C: 100KHZ: 0.0163 Volume Resistivity @ 23C (ohm-cm): 9.8x10 14 Exhibits low viscosity and excellent flexibility while maintaining excellent adhesion to most plastics and rubbers.
Miscellaneous
929
LOCTITE CORP.: Electronic Assembly Aids: Products for Printed Circuit Assemblies, Coating, Potting, and Bonding. LOCTITE materials formulated for the electronics industry helo increase orocessinc Soeed and efficiencv--while building in longer, more reliable product life. These materials include formulations for bonding SMD and other components, potting and encapsulating, sealing and gasketing, and environmental protection of finished assemblies. Some materials are specially designed to cure with ultraviolet light, for immediate component handling. All LOCTITE electronic materials can be dispensed and cured manually or automatically with equipment that easily integrates into on-line processes. Bonding: Thermally Conductive Adhesives: Formulated for heat dissipation applications, LOCTITE OUTPUT primer activated, no-mix adhesives feature excellent thermal conductivity, paste consistency for thin bond lines and fast cure. They -
replace: Costly mechanical fasteners Messy silicone grease that collects contaminants Epoxies requiring precise mixing and off-line curing
OUTPUT 383 High Strength Thermally Conductive Adhesive: For permanent component mounting to heat sinks. Eliminates air entrapment. OUTPUT 384 Repairable Thermally Conductive Adhesive: Mounts components to heat sinks-and allows component removal for repair or replacement. OUTPUT 315 Self-Shimming Thermally Conductive Adhesive: Rapid, room temperature cure with a constant, controlled 5 ml gap between bonded components (not to exceed 500 volts). Provides electrical isolation while maintaining thermal conductivity. Instant Adhesives: TAK PAK instant adhesives cure in seconds to a hard, clear, insulating plastic on a wide variety of substrates. TAK PAK 444 Instant Adhesive: Medium viscosity (700 cp) instant adhesive formulated specifically for PCB assembly and repair. Replaces epoxies, silicones, hot melts for mounting components, reinforcing standoffs, wire tacking and board repair. Available in kit form with TAK PAK Acceierator or as separate items.
930
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Electronic Assembly Aids(Continued): Bonding(Continued): Thermally Conductive Adhesives(Continued): TAK PAK 382 Ultra Performance Adhesive Kit: Designed to cut PCB assembly, repair and modification, TAK PAK 382 is a high temperature (to 223F, intermittent to 250F), high viscosity instant adhesive that withstands thermal cycling. Cures instantly with TAK PAK Accelerator. Available in kit or as separate items. Can be applied with high speed process equipment. Applications: - Secure wires - Tamperproof settings - Attach capacitors - Repair cracks - Strain relieve leads TAK PAK Accelerator 710: Speeds cure of all TAK PAK adhesives. Contains no salts. Can be sprayed, brushed, or applied with fine felt tip. SWPERBONDER 498 Thermal Cycling Resistant Instant Adhesive: Medium viscosity (700 cp) high temperature (to 223F, intermittent to 250F) instant adhesive with excellent resistance to thermal cycling. SUPERBONDER 499 Gel Instant Adhesive: Thixotopic gel formulation, high temperature (to 223F, intermittent to 250F) instant adhesive formulated for gapfilling, thermal cycling applications. Ultraviolet Curing Adhesives: IMPRUV 349 Optically Clear Adhesive: High viscosity (7,000 cp), one-part adhesive that cures in seconds with 365nm UV light. Excellent, durable bonds for glass, metal, and some thermoplastics. Excellent strength retention after exposure to moisture and humidity. IMPRUV 365 W Adhesive/Sealant: High viscosity (2,000 cp), dual cure (UV and anaerobic) material for bonding, sealing, and deep potting. Also well suited for strain relieving, tamperoofing, and insulating.
Miscellaneous
931
LOCTITE CORP.: Electronic Assembly Aids(Continued): Ultraviolet Curing Adhesives(Continued): IMPRUV 366 General Purpose W Adhesive: Medium viscosity (6,500 cp), dual cure (UV and anaerobic) material for bonding a wide variety of opaque and rigid materials including aluminum, ferrite, ceramic, glass, and many thermoset plastics. LITE-TAK Rapid Curing W Adhesive: LITE-TAK adhesives and sealants cure in seconds with inexpensive, low power ultraviolet lamps. Their high speed cure and uncomplicated process save time and expense in a wide range of terminating, coating, sealing, and securing operations. LITE-TAK 370: Formulated for wire tacking and coil termination. LITE-TAK 375: Versatile material for coating, sealing, and securing applications. Coating: Conformal Coating Products: LOCTITE Offers tough protective coatings that seal printed circuit assemblies against moisture, solvents, and harsh environmental conditions. Applications include military, automotive, and industrial electronics. SHADOWCURE 361: Thick film (.003") spray coating cures rapidly with ultraviolet light. Shadow areas cure completely with unique secondary process. Can be applied with hand-held spray gun or commercially available systems customized to LOCTITE specifications. - 100% strength retention on all common PCB substrates - Qualifies to IPC-CC-830 - Meets MIL-I-46058C, Type UR - Meets stringent automotive under-the-hood specifications LITE-TAK 375: Versatile material for coating, sealing, and securing applications. LITE-TAK 376: Thin viscosity formulated for rapid leveling and thin joints.
932
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Electronic Assembly Aids(Continued): Coating(Continued): Conformal Coating Products(Continued): NUVA-SIL 5088 UV Silicone: This UV/moisture curing silicone is self-leveling, noncorrosive, and certified to USP Class VI requirements. This oroduct cures when exposed to UV light and moisture to a medium strength silicone rubber for-potting, coating, and sealing applications. NUVA-SIL 88 is highly resistant to weather, ozone, and other severe environmental conditions. Typical Uses: Pot/seal/encapsulates: - Electronic connectors - Strain relief of wires and assemblies - Coat printed circuit assemblies - Medical USP Class VI approved - Seal, bond, and coat silicone tubing and devices Surface Mount: Adhesives for Surface Mounted Devices: LOCTITE adhesives for surface mounted devices are fast curing, one-part thixotropic adhesives for bonding surface mounted devices to XBs. Particularly well suited for use with syringe dispensers and pin transfer systems. Packaged to be compatible with the most common chip placement machines. Features: - Stable, one-part product - No stringing on application - Flexible-won't stress components or board - For use on all common chip placement equipment CHIPBONDER 346: Fast curing, with heat and UV, excellent thermal conductivity. CHIPBONDER 347: Heat and UV cured, low viscosity for pin transfer applications. CHIPBONDER 348: Very fast, heat curing, high dot profile. CHIPBONDER 360: Fast curing, heat or UV cure.
Mscellaneous
933
LOCTITE CORP.: Electronic Assembly Aids(Continued): Potting: Potting Products: LOCTITE offers anaerobic, moisture, and UV-curing potting products for a wide range of applications. IMPRUV 363 W Potting Compound: Low viscosity (300~~) compound for shallow potting and thinfilm encapsulating. IMPRUV 365 W Adhesive/Sealant: High viscosity (2,OOOcp), dual cure (UV and anaerobic) material for bonding, sealing, and deep potting. Also well suited for strain relieving, tamperproofing, and insulating. NUVA-SIL 5088 UV Silicone: This UV/moisture curing silicone is self-leveling, non-corrive, and certified to USP Class VI requirements. This product cures when exposed to UV light and moisture to a medium strength silicone rubber for potting, coating, and sealing in electronic applications. NUVA-SIL 88 is highly resistant to weather, ozone, and other severe environmental conditions. NUVA-SIL 5091 UV Silicone: Self-leveling. Cures with UV light and moisture to a med ium strength silicone rubber for potting, coating, and sealing industrial applications. Highly resistant to weather, ozone and other severe environmental conditions. NUVA-SIL 5147 UV Silicone: Cures with UV light and moisture to a high strength silicone rubber for gasketing and sealing applications. Approved for medical applications. Highly resistant to weather, ozone, and other severe environmental conditions. LITE-TAR 375: Versatile material for coating, sealing, and securing applications. LITE-TAR 376: Thin viscosity product formulated for rapid leveling and thin joints.
934
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Electronic Assembly Aids(Continued): Sealing: Sealing Products: IMPRUV 365 W Adhesive/Sealant: High viscosity (2,000 cp), dual cure (UV and anaerobic) material for bonding, sealing, and deep potting. Also well suited for strain relieving, tamperproofing, and insulating. NUVA-SIL 5076 UV Silicone: Cures with UV light to a high strength, low adhesion silicone rubber for gasketing and sealing applications. The uncured product is a non-slumping silicone resin. The cured product resists severe environments including ozone, extreme temperature and solvents. NUVA-SIL 5084 UV Silicone: NUVA-SIL 84 is a non-slumping, non-corrosive UV moisture curing silicone. This product is approved for medical applications (USP Class VI). Upon curing, this product is a high strength silicone rubber used in gasketing and sealing of both medical and electronics applications. NUVA-SIL 84 is highly resistant to weather or ozone and other severe environmental conditions. NUVA-SIL 5088 UV Silicone: This UV/moisture curing silicone is self-leveling, noncorrosive, and certified to USP Class IV requirements. This product cures when exposed to UV light and moisture to a medium strength silicone rubber for potting, coating and sealing applications. NUVA-SIL 88 is highly resistant to weather, ozone, and other severe environmental conditions. NUVA-SIL 5091 UV Silicone: Self-leveling. Cures with UV light and moisture to a medium strength silicone rubber for potting, coating, and sealing industrial applications. Highly resistant to weather, ozone, and other severe environmental conditions. LITE-TAR 376: Thin viscosity sealant formulated for rapid leevling and thin joints.
Miscellaneous
LOCTITE CORP.: Electronic Assembly Aids: Bonding Products Technical Information: 383: Color: Grev Base: Modified Acrylic Viscosity cp: l,OOO,OOO Strength-PSI Shear-Tensile: 2,500 Temperature Range: -65 to 302F (-70 to 15OC) Cure Speed: Fixture: 5 min. Full: 12-24 hrs. Thermal Conductivity: 2.2 Watts/M -C: 0.32 Specific Gravity: 1.50 384: Color: White Base: Modified Acrylic Viscosity cp: 1,000,000 Strength PSI Shear-Tensile: 1,000 Temperature Range: -65 to 302F (-54 to 15OC) Cure Speed: Fixture: 5 min. Full: 12-24 hrs. Thermal Conductivity: 4.6 Watts/M-C: 0.66 Specific Gravity: 1.64 315: Color: Blue Base: Modified Acrylic Viscositv co: 1.000.000 Strength-PSI Shear-Tensile: 1,000 Temperature Ranqe: -65 to 302F (-54 to 15OC) Cure Speed: Fixture: 5 min. Full: 12-24 hrs. Thermal Conductivity: 4.6 Watts/M-C: 0.66 Specific Gravity: 1.66 TAK PAK 444: Color: Clear Base: Cyanoacrylate Ester Viscosity cp: 700 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: 30-60 sec. Full: 24 hrs. Specific Gravity: 1.05 Mil. Spec.: MIL-A-46050C
935
936
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Electronic Assembly Aids: Bonding Products Technical Information(Continued): ULTRA TAK PAK 382: Color: Clear Base: Cyanoacrylate Ester Viscosity cp: 5,000 Strength PSI Shear-Tensile: 3,500 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 10 sec. Full: 24 hrs. Specific Gravity: 1.33 710: Color: Clear Base: FREON TA Viscosity cp: 3 498 :
Color: Clear Base: Ethyl Viscosity cp: 70 Strength PSI Shear-Tensile: 3,000 Temperature Range: -40 to 223F (-40 to 106C) Cure Speed: Fixture: 30-60 sec. Full: 24 hrs. Specific Gravity: 1.05 499:
Color: Clear Base: Ethyl Viscosity cp: Thixo. Gel Strength PSI Shear-Tensile: 3,500 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 60-80 sec. Full: 24 hrs. Specific Gravity: 1.05 365: Color: Clear Base: Modified Acrylic Viscosity cp: 2,000 Strength PSI Shear-Tensile: -65 to 356F (-54 to 18OC) Cure Speed: Fixture: 5-30 sec. Full: 8-24 hrs. Dielectric Strength volts/mil: 850 Specific Gravity: 1.08
Mixellaneous
LOCTITE CORP.: Electronic Assembly Aids: Bonding Products Technical Information(Continued): 366: Color: Amber Base: Modified Acrylic Viscosity cp: 6,500 Strength PSI Shear-Tensile: 4,270 Temperature Range: -65 to 230F (-54 to IIOC) Cure Speed: Fixture: 5-30 sec. Full: 8-24 hrs. Dielectric Strength volts/mil: 630 Specific Gravity: 1.10 370: Color: Clear Base: Modified Ester Viscosity cp: 6,500 Strength PSI Shear-Tensile: 850 Temperature Range: -30 to 266~ (-34 Cure Speed: Fixture: I-IO sec. Dielectric Strength volts/mil: 492 Specific Gravity: 1.10
to
130~2)
349:
Color: Clear Base: Methacrylic Ester Viscosity cp: 7,000 Strength PSI Shear-Tensile: 3,800 Temperature Range: -65 to 266F (-54 to 13OC) Cure Sneed: Fixture: l-8 sec. Dielectric Strength volts/mil: 706 Specific Gravity: 1.02 375: Color: Pale Yellow Base: Modified Acrylic Ester Viscosity cp: 1,000 Temperature Range: -30 to 266~ (-34 to Cure Speed: Fixture: l-5 sec. Dielectric Strength volts/mil: 800 Specific Gravity: 1.10
130~2)
937
938
Adhesives, Sealants and Coatings for the Electronics Industry
CORP.: Electronic Assembly Aids: Coating Products Technical Information:
LOCTITE
361: Color: Clear Base: Modified Acrvlic Specific Gravity: 7.08 Viscosity cp: 300 Tensile-PSI: 2,500 Dielectric Strength volts/mil: 842 Approvals: MIL-I-46058 Type UR IPC-CC-830 UL 746 375: Color: Pale Yellow Base: Modified Acrylic Ester Specific Gravity: 1.10 Cure Speed: l-5 sec. Viscosity cp: 6,000 376: Color: Pale Yellow Base: Modified Acrylic Ester Specific Gravity: 1.10 Cure Speed: l-5 sec. Viscosity cp: 1,000 Dielectric Strength volts/mil: 850 NUVA-SIL
5088:
Color: Straw Base: UV Methoxy Specific Gravity: 1.04 Viscosity cp: 50,000 Tensile-PSI: 200 Dielectric Strength volts/mil: 1,000 Approvals: USP Class VI
Miscellaneous
LOCTITE CORP.: Electronic Assembly Aids: Potting Products Technical Information: 363: Color: Clear Base: Modified Acrylic Ester Viscosity cp: 300 Strensth PSI Tensile-Shear: 3,200 TempeGature Range: -65 to 3563 (-54 to 18OC) Cure Speed (UV): S-30 sec. Dielectric Strength volts/mil: 850 Specific Gravity: 1.08 365: Color: Clear Base: Modified Acrylic Ester Viscosity cp: 2,000 Strength PSI Tensile-Shear: 3,240 Temperature Range: -65 to 356F (-54 to 18OC) Cure Speed (UV): 5-30 sec. Dielectric Strength volts/mil: 850 Specific Gravity: 1.08 NUVA-SIL 5091: Color: Translucent Base: UV/Acetoxy Viscosity (cp): 5,500 Strength PSI Tensile-Shear: 100 Temperature Range: -65 to 500F (-54 to 26OC) Dielectric Strength volts/mil: 850 Specific Gravity: 1.01 NUVA-SIL 5147: Color: Translucent Base: UV/Acetoxy Viscosity cp: 7,000 Strencrth PSI Tensile-Shear: 100 Temperature Range: -65 to 500F (-54 to 26OC) Dielectric Strength volts/mil: 850 Specific Gravity: 1.01 NUVA-SIL 5088: Color: Straw Base: UVjMethoxy Viscosity cp: 50,000 Strencth PSI Tensile-Shear: 200 Tempegature Range: -65 to 500F (-54 to 26OC) Dielectric Strength volts/mil: 850 Specific Gravity: 1.04
939
940
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Electronic Assembly Aids: Potting Products Technical Information(Continued): 375: Color: Pure Yellow Base: Modified Acrylic Ester Viscosity cp: 6,000 Cure Speed (UV): l-5 sec. Dielectric Strength volts/mil: 800 Specific Gravity: 1.10 376: Color: Pale Yellow Base: Modified Acrylic Ester Cure Speed (UV): l-5 sec. Dielectric Strength volts/mil: 800 Specific Gravity: 1.10 Sealing Products Technical Information: 365: Color: Clear Ease: Modified Acrylic Ester Viscositv cw: 2,000 Strength-PSI Tensile-Shear: 3,240 Temperature Range: 5 to 356F (1 to 18OC) Cure Speed (UV): 30 sec. NWA-SIL 5076: Color: Milky White Base: UV Strength PSI Tensile-Shear: 550 Temperature Range: -65 to 500F (-54 to 26OC) Cure Speed (UV): tack free 35 sec. Approvals: USP Class VI NUVA-SIL 5084: Color: Transparent Yellow Base: W/Methoxy Strength PSI Tensile-Shear: 550 Temperature Range: -65 to 500F (-54 to 26OC) Cure Speed (UV): tack free 15 sec. Approvals: USP Class VI
Miscellaneous
LOCTITE CORP.: Electronic Assembly Aids: Sealing Products Technical Information(Continued): NWA-SIL 5088: Color: Straw Base: W/Methoxy Viscosity cp: 50,000 Strencrth PSI Tensile-Shear: 200 Temperature Range: -65 to 500F (-54 to 26OC) Cure Speed (UV): tack free 25 sec. Approvals: USP Class VI NUVA-SIL 5091: Color: Translucent Base: W/Acetoxy Viscosity cp: 5,500 Strenoth PSI Tensile-Shear: 100 Dielectric Strength volts/mil: 850 Temperature Range: -65 to 500F (-54 to 26OC) Specific Gravity: 1.01 375: Color: Pale Yellow Base: Modified Acrylic Ester Viscosity cp: 6,000 Dielectric Strength volts/mil: 800 Cure Speed (UV): l-5 sec. Specific Gravity: 1.10 376: Color: Pale Yellow Base: Modified Acrylic Ester Viscosity cp: 1,000 Dielectric Strength volts/mil: 800 Cure Speed (W): l-5 sec. Specific Gravity: 1.10
941
942
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Electronic Assembly Aids: Surface Mount Products Technical Information: 346: Color: Pink Base: Methacylate ester Viscosity cp: 265,000 Cure Speed: Fixture: 30 sec. Full: 5 min. Dielectric Strength volts lm il: 1,700 347: Color: Pink Base: Methacylate ester Viscosity cp: 140,000 Cure Speed: Fixture: 30 sec. Full: 5 min. Dielectric Strength volts/mil: 1,700 348: Color: Orange Base Resin: Epoxy resin Viscosity cp: 1,400,OOO Cure Speed: Fixture: 30 sec. Full: 5 min. Dielectric Strength volts/mil: 540 360: Color: Pink Base: Methacrylate ester Viscosity cp: 275,000 Cure Speed: Fixture: 30 sec. Full: 5 min. Dielectric Strength volts/mil: 1,693
Miscellaneous
943
LOCTITE CORP.: Solvents, Primers, and Activators: Loctite offers a selection of job-specific solvents, primers, and activators--all developed to assure maximum performance from LOCTITE products. LOCTITE solvents prepare surfaces for bonding by effectively removing contaminants. LOCTITE primers speed the cure of LOCTITE anaerobic products, and allow anaerobic products to be used on inactive materials. LOCTITE activators initiate the cure of LOCTITE engineering adhesives. Safety Solvent 755: LOCTITE Safety Solvent is a general purpose, industrial cleaning solvent. Ideal for preparing surfaces prior to using all LOCTITE adhesives and sealants. Removes all traces of grease and oils, and leaves no residue. Ideal for delicate instruments and precision parts. Safety Solvent is nonflammable and low in toxicity. LOCQUIC Primers/Activators: LOCQUIC Primers are specially engineered curing agents for LOCTITE adhesives and sealants. The activators increase the cure speed and gap filling capability of LOCTITE products and insure proper curing on inactive surfaces. LOCQUIC Primer N: General purpose primer. Fixture time is 5-30 minutes. Full cure in 24 hours or less. Meets Military Specification MIL-S-22473E. Primes: - LOCTITE Pipe Sealants - LOCTITE Gasketing - LOCTITE SPEEDBONDER 326 - LOCTITE Retaining Compounds - LOCTITE Threadlockers LOCQUIC Primer T: Fast-curing primer. Fixtures in 5 minutes. Full cure in 6 hours or less. Meets Military Specification MIL-S-22473E. Primes: - LOCTITE Threadlockers - LOCTITE Retaining Compounds' - LOCTITE Pipe Sealants LOCQUIC Primer NF 736: Very fast curing primer. Fixtures in 15-30 seconds. Full cure in 4 hours or less. Primes: - LOCTITE Threadlockers - LOCTITE Retaining Compounds - LOCTITE Sealants
944
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Solvents, Primers, and Activators(Continued): LOCQUIC Activator 707: Designed for use with SPEEDBONDER adhesives 324 and 325. Fixtures in 2-10 minutes. Full cure in 3-12 hours. DEPEND Activator 738: Initiates cure of DEPEND Adhesive. LOCQUIC Activator 792: Designed for use with SPEEDBONDER Adhesive 392. Fixtures in less than one minute. Full cure in 24 hours. TAK PAK Accelerator 710: Speeds cure of all TAK PAK Adhesives. Contains no salts. Can be sprayed, brushed or applied with fine felt tip. Accelerator 711: Speeds cure of instant adhesives. X-NMS Clean-Up Solvent for Instant Adhesives: Use X-NMS Clean-Up Solvent to quickly and safely dissolve cured cyanoacrylate-based adhesives in between parts, on surfaces, or on clothing.
Miscellaneous
LOCTITE CORP.: Solvents, Primers, and Activators(Continued): Solvents and Primers Technical Information: Safetv Solvent 755: coior: Clear Solvent Base: Trichloroethane Viscosity cp: 4 Flash Point: None Specific Gravity: 1.35 Toxicity (TLV): 350 ppm Primer N 764: Color: Green Solvent Base: Trichloroethane Viscosity cp: 3 Flash Point: None Specific Gravity: 1.30 Toxicity (TLV): 350 ppm On-Part Life: 1 Month Primer T 747: Color: Yellow Solvent Base: Trichloroethane Isop. Alch. Viscosity cp: 3 Flash Point: 147F Specific Gravity: 1.30 Toxicity (TLV): 350 ppm On-Part Life: 1 Week Primer NF 736: Color: Brown Solvent Base: Trichloroethylene Isoo. Alch. Viscosity cp: 3 _ Flash Point: 168F Specific Gravity: 1.30 Toxicity (TLV): 50 ppm On-Part Life: 30 Minutes X-NMS Clean-Up Solvent 768: Color: Clear Solvent Base: Nitromethane blend Viscosity cp: 1.5 Flash Point: 95F Toxicity (TLV): 100 ppm
945
946
Adhesives, Sealants and Coatings for the Electronics Industry
LOCTITE CORP.: Solvents, Primers, and Acti.vators(Continued): Activators Technical Information: Activator 107: Color: Amber Solvent Base: Trichloroethane Viscosity cp: 3 Flash Point: None Specific Gravity: 1.20 Toxicity (TLV): 350 ppm On-Part Life: 2 Hours Activator 738: Color: Amber Solvent Base: l,l,l Trichloroethane Isop. Alch. Viscosity cp: 3 Flash Point: None Specific Gravity: 1.30 Toxicity (TLV): 350 ppm On-Part Life: 2 Hours Activator 792: Color: Yellow Solvent Base: l,l,l Trichloroethane Viscositv co: 3 Flash Po'lnti None Specific Gravity: 1.30 Toxicity (TLV): 350 ppm On-Part Life: 2 Hours Activator 710: Color: Clear Solvent Base: FREON TA Viscosity cp: 3 Flash Point: None Specific Gravitv: 1.40 Toxicity (TLV):-900 ppm On-Part Life: 4 seconds Activator 711: Color: Clear Solvent Base: l,l,l Trichloroethane Viscosity cp: l-5 Flash Point: None Specific Gravity: 1.30 Toxicity (TLV): 350 ppm On-Part Life: 72 Hours
Miscellaneous
947
MAVIDON CORP.: SG 21 Thermal Grease: MAVIDON SG 21 is a one component thermally conductive grease featuring high electrical insulation and high dielectric strenqth. SG 21 will not dry out or sag after long exposure at elevated temperatures. It is used to provide heat transfer or heat dissipation between substrates. Typical applications include heat sinks in power resistors and semi-conductor devices. Physical Characteristics: Appearance: Smooth White Paste Specific Gravity: 2.31 Dielectric Strength: 300 volts/mil Bleed (% after 24 hours at 2OOC): 0.0 Weight Loss (% after 24 hours at 2OOC): 0.3 Thermal conductivity (BTU/hr ft 2 in): 5.2 Operating Temperature: -40 to 200C Q-MAX A-27 RF Lacquer: A specifically designed coating and impregnating material for use in VHF-UHF TV circuits and any applications where changes in RF are critical. "Q-MAX" can also be used for bonding and ruggedizing components. It's low dielectric constant and excellent high freauencv insulating characteristics make "Q-MAX" an exceptional product for all high frequency applications. "Q-MAX" does contain a fungicide enabling the product to be used in any environment - particularly high temperature - high humidity conditions. Description: Physical Properties: Viscosity: 500-800 cps Color: amber Solids content: 30-358 Specific Gravity: .950 Weight per gal.: 7.95 lbs/gal Electrical Properties: Surface resistivity: 1.73 x 10 14 ohms Volume resistivity: 7.42 x 10 14 ohms-cm Dielectric strength: 1900 vpm Dielectric constant: 2.53 Softening temperature: 240F Flash point: 76F Cure Time: 30 minutes at room temperature or 15 minutes at 140F Drying Time: Air drying of the lacquer film may be satisfactory in many cases. When several coats are to be applied, oven drying is recommended.
948
Adhesives, Sealants and Coatings for the Electronics Industry
MERECO DIVISION: META-GEL 156 Epoxy Dip Compound: Thixotropic, non-sag, resilient epoxy dip compound for thin film coatings META-GEL 156 is a 100% solids epoxy coating compound developed specifically to combine all of the superior electrical and physical characteristics of the META-GEL Series, and yet provide a dipping material of moderate viscosity for thin film applications. META-GEL 156 contains no chain stopping mono-epoxide reactive diluents to degrade physical properties. When catalyzed with MERECO Hardener 16 NEW FAST, the useable pot-life is in excess of 8 hours and the highly thixotropic liquid dips easily to produce a sag-free coating. META-GEL 156 is quickly converted to a tough, inflexible, enamel-like envelope. The moderate temperature cure schedule (90 minutes at 85C) permits successful dip coating of heat sensitive electronic components such as rectifiers, styrene film and paper capacitors, solid state devices, orecision film and ovrolvtic denoosited film resistors, and multiple assemblies-containing low melting solders and thermoplastics. META-GEL 156 is particularly well suited to coating chokes, coils, transformers, and wirewound resistors. Typical Properties: META-GEL 156: Appearance: Opaque Form: Thixotropic liquid Specific Gravity (25/25(C): 1.3 Viscosity (25C), cP: 60,000 MERECO Hardener 16 New Fast: Appearance: Translucent Form: Thin liquid Specific Gravity (25/25C): 1.0 Viscosity (25C), cP: 200 Fully Cured META-GEL 156 Coatings: Specific Gravity: 1.31 Operating Temperature Range, C: -60 to +170 Heat Distortion Temperature, C: 96 Thermal Shock (-55 to +165C): Passes Hardness: 40 Linear Expansion Coefficient, /C: 3.0 x 10 -15 Moisture Absorprtion (24 hr. dmmersion), %: 0.03 Compressive Strength, psi: 22,000 Flexural Strength, psi: 23,000 Impact Resistance, ft-lb/inch notch: 0.6 Volume Resistivitv. ohm-cm: 5 x 10 12 Dielectric Constant (1000 Hz): 5.1 Dielectric Strenqth, volts/mil: 400 Power Factor (1000 Hz): 0.02 Epoxy Value, eq/lOOg: 0.355
Miscellaneous
NATIONAL STARCH AND CHEMICAL CORP.: THERMID EL-5000 Series: Spin Coatable Polyimides: Features: High Solids/Low Viscosity Benefits: High Planarization Features: Superior Surface Wetting Benefits: Excellent Adhesion Features: Low Moisture Pickup Benefits: Low Dielectric Constant EL-5010: Viscosity/% Solids: 1500 ~~~135% @ 25C Filtration (microns): 0.5 General purpose formulation. Suggested for passivation coating and as an interlayer dielectric; K of 3.2 @ 10 KHz. Excellent planarization. Will adhere direct to microcircuitry oxides and nitrides; also excellent intercoat adhesion. Recommended for spin coating: at as-recieved viscosity, will deposit 15 microns and can be varied to 1 micron with dilution. EL-5501: Viscosity/% Solids: 1000 cps/53% @ 25C Filtration (microns): 0.5 Fluorinated polyimide formulation. Suggested for passivation coating and as an interlayer dielectric. Forms a rigid, low interfacial stress film having a high Tg and modulus with superior solvent resistance. K of 2.8 @ 10 KHz and low moisture absorption. Excellent adhesion and planarization. EL-5512: Viscosity/% Solids: 1100 cps/47% @ 25C Filtration (microns): 0.5 Fluorinated polyimide formulation. Suggested for same applications as EL-5501. Forms solvent resistant film with good tensile properties. K of 2.8 @ 10 KHz and low moisture absorption. Excellent planarization and adhesion. Both EL-5501 and EL-5512 are recommended for spin coating; at as-received viscosity, will deposit 15 microns and can be varied to 1 micron with dilution.
949
950
Adhesives, Sealants and Coatings for the Electronics Industry
NATIONAL STARCH AND CHEMICAL CORP.: THERMID EL-5000 Series: Spin Coatable Polyimides (Continued): EL-5330: Viscosity/% Solids: 980 cps/24% 8 25C Filtration (microns): 0.2 Suggested as alpha particle barrier and for heavy deposition protective applications. K of 3.2 8 IO KHz. Excellent adhesion. Recommended for syringe application on DRAM IC chips. Suggested Cure Schedule for all THERMID EL formulations (in nitrogen or air): Soft bake @ 180C for 30 min. Bake @ 300C for 60 min. Post-cure 400C for 15 min. Ancillary Products: Polyimide thinner T-310: Can be used to thin THERMID EL-5010, THERMID EL-5501 and THERMID EL-5512. Thinner is filtered to 0.2 micron. T-330: Can be used to thin THERMID EL-5330. Thinner is filtered to 0.2 microns. Adhesion Promoter AP-20: Aminosilane adhesion promoter recommended for use on silicon, glass, quartz, nitride and various other surfaces. Suggested for use with all THERMID EL series products.
Miscellaneous
951
NATIONAL STARCH AND CHEMICAL CORP.: THERMID Paste EL-9410: THERMID PASTE EL-9410 is a screen-printable fluorinated polyimide based paste designed primarily to provide environmental and mechanical protection to planar electronic devices such as hybrid circuits and wafers. When properly applied and cured, THERMID PASTE EL-9410 will yield a glossy, "see-through," heat resistant encapsulant coating. This material has excellent room temperature storage stability and screen pot life. Processing: Screen: 200 mesh stainless steel, 2.1 mil wire Emulsion: Special emulsion materials are not required; a 3-4 mil emulsion thickness will yield a 2-3 mil cured film. Squeegee speed: 1.5 cm/set. Flood speed: 2.0 cm/set. Squeegee pressure: 18 psi/5 in. wide, 55 Durometer squeegee Screen-to-substrate distance ("Snap-off"): 2.5 mm Dry/Cure Schedule (C): 100: 60 min. 100-190: lO/min 190: 30 min. soak 190-275: lO/min. 275: 30 min. soak Typical Paste Properties: Viscosity: 80K cps Polyimide content: 62% Pot life: Capable of consistent printing after 8 continuous hours on a screen. Solvent: Tetraglyme Shelf life: 6 months at room temperature Multilayer capability: Capable of multilayer printing in a print/dry/cure, print/dry/cure sequence Typical Cured Film Properties: * Color: Yellow-brown, transparent Coeff. of Thermal Expansion (below Tg): 35 in/in/C Hardness (Shore D): 75 Cation-Anion Analysis: Cl- t5 ppm Na+ c.5ppm K+ (5 ppm Glass Transition Temperature (Tg): 260C Degradation Temperature (dynamic TGA): 590C Dielectric Constant (@ 30 MHz): 2.9 Loss Tangent (@ 30 MHz): 0.004 * Measurements on base resin
952
Adhesives, Sealants and Coatings for the Electronics Industry
NATIONAL STARCH AND CHEMICAL CORP.: THERMID PASTE EL-9411: For Superior Hybrid Microcircuitry Protection: THERMID PASTE EL-9411 is a screen-printable formulation designed primarily for depositing on specific areas of electronic devices to provide environmental or mechanical protection. After proper application and cure, EL-9411 is sufficiently translucent to permit inspection of underlying circuitry. EL-9411 is well suited to application on both thick and thin film hybrids. Unique Features and Benefits: * See-through - Visual Inspection * Pinhole-free - Superior Protection * Low K - Faster Signal Speed Print Processing: Screen: 200 mesh stainless steel, 2.1 mil wire Emulsion: Special emulsion materials are not required; a 3-4 mil emulsion thickness will yield a 2-3 mil cured film. Squeegee speed: 5-10 cm/set. Flood speed: 2.0 cm/set. Squeegee pressure: 18 psi/5 in. wide, 55 Durometer squeegee Screen-to-substrate distance ("Snap-off"): 50 mils Dry/Cure Schedule (C): (Based on 1 mil cured film) 80-190: 5C/min. 190-275: 2/min. 275: 10 min. soak Typical Paste Properties: Rheology: 200K cps @ 1 rpm, 50K cps @ 10 rpm Pot life: Capable of consistent printing after 8 continuous hours on a screen Solvent: Tetraglyme Shelf life: 6 months at room temperature Multilayer capability: Capable of multilayer printing in a print/dry/cure, print/dry/cure sequence. Typical Cured Film Properties: Color: Yellow/Brown, translucent Coefficient of thermal expansion (TMA): 15 u/m - C Glass transition temp. (Tg): 260C Degradation temp. (dynamic TGA): 590C Cation-Anion analysis: Cl- (5 ppm Na+ t5 ppm K+ (5 ppm Dielectric constant (@ 30 MHz): 2.9 Loss tangent (@ 30 MHz): 0.004 Thermal resistance: No failures--- Solder pot to liquid N2, 3 cycles -- 3OOC, 100 hrs -- 45OC, 1 min
Miscellaneow
953
PACER TECHNOLOGY: Accelerators, Primers, Debonder and Protective Hand Cream: Premium Grade Accelerator: Fastest acting grade cures and sets cyanoacrylate adhesive quickly. Use Premium Grade accelerator where you need the fastest cure possible. If using accelerator to speed the setting time of an adhesive, simply spray accelerator on one surface, apply a cyanoacrylate adhesive to the other side and mate the two surfaces. Accelerator can also be used in post application to cure fillets or small potting applications. All PACER Accelerators are FREON free. Standard Grade Accelerator: Use Standard Grade Accelerator when the premium grade is too fast for your application. See above for application techniques. Low Bloom Accelerator: Slowest acting grade cures/sets very slowly (it does not generate the exothermic heat and reduces whitening action sometimes called "blooming" or chlorosis). See above for application techniques. Adhesion Promoter: Adhesion Promoter is used to maximize bond strength when bonding with cyanoacrylates. Apply to one or both surfaces for best surface preparation. Cleaning Solvent: Cleaning Solvent cleans precision parts such as tools, bearings, races, gears, electric motors, condensers, controls and other parts that are to be bonded or cleaned. Cleaning Solvent contains no chlorofluorocarbon compounds harmful to the environment. Primer T: Primer T should metal surfaces for Sealants. Primer T filling ability of cyanoacrylates.)
be used to clean metal parts and prepare assembly using PACER Anaerobic Adhesive/ will increase cure speed and increase gap anaerobic compounds. (Not for use with
X-7 DEBONDER: Excellent for the removal of cyanoacrylate adhesive. Does not dissolve adhesive. Simply allow 20-30 seconds to soften and wipe away with a cloth or brush. X-7 DEBONDER is safe on most plastics, metals, fabrics, clothing dyes and work surfaces. Suggest small trial area prior to general use. PRO-TECH Skin Barrier Cream: PROTECH Skin Barrier Cream is used to protect skin from direct absorption of harmful contamination. It provides easy removal of adhesives, paints, etc. It helps reduce skin bonding from cyanoacrylate adhesive.
954
Adhesives, Sealants and Coatings for the Electronics Industry
PACER TECHNOLOGY: Accelerators, Primers, Debonder and Protective Hand Cream (Continued): Premium: Amber Base: Trichlorethane Viscosity: 5 cps Flash Point: Non-flammable Specific Gravity: 1.26 Standard: Amber Base: Trichloroethane Viscositv: 5 cas Flash Point: Non-flammable Specific Gravity: 1.26 Low Bloom: Amber Base: Trichloroethane Viscosity: 5 cps Flash Point: Non-flammable Specific Gravity: 1.26 Adhesion Promoter: Clear Base: Isopropanol Viscosity: 5 cps Flash Point: TCC 53F Specific Gravity: 0.793 Cleaning Solvent: Amber Base: Trichloroethane Viscosity: 5 cps Flash Point: Non-flammable Specific Gravity: 1.26 Primer T: Clear Base: Trichloroethane Viscosity: 5 cps Flash Point: Non-flammable Specific Gravity: 1.30 X-7 DEBONDER: Clear Base: Acetone Viscosity: IO cps Flash Point: PMCC 79F Specific Gravity: 0.85 PRO-TECH: Pink Base: Water Viscosity: Cream Flash Point: Non-flammable Specific Gravity: 1.02
A4iscellaneous
955
PIERCE & STEVENS INDUSTRIAL GROUP: Products for the Electronics Industry: P&S Emission Binder C1710A: P&S C1710A is a solution of high viscosity nitrocellulose, dissolved in a combination of high nuritv solvents. It acts as a suspending agent and binder for the metallic compounds used in the spray or dip coating of cathodes for electronic tubes. Uniformity Control: Recognizing the vital importance that the binders perform in producing satisfactory performance of cathodes, they are rigidly tested and filtered before shipment to insure complete conformance to established physical and working property specifications. They feature minimal ash residue and excellent "burnoff" qualities. Typical Physical & Application Data: Non-Volatile Content: 2.7% Viscosity @ 77F. (25C.): 50 cps. Weight/Gal. @ 77F. (25C.j: 7.35 lbs. Appearance: Clear, free from suspended matter Color: 1 G.H. Reducer-Cleaner: Methyl Ethyl Ketone Application Method: Spray or dip P&S External Black Conductive Coating C3010: C3010 is a solvent type, flammable, fast air drying, electrically conductive coating, formulated for maximum moisture resistance and low ohmic resistance. Typical Physical & Application Data: Non-Volatile Content: 28% Viscosity @ 77F. (25C.j: 95 cps. Weight/Gal. @ 77F. (25C.j: 8.0 lbs. Ohmic Resistance (Ohms per Linear Inch): 125 Dry Film Thickness (Per Coat in Mils): 1.0-1.5 DOT Classification: Red Label Reducer/Cleaner: Acetone Application Method: Spray - DeVilbiss MBC Gun, #704 air cap, FF fluid tip (or equivalent). Suggested air pressure 50-60 lbs., fluid pressure lo-15 lbs. Airless spray equipment can also be utilized.
956
Adhesives, Sealants and Coatings for the Electronics Industry
PIERCE & STEVENS INDUSTRIAL GROUP: Products for the Electronics Industry(Continued): P&S Aluminizing Coating E9802: For the interior aluminizing of color television tubes. E9802 permits the aluminum film to be deposited uniformly on the phosphor coated tube face. Features minimal ash residue. Typical Physical & Application Data: Non-Volatile Content: 3.2% Viscosity @ 77F. (25C.j: 2.0 cps. Weight/Gal. @ 77F. (25C.j: 7.2 lbs. R.I. at 25C.: 1.4648 Liquid Clarity: Crystal Clear Acidity (% as acetic): 0.01 Reducer/Cleaner: Toluene Application: Spray or flush P&S Frit Vehicle F1016A: For Color Television Tubes P&S F1016A is a solution of high viscosity nitrocellulose dissolved in high purity solvent. It is functional as a suspending agent and binder for the frit used in welding the face plate to the funnel of color TV tubes. Uniformity Control: Recognizing the vital importance that the lacquer performs in producing satisfactory welds, it is rigidly tested and filtered before shipment to assure complete conformance to established physical and working property specifications. It features minimal ash residue and excellent "burn-off" qualities. Typical Physical Data: Non-Volatile Content: 1.3% Viscosity @ 77F. (25C.j: 50 cps. Weight/Gal. @ 77F. (25C.j: 7.3 lbs. Appearance: Clear, free from suspended matter. ALPHA 30 MAX. Dot Classification: Red Label Reducer: Amy1 Acetate, if required Cleaner: Methyl Ethyl Ketone
Miscellaneous
957
PRODUCTS RESEARCH & CHEMICAL CORP.: P/S 775 Polyurethane Primer: P/S 776 is a primer designed for use with PRC polyurethane electrical potting and molding compounds where adhesion to neoprene, vinyl and other plastic surfaces is required. Description: P/S 776 is a two-part polyurethane primer which may be applied by spray or brush. P/S 775 offers good oil and water resistance, is elastomeric for bonding to elastomeric systems, and can be thinned with MEK for spray application. Application Properties: Color: Clear Amber Mixing Ratio: Part A: Part B by weight: 6O:lOO by volume: 54:lOO Viscosity, mixed, poise: Less than 500 NVM, freshly mixed, %: 25 Application Life (at 75F, 50% RH), hours: 8 Cure Time (at 75F, 50% RH), hours: 1/2 Performance Properties: Specific Gravity (Mixed): .089 Service Temperatures, F: -65 to 250 PRODUCTS RESEARCH & CHEMICAL CORP.: P/S 776 Polyurethane Primer: Use: P/S 776 is a metal primer designed for use with PRC polyurethane electrical potting and molding compounds. Description: P/S 776 is a two-part, corrosion inhibiting, urethane metal primer, which may be applied by spray or brush. Application Properties: Color: Yellow Mixing Ratio: Part A:Part B 3O:lOO by weight: by volume: 3O:lOO Viscosity, mixed, poise: Less than 100 NVM, freshly mixed, %: 30 Application Life (at 75F, 50% RH), hours: 6 Cure Time (at 75F, 50% RH), hours: l/2
958
Adhesives, Sealants and Coatings for the Electronics Industry
QUADRANT CHEMICAL CORP.: Automotive Electronics/Automotive Computers: A-2191F:B-2192F: Function: High Energy Ignition Coil Mix Ratio By Weight: 100:30 Gel Time 100 Gm. @ 25C: 12-18 Hours Cured Form: Rigid Cure Schedule: 8-12 Hrs. @ IOOC. Filled: Yes No Viscosity Cps @ 25C.: lO,OOO-25,000 80-180 Color: Grey Clear Vacuum grade for potting ignition coils
under vacuum
A-2161:B-2161: Function: Electronic Ignition Voltage Regulator Mix Ratio by Weight: 48 52 Gel Time: 100 Gm. @ 25C: 12-18 Hours Cured Form: Flexible Cure Schedule: 2 Hrs. @ IOOC. Filled: No No Viscosity Cps @ 25C.: l,OOO-2,400 2,000-5,000 Color: Clear Green Flexible system for sand filled modules A-2354:B-2355: Function: Electronic Ignition Voltage Regulator Mix Ratio By Weight: 100 30 Gel Time 100 Gm. @ 25C.: 12-18 Hours Cured Form: Rigid Cure Schedule: 2-4 Hrs. @ 1OOC. Filled: Yes No Viscosity Cps @ 25C: 70,000-110,000 80-180 Color: Black Clear Vacuum grade for potting ignition coils under vacuum
Miscellaneous
QUADRANT CHEMICAL CORP.: Automotive Electronics/Automotive Computers(Continued): A-2369/B-2370: Function: High Energy Multi-Ignition Coil Mix Ratio By Weight: 100:30 Gel Time 100 Gm. @ 25C.: 12-18 Hours Cured Form: Rigid Cure Schedule: 8-12 Hrs. @ IOOC. Filled: Yes No Viscosity Cps B 25C.: 10.000-25.000 801180 ’ Color: Grey Clear Vacuum grade for potting ignition coils under vacuum U-2359/P-2360: Function: Electronic Ignition Voltage Regulator Mix Ratio By Weight: 100:355 Gel Time 100 Gm. @ 25C.: 60 Min. Cured Form: Flexible Cure Schedule: Room Temp. 24 Hrs. or 30 Min. @ 180F. Filled: No No Viscosity Cps @ 25C: 5,000-12,000 1,500- 2,500 Color: Brown Clear Class H (18OC) Polyurethane system High thermal good water resistance. U-2363/P-2364: Function: Urethane Electronic Ignition Voltage Regulator Mix Ratio By Weight: 30:70 Gel Time: 100 Gm. @ 25C: 30 Min. Cured Form: Flexible Cure Schedule: Room Temp. 24 Hrs. or 30 Min. @ 180F. Filled: No No Viscosity Cps @ 25C: 50-150 600-1,000 Color: Tan Black Room temperature cure-Flexible potting system-high thermal shock
959
960
Adhesives, Sealants and Coatings for the Electronics Industry
QUADRANT CHEMICAL CORP.: High Voltage Electronic Transformer: A-2249-VO/B-2250: Function: Flyback or Trippler (UL) V-O @ 3/16 Mix Ratio By Weight: 100:12.5 Gel Time: 100 Gm. @ 25C.: 25 Min. Cured Form: Rigid Cure Schedule: 1 Hr. @ 85C. Filled: Yes NO
Viscosity Cps @ 25C.: 30,000-60,000 20-30 Color: Cream Blue Television industry-vacuum grade and general electrical grade potting A-2288/B-2289: Function: Integrated High Voltage Transformer Mix Ratio By Weight: 100 70 Gel Time 100 Gm. @ 25C: Days Cured Film: Rigid Cure Schedule: 2-3 Hrs. @ 1OOC. Filled: Yes
(UL) VO @ l/2
Yes
Viscosity Cps @ 25C.: 90,000-200,000 2,000- 9,000 Color: Black Cream Television industry-vacuum grade and general electrical grade potting A-2278-VO BK/B-2279: Function: Integrated High Voltage Transformer (UL) V-O @ l/8 Mix Ratio By Weight: 100:27.5 Gel Time: 100 Gm; @ 25C: Davs Cured Form: Rigid Cure Schedule: 2-3 Hrs. @ IOOC. Filled: Yes No Viscosity Cps @ 25C.: 75,000-150,000 loo-250 Color: Black Clear Television industry-vacuum grade and general electrical grade potting
Miscellaneous
961
QUADRANT CHEMICAL CORP.: High Voltage Electronic Transformer (Continued): A-2238-VO/B-2250: Function: Flyback or Trippler (UL) V-O @ l/4 Mix Ratio By Weight: 100:9.4 Gel Time: 100 Gm. @ 25C.: 60 Min. Cured Form: Rigid Cure Schedule: 1 Hr. @ 85C Filled: Yes No Viscosity Cps @ 25C.: 200,000-400,000 20-30 Color: Cream Blue Television industry-vacuum grade and general electrical grade potting A-2200-VO/B-2201-VO: Functions: Integrated High Voltage Transformer (UL) V-O @ l/8 Mix Ratio By Weight: 100:100 Gel Time: 100 Gm. @ 25C: Days Cured Form: Rigid Cure Schedule: 2-3 Hrs. @ IOOC. Filled: Yes Yes Viscosity Cps @ 25C.: lO,OOO-25,000 lO,OOO-25,000 Color: Cream Cream Television industry-vacuum grade and general electrical grade potting A-2292/B-2293: Integrated High Voltage Transformer (UL) HE Mix Ratio By Weight: 100:93 Gel Time: 100 Gm. @ 25C: Days Cured Form: Rigid Cure Schedule: 2-3 Hrs @ 105C Filled: Yes Yes Viscosity Cps 8 25C.: 12,000-45,000 12,000-45,000 Color: Cream Cream Television industry-vacuum grade and general electrical grade potting.
962
Adhesives,
Sealants
and Coatings for the Electronics
Industy
QUADRANT CHEMICAL CORP.: Marine Coil and Ignition: U-2324/P-2325: Function: Urethane-Vacuum Grade Electronic Ignition Mix Ratio By Weight: 100:170 Gel Time: 100 Gm. @ 25C: 2 Hours Cured Form: Flexible Cure Schedule: 2 Hrs. @ 85C Filled: No No Viscosity Cps @ 25C.: l,lOO-1,500 80-150 Color: Yellow Green High thermal shock-low stress A-7162/B-7162 SF: Function: Vacuum Grade Coil Impregnation Mix Ratio By Weight: 100:330 Gel Time: 100 Gm. @ 25C: Days Cured Form: Semi-Flexible _ Cure Schedule: 12 Hrs. @ 85C. Filled: No Yes Viscosity Cps @ 25C.: 7,000-9,000 8,000-24,000 Color: Black Tan High thermal shock-medium stress A-2319-M/B-2320-M: Function: Vacuum Grade Coil Impregnation Mix Ratio By Weight: 100:115 Gel Time: 100 Gm. @ 25C.: Days Cured Form: Rigid Cure Schedule: 2 Hrs. @ IIOC. Filled: Yes Yes Viscosity Cps @ 25C.: 4,000-12,000 3,000- 6,000 Color: Blue Tan High impact coil impregnation
Miscellaneous
QUADRANT CHEMICAL CORP.: Telecommunications/General and Casting:
Potting
A-2379:B-2380: Function: High Temperature Electrical Mix Ratio By Weight: 100:8 Gel Time: 100 Gm. @ 25C.: 2 Hours Cured Form: Rigid Cure Schedule: 2 Hrs. @ 12OC. Filled: Yes NO
Viscosity Cps 8 25C.: lOO,OOO-220,000 l,OOO-2,000 Color: Black Brown High thermal conductivity Class H (18OC) Non-toxic aromatic diamine based A-2344:B-2345: Function: Optically Transparent Mix Ratio Bv Weight: 1OO:~OO Gel Time: 100 Gm: @ 25C.: Days Cured Form: Rigid Cure Schedule:~l Hr. @ 120C. Filled: No No Viscosity Cps 8 25C.: 6,500-9,500 150- 400 Color: Clear Clear L.E.D. Coating system-Water white heat cure-Transparent A-2390:B-2391: Function: High Thermal Conductive Epoxy Mix Ratio By Weight: 100:7 Gel Time: 100 Gm. @ 25C.:.60 Min. Cured Form: Rigid Cure Schedule: Room Temp. 24 Hrs. or 30 Min. @ 180F. Filled: Yes No Viscosity: Cps @ 25C: 50,000-80,000 20-50 Color: Blue Clear Submersible pump casting resin
963
964
Adhesives, Sealants and Coatings for the Electronics Industty
QUADRANT CHEMICAL CORP.: Telecommunications/General and Casting(Continued):
Potting
A-2314-BK/B-2079: Function: Electrical Grade General Potting Mix Ratio By Weight: 100:25 Gel Time: 100 Gm. @ 25C.: 2 Hours Cured Form: Rigid Cure Schedule: Room Temp. 24 Hrs. or 30 Min. @ ISOF. Filled: Yes No Viscosity Cps @ 25C: 16,000-50,000 700 300Color: Black Clear General purpose electrical grade burning class V-O @ l/4 A-2340/B-2341: Function: Electrical Grade General Potting Mix Ratio By Weight: 100:42 Gel Time: 100 Gm. @ 25C.: 4 Hours Cured Form: Rigid Cure Schedule: Room Temp. 24 Hrs. or 30 Min. @ 180F. Filled: No No Viscosity Cps @ 25C.: 3,500-5,500 200- 400 Color: Black Clear High impact-High thermal shock general purpose potting resin A-2393/B-2394: Optically Transparent Mix Ratio By Weight: 100:30 Gel Time: 180 Gmi @ 25C.: 12 Hours Cured Form: Rigid Cure Schedule: Room Temp. or 2-3 Hrs @ IlOF Filled: No No Viscosity Cps @ 25C.: 7,000-9,000 50- 100 Color: Clear Clear Water white-Room curable casting system
Miscellaneous
QUADRANT CHEMICAL CORP.: Telecommunications/General and Casting(Continued):
Potting
A-2367:B2205P: Low Viscosity General Potting Mix Ratio By Weight: 100:7 Gel Time: 100 Gm. @ 25C.: 60 Min. Cured Form: Rigid Cure Schedule: Room Temp. 24 Hrs. or 2-3 Hrs. 8 IIOF. Filled: Yes No Viscosity Cps @ 25C.: 4,000-10,000 80300 Color: Black Clear Electronic potting/non-abrasive C-2318: Function: Single Component-Electrical Mix Ratio Ev Neisht:.N.A. Gel Time: I;0 Gm: @ 25C.: 6 Months Cured Form: Semi-Flexible Cure Schedule: 2 Hrs. 8 135C. Filled: No Viscosity Cps @ 25C: 900-2,500 Color: Clear Class F (155C) Sand filled transformer c-2392:
Function: Single Component-Electrical Mix Ratio By Weight: N.A. Cure Schedule: 2 Hrs. @ 135C Filled: No Viscosity Cps 8 25C: ZOO-800 Color: Clear Class B (13OC) Sand filled transformer A-2106-MZ:B-2107-M3: Function: Low Exothermic Potting System Mix Ratio By Weight: lOO:lOO Gel Time: 100 GmI 8 25C.: 50 Min. Cured Form: Rigid Cure Schedule: Room Temp. 24 Hrs. or 30 Min. @ 180F. Filled: Yes Yes Viscosity Cps 8 25C.: 25,000-45,000 8,000-18,000 Color: White Tan General Use: Electronic potting/non-abrasive.
Low Cost.
965
966
Adhesives,
Sealants
and Coatings for the Electronics
Industry
THERMOSET PLASTICS, INC.: Microelectronic Resin Systems: Dielectric Materials: ME-125: Glob Top, Low Ionics, Low CTE for Ceramic Substrate Gray Mix Ratio by Weight: 1OO:lOO Viscosity CP @ 25C: 110,000 Room Temperature Working Life: 3 days Typical Cure Schedule: 5 hr. @ 150C Cured Properties: Glass Transition Temperature (C): 175 Adhesive Strength (psi): n/a ME-129: Two Mil Coating Clear Mix Ratio by Weight: 100:90 Viscosity CP @ 25C: 400 Room Temperature Working Life: 8 hr. Tvoical Cure Schedule: 20 min. B 80C &red Properties: Glass Transition Temperature (C): 105 Adhesive Strength (psi): n/a ME-133: SMD Adhesive for Pin Transfer, Fast Cure, High Strength Yellow Mix Ratio by Weight: One Part Viscositv CP @ 25C: 90,000 Room Temperature Working Life: 3 mos. Typical Cure Schedule: 2 min. @ 120C Glass Transition Temperature (C): 90 Adhesive Strength (psi): 1,500 ME-134: Thermally Conductive, Heat Sink Attach Gray Mix Ratio by Weight: 1OO:lOO Viscosity CP @ 25C: Smooth Paste Room Temperature Working Life: 60 min. Typical Cure Schedule: 40 min. @ 95C Glass Transition Temperature (C): 80 Adhesive Strength (psi): 2,000
Miscellaneous
THERMOSET PLASTICS, INC.: Microelectronic Resin Systems: Dielectric Materials (Continued): ME-147: Version of ME-133 for Syringe Dispense Yellow Mix Ratio by Weight: One Part Viscosity CP @ 25C: 200,000 Room Temperature Working Life: 3 mos. Typical Cure Schedule: 2 min. @ 120C Cured Properties: Glass Transition Temperature (C): 90 Adhesive Strength (psi): 1,500 ME-177: Chip-on-board encapsulant, Long RT Life Black Mix Ratio by Weight: One Part Viscosity CP @ 25C: 50,000 Room Temperature Working Life: 3 mos. Typical Cure Schedule: 60 min. @ 150C Cured Properties: Glass Transition Temperature (C): 140 Adhesive Strength (psi): n/a ME-184: LED Encapsulant Clear Mix Ratio by Weight: 1OO:lOO Viscosity CP @ 25C: 800 Room Temperature Working Life: 1 day Typical Cure Schedule: 60 min. @ 120C Cured Properties: Glass Transition Temperature (C): 150 Adhesive Strength (psi): n/a
967
968
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: OHMEX-AG: Thermosetting Silver for Ohmic Bonding to Semiconductors: Produces quality electrical and mechanical contacts Features: * One-part system * High bond strength * Ohmic contacts * Low contact resistance * Low thermal impedance * Low thermal stress * Temperature stability -65C to +275C * Low outgassing Applications: Chip Bonding - Silicon, germanium and other semiconductor materials - for transistors, diodes, rectifiers, thermistors, integrated monolithic and hybrid circuits. Also bonds to: glass, metals, ceramic, mica, plastics, graphite, and quartz. OHMEX-AG is a conductive silver preparation containing as a bonding constituent silver epoxide. Silver Epoxy Paste: Screenable Thermosetting Silver for Ohmic Bonding: A screenable silver epoxy preparation for developing high quality electrical and mechanical contacts - used in bonding semiconductors and other devices in hybrid microelectronic circuits. Silver Epoxy Paste - Type I: Standard screenable conductive epoxy Silver Epoxy Paste - Type II: Screenable conductive compliant epoxy Features: * One component system * Excellent screening characteristics * Develops high bond strength * Low contact resistance * Very low thermal stress * Low thermal impedance * Temperature -65 to +25OC Silver Epoxy Paste is a one component system designed as a conductive thermosetting silver preparation for screen printing applications.
Miscellaneous
969
TRANSENE CO., INC.: Microcircuit Silvers for Conductive Bonding in Microelectronics: One-part thermosetting silver epoxy systems for conductive bonding in microelectronic assembly operations. Microcircuit Silver - Type K: Low temperature, fast cure - automatic dispensing Microcircuit Silver - Type L: Low temperature, fast cure - screen print Microcircuit Silver - Type N: High bond strength - 100% solids Microcircuit Silver - Type 0: High electrical conductivity - 100% solids Microcircuit Silvers are one-part, thermosetting silverepoxy compositions designed specifically for conductive bonding in microelectronic assembly operations. SILVER-BOND: Low Temperature Thermosetting Silver: Epoxy silver compositions for conductive bonding in microelectronic assembly applications SILVER-BOND - Type 40: Standard low-temperature cure, high electrical conductivity SILVER-BOND - Type 50: Fast low-temperature cure high electrical conductivity SILVER-BOND - Type 60: Long pot life, fast cure Features: * Low temperature curing systems * High bond strength * Electrical resistivity (10 -4 ohm-cm * Low outgassing * Long pot life * Adhesive bonding to glass, metal, ceramic, plastics, graphite, quartz SILVER-BOND is a two component, epoxy based conductive adhesive for quality electrical and mechanical contacts.
970
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: Gold-Epoxy Pastes: Thermosetting Gold for Ohmic Bonding: Produces quality electrical and mechanical contacts for semiconductor and hybrid circuits applications. Gold-Epoxy Paste, Type GE-lo: One-part system, economical Gold-Epoxy Paste, Type GE-20: Two-part system, low temperature cure Gold-Epoxy Paste, Type GE-30: Two-part system, fast cure Gold-Epoxy Paste, Type GE-40: Two-part system, fast cure, long pot life Gold-Epoxy Pastes are gold-filled conductive bonding preparations exhibiting high electrical conductivity and bond strength. NICKEL-BOND Low Temperature Thermosetting Nickel: Low cost nickel-epoxy compositions for conductive bonding in microelectronics and as electrodes 10 -2 ohm-cm. NICKEL-BOND - Type 40: Standard low-temperature cure NICKEL-BOND - Type SO: Fast low-temperature cure NICKEL-BOND - Type 60: Long pot life, fast cure Features: * Low-temperature curing systems * High bond strength * Low outgassing * Adhesive bonding to glass, metal, ceramic, plastic, graphite, quartz NICKEL-BOND preparations are two-component epoxy-based conductive adhesives for quality electrical and mechanical contacts.
Miscellaneous
971
TRANSENE CO., INC.: INSUL-BOND Epoxy Adhesives: Non-conductive adhesive bonding for electronic and aerospace applications. Develops high bond strength between all materials metals, ceramics, glass, ferrites, etc. Designed for use in hybrid microcircuit applications. Epoxy-10 Adhesive: High viscosity paste - 100% solids Epoxy-11 Adhesive: Screen-printing viscosity Epoxy-12 Adhesive: Automatic dispensing viscosity Applications: * Adhesive bonding * Bonding substrates to packages * Bonding discrete components to substrates * Connector attachment * Metal ceramic seals * Bonding ferrite materials INSUL-BOND Epoxy-13: INSUL-BOND Epoxy-14: INSUL-BOND Epoxy-15: INSUL-BOND Epoxy 13, 14 and 15 maintain minimal outgassing, high electrical resistivity and high bond strength to 200C operating temperatures. Compatibility with aluminum and other metallizations common to microelectronic devices is assured. INSUL-BOND Epoxy-16: INSUL-BOND Epoxy-17: INSUL-BOND 16 & 17 adhesives are solvent-free, electrically non-conductive epoxy systems designed for die attachment, substrate mounting and lid sealing in Hybrid Microelectronics applications. These 2-part systems feature rapid cure at very low temperatures and outstanding bond 'peel' strengths - typically 10 times greater than standard epoxy materials. Application by screen printing (180-225 SS mesh) or automatic dispensing is recommended.
972
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: TRANSEPOXY Self Catalyzed Epoxy Systems: One-part epoxy system based on latest advances in epoxy chemistry and technology--for potting and encapsulation applications including electronic assemblies and components. TRANSEPOXY 310: Silica filled epoxy system for general purpose potting and encapsulation TRANSEPOXY 320: Alumina filled epoxy system with high thermal conductivity TRANSEPOXY 330: Optically clear unfilled epoxy system The TRANSEPOXIES are a series of one component liquid epoxy systems designed for potting and encapsulation applications. TRANSEPOXY systems are recommended for electrical potting and encapsulation. TRANSISTOR EPOXIES: Novel pre-"B"-stage epoxy filled system offering enhanced power dissipation of encapsulated electronic devices - transistors, MOS, rectifiers & diodes. TRANSISTOR EPOXY - 250: Frozen, pre-mixed one-part potting system Ready to use TRANSISTOR EPOXY - 260: Two-part potting system Features: * High thermal conductivity * Impervious to moisture * Passes thermal shock -65C to +15OC cycling * Withstands solder immersion 230C - 10 seconds * Free of mobile ionic impurities * Chemically resistant * Eliminates junction protective coating requirement for planar passivated devices TRANSISTOR EPOXY-250 is a frozen, one-part alumina pre-"B"stage epoxy system. TRANSISTOR EPOXY-260 is a two-part system which eliminates storage and handling precautions.
Mxellaneous
973
TRANSENE CO., INC.: General Purpose Epoxies: General purpose epoxies are formulated as two component systems to provide the best electrical, physical and mechanical properties attainable. General purpose epoxies are recommended for protection and low cost packaging of semiconductor components, electronic devices and circuit assemblies. The epoxy compounds meet AIEE classes A-B-C-D-H for electrical potting compounds, as well as MIL specifications. Epoxy-125: Black Heat Dist. Temp. : 2,200 Viscosity, Mixed i$i)125 Flex. Str. (psi): 13,600 Dielectric Constant: Frequency, cps 60: 4.10 Dissipation Factor: Frequency, cps 60: 0.0099 Resin:Hardener Ratio: 100:17 Epoxy-175: Black Heat Dist. Temp. (C): 175 Viscosity, Mixed (Cps): 38,000 Flex. Str. (psi): 15,600 Dielectric Constant: Frequency, cps 60: 4.18 Dissipation Factor: Frequency, cps 60: 0.005 Resin:Hardener Ratio: 100:12 Epoxy-200: Black Heat Dist. Temp. (C): 200 Viscosity, Mixed (Cps): 20,000 Flex. Str. (psi): 14,500 Dielectric Constant: Frequency, cps 60: 3.93 Dissipation Factor: Frequency, cps 60: 0.0067 Resin:Hardener Ratio: 1OO:lO Epoxy-225: Black Heat Dist. Temp. (C): 225 Viscosity, Mixed (Cps): 4,200 Flex. Str. (psi): 14,000 Dielectric Constant: Frequency, cps 60: 3.09 Dissipation Factor: Frequency, cps 60: 0.0035 Resin:Hardener Ratio: 100:45
974
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE co., INC.: LED Encapsulants: Epoxy encapsulation for LED (light emitting diodes) - gallium arsenide, gallium phosphide, gallium arsenide phosphide and other opto-electronic devices. Offers stable optical clarity with 10,000 hours life expectancy at 125C. LED 101-C: Clear, water-white LED 101-R: Transparent red LED 101-Y: Transparent yellow LED 101-B: Transparent blue LED 101-G: Transparent green LED 101-O: Transparent orange Features: * High temperature stability * Low viscosity * Long pot life * Fast gel * Quick cure EPOTHERM Thermally Conductive Epoxy Compounds: High thermal conductive epoxy compounds for potting semiconductor components and electronic assemblies. EPOTHERM - 130: Room temperature curing epoxy with high thermal conductivity and excellent electrical insulation properties - for applications up to 130C. EPOTHERM - 180: Elevated temperature curing epoxy with high thermal conductivity and excellent electrical insulation - for applications up to 18OC.
Miscellaneous
975
TRANSENE CO., INC.: Silver Conductive Pastes for Thick Film Microelectronic Circuits: Screenable cermet silver compositions designed to provide conductive electrodes for capacitors, solderable land areas, resistor terminations and shielding applications. Silver Paste - Type 50: for mica, glass, quartz, barium titanate, steatite firing range 450C - 600C Silver Paste - Type 100: for alumina and other ceramic substrates firing range 600C - 700C Silver Paste - Type 200: for alumina and other ceramic substrates firing range 700C - 9OOC Features: * High bond strength on alumina, glass and mica, barium titanate, quartz, steatite substrates * High electrical conductivity * High quality printing and resolution * Accepts solder * Low metallization cost TRANSENE Silver Conductive Pastes were designed and developed as low cost solderable interconnections for thick film hybrid microcircuits and other applications. Palladium-Silver Pastes Conductor for Thick Film Microcircuits: Improved Screenable Conductor Pastes for General Use in Thick Film Hybrid Micro-electronic Circuits Palladium-Silver type 12: high bond strength metallization Palladium-Silver type 14: general purpose, low cost metallization Features: * Eqcellent adhesion on alumina and beryllia substrates * High electrical conductivity * Reduces silver migration phenomenon * High quality screen printing * Eliminates soldering problems * Low cost Palladium-Silver Conductive Pastes have been developed and improved to offer excellent adhesion, high conductivity and good solderability for general use in the manufacture of thick film hybrid microcircuits.
976
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: Gold Alloy Cermet Compositions: Conductors for Thick-Film Microcircuits: Screenable conductive cermet compositions of binary and ternary alloys for resistor terminations and capacitor electrodes. Gold-Platinum Paste: Gold-Palladium Paste: Binary alloys for die attachment. Eliminates silver migration problems Gold-Palladium-Silver Paste: Gold-Palladium-Platinum Paste: Ternary alloys offer excellent adhesion and electrical conductivity Features: * Fine line printing resolution * Good solderability with resistance to solder leaching * Permits thermocompression or ultrasonic bonding of wires for interconnections * Excellent resistor compatibility These oastes are designed for use as conductive terminations for resistors, as electrodes for capacitors and to satisfy multifunctional needs in thick film hybrid microelectronic circuits. Gold Conductive Pastes: For Thick Film Microelectronics: High quality screenable cermet gold compositions designed for die and wire bonding - in hybrid microelectronic circuits. Gold Conductive Paste - Type 100: For low firing temperature, 750-850C Gold Conductive Paste - Type 200: For high firing temperature, 850-1OOOC Features: * Fine line printing - permits single print operation * Excellent adhesion - with good abrasion * Hiah electrical conductivitv * Allows dice bonding with or without preform * Permits wire bonding - ultrasonically or by thermal compression bonding Gold Conductive Pastes are specially formulated to produce terminations for attachment of die (component devices) and wire bonding for interconnections on alumina substrates.
Miscellaneous
977
TRANSENE CO., INC.: Nickel Electrode Paste - Type 801: Conductive Nickel Metallization: Nickel Electrode Paste - Type-801 is a conductive nickel paste formulation which can be screen printed on ceramic substrates and fired in nitrogen to form electrically conductive metallizations. Nickel Electrode Paste is used in thick film hybrid circuit application for low cost metallizations. The fired nickel is also solder-leach resistant. Copper Conductive Paste: For Thick Film Hybrid Applications: A low cost technology for thick film copper metallizations on alumina, beryllia and quartz substrates. Features: * High adhesion * High electrical conductivity * Excellent solderability * Leach resistance * Screen printability A copper conductive paste developed to provide a new, practical approach to copper metallizations on alumina, beryllia, and quartz substrates in electronics and thick film hybrid applications. Buried Electrode Inks for Multilayer Ceramic Capacitor: Multilayer capacitor materials designed to form internal co-fired electrodes in the manufacturs of high capacitance ceramic capacitors. Buried Electrode Inks: Platinum, Type EI-100: firing temperature 1600C Palladium, Type EI-200: firing temperature 1450C Platinum-Palladium-Gold, Type EI-300: firing temperature 1400C Palladium-Gold, Type EI-400: firing temperature 1300C Palladium-Silver, Type EI-500: firing temperature 1300C Features: * Precious metal compositions designed for minimum cost * Formulations for optimized firing temperature * Controlled rheology and drying characteristics * Complete compatibility with green ceramic slips
978
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: Moly Metalizing Preparations: High Temperature Metallizing for Alumina: Moly-Manganese: Type 100 - Standard Screen Printing Paste Type 200 - Fine Line Screen Printing Paste Type 300 - Paint Moly-Titanium: Type 100 - Standard Screen Printing Paste Type 200 - Fine Line Screen Printing Paste Type 300 - Paint Applications: * Paint metallizing preparations for hermetic metal-ceramic seals, ceramic tube structure, headers and ceramic package assemblies. * Screenable metallizing pastes for use in high reliability, thick film, hybrid micro-electronic circuits. Forms electrodes and interconnections on alumina ceramics. * Offers maximum adhesion on alumina and other ceramic substrates. Tungsten Metallizing Preparations: For Alumina and Sapphire Substrates: Screenable tungsten paste and point formulations for high temperature metallization of ceramic substrates in thick film microelectronics and high power tubes - forms conductive electrodes, interconnections, and metal ceramic seals. Tungsten Paste - Type 100: for fired ceramics Tungsten Paste - Type 200: for green ceramics Tungsten Paint: for brush-on applications Features: * Very high bond strength on alumina and sapphire substrates * High electrical conductivity * Fine line printing * Reliable brazing or soldering of lead terminations * Low cost Tungsten Paste is a fine dispesrion of tungsten metal powder in a special vehicle, designed for the metallization of alumina substrates in thick film hybrid microelectronic circuits.
Miscellaneous
979
TRANSENE CO., INC.: Beryllia and Sapphire Metallizing: For High Temperature Metallizing: Beryllia and Sapphire Metallizing preparations contain refractory metals dispersed in proprietary organic vehicles which provide rheological properties appropriate for application by painting or screen printing. Bonding between the ceramic body and the refractory metal preparation results from the formation of eutectic phases during the firing process. Bond strengths of 10,000 psi are typical of the metallization process. Applications include reliable hermetic package assemblies and multi-ceramic seals. Beryllia and Sapphire high temperature metallizations find wide acceptance for conductive electrode and interconnections in hybrid circuits. RTM Process: Room Temperature Metallizing for Alumina: Room-temperature nickel metallizing process for alumina ceramics and other dielectric materials - strongly bonded nickel can be plated, soldered, brazed or welded. Unique Features: Low cost metallization process. Excellent bond strength - 100 psi typical. Withstands temperature extremes - -65C. to +85OC. Passes Mil specifications for temperature cycling and shock. Hermeticity - leak rate (10 -8 cc helium/second. Permits registration of metallization patterns with good resolution using photolithographic techniques and mechanical masking. Process applicable to beryllia, barium titanate, ferrites, epoxies, mylar and other dielectrics. The RTM process offers a reliable, yet simple and economical method to metallize dielectric (non-conductor) materials at room-temperature. This metallizing process with nickel is specially suited for commercial alumina type ceramics. The RTM process is applicable to metallizing alumina substrates in hybrid and microcircuits, insulated heat sinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.
980
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: Dielectric Crossover Pastes: For Multilayer Thick Film Hybrid Circuits: High quality ceramic dielectric crossover compositions for use as an insulating coating over conductor and resistor in the production of thick film multilayer microcircuits. Dielectric Crossover - Type 1000: for very low firing temperatures 500-575C Dielectric Crossover - Type 1500: for low firing temperatures 750-9OOC Dielectric Crossover - Type 1800: for medium firing temperatures 900-1OOOC Dielectric Crossover - Type 2700: for high firing temperatures 1400-1500C Dielectric crossover pastes are designed with low dielectric constant, good dielectric strength and strong adhesion to conductor and substrate materials for use in multilayer thick film hybrid microcircuits. Dielectric Crossover Pastes are applied over the first thick film circuit elements in order to build multilayer hybrid circuits. Vitreous-Crossover Circuits:
Paste: For Multilayer Thick Film Hybrid
High quality vitreous-crossover composition for use as a clear and smooth insulating coating over conductor and resistor in the production of thick film multilayer hybrid circuits. Features: * Excellent screenability * Strong adhesion to ceramic substrates and circuit elements * Low dielectric constant * High dielectric strength * High insulation resistance Vitreous-Crossover Paste is specially designed with low dielectric constant, good dielectric strength and excellent adhesion to conductor and substrate materials for use in multilayer thick film hybrid circuits. The paste based upon vitreous frit composition produces a clear, smooth insulating layer between circuit elements. The paste is applied by screen printing procedure and fired at the appropriate temperatures. The fired insulating crossover shows excellent stability towards moisture and temperatures.
Miscellaneous
981
TRANSENE CO., INC.: Microcircuit Silvers: Microcircuit Silvers are one-part, thermosetting silverepoxy compositions designed specifically for conductive bonding in microelectronic assembly operations. Recommended applications include the conductive bonding of integrated circuit chips, capacitors, and other active and passive components. Microcircuit Silvers meet Hi-Rel requirements for low outgassing, bond strength, and electrical conductivity. Microcircuit Silvers withstand temperatures up to 35OC, allowing ultrasonic and thermal compression bonding of interconnecting wires. Microcircuit Silvers, Types K and L, will fully cure in 15 seconds at 300C; thus these silver compositions possess the unique ability to cure during thermal compression bonding operations. Several modifications of Microcircuit Silvers are offered. Types K and L exhibit low temperatures, fast cures. Types N and 0 are 100% solid systems, provide high adhesion and high electrical conductivity. Microcircuit Silvers, Types K, L,-N, and 0 are designed for screen printing or automatic dispensing applications. Uncured: Type K: Per Cent Silver: 75 Solids (%): 98 Viscosity cps: 60,000 Type L: Per Cent Silver: 73 Solids (%): 98 Viscosity cps: 80,000 Type N: Per Cent Silver: 70 Solids (%): 100 Viscosity cps: 100,000 Type 0: Per Cent Silver: 77 Solids (%): 100 Viscosity cps: 125,000 Cured: Type K: Service Temp. Range: -50C to +175C (325C intermittant) Type L: same Type N: Service Temp. Range: -60C to +2OOC (325C intermittant) Type 0: same
982
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: FARADEX Capacitor Dielectric Pastes: Screenable capacitor dielectric pastes for thick film hybrid microcircuits, designed for high yield and reliability. FARADEX - K50: Dielectric constant 50 4,500 pf/inch 2 FARADEX - KlOO: Dielectric constant 100 9,000 pf/inch 2 FARADEX - K1.50: Dielectric constant 150 13,500 pf/inch 2 FARADEX - K250: Dielectric constant 250 22,500 pf/inch 2 FARADEX pastes are screenable capacitor dielectric pastes for thick film hybrid microcircuits, designed for high yield and reliability.
Miscellaneous
TRANSENE
CO.,
INC.:
SES
983
- Black: Modified Silicone Elastomer
for Light Absorption: SES - Black is a high purity siloxane formulated with special inert fillers to impart light absorption and eliminate light transmission. Designed as a protective coating for light sensitive semiconductor devices; other applications requiring light shielding of component arrays and digital displays are appropriate. Catalyzed SES-Black will cure at room temperature to a solid silicone elastomer with excellent electrical and physical properties. Elevated temperature curing will optimize electrical properties. Products offered are: Viscosity: 7,500 cps SES-Black 75 II 15,000 cps SES-Black 150 11 SES-Black 350 35,000 cps II 70,000 cps SES-Black 11 SES-Black 80,000 cps MBS: Moisture Barrier Silicone: Single component, silicone elastomer coating designed to stabilize semiconductor junctions and surfaces, and for the environmental protection of electronic components - used for diodes, transistors, integrated circuits, thick film and thin film microelectronic circuit modules. Features: * Single component self-catalyzed system - simple and economical to use * Unaffected by humidity * Excellent electrical characteristics * Wide operating temperature range - -65C to 275C (continuous) * Useful as protective coating, encapsulant or potting MBS, Moisture Barrier Silicone, is a medium viscosity translastic product specially processed from highly purified siloxane compounds. This product is particularly formulated to provide greater protection against humidity in electronic applications. MBS possesses self-catalyzing properties and cures as a single component system to form a tough protective coating impervious to moisture. Significantly, the additions of curing agents, catalysts or accelerators are not needed to effect the silicone polymerization. Furthermore, the coating shows good mechanical and electrical characteristics over a wide range of ambient conditions. MBS is supplied at a viscosity of 45,000+-10%. Specific viscosities of 20,000 to 100,000 are available upon request.
984
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: Silicone Semi-Gel: Transparent Dielectric Potting: Transparent silicone potting systems - cures to a soft elastomer gel material - for mechanical cushioning, vibration damping and protective coating of sensitive microelectronic devices and circuits. Silicone Semi-Gel - Type C: Two-part, quick cure, self-healing Features: * Low viscosity - quick cure * Shock-absorbing * Service temperature range -60C to +25OC TRANSLASTIC Semi-Gel is a one-part silicone product which cures to a mechanical energy absorbing material. HYBRISIL: Conformal Coatings for Thin Film/Thick Film: One-part silicone, conformal protective coatings for thin film and thick film resistor networks in microelectronic circuits. HYBRISIL-100: Flexible translastic silicone coating Cures at room temperature Thermal class 250C HYBRISIL-200: High power resistor silicone coating Elevator temperature cure Thermal class 350C HYBRISIL-300: High dielectric strength silicone coating Elevated temperature cure Thermal class 300C HYBRISIL conformal coatings are designed to protect and stabilize thick and thin film resistor networks. The HYBRISIL coatings are one-part systems, silicone based and easily applied. These silicone materials provide a low cost yet reliable process for resistor encapsulation. The need for high temperature firings with cermet encapsulations is avoided.
Miscellaneous
985
TRANSENE CO., INC.: Solder Glass Sealant Pastes: Hermetic Sealing of Hybrid Microelectronic Packages: High quality solder glass compositions for use as hermetic sealants in the production of hybrid microelectronic packages. Solder Glass Sealant 100: Vitreous sealant for glass substrates Solder Glass Sealant 200: Devitrifying sealant for glass substrates Solder Glass Sealant 300: Devitrifying sealant for alumina substrates Solder Glass Sealant 400: Devitrifying sealant for alumina substrates TRANSENE Solder Glass Sealant Pastes were developed primarily for use as solder seals in the production of hybrid microelecttonic packages. Selection and control of the thermal expansion of the special glasses contained in these products permit matched seals between glass, ceramics and metals. These seals exhibit and stability towexcellent hermeticitv. _ . mechanical russedness -_ ard environmental conditions. The Solder Glass Sealant Pastes are designed and formulated from two basic types of TRANSENE glasses: (1) vitreous glasses and (2) devitrifying glasses. The vitreous glasses are thermoplastic and soften and flow upon heating. Seals are formed at a temperature that permits the glass to flow, followed by cooling below the temperature at which the glass becomes rigid. The devitrifying glasses are thermosetting. These glasses melt initially at low temoeratures (aporox. 4OOC) but underso -_ crystallization or devitrification when held at higher temperature (approx. SOOC) for a period of time. The devitrified glasses have a ceramic structure and the seals made are extremely rugged. The Solder Glass Sealant Pastes are applied by the screen printing method and are fired at the appropriate temperature in an air furnace. Preglazing or melting the glass onto the parts to be sealed is essential. Final sealing is accomplished by subjecting the seal to a prescribed heat time-temperature cycle. Solder Glass Sealant Pastes: Types 500 and 600: Solder Glass Sealant Paste - Type 500: Low temperature devitrifying solder glass for hermetic sealing of hybrid microelectronic packages. Solder Glass Sealant Paste - Type 600: Devitrifying solder glass for hermetic sealing of hybrid microelectronic packages.
986
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE CO., INC.: OHM-RESIST: Thick Film Resistor Compositions: OHM-RESIST type 150 - screenable resistive cermet composition for thick film hybrid microelectronic circuits Features: * Hard fired structure * High quality printing resolution * Stable resistor characteristics * Cofirability * Excellent blendability * Wide selection of resistance values * Low cost resistor system OHM-RESIST pastes are thick-film resistor compositions based on precious metals and lead borosilicate glass systems. These systems are formulated as screenable resistor pastes with carefully controlled rheology. The product is applied by screening on ceramic substrates and fired under appropriate conditions to generate discrete resistors and resistor networks. The resistors characteristically exhibit a hard fired structure. OHM-RESIST pastes are also referred to as resistor inks. Physical Characteristics and Processing: Viscosity (xl0 3): 180-240 cps Thinner: BCA, terpineol, pine oil Printing: 165-200 mesh screens Prefired electrodes: Pd-Ag, Ag, Pd-Ag-Au, Au, Pd-Au, Pt-Au, Pt-Au-Pd Cofirable electrodes: Pd-As (TRANSENE) Drying Time (IOO-125C): 15-minutes Firing temperatures (optimum): 850C Furnace atmosphere: Air Firing time (at 775C): 10 minutes Protective encapsulant: Vitreous overglaze (TRANSENE 780-980) Electrical Properties of 150-11: Nom. Sheet Resistance 150-51: Nom. Sheet Resistance 150-12: Nom. Sheet Resistance 150-52: Nom. Sheet Resistance 150-13: Nom. Sheet Resistance 150-14: Nom. Sheet Resistance 150-54: Nom. Sheet Resistance 150-15: Nom. Sheet Resistance 150-16: Nom. Sheet Resistance
OHM-RESIST type 150: (ohms/sq.): 10 ohm (ohmslsq.): 50 ohm lohms/sa.): 100 ohm ._. (ohms/sq.): 500 ohm (ohms/sq.): 1 K (ohms/sq.): 10 K (ohms/sq.): 50 K (ohms/sq.): IOOK (ohms/sq.): 1 M
Miscellaneous
987
TRANSENE CO., INC.: Improved Solder Fluxes: Selective Solder Fluxing for Electronic Applications: Rosin Flux SF-lo: Safe, non-corrosive flux for copper, and tinned metals Rosin Flux SF-15: Mildly activated rosin flux Activated Rosin Flux SF-20: Rapidly acting rosin flux on copper and tinned metals. Also selective for silver-palladium thick film metallizations NEUTRAFLUX SF-30: General purpose organic flux effective on most metals NEUTRAFLUX SF-30F: Formulation for foam soldering Chloride Flux SF-40: General purpose, non-spatterable flux, effective on most metals Activated Acid Flux SF-50: Highly active flux for stainless steel and ferrous metal Solder fluxes produced by the Transene Co., Inc. permit selection of the optimum flux for specific industrial requirements. These special fluxes afford distinct advantages in performance and in effectiveness over other solder fluxes heretofore in use with tin solders. TRANSENE solder fluxes are metallurgically formulated to dissolve oxides from both metal surfaces and molten solder below the solderins temperature. These fluxes also protect the metal surfaces-against re-oxidation during the soldering procedure, due to the formation of a "flux liquidus". The adhesive force of the "flux liquidus" is quite adequate and yet it permits "liquidus" displacement by the moleten solder. Excellent wetting of the metal surfaces with solder results. This wetting action, pre-requisite for good soldering, is thus immensely enhanced by the inherent physical chemical activity, characteristic of TRANSENE improved solder fluxes. All TRANSENE fluxes may be applied by brushing or dipping; furthermore, the flux residues are readily removed by solvents. Fluxing activities of TRANSENE fluxes increase with the product number designation, i.e., SF-50 > SF-40 > SF-30 > SF-20 > SF-15 > SF-10
988
Adhesives, Sealants and Coatings for the Electronics Industry
TRANSENE
CO.,
INC.:
Solder Creams: For Microelectronic Soldering:
Solder-flux creams for use in microelectonic thick and thin film applications to provide uniformity and reliability of bonded discrete components, leads, and cover seals. Standard Solder Compositions
(Non-Corrosive):
Solder Cream - 1090: 10% Sn/90% Pb Solder Cream - 2575: 25% Sn/75% Pb Solder Cream - 6040: 60% Sn/40% Pb Solder Cream - 62362: 62% Sn/36% Pb/2% Ag Solder Cream - 955: 95% Sn/5% Ag Solder Cream - 7525: 75% Pb/25% In Other Solder Compositions Available TRANSENE solder creams are compositions containing solder alloy powders of controlled particle size dispersed in a flux vehicle for good wetting and soldering. The basic flux system used in these solder creams have an optimized rheology for screen-printing applications. Good soldering performance is obtained on thick and thin film metallizations--Pd, Ag, Au, Pt, as well as brass and copper. TRANSENE solder creams are used to solder minute parts in high-density electronic packages, particularly discrete components, leads and cover seals in hybrid circuits. By screen printing, the amount of solder can be rigidly controlled to avoid solder bridging. Many other solder problems can be avoided by the use of solder creams.
Properties: -1090: Melting Point -2575: Melting Point -6040: Melting Point 62362: Melting Point -955: Melting Point -7525: Melting Point
or Liquidus (C): 300 or Liquidus (C): 283 or Liquidus (C): 193 or Liquidus (C): 189 or Liquidus (C): 235 or Liquidus (C)i 264
Miscellaneous
ZIEGLER CHEMICAL & MINERAL CORP.: Specialty Asphalt Products: Electronics Industry: IMPREG WAX: These products are generally asphalts with the addition of wax to raise its softening point to between 220F and 300F. Impreg waxes are asphalt and wax blends and are used in ballasts of fluorescent lights to reduce noise and hold the components in place, protecting them from moisture damage. Potting Compounds: Potting compounds are asphalts filled with l-70% silica to increase their softening point (raise approx. 0.4F/l% silica added).
989
Suppliers' Addresses
990
Suppliers'
Abatron, Inc. 33 Center Drive Gilberts, IL 60136 (708)-426-2200/(800)-445-1754
Ashland Chemical, Inc. 1745 Cottage St. Ashland, OH 44805 (419)-289-9588/(800)-848-7485
Ablestik 833 West 182nd St. Gardena, CA 90248 (213)-532-9341
Bacon Industries, Inc. 192 Pleasant St. Watertown, MA 02172 (617)-926-2550
Adhesives Research, P.O. Box 100 Glen Rock, PA 17327 (717)-235-7979
Inc.
A.I. Technology, Inc. 1425 Lower Ferry Rd. Trenton, NJ 08618 (609)-882-2332
Addresses
Biwax Corp. 45 E. Bradrock Drive Des Plaines, IL 60016 (312)-824-0137 Bonded Products, Inc. 439 South Bolmar St. Box 39 West Chester, PA 19381 (215)-696-9220
American Biltrite Inc. Ideal Tape Co. 1400 Middlesex St. Lowell, MA 01851 (617)-458-6833
Bostik Emhart Boston St. Middleton, MA 01949 (508)-777-0100/(800)-726-7845
American Sealants, Inc. 3912 Option Pass P.O. Box 80307 Fort Wayne, IN 46898 (219)-489-0728/(219)-489-0825
CasChem, Inc. 40 Avenue A Bayonne, NJ 07002 (800)-CASCHEM
Apple Adhesives, Inc. 184-08 Jamaica Ave. Hollis, NY 11423 (718)-454-7375
Castall, Inc. Weymouth Industrial Park East Weymouth, MA 02189 (617)-337-6075
Aremco Products, Inc. P.O. Box 429 Ossining, NY 10562 (914)-762-0685
Chomerics Inc. 77 Dragon Court Woburn, MA 01888 (617)-935-4850/(800)-225-1936
Arlon 199 Amaral St. P.O. Box 14305 East Providence, (401)-434-2340
CHR Industries, Inc. 407 East St. New Haven, CT 06509 (203)-777-3631
RI
02914
991
992
Adhesives, Sealants and Coatings for the Electronics IndILStry
Conap, Inc. 1405 Buffalo St. Olean, NY 14760 (716)-372-9650
Ducey Chemical, Inc. P.O. Box 776 Princeton Junction, (609)-799-3191
Copps Industries, Inc. N90 W14683 Commerce Dr. P.O. Box 844 Menomonee Falls, WI 53052 (414)-251-3825
Dymax Corp. 51 Greenwoods Rd. Torrington, CT 06790 (203)-482-1010 Dynaloy, Inc. 7 Great Meadow Lane Hanover, NJ 07936 (201)-887-9270
Cotronics Corp. 3379 Shore Parkway Brooklyn, NY 11235 (718)-646-7996
Dynamold, Inc. P.O. Box 9617 Fort Worth, TX 76147 (817)-335-0862
Custom Coating & Laminating 717 Plantation St. Worcester, MA 01605 (508)-852-3072 Dielectric Polymers 218 Race St. Holyoke, MA 01040 (413)-532-3288
John C. Dolph Co. West New Road Monmouth Junction, (201 )-329-2923
Ave.
NJ 08852
Dow Chemical USA Midland, MI 48674 (800)-258-CHEM/(800)-232-CHEM Dow Corning Midland, MI (517)-496-6000
Corp. 48686
Electro-Kinetic Systems, 701 Chestnut St. Trainer, PA 19103 (215)-497-4660
Inc.
Dimiter Emulsion & Chemical P.O. Box 341 Poughkeepsie, NY 12602 (914)-452-4071 Dock Resins Corp. 1512 West Elizabeth Linden, NJ 07036 (908)-862-2351
NJ 08550
Co.
Electro-Science Laboratories 416 East Church Road P.O. Box 1533 King of Prussia, PA 19406 (215)-272-8000/(800)-257-8340 Emerson & Cuming, Inc. 77 Dragon Court Woburn, MA 01888 (617)-938-8630/(800)-TECHWAY Epoxy Technology, Inc. 14 Fortune Drive Billerica, MA 01821 (508)-667-3805/(800)-227-2201 Fel-Pro Chemical Products 7450 North McCormick Blvd. P. 0. Box 1205 Skokie, IL 60076 (312)-761-4500 and 674-7700
Inc.
Suppliers'
Fenwal Inc. 50 Main St. Ashland, MA 01721 (508)-881-2000
Hexcel Chemical Products 20701 Nordhoff St. Chatsworth, CA 91311 (818)-882-3022
Finite Industries Inc. 746 Gotham Parkway Carlstadt, NJ 07072 (201 )-939-0565
IPS Corp. 17109 So. Main St. Gardena, CA 90248 (213)-321-6515/(800)-421-2677
Flexbar Machine 250 Gibbs Road Central Islip, (516)-582-8440
ITW Devcon 30 Endicott St. Danvers, MA 01923 (508)-777-1100
Corp. NY 11722
H.B. Fuller Co. 3530 Lexington Ave. North St. Paul, MN 55126 (800)-468-6358/(800)-446-8788 Furane Products 5121 San Fernando Road Los Angeles, CA 90039 (818)-247-6210 GC Electronics 1801 Morgan St. Rockford, IL 61102 (815)-968-9661 GE Silicones General Electric Co. 260 Hudson River Road Waterford, NY 12188 (518)-237-3330 General Polymers 2 Sherman St. Linden, NJ 07036 (201)-925-6776
Park
West Loctite Corp. 705 North Mountain Road Newington, CT 06111 (203)-278-1280/(800)-LOC-TITE Magnolia Plastics, Inc. 5547 Peachtree Industrial Chamblee, GA 30341 (404)-451-2777
Blvd.
Mavidon Corp. 3953 Bryner Terrace Palm City, FL 34990 (407)-286-8951
Corp.
The P.D. George Co. 5200 N. 2 St. st. Louis, MO 63147 (314)-621-5700 Hardman Inc. 600 Cortlandt Belleville, (201)-751-3000
Key Polymer Corp. Jacob's Way Lawrence Industrial P.O. Box 1529 Lawrence, MA 01842 (508)-683-9411
993
Addresses
St. NJ 07109
Mereco Division Metachem Resins Corp. 1505 Main St. West Warwick, RI 02893 (401)-822-9300/(800)-556-7164 Miller-Stephenson George Washington Danbury, CT 06810 (203)-743-4447
Chemical Highway
Co.
994
Adhesives, Sealants and Coatings for the Electronics Industry
National Starch and Chemical P. 0. Box 6500 Finderne Ave. Bridgewater, NJ 08807 (201 )-685-5000/(800)-532-1115
Sauereisen Cements 160 Gamma Drive Pittsburgh, PA 15238 (412)-963-0303
Norland Products Inc. 695 Joyce Kilmer Ave. New Brunswick, NJ 08902 (201)-545-7828 Oneida Electronic Mfg. P.O. Box 678 Meadville, PA 16335 (814)-336-2125
Inc.
Pacer Technology 9420 Santa Anita Ave. Rancho Cucamonga, CA 91730 (714)-987-0550/(800)-538-3091 Permabond International 480 South Dean St. Englewood, NJ 07631 (201 )-567-9494 Permagile Industries Inc. 101 Commercial St. Plainview, NY 11803 (516)-349-1100/(800)-645-7546 Pierce & Stevens Industrial Group Pierce & Stevens Corp. Box 1092 Buffalo, NY 14240 (716)-856-4910 Products Research & Chemical 5426 San Fernando Road P.O. Box 1800 Glendale, CA 91209 (818)-240-2710/(800)-331-5865 Quadrant Chemical Corp. 200 Industrial Blvd. McKinney, TX 75069 (214)-542-0072
Ranbar Technology Inc. 1114 William Flinn Highway Glenshaw, PA 15116 (412)-486-1111
Sheldahl P.O. Box 170 Northfield, MN 55057 (507)-663-8000 Smooth-On, Inc. 1000 Valley Rd. Gillette, NJ 07933 (201)-647-5800 Symplastics Inc. 3718 Clifton Place Montrose, CA 91020 (818)-249-7810 3M Co. 3M Center St. Paul, MN 55144 (612)-733-2194 TACC International Corp. Air Station Industrial Park P.O. Box 535 Rockland, MA 02370 (617)-878-7015 Tecknit 129 Dermody St. Cranford, NJ 07016 (201)-272-5500 Tesa Tuck Inc. 1 LeFevre Lane New Rochelle, NY 10801 (914)-235-1000/(800)-426-2181 Thermoset Plastics, 5101 East 65 St. P.O. Box 20902 Indianapolis, IN (317)-259-4161
Inc.
46220
Suppliers'Addresses 995
Tra-Con, Inc. 55 North st. Medford, MA 02'55 (6'7)-39'-5550/(800)-872-266' Transene Co., Inc. Route One Rowley, MA 0'969 (508)-948-250'/948-28" J. H. Young Co., Inc. 8 Symington Place Rochester, NY '46" (7'6)-235-7698 Ziegler Chemical & Mineral Allied Asphalt '00 Jericho Quadrangle Jericho, NY "753 (5'6)-68'-9600/(20')-752-4"'
Corp.
Trade Name Index
996
Trade Name Index
Trade Name
Supplier
ABLEBOND ABLEFILM ABLESTIK ABOCAST ABOCOAT ABOCURE ABOWELD ACRYLANE ALLABOND TWENTY ALUSEAL AMICON ANA-LOK
Able&k Ablestik Ablestik Abatron Abatron Abatron Abatron Furane Products Bacon Industries
TWENTY/
997
AQUAHYDE AQUA-THERM ARALDITE ARCLAD AREMCO AREMCO-BOND AREMCO-COAT AREMCO-SHIELD ARLON AS1 AUTOCRETE
Sauereisen Cements Emerson & Cuming Pacer Technology Pacer Technology Dock Resin John C. Dolph Ciba-Geigy Corp./(Symplastics Inc.)* Adhesives Research Aremco Products Aremco Products Aremco Products Aremco Products Arlon American Sealants Flexbar Machine
BACON BLACK MAX BOSTIK BOSTIK BOSS
Bacon Industries Loctite Bostik Bostik
CASCHEM CASTALL CASTALL QUICK CURE CERAMACOAT CERAMA-DIP CHIPBONDER CHO-BOND CHO-FLEX CHO-SHIELD
CasChem Castall Castall Aremco Products Aremco Products Loctite Chomerics Chomerics Chomerics
*Parentheses
indicate that the company listed is a distributor.
998
Adhesives, Sealants and Coatings for the Electronics Industry
Trade Name
Supplier
CONASTIC CONATHANE CONDUCTINE TWENTY/ TWENTY CONDUCT-X CONKOAT CON/RTV CORONA DOPE COTRONICS
Conap Conap Bacon Industries
DEBONDER DECAP D.E.N. DEPEND D.E.R. DEVCON DOLPHON DOLPH SPRAY DOW CORNING DRI-LOC DURALCO DURAPOT DUSIL DYMAX DYNAMOLD DYNASOLVE
Pacer Technology
ECCOSIL ELECTRO-SCIENCE ELECTROTEMP EMCA-REMEX EMFLOW EMI-RF1 SHIELD EPIBOND EPI-SEAL EPOCAP EPOCAST EPOLITE EPO-TEK EPOTHERM EPOWELD EPOXIT ESL
Emerson & Cuming Electra-Science Laboratories Sauereisen Cements Ablestik Laboratories (GC Electronics) Furane Products Bonded Products HaIdrmUl Furane Products Hexcel Chemical Products Epoxy Technology Transene Hardmall Abatron Electra-Science Laboratories
Electra-Kinetic Systems (GC Electronics) Tecknit (GC Electronics) Cotronics
Dyna’oy Dow Chemical Loctite Dow Chemical ITW Devcon John C. Dolph John C. Dolph Dow Corning Loctite Cotronics Cotronics Ducey Chemical Dyn== Dynamold Dyndoy
Trade Name Index Trade Name
Supplier
5-MINUTE FARADEX FINITE FLEXBOND FLEXCONNECT FLEXSEAL FURANE
ITW Devcon Transene Finite Industries Furane Products Sheldahl Loctite Furane Products
GC BOND GE GEL-WELD GR-R-RIP
(GC Electronics) General Electric (GC Electronics) (GC Electronics)
HC HEAT-AWAY HI HI-THERM HIGH VOLTAGE HP HYBRISIL
Pacer Technology Aremco Products Pacer Technology John C. Dolph (GC Electronics) Pacer Technology Transene
PUTTY
IDEAL IMPREG WAX IMPRUV INSA-LUTE INSTANT-WELD INSUL-BOND INSULCAST INSULCURE INSUL-VOLT
American Biltrite Ziegler Chemical & Mineral Loctite Sauereisen Cements Oneida Electronic Transene Permagile Industries Permagile Industries (GC Electronics)
JET-MELT
3M
KALEX KAPTON
HaNlnlall DuPont/(American B&rite) DuPont/(CHR Industries)
LIGHT-WELD LIQUID-TAPE LIS LITE-TAJS LOCQUIC LOCTITE
Dym=
(GC Electronics) Loctite Loctite Loctite Loctite
999
1000
Adhesives, Sealants and Coatings for the Electronics Industry
Trade Name
Supplier
MAGNOBOND MAGNOLIA MAVIDON MBS MERECO META-CLAD METACOTE METADUCT META-GEL METALSET META-SHIELD METASIL METRE-GRIP METRE-SET MONOPOXY MULTI-CURE
Magnolia Plastics Magnolia Plastics Mavidon Transene Mereco Mereco Mereco Mereco Mereco Smooth-On Mereco Mereco Mereco Mereco Division Hardman Dym=
NEA NELTAPE NEUTRAFLUX NICKEL-BOND NOMEX NORLAND NORYL NUVA-SIL
Norland Products Dielectric Polymers Transene Transene Dtiont/(Arlon) Norland Products General Electric Corp. Loctite
OHMEX-AG OHM-RESIST OUTPUT
Transene Transene Loctite
PACER-X PEDIGREE PERMABOND PERMABOND PLIOBOND POLY CAST POLYCIN POWERBOND PRIMA SOLDER PRINT KOTE PRISM PRO GRIP PRO-LOCK
Pacer Technology P.D. George Co. Permabond International (GC Electronics) Ashland Chemical General Polymers CasChem Permabond International A.I. Technology (GC Electronics) Loctite Fel-Pro Chemical Products Fel-Pro
Trade Name Index Trade Name
Supplier
PRONTO PRO-TECH P&S PX PYRO-DUCT PYRO-PAINT PYRO-TAPE
3M Pacer Technology Pierce & Stevens Pacer Technology Aremco Products Aremco Products Aremco Products
Q DOPE QUICKBOND QUICK STIK QURE
(GC Electronics) Mavidon Permabond International (GC Electronics) CasChem
RED GLPT RED-X RTM RTV
(GC Electronics) (GC Electronics) Transene GE Silicones
SAUEREISEN SCOTCH-WELD SHADOWCURE SHELDAHL SILFLEX SILITE SILVER-BOND SPEEDBONDER STATIC HALT STRIP-N-STICK STYCAST SUPERBONDER SUPER GLUE SUPER INSTANT SUPERSET SUPERTHERM SYMPOXY SYNTHITE
Sauereisen Cements 3M Loctite Sheldahl Furane Products ITW Devcon Transene Loctite (GC Electronics) CHR Industries Emerson & Cuming Loctite (GC Electronics) Smooth-On Apple Adhesives Tra-Con Symplastics John C. Dolph
2-TON TACK FILM TACTIX TAK PAK T-BOND
ITW Devcon A.I. Technology Dow Chemical Loctite Permagile Industries
Q-MAX
1001
1002
Adhesives, Sealants and Coatings for the Electronics Industry
Trade Name
Supplier
TECK-BOND TECKNIT TEMP-R-TAPE TESABELT TESAFILM THERMELEC THERMID THERMOSET THERM-X TRA-BOND TRA-CAST TRA-DUCT TRANSENE TRANSEPOXY TRANSISTOR TRA-SHIELD TRU-BOND TRU-CAST TX
Tecknit Tecknit CHR Industries Tesa Tuck Tesa Tuck Ranbar Technology National Starch and Chemica Thermoset Plastics American Biltrite Tra-Con Tra-Con Tra-Con Transene Transene Transene Tra-Con Fenwal Fenwal Pacer Technology
EPOXY
Loctite Furane Products
ULTRA TAK PAK URALANE URESOLVE URESOLVE PLUS
Dyndoy Dyndoy
VORITE
CasChem
WELD-ON
IPS Corp.
x-NMS
Loctite
ZIP GRIP
ITW Devcon
